Built-in color resistance type display screen, preparation method thereof and display device
By adopting a built-in color resistive display design in the OLED panel, the structure of embedded black photoresist layer and color photoresist layer is used to replace the traditional polarizer settings, solving the reflectivity and brightness problems of OLED panels, achieving higher display effects and stability.
Patent Information
- Application Number
- CN202311271701.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-27
- Publication Date
- 2025-03-28
AI Technical Summary
When the existing OLED panel adopts the top emission setting structure, the reflectivity increase leads to a decrease in the RGB main wavelength transmittance and the brightness is affected, and the polarizer structure needs to be replaced to improve the display effect.
Using the design of a built-in color resistive display, the black photoresist layer is embedded in the second opening by setting a pixel positioning layer and a black photoresist layer between the polysilicon substrate and the packaging cover plate, and a color photoresist layer and a second spaced opening are provided on the second surface of the packaging cover plate.
It effectively reduces the power consumption, thickness and preparation cost of the display screen, improves the stability of the color resistance structure, improves the brightness viewing angle attenuation and screen color accuracy.
Smart Images
Figure CN119730615A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field related to display panels, and in particular to a built-in color-resistance display screen and a preparation method thereof, and a display device. Background Art
[0002] In the prior art, in order to obtain a larger aperture ratio, most OLED devices adopt a top-emitting structure, which improves the light extraction efficiency and significantly increases the reflectivity of the panel. Therefore, a polarizer structure is needed to reduce the reflection of the panel. However, this setting reduces the RGB main wavelength transmittance of the panel to about 50%, which greatly affects the panel brightness. Therefore, it is extremely important to seek an alternative setting for the polarizer structure under current demand. Summary of the invention
[0003] In view of the problems in the prior art, the purpose of the present invention is to provide a built-in color-resistance display screen and a preparation method and a display device thereof, which can improve the stability of the color-resistance structure while replacing the traditional polarizer setting structure, and at the same time improve the overall display effect of the display screen.
[0004] Specifically, the first aspect of the present disclosure provides a built-in color-resistance display screen, the built-in color-resistance display screen comprising a polysilicon substrate and a packaging cover plate stacked in sequence, wherein:
[0005] A pixel positioning layer is disposed on the first surface of the polysilicon substrate close to the package cover plate, the pixel positioning layer includes a plurality of first openings, the pixel light emitting units are disposed in the first openings, and emit light along the opening direction of the first openings;
[0006] A black photoresist layer and a color photoresist layer are provided on the second surface of the packaging cover plate close to the polysilicon substrate;
[0007] The second surface includes a plurality of second openings arranged at intervals, and the arrangement positions of the second openings are staggered relative to the arrangement positions of the first openings;
[0008] At least a portion of the black photoresist layer is embedded in the second opening.
[0009] In a possible implementation of the first aspect above, an opening area of the first opening is larger than a bottom area of the first opening;
[0010] The opening area of the second opening is larger than the bottom area of the second opening.
[0011] In a possible implementation of the first aspect above, a cross-section of the first opening on a vertical plane is an isosceles trapezoid;
[0012] The cross section of the second opening on the vertical plane is an isosceles trapezoid.
[0013] In a possible implementation of the first aspect, the first opening divides the pixel positioning layer into a plurality of spacing areas;
[0014] Each spacing area corresponds to each second opening one by one; and
[0015] The two adjacent first side walls in the adjacent spacing regions and the two adjacent second side walls in the corresponding second openings together form an emission channel that continuously expands outwards along the light emission direction of the pixel light emitting unit.
[0016] In a possible implementation of the first aspect above, the first side wall and the most adjacent second side wall are in the same plane.
[0017] In a possible implementation of the first aspect, the black photoresist layer includes a plurality of black photoresist covered areas that are distributed at intervals, and each black photoresist covered area corresponds to each second opening one by one;
[0018] The thickness of the black photoresist covering area is greater than or equal to the depth of the second opening.
[0019] In a possible implementation of the first aspect, each black photoresist covered area corresponds to each spacing area one by one.
[0020] The shape of the black photoresist covering area facing the polysilicon substrate is the same as the shape of the corresponding spacing area facing the packaging cover.
[0021] In a possible implementation of the first aspect above, a side of the black photoresist covering area facing the polysilicon substrate is in the same plane as a side of the color photoresist layer facing the polysilicon substrate.
[0022] In a possible implementation of the first aspect above, a protective film layer is provided on a third surface of the package cover away from the polycrystalline silicon substrate.
[0023] A second aspect of the present disclosure provides a method for preparing a built-in color-resistance display screen, which is applied to a built-in color-resistance display screen;
[0024] This preparation method comprises the following steps:
[0025] Providing a polysilicon substrate with a preset pixel light-emitting unit and a packaging cover;
[0026] Apply film protection to the package cover;
[0027] Prepare an opening etching protection layer in the non-black photoresist layer covered area of the packaging cover plate close to the second surface of the polysilicon substrate;
[0028] Performing opening molding on the area covered by the black photoresist layer on the second surface to form a plurality of second openings arranged at intervals;
[0029] Forming a color resist layer on the second surface, and removing the color resist layer formed at the second opening;
[0030] Forming a black color resist layer at the second opening;
[0031] The polysilicon substrate and the package cover are laminated to form a built-in color-resistance display screen.
[0032] A third aspect of the present disclosure provides a display device, which includes any one of the built-in color-resistance display screens provided in the first aspect.
[0033] Compared with the prior art, the present invention has the following beneficial effects:
[0034] Through the technical solution provided by the present disclosure, a color-resistance setting structure with polarizer removed is provided, which can effectively reduce the power consumption, thickness and manufacturing cost of display products, wherein the black color-resistance layer is embedded in the packaging cover plate structure, so that the overall stability of the color-resistance setting structure is significantly improved. At the same time, in the technical solution provided by the present disclosure, the pixel positioning layer and the black color-resistance layer are uniformly set, providing a continuously expanded emission channel for the pixel light-emitting unit, which can effectively improve the brightness viewing angle attenuation and screen color accuracy of the display screen, and has a popularizable value. BRIEF DESCRIPTION OF THE DRAWINGS
[0035] Other features, objects and advantages of the present disclosure will become more apparent from a reading of the detailed description of non-limiting embodiments made with reference to the following accompanying drawings.
[0036] Figure 1 According to an embodiment of the present disclosure, a cross-sectional structural diagram of a built-in color-resistance display screen is provided.
[0037] Figure 2 According to an embodiment of the present disclosure, a schematic diagram of a preparation process of a built-in color-resistance display screen is provided. DETAILED DESCRIPTION
[0038] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in the present disclosure. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in the present disclosure can also be modified or changed in various ways according to different viewpoints and application systems without departing from the spirit of the present disclosure. It should be noted that the embodiments in the present disclosure and the features in the embodiments can be combined with each other without conflict.
[0039] The following is a detailed description of the embodiments of the present disclosure with reference to the accompanying drawings so that those skilled in the art can easily implement the present disclosure. The present disclosure can be embodied in many different forms and is not limited to the embodiments described herein.
[0040] In the representations of the present disclosure, the reference terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" and the like mean that the specific features, structures, materials, or characteristics represented in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. Moreover, the specific features, structures, materials, or characteristics represented may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples represented in the present disclosure and the features of different embodiments or examples, unless they are mutually contradictory.
[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the representation of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0042] In order to clearly describe the present disclosure, components not related to the description are omitted, and the same reference numerals are given to the same or similar components throughout the specification.
[0043] Throughout the specification, when a device is said to be "connected" to another device, this includes not only the case of "direct connection" but also the case of "indirect connection" by placing other elements therebetween. In addition, when a device is said to "include" a certain component, unless otherwise stated, it does not exclude other components, but means that other components may be included.
[0044] When a device is said to be "on" another device, it may be directly on the other device, but there may also be other devices between it. In contrast, when a device is said to be "directly" on another device, there are no other devices between it.
[0045] Although the terms first, second, etc. are used to represent various elements in some examples, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, the first interface and the second interface, etc. are represented. Moreover, as used in this article, the singular forms "one", "one" and "the" are intended to also include plural forms, unless there is an opposite indication in the context. It should be further understood that the terms "comprising" and "including" indicate the existence of features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way, will there be an exception to this definition.
[0046] The technical terms used herein are only used to refer to specific embodiments and are not intended to limit the present disclosure. The singular form used herein also includes the plural form unless the sentence clearly indicates the contrary meaning. The meaning of "including" used in the specification is to specify specific characteristics, regions, integers, steps, operations, elements and / or components, and does not exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements and / or components.
[0047] Although not defined differently, all terms, including technical and scientific terms used herein, have the same meaning as those generally understood by those skilled in the art to which the present disclosure belongs. Terms defined in commonly used dictionaries are additionally interpreted as having meanings consistent with the content of relevant technical literature and current disclosures, and unless defined, shall not be overly interpreted as ideal or very formal meanings.
[0048] It is understandable that in an optimization scheme of the prior art, a COE (Color filter On Encapsulation) structure is provided to replace the polarizer structure. Specifically, the COE structure includes coating a layer of color filter (CF, Color Filter) on the top of the encapsulated display panel, so that each pixel unit has a color film corresponding to the color of the pixel above, and the gap between the pixel units is blocked by a black matrix layer (BM, Black Matrix). It is understandable that this COE structure can solve the reflection and light transmittance problems of the display screen: for the incident light from the outside, the unnecessary part will be directly absorbed by the black matrix layer, and the part that is incident through the color film will either be reflected as the corresponding pixel color or blocked by the black matrix layer or other color films. At the same time, the color film has a high transmittance of the main wavelength of RGB (about 70% to 90%, much higher than the main wavelength transmittance of the polarizer structure).
[0049] In order to further optimize the above-mentioned polarizer removal structure, the present disclosure provides a built-in color-resistance display screen and a display device, which further improves the overall stability of the display screen through the built-in color-resistance setting and the black light-resistance layer with a regular trapezoidal structure, and has better brightness and viewing angle performance. The technical solutions involved in the present disclosure will be specifically explained and described below:
[0050] In some embodiments of the present disclosure, Figure 1 A schematic diagram of the cross-sectional structure of a built-in color-resistance display screen is provided, specifically, Figure 1 As shown, the built-in color-resistance display screen includes a polysilicon substrate 100 and a packaging cover plate 200 stacked in sequence, wherein:
[0051] The first surface of the polysilicon substrate 100 close to the package cover 200 (ie Figure 1 The upper surface of the polysilicon substrate 100 shown in FIG. 1 is provided with a pixel positioning layer 300, and the pixel positioning layer 300 includes a plurality of first openings for arranging corresponding pixel light emitting units 400 ( Figure 1 400R, 400G and 400B respectively refer to the red pixel light-emitting unit, the green pixel light-emitting unit and the blue pixel light-emitting unit, wherein the area occupied by the blue pixel light-emitting unit 400B is larger than the area occupied by the red pixel light-emitting unit 400R and the green pixel light-emitting unit 400G, which is not limited here). Figure 1 As shown, the pixel light emitting unit 400 is disposed in the first opening and emits light along the opening direction of the first opening. The pixel positioning layer 300 can be used to determine the position of the pixel light emitting unit 400. The specific configuration structure of the pixel positioning layer 300 will be described and explained in detail later.
[0052] The second surface (ie, the second surface of the package cover plate 200 close to the polysilicon substrate 100) Figure 1 The lower surface of the package cover plate 200 shown in FIG. 1 is provided with a black photoresist layer 500 and a color photoresist layer 600 ( Figure 1 In the figure, 600R, 600G and 600B respectively refer to the red light-resistance color film, the green light-resistance color film and the blue light-resistance color film, that is, the color light-resistance color film corresponds to the pixel light-emitting unit one by one). In order to realize the function of the depolarizer, the setting position of the color light-resistance layer 600 corresponds to the setting position of the first opening; the setting position of the black light-resistance layer 500 corresponds to the non-first opening area of the pixel positioning layer 300. In order to realize the internalization of the color-resistance structure, a plurality of second openings ( Figure 1 The black photoresist layer 500 is overlapped with the arrangement position of the black photoresist layer 500, and at least a portion of the black photoresist layer 500 is embedded in the second opening. Figure 1 As shown, since the arrangement position of the black photoresist layer 500 needs to correspond to the non-first opening area of the pixel positioning layer 300, the arrangement position of the second opening is staggered relative to the arrangement position of the first opening.
[0053] like Figure 1 As shown, the black photoresist layer 500 is embedded in the package cover plate 200 through the second opening. Compared with the COE (Color filter On Encapsulation) structure used in the prior art, the contact area between the black photoresist layer 500 and the package cover plate 200 is larger and less likely to fall off, thereby improving the overall stability of the color resistance structure. The following will further explain how the above embodiment improves the display effect:
[0054] In the above embodiment, it can be understood that in order to provide the pixel light emitting unit 400 disposed at the bottom of the first opening with an outwardly expanded light exit channel in exchange for a better light exit angle, the opening area of the first opening is required to be larger than the bottom area of the first opening; accordingly, since the second opening filled with the black photoresist layer 500 will block the light exit channel of the pixel light emitting unit 400, in order to provide an outwardly expanded light exit channel, the opening area of the second opening is also required to be larger than the bottom area of the second opening. In a preferred specific implementation, the cross-sections of the first opening and the second opening on the vertical plane can both be isosceles trapezoids, and the specific limitations on the shapes of the first opening and the second opening will be described in detail later.
[0055] In the above embodiment, if Figure 1As shown, it can be seen that the first opening divides the pixel positioning layer 300 into a plurality of spacing areas 301. Correspondingly, each spacing area 301 corresponds to each second opening one by one. It can be understood that the two adjacent first side walls in any two adjacent spacing areas 301, and the two adjacent second side walls in the corresponding second opening, can jointly form a light output channel of the pixel light-emitting unit 400. In order to enable the pixel light-emitting unit 400 to obtain a better light output angle, the light output channel formed by the first side wall and the second side wall can be further limited to a state of continuous expansion along the light output direction. Figure 1 As shown, since the package cover plate 200 and the polysilicon substrate 100 are bonded together only during the bonding process, the first opening and the second opening are set relatively independently. In order to ensure that the light-emitting channel formed after bonding is in a state of continuous expansion along the light-emitting direction, the first side wall and the second side wall closest thereto can be further limited to be located on the same plane. If the cross-sections of the first opening and the second opening on the vertical plane are both isosceles trapezoids, the bottom angles corresponding to the two isosceles trapezoids can be limited to be the same.
[0056] In the above embodiment, if Figure 1 As shown, it can be seen that the black photoresist layer 500 includes a plurality of black photoresist covering areas 501 distributed at intervals, each black photoresist covering area 501 corresponds to each second opening one by one, and completely fills the corresponding second opening. When the vertical section of the second opening is an isosceles trapezoid, the vertical section of the black photoresist covering area 501 can also be an isosceles trapezoid; the thickness of the black photoresist covering area 501 is greater than or equal to the depth of the second opening. It can be understood that the design of the second opening with an isosceles trapezoidal vertical section can increase the emission angle of the pixel light-emitting unit on the one hand, and on the other hand, can increase the contact area between the black photoresist covering area 501 and the package cover plate 200, thereby improving the setting stability of the color resistance structure. Correspondingly, each black photoresist covering area 501 corresponds to each spacing area 301 one by one. In order to realize that the light emitting channel corresponding to the pixel light emitting unit 400 is continuously expanded along the light emitting direction, the shape of the black photoresist covering area 501 facing the polysilicon substrate 100 can be further limited to be the same as the shape of the corresponding spacing area 301 facing the packaging cover plate 200, so that the shape of the black photoresist covering area 501 and the spacing area 301 at the bonding position after the board is combined is consistent, ensuring that the first side wall and the second side wall after the board is combined can continuously expand relative to the light emitting direction of the pixel light emitting unit 400. It can be understood that through the above design, the emission angle of the pixel light emitting unit 400 is increased without being blocked, thereby reducing the deviation of color presentation accuracy and brightness attenuation, and improving the overall display effect.
[0057] In the above embodiment, if Figure 1As shown, it can be seen that the side of the black photoresist covering area 501 facing the polysilicon substrate 100 is in the same plane as the side of the color photoresist layer 600 facing the polysilicon substrate 100. After the board is assembled, there is a distance gap between the color photoresist layer 600 and the corresponding pixel light-emitting unit 400, which can provide a certain packaging height for the pixel light-emitting unit 400.
[0058] In the above embodiment, further, Figure 1 As shown, the package cover 200 is away from the third surface (ie, Figure 1 A protective film layer 700 is provided on the upper surface of the package cover plate 200 shown in FIG. 1 , so as to effectively protect the package cover plate 200 .
[0059] In a specific preparation of the above embodiment, the specific parameters of the pixel light emitting unit 400, the black photoresist layer 500 and the color photoresist layer 600 can be set according to the following ranges, wherein:
[0060] The spacing between the color photoresist layer and the pixel light-emitting unit can be in the range of [1μm, 10μm], preferably in the range of [2μm, 8μm], and the optimal spacing range is [3μm, 6μm]. Technical personnel in this field can select a suitable setting spacing according to actual needs, and no limitation is made here.
[0061] The coverage area of the pixel light emitting unit on the horizontal plane can be in the range [100μm 2 , 800μm 2 ], those skilled in the art can understand that the area of the pixel light-emitting unit can be designed and formulated according to its aperture ratio, and it is necessary to comprehensively consider the power consumption and service life of the pixel light-emitting unit and then select the appropriate pixel light-emitting unit specifications, which is not limited here. Correspondingly, the coverage area of the color photoresist layer corresponding to a single pixel light-emitting unit can be 1.2 to 3 times the coverage area of the pixel light-emitting unit. It can be understood that the coverage area of the color photoresist layer depends on the size of the pixel light-emitting unit and the spacing between the color photoresist layer and the pixel light-emitting unit, and it is necessary to balance the viewing angle of the pixel light-emitting unit and the aperture ratio for specific settings.
[0062] For each black photoresist covered area with an isosceles trapezoid in vertical section, its base angle can be set to be in the range of [10°, 70°], preferably in the range of [20°, 50°]. It can be understood that the smaller the base angle of the isosceles trapezoid in the vertical section, the more favorable the viewing angle design is for the pixel light-emitting unit, but the reduction of the base angle will lead to a decrease in the curing uniformity and optical density value of the black photoresist layer. Those skilled in the art can set a suitable slope angle according to actual needs, which is not limited here.
[0063] The thickness of the black photoresist layer can be set to be in the range of [1μm, 30μm], preferably in the range of [2μm, 20μm], and the optimal thickness range is [3μm, 15μm]; the optical density corresponding to the black photoresist layer can be set to be greater than or equal to 3, preferably greater than or equal to 4; the optimal optical density can be set to be greater than or equal to 5; the thickness of the color photoresist layer can be set to be in the range of [1μm, 5μm], preferably in the range of [2μm, 4μm]. Those skilled in the art can select the black photoresist layer and the color photoresist layer with appropriate thickness and optical density according to actual needs, and no limitation is made here.
[0064] In some embodiments of the present disclosure, the preparation method of the above-mentioned built-in color resistance display screen is described below: Specifically, Figure 2 A schematic diagram of a preparation process of a built-in color-resistance display screen is provided, which may include the following steps:
[0065] Step 201: Attach a protective film to the package cover. It is understandable that in the technical solution provided by the present disclosure, wet etching can be used to form an opening for forming the black color resist layer, so other parts of the package cover need to be properly protected. Specifically, the package cover can be attached with a protective film by attaching an acid-base inert film, and the edge of the package cover is acid-proofed.
[0066] Step 202: Prepare an opening etching protection layer in the non-black photoresist layer covered area. In the specific implementation process of step 202, a yellow light process can be used to protect the non-etched area using an acid-resistant photoresist or other hydrogen fluoride inert material, and expose the black photoresist layer covered area to be etched.
[0067] Step 203: Opening the area covered by the black photoresist layer. In the specific implementation of step 203, a wet etching process can be used to etch the package cover plate with a high concentration of hydrogen fluoride solution to form the required opening of a regular trapezoid. The opening position corresponds to the spacing area in the pixel positioning layer one by one, which will not be described in detail here.
[0068] Step 204: Forming a color resist layer. In the specific implementation of step 204, coating and photolithography processes may be used, and after forming the film, the color resist layer in the etched opening is removed, and the color resist layer in the non-etched opening area is retained.
[0069] Step 205: Forming a black photoresist layer. In the specific implementation of step 205, a coating or inkjet process may be used to form a black photoresist layer structure in a regular trapezoidal shape in the opening region.
[0070] Step 206: forming a protective and planar layer, wherein the thickness of the planar layer can be set to be in the range of [1 μm, 5 μm], preferably in the range of [2 μm, 4 μm].
[0071] Step 207: Combine the polysilicon substrate with pixel light-emitting units and the package cover with built-in color resist. It can be understood that the preparation of the built-in color resist display screen provided by the present disclosure can be realized through the above steps 201 to 207.
[0072] In some embodiments of the present disclosure, a display device is further provided. The display device includes the built-in color-resistance display screen provided in the aforementioned embodiment for content presentation, which will not be described in detail here.
[0073] In summary, through the technical solution provided by the present disclosure, a color-resistance setting structure with polarizer removed is provided, which can effectively reduce the power consumption, thickness and manufacturing cost of display products, wherein the black color-resistance layer is embedded in the packaging cover plate structure, so that the overall stability of the color-resistance setting structure is significantly improved. At the same time, in the technical solution provided by the present disclosure, the pixel positioning layer and the black color-resistance layer are uniformly set, providing a continuously expanded emission channel for the pixel light-emitting unit, which can effectively improve the brightness viewing angle attenuation and screen color accuracy of the display screen, and has a popularizable value.
[0074] The above content is a further detailed description of the present disclosure in combination with specific preferred implementation modes, and it cannot be determined that the specific implementation of the present disclosure is limited to these descriptions. For ordinary technicians in the technical field to which the present disclosure belongs, several simple deductions or substitutions can be made without departing from the concept of the present disclosure, which should be regarded as falling within the scope of protection of the present disclosure.
Claims
1. A built-in color-resistance display screen, characterized in that: It includes a polysilicon substrate and a packaging cover plate stacked in sequence, wherein: A pixel positioning layer is disposed on the first surface of the polysilicon substrate close to the package cover plate, the pixel positioning layer includes a plurality of first openings, the pixel light emitting units are disposed in the first openings, and emit light along the opening direction of the first openings; A black photoresist layer and a color photoresist layer are provided on the second surface of the packaging cover plate close to the polysilicon substrate; The second surface includes a plurality of second openings arranged at intervals, and the arrangement positions of the second openings are staggered relative to the arrangement positions of the first openings; At least a portion of the black photoresist layer is embedded in the second opening.
2. The built-in color-resistance display screen according to claim 1, characterized in that: An opening area of the first opening is larger than a bottom area of the first opening; An opening area of the second opening is larger than a bottom area of the second opening.
3. The built-in color-resistance display screen according to claim 2, wherein: The cross section of the first opening on a vertical plane is an isosceles trapezoid; The cross section of the second opening on a vertical plane is an isosceles trapezoid.
4. The built-in color-resistance display screen according to any one of claims 2, characterized in that: The first opening divides the pixel positioning layer into a plurality of spaced areas; Each of the spacing areas corresponds to each of the second openings one by one; and The two adjacent first side walls in the adjacent spacing regions and the two adjacent second side walls in the corresponding second openings together form an emission channel that continuously expands outwards along the light emission direction of the pixel light emitting unit.
5. The built-in color-resistance display screen according to claim 4, characterized in that: The first side wall and the second side wall that is most proximate to the first side wall are in the same plane.
6. The built-in color-resistance display screen according to claim 4, characterized in that: The black photoresist layer includes a plurality of black photoresist covering areas distributed at intervals, and each of the black photoresist covering areas corresponds to each of the second openings one by one; The thickness of the black photoresist covering area is greater than or equal to the depth of the second opening.
7. The built-in color-resistance display screen according to claim 6, wherein: Each of the black photoresist covered areas corresponds to each of the spaced areas one by one The shape of the black photoresist covering area facing the polysilicon substrate is the same as the shape of the corresponding spacing area facing the packaging cover.
8. The built-in color-resistance display screen according to claim 6, wherein: The side of the black photoresist covering area facing the polysilicon substrate is in the same plane as the side of the color photoresist layer facing the polysilicon substrate.
9. The built-in color-resistance display screen according to claim 1, wherein: A protective film layer is disposed on a third surface of the packaging cover away from the polycrystalline silicon substrate.
10. A method for preparing a built-in color-resistance display screen, characterized in that: Applicable to the built-in color-resistance display screen as claimed in any one of claims 1 to 9; The preparation method comprises the following steps: Providing a polysilicon substrate with a preset pixel light-emitting unit and a packaging cover; Attaching a film to the packaging cover for protection; Prepare an opening etching protection layer in the non-black photoresist layer covered area of the packaging cover plate close to the second surface of the polysilicon substrate; Performing opening molding on the second surface in the area covered by the black photoresist layer to form a plurality of second openings arranged at intervals; Forming a color resist layer on the second surface, and removing the color resist layer formed at the second opening; Forming a black color resist layer at the second opening; The polysilicon substrate and the packaging cover are bonded together to form the built-in color-resistance display screen.
11. A display device, characterized in that: The display device comprises the built-in color-resistance display screen according to any one of claims 1 to 9.