High-power-density solid power controller and packaging structure thereof

Abstract

The invention provides a high-power-density solid power controller and a packaging structure thereof. Comprising an MCU, and the MCU is connected with a CAN transceiver, a power conversion unit, an isolation control unit and an acquisition unit. The CAN transceiver is connected, and the CAN transceiver is provided with a CANL pin and a CANH pin; the isolation control unit is connected with the power switch unit, the power switch unit is connected with the power supply input pin, the power supply input pin is further connected with a power supply protection unit, and the power supply protection unit is connected with the grounding pin; and the acquisition unit is connected with the power supply output pin. According to the invention, redundancy control is realized through the CAN bus, so that the programmable tripping characteristic is realized; the working state and the current value of the load equipment can be collected and reported to the upper computer in real time; the protection circuit has I2t over-current protection, short-circuit protection, under-voltage warning and over-voltage protection functions, and can perform self-locking after protection, so that the safety of load operation is improved.

Description

Technical Field

[0001] The invention relates to a high power density solid power controller and a packaging structure thereof. Background Art

[0002] In the current airborne power distribution system network, solid-state power controllers are the core components of solid-state power distribution systems. Existing solid-state power controllers are large in size and are mostly built with discrete semiconductor electronic components. They are not sufficiently integrated and have low power density, which cannot meet the needs of increasingly lightweight and miniaturized airborne systems in the future. In addition, existing solid-state power controllers have capacitive loads, and there are large current spikes at the moment of switching on, which damage the MOS tube.

[0003] For example, CN110267442B discloses an integrated SiC solid-state power controller, which adopts a three-layer stacking structure of a power circuit board, a drive circuit board and a digital circuit board. The electrical connection is made through copper pillars and pins. The module is connected to the outside by bending the power terminal to achieve the characteristics of high temperature resistance, high power density and low parasitic parameters of the module. The power routing is realized by using copper-clad ceramic substrate technology with Si3N4 ceramic substrate as the material. The layout of the main circuit, current limiting branch and discharge branch is integrated, and a right-angle bending circuit structure is adopted to greatly reduce the volume of the power part circuit, reduce the parasitic parameters of the power part circuit, and thus reduce the voltage stress of the SiC MOSFET. However, it has the problem of capacitive load, which causes it to receive a large current shock when it is turned on. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a high power density solid power controller and its packaging structure.

[0005] The present invention is achieved through the following technical solutions.

[0006] The present invention provides a high-power-density solid power controller; comprising an MCU, wherein the MCU is respectively connected to a CAN transceiver, a power conversion unit, an isolation control unit, and a collection unit; the CAN transceiver is connected, and the CAN transceiver is provided with a CAN_L pin and a CAN_H pin; the isolation control unit is connected to a power switch unit, and the power switch unit is connected to a power input pin, and the power input pin is also connected to a power protection unit, and the power protection unit is connected to a ground pin; the collection unit is connected to a power output pin.

[0007] The power conversion unit includes an LDO power chip, which is connected to the VCC pin and converts the power supply VCC into 3.3V to power the MCU.

[0008] The power switch unit includes a MOS tube, and the collection unit includes a micro current sensor. The micro current sensor collects the current in the MOS tube and converts the electrical signal into a voltage analog signal and transmits it to the MCU.

[0009] The isolation control unit comprises an optical coupler, the front end of which is connected to the MCU, and the rear end of which is respectively connected to the gate and source of the MOS tube in the power switch unit.

[0010] The invention comprises a base; the base, a power board and a control board, wherein the power board and the control board are stacked on the base, and a plurality of external pins are installed at both ends of the base, one end of the external pins extends into the upper end surface of the base and is respectively connected with the power board and the control board, and the other end neatly extends out of the lower end surface of the power board; a power switch unit, a collection unit and an isolation control unit are installed on the power board, and a power conversion unit, an MCU, a CAN transceiver, a status collection unit and a power protection unit are installed on the control board, the power conversion unit is electrically connected with the CAN transceiver and the MCU through the printed circuit on the control board, the power conversion unit is electrically connected with the isolation control unit and the collection unit through the inner lead, the MCU is electrically connected with the CAN transceiver and the status collection unit through the printed circuit on the control board, and the MCU is electrically connected with the collection unit and the isolation control unit through the inner lead.

[0011] The power board is installed on the upper end surface of the base, the power unit includes a bare core MOS tube, the acquisition unit includes a micro current sensor, the isolation control unit includes a photocoupler, the MOS tube is installed at one end of the power board, and the micro current sensor and the photocoupler are installed at the other end of the power board.

[0012] The control board is installed directly above the power board, and the power conversion unit and the MCU are installed at two ends of the control board respectively.

[0013] The external pins are connected to the power board and the control board to support the control board above the power board. The external pins include PIN, PGND, POUT, VCC, CAN_L, CAN_H, and GND pins. The PIN, PGND, POUT pins and VCC, CAN_L, CAN_H, and GND pins are respectively installed at both ends of the base.

[0014] The PIN pin is electrically connected to the power switch unit, the POUT pin is electrically connected to the acquisition unit, and the PGND pin is electrically connected to the TVS tube in the power protection unit; the VCC and GND pins are electrically connected to the power conversion unit, and the CAN_L and CAN_H pins are electrically connected to the CAN transceiver.

[0015] An outer cover is also installed on the base to enclose the power board and the control board in the outer cover.

[0016] The beneficial effects of the present invention are: through CAN bus redundancy control, it has programmable tripping characteristics; it can collect the working status and current value of the load equipment and report them to the host computer in real time; it has I 2 It has over-current protection, short-circuit protection, under-voltage warning and over-voltage protection functions, and can self-lock after protection, which increases the safety of load operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the principle of the present invention;

[0018] Figure 2 It is a schematic diagram of the processing circuit structure of the present invention;

[0019] Figure 3 It is a schematic diagram of the structure of the driving control circuit of the present invention;

[0020] Figure 4 It is a structural schematic diagram of the state acquisition unit of the present invention;

[0021] Figure 5 is a schematic diagram of a power conversion unit of the present invention;

[0022] Figure 6 It is a schematic diagram of the internal chip structure of the present invention;

[0023] Figure 7 It is a schematic diagram of the packaging structure of the present invention;

[0024] Figure 8 It is a schematic diagram of the pin arrangement of the present invention;

[0025] In the figure: 1-base, 2-power board, 3-control board, 4-outer cover, 5-inner lead, 6-LDO power chip, 7-MCU, 8-external pin, 9-MOS tube, 10-photocoupler, 11-inclined surface. DETAILED DESCRIPTION

[0026] The technical solution of the present invention is further described below, but the scope of protection claimed is not limited to the description.

[0027] like Figure 1As shown, a high power density solid power controller; including MCU, the MCU is respectively connected to a CAN transceiver, a power conversion unit, an isolation control unit, and a collection unit; the CAN transceiver is connected, and the CAN transceiver is provided with a CAN_L pin and a CAN_H pin; the isolation control unit is connected to a power switch unit, and the power switch unit is connected to a power input pin, and the power input pin is also connected to a power protection unit, and the power protection unit is connected to a ground pin; the collection unit is connected to a power output pin. Taking the on command as an example, when the CAN transceiver of the product receives the on command from the external host computer, the CAN transceiver transmits the signal to the MCU, and the MCU determines whether the loop state is normal. If it is normal, it controls the power switch unit to be turned on, and the load loop is turned on. When the load device is working, the MCU collects the state and current value of the load circuit in real time through the acquisition unit and the state acquisition unit. If the starting overcurrent protection point is reached, the inverse current protection is performed. The starting protection point and the inverse current protection time can be configured and changed through CAN communication; if the loop current reaches the short-circuit protection point, the short-circuit protection is performed, and the protection is self-locked. When the reconnection command is sent through CAN communication, the self-locking state is reset, and the connection command can be sent again to connect. In addition, the working status and current value of the solid power controller are reported in real time through CAN communication. The host can monitor the operation of the solid power controller in real time, and can also issue commands to query the working status, current value and other information when necessary.

[0028] like Figure 2 As shown, the power conversion unit includes an LDO power chip, which is connected to the VCC pin to convert the power supply VCC into 3.3V to power the MCU. The power supply voltage is converted to 3.3V by the LDO chip, and the 3.3V voltage is used to power the MCU, current sensor, and optocoupler and provide a reference voltage.

[0029] like Figure 3 As shown, the power switch unit includes a MOS tube, and the acquisition unit includes a micro current sensor. The micro current sensor collects the current in the MOS tube and converts the electrical signal into a voltage analog signal for transmission to the MCU. The use of a power MOS with low on-resistance, a lead-out terminal of a Kovar copper core, a Hall current sensor with low on-resistance, and a wiring DBC board with high current carrying capacity effectively reduces the power loss of the overall power circuit. The drive of the MOS tube mostly adopts DC / DC magnetic isolation technology. Considering the limited product volume and the small driving power required for a single MOS, an optocoupler with optical isolation technology is used for drive control, such as Figure 2 As shown. The front end of the photocoupler is controlled by the single-chip microcomputer, and the back end is connected to the gate source of the MOS tube. The single-chip microcomputer controls the on and off of the photocoupler by receiving instructions or judging whether the circuit needs protection, and then controls the on and off of the MOS tube.

[0030] like Figure 4 As shown, the isolation control unit includes an optocoupler, the front end of which is connected to the MCU, and the back end is respectively connected to the gate and source of the MOS tube in the power switch unit. It is used to realize the on and off of the MOS tube and the isolation of the control circuit and the power circuit. Since there will be a certain capacitance in the load during actual use of the product, there will be a large current spike at the moment of switching on, which will cause certain damage to the MOS tube. Therefore, the slow opening and fast closing technology is adopted. By selecting an optocoupler with an integrated special discharge circuit to match the selected MOS junction capacitance to achieve slow opening, and then bring up the corresponding capacitive load, and fast closing to ensure that the rear-end load circuit is cut off in time and quickly, avoid damage to the load, and improve product reliability.

[0031] When an overload or short circuit occurs, the MOS tube is disconnected and then self-locked to ensure that the MOS tube is disconnected before there is a new control instruction. When the bus receives a reset instruction, the self-locking is released and the MOS can be controlled to be turned on again.

[0032] like Figure 6 As shown, a packaging structure of a high power density solid power controller includes a base 1; the base 1, a power board 2, and a control board 3, wherein the power board 2 and the control board 3 are stacked and installed on the base 1, and a plurality of external pins 8 are installed at both ends of the base 1, one end of the external pin 8 extends into the upper end surface of the base 1 and is respectively connected to the power board 2 and the control board 3, and the other end neatly extends out of the lower end surface of the power board 2; a power switch unit, a collection unit, and an isolation control unit are installed on the power board 2, and a power conversion unit, an MCU, a CAN transceiver, a state collection unit, and a power protection unit are installed on the control board 3, the power conversion unit is electrically connected to the CAN transceiver and the MCU through the printed circuit on the control board 3, the power conversion unit is electrically connected to the isolation control unit and the collection unit through the inner lead, the MCU is electrically connected to the CAN transceiver and the state collection unit through the printed circuit on the control board 3, and the MCU is electrically connected to the collection unit and the isolation control unit through the inner lead.

[0033] like Figure 6 As shown, the power board 2 is mounted on the upper end surface of the base 1, the power unit includes a bare core MOS tube, the acquisition unit includes a micro current sensor, the isolation control unit includes a photocoupler, the MOS tube is mounted at one end of the power board 2, and the micro current sensor and the photocoupler are mounted at the other end of the power board 2. The power board uses a low on-resistance power MOS, a lead-out terminal of a copper core, a low on-resistance Hall current sensor, and a high current-carrying wiring DBC board to effectively reduce the power loss of the overall power circuit. The photocoupler has a built-in discharge circuit to simplify the circuit. The internal MOS tube, TVS tube, and diodes and triodes are all bare core, which improves its heat dissipation while reducing its volume, which helps to achieve the miniaturization of the solid power controller.

[0034] The control board 3 is installed directly above the power board 2 , and the power conversion unit and the MCU are installed at two ends of the control board 3 respectively.

[0035] Furthermore, the external pins 8 are connected to the power board 2 and the control board 3 to support the control board 3 above the power board 2, and the external pins 8 include PIN, PGND, POUT, VCC, CAN_L, CAN_H, and GND pins, and the PIN, PGND, POUT pins and VCC, CAN_L, CAN_H, and GND pins are respectively installed at both ends of the base 1.

[0036] Furthermore, the PIN pin is electrically connected to the power switch unit, the POUT pin is electrically connected to the acquisition unit, and the PGND pin is electrically connected to the TVS tube in the power protection unit; the VCC and GND pins are electrically connected to the power conversion unit, and the CAN_L and CAN_H pins are electrically connected to the CAN transceiver.

[0037] Furthermore, an outer cover 4 is mounted on the base 1 to enclose the power board 2 and the control board 3 in the outer cover 4. The cover and the base are used for packaging.

[0038] The solid relay of the present invention can be controlled by CAN bus redundancy and has programmable tripping characteristics. The product has a rated load voltage of 28V, a rated load current of 10A, a maximum short-circuit current of 50A, and a volume of 20.5mm*10.5mm*11.5mm. It can collect the working status and current value of the load device in real time, and has I 2 tOvercurrent protection and short-circuit protection, with undervoltage warning and overvoltage protection. It will self-lock after protection and can report the working status and current value information of the load-end equipment in real time.

[0039] Depend on Figure 4 It can be seen that the product's 5V power supply is converted to 3.3V through the power conversion unit to power each internal circuit unit. The processor unit makes a decision based on the control signal sent by the CAN bus and the acquisition signal transmitted by the acquisition unit, whether to issue a drive signal to control the load circuit to be connected. At the same time, when the current in the back-end load circuit changes, the back-end load is controlled accordingly based on the analog acquisition signal.

Claims

1. A high power density solid power controller, characterized in that: It includes an MCU, which is respectively connected to a CAN transceiver, a power conversion unit, an isolation control unit, and a collection unit; the CAN transceiver is connected, and the CAN transceiver is provided with a CAN_L pin and a CAN_H pin; the isolation control unit is connected to a power switch unit, and the power switch unit is connected to a power input pin, and the power input pin is also connected to a power protection unit, and the power protection unit is connected to a ground pin; the collection unit is connected to a power output pin.

2. The high power density solid state power controller according to claim 1, characterized in that: The power conversion unit includes an LDO power chip, which is connected to the VCC pin and converts the power supply VCC into 3.3V to power the MCU.

3. The high power density solid state power controller according to claim 1, characterized in that: The power switch unit includes a MOS tube, and the collection unit includes a micro current sensor. The micro current sensor collects the current in the MOS tube and converts the electrical signal into a voltage analog signal and transmits it to the MCU.

4. The high power density solid state power controller according to claim 1, characterized in that: The isolation control unit comprises an optical coupler, the front end of which is connected to the MCU, and the rear end of which is respectively connected to the gate and source of the MOS tube in the power switch unit.

5. A packaging structure of a high power density solid power controller as described in any one of claims 1 to 4, characterized in that: The invention comprises a base (1), characterized in that: the base (1), a power board (2), and a control board (3), wherein the power board (2) and the control board (3) are stacked and installed on the base (1), and a plurality of external pins (8) are installed at both ends of the base (1), one end of the external pin (8) extends into the upper end surface of the base (1) and is respectively connected to the power board (2) and the control board (3), and the other end neatly extends out of the lower end surface of the power board (2); a power switch unit, a collection unit, and an isolation control unit are installed on the power board (2), and a power conversion unit, an MCU, a CAN transceiver, a state collection unit, and a power protection unit are installed on the control board (3); the power conversion unit is electrically connected to the CAN transceiver and the MCU through the printed circuit on the control board (3), the power conversion unit is electrically connected to the isolation control unit and the collection unit through the internal lead, the MCU is electrically connected to the CAN transceiver and the state collection unit through the printed circuit on the control board (3), and the MCU is electrically connected to the collection unit and the isolation control unit through the internal lead.

6. The packaging structure of a high power density solid power controller as claimed in claim 5, characterized in that: The power board (2) is mounted on the upper end surface of the base (1); the power unit comprises a bare core MOS tube; the acquisition unit comprises a micro current sensor; the isolation control unit comprises a photoelectric coupler; the MOS tube is mounted on one end of the power board (2); and the micro current sensor and the photoelectric coupler are mounted on the other end of the power board (2).

7. The packaging structure of a high power density solid power controller according to claim 5, characterized in that: The control board (3) is installed directly above the power board (2), and the power conversion unit and the MCU are installed at two ends of the control board (3) respectively.

8. The packaging structure of a high power density solid power controller according to claim 5, characterized in that: The external pins (8) are connected to the power board (2) and the control board (3) to support the control board (3) above the power board (2); the external pins (8) include PIN, PGND, POUT, VCC, CAN_L, CAN_H, and GND pins; the PIN, PGND, POUT pins and the VCC, CAN_L, CAN_H, and GND pins are respectively mounted at two ends of the base (1).

9. The packaging structure of a high power density solid power controller according to claim 8, characterized in that: The PIN pin is electrically connected to the power switch unit, the POUT pin is electrically connected to the acquisition unit, and the PGND pin is electrically connected to the TVS tube in the power protection unit; the VCC and GND pins are electrically connected to the power conversion unit, and the CAN_L and CAN_H pins are electrically connected to the CAN transceiver.

10. The packaging structure of a high power density solid state power controller according to claim 5, characterized in that: An outer cover (4) is also installed on the base (1) to enclose the power board (2) and the control board (3) in the outer cover (4).

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