Display panel, manufacturing method thereof and display device

Abstract

The invention relates to a display panel, a manufacturing method thereof and a display device. The display panel comprises a display area and a non-display area located on the periphery of the display area, and the non-display area comprises a sealing area. The display panel comprises a display substrate, a cover plate located on the display side of the display substrate, a sealing structure and a supporting layer, wherein the sealing structure and the supporting layer are located between the display substrate and the cover plate. The sealing structure is located in the sealing area; the difference value between the refractive index of the supporting layer and the refractive index of the cover plate is smaller than a preset value. On the inner side, close to the center of the display panel, of the sealing structure, the upper surface and the lower surface of the supporting layer are attached to the cover plate and the display substrate respectively, and the sealing structure is attached to the side face of the supporting layer.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display has the advantages of self-luminescence, continuously adjustable luminous color, high brightness, low power consumption, light weight, and wide viewing angle, making it a promising next-generation display technology.

[0003] OLED display substrates can be flexible substrates and rigid substrates. In related technologies, different corresponding packaging methods are generally used to make OLED display film layers on flexible substrates and rigid substrates: thin film encapsulation (TFE) can be used to make OLED display film layers on flexible substrates, and a cover plate can be set on the display side of the OLED display film layer on a rigid substrate, and glass powder laser sintering (Frit packaging) can be used to encapsulate the cover plate and OLED display substrate.

[0004] For rigid OLED display devices that use cover plate packaging, rainbow patterns appear at oblique viewing angles, but no rainbow patterns appear at straight viewing angles. As the viewing angle changes, the rainbow patterns move, affecting the user experience. Summary of the invention

[0005] The present application provides a display panel and a manufacturing method thereof, and a display device, which are used to solve the problem that a display device encapsulated with a cover plate has rainbow patterns at oblique viewing angles.

[0006] In a first aspect, a display panel is provided, comprising a display area and a non-display area located outside the display area, wherein the non-display area comprises a sealing area. The display panel comprises: a display substrate and a cover plate located on the display side of the display substrate, and a sealing structure and a support layer located between the display substrate and the cover plate. The sealing structure is located in the sealing area; the difference between the refractive index of the support layer and the refractive index of the cover plate is less than a preset value. On the inner side of the sealing structure close to the center of the display panel, the upper surface and the lower surface of the support layer are respectively bonded to the cover plate and the display substrate, and the sealing structure is bonded to the side of the support layer.

[0007] In a second aspect, a method for manufacturing a display panel is provided, wherein the display panel includes a display area and a non-display area located outside the display area, wherein the non-display area includes a sealing area. The manufacturing method includes: forming a display substrate; forming a cover plate on the display side of the display substrate; forming a sealing structure between the display substrate and the cover plate, wherein the sealing structure is located in the sealing area; forming a supporting layer between the display substrate and the cover plate, wherein the difference between the refractive index of the supporting layer and the refractive index of the cover plate is less than a preset value; wherein, on the inner side of the sealing structure close to the center of the display panel, the upper surface and the lower surface of the supporting layer are respectively bonded to the cover plate and the display substrate, and the sealing structure is bonded to the side of the supporting layer.

[0008] In a third aspect, a display device is provided, comprising the above-mentioned display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0010] Figure 1 A schematic diagram of a local structure of a non-binding area of ​​a display panel in some embodiments of the present application;

[0011] Figure 2 A schematic diagram of a local structure of a binding area of ​​a display panel in some embodiments of the present application;

[0012] Figure 3-Figure 5 A schematic diagram showing the manufacturing process of a substrate in some embodiments of the present application;

[0013] Figure 6 This is a schematic diagram of the structure of the cover plate in some embodiments of the present application;

[0014] Figure 7a for Figure 6 Section view along AA;

[0015] Figure 7b for Figure 6 Sectional view along BB;

[0016] Figure 8a and Figure 8b This is a schematic diagram of the structure of the cover plate in some embodiments of the present application;

[0017] Figure 9a and Figure 9b A schematic diagram of a partial structure of a display panel is shown in some embodiments of the present application. DETAILED DESCRIPTION

[0018] The technical solution of the present application will be described clearly and in detail below in conjunction with the drawings of the embodiments of the present application. Obviously, the embodiments described below are part of the embodiments of the present application rather than all of the embodiments, and are only used to more clearly illustrate the technical solution of the present application. Therefore, they are only used as examples, and the protection scope of the present application cannot be limited by this. Based on the described embodiments of the present application, all other embodiments that can be obtained by those skilled in the art without creative work belong to the scope of protection of the present application.

[0019] Unless otherwise defined, all technical and scientific terms used herein shall have the meanings commonly understood by technicians in the technical field of this application; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the embodiments of this application and any variations thereof are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the embodiments of this application are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the embodiments of this application, unless otherwise stated, "multiple" means more than two.

[0020] The OLED display panel includes a plurality of pixel regions distributed in an array, each pixel region includes a plurality of adjacent sub-pixel regions, and OLEDs emitting different colors may be arranged in the plurality of sub-pixel regions, and the OLEDs of different colors emit light of different colors to achieve color display. The colors of the light emitted by the OLEDs in the plurality of sub-pixel regions may include, but are not limited to, red, green, blue, and may also include yellow, white, and the like.

[0021] It is understandable that OLEDs of the same color may be arranged in multiple sub-pixel regions, for example, white OLEDs. In this case, a color filter may be arranged on the display side of the OLED display panel, and the filtering effect of the color filter may convert the white light emitted by the white OLED into light of different colors, thereby enabling color display. In other words, when the light emitted by the OLEDs in all sub-pixel regions is the same color, color display may also be achieved by arranging a color filter on the display side.

[0022] See also Figure 1As shown, the substrate 101 of the OLED display substrate 10 can be a flexible substrate or a rigid substrate, such as a glass substrate, an organic resin substrate, a polyimide (PI) substrate, a polyethylene terephthalate (PET) substrate, a polydimethylsiloxane (PDMS) substrate, etc. The OLED may include an anode 1, an organic light-emitting layer 2, and a cathode 3 sequentially arranged on the substrate 101. A pixel defining layer 102 may be formed on the substrate 101 to define a plurality of sub-pixel regions. Each OLED is arranged in a sub-pixel region of the substrate 101, that is, at least the organic light-emitting layer 2 of each OLED is located in the sub-pixel region, so that the radiation range of the light emitted by the OLED is limited by the sub-pixel region, avoiding crosstalk of light from adjacent sub-pixel regions. The material of the pixel defining layer 102 may include, for example, but not limited to, at least one of the following: silicon oxide, silicon nitride, silicon oxynitride, polyimide, polyamide, acrylic resin, styrene and phenolic resin. The pixel defining layer 102 may be a single-layer structure or a multi-layer structure.

[0023] The OLED display substrate 10 may also include a thin film transistor for controlling the light emission of the OLED, a driving circuit for controlling the working state of the thin film transistor, and a signal line (such as a gate line, a data line, etc.) for transmitting a signal (not shown in the figure). The working state of the thin film transistor includes the switch of the thin film transistor, the signal size output by the thin film transistor to the anode 1 of the OLED, etc. The driving circuit can control the switch of the thin film transistor through the gate line transmission switch signal, and control the signal size output by the thin film transistor to the anode 1 through the data line transmission data signal to control the brightness of the light emitted by the OLED. The OLED display substrate 10 also includes a flat layer 103 covering the thin film transistor, and the pixel defining layer 102 and the OLED are arranged on the flat layer 103. The anode 1 of the OLED can be electrically connected to the drain electrode of the thin film transistor through a via in the flat layer 103.

[0024] The OLED display substrate 10 using a flexible substrate can be encapsulated by a thin film, while the OLED display substrate 10 using a rigid substrate can be provided with a cover plate 20 on its display side, and glass powder laser sintering is used between the cover plate 20 and the OLED display substrate 10 for sealing and encapsulation (Frit encapsulation). The material of the cover plate 20 can be glass, polyimide (PI), polyethylene terephthalate (PET), polydimethylsiloxane (PDMS), etc.

[0025] For a rigid OLED display device encapsulated with a cover plate 20, the sealing structure 40 formed by laser sintering of glass powder makes a height difference between the cover plate 20 and the OLED display substrate 10, that is, there is a gap between the encapsulated cover plate 20 and the OLED display substrate 10, and an inert gas such as nitrogen can be filled in the gap. Since the refractive index of the gas in the gap (about 1.0) and the refractive index of the cover plate 20 (about 1.5) are quite different, the OLED display device will have rainbow lines at oblique viewing angles, but no rainbow lines at normal viewing angles, and the rainbow lines will move as the viewing angle changes, affecting the user experience.

[0026] Based on this, a display panel and a manufacturing method thereof are provided in an embodiment of the present application, wherein a support layer 30 is formed between the cover plate 20 and the display substrate 10, and on the inner side of the sealing structure 40 close to the center of the display panel, the entire upper surface and the entire lower surface of the support layer 30 are respectively bonded to the cover plate 20 and the display substrate 10, and the sealing structure 40 is bonded to the entire side of the support layer 30, that is, the support layer 30 fills the gap between the cover plate 20 and the display substrate 10. By setting the refractive index difference between the support layer 30 and the cover plate 20 to be less than a preset value, the problem of rainbow patterns caused by gas in the gap between the cover plate 20 and the display substrate 10 can be eliminated. In addition, the support layer 30 can also play a supporting role, thereby improving the overall impact resistance of the device. Furthermore, the sealing structure 40 is bonded to the entire side of the support layer 30, and the support layer 30 will not occupy the sealing area, thereby avoiding affecting the packaging effect.

[0027] It is understandable that the technical solution of the present application is not limited to OLED display, but can also be applied to other display technologies in which there is a gap between the cover plate and the display substrate due to packaging, and can also eliminate the problem of rainbow patterns caused by gas in the gap.

[0028] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] Combination Figure 1 , Figure 2 and Figure 6 As shown, according to some embodiments of the present application, a display panel is provided. The display panel includes a display area AA and a non-display area NA located at the periphery of the display area. The non-display area includes a sealing area SE.

[0030] The display panel includes a display substrate 10 and a cover plate 20, and a sealing structure 40 and a support layer 30 located between the display substrate 10 and the cover plate 20. The cover plate 20 is located on the display side of the display substrate 10 and is used to encapsulate the display substrate 10. The sealing structure 40 is located in the sealing area and is used to seal and encapsulate the display substrate 10 and the cover plate 20.

[0031] The sealing structure 40 allows a gap to exist between the package cover plate 20 and the display substrate 10, and the support layer 30 fills the gap between the display substrate 10 and the cover plate 20. In other words, on the inner side of the sealing structure 40 close to the center of the display panel, the upper surface and the lower surface of the support layer 30 are respectively attached to the cover plate 20 and the display substrate 10, and the sealing structure 40 is attached to the side of the support layer 30. And the refractive index difference between the support layer 30 and the cover plate 20 is set to be less than a preset value.

[0032] Thus, the gap between the display substrate 10 and the cover plate 20 on the inner side of the sealing structure 40 is filled with the support layer 30, the entire upper surface of the support layer 30 is fitted with the cover plate 20, the entire lower surface is fitted with the cover plate 20, and the sealing structure 40 is fitted with the entire side of the support layer 30. By setting the refractive index difference between the support layer 30 and the cover plate 20 to be less than the preset value, the problem of rainbow patterns caused by gas in the gap between the cover plate 20 and the display substrate 10 can be eliminated. In addition, the support layer 30 can also play a supporting role, thereby improving the overall impact resistance of the device. Furthermore, the sealing structure 40 is fitted with the entire side of the support layer 30, and the support layer 30 will not occupy the sealing area, thereby avoiding affecting the packaging effect.

[0033] The refractive index difference between the support layer 30 and the cover plate 20 may be, for example, less than 0.2, thereby being able to more effectively eliminate the problem of rainbow stripes.

[0034] The display substrate 10 may be, for example, an OLED display substrate. In this case, the display substrate 10 may include a pixel defining layer 102 disposed on a substrate 101. The pixel defining layer 102 defines a plurality of pixel regions in the display area of ​​the substrate 101, and each pixel region includes a plurality of adjacent sub-pixel regions. The display substrate 10 may also include an OLED located in each sub-pixel region. The OLED includes an anode 1, an organic light-emitting layer 2, and a cathode 3 sequentially disposed on the substrate 101. Exemplarily, the anode 1 and the organic light-emitting layer 2 in adjacent sub-pixel regions may be separated by the pixel defining layer 102, and all sub-pixel regions may share the cathode 3, that is, the cathode 3 covers the entire display area.

[0035] The non-display area NA may be arranged around the periphery of the display area AA. The sealing area SE of the non-display area is an annular area surrounding the display area, and the sealing structure 40 formed in the sealing area SE is used to prevent water vapor and the like from entering between the cover plate 20 and the display substrate 10. For example, the sealing structure 40 may be formed by laser sintering of glass powder.

[0036] A driving circuit and the like may be provided in the non-display area NA. In this case, the non-display area NA on at least one side of the display area AA may be a binding area, and the binding area has a plurality of conductive traces, and the driving circuit is electrically connected to the pixel driving circuit of the display area AA through the conductive traces. The plurality of conductive traces may, for example, include a target conductive trace 4 for connecting to the cathode 3, and the driving circuit transmits a common voltage to the cathode 3 through the target conductive trace 4. The conductive trace may include a plurality of conductive layers, for example, a first conductive layer made in the same layer as the source and drain electrodes of the thin film transistor, and a second conductive layer made in the same layer as the anode of the OLED, to reduce resistance. The cathode 3 may be electrically connected to the target conductive trace 4 through a via in the pixel defining layer 102.

[0037] The pixel driving circuit may include, for example, a thin film transistor (TFT) located in each sub-pixel region, and the thin film transistor may be a low temperature polycrystalline silicon thin film transistor (LTPS TFT), an oxide thin film transistor (Oixde TFT), a low temperature polycrystalline oxide thin film transistor (LTPO TFT), etc. Taking LTPS TFT as an example, the thin film transistor includes an active layer, a first gate insulating layer, a first gate electrode, a second gate insulating layer, a second gate electrode, an intermediate insulating layer, and a source-drain electrode sequentially arranged on a substrate 101. The display substrate may also include a flat layer 103 covering the thin film transistor, and the anode 1 of the OLED is electrically connected to the drain electrode of the thin film transistor through a via in the flat layer 103, so as to transmit a display signal to the anode 1 to control the OLED to emit display light.

[0038] The display substrate may further include other functional film layers, or the number of functional film layers may be increased or decreased according to different products, such as a dual source-drain electrode layer, etc., which will not be elaborated here.

[0039] In some embodiments, the support layer 30 can be made of organic materials (such as photoresist, methyl methacrylate, etc.). Since the gap height between the display substrate 10 and the cover plate 20 is tens of microns when Frit packaging is used, the support layer 30 formed of organic materials can meet the height requirement for filling the gap.

[0040] The upper surface of the supporting layer 30 may refer to the surface of the supporting layer 30 close to the cover plate 20 , the lower surface may refer to the surface of the supporting layer 30 close to the display substrate 10 , and the side surface of the supporting layer 30 is located between the upper surface and the lower surface.

[0041] On the inner side of the sealing structure 40 near the center of the display panel, the upper surface of the supporting layer 30 is fitted with the cover plate 20, which may mean that on the inner side of the sealing structure 40 near the center of the display panel, there is no gap between the upper surface of the supporting layer 30 and the cover plate 20, the entire upper surface of the supporting layer 30 may be directly in contact with the cover plate 20 and fitted, or a portion of the upper surface of the supporting layer 30 may be directly in contact with the cover plate 20 and fitted, and a portion of the upper surface may be indirectly in contact with the cover plate 20 via other film layers and fitted. Similarly, on the inner side of the sealing structure 40 near the center of the display panel, the lower surface of the supporting layer 30 is bonded to the display substrate 10, which may mean that on the inner side of the sealing structure 40 near the center of the display panel, there is no gap between the lower surface of the supporting layer 30 and the display substrate 10, and the entire lower surface of the supporting layer 30 may be bonded to the display substrate 10 in direct contact, or a portion of the lower surface of the supporting layer 30 may be bonded to the display substrate 10 in direct contact, and a portion of the lower surface may be bonded to the display substrate 10 indirectly through other film layers. Similarly, on the inner side of the sealing structure 40 near the center of the display panel, the sealing structure 40 is bonded to the side of the supporting layer 30, which may mean that on the inner side of the sealing structure 40 near the center of the display panel, there is no gap between the sealing structure 40 and the side of the supporting layer 30, and the sealing structure 40 may be bonded to the entire side of the supporting layer 30 in direct contact, thereby avoiding the problem that the supporting layer 30 occupies the sealing area and thus increases the risk of frame failure.

[0042] The support layer 30 may be disposed on the display substrate 10 or the cover plate 20 .

[0043] See also Figure 3As shown, taking the support layer 30 disposed on the display substrate 10 as an example, affected and limited by the manufacturing process, a support film layer 301 is formed on the display substrate 10 by vacuum evaporation, inkjet printing and other film forming processes, and its edge is a second uneven edge 3011 (i.e., not parallel to the cover plate 20), which results in the second uneven edge 3011 of the support film layer 301 being unable to fit with the cover plate 20 during packaging, so that there is still a gap between the second uneven edge 3011 of the support film layer 301 and the cover plate 20. Since there is gas in the gap, the refractive index of the gas and the cover plate 20 differ greatly, which leads to the rainbow pattern problem. In the embodiment of the present application, the manufacturing method of the display panel is improved, for example, the second uneven edge 3011 of the support film layer 301 is basically or even completely removed through a process (details will be described in the following content), so as to obtain the support layer 30 in the embodiment of the present application, so that the support layer 30 can fill the gap between the cover plate 20 and the display substrate 10, that is, the upper surface and the lower surface of the support layer 30 are respectively bonded to the cover plate 20 and the display substrate 10, and the sealing structure 40 is bonded to the side of the support layer 30. Therefore, the technical solution in the embodiment of the present application can eliminate the rainbow pattern problem caused by the gas in the gap between the cover plate 20 and the display substrate 10. And by removing at least a part of the second uneven edge 3011 of the support film layer 301, the formed support layer 30 reduces the crowding out of the non-display area, which is conducive to achieving a narrow frame.

[0044] In some embodiments, the refractive index of the support layer 30 can be set to be smaller than the refractive index of the cover plate 20, which is conducive to emitting as much display light as possible from the display side, improving the light extraction efficiency, thereby increasing the display brightness and reducing energy consumption.

[0045] In some embodiments, the refractive index of the support layer 30 can be set to be greater than the refractive index of the outermost layer of the display substrate 10 close to the display side (such as the cathode 3 of the OLED) and less than the refractive index of the cover plate 20, which is conducive to emitting as much display light as possible from the display side and improving the light extraction efficiency.

[0046] Taking the cover plate 20 as a glass substrate as an example, the refractive index of the support layer 30 can be 1.45-1.55, so as to ensure that the refractive index of the support layer 30 is smaller than the refractive index of the cover plate 20, and at the same time ensure that the refractive index difference between the support layer 30 and the cover plate 20 is not large, thereby avoiding the formation of rainbow patterns due to refraction and reflection of light after the light passing through the support layer 30 enters the cover plate 20.

[0047] Taking the support layer 30 disposed on the substrate 101 of the display substrate 10 as an example, due to the influence and limitation of the process, the second uneven edge 3011 of the support film layer 301 formed by the film forming process cannot be completely removed, so that the obtained support layer 30 still has the first uneven edge 31. However, by pre-removing most of the second uneven edge 3011 of the support film layer 301, the width of the first uneven edge 31 of the formed support layer 30 is small. In this case, the height difference between any point on the upper surface of the first uneven edge 31 of the support layer 30 relative to the substrate 101 and the height difference between the upper surface of the central area 32 of the support layer 30 other than the edge 31 relative to the substrate 101 is less than a preset threshold, such as 10um. This is conducive to the subsequent filling of the gap between the first uneven edge 31 of the support layer 30 and the cover plate 20 through the process, so that the entire upper surface of the support layer 30 is arranged in contact with the cover plate 20. Since the width of the first uneven edge 31 of the support layer 30 in the embodiment of the present application is small after the removal process, it is easy to achieve filling. For example, glue may be filled between the first uneven edge 31 of the support layer 30 and the cover plate 20. By removing at least a portion of the second uneven edge 3011 of the support film layer 301, the formed support layer 30 reduces the occupation of the non-display area, which is conducive to achieving a narrow frame.

[0048] The width of the uneven edge may refer to an extended length of the uneven edge in a direction perpendicular to a side edge of the display panel (a side edge on which the uneven edge is located).

[0049] In some embodiments, the sealant forming the sealing structure 40 can be used to fill the gap between the first uneven edge 31 of the support layer 30 and the cover plate 20. For example, in the process of pressing the cover plate 20 on the display side of the display substrate 10, the sealant can be squeezed between the first uneven edge 31 of the support layer 30 and the cover plate 20 under pressure to fill the gap between the first uneven edge 31 of the support layer 30 and the cover plate 20, and then the sealant is cured. As a result, the inner side of the upper surface of the sealing structure 40 facing away from the display substrate 10 has a flange 401, and the flange 401 is filled between the first uneven edge 31 of the support layer 30 and the cover plate 20, so that the first uneven edge 31 of the support layer 30 is attached to the cover plate 20 through the flange 401.

[0050] According to some embodiments of the present application, the support layer 30 may be disposed on the display substrate 10. In this case, the display substrate 10 may further include: a sacrificial layer, at least part of the sacrificial layer is located in the sealing area, and the first uneven edge 31 of the support layer 30 overlaps the sacrificial layer or is located on the inner side of the sacrificial layer close to the center of the display substrate 10. Therefore, when making the support layer 30, the sacrificial layer can be used as a mark to control the first uneven edge 31 of the support layer 30 to overlap the sacrificial layer or be located on the side of the sacrificial layer close to the center of the display substrate 10, thereby avoiding the problem that the support layer 30 occupies the sealing area and increases the risk of frame packaging failure. By controlling the support layer 30 to be on the inner side of the sealing area, it is possible to avoid the problem that the support layer 30 becomes a water vapor failure path due to poor water blocking ability, resulting in packaging failure.

[0051] The overlapping in the embodiments of the present application may refer to one end of a certain structure being located on another structure.

[0052] In some embodiments, the sacrificial layer may be made of a conductive material, and when the support film layer 301 is formed on the outermost layer of the display substrate 10 near the display side through a film forming process, at least a portion of the second uneven edge 3011 of the support film layer 301 may be removed by laser, so that the first uneven edge 31 of the formed support layer 30 overlaps the sacrificial layer or is located on the side of the sacrificial layer near the center of the display substrate 10. In this case, the fast heat absorption characteristic of the conductive material can be utilized, and the difficulty of laser removal can be increased by adding a sacrificial layer, and when the sealing structure 40 is subsequently formed by laser sintering of glass powder, the sacrificial layer can also serve as a barrier to prevent the laser from ablating the glass powder in this area.

[0053] The sacrificial layer can be manufactured through a separate process, or it can be the same layer structure manufactured through the same manufacturing process as other conductive film layers of the display substrate. For example, it can be the same layer structure manufactured through the same manufacturing process as the gate electrode or source-drain electrode of the thin film transistor.

[0054] In some embodiments, the non-display area may include a non-binding area located on one side of the display area, and the sacrificial layer includes a first sacrificial conductive layer 51 located in the non-binding area. In the non-binding area, the first uneven edge 31 of the support layer 30 overlaps the first sacrificial conductive layer 51. Since there is no conductive trace in the non-binding area, a first sacrificial conductive layer 51 of a larger size may be provided, and at least a portion of the first sacrificial conductive layer 51 may be located in the sealing area, which can effectively control the first uneven edge 31 of the support layer 30 to overlap the sacrificial conductive layer, thereby preventing the support layer 30 from occupying the sealing area. In the case of using a laser to remove at least a portion of the second uneven edge 3011 of the support film layer 301, by providing the first sacrificial conductive layer 51, the characteristic of fast heat absorption of the conductive material can be utilized to reduce the difficulty of laser removal, and when the glass powder is subsequently sintered by laser to form the sealing structure 40, the first sacrificial conductive layer 51 can also serve as a barrier to allow the laser to ablate the glass powder in the sealing area.

[0055] It can be understood that the sacrificial layer in the non-binding area can also be made of insulating material, and only plays a marking role in controlling the edge position of the supporting layer.

[0056] The first sacrificial conductive layer 51 may be disposed close to the outer edge of the display substrate 10 to form a first sacrificial conductive layer 51 of a larger size, thereby playing a more conspicuous marking role.

[0057] The non-display area may also include a binding area located on one side of the display area. Due to the presence of conductive traces in the binding area, a second sacrificial conductive layer may not be formed in the binding area or a small-sized second sacrificial conductive layer may be made to avoid interfering with signals transmitted by the conductive traces.

[0058] like Figure 4 As shown, in some embodiments, the sacrificial layer includes a second sacrificial conductive layer 52 located between two adjacent conductive traces in the binding area. In the binding area, the first uneven edge 31 of the support layer 30 is spaced apart from the second sacrificial conductive layer 52 and is located on the inner side of the second sacrificial conductive layer 52 close to the center of the display substrate 10. When manufacturing the support layer 30, the second uneven edge 3011 of the support film layer 301 formed by the film forming process can be controlled to overlap the second sacrificial conductive layer 52, and a part of the second uneven edge 3011 of the support film layer 301 can be removed by the process, so that the first uneven edge 31 of the support layer 30 formed in the binding area is located on the inner side of the second sacrificial conductive layer 52 close to the center of the display panel, and the two are spaced apart to prevent the support layer 30 from occupying the sealing area.

[0059] It can be understood that the sacrificial layer in the binding area can also be made of insulating material, and only plays a marking role in controlling the edge position of the supporting layer.

[0060] It should be noted that a support layer and a sacrificial layer may also be formed on the cover plate, and the support layer may be encapsulated inside the sealing structure through the sacrificial layer. The specific implementation structure is similar to the above.

[0061] Affected by and limited by the process, the width of the uneven edge of the film layer increases with increasing thickness, as shown in Table 1.

[0062] Table 1 shows the relationship between the thickness of the organic film layer and the width of the uneven edge.

[0063] Thickness of organic film layer / um Width of uneven edge / mm 12 4.6 24 5.2 36 6.0

[0064] Based on this, Figure 5 As shown, according to some embodiments of the present application, the support layer 30 may include a plurality of sub-support layers stacked in sequence. Compared with a support film layer with a larger thickness formed by a single film forming process, a plurality of sub-support film layers formed by multiple film forming processes respectively have a smaller thickness of each sub-support film layer, so that the width of the uneven edge of each sub-support film layer is smaller, thereby being able to reduce the width of the second uneven edge 3011 of the entire support film layer 301, which is conducive to removing the second uneven edge 3011 of the support film layer 301 by a removal process to obtain a support layer 30 with a flat surface, so that the support layer 30 can be directly in contact with the cover plate 20 and the display substrate 10 and be arranged in a laminated manner, thereby eliminating the problem of rainbow patterns caused by gas in the gap between the cover plate 20 and the display substrate 10. And removing the second uneven edge of the support film layer by a removal process is conducive to achieving a narrow frame.

[0065] Taking the example of a support layer being arranged on a display substrate, when the support layer includes a plurality of sub-support layers stacked in sequence, the uneven edge of the support layer can be completely removed through a pre-removal process, so that the upper surface of the support layer is flat, and the entire upper surface of the support layer can be directly in contact with the cover plate and fit together to fill the gap between the display substrate and the cover plate.

[0066] In some embodiments, along the direction of the substrate away from the display substrate, the refractive index of the plurality of sub-support layers tends to increase, which is beneficial to improving the light extraction efficiency.

[0067] The refractive index of the plurality of sub-support layers showing an increasing trend may mean that for two adjacent sub-support layers, the refractive index of the sub-support layer close to the substrate is not greater than the refractive index of the sub-support layer away from the substrate. For example, along the direction away from the substrate, the refractive index of the plurality of sub-support layers increases successively. It is understandable that the refractive index of some two adjacent sub-support layers may be the same, while the refractive index of the sub-support layer 30 close to the substrate in the other two adjacent sub-support layers is less than the refractive index of the sub-support layer away from the substrate.

[0068] In some embodiments, for a support layer formed by a plurality of sub-support layers, the above-mentioned sacrificial layer may also be provided in the sealing area, so as to control the edge of the support layer to overlap the sacrificial layer or be located on the inner side of the sacrificial layer close to the center of the display substrate, so as to avoid the problem of occupying the sealing area and causing the frame to have the risk of sealing failure. The sacrificial layer may include a first sacrificial layer located in the non-binding area and / or a second sacrificial layer located in the binding area.

[0069] Exemplarily, the first sacrificial layer in the non-binding area may be the first sacrificial conductive layer 51, and the second sacrificial layer in the binding area may be the second sacrificial conductive layer 52. In this case, in the non-binding area, due to the large size of the first sacrificial conductive layer 51, the edge of each sub-support film layer can be controlled to overlap the first sacrificial conductive layer 51 during the film forming process, and the first sacrificial conductive layer 51 can be used to absorb heat quickly, and a portion of the second uneven edge 3011 of the support film layer 301 can be effectively removed by laser. Since the width of the uneven edge of the sub-support film layer formed by multiple film forming processes is small, even the uneven edge of the outermost sub-support film layer can be completely removed. In the binding area, due to the small size of the second sacrificial conductive layer, the edge of the outermost sub-support film layer can be controlled to overlap the second sacrificial conductive layer during the film forming process, and the second sacrificial conductive layer can be used to absorb heat quickly, and the uneven edge of the support film layer can be effectively removed by laser. Since the width of the uneven edge of the support film layer formed by multiple film forming processes is small, even the uneven edge of the outermost sub-support film layer can be completely removed.

[0070] In the above embodiments, after the support film layer is formed by the film forming process, at least a portion of the uneven edge of the support film layer is removed by the removal process to obtain the support layer, so that the upper surface and the lower surface of the inner support layer of the sealing structure can be respectively bonded with the cover plate and the display substrate, that is, the gap between the cover plate and the display substrate is filled with the support layer. In the case where the uneven edge of the support film layer cannot be completely removed, since the width of the uneven edge of the support film layer after the removal process is small, the gap between the uneven edge of the support film layer and the cover plate (or display substrate) can be filled by, for example, filling with glue, so that the upper surface and the lower surface of the support layer are respectively bonded with the cover plate and the display substrate. It can be understood that the support layer can also be filled with the gap between the cover plate and the display substrate by other methods, so that the upper surface and the lower surface of the support layer are respectively bonded with the cover plate and the display substrate.

[0071] See also Figure 6 , Figure 7a and Figure 7b as well as Figure 8a and Figure 8bAs shown, according to some embodiments of the present application, the sealing structure 40 and the supporting layer 30 are arranged on the cover plate 20. The sealing structure 40 may include a first sealing structure 41 and a second sealing structure 42, and the second sealing structure 42 is located between the supporting layer 30 and the first sealing structure 41. The first sealing structure 41 is an annular structure surrounding the periphery of the display area, which plays a role in blocking water vapor. The second sealing structure 42 is located on the inner side of the first sealing structure 41 close to the center of the display panel, and includes a plurality of sub-sealing structures arranged at intervals along the circumference of the first sealing structure 41. The plurality of sub-sealing structures make the bonding between the cover plate 20 and the display substrate 10 more stable.

[0072] See also Figure 9a and Figure 9b As shown, the edge 31 of the support layer 30 can be located between the first sealing structure 41 and the second sealing structure 42, and the multiple sub-sealing structures are arranged in contact with the side of the central area 32 of the support layer 30 except the edge 31. Thus, by setting the inner second sealing structure 42 to include multiple sub-sealing structures arranged at intervals, the first uneven edge 31 of the support layer 30 can be controlled to flow between the two adjacent sub-sealing structures to the first sealing structure 41 and the second sealing structure 42, so that the support layer 30 on the inner side of the second sealing structure 42 has a flat surface, which can be arranged in contact with the display substrate 10 or the cover plate 20, and the multiple sub-sealing structures are arranged in contact with the side of the central area 32 of the support layer 30, that is, the gap between the display substrate 10 and the cover plate 20 is filled with the support layer 30, avoiding the problem of rainbow lines caused by gas in the gap between the display substrate 10 and the cover plate 20.

[0073] In some embodiments, when the sealing structure adopts the two-circle structure in the above embodiment, the support layer can also be set to include multiple sub-support layers arranged in sequence. Therefore, since the width of the uneven edge of each sub-support film layer is small, the thickness of the entire support film layer formed can be thinner, which facilitates the edge of the support film layer to flow between the two adjacent sub-sealing structures to between the first sealing structure and the second sealing structure, which is conducive to realizing that the inner support layer of the second sealing structure has a flat surface.

[0074] According to some embodiments of the present application, a display device is further provided, comprising the above-mentioned display panel, thereby eliminating the problem of rainbow stripes on the display device.

[0075] The display device in the embodiments of the present application may be, but is not limited to, any device with a display function, such as a cellular phone, a smart phone, a tablet computer, a wearable device, a desktop computer, a laptop computer, etc.

[0076] According to some embodiments of the present application, a method for manufacturing a display panel is also provided. The display panel includes a display area and a non-display area located outside the display area, and the non-display area includes a sealing area.

[0077] Combination Figure 1 and Figure 2 As shown, the manufacturing method of the display panel includes:

[0078] forming a display substrate 10;

[0079] A cover plate 20 is formed on the display side of the display substrate 10;

[0080] A sealing structure 40 is formed between the display substrate 10 and the cover plate 20, and the sealing structure 40 is located in the sealing area;

[0081] A support layer 30 is formed between the display substrate 10 and the cover plate 20 , and a difference between a refractive index of the support layer 30 and a refractive index of the cover plate 20 is less than a preset value.

[0082] Among them, on the inner side of the sealing structure 40 close to the center of the display panel, the upper surface and the lower surface of the support layer 30 are respectively bonded to the cover plate 20 and the display substrate 10, and the sealing structure 40 is bonded to the side of the support layer 30.

[0083] Thus, the gap between the display substrate 10 and the cover plate 20 on the inner side of the sealing structure 40 is filled with the support layer 30, the entire upper surface of the support layer 30 is fitted with the cover plate 20, the entire lower surface is fitted with the cover plate 20, and the sealing structure 40 is fitted with the entire side of the support layer 30. By setting the refractive index difference between the support layer 30 and the cover plate 20 to be less than the preset value, the problem of rainbow patterns caused by gas in the gap between the cover plate 20 and the display substrate 10 can be eliminated. In addition, the support layer 30 can also play a supporting role, thereby improving the overall impact resistance of the device. Furthermore, the sealing structure 40 is fitted with the entire side of the support layer 30, and the support layer 30 will not occupy the sealing area, thereby avoiding affecting the packaging effect.

[0084] In some embodiments, a sealing structure 40 may be formed on the cover plate 20, so as to avoid the manufacturing process of the sealing structure 40 affecting the display substrate 10. The sealing structure 40 may be, for example but not limited to, formed by laser sintering of glass powder.

[0085] A support layer may be formed on the cover plate or the display substrate. In some embodiments, the support layer may be made of an organic material (e.g., photoresist, methyl methacrylate, etc.). Since the height of the gap between the display substrate and the cover plate is tens of microns when Frit packaging is used, the support layer formed by an organic material can meet the height requirement of filling the gap.

[0086] Combination Figure 3-Figure 5 As shown, in some embodiments, a support layer 30 is formed between the display substrate 10 and the cover plate 20, including:

[0087] Forming a support film layer 301 on the display substrate 10 or the cover plate 20;

[0088] At least a portion of the second uneven edge 3011 of the supporting film layer 301 is removed to form the supporting layer 30 .

[0089] Therefore, by pre-removing at least a portion of the second uneven edge 3011 of the supporting film layer 301, the first uneven edge 31 of the supporting layer 30 can be reduced or even removed, so that the gap between the display substrate 10 and the cover plate 20 on the inner side of the sealing structure 40 can be filled with the supporting layer 30, eliminating the problem of rainbow patterns caused by gas in the gap between the display substrate 10 and the cover plate 20.

[0090] In some embodiments, a sacrificial layer may be formed in the non-display area of ​​the display substrate 10, at least a portion of the sacrificial layer is located in the sealing area, and then a support layer 30 is formed on the display substrate 10 using the sacrificial layer as a mark. The support layer 30 is formed between the display substrate 10 and the cover plate 20, including:

[0091] forming a sacrificial layer on the substrate 101 of the display substrate 10, wherein at least a portion of the sacrificial layer is located in the sealing area;

[0092] A supporting film layer 301 is formed on the substrate 101 of the display substrate 10, and a second uneven edge 3011 of the supporting film layer 301 is overlapped on the sacrificial layer;

[0093] At least a portion of the second uneven edge 3011 of the supporting film layer 301 is removed to form the supporting layer 30 , and the first uneven edge 31 of the supporting layer 30 is overlapped on the sacrificial layer or located on a side of the sacrificial layer close to the center of the display panel.

[0094] Thus, by forming a sacrificial layer as a mark, it can be ensured that the prepared support layer 30 will not flow to the sealing area, thereby avoiding the problem of increasing the risk of frame sealing failure. In addition, the support layer 30 is encapsulated inside the sealing area, which can avoid the problem of the support layer 30 forming a water vapor barrier failure path.

[0095] At least a portion of the second uneven edge of the support film layer may be removed by laser, but is not limited to laser. In this case, the sacrificial layer may be made of a conductive material, and the sacrificial layer may absorb heat quickly to reduce the difficulty of laser removal. Then, a support layer 30 is formed on the substrate 101 of the display substrate 10, including:

[0096] A sacrificial conductive layer is formed on the substrate 101 of the display substrate 10, wherein at least a portion of the sacrificial conductive layer is located in the sealing area;

[0097] A supporting film layer 301 is formed on the substrate 101 of the display substrate 10 by using a film forming process, and a second uneven edge 3011 of the supporting film layer 301 is overlapped on the sacrificial conductive layer;

[0098] At least a portion of the second uneven edge 3011 of the supporting film layer 301 is removed by laser to form the supporting layer 30, and the first uneven edge 31 of the supporting layer 30 overlaps the sacrificial conductive layer or is located on one side of the sacrificial conductive layer close to the center of the display panel.

[0099] Therefore, the sacrificial conductive layer not only serves as a mark to ensure that the prepared support layer will not flow to the sealing area, but also can reduce the difficulty of laser removal by taking advantage of the fast heat absorption of the sacrificial conductive layer. In addition, when the sealant is subsequently cured by laser to form a sealing structure, the sacrificial layer can serve as a barrier to cure the sealant in the sealing area.

[0100] The sacrificial conductive layer can be manufactured through a separate process, or it can be the same layer structure manufactured through the same manufacturing process as other conductive film layers of the display substrate. For example, it can be the same layer structure manufactured through the same manufacturing process as the gate electrode or source-drain electrode of the thin film transistor.

[0101] Take the support layer 30 disposed on the substrate 101 of the display substrate 10 as an example. Due to the influence and limitation of the process, the second uneven edge 3011 of the support film layer 301 may not be completely removed, but the width of the first uneven edge 31 of the formed support layer 30 can be reduced. In this case, the height difference between any point on the upper surface of the edge 31 of the support layer 30 relative to the substrate 101 and the height difference between the upper surface of the central area 32 of the support layer 30 other than the edge 31 relative to the substrate 101 is less than a preset threshold value, and the gap between the first uneven edge 31 of the support layer 30 and the cover plate 20 can be filled by the process later, so that the entire upper surface of the support layer 30 is arranged in affixed with the cover plate 20. Since the width of the first uneven edge 31 of the support layer 30 in the embodiment of the present application is small after the removal process, it is easy to achieve filling. For example, glue can be filled between the first uneven edge 31 of the support layer 30 and the cover plate 20.

[0102] In some embodiments, a sealing structure 40 is formed between the display substrate 10 and the cover plate 20, including:

[0103] Applying sealant to the sealing area of ​​the cover plate 20 and pre-baking it;

[0104] In the process of pressing the cover plate 20 onto the display side of the display substrate 10 , the pre-baked sealant is filled between the edge 31 of the support layer 30 and the cover plate 20 to form a flange 401 ;

[0105] The sealant is cured to form a sealing structure 40 .

[0106] Therefore, by improving the manufacturing process of the sealing structure 40, the sealant can fill the gap between the first uneven edge 31 of the supporting layer 30 and the cover plate 20 during the lamination process of the cover plate 20 and the display substrate 10, so that the entire upper surface of the supporting layer 30 is fitted with the cover plate 20, thereby eliminating the problem of rainbow lines.

[0107] In some embodiments, the non-display area may include a non-binding area located on one side of the display area, and the sacrificial layer includes a first sacrificial conductive layer 51 located in the non-binding area. In the non-binding area, the edge 31 of the support layer 30 overlaps the first sacrificial conductive layer 51. Since there is no conductive trace in the non-binding area, a first sacrificial conductive layer 51 of a larger size can be formed, and at least a portion of the first sacrificial conductive layer 51 can be located in the sealing area, which can effectively control the edge 31 of the support layer 30 to overlap the sacrificial conductive layer, thereby preventing the support layer 30 from occupying the sealing area. In the case of using a laser to remove at least a portion of the second uneven edge 3011 of the support film layer 301, by setting the first sacrificial conductive layer 51, the characteristic of fast heat absorption of the conductive material can be utilized to reduce the difficulty of laser removal, and when the glass powder is subsequently sintered by laser to form the sealing structure 40, the first sacrificial conductive layer 51 can also serve as a barrier to allow the laser to ablate the glass powder in the sealing area.

[0108] The non-display area may also include a binding area located on one side of the display area. Due to the presence of conductive traces in the binding area, a second sacrificial conductive layer may not be formed in the binding area or a small-sized second sacrificial conductive layer may be made to avoid interfering with signals transmitted by the conductive traces.

[0109] In some embodiments, the sacrificial layer includes a second sacrificial conductive layer 52 located between two adjacent conductive traces in the binding area. In the binding area, the edge 31 of the support layer 30 is spaced apart from the second sacrificial conductive layer 52 and is located on the side of the second sacrificial conductive layer 52 close to the center of the display substrate 10. When manufacturing the support layer 30, the second uneven edge 3011 of the support film layer 301 formed by the film forming process can be overlapped with the second sacrificial conductive layer 52, and a part of the second uneven edge 3011 of the support film layer 301 can be removed by the process, so that the first uneven edge 31 of the support layer 30 formed in the binding area is located on the side of the second sacrificial conductive layer 52 close to the center of the display panel, and the two are spaced apart to prevent the support layer 30 from occupying the sealing area.

[0110] like Figure 5 As shown, according to some embodiments of the present application, a support layer 30 is formed between the display substrate 10 and the cover plate 20, including:

[0111] A plurality of sub-support layers are formed in sequence, and a support layer is formed from the plurality of sub-support layers.

[0112] Compared with the support film layer 301 with a larger thickness formed by a single film forming process, the multiple sub-support film layers formed respectively by multiple film forming processes have a smaller thickness of each sub-support film layer, so that the width of the uneven edge of each sub-support film layer is smaller, thereby reducing the width of the second uneven edge 3011 of the entire support film layer 301, which is beneficial for completely removing the second uneven edge 3011 of the support film layer 301 through a removal process to obtain a support layer 30 with a flat surface, so that the support layer 30 can be directly in contact with the cover plate 20 and the display substrate 10 and be fitted, thereby eliminating the problem of rainbow patterns caused by gas in the gap between the cover plate 20 and the display substrate 10.

[0113] Figure 5 In the illustrated example, the support layer 30 includes two sub-support layers. It can be understood that the support layer 30 may also include three or more sub-support layers.

[0114] In some embodiments, for the support layer 30 formed by multiple sub-support layers 30, the above-mentioned sacrificial layer can also be formed in the sealing area, and the sacrificial layer is used as a mark to facilitate the control of the second uneven edge 3011 of the support film layer 301 formed by the film forming process to overlap the sacrificial layer. After removing at least a part of the second uneven edge 3011 of the support film layer 301, the first uneven edge 31 of the prepared support layer 30 can be overlapped on the sacrificial layer or located on the side of the sacrificial layer close to the center of the display panel, avoiding the problem of occupying the sealing area and increasing the risk of sealing failure of the frame. The sacrificial layer can be made of conductive material, and the sacrificial layer can include a first sacrificial conductive layer 51 located in the non-binding area and / or a second sacrificial conductive layer 52 located in the binding area. Therefore, the fast heat absorption characteristic of the sacrificial layer can be utilized to reduce the difficulty of laser removal.

[0115] In the above embodiments, after the support film layer is formed by the film forming process, at least a portion of the uneven edge of the support film layer is removed by the removal process to obtain the support layer, so that the upper surface and the lower surface of the support layer can be respectively bonded to the cover plate and the display substrate, that is, the gap between the cover plate and the display substrate is filled with the support layer. In the case where the uneven edge of the support film layer cannot be completely removed, since the width of the uneven edge of the support layer after the removal process is small, the gap between the uneven edge of the support layer and the cover plate (or display substrate) can be filled by, for example, filling with glue, so that the upper surface and the lower surface of the support layer are respectively bonded to the cover plate and the display substrate. It can be understood that the support layer can also be filled in the gap between the cover plate and the display substrate by other methods, so that the upper surface and the lower surface of the support layer are respectively bonded to the cover plate and the display substrate.

[0116] Combination Figure 6 , Figure 7a and Figure 7b As shown, according to some embodiments of the present application, a support layer 30 and a sealing structure 40 are formed on the cover plate 20, wherein the sealing structure 40 is formed on the cover plate 20, including:

[0117] A first sealing structure 41 and a second sealing structure 42 are formed in the sealing area. The second sealing structure 42 is located on one side of the first sealing structure 41 close to the center of the display panel. The first sealing structure 41 is an annular structure surrounding the periphery of the display area. The second sealing structure 42 includes a plurality of sub-sealing structures spaced apart along the circumference of the first sealing structure 41.

[0118] Combination Figure 8a and Figure 8b as well as Figure 9a and Figure 9b As shown, a support layer 30 is formed on the cover plate 20, including:

[0119] A supporting film layer 301 is formed on the inner side of the second sealing structure 42 close to the center of the display panel, and the thickness of the supporting film layer 301 is greater than the thickness of the sealing structure 40 along the direction perpendicular to the cover plate 20;

[0120] After the cover plate 20 is pressed onto the display side of the display substrate 10, the support film layer 301 is cured to form a support layer 30, wherein the edge 31 of the support layer 30 is located between the first sealing structure 41 and the second sealing structure 42, and the sub-sealing structure is arranged to fit the side of the center area 32 of the support layer 30 except the edge 31.

[0121] Since the thickness of the supporting film layer 301 is greater than the thickness of the sealing structure 40, after the cover plate 20 is pressed onto the display side of the display substrate 10, the supporting film layer 301 flows between the two adjacent sub-sealing structures 40 to between the first sealing structure 41 and the second sealing structure 42 due to the extrusion effect, so that the edge 31 of the formed supporting layer 30 is located between the first sealing structure 41 and the second sealing structure 42, and the central area 32 of the supporting layer 30 except the edge 31 is encapsulated inside the second sealing structure 42, and due to the pressing effect of the cover plate 20 and the display substrate 10, the lower surface of the central area 32 of the supporting layer 30 is tightly attached to the display substrate 10. As a result, the gap between the cover plate 20 and the display substrate 10 is filled with the central area 32 of the supporting layer 30, thereby eliminating the problem of rainbow lines caused by gas in the gap between the cover plate 20 and the display substrate 10.

[0122] The first sealing structure 41 is an annular structure surrounding the periphery of the display area, which can play a role in blocking water vapor. The second sealing structure 42 is located on the inner side of the first sealing structure 41 close to the center of the display panel, and includes a plurality of sub-sealing structures arranged at intervals along the circumference of the first sealing structure 41. The plurality of sub-sealing structures can encapsulate the central area 32 of the support layer 30 on the inner side of the sealing area, and the edge 31 is located between the two circles of sealing structures, so that the central area 32 of the support layer 30 can have a flat surface, eliminating the problem of rainbow lines caused by gas in the gap between the cover plate 20 and the display substrate 10, and also avoiding the problem of the support layer 30 flowing to the effective sealing area (i.e., the area where the two sealing structures are located) and increasing the risk of frame sealing failure. In addition, the plurality of sub-sealing structures make the bonding between the cover plate 20 and the display substrate 10 more stable.

[0123] In some embodiments, when the sealing structure adopts the two-circle structure in the above embodiment, the support layer can also be set to include multiple sub-support layers arranged in sequence. Therefore, since the width of the uneven edge of each sub-support film layer is small, the thickness of the entire support film layer formed can be thinner, which facilitates the edge of the support film layer to flow between the two adjacent sub-sealing structures to between the first sealing structure and the second sealing structure, which is conducive to realizing that the inner support layer of the second sealing structure has a flat surface.

[0124] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in this disclosure can be performed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved, and this document does not limit this.

[0125] Although the embodiments or examples of the present disclosure have been described with reference to the accompanying drawings, it should be understood that the above-mentioned methods, systems and devices are merely exemplary embodiments or examples, and the scope of the present invention is not limited by these embodiments or examples, but only by the claims after authorization and their equivalent scope. Various elements in the embodiments or examples can be omitted or replaced by their equivalent elements. In addition, each step can be performed in an order different from that described in the present disclosure. Further, the various elements in the embodiments or examples can be combined in various ways. It is important that with the evolution of technology, many elements described herein can be replaced by equivalent elements that appear after the present disclosure.

Claims

1. A display panel, comprising a display area and a non-display area located outside the display area, wherein the non-display area comprises a sealing area, characterized in that: The display panel comprises: Display substrate; A cover plate, located on the display side of the display substrate; A sealing structure, located between the display substrate and the cover plate and located in the sealing area; A support layer, located between the display substrate and the cover plate, wherein a difference between a refractive index of the support layer and a refractive index of the cover plate is less than a preset value; Wherein, on the inner side of the sealing structure close to the center of the display panel, the upper surface and the lower surface of the supporting layer are respectively bonded to the cover plate and the display substrate, and the sealing structure is bonded to the side surface of the supporting layer.

2. The display panel according to claim 1, characterized in that: The support layer includes a plurality of sub-support layers stacked in sequence.

3. The display panel according to claim 1, characterized in that: The supporting layer is arranged on the substrate of the display substrate, and the difference between the height of any point on the upper surface of the edge of the supporting layer relative to the substrate and the height of the upper surface of the central area of ​​the supporting layer excluding the edge relative to the substrate is less than a preset threshold.

4. The display panel according to claim 3, characterized in that: The inner side of the sealing structure facing away from the upper surface of the display substrate has a flange, and the flange is filled between the edge of the supporting layer and the cover plate.

5. The display panel according to claim 1, characterized in that: The support layer is disposed on the display substrate, and the display substrate further comprises: A sacrificial layer, at least a portion of the sacrificial layer is located in the sealing area, and an edge of the supporting layer is overlapped on the sacrificial layer or is located on a side of the sacrificial layer close to the center of the display panel.

6. The display panel according to claim 5, characterized in that: The non-display area of ​​the display substrate includes a non-binding area located at one side of the display area, and the sacrificial layer includes a first sacrificial conductive layer located at the non-binding area; In the non-binding area, an edge of the support layer overlaps the first sacrificial conductive layer.

7. The display panel according to claim 5, characterized in that: The non-display area of ​​the display substrate includes a binding area located at one side of the display area, the binding area includes a plurality of conductive traces, and the sacrificial conductive layer includes a second sacrificial conductive layer located between two adjacent conductive traces; In the binding area, an edge of the support layer is spaced apart from the second sacrificial layer.

8. The display panel according to claim 1, characterized in that: The sealing structure and the supporting layer are arranged on the cover plate, the sealing structure comprises a first sealing structure and a second sealing structure, the second sealing structure is located on the inner side of the first sealing structure close to the center of the display panel, the first sealing structure is an annular structure surrounding the periphery of the display area, and the second sealing structure comprises a plurality of sub-sealing structures arranged at intervals along the circumference of the first sealing structure; The edge of the supporting layer is located between the first sealing structure and the second sealing structure, and the sub-sealing structure is arranged in contact with the side of the central area of ​​the supporting layer except the edge.

9. A method for manufacturing a display panel, the display panel comprising a display area and a non-display area located outside the display area, the non-display area comprising a sealing area, characterized in that: The production method comprises: forming a display substrate; forming a cover plate on a display side of the display substrate; forming a sealing structure between the display substrate and the cover plate, wherein the sealing structure is located in the sealing area; forming a support layer between the display substrate and the cover plate, wherein a difference between a refractive index of the support layer and a refractive index of the cover plate is less than a preset value; Wherein, on the inner side of the sealing structure close to the center of the display panel, the upper surface and the lower surface of the supporting layer are respectively bonded to the cover plate and the display substrate, and the sealing structure is bonded to the side surface of the supporting layer.

10. The manufacturing method according to claim 9, characterized in that: The supporting layer is formed between the display substrate and the cover plate, comprising: A plurality of stacked sub-support layers are sequentially formed, and the support layer is formed from the plurality of sub-support layers.

11. The manufacturing method according to claim 9, characterized in that: The supporting layer is formed between the display substrate and the cover plate, comprising: forming a sacrificial layer on the substrate of the display substrate, at least a portion of the sacrificial layer being located in the sealing area, Forming a supporting film layer on the substrate of the display substrate, wherein the edge of the supporting film layer overlaps the sacrificial layer; At least a portion of the edge of the supporting film layer is removed to form the supporting layer, the edge of the supporting layer overlaps the sacrificial layer or is located on a side of the sacrificial layer close to the center of the display panel, and the difference between the height of any point on the upper surface of the edge of the supporting layer relative to the substrate and the height of the upper surface of the central area of ​​the supporting layer excluding the edge relative to the substrate is less than a preset threshold.

12. The manufacturing method according to claim 11, characterized in that: The sacrificial layer is made of a conductive material, and the step of removing at least a portion of an edge of the supporting film layer to form the supporting layer comprises: At least a portion of the edge of the supporting film layer is removed by laser to form the supporting layer.

13. The manufacturing method according to claim 11, characterized in that: The sealing structure is formed between the display substrate and the cover plate, comprising: forming a sealant in the sealing area of ​​the cover plate and pre-baking it; In the process of pressing the cover plate onto the display side of the display substrate, the pre-baked sealant is filled between the edge of the support layer and the cover plate to form a flange; The sealant is cured to form the sealing structure.

14. The manufacturing method according to claim 9, characterized in that: The supporting layer and the sealing structure are formed on the cover plate, wherein the sealing structure is formed on the cover plate, comprising: A first sealing structure and a second sealing structure are formed in the sealing area of ​​the cover plate, the second sealing structure is located on the inner side of the first sealing structure close to the center of the display panel, the first sealing structure is an annular structure surrounding the periphery of the display area, and the second sealing structure includes a plurality of sub-sealing structures arranged at intervals along the circumference of the first sealing structure; The forming of a support layer on the cover plate comprises: forming a supporting film layer on the inner side of the second sealing structure close to the center of the display panel, wherein the thickness of the supporting film layer is greater than the thickness of the sealing structure in a direction perpendicular to the cover plate; After the cover plate is pressed onto the display side of the display substrate, the support film layer is cured to form the support layer, the edge of the support layer is located between the first sealing structure and the second sealing structure, and the sub-sealing structure is arranged to fit the side of the center area of ​​the support layer except the edge.

15. A display device, characterized in that: A display panel comprising any one of claims 1-8.

Images