CPU pick-and-place device and detection device

Abstract

The invention relates to the technical field of detection devices, in particular to a CPU taking and placing device and a detection device. The CPU taking and placing device comprises a rack and a heat dissipation assembly. The rack is provided with a driving assembly; the heat dissipation assembly is movably arranged on the rack, the heat dissipation assembly comprises a mounting plate and a radiator, the mounting plate corresponds to the output end of the driving assembly, the radiator is mounted at the lower end of the mounting plate, and the lower end of the radiator is provided with a groove used for mounting a CPU and a clamping piece used for fixing the CPU; wherein the output end of the driving assembly is provided with a pressure sensor, the pressure sensor and the driving assembly are both connected with the controller, the pressure sensor is used for transmitting detected pressure information to the controller, and the controller controls the driving assembly according to the pressure information. According to the CPU taking and placing device provided by the embodiment of the utility model, manual testing is replaced, and the efficiency is improved.

Description

Technical Field

[0001] This patent relates to the technical field of detection devices, and in particular to a CPU fetching and placing device and a detection device. Background Art

[0002] In some production workshops, the process of testing the CPU of a computer motherboard is roughly as follows: first place the computer motherboard to be tested on the predetermined position of the workbench, then manually pick up the CPU and align the CPU with the CPU installation position of the computer motherboard so that the CPU is stuck on the computer motherboard. After the test is completed without any problems, the CPU is removed and the computer motherboard to be tested is sent to the next process. This manual inspection method is also cumbersome and will waste a lot of manpower and time costs. Summary of the invention

[0003] This patent provides a CPU fetching and placing device and a detection device to at least solve the above technical problems existing in the prior art.

[0004] The first aspect of this patent provides a CPU fetching and placing device, comprising:

[0005] A frame, wherein a drive assembly is installed on the frame;

[0006] A heat dissipation component is movably arranged on the frame, the heat dissipation component includes a mounting plate and a radiator, the mounting plate is arranged corresponding to the output end of the driving component, the radiator is installed at the lower end of the mounting plate, and the lower end of the radiator is provided with a groove for mounting a CPU and a clamp for fixing the CPU;

[0007] A pressure sensor is provided at the output end of the driving component. Both the pressure sensor and the driving component are connected to a controller. The pressure sensor is used to transmit the detected pressure information to the controller, and the controller controls the driving component according to the pressure information.

[0008] Furthermore, the radiator is equipped with a cooling fan, the radiator comprises a plurality of cooling fins, the plurality of cooling fins are arranged in parallel and at intervals, and the cooling fan is arranged relative to the intervals between the plurality of cooling fins.

[0009] Furthermore, the radiator is provided with a plurality of heat dissipation holes, the plurality of heat dissipation holes are in a honeycomb shape, and the heat dissipation holes are arranged opposite to the heat dissipation fan.

[0010] Further, the driving assembly includes a driving motor, a driving screw, a rotating gear and a pressing plate;

[0011] The rotating gear is threadedly matched with the driving screw, and the driving motor drives the rotating gear to rotate so that the driving screw moves up and down. The pressure sensor is arranged at the end of the driving screw, and the pressure plate is slidably matched with the frame. The pressure plate and the driving screw are connected by an elastic member, and the pressure plate and the mounting plate are correspondingly arranged.

[0012] Furthermore, the pressure plate is provided with a guide column, and the guide column is plugged into and matched with the heat dissipation component.

[0013] Furthermore, the pressure plate is provided with a mounting block, and a locking and unlocking component is provided between the mounting block and the mounting plate.

[0014] Furthermore, the mounting block is provided with a positioning hole, and the mounting plate is provided with a positioning column, and the positioning column is plug-fitted with the positioning hole.

[0015] Furthermore, a linear guide rail is provided on the frame, and the pressure plate is slidably connected to the frame via the linear guide rail.

[0016] Furthermore, the clamping member includes positioning blocks arranged at four corners of the heat sink.

[0017] The second aspect of this patent provides a detection device, including the CPU pick-up and placement device described in the first aspect.

[0018] The technical solution provided by this patent embodiment has the following advantages compared with the prior art:

[0019] The CPU pick-and-place device provided in the embodiment of the present invention includes a rack and a heat dissipation component, and the rack is equipped with a drive component; the heat dissipation component is movably arranged on the rack, and the heat dissipation component includes a mounting plate and a radiator, and the mounting plate is arranged corresponding to the output end of the drive component, and the radiator is installed at the lower end of the mounting plate, and the lower end of the radiator is provided with a groove for mounting the CPU and a clamp for fixing the CPU; wherein, a pressure sensor is provided at the output end of the drive component, and the pressure sensor and the drive component are both connected to the controller, and the pressure sensor is used to transmit the detected pressure information to the controller, and the controller controls the drive component according to the pressure information. Before the test, the CPU is placed in the groove, and the CPU is fixed by the clamp. The controller controls the drive component to drive the mounting plate and the radiator, and automatically presses down to install the CPU for testing. The CPU pressure value is controlled by the pressure sensor, and the personnel set the pressure value at one time. During the test, the controller controls the drive component according to the pressure value detected by the pressure sensor, so that the socket PIN is in close contact with the CPU body, and the socket body will not be damaged, causing quality problems. The CPU pick-and-place device provided in the embodiment of the present invention replaces manual testing and improves efficiency. The CPU pick-and-place device provided in the embodiment of the present invention replaces the manual pick-and-place of the CPU by the operator, and improves work efficiency.

[0020] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of this patent, nor is it intended to limit the scope of this patent. Other features of this patent will become easy to understand through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other purposes, features and advantages of the exemplary embodiments of the present invention will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present invention are shown in an exemplary and non-limiting manner, in which:

[0022] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0023] Figure 1 The structure diagram of the CPU fetching and placing device provided by the embodiment of the present invention is shown. Figure 1 ;

[0024] Figure 2 The structure diagram of the CPU fetching and placing device provided by the embodiment of the present invention is shown. Figure 2 ;

[0025] Figure 3 The structure diagram of the CPU fetching and placing device provided by the embodiment of the present invention is shown. Figure 3 .

[0026] Explanation of the numbers in the figure: 1. Frame; 11. Linear guide; 2. Mounting plate; 21. Positioning column; 3. Radiator; 31. Heat sink; 32. Heat dissipation hole; 33. Cooling fan; 34. Groove; 40. Drive motor; 41. Drive screw; 43. Pressure plate; 431. Guide column; 432. Mounting block; 433. Locking and unlocking assembly; 44. Elastic member; 5. Positioning block; 6. Pressure sensor. DETAILED DESCRIPTION

[0027] In order to make the purpose, features, and advantages of this patent more obvious and easy to understand, the technical solutions in the embodiments of this patent will be clearly and completely described below in conjunction with the drawings in the embodiments of this patent. Obviously, the described embodiments are only part of the embodiments of this patent, not all of them. Based on the embodiments in this patent, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this patent.

[0028] Combination Figure 1 , Figure 2 and Figure 3As shown, the CPU pick-up and placement device provided by the embodiment of the present invention includes a rack 1 and a heat dissipation component, and the rack 1 is equipped with a drive component; the heat dissipation component is movably arranged on the rack 1, and the heat dissipation component includes a mounting plate 2 and a radiator 3, and the mounting plate 2 is arranged corresponding to the output end of the drive component, and the radiator 3 is installed at the lower end of the mounting plate 2, and the lower end of the radiator 3 is provided with a groove 34 for mounting the CPU and a clamp for fixing the CPU; wherein, a pressure sensor 6 is provided at the output end of the drive component, and the pressure sensor 6 and the drive component are both connected to the controller, and the pressure sensor 6 is used to transmit the detected pressure information to the controller, and the controller controls the drive component according to the pressure information. Before the test, the CPU is placed in the groove 34, and the CPU is fixed by the clamp. The controller controls the drive component to drive the mounting plate 2 and the radiator 3, and automatically presses down to install the CPU for testing. The CPU pressure value is controlled by the pressure sensor 6, and the personnel set the pressure value at one time. During the test, the controller controls the drive component according to the pressure value detected by the pressure sensor 6, so that the socket PIN pin is in close contact with the CPU body, and at the same time, the socket body will not be damaged, causing quality problems. The CPU picking and placing device provided in the embodiment of this patent replaces the manual picking and placing of the CPU by operators, thereby improving work efficiency.

[0029] The clamping piece fixes the CPU tightly on the heat sink 3 to prevent the CPU from falling during the operation of the equipment and causing quality abnormalities.

[0030] The groove 34 includes an extension groove, which is connected to the groove 34, so that the CPU, the heat dissipation silica gel and the heat sink 3 can be closely contacted to improve the heat dissipation effect.

[0031] In the embodiment of the present disclosure, the stroke of the driving component is controlled by the pressure sensor 6, and then the stroke of the heat dissipation component is controlled, so that the pressure applied to the CPU can be controlled, the possibility of CPU damage can be reduced, and work efficiency can be improved.

[0032] In some specific implementations, the radiator 3 is equipped with a cooling fan 33, and the radiator 3 includes a plurality of cooling fins 31, and the plurality of cooling fins 31 are arranged in parallel and spaced apart, and the cooling fan 33 is arranged relative to the space between the plurality of cooling fins 31. The radiator 3 includes a plurality of cooling fins 31 arranged in spaced apart manners, which can increase the external cooling area, and at the same time, the side cooling fan 33 is added with a side blowing design to directly dissipate the test heat in the test, thereby improving the cooling effect.

[0033] In some specific implementations, the heat sink 3 and the mounting plate 2 are detachably connected, so that the heat sink 3 can be quickly removed, and the CPU can be quickly removed, thereby improving the efficiency of line replacement.

[0034] In some specific embodiments, the radiator 3 is provided with a plurality of heat dissipation holes 32, the plurality of heat dissipation holes 32 are honeycomb-shaped, and the heat dissipation holes 32 are arranged opposite to the heat dissipation fan 33. The radiator 3 includes a plurality of honeycomb-shaped heat dissipation holes 32, which can increase the internal heat dissipation area, and at the same time, the side heat dissipation fan 33 is added with a side blowing design to directly dissipate the test heat in the test and improve the heat dissipation effect.

[0035] The heat dissipation holes 32 are designed at the same time as the multiple heat sinks 31 arranged at intervals, which breaks through the previous design scheme and increases the heat dissipation area by 1.5 times of the original; a heat dissipation fan 33 is installed on the side, and the heat dissipation wind speed is increased by 0.5 times on the original basis; the heat dissipation holes 32 are designed in the same direction as the heat sink 31, and with the side direct blowing fan, the heat dissipation flow rate is increased by 0.5 times.

[0036] When the CPU is fixed on the heat sink 3, before the mainboard is powered on for testing, the CPU pick-and-place device needs to accurately install the CPU on the mainboard so that the mainboard can be powered on for testing.

[0037] In some specific embodiments, the driving assembly includes a driving motor 40, a driving screw 41, a rotating gear 42 and a pressure plate 43; the rotating gear 42 is threadedly matched with the driving screw 41, and the driving motor 40 drives the rotating gear 42 to rotate so that the driving screw 41 moves up and down, and the pressure sensor 6 is arranged at the end of the driving screw 41, and the pressure plate 43 is slidably matched with the frame 1. The pressure plate 43 and the driving screw 41 are connected by an elastic member 44, and the pressure plate 43 is correspondingly arranged with the mounting plate 2.

[0038] Optionally, the pressure sensor 6 is fixedly connected to the driving screw 41 .

[0039] Optionally, a toothed structure is provided around the rotating gear 42, and the output end of the driving motor 40 is connected to a driving gear, which meshes with the rotating gear 42. Optionally, the driving gear and the rotating gear 42 are driven by a gear assembly, which includes two or more meshing gears.

[0040] Optionally, the controller controls the stepper motor to rotate, driving the main motor gear to rotate, and the main motor gear drives the rotating gear 42 to rotate, thereby driving the driving screw 41 to move up and down, thereby driving the pressure plate 43 to move up and down. Since an elastic member 44 is provided between the pressure plate 43 and the driving screw 41, the elastic member 44 is compressed by the driving screw 41, so that the pressure plate 43 pushes the radiator 3, so that the CPU set on the radiator 3 fits tightly on the CPU seat on the motherboard and maintains a certain pressure. When the CPU fits well, pressure feedback is generated on the pressure sensor 6. When the pressure value set on the controller is reached, it stops under the control of the single-chip microcomputer, and the yellow indicator light on the controller lights up, indicating that a balance point has been reached. The CPU pick-up and placement device provided by the embodiment of the present patent replaces the manual pick-up and placement of the CPU by the operator, thereby improving work efficiency.

[0041] In the disclosed embodiment, the CPU can push the pressure plate 43 to adaptively offset through the elastic member 44, thereby ensuring that all contacts on the CPU are in one-to-one contact with all contacts on the CPU socket at all times, thereby ensuring smooth testing of the motherboard and high testing efficiency.

[0042] The elastic member 44 may be a spring, or an elastic element made of other elastic materials.

[0043] In some specific embodiments, a single-chip microcomputer is used as a control system, and a pressure sensor 6 is used to sense the force applied to the CPU and ensure that the CPU is in flat contact with the CPU seat through a drive assembly. When the micro switch installed in front of the drive assembly is triggered, a connection signal is given to the controller. The controller controls the stepper motor to rotate, driving the main motor gear to rotate, and the main motor gear drives the worm to rotate, thereby driving the worm wheel and the ball screw nut fixed with the worm wheel to rotate. The ball screw screw moves downward in a straight line to drive the screw coupling head and the pressure sensor 6 fixed on the screw coupling head to move downward. Thus, the entire moving part moves downward under the positioning of four sets of cross roller guides to make the CPU fit evenly on the CPU seat on the mainboard. When the CPU is well fitted, pressure feedback is generated on the pressure sensor 6. When the pressure value set on the controller is reached, it stops under the control of the single-chip microcomputer, and the yellow indicator light on the controller lights up, indicating that a balance point has been reached. And under the interlocking mechanical principle of the worm gear, it is ensured that the pressure loaded on the CPU is a uniform and constant pressure value, and the mainboard is powered on normally and turned on for testing. After the test is completed, the side plug-in module retracts to disconnect the micro switch, and under the control of the controller, the opposite action is performed to the above, and the entire module returns to the original position for the next test.

[0044] In some specific embodiments, the pressure plate 43 is provided with a guide column 431, which is plugged into the heat dissipation component to achieve rapid guidance and positioning of the drive component and the heat dissipation component, so as to ensure accurate positioning and reduce the possibility of damage to the mainboard.

[0045] In some specific embodiments, the pressing plate 43 is provided with a mounting block 432, and a locking and unlocking assembly 433 is provided between the mounting block 432 and the mounting plate 2. The locking and unlocking assembly 433 can be an unlocking and locking switch, and when the radiator 3 needs to be removed, the switch is rotated downward, and when the radiator 3 needs to be installed, the switch is rotated upward, which plays the role of an unlocking and locking button.

[0046] In some specific embodiments, the mounting block 432 is provided with a positioning hole, and the mounting plate 2 is provided with a positioning column 21. The positioning column 21 is plugged into and matched with the positioning hole to achieve rapid guidance and positioning of the drive component and the heat dissipation component, so as to ensure accurate positioning and reduce the possibility of damage to the mainboard.

[0047] In some specific implementations, a linear guide rail 11 is provided on the frame 1, and the pressing plate 43 is slidably connected to the frame 1 via the linear guide rail 11, so that the pressing plate 43 can be guided and positioned.

[0048] In some specific embodiments, the clamping member includes positioning blocks 5 arranged at the four corners of the heat sink 3. After the CPU is placed in the groove 34, the CPU is positioned by the positioning blocks 5, so that the CPU is tightly fixed on the heat sink 3 to prevent the CPU from falling during the operation of the equipment and causing quality abnormalities.

[0049] The detection device provided in the embodiment of the present invention includes the CPU fetching and placing device provided in the embodiment of the present invention. Since the detection device provided in the embodiment of the present invention has the same advantages as the CPU fetching and placing device provided in the embodiment of the present invention, they will not be described in detail here.

[0050] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this patent can be executed in parallel, sequentially or in different orders, as long as the expected results of the technical solution of this patent can be achieved, and this document does not limit it here.

[0051] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this patent, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0052] The above are only specific implementations of this patent, but the protection scope of this patent is not limited to this. Any technician familiar with this technical field can easily think of changes or substitutions within the technical scope disclosed in this patent, which should be covered by the protection scope of this patent. Therefore, the protection scope of this patent should be based on the protection scope of the claims.

Claims

1. A CPU pick-and-place device, characterized in that: include: A frame (1), wherein the frame (1) is equipped with a drive assembly; A heat dissipation component is movably arranged on the frame (1), the heat dissipation component comprises a mounting plate (2) and a heat sink (3), the mounting plate (2) is arranged corresponding to the output end of the driving component, the heat sink (3) is installed at the lower end of the mounting plate (2), and the lower end of the heat sink (3) is provided with a groove (34) for installing a CPU and a clamping piece for fixing the CPU; The output end of the driving component is provided with a pressure sensor (6), and both the pressure sensor (6) and the driving component are connected to a controller. The pressure sensor (6) is used to transmit detected pressure information to the controller, and the controller controls the driving component according to the pressure information.

2. The CPU fetching and placing device according to claim 1, characterized in that: The radiator (3) is equipped with a cooling fan (33), the radiator (3) comprises a plurality of cooling fins (31), the plurality of cooling fins (31) are arranged in parallel and at intervals, and the cooling fan (33) is arranged relative to the intervals between the plurality of cooling fins (31).

3. The CPU fetching and placing device according to claim 2, characterized in that: The radiator (3) is provided with a plurality of heat dissipation holes (32), the plurality of heat dissipation holes (32) are honeycomb-shaped, and the heat dissipation holes (32) are arranged opposite to the heat dissipation fan (33).

4. The CPU fetching and placing device according to claim 1, characterized in that: The driving assembly comprises a driving motor (40), a driving screw (41), a rotating gear (42) and a pressing plate (43); The rotating gear (42) is threadedly matched with the driving screw (41), and the driving motor (40) drives the rotating gear (42) to rotate so that the driving screw (41) moves up and down. The pressure sensor (6) is arranged at the end of the driving screw (41), and the pressure plate (43) is slidably matched with the frame (1). The pressure plate (43) and the driving screw (41) are connected by an elastic member (44), and the pressure plate (43) and the mounting plate (2) are correspondingly arranged.

5. The CPU fetching and placing device according to claim 4, characterized in that: The pressing plate (43) is provided with a guide column (431), and the guide column (431) is plug-fitted with the heat dissipation component.

6. The CPU fetching and placing device according to claim 4, characterized in that: The pressing plate (43) is provided with a mounting block (432), and a locking and unlocking assembly (433) is provided between the mounting block (432) and the mounting plate (2).

7. The CPU fetching and placing device according to claim 6, characterized in that: The mounting block (432) is provided with a positioning hole, and the mounting plate (2) is provided with a positioning column (21), and the positioning column (21) is plug-fitted into the positioning hole.

8. The CPU fetching and placing device according to claim 4, characterized in that: The frame (1) is provided with a linear guide rail (11), and the pressing plate (43) is slidably connected to the frame (1) via the linear guide rail (11).

9. The CPU fetching and placing device according to claim 1, characterized in that: The clamping member comprises positioning blocks (5) arranged at four corners of the heat sink (3).

10. A detection device, characterized in that: The CPU fetching and placing device comprises the CPU fetching and placing device according to any one of claims 1 to 9.

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