Solar cell panel production equipment

Abstract

The invention belongs to the field of solar equipment, and particularly relates to solar cell panel production equipment which comprises a base. The top surface of the base is fixedly connected with a shell; a plurality of evenly-arranged bearing boxes are fixedly connected to the top face of the base and the interior of the shell. The top surface in the shell is slidably connected with a moving seat; the bottom of the moving seat is fixedly connected with an electric push rod; the telescopic end of the electric push rod is fixedly connected with a connecting seat; the two sides of the connecting base are both slidably connected with sliding rods. The ends, away from each other, of the two sliding rods are fixedly connected with straight plates. Connecting columns are installed on the surfaces of the sides, close to each other, of the two straight plates and close to the bottoms of the straight plates, the clamping assemblies are driven to rotate through the connecting columns, then the silicon wafers in the clamping assemblies are driven to rotate, and liquid adhering to the surfaces of the silicon wafers is thrown away from the surfaces of the silicon wafers through the centrifugal effect. Therefore, the silicon wafer is prevented from bringing the surface solution into the reaction solution in the next receiving box, the reaction solution is prevented from being diluted, and subsequent repeated use is prevented from being influenced.

Description

Technical Field

[0001] The invention belongs to the field of solar energy equipment, in particular to a solar energy panel production equipment. Background Art

[0002] The working principle of solar panels is based on the photovoltaic effect of semiconductor PN junction. When sunlight shines on the solar panels, the electrons in the semiconductor material are excited to generate current, which is then transmitted to the outside world. During the working process, it will not cause pollution to the external environment, so it is widely used.

[0003] In the prior art, before silicon wafers are made into solar panels, the surface of the silicon wafers needs to be textured, that is, the silicon wafers are placed in different solutions and immersed in turn so that a textured structure is formed on the surface of the silicon wafers to reduce the reflectivity of the cell and increase the light absorption and the photoelectric conversion efficiency of the cell.

[0004] In the prior art, after silicon wafers are taken out from different solutions, the surface of the silicon wafers will inevitably be sticky with liquid. If the silicon wafers sticky with liquid are directly placed in another solution for reaction, the solution will be diluted, thereby reducing the number of times the solution is used, thereby increasing production costs.

[0005] To this end, the present invention provides a solar panel production device. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problem is: a solar panel production device described in the present invention comprises a base; the top surface of the base is fixedly connected to a shell; the two sides of the shell are respectively provided with a feed port and a discharge port, and the shell is internally provided with a conveyor belt at the feed port and the discharge port; the top surface of the base is fixedly connected to the inside of the shell with a plurality of evenly arranged receiving boxes; the top surface inside the shell is slidably connected to a moving seat, and the moving seat is driven by a servo motor; the bottom of the moving seat is fixedly connected to an electric push rod; the telescopic end of the electric push rod is fixedly connected to a connecting seat; both sides of the connecting seat are slidably connected to sliding rods, The sliding rod is driven by a motor; the ends of the two sliding rods that are far away from each other are fixedly connected with a straight plate; the surfaces of the two straight plates that are close to each other and close to the bottom are equipped with connecting columns; the connecting columns are driven by a driving component and can rotate on the surface of the straight plate; the ends of the two connecting columns that are close to each other are provided with slots; a clamping component is arranged between the two connecting columns; the clamping component is used to clamp the silicon wafer to be processed, and the two ends are respectively plugged into the slots on the end faces of the connecting columns; when working, in the process of processing the solar cell panel, in order to reduce the reflectivity of the silicon wafer surface, it is necessary to etch a high and low velvet surface on the surface of the silicon wafer. To this end, the embodiment of the present invention can be used. First, the user loads different reaction solutions into each receiving box as needed, and then installs the silicon wafer in the clamping assembly, and then feeds the clamping assembly into the shell from the feed port. Then the moving seat drives the electric push rod to move to the top surface of the clamping assembly, and then the motor drives the sliding rods at both ends of the connecting seat to move toward each other, and then drives the two straight plates to move toward each other, and the two straight plates moving toward each other will drive the connecting columns on their surfaces to move toward each other, so that the two ends of the clamping assembly are plugged into the slots on the end faces of the connecting columns, and then the moving seat moves toward the receiving box, and the clamping assembly is also moved to the receiving box. The top surface of the receiving box is then driven by the electric push rod, and then the clamping assembly is extended into the interior of the receiving box, so that the silicon wafer inside the clamping assembly is completely immersed in the reaction solution inside the receiving box. When the silicon wafer has been soaked for a specified time, the electric push rod will drive the clamping assembly to move above the liquid surface of the solution inside the receiving box, and then the driving assembly drives the clamping assembly to rotate through the connecting column, thereby driving the silicon wafer inside the clamping assembly to rotate, and through centrifugal action, the sticky liquid on the surface of the silicon wafer is thrown away from the surface of the silicon wafer, thereby preventing the silicon wafer from bringing the surface solution to the reaction solution in the next receiving box, thereby causing the dilution of the reaction solution and affecting the subsequent reuse.

[0008] Preferably, the driving assembly includes a rotating rod, and the rotating rod is driven by a servo motor; the two straight plate surfaces are provided with connecting holes at corresponding positions of the rotating rod; both ends of the rotating rod are arranged in the connecting holes; both ends of the rotating rod are fixedly connected with a main gear; the straight plate surface is rotatably connected with a transmission rod at the bottom of the rotating rod; the transmission rod is fixedly connected with a sub-gear at one end close to the main gear, and the sub-gear is meshed with the main gear; the transmission rod and the connecting column are transmitted through a gear set; during operation, when it is necessary to drive the clamping assembly to rotate, the servo motor will drive the rotating rod to rotate, and then the rotating rod will synchronously drive the The main gear rotates synchronously, and the synchronously rotating main gear drives the sub-gear to rotate synchronously, and then the synchronously rotating sub-gear drives the transmission rod to rotate synchronously, and finally the synchronously rotating transmission rod drives the connecting column to rotate synchronously through the gear set, thereby realizing the synchronous rotation of both ends of the clamping assembly, thereby avoiding the different rotation speeds at both ends of the clamping assembly, which may cause damage to the silicon wafer inside the clamping assembly. At the same time, when the two straight plates approach or move away from each other, since the main gear is thicker than the sub-gear, the sub-gear can always slide on the surface of the main gear, thereby ensuring that the main gear and the sub-gear are always in a meshing state, thereby ensuring that the rotating rod can normally drive the connecting column to rotate.

[0009] Preferably, the clamping assembly comprises two pairs of support plates; a pair of symmetrically arranged support rods are fixedly connected between the paired support plates; a card slot is provided on the side of the paired support rods at the top and bottom that are close to each other; an insert plate is fixedly connected on the side of the support plates at the same side that are close to each other; the notch of the slot is rectangular; the two insert plates at the same side are spliced ​​together to fit into the slot of the connecting column; during operation, when the user needs to load the silicon wafer into the clamping assembly, the user needs to first remove the pair of support plates, the insert plate and the support rods at the top, and then insert the silicon wafer into the card slot on the surface of the two support rods at the bottom, Later, the support plate, plug rod and support rod that have just been removed are buckled back to the support plate, plug rod and support rod top surface at the bottom, and the top of the silicon wafer is also inserted into the slot on the surface of the top support rod, so as to fix the silicon wafer. When the straight plate drives the connecting column to clamp the silicon wafer, it only needs to drive the connecting column to move toward the plug plate, and insert the plug plate buckled together on the same side into the slot on the end face of the connecting column. The slot restricts the plug plate, so that the top and bottom support plates, plug rod and support rod can remain in a buckled state, so as to avoid the silicon wafer from detaching from the support rods during transportation, thereby facilitating the loading and transportation of the silicon wafer.

[0010] Preferably, mounting grooves are provided on the surfaces of the two plug-in plates on the same side that are close to each other; magnet blocks are fixedly connected in the two mounting grooves; the two magnet blocks attract each other on the sides that are close to each other; during operation, when the user buckles the top plug-in plate to the surface of the bottom plug-in plate, the magnet blocks in the mounting grooves on the surfaces of the two plug-in plates will fit together, and since the two magnet blocks attract each other, the top plug-in plate and the support plate can be kept in a buckled state with the bottom plug-in plate and the support plate, and it is ensured that the two will not be misaligned, thereby preventing the silicon wafer from being damaged.

[0011] Preferably, a guide groove is provided on the surface of one side of the support rod away from the card slot; the guide groove is connected to the card slot; the guide groove runs through the entire support rod; during operation, when the connecting column drives the tooth plate, the support plate and the support rod to rotate, part of the solution sticking to the surface of the silicon wafer will flow into the card slot, and because the guide groove is connected to the card slot, the solution will eventually enter the guide groove and be discharged to the outside by the guide groove, thereby avoiding the accumulation of solution in the card slot.

[0012] Preferably, hydraulic rods are fixedly connected at both sides of the receiving box near the bottom; baffles are fixedly connected to the telescopic ends of the hydraulic rods; the baffles are slidably connected to the surface of the receiving box; the top surfaces of the baffles are rotatably connected to cover plates; the cover plates and the baffles are vertically arranged, and torsion springs are installed at the rotatable connections between the cover plates and the baffles; when working, before the electric push rod needs to deliver the silicon wafer into the receiving box, the hydraulic rod will drive the baffle to rise, and then the baffle will drive the cover to rise, and the support plate and the limit rod will first squeeze the cover plate in the process of extending the silicon wafer into the receiving box, causing the cover plate to deflect, so that the support plate and the limit rod can smoothly pass through the cover plate and deliver the silicon wafer Inserted into the solution inside the receiving box, and when the solution on the surface of the silicon wafer needs to be shaken off, the electric push rod will drive the support plate and the limit rod to rise above the liquid surface of the solution inside the receiving box. At this time, the support plate and the limit rod are still located under the two cover plates and between the two baffles. At this time, the connecting column drives the support plate and the support rod to rotate, and the rotating silicon wafer will shake out the sticky solution on its surface to all sides. At this time, the baffle and the cover plate can be used as a shield to prevent the solution from splashing everywhere. When the silicon wafer is dried, the electric push rod will drive the support plate and the support rod to rise and squeeze the cover plate, causing the cover plate to deflect, so that the support plate and the support rod are separated from the bottom of the cover plate and the space between the two baffles.

[0013] Preferably, a pair of symmetrically arranged scrapers are installed on the top surface of the receiving box, and the two scrapers are respectively located at the two baffles; the end of the scraper close to the baffle is higher than the end away from the baffle; the higher end of the scraper is in contact with the surface of the baffle; during operation, when the silicon wafer is dried and moved to the top surface of the cover plate, the hydraulic rod will drive the baffle to descend, and at this time the scraper on the top of the receiving box will scrape the surface of the baffle, so that the solution on the surface of the baffle is scraped off and flows back into the receiving box along the surface of the scraper, thereby reducing the waste of reaction solution.

[0014] Preferably, a slide groove is provided at a position corresponding to the top surface of the receiving box and the scraper; a spring is fixedly connected between the scraper and the bottom of the slide groove; a drainage plate is fixedly connected to the end of the scraper away from the baffle; the drainage plate is in contact with the inner surface of the receiving box; during operation, when the baffle drives the cover plate to descend and makes the cover plate fully engage with the top surface of the receiving box, the cover plate will squeeze the scraper, so that the scraper is pressed into the slide groove and compresses the spring, thereby preventing the scraper from being squeezed and deformed by the cover plate when the cover plate is fully engaged with the top surface of the receiving box. At the same time, the drainage plate on one side of the scraper can also cover the slide groove to prevent the reaction solution from flowing into the slide groove.

[0015] Preferably, the surface of the receiving box is fixedly connected with a support frame on both sides of the baffle; the top surface of the support frame is slidably connected with a sealing plate; the support frame is rotatably connected with a secondary gear on one side close to the baffle; the top surface of the sealing plate is fixedly connected with a secondary gear at the corresponding position of the secondary gear, and the secondary gear plate is meshed with the secondary gear; the corresponding position of the secondary gear on the surface of the baffle is fixedly connected with a main gear plate; during operation, when the baffle rises, the main gear plate on the baffle surface will mesh with the secondary gear on one side of the support frame and drive the secondary gear to rotate, and the rotating secondary gear will drive the secondary gear plate and the sealing plate to move, so that the sealing plate moves out of the box opening of the receiving box, at this time the straight plate and the transmission rod can be normally extended into the receiving box, and when the baffle descends, the main gear plate will drive the secondary gear plate to move through the secondary gear, so that the sealing plate moves back to the top surface of the box opening of the receiving box, and then cooperates with the cover plate to block the top surface of the receiving box, thereby reducing the volatilization of the reaction solution inside the receiving box.

[0016] Preferably, a side of the top surface of the base near the discharge port is fixedly connected to an air drying box; an air outlet is provided on one side inside the air drying box, and the air outlet is connected to an external fan; a plurality of evenly arranged heating wires are fixedly connected to the inner wall of the air outlet, and the air outlet is connected to an external fan; an air inlet is provided on the side of the air drying box opposite to the air outlet, and the air inlet is connected to an external exhaust device; during operation, after the silicon wafer completes the texturing process, the movable seat and the electric push rod will also move the silicon wafer into the air drying box, and the external fan will exhaust the gas to the air outlet, and the exhausted gas will be heated by the heating wire and then discharged to the surface of the silicon wafer, so that the solution on the surface of the silicon wafer is completely evaporated, so as to facilitate further processing of the silicon wafer, and at the same time, the air inlet will also draw away the humid and hot gas to ensure that the inside of the shell is dry, and then the movable seat and the electric push rod can send the processed silicon wafer as well as the support plate, support rod and plug plate to the conveyor belt at the discharge port, and then the conveyor belt will send the processed silicon wafer out of the discharge port.

[0017] The beneficial effects of the present invention are as follows: 1. The solar panel production equipment described in the present invention drives the clamping assembly to rotate through the connecting column, thereby driving the silicon wafer inside the clamping assembly to rotate, and through the centrifugal effect, the sticky liquid on the surface of the silicon wafer is thrown away from the surface of the silicon wafer, thereby preventing the silicon wafer from carrying the surface solution to the reaction solution in the next receiving box, thereby causing the dilution of the reaction solution and affecting the subsequent reuse.

[0018] 2. The solar panel production equipment described in the present invention restricts the plug-in board through the slot, so that the top and bottom support plates, the plug-in rods and the support rods can remain in a buckled state, so as to prevent the silicon wafers from detaching from between the support rods during transportation, thereby facilitating the loading and transportation of the silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] Figure 1 is a stereogram of the present invention; Figure 2 is a partial cross-sectional view of the housing in the present invention; Figure 3 It is a structural schematic diagram of the connecting seat in the present invention; Figure 4 It is a schematic structural diagram of the connecting column in the present invention; Figure 5 is a partial cross-sectional view of the insert plate of the present invention; Figure 6 It is a structural schematic diagram of the receiving box in the present invention; Figure 7 It is a schematic diagram of the structure of the scraper in the present invention; Figure 8 It is a structural schematic diagram of the air drying box in the present invention; In the figure: 1. base; 2. shell; 3. feed port; 4. discharge port; 5. receiving box; 6. moving seat; 7. electric push rod; 8. connecting seat; 9. sliding rod; 10. straight plate; 11. connecting column; 12. slot; 13. rotating rod; 14. connecting hole; 15. main gear; 16. transmission rod; 17. secondary gear; 18. support plate; 19. support rod; 20. card slot; 21. plug plate; 22. installation slot; 23. magnet block; 24. guide groove; 25. hydraulic rod; 26. baffle; 27. cover plate; 28. scraper; 29. ​​slide; 30. spring; 31. guide plate; 32. support frame; 33. sealing plate; 34. secondary gear; 35. secondary gear plate; 36. main gear plate; 37. air drying box; 38. air outlet; 39. heating wire; 40. air inlet. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0022] like Figures 1 to 3 As shown, a solar panel production device according to an embodiment of the present invention comprises a base 1; a shell 2 is fixedly connected to the top surface of the base 1; a feed port 3 and a discharge port 4 are respectively provided on both sides of the shell 2, and conveyor belts are installed at the feed port 3 and the discharge port 4 inside the shell 2; a plurality of evenly arranged receiving boxes 5 are fixedly connected to the top surface of the base 1 and the inside of the shell 2; a moving seat 6 is slidably connected to the top surface inside the shell 2, and the moving seat 6 is driven by a servo motor; an electric push rod 7 is fixedly connected to the bottom of the moving seat 6; a connecting seat 8 is fixedly connected to the telescopic end of the electric push rod 7; sliding rods 9 are slidably connected to both sides of the connecting seat 8, and the sliding rods 9 are driven by a motor drive; the ends of the two sliding rods 9 that are away from each other are fixedly connected with a straight plate 10; the surfaces of the two straight plates 10 that are close to each other and close to the bottom are both equipped with connecting columns 11; the connecting columns 11 are driven by the driving component and can rotate on the surface of the straight plate 10; the ends of the two connecting columns 11 that are close to each other are each provided with a slot 12; a clamping component is arranged between the two connecting columns 11; the clamping component is used to clamp the silicon wafer to be processed, and the two ends are respectively plugged into the slots 12 on the end faces of the connecting columns 11; when working, in the process of processing the solar cell panel, in order to reduce the reflectivity of the silicon wafer surface, it is necessary to etch a high and low velvet pattern on the surface of the silicon wafer The embodiment of the present invention can be used for this purpose. First, the user loads different reaction solutions into each receiving box 5 as needed, and then installs the silicon wafer in the clamping assembly, and then feeds the clamping assembly into the housing 2 from the feed port 3. Then the moving seat 6 drives the electric push rod 7 to move to the top surface of the clamping assembly, and then the motor drives the slide bars 9 at both ends of the connecting seat 8 to move toward each other, and then drives the two straight plates 10 to move toward each other, and the two straight plates 10 moving toward each other will drive the connecting columns 11 on their surfaces to move toward each other, so that the two ends of the clamping assembly are plugged into the slots 12 on the end faces of the connecting columns 11, and then the moving seat 6 moves toward the receiving box 5, and the clamping assembly is also moved. The electric push rod 7 drives the clamping assembly to move to the top surface of the receiving box 5, and then the electric push rod 7 drives the clamping assembly to extend into the interior of the receiving box 5, so that the silicon wafer inside the clamping assembly is completely immersed in the reaction solution inside the receiving box 5. When the silicon wafer has been soaked for a specified time, the electric push rod 7 drives the clamping assembly to move above the liquid surface of the solution inside the receiving box 5, and then the driving assembly drives the clamping assembly to rotate through the connecting column 11, thereby driving the silicon wafer inside the clamping assembly to rotate, and through centrifugal action, the sticky liquid on the surface of the silicon wafer is thrown away from the surface of the silicon wafer, thereby preventing the silicon wafer from bringing the surface solution to the reaction solution in the next receiving box 5, thereby causing dilution of the reaction solution and affecting subsequent reuse.

[0023] like Figure 3 to Figure 4As shown, the driving assembly includes a rotating rod 13, and the rotating rod 13 is driven by a servo motor; connecting holes 14 are opened on the surfaces of the two straight plates 10 at positions corresponding to the rotating rods 13; both ends of the rotating rods 13 are arranged in the connecting holes 14; both ends of the rotating rods 13 are fixedly connected with main gears 15; the surface of the straight plate 10 is rotatably connected with a transmission rod 16 at the bottom of the rotating rod 13; one end of the transmission rod 16 close to the main gear 15 is fixedly connected with a sub-gear 17, and the sub-gear 17 is meshed and connected with the main gear 15; the transmission rod 16 and the connecting column 11 are transmitted through a gear set; during operation, when it is necessary to drive the clamping assembly to rotate, the servo motor will drive the rotating rod 13 to rotate, and then the rotating rod 13 will synchronously drive The main gears 15 at both ends rotate synchronously, and then the synchronously rotating main gear 15 drives the sub-gear 17 to rotate synchronously, and then the synchronously rotating sub-gear 17 drives the transmission rod 16 to rotate synchronously, and finally the synchronously rotating transmission rod 16 drives the connecting column 11 to rotate synchronously through the gear set, thereby realizing the synchronous rotation of the two ends of the clamping assembly, thereby avoiding the different rotation speeds at the two ends of the clamping assembly, which may cause damage to the silicon wafer inside the clamping assembly. At the same time, when the two straight plates 10 approach or move away from each other, since the main gear 15 is thicker than the sub-gear 17, the sub-gear 17 can always slide on the surface of the main gear 15, thereby ensuring that the main gear 15 and the sub-gear 17 are always in a meshing state, thereby ensuring that the rotating rod 13 can normally drive the connecting column 11 to rotate.

[0024] like Figures 4 to 5As shown, the clamping assembly includes two pairs of support plates 18; a pair of symmetrically arranged support rods 19 are fixedly connected between the pairs of support plates 18; a card slot 20 is provided on the side of the pair of support rods 19 located at the top and the bottom, which are close to each other; a plug plate 21 is fixedly connected to the side of the support plates 18 located on the same side, which are close to each other; the notch of the slot 12 is rectangular; the two plug plates 21 on the same side are spliced ​​together to adapt to the slot 12 of the connecting column 11; during operation, when the user needs to load the silicon wafer into the clamping assembly, the user needs to first remove the pair of support plates 18, the plug plate 21 and the support rods 19 located at the top, and then insert the silicon wafer into the card slot 20 on the surface of the two support rods 19 located at the bottom, and then The support plate 18, the insertion rod and the support rod 19 just removed are buckled back to the top surface of the support plate 18, the insertion rod and the support rod 19 at the bottom, and the top of the silicon wafer is also inserted into the slot 20 located on the surface of the top support rod 19, so as to fix the silicon wafer. When the straight plate 10 drives the connecting column 11 to clamp the silicon wafer, it is only necessary for the straight plate 10 to drive the connecting column 11 to move toward the insertion plate 21, and insert the insertion plate 21 buckled together on the same side into the slot 12 on the end face of the connecting column 11. The slot 12 restricts the insertion plate 21, so that the top and bottom support plates 18, the insertion rod and the support rod 19 can remain in a buckled state to prevent the silicon wafer from detaching from between the support rods 19 during transportation, thereby facilitating the loading and transportation of the silicon wafer.

[0025] like Figure 5 As shown, a mounting groove 22 is provided on the surface of the side where the plug boards 21 on the same side are close to each other; a magnet block 23 is fixedly connected in each of the two mounting grooves 22; the sides of the two magnet blocks 23 close to each other attract each other; when working, when the user buckles the top plug board 21 to the surface of the bottom plug board 21, the magnet blocks 23 in the mounting grooves 22 on the surfaces of the two plug boards 21 will fit together. Since the two magnet blocks 23 attract each other, the top plug board 21 and the support plate 18 can be kept in a buckled state with the bottom plug board 21 and the support plate 18, and it is ensured that the two will not be misaligned, thereby preventing the silicon wafer from being damaged.

[0026] like Figure 5 As shown, a guide groove 24 is provided on the surface of one side of the support rod 19 away from the card slot 20; the guide groove 24 is connected to the card slot 20; the guide groove 24 runs through the entire support rod 19; during operation, when the connecting column 11 drives the tooth plate, the support plate 18 and the support rod 19 to rotate, part of the solution sticking to the surface of the silicon wafer will flow into the card slot 20, and because the guide groove 24 is connected to the card slot 20, the solution will eventually enter the guide groove 24 and be discharged to the outside by the guide groove 24, thereby avoiding the solution from accumulating in the card slot 20.

[0027] like Figure 3 and Figure 6As shown, hydraulic rods 25 are fixedly connected to the bottom positions of both sides of the receiving box 5; baffles 26 are fixedly connected to the telescopic ends of the hydraulic rods 25; the baffles 26 are slidably connected to the surface of the receiving box 5; the top surfaces of the baffles 26 are rotatably connected to cover plates 27; the cover plates 27 and the baffles 26 are vertically arranged, and torsion springs are installed at the rotational connections between the cover plates 27 and the baffles 26; during operation, before the electric push rod 7 needs to deliver the silicon wafer into the receiving box 5, the hydraulic rods 25 will drive the baffles 26 to rise, and then the baffles 26 will drive the cover plates 27 to rise, and the support plate 18 and the limit rod will first squeeze the cover plate 27 in the process of carrying the silicon wafer into the receiving box 5, so that the cover plate 27 is deflected, so that the support plate 18 and the limit rod can smoothly pass through the cover plate 27, and The silicon wafer is inserted into the solution inside the receiving box 5. When the solution on the surface of the silicon wafer needs to be shaken off, the electric push rod 7 will drive the support plate 18 and the limit rod to rise above the liquid surface of the solution inside the receiving box 5. At this time, the support plate 18 and the limit rod are still located under the two cover plates 27 and between the two baffles 26. At this time, the connecting column 11 drives the support plate 18 and the support rod to rotate, and the rotating silicon wafer will shake out the sticky solution on its surface to the surroundings. At this time, the baffle 26 and the cover plate 27 can be used as a shield to prevent the solution from splashing everywhere. When the silicon wafer is dried, the electric push rod 7 will drive the support plate 18 and the support rod 19 to rise and squeeze the cover plate 27, causing the cover plate 27 to deflect, so that the support plate 18 and the support rod 19 are separated from the bottom of the cover plate 27 and the space between the two baffles 26.

[0028] like Figure 6 to Figure 7 As shown, a pair of symmetrically arranged scrapers 28 are installed on the top surface of the receiving box 5, and the two scrapers 28 are respectively located at the two baffles 26; the end of the scraper 28 close to the baffle 26 is higher than the end away from the baffle 26; the higher end of the scraper 28 is in contact with the surface of the baffle 26; during operation, when the silicon wafers are dried and moved to the top surface of the cover plate 27, the hydraulic rod 25 will drive the baffle 26 to descend, and at this time, the scraper 28 on the top of the receiving box 5 will scrape the surface of the baffle 26, so that the solution on the surface of the baffle 26 is scraped off and flows back into the receiving box 5 along the surface of the scraper 28, thereby reducing the waste of the reaction solution.

[0029] like Figure 7As shown, a slide groove 29 is provided at a position corresponding to the top surface of the receiving box 5 and the scraper 28; a spring 30 is fixedly connected between the scraper 28 and the bottom of the slide groove 29; a drain plate 31 is fixedly connected to the end of the scraper 28 away from the baffle 26; the drain plate 31 is in contact with the inner surface of the receiving box 5; during operation, when the baffle 26 drives the cover plate 27 to descend and makes the cover plate 27 completely buckled on the top surface of the receiving box 5, the cover plate 27 will squeeze the scraper 28, so that the scraper 28 is pressed into the slide groove 29 and the spring 30 is compressed. At this time, the scraper 28 is prevented from being squeezed and deformed by the cover plate 27 when the cover plate 27 is completely buckled on the top surface of the receiving box 5. At the same time, the drain plate 31 on one side of the scraper 28 can also cover the slide groove 29 to prevent the reaction solution from flowing into the slide groove 29.

[0030] like Figure 3 and Figure 6 As shown, the surface of the receiving box 5 is fixedly connected with a support frame 32 on both sides of the baffle 26; the top surface of the support frame 32 is slidably connected with a sealing plate 33; the side of the support frame 32 close to the baffle 26 is rotatably connected with a secondary gear 34; the top surface of the sealing plate 33 is fixedly connected with a secondary gear 35 at a position corresponding to the secondary gear 34, and the secondary gear 35 is meshed with the secondary gear 34; the surface of the baffle 26 is fixedly connected with a main gear plate 36 at a position corresponding to the secondary gear 34; during operation, when the baffle 26 rises, the main gear plate 36 on the surface of the baffle 26 will mesh with the support frame The main gear 36 is on the secondary gear 34 on one side of 32, and drives the secondary gear 34 to rotate, and the rotating secondary gear 34 will drive the auxiliary tooth plate 35 and the sealing plate 33 to move, so that the sealing plate 33 moves out of the box opening of the receiving box 5. At this time, the straight plate 10 and the transmission rod 16 can be normally extended into the receiving box 5, and when the baffle 26 descends, the main tooth plate 36 will drive the auxiliary tooth plate 35 to move through the secondary gear 34, so that the sealing plate 33 moves back to the top surface of the box opening of the receiving box 5, and then cooperate with the cover plate 27 to block the top surface of the receiving box 5, thereby reducing the volatilization of the reaction solution inside the receiving box 5.

[0031] like Figure 2 and Figure 8As shown, a drying box 37 is fixedly connected to one side of the top surface of the base 1 near the discharge port 4; an air outlet 38 is provided on one side of the interior of the drying box 37, and the air outlet 38 is connected to an external fan; a plurality of uniformly arranged heating wires 39 are fixedly connected to the inner wall of the air outlet 38, and the air outlet 38 is connected to an external fan; an air inlet 40 is provided on the side of the interior of the drying box 37 opposite to the air outlet 38, and the air inlet 40 is connected to an external exhaust device; during operation, when the silicon wafer completes the texturing process, the movable seat 6 and the electric push rod 7 will also The silicon wafer is moved into the air drying box 37, and the external fan exhausts the gas to the air outlet 38. After being heated by the heating wire 39, the exhausted gas is discharged to the surface of the silicon wafer, so that the solution on the surface of the silicon wafer is completely evaporated, so as to facilitate further processing of the silicon wafer. At the same time, the air inlet 40 will also extract the hot and humid gas to ensure the dryness of the inside of the shell. Then the moving seat 6 and the electric push rod 7 can send the processed silicon wafer and the support plate 18, the support rod 19 and the plug plate 21 to the conveyor belt at the discharge port 4, and then the conveyor belt sends it out of the discharge port 4.

[0032] During operation, in the processing of the solar cell panel, in order to reduce the reflectivity of the silicon wafer surface, it is necessary to etch an undulating velvet surface on the surface of the silicon wafer. For this purpose, the embodiment of the present invention can be used. First, the user loads different reaction solutions into each receiving box 5 as needed, and then installs the silicon wafer in the clamping assembly, and then feeds the clamping assembly into the shell 2 from the feed port 3. Then the moving seat 6 will drive the electric push rod 7 to move to the top surface of the clamping assembly, and then the motor drives the sliding rods 9 at both ends of the connecting seat 8 to move toward each other, and then drives the two straight plates 10 to move toward each other, and the two straight plates 10 moving toward each other will drive the connecting columns 11 on their surfaces to move toward each other, so that the two ends of the clamping assembly are plugged into the slots 12 on the end faces of the connecting columns 11. , then the moving seat 6 moves toward the receiving box 5, and moves the clamping assembly to the top surface of the receiving box 5, and then the electric push rod 7 drives the clamping assembly to extend into the interior of the receiving box 5, so that the silicon wafer inside the clamping assembly is completely immersed in the reaction solution inside the receiving box 5. When the silicon wafer is soaked for a specified time, the electric push rod 7 will drive the clamping assembly to move above the liquid surface of the solution inside the receiving box 5, and then the driving assembly drives the clamping assembly to rotate through the connecting column 11, and then drives the silicon wafer inside the clamping assembly to rotate, and through centrifugal action, the sticky liquid on the surface of the silicon wafer is thrown away from the surface of the silicon wafer, thereby preventing the silicon wafer from bringing the surface solution to the reaction solution in the next receiving box 5, thereby causing dilution of the reaction solution and affecting subsequent reuse.

[0033] When it is necessary to drive the clamping assembly to rotate, the servo motor will drive the rotating rod 13 to rotate, and then the rotating rod 13 will synchronously drive the main gears 15 at both ends to rotate synchronously, and then the synchronously rotating main gear 15 will drive the sub-gear 17 to rotate synchronously, and then the synchronously rotating sub-gear 17 will drive the transmission rod 16 to rotate synchronously, and finally the synchronously rotating transmission rod 16 will drive the connecting column 11 to rotate synchronously through the gear set, thereby realizing the synchronous rotation of the two ends of the clamping assembly, thereby avoiding the different rotation speeds of the two ends of the clamping assembly, which may cause damage to the silicon wafer inside the clamping assembly. At the same time, when the two straight plates 10 approach or move away from each other, since the main gear 15 is thicker than the sub-gear 17, the sub-gear 17 can always slide on the surface of the main gear 15, thereby ensuring that the main gear 15 and the sub-gear 17 are always in a meshing state, thereby ensuring that the rotating rod 13 can normally drive the connecting column 11 to rotate.

[0034] When the user needs to load the silicon wafer into the clamping assembly, the user needs to first remove the pair of support plates 18, the inserting plate 21 and the support rod 19 at the top, and then insert the silicon wafer into the card slot 20 on the surface of the two support rods 19 at the bottom, and then buckle the support plate 18, the inserting rod and the support rod 19 just removed back to the top surface of the support plate 18, the inserting rod and the support rod 19 at the bottom, and make the top of the silicon wafer also inserted into the card slot 20 on the surface of the top support rod 19, so as to achieve The silicon wafer is now fixed. When the straight plate 10 drives the connecting column 11 to clamp the silicon wafer, the straight plate 10 only needs to drive the connecting column 11 to move toward the plug plate 21, and insert the plug plates 21 that are buckled together on the same side into the slots 12 on the end faces of the connecting column 11. The slots 12 restrict the plug plates 21, so that the top and bottom support plates 18, the plug rods and the support rods 19 can remain in a buckled state, so as to prevent the silicon wafer from detaching from between the support rods 19 during transportation, thereby facilitating the loading and transportation of the silicon wafer.

[0035] When the user buckles the top plug-in board 21 against the surface of the bottom plug-in board 21, the magnet blocks 23 in the mounting grooves 22 on the surfaces of the two plug-in boards 21 will fit together. Since the two magnet blocks 23 attract each other, the top plug-in board 21 and the support plate 18 and the bottom plug-in board 21 and the support plate 18 can be kept in a buckled state and ensure that the two are not misaligned, thereby preventing the silicon wafer from being damaged.

[0036] When the connecting column 11 drives the tooth plate, the support plate 18 and the support rod 19 to rotate, part of the solution sticking to the surface of the silicon wafer will flow into the card slot 20. Since the guide groove 24 is connected to the card slot 20, the solution will eventually enter the guide groove 24 and be discharged to the outside by the guide groove 24, thereby avoiding the accumulation of the solution in the card slot 20.

[0037] Before the electric push rod 7 needs to deliver the silicon wafer into the receiving box 5, the hydraulic rod 25 will drive the baffle 26 to rise, and then the baffle 26 will drive the cover plate 27 to rise. In the process of carrying the silicon wafer into the receiving box 5, the support plate 18 and the limit rod will first squeeze the cover plate 27, causing the cover plate 27 to deflect, so that the support plate 18 and the limit rod can smoothly pass through the cover plate 27 and insert the silicon wafer into the solution inside the receiving box 5. When the solution on the surface of the silicon wafer needs to be thrown away, the electric push rod 7 will drive the support plate 18 and the limit rod to rise above the liquid level of the solution inside the receiving box 5. At this time, the support plate 18 and the limit rod are still located under the two cover plates 27 and between the two baffles 26. At this time, the connecting column 11 drives the support plate 18 and the support rod to rotate, and the rotating silicon wafer will throw the sticky solution on its surface to the surroundings. At this time, the baffle 26 and the cover plate 27 can be used as a shield to prevent the solution from splashing everywhere. When the silicon wafer is dried, the electric push rod 7 will drive the support plate 18 and the support rod 19 to rise and squeeze the cover plate 27, causing the cover plate 27 to deflect, so that the support plate 18 and the support rod 19 are separated from the bottom of the cover plate 27 and the space between the two baffles 26.

[0038] When the silicon wafers are dried and moved to the top surface of the cover plate 27, the hydraulic rod 25 will drive the baffle 26 to descend. At this time, the scraper 28 on the top of the receiving box 5 will scrape the surface of the baffle 26, so that the solution on the surface of the baffle 26 is scraped off and flows back into the receiving box 5 along the surface of the scraper 28, thereby reducing the waste of the reaction solution.

[0039] When the baffle 26 drives the cover plate 27 to descend and makes the cover plate 27 fully engage with the top surface of the receiving box 5, the cover plate 27 will squeeze the scraper 28, so that the scraper 28 is pressed into the chute 29 and the spring 30 is compressed. At this time, the scraper 28 is prevented from being squeezed and deformed by the cover plate 27 when the cover plate 27 is fully engaged with the top surface of the receiving box 5. At the same time, the drainage plate 31 on one side of the scraper 28 can also cover the chute 29 to prevent the reaction solution from flowing into the chute 29.

[0040] When the baffle 26 rises, the main tooth plate 36 on the surface of the baffle 26 will engage with the secondary gear 34 on one side of the support frame 32, and drive the secondary gear 34 to rotate, and the rotating secondary gear 34 will drive the auxiliary tooth plate 35 and the sealing plate 33 to move, so that the sealing plate 33 moves out of the box opening of the receiving box 5. At this time, the straight plate 10 and the transmission rod 16 can be normally extended into the receiving box 5, and when the baffle 26 descends, the main tooth plate 36 will drive the auxiliary tooth plate 35 to move through the secondary gear 34, so that the sealing plate 33 moves back to the top surface of the box opening of the receiving box 5, and then cooperate with the cover plate 27 to block the top surface of the receiving box 5, thereby reducing the volatilization of the reaction solution inside the receiving box 5.

[0041] When the silicon wafer completes the texturing process, the movable seat 6 and the electric push rod 7 will move the silicon wafer into the air drying box 37, and the external fan will exhaust the gas to the air outlet 38. The exhausted gas will be heated by the heating wire 39 and then discharged to the surface of the silicon wafer, so that the solution on the surface of the silicon wafer can be completely evaporated, so as to facilitate further processing of the silicon wafer. At the same time, the air inlet 40 will also extract the hot and humid gas to ensure the dryness of the inside of the shell. Then the movable seat 6 and the electric push rod 7 can send the processed silicon wafer and the support plate 18, the support rod 19 and the plug plate 21 to the conveyor belt at the discharge port 4, and then the conveyor belt will send it out of the discharge port 4.

[0042] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A solar panel production equipment, characterized in that: The invention comprises a base (1); the top surface of the base (1) is fixedly connected to a shell (2); a feed port (3) and a discharge port (4) are respectively provided on both sides of the shell (2), and a conveyor belt is installed inside the shell (2) at the feed port (3) and the discharge port (4); a plurality of evenly arranged receiving boxes (5) are fixedly connected between the top surface of the base (1) and the inside of the shell (2); a moving seat (6) is slidably connected to the top surface inside the shell (2), and the moving seat (6) is driven by a servo motor; an electric push rod (7) is fixedly connected to the bottom of the moving seat (6); a connecting seat (8) is fixedly connected to the telescopic end of the electric push rod (7); two ends of the connecting seat (8) are fixedly connected to the connecting seat (8); The two sides are slidably connected with a slide bar (9), and the slide bar (9) is driven by a motor; the ends of the two slide bars (9) that are away from each other are fixedly connected with a straight plate (10); the two straight plates (10) are installed with a connecting column (11) on the side surface close to each other and close to the bottom; the connecting column (11) is driven by a driving component and can rotate on the surface of the straight plate (10); the ends of the two connecting columns (11) that are close to each other are provided with a slot (12); a clamping component is arranged between the two connecting columns (11); the clamping component is used to clamp the silicon wafer to be processed, and the two ends are respectively plugged into the slot (12) on the end surface of the connecting column (11).

2. A solar panel production device according to claim 1, characterized in that: The driving assembly comprises a rotating rod (13), and the rotating rod (13) is driven by a servo motor; connecting holes (14) are opened on the surfaces of the two straight plates (10) at positions corresponding to the rotating rods (13); both ends of the rotating rods (13) are arranged in the connecting holes (14); both ends of the rotating rods (13) are fixedly connected to main gears (15); a transmission rod (16) is rotatably connected to the bottom of the rotating rod (13) on the surface of the straight plate (10); a sub-gear (17) is fixedly connected to one end of the transmission rod (16) close to the main gear (15), and the sub-gear (17) is meshedly connected to the main gear (15); and the transmission rod (16) and the connecting column (11) are driven by a gear set.

3. A solar panel production device according to claim 2, characterized in that: The clamping assembly comprises two pairs of support plates (18); a pair of symmetrically arranged support rods (19) are fixedly connected between the pairs of support plates (18); a clamping groove (20) is provided on the sides of the pairs of support rods (19) located at the top and the bottom that are close to each other; an inserting plate (21) is fixedly connected on the sides of the support plates (18) located at the same side that are close to each other; the notch of the slot (12) is arranged in a rectangular shape; and the two inserting plates (21) on the same side are spliced ​​together to fit into the slot (12) of the connecting column (11).

4. A solar panel production device according to claim 3, characterized in that: The surfaces of the plug plates (21) on the same side that are close to each other are each provided with a mounting groove (22); magnet blocks (23) are fixedly connected to the two mounting grooves (22); and the surfaces of the two magnet blocks (23) that are close to each other attract each other.

5. A solar panel production device according to claim 4, characterized in that: A guide groove (24) is provided on a surface of one side of the support rod (19) away from the clamping groove (20); the guide groove (24) is connected to the clamping groove (20); and the guide groove (24) runs through the entire support rod (19).

6. A solar panel production device according to claim 5, characterized in that: Hydraulic rods (25) are fixedly connected to the bottom of both sides of the receiving box (5); the telescopic ends of the hydraulic rods (25) are fixedly connected to baffles (26); the baffles (26) are slidably connected to the surface of the receiving box (5); the top surfaces of the baffles (26) are rotatably connected to cover plates (27); the cover plates (27) and the baffles (26) are arranged vertically, and torsion springs are installed at the rotatable connection points between the cover plates (27) and the baffles (26).

7. A solar panel production device according to claim 6, characterized in that: A pair of symmetrically arranged scrapers (28) are installed on the top surface of the receiving box (5), and the two scrapers (28) are respectively located at the two baffles (26); one end of the scraper (28) close to the baffle (26) is higher than the other end away from the baffle (26); and the higher end of the scraper (28) is in contact with the surface of the baffle (26).

8. The solar panel production equipment according to claim 7, characterized in that: A slide groove (29) is provided at a position corresponding to the scraper (28) on the top surface of the receiving box (5); a spring (30) is fixedly connected between the scraper (28) and the bottom of the slide groove (29); a guide plate (31) is fixedly connected to one end of the scraper (28) away from the baffle (26); and the guide plate (31) is in contact with the inner surface of the receiving box (5).

9. A solar panel production device according to claim 8, characterized in that: The surface of the receiving box (5) is fixedly connected to support frames (32) on both sides of the baffle (26); the top surface of the support frame (32) is slidably connected to a sealing plate (33); the side of the support frame (32) close to the baffle (26) is rotatably connected to a secondary gear (34); the top surface of the sealing plate (33) is fixedly connected to a secondary gear (35) at a position corresponding to the secondary gear (34), and the secondary gear plate (35) is meshingly connected to the secondary gear (34); the surface of the baffle (26) is fixedly connected to a main gear plate (36) at a position corresponding to the secondary gear (34).

10. The solar panel production equipment according to claim 1, characterized in that: An air drying box (37) is fixedly connected to one side of the top surface of the base (1) near the discharge port (4); an air outlet (38) is provided on one side inside the air drying box (37), and the air outlet (38) is connected to an external fan; a plurality of uniformly arranged heating wires (39) are fixedly connected to the inner wall of the air outlet (38), and the air outlet (38) is connected to an external fan; an air inlet (40) is provided on the side of the air drying box (37) opposite to the air outlet (38), and the air inlet (40) is connected to an external exhaust device.

Images