Beryllium copper alloy powder and preparation method thereof

Abstract

The present invention provides a beryllium copper alloy powder and a preparation method thereof. The preparation method may include: heating and melting a raw material containing beryllium copper under a protective atmosphere; under the protective atmosphere, spreading the raw material liquid formed after melting on the end face of a centrifugal atomizer to form a liquid film, rotating the end face to atomize and break the liquid film into mist-like liquid beads, and obtaining beryllium copper alloy powder after the mist-like liquid beads are cooled. In the beryllium copper alloy powder prepared by the preparation method of the present invention, there are fewer hollow powders and satellite powders, concentrated particle size distribution, good sphericity, good fluidity, low manufacturing cost, high continuous production efficiency, and the alloy powder particle size of 15μm to 63μm accounts for more than 70%, which is suitable for 3D printing purposes and meets the quality requirements of the additive manufacturing process for raw material powder.

Description

Technical Field

[0001] The present invention belongs to the technical field of metal additive manufacturing, and more specifically, relates to a beryllium copper alloy powder and a preparation method thereof. Background Art

[0002] Beryllium copper alloy has good yield strength, fatigue strength, good thermal conductivity and wear resistance at high temperatures, and has been widely used in the bushings and pivots of large aircraft landing gear. In addition, due to the unique high elasticity and good electrical conductivity of beryllium copper alloy, it has become the preferred material for connectors in the computer and communication fields. Probes commonly used in integrated circuit manufacturing processes are also made of beryllium copper alloy.

[0003] At present, in the existing production process, due to the large difference in density between beryllium and copper, the beryllium copper alloy components are prone to segregation after the molten metal is left to stand for a long time. Therefore, the mainstream production method of beryllium copper alloy powder is chemical method. However, the chemical method for producing beryllium copper alloy powder has defects such as poor sphericity and high production cost. Therefore, a new process for preparing beryllium copper alloy materials is urgently needed. Summary of the invention

[0004] The purpose of the present invention is to solve at least one of the above-mentioned deficiencies in the prior art. For example, one of the purposes of the present invention is to solve the shortcomings of the current chemical powder preparation method, such as low efficiency, poor sphericity, high cost, and high environmental pressure, and to provide a method for preparing beryllium copper alloy powder.

[0005] In order to achieve the above-mentioned purpose, one aspect of the present invention provides a method for preparing beryllium copper alloy powder, which may include the following steps: heating and melting a raw material containing beryllium copper under a protective atmosphere; under the protective atmosphere, spreading the raw material liquid formed after melting on the end face of a centrifugal atomizer to form a liquid film, rotating the end face to atomize and break the liquid film into mist-like liquid beads, and obtaining beryllium copper alloy powder after the mist-like liquid beads are cooled, wherein the beryllium copper alloy powder includes, by mass fraction, Be: 1.8% to 4.6%, Ni: 0.2% to 0.5%, Cu: 94.5% to 97.5%, and the total impurities: <0.5%; the oxygen content of the beryllium copper alloy powder is less than 300ppm, and the powder in the particle size range of 15μm to 63μm in the beryllium copper alloy powder accounts for more than 70%.

[0006] Furthermore, the heating and melting temperature may be 50° C. to 350° C. higher than the melting point of the beryllium copper alloy, and the heating and melting method may be electromagnetic induction heating.

[0007] Furthermore, the end face of the centrifugal atomizer can be a curved surface or a flat surface; the end face material can be a refractory metal or engineering ceramic or graphite, the refractory metal includes tungsten, tantalum, etc., and the ceramic includes engineering ceramics such as silicon nitride, silicon carbide or alumina.

[0008] Furthermore, beryllium copper alloy powder can be prepared in an atomization system, and the atomization system may include a raw material clamping mechanism, a heating mechanism, a liquid discharge mechanism and a centrifugal atomizer arranged from top to bottom, wherein the raw material clamping mechanism includes a clamp and a push rod, and the push rod pushes the raw material clamped in the clamp into the heating mechanism; the heating mechanism heats and melts the raw material through a circumferentially arranged electromagnetic induction coil; the liquid discharge mechanism receives the molten raw material liquid and transports the raw material liquid to the centrifugal atomizer by its own gravity; the centrifugal atomizer includes an end face and a rotating motor connected to the end face and driving the end face to rotate, after the high-speed rotating end face receives the raw material liquid, the raw material liquid spreads as a liquid film on the end face, and the liquid film is broken into mist-like liquid beads under the action of centrifugal force, and the mist-like liquid beads are cooled to obtain beryllium copper alloy powder.

[0009] Furthermore, the end surface rotation speed may be 40,000 to 65,000 rpm.

[0010] Furthermore, the protective gas pressure in the atomization system can be 2500Pa to 5000Pa higher than the ambient atmospheric pressure; the oxygen content in the atomization system can be controlled at 40ppm to 180ppm.

[0011] Furthermore, a discharge port is provided at the lower end of the liquid discharge mechanism, and a height difference of 100mm to 450mm is maintained between the upper and lower ports of the liquid discharge mechanism to ensure stable liquid flow, and the distance between the lower end face and the end face of the discharge port can be 30mm to 90mm.

[0012] Furthermore, the particle size of the mist-like liquid droplets may be less than 150 μm.

[0013] Furthermore, the raw material may be a beryllium copper alloy rod or ingot.

[0014] Another aspect of the present invention provides a beryllium copper alloy powder, which may include, by mass fraction, Be: 1.8% to 4.6%, Ni: 0.2% to 0.5%, Cu: 94.5% to 97.5%, and total impurities: <0.5%; the oxygen content of the beryllium copper alloy powder may be less than 300 ppm, and the proportion of powder in the particle size range of 15 μm to 63 μm in the beryllium copper alloy powder may be more than 70%.

[0015] Compared with the prior art, the beneficial effects of the present invention include at least one of the following:

[0016] (1) The beryllium copper alloy powder prepared by the preparation method of the present invention has less hollow powder and satellite powder, concentrated particle size, good sphericity, good fluidity, low manufacturing cost, high efficiency, and the alloy powder particle size is between 15 μm and 63 μm, accounting for more than 70%, which is suitable for 3D printing purposes and meets the quality requirements of the additive manufacturing process for raw material powder.

[0017] (2) The preparation method of the present invention heats the raw materials to melt rapidly, and the molten metal liquid flows down and is laid on the end surface for rapid atomization and crushing, and then is cooled and solidified into powder. This can avoid component segregation caused by the molten metal liquid being left standing for too long, and the alloy powder yield is high.

[0018] (3) The protective gas of the present invention only plays a protective role. Compared with the gas atomization powder making process, it not only consumes less gas, but also brings less oxygen into the system by the protective gas. The oxygen content of the prepared beryllium copper alloy powder is lower and the quality is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other objects and / or features of the present invention will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0020] Figure 1 The schematic diagram of the atomization system structure for preparing beryllium copper alloy powder according to the present invention is shown.

[0021] Figure 2 The morphology of the beryllium copper alloy powder in Example 1 of the present invention is shown in the micrograph.

[0022] Figure 3 The particle size distribution diagram of the beryllium copper alloy powder in Example 1 of the present invention is shown.

[0023] Description of main reference numerals:

[0024] 1-raw material, 2-heating mechanism, 3-liquid discharge mechanism, 3a-discharge port, 4-centrifugal atomizer, 4a-end face, 4b-rotating motor. DETAILED DESCRIPTION

[0025] Hereinafter, a beryllium copper alloy powder and a preparation method thereof according to the present invention will be described in detail in conjunction with exemplary embodiments.

[0026] Specifically, the preparation method of the present invention is to melt the raw material containing beryllium copper quickly, and then quickly flow it into the end face of a rotating centrifugal atomizer by its own gravity. The end face of the rotating centrifugal atomizer quickly atomizes the raw material molten metal into mist-like liquid beads, and the mist-like liquid beads are cooled to obtain beryllium copper alloy powder. Since the method of the present invention can quickly atomize the molten metal liquid into a powder product, the standing time of the raw material molten metal after melting is reduced, and the segregation of beryllium elements in the alloy can be avoided. The currently commonly used 200 kg vacuum gas atomization furnace requires molten metal to stand for 40 to 60 minutes to complete atomization after melting, while the present invention completes atomization and solidification at the moment of melting. At the same time, the centrifugal atomization method of the present invention also avoids the presence of hollow powder and satellite powder in the beryllium copper alloy powder, and the sphericity and fluidity of the beryllium copper alloy powder are better, the powder particle size distribution is concentrated, the impurities are less, and the oxygen content is low, which better meets the technical progress of rapid powder spreading in additive manufacturing and improves the efficiency and quality of additive manufacturing printed products.

[0027] One aspect of the present invention provides a method for preparing beryllium copper alloy powder. In some embodiments, the preparation method may include the following steps:

[0028] Step S01, heating and melting the raw material containing beryllium copper under a protective atmosphere.

[0029] Step S02, under a protective atmosphere, spreading the melted raw material liquid on the end face of a centrifugal atomizer to form a liquid film, rotating the end face to atomize and break the liquid film into mist-like liquid beads, and obtaining beryllium copper alloy powder after the mist-like liquid beads are cooled, wherein the beryllium copper alloy powder may include, by mass fraction, Be: 1.8% to 4.6%, Ni: 0.2% to 0.5%, Cu: 94.5% to 97.5%, and total impurities: <0.5%; the oxygen content of the beryllium copper alloy powder may be less than 300ppm, and the proportion of powder in the particle size range of 15μm to 63μm in the beryllium copper alloy powder may be more than 70%.

[0030] In certain embodiments, the beryllium copper alloy powder may include, by mass fraction, Be: 1.9% to 3.5%, Ni: 0.3% to 0.4%, Cu: 95.5% to 97.1%, and total impurities: <0.5%; or Be: 2.2% to 3.0%, Ni: 0.35% to 0.45%, Cu: 96.0% to 96.9%, and total impurities: <0.5%; or a combination of the above ranges.

[0031] In certain embodiments, the oxygen content of the beryllium copper alloy powder may be less than 380 ppm, and the powder in the particle size range of 15 μm to 63 μm in the beryllium copper alloy powder may account for 72% to 98%; or the oxygen content of the beryllium copper alloy powder may be 50 ppm to 300 ppm, and the powder in the particle size range of 15 μm to 63 μm in the beryllium copper alloy powder may account for 80% to 88%; or the oxygen content of the beryllium copper alloy powder may be 70 ppm to 220 ppm, and the powder in the particle size range of 15 μm to 63 μm in the beryllium copper alloy powder may account for 73% to 85%.

[0032] In some embodiments, the raw material containing beryllium copper is compatible with the composition and proportion of the beryllium copper alloy powder to be prepared. The raw material containing beryllium copper can be an alloy containing metal elements such as beryllium, copper, and nickel. The raw material can exist in the form of rods, ingots, etc. For example, the raw material containing beryllium copper can be a metal rod with a diameter of 30 mm to 60 mm and a length of 500 mm to 1000 mm.

[0033] In certain embodiments, the protective atmosphere may be an atmosphere of nitrogen, argon or other inert gas with a purity of 99.99%.

[0034] In some embodiments, the temperature at which the raw materials are heated and melted may be 50°C to 350°C higher than the melting point of the beryllium copper alloy. The melting point of the beryllium copper alloy containing about 2% beryllium is 950°C, and the melting temperature is 1150°C±20°C.

[0035] In some embodiments, the heating method of the raw material containing beryllium copper can be electromagnetic induction heating. Of course, the heating method of the present invention is not limited to this, and other heating methods are also possible.

[0036] In some embodiments, the end surface may be an arc surface or a plane surface. The end surface material may be a refractory metal or engineering ceramic or graphite, the refractory metal includes tungsten, tantalum, etc., and the engineering ceramic includes silicon nitride, silicon carbide or aluminum oxide, etc.

[0037] In some embodiments, the preparation of beryllium copper alloy powder can be carried out in an atomization system. The schematic diagram of the atomization system is shown in FIG. Figure 1 The atomization system may include a raw material clamping mechanism (not shown in the figure), a heating mechanism 2, a liquid feeding mechanism 3 and a centrifugal atomizer 4 arranged from top to bottom.

[0038] The raw material clamping mechanism may include a clamp and a push rod. The clamp is used to clamp the raw material 1 containing beryllium copper. Figure 1 The raw material shown in the figure is a rod-shaped raw material. The push rod is used to push the raw material 1 clamped in the clamp into the heating mechanism 2. The heating mechanism 2 is used to heat the raw material so that the raw material is melted into molten metal. The heating mechanism 2 can be provided with a circumferential electromagnetic induction coil to melt the raw material into molten metal by electromagnetic induction. The liquid discharge mechanism 3 can receive the molten metal flowing out of the heating mechanism 2, and discharge the molten metal heat into the centrifugal atomizer 4 from the discharge port 3a provided at the bottom of the liquid discharge mechanism 3. The molten metal in the liquid discharge mechanism 3 can flow into the centrifugal atomizer 4 quickly by its own gravity. The centrifugal atomizer 4 may include an end face 4a and a rotating motor 4b connected to the end face and driving the end face to rotate. The molten metal flowing out of the discharge port 3a flows to the high-speed rotating end face. Since the end face is an arc surface or a plane, the raw material molten metal can be spread as a liquid film on the end face of the centrifugal atomizer. The liquid film is broken into mist-like liquid beads under the action of centrifugal force, and the mist-like liquid beads are cooled to obtain beryllium copper alloy powder. The transmission mode of the rotating motor can be electric or pneumatic.

[0039] For example, during the preparation process, beryllium copper alloy powder can be prepared by:

[0040] A. Prepare the raw material rods of the chemical composition of the product to be prepared, the diameter can be 30mm~60mm, and the length can be 500mm~1000mm.

[0041] B. Place the raw material rod into the atomization system, clamp the raw material rod on the clamping mechanism, evacuate the atomization system to 3Pa, and then fill it with protective gas.

[0042] C. Induction heat the beryllium copper alloy raw material rod to a temperature above the alloy melting point under protective gas to melt it, and obtain the beryllium copper alloy liquid which flows into the centrifugal atomizer.

[0043] D. The beryllium copper alloy liquid flows into the high-speed rotating end surface of the atomization system under the action of gravity. The metal liquid spreads as a liquid film on the end surface. The liquid film is broken into mist-like liquid beads under the action of centrifugal force. The mist-like liquid beads are cooled to obtain beryllium copper alloy powder.

[0044] In some embodiments, the distance between the lower end surface of the feed opening 3a and the upper surface of the end surface 4a can be 30 mm to 90 mm. At the above distance, it can be ensured that the molten metal quickly falls into and reaches the end surface to be transformed into mist-like liquid beads, ensuring the smooth progress of the centrifugal atomization process. For example, the distance between the lower end surface of the feed opening 3a and the upper surface of the end surface 4a can be 31 mm to 85 mm, 39 mm to 78 mm, 44 mm to 72 mm, 51 mm to 60 mm, or a combination of the above ranges.

[0045] In some embodiments, the particle size of the mist droplets may be less than 150 μm. At the above particle size, the mist droplets can be ensured to cool and solidify into spherical beryllium copper alloy powder through surface tension. For example, the particle size of the mist droplets may be less than 10 μm, 25 μm to 140 μm, 30 μm to 110 μm, 55 μm to 89 μm, or a combination of the above ranges.

[0046] In some embodiments, the rotation speed of the end surface rotation can be 40000-65000 rpm. Under the above end surface rotation, the liquid film can be quickly atomized and broken into mist-like liquid beads. For example, the rotation speed of the end surface rotation can be 42000-60000 rpm, 45000-58000 rpm, 51000-55000 rpm, or a combination of the above ranges.

[0047] In some embodiments, the protective gas pressure in the atomization system may be higher than the ambient atmospheric pressure by 2500 Pa to 5000 Pa. For example, the protective gas pressure in the atomization system may be higher than the standard atmospheric pressure by 4200 Pa ± 100 Pa.

[0048] In some embodiments, the oxygen content in the atomization system can be controlled at 40 ppm to 180 ppm. For example, the oxygen content can be controlled at 60±5 ppm or 100±5 ppm or other values ​​in the range above.

[0049] In some embodiments, the diameter of the feed opening can be set to 1.7 mm to 2.9 mm. For example, the diameter of the feed opening can be set to 1.9±0.01 mm, 3.0±0.01 mm or other values ​​within the above range.

[0050] In some embodiments, a solid cylinder, disk or truncated cone without holes can be provided between the end surface and the rotating motor. The advantages of such a design are that it is simple and reliable, not prone to failure, and prevents dynamic balance problems at high speeds; it avoids the existing centrifugal atomizers that have many small holes, are difficult to process, are easy to clog, have a high failure rate, and more importantly, are difficult to balance at high speeds.

[0051] Another aspect of the present invention provides a beryllium copper alloy powder. In some embodiments, the beryllium copper alloy powder may include, by mass fraction, Be: 1.8% to 4.6%, Ni: 0.2% to 0.5%, Cu: 94.5% to 97.5%, and total impurities: <0.5%. The oxygen content of the beryllium copper alloy powder may be less than 300 ppm, and the proportion of powder in the particle size range of 15 μm to 63 μm in the beryllium copper alloy powder may be more than 70%.

[0052] In order to better understand the above exemplary embodiments of the present invention, they are further described below with reference to specific examples.

[0053] Example 1

[0054] A method for preparing beryllium copper alloy powder, comprising:

[0055] Step 1, take a beryllium copper alloy raw material rod with a diameter of 30 mm, a length of 1000 mm, and a tapered end, and its chemical composition is as follows:

[0056] Table 1 Chemical composition of beryllium copper alloy (wt%)

[0057] element Cu Be Ni Mn Zn Total impurities (Actual measurement) 97.35 1.821 0.209 0.021 0.112 margin

[0058] Step 2, load the raw material rod into the atomization system, draw vacuum, when the vacuum reaches 3Pa, add inactive gas to replace the oxygen in the atomization system, the oxygen content in the atomization system is controlled at 50±10ppm, and the atomization system is filled with nitrogen protection, and its pressure is higher than the indoor ambient atmospheric pressure 3500±100Pa. Adjust the output power of the electromagnetic inductor, heat the beryllium copper alloy raw material rod, heat the raw material rod to exceed the melting point of the beryllium copper alloy by 150±5 degrees, melt it and flow into the lower liquid mechanism. Among them, the height between the upper and lower openings of the lower liquid mechanism is 150mm, and the diameter of the lower material opening in the lower liquid mechanism is set to 1.8mm. The distance from the lower material opening to the end face of the centrifugal atomizer can be 41mm. The end face is spherical, with a diameter of 35mm, and is made of metal tungsten.

[0059] Step 3: Under the action of gravity, the beryllium copper alloy liquid flows from the feed port into the centrifugal atomizer below and spreads as a liquid film on the upper end surface. The end surface speed is 65000±1000 rpm, and the liquid film is crushed into liquid droplets less than 105 μm by centrifugal force. The crushed liquid droplets are cooled and solidified into spherical beryllium copper alloy powders under the protection of nitrogen with a purity of 99.99% by surface tension.

[0060] After the beryllium copper alloy powder is fully cooled and its temperature is close to room temperature, it is divided into beryllium copper alloy powder products with three particle size levels: 0-15μm, 15μm-63μm and 45μm-105μm by an air flow classifier under the protection of 99.99% nitrogen.

[0061] Powders of the same particle size are grouped into batches of 500 kg and put into a mixer for mixing for 20 minutes to ensure that the quality of the powders in the same batch is the same. The combined beryllium copper alloy powder is sealed and packaged with argon gas.

[0062] Figure 2 The metallographic micrograph of the beryllium copper alloy powder is shown in FIG. Figure 2 It can be seen that the sphericity of the beryllium copper alloy powder is very good. The X / Y diameter ratio of the beryllium copper alloy powder tested by sphericity test reaches 95%. The particle size distribution diagram of the beryllium copper alloy powder is as follows Figure 3 shown.

[0063] The performance indicators of beryllium copper alloy powder with particle size grade of 15μm to 63μm are shown in Table 2, Table 3 and Table 4.

[0064] Table 2 Chemical composition of beryllium copper alloy powder (wt%)

[0065]

[0066] Table 3 Beryllium copper alloy powder particle size 15~63μm

[0067] unit D10 D50 D90 Junkers Index 21.36μm 35.12μm 56.75μm

[0068] Table 4 Processing performance of beryllium copper alloy powder with particle size of 15 to 63 μm

[0069]

[0070] It can be seen from Table 2 that the powder product prepared by the method of the present invention has a lower oxygen content of only 220 ppm, which is lower than the oxygen content of other vacuum gas atomization products in China, which is in the range of 350 to 800 ppm.

[0071] The particle size distribution diagram of Table 3 is shown in Figure 3As shown in Table 3 and Table 4, it can be seen that the fluidity of the powder product prepared by the method of the present invention is 20.5s / 50g, which has good fluidity. The fluidity of the beryllium copper alloy powder currently supplied to additive manufacturing in China is generally around 22-25s / 50g.

[0072] Example 2

[0073] A method for preparing beryllium copper alloy powder, comprising:

[0074] Step 1, take a beryllium copper alloy raw material rod with a diameter of 50 mm, a length of 500 mm, and a tapered end, and the chemical composition is shown in Table 1 above.

[0075] Step 2, load the raw material rod into the atomization system, draw vacuum, when the vacuum reaches 3Pa, add inactive gas to replace the oxygen in the atomization system, the oxygen content in the atomization system is controlled at 150±10ppm, and the atomization system is filled with nitrogen protection, and its pressure is higher than the indoor ambient atmospheric pressure 4500±100Pa. Adjust the output power of the electromagnetic inductor, heat the beryllium copper alloy raw material rod, heat the raw material rod to exceed the melting point of the beryllium copper alloy by 50±5 degrees, melt it and flow into the feed pipe. Among them, the outlet diameter of the feed pipe is 2.8mm. The distance from the outlet of the feed pipe to the upper end face of the centrifugal atomizer can be 70mm. The end face is spherical, with a diameter of 65mm, and is made of silicon carbide.

[0076] Step 3: Under the action of gravity, the beryllium copper alloy liquid flows from the bottom outlet of the feed pipe to the end face of the centrifugal atomizer arranged below and spreads into a liquid film. The end face speed is 50000±1000 rpm, and the centrifugal atomizer crushes the liquid film into liquid droplets less than 150 μm by centrifugal force. The crushed liquid droplets are cooled and solidified into spherical beryllium copper alloy powder by surface tension under the protection of nitrogen with a purity of 99.99%.

[0077] The performance indicators of beryllium copper alloy powder with particle size grade of 45μm to 150μm are shown in Table 5, Table 6 and Table 7.

[0078] Table 5 Chemical composition of beryllium copper alloy powder (wt%)

[0079]

[0080] Table 6 Beryllium copper alloy powder particle size 45~105μm

[0081] unit D10 D50 D90 Junkers Index 39.36μm 78.12μm 106.75μm

[0082] Table 7 Processing performance of beryllium copper alloy powder with particle size of 15 to 63 μm

[0083] unit Powder flowability Repose Angle Bulk density Tap density Surface state Junkers Index 18.5s / 50g <![CDATA[23 0 ]]> <![CDATA[4.21g / cm 3 ]]> <![CDATA[5.32g / cm 3 ]]> Light rose red

[0084] The powder product prepared by the method of the present invention has good fluidity, and can increase the powder spreading speed and the density of each layer of powder during printing, so as to meet the requirements of the additive manufacturing technology for raw materials, and is more suitable for application in the field of additive manufacturing.

[0085] Although the present invention has been described above in conjunction with the exemplary embodiments and the accompanying drawings, it should be apparent to those skilled in the art that various modifications may be made to the above-described embodiments without departing from the spirit and scope of the claims.

Claims

1. A method for preparing beryllium copper alloy powder, characterized in that: The following steps are involved: The raw material containing beryllium copper is heated and melted under a protective atmosphere; Under a protective atmosphere, the raw material liquid formed after melting is spread on the end face of a centrifugal atomizer to form a liquid film, and the end face is rotated to atomize and break the liquid film into mist-like liquid beads, and the mist-like liquid beads are cooled to obtain beryllium copper alloy powder, wherein the beryllium copper alloy powder includes, by mass fraction, Be: 1.8% to 4.6%, Ni: 0.2% to 0.5%, Cu: 94.5% to 97.5%, and the total impurities: <0.5%; the oxygen content of the beryllium copper alloy powder is less than 300ppm, and the powder in the particle size range of 15μm to 63μm in the beryllium copper alloy powder accounts for more than 70%.

2. The method for preparing beryllium copper alloy powder according to claim 1, characterized in that: The heating and melting temperature is 50°C to 350°C higher than the melting point of the beryllium copper alloy, and the heating and melting method is electromagnetic induction heating.

3. The method for preparing beryllium copper alloy powder according to claim 1 or 2, characterized in that: The end face of the centrifugal atomizer is an arc surface or a plane; the end face material is metal tantalum, metal tungsten, graphite, silicon carbide, aluminum oxide or silicon nitride.

4. The method for preparing beryllium copper alloy powder according to claim 1 or 2, characterized in that: Beryllium copper alloy powder is prepared in an atomization system, which includes a raw material clamping mechanism, a heating mechanism, a liquid lowering mechanism and a centrifugal atomizer arranged from top to bottom, wherein the raw material clamping mechanism includes a clamp and a push rod, and the push rod pushes the raw material clamped in the clamp into the heating mechanism; The heating mechanism heats and melts the raw material through the electromagnetic induction coils arranged circumferentially; The liquid lowering mechanism receives the melted raw material liquid and transports the raw material liquid to the centrifugal atomizer by its own gravity; The centrifugal atomizer includes an end face and a rotating motor connected to the end face and driving the end face to rotate. After the high-speed rotating end face receives the raw material liquid, the raw material liquid spreads as a liquid film on the end face. The liquid film is broken into mist-like liquid beads under the action of centrifugal force. After the mist-like liquid beads are cooled, beryllium copper alloy powder is obtained.

5. The method for preparing beryllium copper alloy powder according to claim 4, characterized in that: The end face rotation speed is 40000~65000 rpm.

6. The method for preparing beryllium copper alloy powder according to claim 4 or 5, characterized in that: The protective gas pressure in the atomization system is 2500Pa to 5000Pa higher than the ambient atmospheric pressure; the oxygen content in the atomization system is controlled at 40ppm to 180ppm.

7. The method for preparing beryllium copper alloy powder according to claim 4 or 5, characterized in that: A feeding port is arranged at the lower end of the liquid feeding mechanism, and the distance between the lower end surface of the feeding port and the end surface of the centrifugal atomizer is 30mm-90mm.

8. The method for preparing beryllium copper alloy powder according to claim 4 or 5, characterized in that: The particle size of the mist droplets is less than 150 μm.

9. The method for preparing beryllium copper alloy powder according to claim 4 or 5, characterized in that: The raw material is beryllium copper alloy rod or ingot.

10. A beryllium copper alloy powder prepared by the method for preparing beryllium copper alloy powder according to any one of claims 1 to 9, characterized in that: The beryllium copper alloy powder includes, by mass fraction, Be: 1.8% to 4.6%, Ni: 0.2% to 0.5%, Cu: 94.5% to 97.5%, and total impurities: <0.5%; the oxygen content of the beryllium copper alloy powder is less than 300 ppm, and the powder in the particle size range of 15μm to 63μm accounts for more than 70% of the beryllium copper alloy powder.

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