Wafer storage container cleaning device
By designing a wafer storage container cleaning device including a cleaning tank and a transport robot, the problem of insufficient cleaning efficiency and throughput in the prior art is solved, efficient cleaning and drying is achieved, and the production efficiency of semiconductor components is improved.
Patent Information
- Application Number
- CN202411328988.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-29
- Filing Date
- 2024-09-24
- Publication Date
- 2025-04-01
AI Technical Summary
The existing wafer storage container cleaning devices have shortcomings in terms of throughput and cleaning efficiency, which affects the production efficiency of semiconductor components.
A wafer storage container cleaning device including a cleaning tank and a conveying robot is designed. The cleaning tank is cleaned with the opening of the container main body facing downwards. The conveying robot holds the container main body and the door through the main body grasping part and the door holding part, and performs efficient cleaning and drying treatment.
It realizes efficient cleaning and drying of wafer storage containers, improves the throughput of the cleaning device, avoids the impact of contaminants on semiconductor components, and improves production efficiency.
Smart Images

Figure CN119733722A_ABST
Abstract
Description
Technical Field
[0001] An embodiment of the present invention relates to a wafer storage container cleaning apparatus. Background Art
[0002] As a semiconductor wafer storage container used in the manufacturing process of semiconductor wafers, a front opening unified pod (FOUP) is known. The FOUP is composed of a shell (FOUP body, container body) having an opening, and a door (opening and closing cover) installed in the opening of the shell. The inside of the shell is formed into a storage space where a plurality of shelves are formed to hold a plurality of wafers.
[0003] This type of FOUP is used to move semiconductor wafers that have undergone various processing steps (e.g., resist coating, exposure and development, etching (film formation), resist stripping, cleaning, etc.) to form semiconductor elements between processing steps. That is, when the semiconductor wafer moves between processing steps, it is transported while being held in the FOUP.
[0004] When a FOUP is used repeatedly, particles or chemical contaminants may sometimes adhere to the inner wall of the FOUP (the wall that divides the storage space for the wafers). When these contaminants adhere to the semiconductor wafers stored in the FOUP, there is a concern that the yield of the semiconductor elements will be reduced. Therefore, if the FOUP is used repeatedly several times, it is necessary to clean the FOUP in order to restore it to a clean state.
[0005] As a technology for cleaning FOUP, for example, a wafer storage container cleaning apparatus has been proposed, which cleans the shell and the door individually in one cleaning tank.
[0006] In addition, the transfer robot carries the shell and the door into the cleaning tank and carries the shell and the door out of the cleaning tank.
[0007] [Prior art literature]
[0008] [Patent Document]
[0009] [Patent Document 1] Japanese Patent Application Publication No. 2005-109523 Summary of the invention
[0010] [Problems to be solved by the invention]
[0011] In such a wafer storage container cleaning device, it is required to improve the throughput so as not to hinder the production efficiency of semiconductor devices. In addition, the same is true for a wafer storage container cleaning device that cleans wafer storage containers other than FOUP (for example, Front Opening Shipping Box (FOSB) etc.).
[0012] The present invention is made to solve the above-mentioned problems, and an object of the present invention is to provide a wafer storage container cleaning device that can efficiently clean a wafer storage container.
[0013] [Technical means to solve the problem]
[0014] In order to solve the above-mentioned problems and achieve the purpose, a wafer storage container cleaning device according to an embodiment of the present invention comprises: a cleaning tank for cleaning a wafer storage container, wherein the wafer storage container comprises: a container body and a door portion, wherein the container body forms a hexahedral shape, has an opening portion on one face, and has a gripped portion on another face intersecting with the face having the opening portion, and the door portion can be loaded and unloaded relative to the opening portion; and a transport robot comprising: a gripping mechanism for gripping the container body and the door portion individually, and moving the container body and the door portion individually into the cleaning tank, and moving the container body and the door portion individually out of the cleaning tank, wherein the gripping mechanism comprises: a main body gripping portion comprising: a pair of first gripping claws capable of approaching / separating movement along a first straight line, and using the pair of first gripping claws to grip the gripped portion; and a door gripping portion comprising: a pair of second gripping claws capable of approaching / separating movement along a second straight line intersecting with the first straight line when viewed from above, and using the pair of second gripping claws to grip the door portion. The cleaning tank cleans the container body in a state where the opening is facing downward.
[0015] [Effects of the Invention]
[0016] According to an embodiment of the present invention, a wafer storage container cleaning apparatus can be provided, which can efficiently clean a wafer storage container. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a plan view showing an example of a schematic structure of the wafer storage container cleaning apparatus according to the first embodiment.
[0018] Figure 2 It is a cross-sectional view taken along line XX of the wafer storage container cleaning apparatus according to the first embodiment.
[0019] Figure 3 It is a schematic diagram showing an example of the structure of the transfer robot according to the first embodiment.
[0020] Figure 4 This is a cross-sectional view showing an example of the internal structure of the robot hand according to the first embodiment.
[0021] Figure 5 yes Figure 4 YY line profile in .
[0022] Figure 6 This is a diagram showing an example of the base body according to the first embodiment.
[0023] Figure 7 This is a diagram showing an example of a state in which the robot hand according to the first embodiment grasps a flange.
[0024] Figure 8 This is a cross-sectional view showing an example of the internal structure of the robot hand according to the first embodiment.
[0025] Fig. 9 These are diagrams for explaining the door and the grip claw in the first embodiment and the second embodiment.
[0026] Fig.10 These are diagrams for explaining the door and the grip claw in the first embodiment and the second embodiment.
[0027] Fig.11 These are diagrams for explaining the door and the grip claw in the first embodiment and the second embodiment.
[0028] Fig.12 These are diagrams for explaining the door and the grip claw in the first embodiment and the second embodiment.
[0029] Fig.13 These are diagrams for explaining the door and the grip claw in the first embodiment and the second embodiment.
[0030] Fig.14 This is a diagram showing an example of a state in which a pair of gripping claws grip a door when a door has a protrusion on its outer peripheral surface.
[0031] Fig.15 It is a perspective view of a grip claw according to a modified example.
[0032] Fig.16 This is a diagram showing an example of a pair of gripping claws gripping a door.
[0033] Fig.17 This is a diagram showing an example of a pair of gripping claws gripping a door.
[0034] Fig.18 This is a diagram showing an example of a pair of gripping claws gripping a door.
[0035] Fig.19This is a diagram showing an example of a state in which a pair of gripping claws grip a door when a door has a protrusion on its outer peripheral surface.
[0036] [Explanation of Symbols]
[0037] 1: Transport robot
[0038] 1b: Robotic Hand
[0039] 2: Disassembly / connection station (buffer)
[0040] 3: Cleaning tank
[0041] 8: Control Department
[0042] 100: Wafer storage container cleaning device
[0043] 104: Container body grip
[0044] 105: Door handle DETAILED DESCRIPTION
[0045] Hereinafter, with reference to the accompanying drawings, the embodiment of the wafer storage container cleaning device disclosed in the present application is described in detail. In addition, the wafer storage container cleaning device disclosed in the present application is not limited to the following embodiments. In addition, each embodiment and each modification can be appropriately combined within the scope that does not cause contradiction. In addition, in this embodiment, the case where at least four processing tanks of the wafer storage container cleaning device are cleaning tanks (cleaning processing tanks) is cited as an example for description.
[0046] (First Embodiment)
[0047] Figure 1 It is a plan view showing an example of a schematic structure of the wafer storage container cleaning apparatus 100 according to the first embodiment. Figure 2 yes Figure 1 The wafer storage container cleaning device 100 is, for example, installed in a factory for manufacturing semiconductor wafers to clean the wafer storage container. Figure 1 and Figure 2 As shown, the chip storage container cleaning device 100 includes: a transfer robot 1, a decomposition / connection table (buffer) 2, a cleaning tank 3, a frame 6, a vacuum processing tank 7, a control unit 8, a first load / unload port 9a, a second load / unload port 9b, a third load / unload port 9c, and an input interface 10.
[0048] In addition, in the present embodiment, the wafer storage container 200 is, for example, a FOUP or a FOSB, and includes: a container body (shell) 201 and a cover (door) 202. The container body 201 forms a hexahedral shape. In addition, the container body 201 has a square opening on one face. In addition, the container body 201 has: a storage space for storing semiconductor wafers. The storage space exists at a position further inside than the opening and is connected to the opening. The door 202 can be disassembled / connected with the container body 201, and when connected to the container body 201, it is installed in a state that it can be opened and closed relative to the opening. In this way, the door 202 is formed in a square shape corresponding to the size of the opening of the container body 201, and can be loaded and unloaded relative to the opening. The door 202 is, for example, an example of a door. In addition, a flange 203 is provided on the container body 201. For example, the container body 201 has a flange 203 on another face that is orthogonal (intersecting) with the face having the opening. The flange 203 is a portion that is gripped (held) when the wafer storage container 200 is transported by an overhead hoist transport (OHT) or the transport robot 1, and is formed in a square plate shape. The flange 203 is, for example, an example of a gripped portion.
[0049] The transfer robot 1, the disassembling / connecting table 2, the cleaning tank 3, the maintenance area 4, the cover 5, the vacuum treatment tank 7, and the control unit 8 are arranged inside the housing 6. On the other hand, the first loading / unloading port 9a, the second loading / unloading port 9b, and the third loading / unloading port 9c are arranged across the inside and outside of the housing 6.
[0050] The first loading / unloading port 9 a loads the wafer storage container 200 to be cleaned, which is placed on the outside of the housing 6 at the first loading / unloading port 9 a , into the housing 6 .
[0051] For example, the wafer storage container 200 is placed outside the frame 6 of the first loading / unloading port 9a, and is transported while being held by the flange 203 by the OHT. Figure 1 As shown, the wafer storage container 200 is placed on the first loading / unloading port 9a so that the door 202 of the wafer storage container 200 faces the frame 6. When the wafer storage container 200 is placed on the first loading / unloading port 9a, the baffle provided at the opening 6a of the frame 6 rises. As a result, the wafer storage container 200 is placed in a state where it can be loaded into the frame 6 from the opening 6a. Then, the wafer storage container 200 is slid in the direction toward the inside by the sliding device of the first loading / unloading port 9a and loaded into the frame 6.
[0052] The first loading / unloading port 9 a carries out the cleaned and vacuum-dried wafer storage container 200 placed in the first loading / unloading port 9 a of the housing 6 by the transfer robot 1 to the outside of the housing 6 .
[0053] For example, after vacuum drying, the wafer storage container 200 formed by connecting the container body 201 and the door 202 on the decomposition / connection stage 2 is transported by the transport robot 1 and placed in the first loading / unloading port 9a of the housing 6. In this way, when the wafer storage container 200 is placed in the first loading / unloading port 9a, the shutter provided in the opening 6a of the housing 6 rises. As a result, the wafer storage container 200 is in a state where it can be carried out from the opening 6a to the outside of the housing 6. Then, the wafer storage container 200 is slid in the direction toward the outside by the sliding device of the first loading / unloading port 9a and is carried out to the outside of the housing 6.
[0054] The second loading / unloading port 9b can carry in and out the wafer storage container 200 through the opening 6b of the frame 6, similarly to the first loading / unloading port 9a. In addition, the third loading / unloading port 9c can also be configured to carry in and out the wafer storage container 200 through the opening 6c of the frame 6, similarly to the first loading / unloading port 9a.
[0055] The transfer robot 1 is a vertical multi-joint robot, and transfers the wafer storage container 200 to each unit while holding the flange 203 of the wafer storage container 200 . Figure 3 1 is a schematic diagram showing an example of the structure of the transfer robot 1 according to the first embodiment. Figure 2 and Figure 3 As shown, the transfer robot 1 includes a robot arm 1a, a robot hand 1b, a base 1c, a moving device 1d, and a wrist 1e. The transfer robot 1 transfers the wafer storage container 200 to each part by extending or rotating the robot arm 1a while the robot hand 1b provided at the front end of the robot arm 1a holds the flange 203 supported by the robot arm 1a supported by the base 1c.
[0056] The moving device 1d includes a servo motor and a ball screw mechanism (not shown) that can move the base portion 1c Figure 1 The movement within the shown movement region R3 is in the front-rear direction (the up-down direction in the figure).
[0057] like Figure 3 As shown in the example of FIG. 1 , the robot arm 1 a of the transfer robot 1 includes a rotation support member 1 a 1 , a first arm 1 a 2 , and a second arm 1 a 3 .
[0058] In a state where the rotation support member 1a1 is rotatable around an axis (vertical axis) 11 extending in the vertical direction, the lower end portion of the rotation support member 1a1 is supported by the upper portion of the base portion 1c. In addition, in a state where the first arm 1a2 is rotatable around an axis (horizontal axis) 12 extending in the horizontal direction, a portion on one end side of the first arm 1a2 is connected to a portion on the upper end side of the rotation support member 1a1. In addition, in a state where the second arm 1a3 is rotatable around a horizontal axis 13, a portion on one end side of the second arm 1a3 is connected to a portion on the other end side of the first arm 1a2. In addition, the wrist portion 1e is connected to a portion on the other end side of the second arm 1a3 in a state where it is rotatable around a horizontal axis 15. In addition, the robot hand 1b is connected to the front end portion of the wrist portion 1e in a state where it is rotatable around an axis 14 orthogonal to the horizontal axis 15. With the above-mentioned structure, the transport robot 1 can move the robot hand 1b to various positions.
[0059] In the disassembly / connection station 2, a disassembly process of disassembling the wafer storage container 200 into the container body 201 and the door 202 and a connection process of connecting the container body 201 and the door 202 are performed. A latch key is provided on the disassembly / connection station 2, and the disassembly process and the connection process of the wafer storage container 200 are performed by rotating the latch key while being inserted into the key hole formed in the door 202 of the wafer storage container 200. For example, the wafer storage container 200 carried into the interior of the frame 6 is transported to the disassembly / connection station 2 by the transport robot 1, and the disassembly process is performed on the disassembly / connection station 2. Then, the transport robot 1 carries the container body 201 and the door 202 into the cleaning tank 3 separately. In addition, when the temporary drying of the wafer storage container 200 in the cleaning tank 3 is completed, the transfer robot 1 individually carries out the container body 201 and the door 202 from the cleaning tank 3, and individually transfers the container body 201 and the door 202 to the vacuum processing tank 7. In addition, in the decomposition / connection station 2, the vacuum-dried container body 201 and the door 202 are transferred by the transfer robot 1, and the connection process is performed.
[0060] In the wafer storage container cleaning apparatus 100 of the present embodiment, the disassembling / joining stage 2 is provided on a plate-shaped support member disposed in the frame 6 at a position higher than the installation surface of the cleaning tank 3 or the vacuum processing tank 7 or the like.
[0061] The cleaning tank 3 is a tank for cleaning the wafer storage container 200. For example, the container body 201 and the door 202 are respectively transported to the cleaning tank 3 by the transport robot 1. Then, the cleaning tank 3 cleans the wafer storage container 200 while holding the container body 201 and the door 202. For example, Figure 2As shown, the cleaning tank 3 includes: a cleaning tank body 30a having an opening on the upper surface, an upper cover 30b capable of opening and closing the opening of the cleaning tank body 30a, and an upper cover opening and closing driving mechanism 30c for opening and closing the upper cover 30b. In the cleaning tank 3, the upper cover 30b holds the door 202, and the container body 201 is placed on a rotating table (not shown) provided on the cleaning tank body 30a. Then, in the cleaning tank 3, while the container body 201 and the door 202 are rotated by a rotating mechanism (not shown), the cleaning liquid (for example, pure water) is sprayed to the container body 201 and the door 202 respectively by a cleaning liquid nozzle, thereby cleaning the wafer storage container 200. In addition, in the interior of the cleaning tank 3, considering the discharge property of the cleaning liquid, the container body 201 is arranged in a manner that the opening of the container body 201 faces downward, but the orientation of the container body 201 is not limited to this.
[0062] After the cleaning of the wafer storage container 200 in the cleaning tank 3 is completed, the container body 201 and the door 202 in the cleaning tank 3 are rotated, and dry air is blown to the container body 201 and the door 202 to dry them. The drying in the cleaning tank 3 here is a process (temporary drying) to roughly dry the cleaning liquid attached to the wafer storage container 200. After the temporary drying of the wafer storage container 200 in the cleaning tank 3 is completed, the transfer robot 1 transfers the container body 201 and the door 202 in the cleaning tank 3 to the vacuum processing tank 7.
[0063] like Figure 1 As shown, the wafer container cleaning apparatus 100 has four cleaning tanks 3 , two of which are disposed in the first region R1 and two in the second region R2 .
[0064] The vacuum processing tank 7 is a tank for vacuum drying (main drying) the wafer storage container 200. For example, the vacuum processing tank 7 includes: a vacuum tank body, an opening and closing cover, a heater, and a decompression device that can evacuate the interior of the vacuum processing tank 7. When the container body 201 and the door 202 are moved into the interior of the vacuum tank body by the transfer robot 1 and the opening of the vacuum tank body is closed by the opening and closing cover, the vacuum processing tank 7 is evacuated by the decompression device and heated by the heater, thereby vacuum drying the container body 201 and the door 202.
[0065] The control unit 8 controls the overall operation of the wafer storage container cleaning apparatus 100. For example, the control unit 8 controls the transfer robot 1, the disassembling / connecting station 2, the cleaning tank 3, the vacuum processing tank 7, the first loading / unloading port 9a, the second loading / unloading port 9b, and the third loading / unloading port 9c, thereby causing the transfer robot 1, the disassembling / connecting station 2, the cleaning tank 3, the vacuum processing tank 7, the first loading / unloading port 9a, the second loading / unloading port 9b, and the third loading / unloading port 9c to operate as described above.
[0066] For example, the control unit 8 includes a central processing unit (CPU), a read only memory (ROM), a random access memory (RAM), a hard disk drive (HDD), and a communication interface, which are connected via an internal bus.
[0067] The CPU executes various processes while using the storage area of the RAM as a temporary storage area for data used in the various processes. The ROM and the HDD store programs for executing the various processes, various databases and tables used when executing the various processes, and the like.
[0068] The communication interface is an interface for communicating with the above-mentioned components of the wafer storage container cleaning apparatus 100 and communicating with an external device connected to the wafer storage container cleaning apparatus 100 via a network. For example, the communication interface is a network interface card.
[0069] The input interface 10 receives input operations of various instructions and various information from the operator P. Specifically, the input interface 10 is connected to the control unit 8, and transmits the input operations received from the operator P to the control unit 8. For example, the input interface 10 is a mouse, a keyboard, a touch panel, or the like.
[0070] Next, an example of the robot hand 1 b according to the present embodiment will be described. Figure 4 This is a cross-sectional view showing an example of the internal structure of the robot hand 1 b according to the first embodiment. Figure 5 yes Figure 4 YY line profile in .
[0071] like Figure 4 and Figure 5As shown, the robot hand 1b includes: a base 90, a gripping portion driving mechanism 101, a container body gripping portion 104, and a door gripping portion 105. The gripping portion driving mechanism 101, the container body gripping portion 104, and the door gripping portion 105 are respectively arranged on the base 90. In this embodiment, the robot hand 1b grips the container body 201 and the door 202 separately. The robot hand 1b is, for example, an example of a gripping mechanism.
[0072] The container body holding part 104 holds the square flange 203 of the container body 201. The container body holding part 104 includes: a pair of holding claws 104a1, 104b1, and a pair of arm blocks 104a, 104b. The holding claw 104a1 is provided at one end of the arm block 104a, and the holding claw 104b1 is provided at one end of the arm block 104b. The container body holding part 104 uses the pair of holding claws 104a1, 104b1 to hold the flange 203. Specifically, the pair of holding claws 104a1, 104b1 holds the flange 203 by clamping the flange 203. The holding claws 104a1 and the holding claws 104b1 are formed, for example, to have substantially the same length as the side of the flange 203 that is to be held. The container body holding part 104 is, for example, an example of a main body holding part.
[0073] The door holding part 105 holds the square door 202 which is larger than the flange 203. The door holding part 105 includes: a pair of holding claws 105a1, 105b1 and a pair of arm blocks 105a, 105b. The holding claw 105a1 is provided at one end of the arm block 105a, and the holding claw 105b1 is provided at one end of the arm block 105b. The door holding part 105 uses the pair of holding claws 105a1, 105b1 to hold the door 202. Specifically, the pair of holding claws 105a1, 105b1 holds the door 202 by clamping the door 202. The holding claws 105a1, 105b1, for example, only hold the central part of the door 202, and are formed to be shorter in length than the holding claws 104a1, 104b1. Furthermore, since the pair of grip claws 105a1 and 105b1 can grip the rectangular door 202 which is larger than the flange 203, the distance between the pair of grip claws 105a1 and 105b1 is wider than the distance between the pair of grip claws 104a1 and 104b1.
[0074] The base body 90 is provided with a gripper driving mechanism 101 . Figure 6 FIG. 1 is a diagram showing an example of the base body 90 according to the first embodiment. Figure 6As shown, the base 90 is formed in a shape (convex shape) having a cutout 90a formed by cutting out two adjacent corners of a square in a plan view. For example, if the container body 201 is transported to the disassembly / connection table 2 in a direction in which the cutout 90a is located at the lower side, the robot hand 1b can be prevented from interfering with the disassembly / connection table 2. In addition, the robot hand 1b is not limited to the case of transporting the container body 201 to the disassembly / connection table 2. When the container body 201 is placed (carried in) in the cleaning tank 3 or taken out (carried out) from the cleaning tank 3, the robot hand 1b can also be prevented from interfering with the cleaning tank 3.
[0075] The gripping portion driving mechanism 101 drives the container body gripping portion 104 so that the container body gripping portion 104 grips the flange 203 of the container body 201, or drives the door gripping portion 105 so that the door gripping portion 105 grips the door 202. The gripping portion driving mechanism 101 includes: a linear guide 102a, a linear guide 102b, a linear guide 103a, a linear guide 103b, a support shaft 115, a rotating member 116, four connecting members 106a, 106b, 107a, 107b, a cylinder 110, a rod portion 111, and a connecting portion 112.
[0076] Each of the linear guides 102a and 102b supports each of the arm blocks 104a and 104b so that each of the arm blocks 104a and 104b can move toward or away from each other along the first straight line L1 as an imaginary line. Thus, a pair of gripping claws 104a1 and 104b1 provided on the two arm blocks 104a and 104b can move toward or away from each other as indicated by the double arrow L11. In this way, the linear guides 102a and 102b support a pair of gripping claws 104a1 and 104b1 so that they can move in the direction along the first straight line L1. The linear guides 102a and 102b are, for example, an example of a first guide member. In addition, the gripping claws 104a1 and 104b1 are, for example, an example of a first gripping claw.
[0077] Each of the linear guides 103a and 103b supports each of the arm blocks 105a and 105b so that each of the arm blocks 105a and 105b can move toward or away from each other along the imaginary line orthogonal to the first straight line L1 when viewed from above, that is, the second straight line L2. As a result, a pair of gripping claws 105a1 and 105b1 provided on the two arm blocks 105a and 105b can move toward or away from each other as indicated by the double arrow L21. In this way, the linear guides 103a and 103b support the pair of gripping claws 105a1 and 105b1 so that they can move in the direction along the second straight line L2. The linear guides 103a and 103b are, for example, an example of a second guide member. In addition, the gripping claws 105a1 and 105b1 are, for example, an example of a second gripping claw.
[0078] Furthermore, although the second straight line L2 is orthogonal to the first straight line L1 in a plan view, the present invention is not limited to the case where the second straight line L2 is orthogonal to the first straight line L1 in a plan view, and the second straight line L2 may intersect the first straight line L1 in a plan view.
[0079] Here, if Figure 5 As shown, in this embodiment, in a plan view, the first straight line L1 and the second straight line L2 intersect on the support shaft 115. Therefore, the container body grip 104 and the door grip 105 are arranged in a relationship of intersecting with the support shaft 115 as the center.
[0080] The air cylinder 110 is controlled by the control unit 8 to drive the rod portion 111 forward and backward (reciprocating) along the second straight line L2. As a result, the rod portion 111 moves in two directions indicated by the double arrow 111a along the second straight line L2. In addition, the direction along the second straight line L2, the two directions indicated by the double arrow L21, and the two directions indicated by the double arrow 111a are parallel.
[0081] The connecting portion 112 is a member connecting the rod portion 111 and the arm block 105a. Since the rod portion 111 is connected to the arm block 105a via the connecting portion 112, when the rod portion 111 moves as described above, the arm block 105a moves in the direction along the second straight line L2 in conjunction with the movement of the rod portion 111.
[0082] The support shaft 115 is a shaft that is disposed approximately in the center of the base 90, at a position P where the first straight line L1 and the second straight line L2 intersect when viewed from above, and extends in a direction orthogonal to the first straight line L1 and the second straight line L2. The rotating member 116 is supported on the support shaft 115 in a manner that allows it to rotate around the support shaft 115. That is, when viewed from above, the position P coincides with the rotation center C. In this way, the rotating member 116 is rotatably disposed at a position P where the first straight line L1 and the second straight line L2 intersect when viewed from above, with the support shaft 115 orthogonal to the two straight lines L1 and the second straight line L2 as the center. The support shaft 115 is, for example, an example of a shaft. In addition, in the present embodiment, the rotating member 116 is a disc-shaped member, but may also be a member of other shapes.
[0083] Four (plural) connecting members 106a, 106b, 107a, 107b connect each of the pair of gripping claws 104a1, 104b1 and each of the pair of gripping claws 105a1, 105b1 to the rotating member 116 in a rotatable state. Specifically, a portion 106a1 on one end side of the connecting member 106a is rotatably connected to the rotating member 116, and a portion 106a2 on the other end side of the connecting member 106a is rotatably connected to the arm block 104a. In addition, a portion 106b1 on one end side of the connecting member 106b is rotatably connected to the rotating member 116, and a portion 106b2 on the other end side of the connecting member 106b is rotatably connected to the arm block 104b.
[0084] A portion 107a1 on one end side of the connecting member 107a is rotatably connected to the rotating member 116, and a portion 107a2 on the other end side of the connecting member 107a is rotatably connected to the arm block 105a. In addition, a portion 107b1 on one end side of the connecting member 107b is rotatably connected to the rotating member 116, and a portion 107b2 on the other end side of the connecting member 107b is rotatably connected to the arm block 105b.
[0085] The positions of the pair of end portions 106a1, 106b1 on the rotating member 116 side of the pair of connecting members 106a, 106b connected to the pair of grip claws 104a1, 104b1 are symmetrical with respect to the rotation center C of the rotating member 116. In addition, the positions of the pair of end portions 107a1, 107b1 on the rotating member 116 side of the pair of connecting members 107a, 107b connected to the pair of grip claws 105a1, 105b1 are symmetrical with respect to the rotation center C of the rotating member 116.
[0086] In addition, in this embodiment, the distance between the end 106a1 of the connecting member 106a and the rotation center C, the distance between the end 106b1 of the connecting member 106b and the rotation center C, the distance between the end 107a1 of the connecting member 107a and the rotation center C, and the distance between the end 107b1 of the connecting member 107b and the rotation center C are the same.
[0087] From these contents, in the first embodiment, the stroke (opening and closing amount, movement amount) of the pair of gripping claws 104a1 and 104b1 is the same as the stroke of the pair of gripping claws 105a1 and 105b1.
[0088] Next, an example of the operation of the gripping unit driving mechanism 101 when the container body gripping unit 104 grips the flange 203 of the container body 201 or the door gripping unit 105 grips the door 202 will be described. For example, the control unit 8 controls the transport robot 1 so that the transport robot 1 approaches the flange 203 or the door 202 until the robot hand 1b can grip the flange 203 or the door 202. As a result, the robot hand 1b approaches the flange 203 or the door 202 until the robot hand 1b can grip the flange 203 or the door 202.
[0089] Then, the control unit 8 Figure 5 In the state shown in FIG. 1 , the air cylinder 110 is controlled so that the rod portion 111 is retracted toward the air cylinder 110. Thus, the rod portion 111 is moved in one of the two directions indicated by the double arrow 111a along the second straight line L2. Figure 5 By the movement of the rod portion 111, the arm block 105a moves in a manner along the second straight line L2 in conjunction with the movement of the rod portion 111. Figure 5 Move in the middle right direction (the direction close to the support shaft 115).
[0090] When the arm block 105a moves Figure 5 When moving in the right direction, the rotating member 116 connected to the arm block 105a by the connecting member 107a moves in the Figure 5When the rotating member 116 rotates clockwise, the arm blocks 104a, 104b, and 105b connected by the connecting member 106a, the connecting member 106b, and the connecting member 107b respectively move in a direction close to the support shaft 115. In the above case, the pair of arm blocks 104a and 104b move in a close manner. In addition, the pair of arm blocks 105a and 105b also move in a close manner. When the pair of arm blocks 104a and 104b move in a close manner, the pair of gripping claws 104a1 and 104b1 move in a close manner along with the movement of the pair of arm blocks 104a and 104b. Similarly, the pair of gripping claws 105a1 and 105b1 also move in a close manner. Furthermore, the pair of holding claws 104 a 1 , 104 b 1 holds the flange 203 by sandwiching the flange 203 , or the pair of holding claws 105 a 1 , 105 b 1 holds the door 202 by sandwiching the door 202 .
[0091] When the container body gripping portion 104 gripping the flange 203 of the container body 201 releases the flange 203, or the door gripping portion 105 gripping the door 202 releases the door 202, the gripping portion driving mechanism 101 only needs to perform an action opposite to the above action. For example, the control unit 8 controls the cylinder 110 so that the rod portion 111 protrudes from the cylinder 110 (to restore to the position at which the rod 111 is protruded). Figure 5 Thus, the rod portion 111 moves along the second straight line L2 in one of the two directions indicated by the double arrow 111a. Figure 5 The arm block 105a moves to the left (away from the support shaft 115). Figure 5 Move center-left.
[0092] When the arm block 105a moves Figure 5 When the arm block 105a moves in the middle left direction, the rotating member 116 moves in the middle left direction. Figure 5 When the rotating member 116 rotates counterclockwise, the arm block 104a, the arm block 104b, and the arm block 105b also move in a direction away from the support shaft 115. In the case described above, the pair of arm blocks 104a and 104b move in a separated manner. In addition, the pair of arm blocks 105a and 105b also move in a separated manner. When the pair of arm blocks 104a and 104b move in a separated manner, the pair of holding claws 104a1 and 104b1 move in a separated manner along with the movement of the pair of arm blocks 104a and 104b. Similarly, the pair of holding claws 105a1 and 105b1 also move in a separated manner. As a result, the pair of holding claws 104a1 and 104b1 release the flange 203, or the pair of holding claws 105a1 and 105b1 release the door 202.
[0093] As described above, the air cylinder 110 moves one of the pair of gripping claws 104a1, 104b1 and the pair of gripping claws 105a1, 105b1, thereby moving all of the pair of gripping claws 104a1, 104b1 and the pair of gripping claws 105a1, 105b1. In addition, the gripping claw moved by the air cylinder 110 is not limited to the gripping claw 105a1, and may be other gripping claws 104a1, gripping claw 104b1, gripping claw 105b1. The air cylinder 110 is, for example, an example of a moving member.
[0094] Figure 7 2 is a diagram showing an example of a state in which the robot hand 1b of the first embodiment grasps the flange 203. Figure 7 In the example of FIG. 1 , a case is shown in which a pair of grip claws 104 a 1 and 104 b 1 grip the flange 203 by clamping the flange 203 in the up-down direction (vertical direction).
[0095] Here, when the pair of gripping claws 104a1 and 104b1 grip the flange 203 by clamping the flange 203 in the horizontal direction, there is a concern that the flange 203 may slip off the pair of gripping claws 104a1 and 104b1. Therefore, the pair of gripping claws 104a1 and 104b1 are required to clamp the flange 203 with a relatively strong force. On the other hand, when the pair of gripping claws 104a1 and 104b1 grip the flange 203 by clamping the flange 203 in the vertical direction, the lower gripping claw (in the pair of gripping claws 104a1 and 104b1) Figure 7 In the example of FIG. 1 , the flange 203 is supported by the gripping claw 104b1. Therefore, the magnitude of the force required when the pair of gripping claws 104a1 and 104b1 clamp the flange 203 in the vertical direction can be smaller than the magnitude of the force required when the flange 203 is clamped in the horizontal direction. Therefore, when the pair of gripping claws 104a1 and 104b1 clamp the flange 203 in the vertical direction, the force applied to the flange 203 can be reduced, thereby suppressing damage to the flange 203 and the gripping claws 104a1 and 104b1. In addition, the cylinder 110 can be miniaturized according to the force that can be reduced to clamp the flange 203, thereby achieving lightweight robot hand 1b.
[0096] Therefore, when the conveying robot 1 carries the container body 201 into the cleaning tank 3, the control unit 8 controls the conveying robot 1 to carry the container body 201 into the cleaning tank 3 with the opening facing downward while maintaining a pair of first holding claws 104a1 and 104b1 holding the flange 203 from above and below.
[0097] In addition, the case where the transport robot 1 carries out the container body 201 from the cleaning tank 3 will be described. In the case described above, the container body 201 is placed in the cleaning tank 3 with the opening facing downward. Therefore, the control unit 8 may control the transport robot 1 to carry out the container body 201 from the cleaning tank 3 with the opening facing downward while the pair of first gripping claws 104a1 and 104b1 grip the flange 203 from above and below.
[0098] As described above, in the wafer storage container cleaning apparatus 100 of the first embodiment, the robot hand 1b as the gripping mechanism is configured such that the container body gripping portion 104 and the door gripping portion 105 are arranged so that the approach / separation direction (the direction along the first straight line L1) of the pair of gripping claws 104a1, 104b1 of the container body gripping portion 104 and the approach / separation direction (the direction along the second straight line L2) of the pair of gripping claws 105a1, 105b1 of the door gripping portion 105 are orthogonal in a plan view. With such a configuration, in the wafer storage container cleaning apparatus 100 of the first embodiment, the effect of efficiently cleaning the wafer storage container is achieved for the following reasons.
[0099] As described above, inside the cleaning tank 3, the opening of the container body 201 is Figure 7 In other words, the container body 201 is arranged with the flange 203 facing the side. However, the container body 201 (wafer storage container 200) is carried into the wafer storage container cleaning apparatus 100 with the opening facing the side, that is, with the flange 203 facing upward. Therefore, in order to move the container body 201 in and out of the cleaning tank 3, it is necessary to rotate the wrist 1e of the robot arm 1a by 90 degrees to change the direction of the container body 201.
[0100] Here, consider the case of a robot hand including a container body gripping part 104 and a door gripping part 105, wherein the container body gripping part 104 and the door gripping part 105 are configured such that the gripping claws 104a1, 104b1 and the gripping claws 105a1, 105b1 of the door gripping part 105 are arranged on a straight line and approach / separate in the same direction. In the case of such a robot hand, Figure 7Similarly, when the flange 203 is gripped in a direction perpendicular to the horizontal axis 15, that is, in the vertical direction, one of the gripping claws (located on the lower side) of the door gripping portion 105 protrudes to a position lower than the opening of the container body 201. Therefore, when the container body 201 is placed with the opening facing downward, or when the container body 201 is held with the opening facing downward, there is a concern that the gripping claws of the door gripping portion 105 may interfere with the loading table inside the washing tank 3. Therefore, in the robot hand of such a structure, the flange 203 cannot be gripped in the vertical direction, and needs to be gripped in a direction parallel to the horizontal axis 15, that is, in the horizontal direction.
[0101] Therefore, let's consider a case where the robot hand with the above structure grips the flange 203 from the side, rotates the wrist 1e by 90°, and changes the orientation of the container body 201 by 90°. During the rotation, a force in the twisting direction (swinging direction) corresponding to the inertial force of the container body 201 acts on the container body gripping part (the arm block or linear guide as its component) 104. The movable part such as the linear guide has a small gap to enable movement. As the gap is used, it gradually expands, causing undesirable conditions such as shaking, that is, degradation. When such a movable part is repeatedly subjected to the above force, it deteriorates faster than in the case where it is not. That is, the life is shortened. Therefore, in the robot hand with such a structure, in order to prevent the life of the container body gripping part 104 from being shortened, the rotation speed of the wrist 1e that changes the orientation of the container body 201 has to be suppressed. As a result, the time required to change the orientation of the container body 201 becomes longer, and accordingly, the time required to clean the wafer storage container 200 becomes longer, and the cleaning efficiency decreases. If the linear guides 102a and 102b are replaced with sufficiently wide members or multiple members are arranged in parallel, it is possible to suppress the reduction in life even if the rotation speed is increased. However, the weight of the container body gripping portion 104, that is, the weight of the portion rotated 90 degrees, becomes heavier, thereby hindering the increase in the rotation speed, and still cannot be expected to improve the efficiency.
[0102] In contrast, according to the robot hand 1b of the first embodiment, as shown in FIG. Figure 7 As shown, the flange 203 can be gripped in the direction perpendicular to the horizontal axis, that is, in the up-down direction. Therefore, it is possible to suppress the force in the twisting direction (swinging direction) acting on the container body gripping portion 104 (the arm block 104a, the arm block 104b, the linear guide 102a, and the linear guide 102b as its constituent members). Therefore, the above-mentioned inconvenience on the movable parts such as the linear guide 102a and the linear guide 102b can be eliminated. As a result, the operation of changing the orientation of the container body 201 can be performed quickly, so that the wafer storage container 200 can be cleaned efficiently.
[0103] In addition, according to the wafer storage container cleaning device 100 of the first embodiment, the container body holding part 104 holding the container body 201 and the door holding part 105 holding the door 202 can be driven by the common holding part driving mechanism 101, thereby simplifying the structure and reducing the manufacturing cost.
[0104] (Second Embodiment)
[0105] As described above, in the first embodiment, the case where the four distances, namely, the distance between the end 106a1 of the connecting member 106a and the rotation center C, the distance between the end 106b1 of the connecting member 106b and the rotation center C, the distance between the end 107a1 of the connecting member 107a and the rotation center C, and the distance between the end 107b1 of the connecting member 107b and the rotation center C, are the same is described. However, the two distances, namely, the distance between the end 106a1 and the rotation center C and the distance between the end 106b1 and the rotation center C, and the two distances, namely, the distance between the end 107a1 and the rotation center C and the distance between the end 107b1 and the rotation center C, may be different. That is, the stroke of the pair of gripping claws 104a1, 104b1 and the stroke of the pair of gripping claws 105a1, 105b1 may be different. Therefore, such an embodiment is described as the wafer storage container cleaning apparatus of the second embodiment. Hereinafter, in the description of the second embodiment, differences from the first embodiment will be mainly described, and description of the same configuration as that of the first embodiment may be omitted.
[0106] Figure 8 1 is a cross-sectional view showing an example of the internal structure of the robot hand of the second embodiment. In the second embodiment, the distance between the end 106a1 and the rotation center C and the distance between the end 106b1 and the rotation center C are designed to be different from the distance between the end 107a1 and the rotation center C and the distance between the end 107b1 and the rotation center C.
[0107] like Figure 8 As shown, the distance between the end 106a1 and the rotation center C and the distance between the end 106b1 and the rotation center C are "D1". On the other hand, the distance between the end 107a1 and the rotation center C and the distance between the end 107b1 and the rotation center C are "D2". In addition, the distance "D2" is longer than the distance "D1".
[0108] With this structure, even with a single drive source (cylinder 110), two groups of gripping claws (a group of gripping claws 104a1, 104b1 and a group of gripping claws 105a1, 105b1) can be opened and closed with different strokes in different directions (orthogonal directions) by the gripping portion drive mechanism 101. For example, the size of the flange 203 of the container body 201 is standardized and is substantially the same regardless of the type (manufacturer type) of the wafer storage container 200. In contrast, the outer dimensions of the door 202 are not standardized, and there is a tendency that the outer dimensions and shape vary depending on the type of the wafer storage container 200.
[0109] In this case, in the equipment where different types of wafer storage containers 200 are mixed, it is necessary to provide a driving mechanism for the container body gripping portion 104 and a driving mechanism for the door gripping portion 105 separately, or to use a single driving mechanism to make the stroke of the pair of gripping claws 104a1, 104b1 and the stroke of the pair of gripping claws 105a1, 105b1 significantly increase in accordance with each other. However, in the case of providing separate driving mechanisms, the structure becomes complicated and the manufacturing cost increases. In addition, in the case of using a single driving mechanism to make the stroke of the pair of gripping claws 104a1, 104b1 and the stroke of the pair of gripping claws 105a1, 105b1 significantly increase in accordance with each other, it takes extra time to open and close the pair of gripping claws 104a1, 104b1, so the efficiency decreases.
[0110] However, in the second embodiment, this is not necessary, and only the stroke of the pair of gripping claws 105a1 and 105b1 of the door gripping portion 105 can be increased. Therefore, the opening and closing of the pair of gripping claws 104a1 and 104b1 does not require extra time. Therefore, according to the wafer storage container cleaning apparatus of the second embodiment, the cleaning process can be performed more efficiently.
[0111] (Other Modifications)
[0112] Here, the door 202 and the grip claws 105a1 and 105b1 in the above-described embodiments will be described. Figures 9 to 13 1 is a diagram for explaining the door 202 and the gripping claws 105a1 and 105b1 in the first embodiment and the second embodiment. Fig. 9 As shown, the pair of holding claws 105 a 1 , 105 b 1 holds the door 202 by sandwiching the door 202 .
[0113] Fig.10 105a1 and 105b1 are three-dimensional diagrams of the gripping claws 105a1 and 105b1. Fig.10As shown, the grip claws 105a1 and 105b1 have a substantially U-shaped shape. The central portion of the grip claws 105a1 and 105b1, which is equivalent to the bottom of the U, is a flat surface. In addition, in a state where the central portion surface of the grip claw 105a1 and the central portion surface of the grip claw 105b1 abut against the outer peripheral surface of the door 202, the pair of grip claws 105a1 and 105b1 hold the door 202 by clamping the door 202. Figure 11 to Figure 13 yes Fig. 9 The enlarged view within the dashed frame 300. Fig.11 As shown in the figure, there is no protrusion on the outer peripheral surface of the door 202, and there are also cases where the protrusion does not exist depending on the type of the wafer storage container 200. Fig.12 , Fig.13 As shown, the outer peripheral surface of the door 202 has protrusions 202a and 202b. Fig.14 1 is a diagram showing an example of a state in which a pair of grip claws 105a1 and 105b1 grip the door 202 when there is a protrusion on the outer peripheral surface of the door 202. Fig.14 In FIG. 1 , the black dots indicate that the grip claws 105a1 and 105b1 are in contact with the door 202 at one point. Fig.14 In the example of FIG. 1 , a pair of grip claws 105a1 and 105b1 are in contact with the door 202 at two points. This may occur when the central portion of the grip claws 105a1 and 105b1 is a flat surface, and the outer peripheral surface of the door 202 may have undulations due to deviations in processing accuracy, etc., and the protruding portion (protrusion) is positioned opposite to the two grip claws 105a1 and 105b1. In such a case, the gripping of the door 202 is unstable, and the door 202 is offset relative to the grip claws 105a1 and 105b1.
[0114] Therefore, it is also possible to use the grip claws 105a1 and 105b1 instead of the grip claws 105a1 and 105b1. Fig.15 The holding claws 205a1 and 205b1 shown are used to hold the door 202 stably even when there are protrusions on the outer peripheral surface of the door 202. Fig.15 It is a perspective view of the grip claw 205a1 and the grip claw 205b1 of a modified example.
[0115] like Fig.15 As shown, the grip claws 205 a 1 and 205 b 1 include a first member 211 , a second member 212 , an elastic body 213 , and a third member 214 .
[0116] The first member 211 is a flat plate-shaped member, and is a square plate-shaped member including four sides in a plan view (top view).
[0117] On the surface of the first member 211, a pair of second members 212 and a third member 214 in the shape of square plates are arranged in a manner that they stand up from the three sides thereof. The pair of second members 212 are arranged facing each other, and the third member 214 is arranged in a manner that it is clamped by the pair of second members 212. Such a pair of second members 212 and third members 214 are U-shaped when viewed from above (from a state observed from the direction facing the surface of the first member 211). The second member 212 is formed with a recess 212b at the upper end portion (the end portion on the opposite side to the first member 211 side) 212a. In addition, protrusions 212c are formed at both ends of the upper end portion 212a. The side surface of the central portion side of the upper end portion 212a in the protrusion 212c is formed as an inclined surface 212c1 inclined toward the central portion side. The inclined surface 212c1 functions as a guide when the grip claws 205a1 and 205b1 grip the door 202. In addition, an elastic body 213 having a width the same as that of the second member 212 and having a substantially cubic shape is provided in the recess 212b. The upper end surface 213b of the elastic body 213 is formed in such a way as to be flush with a plane 212d connected to the base end of the recess 212b (a plane connected to the base end of the protrusion 212c). In addition, a groove 213a is formed at the end of the elastic body 213 on the opposite side to the third member 214. The groove 213a is provided in order to accommodate a convex protrusion when a convex protrusion is formed on the outer periphery of the door 202, and to clamp the front end of the protrusion with the bottom of the groove 213a.
[0118] The third member 214 includes: a convex stripe 214a continuous with the protrusion 212c of the second member 212, and a plane 214b continuous with the plane 212d of the second member 212. In addition, as long as either the convex stripe 214a or the protrusion 212c on the third member 214 side of the second member 212 is included, the guiding function can be performed, so the other can be omitted. Such first to third members 211, 212, 214 can be configured separately or integrally.
[0119] In addition, grooves 213 a for contacting with protrusions on the outer peripheral surface of the door 202 are formed in the grip claws 205 a 1 and 205 b 1 .
[0120] Figure 16 to Figure 18 2 is a diagram showing various examples of a pair of gripping claws 205a1, 205b1 gripping the door 202. Fig.16 As shown, when the outer peripheral surface of the door 202 is flat and has no protrusions, in one holding claw (holding claw 205a1 or holding claw 205b1), the upper end surfaces 213b (refer to Fig.15 ) is in close contact with the door 202 so as to prevent the door 202 from being misaligned. Fig.17 , Fig.18As shown, when the outer peripheral surface of the door 202 has protrusions 202a and 202b, in one gripping claw (gripping claw 205a1 or gripping claw 205b1), two grooves 213a contact the protrusions 202a and 202b at two points to prevent the door 202 from being misaligned. Fig.17 An example of a protrusion 202a having a square cross-sectional shape is shown. Fig.18 An example of the protrusion 202b having a triangular cross-sectional shape is shown. Fig.19 2 is a diagram showing an example of a situation where a pair of gripping claws 205a1 and 205b1 grip the door 202 when the outer peripheral surface of the door 202 has a protrusion. Fig.19 In the example of FIG. 1 , two black dots indicate the positions where the grip claw 205a1 contacts the protrusion of the door 202 at two points. Fig.19 In the example of FIG. 1 , a black dot indicates a position where the grip claw 205b1 contacts the protrusion of the door 202 at one point. In this case, the pair of grip claws 205a1, 205b1 contacts the door 202 at three points, so that the grip of the door 202 is stable and the displacement of the door 202 relative to the grip claws 205a1, 205b1 can be suppressed.
[0121] In addition, as described above, the outer periphery of the door 202 may have fluctuations due to deviations in processing accuracy, etc., but in the gripping claws 205a1 and 205b1 of this modified example, an elastic body 213 is provided at the contact portion with the door 202, so that fluctuations of a certain size can be absorbed by the deformation of the elastic body 213, so that the gripping claws 205a1 and 205b1 can stably grip the door 202 at a total of four points, two points each. Fig.19 The holding state shown is a case where there are undulations (protrusions) in the held area on the periphery of the door 202 that cannot be completely absorbed by the deformation of the elastic body 213. However, in the holding claws 205a1 and 205b1 of this modified example, the elastic body 213 that abuts against the door 202 is arranged at two separate locations. Therefore, even in the presence of the undulations, any one of the elastic bodies 213 can be reliably abutted against the door 202. Therefore, as long as there are no similar undulations in another held area, the door 202 can be reliably held at a total of three points by a pair of holding claws 205a1 and 205b1.
[0122] Furthermore, in the first embodiment, the case where the wafer storage container cleaning apparatus 100 has four cleaning tanks 3 has been described. However, the embodiment is not limited thereto, and the wafer storage container cleaning apparatus 100 may have five or more cleaning tanks.
[0123] In the first embodiment, the case where the wafer storage container cleaning device 100 has four cleaning tanks 3 and two vacuum processing tanks 7 is described. However, the embodiment is not limited to this, and at least four processing tanks may be vacuum processing tanks 7. That is, the wafer storage container cleaning device 100 may also have at least four vacuum processing tanks 7, and the vacuum processing tanks 7 are provided at the positions where the cleaning tanks 3 are provided in the first embodiment. In the above case, the wafer storage container cleaning device 100 may also have two cleaning tanks 3, and the cleaning tanks 3 are provided at the positions where the vacuum processing tanks 7 are provided in the first embodiment.
Claims
1. A wafer storage container cleaning device, characterized in that: include: A cleaning tank for cleaning a wafer storage container, the wafer storage container comprising: a container body and a door portion, wherein the container body is formed in a hexahedral shape, has an opening portion on one face, and has a gripping portion on another face intersecting the face having the opening portion, and the door portion is attachable and detachable relative to the opening portion; and The transport robot includes: a holding mechanism for individually holding the container body and the door portion, individually carrying the container body and the door portion into the cleaning tank, and individually carrying the container body and the door portion out of the cleaning tank, Wherein, the holding mechanism comprises: a main body gripping portion having: a pair of first gripping claws capable of approaching / separating movements along a first straight line, and gripping the gripped portion using the pair of first gripping claws; and The door gripping portion includes a pair of second gripping claws that can move toward and away from each other along a second straight line intersecting the first straight line when viewed from above, and the door portion is gripped using the pair of second gripping claws. The cleaning tank cleans the container body in a state where the opening is facing downward.
2. The wafer storage container cleaning device according to claim 1, characterized in that: Also includes: A rotating member is rotatably disposed at a position where the first straight line and the second straight line intersect when viewed from above, with an axis perpendicular to the first straight line and the second straight line as a center; a first guide member supporting the pair of first gripping claws so as to be movable in a direction along the first straight line; a second guide member supporting the pair of the second gripping claws so as to be movable in a direction along the second straight line; a plurality of connecting members, connecting each of the pair of the first gripping claws and each of the pair of the second gripping claws to the rotating member, respectively; as well as The moving means moves all of the pair of first gripping claws and the pair of second gripping claws by moving any one of the pair of first gripping claws and the pair of second gripping claws.
3. The wafer storage container cleaning device according to claim 2, characterized in that: A pair of end portions on the rotating member side of the pair of connecting members connected to the pair of first gripping claws are rotatably connected to the rotating member at positions symmetrical with respect to the rotation center of the rotating member; A pair of end portions on the rotating member side of the pair of connecting members connected to the pair of second grip claws are rotatably connected to the rotating member at positions symmetrical with respect to the rotation center of the rotating member.
4. The wafer storage container cleaning device according to claim 3, characterized in that: A first distance between a position where a pair of end portions on the rotating member side of a pair of connecting members connected to the pair of first gripping claws are connected to the rotating member and the rotation center is different from a second distance between a position where a pair of end portions on the rotating member side of a pair of connecting members connected to the pair of second gripping claws are connected to the rotating member and the rotation center.
5. The wafer storage container cleaning device according to claim 4, characterized in that: The second distance is longer than the first distance.
6. The wafer storage container cleaning device according to claim 1, characterized in that: Also includes: The control unit controls the conveying robot when the container body is placed in the cleaning tank with the opening facing downward, so as to carry out the container body from the cleaning tank with the opening facing downward while the pair of first holding claws hold the held portion from above and below.
7. The wafer storage container cleaning device according to claim 1, characterized in that: Also includes: The control unit controls the transfer robot to transfer the container body into the cleaning tank in a state where the pair of first gripping claws grip the gripped portion from above and below and with the opening facing downward.
8. The wafer storage container cleaning device according to claim 1, characterized in that: The second gripping claw comprises: A first member having a rectangular shape; a second member extending in a manner of standing up from one side of the first member and a side facing the one side, and having a recess formed at an end portion on the opposite side to the first member side; and An elastic body is disposed in the recess formed in the second member, and the elastic body is formed with a groove.
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