Multi-layer integrated optical isolation large-current power controller

Abstract

The invention provides a multi-layer integrated optical isolation large-current power controller. The multi-layer integrated optical isolation large-current power controller comprises a power output chip, an output circuit module and an input circuit module, the power output chip, the output circuit module and the input circuit module are sequentially installed in the ceramic shell, the output circuit module and the input circuit module are oppositely arranged, and an outer pin group is arranged at the bottom of the ceramic shell. The multi-layer vertical structure is adopted, and only the power chip is placed at the bottom, so that the utilization rate of the internal space of the controller is improved, and the power chip can occupy a larger space and can play a better role. Semicircular grooves are designed around the output circuit board and the input circuit board, so that the controller can exhaust better in the glue pouring process.

Description

Technical Field

[0001] The invention relates to a multi-layer integrated optical isolation high current power controller. Background Art

[0002] There are three packaging forms for power controllers, one is plastic packaging, one is metal packaging, and the other is ceramic metal packaging. The plastic packaging structure uses a metal frame to bond the chip, and the external plastic packaging material is thermoformed to achieve the corresponding power control function. The advantages of this structure are small size, light weight, low cost, and mass production; the disadvantages are poor corrosion resistance, poor thermal stability, poor heat dissipation, long-term reliability, low moisture resistance, and a small operating temperature range. The metal packaging structure uses a metal shell to encapsulate chips or components to achieve the power controller function. The advantages of this structure are corrosion resistance, moisture resistance, good thermal conductivity, good shielding, and a wide operating temperature range. The disadvantages are high material cost and heavy weight. The advantages of the ceramic metal packaging structure are corrosion resistance, good insulation performance, light weight, small size, low material cost, good thermal conductivity, and a large operating temperature range. The disadvantages are that it is fragile, the on-resistance is relatively high compared to plastic packaging, and the processing cycle is long. The existing packaging method results in the internal space of the controller not being well utilized, resulting in low overall power density of the product. For example, CN216490437U discloses a ceramic sealed photoelectric isolating switch with high dielectric withstand voltage, which adopts a ceramic sealing structure, and the field effect tube chips are separated by a ceramic isolation platform, so that the electrical connection between the field effect tube chips is transitioned through the ceramic isolation platform, thereby increasing the creepage distance and avoiding arcing caused by high voltage. In addition, by coating the photosensitive area of ​​the photovoltaic module chip with a high-strength photosensitive medium, a solid medium is added between the light-emitting area and the photosensitive area, thereby making the dielectric withstand voltage index reach 4000Vr.ms, which meets the use standards in the field of weapons and equipment. However, the power chip and the driver chip are both installed at the bottom of the ceramic metal shell, which causes the power chip to not be able to fully play its role. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a multi-layer integrated optical isolation high current power controller.

[0004] The present invention is achieved through the following technical solutions.

[0005] The present invention provides a multi-layer integrated optical isolation high-current power controller, comprising a power output chip, an output circuit module, and an input circuit module; the power output chip, the output circuit module, and the input circuit module are sequentially installed in a ceramic housing, the output circuit module and the input circuit module are relatively arranged, an external pin group is provided at the bottom of the ceramic housing, and the external pin group is respectively connected to the power output chip, the output circuit module, and the input circuit module through molybdenum copper columns; the power output chip is installed at the bottom of the ceramic housing and on both sides of the middle boss, the output circuit module is supported in the middle of the ceramic housing through second step grooves on the opposite side walls of the second step groove, the input circuit module is supported and installed at the upper end of the ceramic housing through a first step groove processed at the upper end of the ceramic housing, and a cover plate is installed on the top of the ceramic housing.

[0006] The power output chip includes two field effect tube chips, which are connected to the bottom of the ceramic shell through conductive silver glue. A connecting plate is provided on the middle boss, and the two field effect tubes are respectively connected to the connecting plate through bonding wires.

[0007] The output circuit module includes an output substrate, and a plurality of isolation drive chip seats are installed in the middle of the output substrate. The plurality of isolation drive chip seats are arranged in a straight line in the middle of the output substrate. A contact board A and an inner pin G are respectively arranged on both sides of the isolation drive chip seat on the output substrate. The two ends of the contact board A are respectively connected to the inner pin A and the inner pin B. The inner pin A, the inner pin B, and the output substrate are connected to the outer pin group through a molybdenum copper column; an isolation drive chip is installed on the isolation drive chip seat, and the isolation drive chip is respectively connected to the contact board A and the inner pin G through bonding wires.

[0008] The input circuit module includes an input substrate, a row of resistor bases and a row of light-emitting diode bases are respectively arranged in the middle of the input substrate, and contact boards B and contact boards C are respectively arranged adjacent to the resistor bases and the light-emitting diode bases and parallel to them, one end of the contact board B is connected to the inner pin C and the inner pin F, and one end of the contact board C is connected to the inner pin D and the inner pin E, and the inner pin C, the inner pin F and the inner pin D, and the inner pin E are respectively arranged at the two ends of the input substrate and at the edge of the input substrate; resistors and light-emitting diodes are respectively arranged on the resistor base and the light-emitting diode base, and adjacent resistors and light-emitting diodes are connected to each other through bonding wires, and the resistors and light-emitting diodes are also respectively connected to the contact board B and the contact board C through bonding wires.

[0009] The edges of the output circuit module and the input circuit module are both processed with semicircular grooves.

[0010] The external pin group includes external pin C, external pin A, external pin B, external pin D, external pin F, external pin G, and external pin E. The external pin C, external pin A, external pin B, external pin D, external pin F, external pin G, and external pin E are respectively connected to the inner pin C, inner pin A, inner pin B, inner pin D, inner pin F, inner pin G, and inner pin E through a molybdenum copper column.

[0011] The external pin group includes a welding portion welded to the molybdenum copper column, and one end of the welding portion extends out of the ceramic shell and is vertically bent.

[0012] The beneficial effects of the present invention are: adopting a multi-layer vertical structure, with only the power chip placed at the bottom, not only the internal space utilization of the controller is improved, but the power chip can occupy a larger space, so that it can play a better role. Semicircular grooves are designed around the output circuit board and the input circuit board, so that the controller can be better vented during the glue filling process. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a partial cross-sectional structural schematic diagram of the present invention;

[0014] Figure 2 It is a schematic diagram of the shell structure of the present invention;

[0015] Figure 3 It is a schematic diagram of the top view structure of the present invention;

[0016] Figure 4 This is a schematic diagram of the power output chip installation structure of the present invention;

[0017] Figure 5 It is a schematic diagram of the structure of the output circuit module of the present invention;

[0018] Figure 6 It is a schematic diagram of the structure of the input circuit module of the present invention;

[0019] Figure 7 It is a schematic diagram of the external pin arrangement structure of the present invention;

[0020] Figure 8 This is a schematic diagram of the first pin structure of the present invention;

[0021] Fig. 9 is a schematic diagram of a second pin structure of the present invention;

[0022] Fig.10 It is a schematic diagram of the third pin structure of the present invention;

[0023] In the figure: 1-power output chip, 2-output circuit module, 21-inner pin A, 22-inner pin B, 23-communication board A, 24-inner pin G, 25-isolation drive chip, 26-isolation drive chip seat, 27-output substrate, 3-input circuit module, 31-inner pin C, 32-communication board B, 33-inner pin D, 34-resistance, 35-resistance base, 36-light emitting diode base, 37-input substrate, 38-inner pin E, 39-communication board C, 3 10-inner pin F, 311-light-emitting diode, 4-cover plate, 5-copper clad plate, 6-connecting plate, 7-external pin group, 71-external pin C, 72-external pin A, 73-external pin B, 74-external pin D, 75-external pin F, 76-external pin G, 77-external pin E, 78-welding part, 79-connecting part, 8-ceramic shell, 81-first step groove, 82-second step groove, 83-middle boss, 9-molybdenum copper column, 10-bonding wire, 11-semicircular groove. DETAILED DESCRIPTION

[0024] The technical solution of the present invention is further described below, but the scope of protection claimed is not limited to the description.

[0025] like Figure 1 As shown, the present invention adopts a multi-layer vertical installation structure for the power output chip 1, the output circuit module 2, and the input circuit module 3, and each layer of the ceramic substrate is divided functionally. A multi-layer integrated optical isolation high current power controller includes a power output chip 1, an output circuit module 2, and an input circuit module 3; the power output chip 1, the output circuit module 2, and the input circuit module 3 are sequentially installed in a ceramic housing 8, the output circuit module 2 and the input circuit module 3 are arranged relatively, and an external pin group 7 is provided at the bottom of the ceramic housing 8, and the external pin group 7 is respectively connected to the power output chip 1, the output circuit module 2, and the input circuit module 3 through a molybdenum copper column 9; the power output chip 1 is installed at the bottom of the ceramic housing 8 and on both sides of the middle boss 83, the output circuit module 2 is supported in the middle of the ceramic housing 8 by the second step groove 82 on the opposite side walls of the second step groove 82, the input circuit module 3 is supported and installed on the upper end of the ceramic housing 8 by the first step groove 81 processed at the upper end of the ceramic housing 8, and a cover plate 4 is installed on the top of the ceramic housing 8 for airtight sealing.

[0026] like Figure 4 As shown, the power output chip 1 includes two field effect tube chips, which are connected to the bottom of the ceramic housing 8 through conductive silver glue, and a connecting plate 6 is provided on the middle boss 83. The two field effect tubes are respectively connected to the connecting plate 6 through bonding wires 10. The two field effect chips V1 and V2 are physically isolated by the middle boss in the middle of the housing 8, and a copper clad plate is processed on the middle boss as a bonding plate between the two field effect chips V1 and V2.

[0027] like Figure 5 As shown, the output circuit module 2 includes an output substrate 27, a plurality of isolation drive chip seats 26 are installed in the middle of the output substrate 27, and the plurality of isolation drive chip seats 26 are arranged in a straight line in the middle of the output substrate 27. A contact board A23 and an inner pin G24 are respectively arranged on both sides of the isolation drive chip seat 26 on the output substrate 27, and the two ends of the contact board A23 are respectively connected to the inner pin A21 and the inner pin B22, and the inner pin A21, the inner pin B22, and the output substrate 27 are connected to the outer pin group 7 through the molybdenum copper column 9; an isolation drive chip 25 is installed on the isolation drive chip seat 26, and the isolation drive chip 25 is respectively connected to the contact board A23 and the inner pin G24 through bonding wires.

[0028] like Figure 6 As shown, the input circuit module 3 includes an input substrate 37, a row of resistor bases 35 and a row of light-emitting diode bases 36 are respectively arranged in the middle of the input substrate 37, and a contact board B32 and a contact board C39 are respectively arranged adjacent to the resistor bases 35 and the light-emitting diode bases 36 and parallel thereto, one end of the contact board B32 is connected to the inner pin C31 and the inner pin F310, one end of the contact board C39 is connected to the inner pin D33 and the inner pin E38, the inner pin C31, the inner pin F310 and the inner pin D33, the inner pin E38 are respectively arranged at the two ends of the input substrate 37 and at the edge of the input substrate 37; the resistor base 35 and the light-emitting diode base 36 are respectively provided with resistors 34 and light-emitting diodes 311, the adjacent resistors 34 and light-emitting diodes 311 are connected to each other through bonding wires, and the resistors 34 and the light-emitting diodes 311 are also respectively connected to the contact board B32 and the contact board C39 through bonding wires.

[0029] like Figure 5 and 6 As shown, the edges of the output circuit module 2 and the input circuit module 3 are processed with semicircular grooves 11. The ceramic circuit substrate is designed to prevent fooling, and the appearance structure of the ceramic circuit substrate adopts an asymmetric design up and down, which has assembly uniqueness and prevents misassembly in the general assembly. The glue filling and exhaust design in this power controller, the ceramic circuit substrate is designed with semicircular side holes around it for filling light guide glue and exhaust during the process.

[0030] like Figure 7 As shown, the external pin group 7 includes an external pin C71, an external pin A72, an external pin B73, an external pin D74, an external pin F75, an external pin G76, and an external pin E77. The external pin C71, the external pin A72, the external pin B73, the external pin D74, the external pin F75, the external pin G76, and the external pin E77 are respectively connected to the internal pin C31, the internal pin A21, the internal pin B22, the internal pin D33, the internal pin F310, the internal pin G24, and the internal pin E38 through a molybdenum copper column 9.

[0031] like Figure 2 and 8 As shown, the external pin group 7 includes a welding portion 78 welded to the molybdenum copper column 9, and one end of the welding portion 78 extends outward from the ceramic housing 8 and is bent vertically. The lead-out terminal of the DIP packaging method is bent downward at the bottom, and is not a conventional structure with a straight downward side; the bottom of the two rows of lead-out terminals of the power controller is asymmetrically designed, the bottom welding area of ​​the power lead-out terminal is large, and the bottom welding area of ​​the signal lead-out terminal is small. The power lead-out terminal uses a molybdenum copper column to connect to the inside to reduce the lead resistance.

Claims

1. A multi-layer integrated optical isolation high current power controller, comprising a power output chip (1), an output circuit module (2), and an input circuit module (3), characterized in that: The power output chip (1), the output circuit module (2), and the input circuit module (3) are sequentially mounted in a ceramic housing (8), the output circuit module (2) and the input circuit module (3) are arranged opposite to each other, an external pin group (7) is provided at the bottom of the ceramic housing (8), and the external pin group (7) is respectively connected to the power output chip (1), the output circuit module (2), and the input circuit module (3) through molybdenum copper pillars (9); the power output chip (1) is mounted at the bottom of the ceramic housing (8) and on both sides of the middle boss (83), the output circuit module (2) is supported in the middle of the ceramic housing (8) through second step grooves (82) on opposite side walls of the second step groove (82), the input circuit module (3) is supported and mounted on the upper end of the ceramic housing (8) through a first step groove (81) machined at the upper end of the ceramic housing (8), and a cover plate (4) is mounted on the top of the ceramic housing (8).

2. The multi-layer integrated optical isolation high current power controller according to claim 1, characterized in that: The power output chip (1) comprises two field effect tube chips, the two field effect tube chips are connected to the bottom of the ceramic housing (8) via conductive silver glue, a connecting plate (6) is provided on the middle boss (83), and the two field effect tubes are respectively connected to the connecting plate (6) via bonding wires (10).

3. The multi-layer integrated optical isolation high current power controller according to claim 1, characterized in that: The output circuit module (2) comprises an output substrate (27), a plurality of isolation drive chip seats (26) are mounted in the middle of the output substrate (27), the plurality of isolation drive chip seats (26) are arranged in a straight line in the middle of the output substrate (27), a contact board A (23) and an inner pin G (24) are respectively arranged on both sides of the isolation drive chip seat (26) on the output substrate (27), the two ends of the contact board A (23) are respectively connected to the inner pin A (21) and the inner pin B (22), the inner pin A (21), the inner pin B (22) and the output substrate (27) are connected to the outer pin group (7) via a molybdenum copper column (9); an isolation drive chip (25) is mounted on the isolation drive chip seat (26), and the isolation drive chip (25) is respectively connected to the contact board A (23) and the inner pin G (24) via bonding wires.

4. The multi-layer integrated optical isolation high current power controller according to claim 1, characterized in that: The input circuit module (3) comprises an input substrate (37), wherein a row of resistor bases (35) and a row of light emitting diode bases (36) are respectively arranged in the middle of the input substrate (37), and adjacent to the resistor bases (35) and the light emitting diode bases (36) are respectively arranged a contact board B (32) and a contact board C (39) parallel thereto, wherein one end of the contact board B (32) is connected to an inner pin C (31) and an inner pin F (310), and one end of the contact board C (39) is connected to an inner pin D (33) and an inner pin E (38), and the inner pin C (31), inner pin F (310) and inner pin D (33), inner pin E (38) are respectively arranged at two ends of the input substrate (37) and at the edge of the input substrate (37); the resistor base (35) and the light-emitting diode base (36) are respectively provided with a resistor (34) and a light-emitting diode (311), adjacent resistors (34) and light-emitting diodes (311) are connected to each other through bonding wires, and the resistors (34) and light-emitting diodes (311) are also respectively connected to the contact board B (32) and the contact board C (39) through bonding wires.

5. The multi-layer integrated optical isolation high current power controller according to claim 1, characterized in that: The edges of the output circuit module (2) and the input circuit module (3) are both processed with semicircular grooves (11).

6. The multi-layer integrated optical isolation high current power controller according to claim 1, characterized in that: The external pin group (7) comprises an external pin C (71), an external pin A (72), an external pin B (73), an external pin D (74), an external pin F (75), an external pin G (76), and an external pin E (77); the external pin C (71), the external pin A (72), the external pin B (73), the external pin D (74), the external pin F (75), the external pin G (76), and the external pin E (77) are respectively connected to the internal pin C (31), the internal pin A (21), the internal pin B (22), the internal pin D (33), the internal pin F (310), the internal pin G (24), and the internal pin E (38) via a molybdenum copper column (9).

7. The multi-layer integrated optical isolation high current power controller according to claim 6, characterized in that: The external pin group (7) comprises a welding portion (78) welded to the molybdenum copper column (9), and one end of the welding portion (78) extends outside the ceramic housing (8) and is vertically bent.

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