Internal vertically stacked signal isolation transmission packaging structure and isolator

Abstract

The invention provides an internally vertically stacked signal isolation transmission packaging structure and an isolator. The packaging structure comprises a first base island, a second base island, a first chip, a second chip, a first transceiving unit, a second transceiving unit, a first plastic package body, a first bonding pad and a second bonding pad, the first chip is arranged on the first base island; the second chip is arranged on the second base island; the first chip, the first base island, the second chip and the second base island are plastically packaged in the first plastic package body; a first bonding pad communicated with the first chip and a second bonding pad communicated with the second chip are respectively arranged on the first plastic package body; the first transceiving unit is arranged on the first plastic package body and is connected with the first bonding pad; the second transceiving unit and the first transceiving unit correspond to each other in the stacking direction of the packaging structure or correspond to each other in the same level of the packaging structure; the second transmit-receive unit is connected with the second bonding pad. According to the invention, the size is reduced through the internal vertical stacking layout design, and the isolation performance is improved at the same time.

Description

Technical Field

[0001] The present invention relates to the field of packaging technology, and in particular to an internally vertically stacked signal isolation transmission packaging structure and an isolator. Background Art

[0002] The existing signal isolation transmission structure usually adopts the traditional frame packaging, and its structure is as follows Figure 1 As shown, the chip in the packaging structure is bonded to two independent frame base islands on the left and right in a flat manner, connected by wire bonding, and then plastic-sealed as a whole to form a finished packaged chip with the function of isolating and transmitting signals on both sides.

[0003] The isolation strength of the above-mentioned existing signal isolation transmission packaging structure depends on the base island spacing, and the overall size of the packaging structure is relatively large; furthermore, the direction of its isolation transmission path is single and is dependent on the frame; in addition, its wiring is relatively complex, so the wiring parasitic parameters are large, which can easily affect the coupling performance of the isolation transmission. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide an internal vertically stacked signal isolation transmission packaging structure and an isolator, which can both reduce the size of the packaging structure and optimize the isolation transmission performance.

[0005] In order to solve the above technical problems, the first technical solution adopted by the present invention is:

[0006] An internal vertically stacked signal isolation transmission packaging structure comprises: a first base island, a second base island, a first chip, a second chip, a first transceiver unit, a second transceiver unit, a first plastic package, a first solder pad and a second solder pad; the first base island and the second base island are separated by a preset distance;

[0007] The first chip is disposed on the first base island; the second chip is disposed on the second base island; the first chip, the first base island, the second chip and the second base island are plastic-encapsulated in the first plastic encapsulation body;

[0008] The first plastic package body is respectively provided with the first solder pad connected to the first chip, and the second solder pad connected to the second chip; the first transceiver unit is arranged on the first plastic package body and connected to the first solder pad; the second transceiver unit corresponds to the first transceiver unit in the stacking direction of the packaging structure, or corresponds to the same level of the packaging structure; the second transceiver unit is connected to the second solder pad.

[0009] Optionally, the second transceiver unit is disposed on the first plastic packaging body and corresponds to the first transceiver unit.

[0010] Optionally, in a stacking direction of the package structure, the first base island, the first chip and the first transceiver unit correspond to each other;

[0011] In the stacking direction of the package structure, the second base island, the second chip and the second transceiver unit correspond to each other.

[0012] Optionally, it further includes a second plastic packaging body; the first plastic packaging body, the first transceiver unit and the second transceiver unit are plastic-sealed in the second plastic packaging body.

[0013] Optionally, it also includes a second plastic package body and a third solder pad; the first plastic package body and the first transceiver unit are plastic-encapsulated in the second plastic package body; the second transceiver unit is arranged on the second plastic package body and corresponds to the first transceiver unit in the stacking direction of the packaging structure; the second plastic package body is provided with a third solder pad connected to the second solder pad; the second transceiver unit is connected to the second solder pad via the third solder pad.

[0014] Optionally, the packaging structure further includes a third plastic packaging body; the first plastic packaging body, the second plastic packaging body and the second transceiver unit are plastic-sealed in the third plastic packaging body.

[0015] Optionally, the first pad, the second pad and the third pad are all perpendicular to a stacking direction of the package structure.

[0016] Optionally, the first chip and the first base island are connected in sequence through bonding wires; and the second chip and the second base island are connected in sequence through bonding wires.

[0017] Optionally, the first transceiver unit is an antenna or a coil; the second transceiver unit is an antenna or a coil.

[0018] Another technical solution provided by the present invention is:

[0019] An isolator comprises the above-mentioned signal isolation transmission packaging structure.

[0020] The beneficial effect of the present invention is that the present invention uniformly plastic-encapsulates the base island and the chip in the first plastic package, arranges the first transceiver unit and the second transceiver unit above the first plastic package in a flat or vertically stacked manner, and connects to the corresponding chip in the first plastic package through pads, respectively, so as to obtain an isolation transmission packaging structure with an internal vertical stacking layout design. The present invention can not only ensure effective isolation transmission between the primary side and the secondary side; but also the internal vertical stacking layout design can shorten the signal path, making the transmission matching performance more guaranteed, and can meet the requirements of various isolation transmission path directions and isolation strength by adjusting the thickness of the plastic package without increasing the floor space, and further, can significantly reduce the size of the packaging structure in the horizontal direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of a signal isolation transmission packaging structure in the prior art;

[0022] Figure 2 A schematic diagram of a structure of an internal vertically stacked signal isolation transmission package structure provided by an embodiment of the present invention Figure 1 ;

[0023] Figure 3 A schematic diagram of a structure of an internal vertically stacked signal isolation transmission package structure provided by an embodiment of the present invention Figure 2 ;

[0024] Figure 4 for Figure 2 A schematic diagram of the process flow of manufacturing a vertically stacked signal isolation transmission packaging structure;

[0025] Figure 5 for Figure 3 Schematic diagram of the process flow of manufacturing an internal vertically stacked signal isolation transmission packaging structure.

[0026] Description of labels:

[0027] 10. first plastic sealing body; 20. second plastic sealing body; 30. third plastic sealing body;

[0028] 11. first base island; 12. first chip; 13. first transceiver unit; 14. first pad;

[0029] 21. second base island; 22. second chip; 23. second transceiver unit; 24. second pad;

[0030] 31. The third solder pad. DETAILED DESCRIPTION

[0031] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in combination with the implementation modes and the accompanying drawings.

[0032] Embodiment 1

[0033] Please refer to Figure 2 and Figure 3 The present embodiment provides an internal vertically stacked signal isolation transmission packaging structure, including: a first base island 11, a second base island 21, a first chip 12, a second chip 22, a first transceiver unit 13, a second transceiver unit 23, a first plastic package 10, a first solder pad 24 and a second solder pad 31; the first base island 11 and the second base island 21 are separated by a preset distance;

[0034] The first chip 12 is disposed on the first base island 11; the second chip 22 is disposed on the second base island 21; the first chip 12, the first base island 11, the second chip 22 and the second base island 21 are plastic-encapsulated in the first plastic encapsulation body 10;

[0035] The first plastic package 10 is provided with the first solder pad 14 connected to the first chip 12, and the second solder pad 24 connected to the second chip 22; the first transceiver unit 13 is provided on the first plastic package 10 and connected to the first solder pad 14; the second transceiver unit 23 corresponds to the first transceiver unit 13 in the stacking direction of the packaging structure (such as Figure 3 ), or in the same level of the package structure (as shown in Figure 2 As shown); the second transceiver unit 23 is connected to the second pad 24.

[0036] In this embodiment, the stacking direction refers to the hierarchical stacking direction of the packaging structure, that is, the Z-axis direction of the packaging structure. Assuming that the level where the first base island and the second base island are located is the first level, the level where the first chip disposed on the first base island and the second chip disposed on the second base island are respectively located is the second level stacked on the first level, and the components disposed on the upper surface of the first plastic package body are the third level, and so on, by stacking in the Z-axis direction of the overall structure to form a vertically stacked packaging structure. Therefore, it can also be understood that the same level described in this embodiment refers to being in the same first level / second level...

[0037] In this embodiment, the second transceiver unit corresponds to the first transceiver unit in the stacking direction of the packaging structure, which means that the signal transmission and reception directions of the first transceiver unit and the second transceiver unit correspond to each other in the Z-axis direction of the packaging structure. It can also be understood that the second transceiver unit and the first transceiver unit are in a vertically corresponding relationship, one above and one below. For details, please refer to Figure 3Similarly, the second transceiver unit corresponds to the first transceiver unit in the same level of the packaging structure, which means that the signal transmission and reception directions of the first transceiver unit and the second transceiver unit correspond to each other in the X / Y axis direction of the packaging structure. It can also be understood that the first transceiver unit and the second transceiver unit are arranged horizontally with a distance between them, which is a horizontal correspondence between left and right. For details, please refer to Figure 2 The above two layout designs for the transceiver unit can ensure the best signal transmission and reception effect between the primary side and the secondary side, that is, the best isolation transmission effect.

[0038] In this embodiment, the primary side structure includes a first chip, a first transceiver unit and a first base island; the secondary side structure includes a second chip, a second transceiver unit and a second base island. The primary side structure performs wireless isolation transmission of signals through the first transceiver unit and the second transceiver unit of the secondary side structure; the first base island and the second base island serve as carriers for isolation transmission.

[0039] It can be understood that in the signal isolation transmission packaging structure of this embodiment, the first chip, the first transceiver unit and the first base island in the primary side structure need to be connected in sequence; the second chip, the second transceiver unit and the second base island in the secondary side structure need to be connected in sequence.

[0040] In some specific implementations of this embodiment, Figure 2 and Figure 3 As shown, before the first chip 12 and the first base island 11 in the primary side structure are plastic-encapsulated in the first plastic encapsulation body 10, the connection relationship between the first chip 12 and the first transceiver unit 13 can be established by wire bonding. Correspondingly, before the second chip 22 and the second base island 21 in the secondary side structure are plastic-encapsulated in the first plastic encapsulation body 10, the connection relationship between the second chip 22 and the second transceiver unit 23 can also be established by wire bonding. Here, since the first chip 12 and the first base island 11, the second chip 22 and the second base island 21 are all in the same plastic encapsulation body (i.e., the first plastic encapsulation body 10), it is easier to implement the connection relationship by wire bonding in terms of process and the operation is more convenient.

[0041] In some other specific implementations of this embodiment, the first chip in the primary side structure and the first base island may also be connected in other ways, for example, a pad may be drawn out by punching holes on the surface of the first base island to connect the first chip; or, the first chip directly uses a flip chip with built-in solder joints, and the solder joints of the flip chip are ground flat and connected to the first base island as a pad. Correspondingly, the second chip in the secondary side structure and the second base island may also be connected in the same way, that is, a pad may be drawn out by punching holes on the surface of the second base island to connect the second chip; or, the second chip directly uses a flip chip with built-in solder joints, and the solder joints of the flip chip are ground flat and connected to the second base island as a pad.

[0042] In particular, in this embodiment, since the first transceiver unit and the second transceiver unit are arranged outside the first plastic package, they are at different levels from the corresponding chips. Therefore, the first transceiver unit and the first chip, and the second transceiver unit and the second chip cannot be connected by wire bonding. Figure 2 and Figure 3 As shown, in this embodiment, the first solder pad 14 connected to the first chip 12 and the second solder pad 24 connected to the second chip 22 are respectively arranged on the first plastic package 10, so that the first transceiver unit 13 and the second transceiver unit 23 arranged outside the first plastic package 10 can be connected to the corresponding chips through the corresponding solder pads, ensuring the normal functions of the primary side structure and the secondary side structure.

[0043] In some specific implementations of this embodiment, the first transceiver unit is an antenna or a coil; the second transceiver unit is an antenna or a coil. In particular, the first transceiver unit and the second transceiver unit can also be directly implemented on the first plastic package by electroplating.

[0044] The signal isolation transmission packaging structure provided in this embodiment is vertically stacked internally, so that the primary side structure and the secondary side structure can achieve effective isolation transmission in the stacking direction or horizontal direction. Not only does it shorten the signal path, making the transmission matching performance more guaranteed; it can also meet the requirements of various isolation transmission path directions and isolation strength by adjusting the thickness of the plastic package without increasing the floor space; furthermore, it can also significantly reduce the size of the packaging structure in the horizontal direction.

[0045] Embodiment 2

[0046] This embodiment is further expanded based on the above-mentioned embodiment 1, and specifically describes in detail the corresponding relationship between the first transceiver unit and the second transceiver unit.

[0047] As can be seen from the above-mentioned first embodiment, the correspondence between the second transceiver unit and the first transceiver unit can have two layout designs: (1) corresponding in the same level of the package structure; (2) corresponding in the stacking direction of the package structure. This embodiment describes in detail the implementation methods of these two different layout designs in combination with specific implementation methods:

[0048] (1) The second transceiver unit corresponds to the first transceiver unit in the same level of the packaging structure.

[0049] like Figure 2 As shown, in some specific implementations of this embodiment, the second transceiver unit 23 can also be arranged on the first plastic package body 10, that is, the first transceiver unit 13 and the second transceiver unit 23 are both arranged on the upper surface of the first plastic package body 10, and the two correspond to each other in the horizontal direction. Here, the first transceiver unit 13 and the second transceiver unit 23 are at the same level; and the transceiver directions of the first transceiver unit 13 and the second transceiver unit 23 correspond to each other in the horizontal direction.

[0050] In some preferred specific embodiments, in the stacking direction of the packaging structure, the first base island 11, the first chip 12 and the first transceiver unit 13 correspond to each other; accordingly, in the stacking direction of the packaging structure, the second base island 21, the second chip 22 and the second transceiver unit 23 correspond to each other.

[0051] In some preferred embodiments, Figure 2 As shown, the packaging structure further includes a second plastic package 20; the first plastic package 10, the first transceiver unit 13 and the second transceiver unit 23 are plastic packaged in the second plastic package 20. The second plastic package 20 serves to fix the first transceiver unit 13 and the second transceiver unit 23.

[0052] It can be understood that based on this layout design, the first transceiver unit on the primary side and the second transceiver unit on the secondary side will perform isolated transmission in the horizontal direction; at the same time, for the isolated transmission packaging structure as a whole, the internal parts of the primary side structure and the secondary side structure are also implemented in a vertical stacking manner, and the two constitute a mirror structure, which can not only greatly optimize the overall layout design of the packaging structure, significantly reduce its horizontal size, and strengthen the overall structure; but also can realize the overall internal vertical stacking design with the shortest connection line, thereby minimizing the size of the packaging structure to the greatest extent.

[0053] (2) The second transceiver unit corresponds to the first transceiver unit in the stacking direction of the packaging structure.

[0054] like Figure 3As shown, in some other specific implementations of this embodiment, the first transceiver unit 13 and the second transceiver unit 23 can be stacked vertically. Specifically, the packaging structure will also include a second plastic package 20 and a third solder pad 31; wherein the first plastic package 10 and the first transceiver unit 13 arranged on the upper surface of the first plastic package 10 are plastic-sealed in the second plastic package 20; the second transceiver unit 23 is arranged on the upper surface of the second plastic package 20, and corresponds to the first transceiver unit 13 in the first plastic package 10 in the stacking direction of the packaging structure; the second plastic package 20 is provided with the third solder pad 31 connected to the second solder pad 24; the second transceiver unit 23 is connected to the second solder pad 24 through the third solder pad 31. It can be understood that in the stacking direction of the packaging structure, the first base island 11, the first chip 12, the first transceiver unit 13 and the second transceiver unit 23 are distributed correspondingly, so that the overall packaging structure is more compact and more conducive to the miniaturization design of the packaging structure.

[0055] In some preferred embodiments, Figure 3 As shown, the packaging structure further includes a third plastic package 30; the first plastic package 10, the second plastic package 20 and the second transceiver unit 23 are plastic packaged in the third plastic package 30. Here, the third plastic package plays a role in fixing the second transceiver unit.

[0056] In some preferred embodiments, the first pad, the second pad and the third pad are all perpendicular to the stacking direction of the package structure, that is, the pads in the package structure are all vertical pads, which is convenient for processing and can shorten the connection line.

[0057] In particular, in this layout design, by adjusting the thickness of the second plastic package, the "isolation distance" between the primary side structure and the secondary side structure can be adjusted, and then the isolation strength can be adjusted to meet the requirements of various isolation transmission path directions and isolation strengths.

[0058] It can be understood that based on this layout design, the first transceiver unit on the primary side and the second transceiver unit on the secondary side will be isolated and transmitted in the vertical direction. Since the first transceiver unit and the second unit are designed to be stacked vertically, the overall horizontal area of ​​the packaging structure will not be affected at all, and the size of the packaging structure in the horizontal direction can be significantly reduced; furthermore, the requirements of various isolation transmission path directions and isolation strength can be met by adjusting the thickness of the plastic package without increasing the floor space, thereby improving the application scope of the isolation transmission packaging structure.

[0059] Embodiment 3

[0060] This embodiment is further expanded on the basis of the second embodiment, and provides corresponding process manufacturing flows for its two different layout designs.

[0061] See also Figure 4 ,correspond Figure 2 The process flow of the signal isolation transmission packaging structure shown includes:

[0062] S1: Make the framework;

[0063] S2: First chip placement: placing a first chip on the first base island by bonding or other methods, and placing a second chip on the second base island by bonding or other methods;

[0064] S3: Wire bonding: Wire bonding connects the first chip and the first transceiver unit, and the second chip and the second transceiver unit;

[0065] S4: First plastic packaging: The first base island, the second base island, the first chip and the second chip are plastic packaged by plastic packaging methods such as injection molding to form a first plastic packaging body.

[0066] S5: Laser + electroplating + surface treatment: Solder joints connected to the first chip and the second chip are formed by punching holes and electroplating on the upper surface of the first plastic package; then the two solder joints are surface treated to form the first pad and the second pad. The purpose of this step is to lead the signal of the first chip to the surface of the first plastic package through the first pad, and to lead the signal of the second chip to the surface of the second plastic package through the second pad.

[0067] S6: Second core mounting: The first transceiver unit and the second transceiver unit are respectively arranged on the first plastic package body by bonding or other methods, and are respectively connected to the corresponding first soldering pad and the second soldering pad. Here, the first transceiver unit and the second transceiver unit on the upper surface of the first plastic package body need to correspond to each other in the horizontal direction, that is, the two are on the same straight line, so as to ensure the best isolation transmission effect.

[0068] S7: Second plastic packaging: Wrap the first plastic packaging body, the first transceiver unit and the second transceiver unit by injection molding or other plastic packaging methods to form a second plastic packaging body.

[0069] S8: cutting and forming.

[0070] The above process flow, by designing the layout of the internal vertically stacked primary-side structure and the internal vertically stacked secondary-side structure in a mirror-symmetrical distribution manner, not only realizes effective isolated transmission in the horizontal direction, shortens the signal path, makes the transmission matching performance more guaranteed, but also significantly reduces the size of the packaging structure in the horizontal direction; it can also greatly optimize the overall layout design of the packaging structure, significantly reduce its size in the horizontal direction, and strengthen the overall structure; further, it can also achieve the minimum and shortest possible connections, thereby minimizing the size of the packaging structure.

[0071] See also Figure 5 ,correspond Figure 3 The process flow of the signal isolation transmission packaging structure shown includes:

[0072] S1: Make the framework;

[0073] S2: First chip placement: placing a first chip on the first base island by bonding or other methods, and placing a second chip on the second base island by bonding or other methods;

[0074] S3: first bonding: bonding the first chip to the first transceiver unit, and the second chip to the second transceiver unit;

[0075] S4: First plastic packaging: The first base island, the second base island, the first chip and the second chip are plastic packaged by plastic packaging methods such as injection molding to form a first plastic packaging body.

[0076] S5: First laser + electroplating + surface treatment: Solder joints connected to the first chip and the second chip are formed by punching holes and electroplating on the upper surface of the first plastic package; then the two solder joints are surface treated to form the first pad and the second pad. The purpose of this step is to lead the signal of the first chip to the surface of the first plastic package through the first pad, and to lead the signal of the second chip to the surface of the second plastic package through the second pad.

[0077] S6: Second core mounting: The first transceiver unit is disposed on the first plastic package body at a position corresponding to the first solder pad by bonding or other methods.

[0078] S7: Second plastic packaging: Wrap the first plastic packaging body and the first transceiver unit by injection molding or other plastic packaging methods to form a second plastic packaging body;

[0079] S8: Second laser + electroplating + surface treatment: A solder joint connected to the second pad is formed by punching and electroplating on the upper surface of the second plastic package, and then the solder joint is surface treated to form a third pad. The purpose of this step is to lead the signal of the second chip to the surface of the second plastic package through the second pad and the third pad. Preferably, the second pad and the third pad are located on the same straight line to ensure the stability of the connection relationship and shorten the connection line.

[0080] S9: Third core loading: The second transceiver unit is set on the second plastic package body by bonding or other methods, and the second transceiver unit is connected to the third pad. Here, the second transceiver unit needs to correspond to the first transceiver unit in the second plastic package body in the stacking direction, that is, it is located directly above the first transceiver unit to ensure the best isolation transmission effect.

[0081] S10: Third plastic packaging: Wrapping the first plastic packaging body, the second plastic packaging body and the second transceiver unit by injection molding or other plastic packaging methods to form a third plastic packaging body.

[0082] S11: cutting and forming.

[0083] The above process design arranges the interior of the packaging structure in a vertical stacking manner, so that the first transceiver unit on the primary side and the second transceiver unit on the secondary side are isolated and transmitted in the vertical direction. The signal isolation transmission packaging structure made by the above process can not only shorten the signal path and make the transmission matching performance more guaranteed; but also meet the requirements of various isolation transmission path directions and isolation strength by adjusting the thickness of the plastic package without increasing the floor space; and further, the size of the packaging structure in the horizontal direction can be significantly reduced.

[0084] Embodiment 4

[0085] This embodiment is based on any one of the above embodiments 1 to 3 and further expands to provide an isolator. The isolator can achieve face-to-face isolated communication transmission in the vertical direction, or isolated communication transmission in the horizontal direction; more importantly, its isolation transmission performance is improved to a certain extent, and the size of the isolation chip inside it is optimized.

[0086] The isolator provided in this embodiment includes the signal isolation transmission packaging structure described in any one of the above embodiments. The specific structure of the signal isolation transmission packaging structure and its corresponding process flow are not described here in detail. For details, please refer to the description of the above embodiments.

[0087] The isolator provided in this embodiment has an isolation chip whose internal layout is designed in a vertical stacking manner, and its primary side structure and secondary side structure can be selected in the stacking direction or the horizontal direction to achieve effective isolation transmission. As a result, not only the signal path is shortened, so that the transmission matching performance is more guaranteed; but also the requirements of various isolation transmission path directions and isolation strength can be met by adjusting the thickness of the plastic package without increasing the floor space; furthermore, the size of the packaging structure in the horizontal direction can be significantly reduced.

[0088] The isolator of this embodiment can be well applied to scenarios requiring wireless isolation transmission, such as high and low voltage wireless isolation in power systems.

[0089] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent transformations made using the contents of the present invention's specification and drawings, or directly or indirectly applied in related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. The internal vertically stacked signal isolation transmission packaging structure is characterized by: include: A first base island, a second base island, a first chip, a second chip, a first transceiver unit, a second transceiver unit, a first plastic package, a first solder pad, and a second solder pad; the first base island and the second base island are separated by a preset distance; The first chip is disposed on the first base island; the second chip is disposed on the second base island; the first chip, the first base island, the second chip and the second base island are plastic-encapsulated in the first plastic encapsulation body; The first plastic package body is provided with the first solder pad connected to the first chip and the second solder pad connected to the second chip; the first transceiver unit is provided on the first plastic package body and connected to the first solder pad; the second transceiver unit corresponds to the first transceiver unit in the stacking direction of the packaging structure, or corresponds to the first transceiver unit in the same level of the packaging structure; The second transceiver unit is connected to the second pad.

2. The internal vertically stacked signal isolation transmission packaging structure according to claim 1, characterized in that: The second transceiver unit is disposed on the first plastic package body and corresponds to the first transceiver unit.

3. The internal vertically stacked signal isolation transmission packaging structure as claimed in claim 2, characterized in that: In the stacking direction of the package structure, the first base island, the first chip and the first transceiver unit correspond to each other; In the stacking direction of the package structure, the second base island, the second chip and the second transceiver unit correspond to each other.

4. The internal vertically stacked signal isolation transmission packaging structure as claimed in claim 2, characterized in that: It also includes a second plastic packaging body; the first plastic packaging body, the first transceiver unit and the second transceiver unit are plastic-sealed in the second plastic packaging body.

5. The internal vertically stacked signal isolation transmission packaging structure according to claim 1, characterized in that: It also includes a second plastic package body and a third soldering pad; the first plastic package body and the first transceiver unit are plastic-encapsulated in the second plastic package body; the second transceiver unit is arranged on the second plastic package body and corresponds to the first transceiver unit in the stacking direction of the packaging structure; the second plastic package body is provided with the third soldering pad connected to the second soldering pad; the second transceiver unit is connected to the second soldering pad via the third soldering pad.

6. The internal vertically stacked signal isolation transmission packaging structure as claimed in claim 5, characterized in that: The packaging structure further includes a third plastic package body; the first plastic package body, the second plastic package body and the second transceiver unit are plastic-sealed in the third plastic package body.

7. The internal vertically stacked signal isolation transmission packaging structure as claimed in claim 5, characterized in that: The first pad, the second pad and the third pad are all perpendicular to the stacking direction of the package structure.

8. The internal vertically stacked signal isolation transmission packaging structure according to claim 1, characterized in that: The first chip and the first base island are connected in sequence through bonding wires; the second chip and the second base island are connected in sequence through bonding wires.

9. The internal vertically stacked signal isolation transmission packaging structure according to claim 1, characterized in that: The first transceiver unit is an antenna or a coil; the second transceiver unit is an antenna or a coil.

10. An isolator, characterized in that: It comprises the signal isolation transmission packaging structure as described in any one of claims 1 to 9 above.

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