Forming and surface treatment method of twisted waveguide

Abstract

The invention relates to a forming and surface treatment method of a twisted waveguide, and belongs to the field of metal additive manufacturing technology and surface treatment. The manufacturing technical problems that parting manufacturing precision and reliability are poor, torsional deformation and position tolerance of torsional forming are not easy to guarantee, and a welding position is prone to deformation are solved, and the problem that a twisted waveguide not plated with a copper layer is large in microwave transmission loss is solved. The method comprises the following steps: modeling a designed twisted waveguide, and completing support adding and slicing processing; aluminum alloy powder is added into a forming equipment material cylinder; performing selective laser melting forming by adopting the slice file to obtain a twisted waveguide with a substrate and a support; separating the twisted waveguide from the substrate and the support; carrying out finishing processing on the twisted waveguide by adopting chemical polishing; and plating the twisted waveguide by adopting chemical plating to obtain the twisted waveguide with the plating layer. The additive manufacturing integrated forming and surface treatment process is adopted, the production period is effectively shortened, the product quality reliability is improved, and the microwave transmission loss is reduced.

Description

Technical Field

[0001] The invention belongs to the field of metal additive manufacturing technology and surface treatment, and specifically relates to a forming and surface treatment method of a twisted waveguide. Background Art

[0002] In satellite communications, radar and navigation and control systems, waveguide devices are widely used in various communication products as channels for electromagnetic wave transmission. Limited by the spatial position of the microwave system platform carrier, the transmission and polarization direction of the beam are different, and the microwave rectangular waveguide must change its straight shape, bend and twist. Twist waveguide plays an important role. Its basic function is to connect two rotationally misaligned ports by rotating the polarization direction of the electromagnetic wave propagating in the waveguide by a certain angle.

[0003] Twist waveguides are essential interconnecting components, commonly used in microwave and millimeter wave systems. Electromagnetic waves can change polarization direction at a specific angle in the twist waveguide along the propagation direction. The traditional twist waveguide process requires filling the waveguide with auxiliary materials and then twisting it. Due to the different mechanical properties of the waveguide and the auxiliary materials, their deformation speeds cannot be consistent when twisted, resulting in the difficulty in ensuring the cross-sectional dimensional accuracy and inner surface roughness of the rectangular twist waveguide, poor quality stability, and direct impact on the stability of the microwave system. For example: the publication number is CN 114986085 B, and the name of the invention is a twist waveguide processing method. In its technical solution, the twist waveguide processing includes machining of flanges, side panels, and upper and lower panels that constitute the waveguide, twisting forming of the side panels and upper and lower panels, and then welding and forming of the flanges, side panels, and upper and lower panels to form a twist waveguide, and then performing CNC precision milling on the twist waveguide. There are long processing procedures, poor reliability of parting manufacturing accuracy, difficult to ensure torsional deformation and position tolerance of twist forming, and easy deformation at the welding point. Summary of the invention

[0004] The purpose of the present invention is to overcome the above-mentioned defects and provide a method for forming and surface treating a twist waveguide, which solves the problems of long processing flow, poor reliability of mold manufacturing accuracy, difficulty in ensuring the torsional deformation and position tolerance of twist forming, easy deformation at welding points, and other manufacturing technical problems, as well as the problem of large microwave transmission loss of rectangular twist waveguides without copper plating. The present invention adopts an integrated forming and surface treatment process of additive manufacturing, which effectively shortens the production cycle, improves product quality reliability, and reduces microwave transmission loss. One purpose of the present invention is to provide a metal additive manufacturing and surface treatment process that can be quickly molded and manufactured with reliable accuracy.

[0005] In order to achieve the above-mentioned object of the invention, the present invention provides the following technical solutions:

[0006] The present invention discloses a forming and surface treatment method of a twist waveguide, and belongs to the field of metal additive manufacturing technology and surface treatment. In order to minimize the support structure when additively manufacturing a twist waveguide, the present invention uses a conical structure transition between the external connection of a rectangular flange and a twisted rectangular cavity to form a basic self-supporting structure, with support only around the bolt holes of the rectangular flange, thereby improving the forming efficiency of the formed part and shortening the forming cycle. The forming process parameters of a small spot, medium laser power, and high scanning speed are combined with chemical polishing for surface finishing, and finally the surface of the twist waveguide is chemically copper plated to reduce microwave transmission loss, thereby obtaining a twist waveguide forming and surface treatment method with reliable quality and low transmission loss.

[0007] A method for forming and surface treating a twist waveguide, comprising:

[0008] A twist waveguide model is established using 3D modeling software and saved in an STL format file. The model is connected by rectangular flanges at both ends and a twisted rectangular cavity in the middle, and the rectangular flange and the outside of the twisted rectangular cavity are transitioned by a conical structure.

[0009] Add support to the twist waveguide model to obtain a twist waveguide model with support;

[0010] Slice the supported twisted waveguide model, set the process parameters for laser selective melting, and save the slice file;

[0011] Adding aluminum alloy powder into a material cylinder of a laser selective melting device;

[0012] The slicing file is used for laser selective melting to obtain a twist waveguide with a substrate and support;

[0013] After separating the twist waveguide from the substrate, a twist waveguide with support is obtained;

[0014] After separating the supported twist waveguide from the support, a twist waveguide is obtained;

[0015] The inner and outer surfaces of the twist waveguide are finished by chemical polishing + ultrasonic vibration method;

[0016] The twisted waveguide after finishing is chemically plated by a method of chemical plating + ultrasonic vibration to obtain a twisted waveguide with a coating.

[0017] Furthermore, the aluminum alloy powder is selected as AlSi10Mg powder with a particle size of 15 μm to 53 μm.

[0018] Furthermore, the parameters of the support structure in the twist waveguide include:

[0019] The support shape is linear, the linear support thickness is 0.2mm, and the support spacing is 4mm.

[0020] Furthermore, the process parameters used for forming the twisted waveguide by laser selective melting include:

[0021] The scanning interval is 80μm, the spot diameter is 40μm, the powder layer thickness is 30μm, the phase angle is 67°, the laser power is 380~420w, and the scanning speed is 1250~1500mm / s.

[0022] Furthermore, a reciprocating wire-feed electrospark wire cutting method is used to separate the twisted waveguide from the substrate. The electrospark pulse width is 10 to 20 μs, the pulse interval is 30 to 60 μs, the waveform is a rectangular pulse, and the electrode wire is a molybdenum wire with a diameter of 0.18 mm.

[0023] Further, the twist waveguide is separated from the supporting structure and removed by a vise.

[0024] Furthermore, the chemical polishing liquid is a mixed solution of H2SO4, H3PO4, and HNO3, the temperature of the chemical polishing liquid is 40-60°C, the ultrasonic vibration frequency is 30-40kHz, and the polishing time is 4-5min.

[0025] Furthermore, the chemical plating process specifically includes first performing secondary zinc immersion, then chemical nickel plating on the surface, and finally chemical copper plating on the surface. The specific method is:

[0026] The twist waveguide was degreased using NaCO3 solution at room temperature for 10N15min.

[0027] The twist waveguide is deoxidized using HNO3 solution at room temperature for 30 to 60 seconds.

[0028] The first zinc immersion treatment removes the oxide layer and replaces it with a zinc layer, and then the twisted waveguide that has been zinc-immersed for the first time is partially de-zincified and dissolved in a HNO3 solution, and then a second zinc immersion treatment is performed to obtain a more uniform zinc layer;

[0029] The surface of the twisted waveguide after secondary zinc immersion is nickel plated by a method of chemical nickel plating + ultrasonic vibration, wherein the chemical nickel plating solution is a mixed solution of NiSO4·7H2O, NaH2PO2·H2O, C6H8O7·H2O, C3H6O3, and Tu, the temperature of the chemical nickel plating solution is 70-80°C, and the chemical nickel plating time is 40-60min;

[0030] The surface of the chemically nickel-plated twisted waveguide is copper-plated by a method of chemical copper plating + ultrasonic vibration. The chemical copper plating solution is a mixed solution of CuSO4·5H2O, HCHO, NaOH, Na2EDTA, and Tu. The temperature of the chemical copper plating solution is 30-35° C., and the chemical copper plating time is 90-120 min.

[0031] Furthermore, the secondary zinc immersion process also includes:

[0032] The zinc immersion solution is a mixed solution of NaOH, ZnO, FeCl3, and KNaC4H4O6, and the solution used in the two zinc immersion operations is the same;

[0033] The temperature of the first zinc dipping solution is room temperature, and the zinc dipping time is 30 to 60 seconds;

[0034] The temperature of zinc stripping and dissolution is room temperature, and the zinc stripping time is 60 to 80 seconds;

[0035] The temperature of the second zinc dipping solution is room temperature, and the zinc dipping time is 30 to 60 seconds.

[0036] Furthermore, the twist waveguide is washed with deionized water before each step of the surface treatment process.

[0037] Compared with the prior art, the present invention has at least one of the following beneficial effects:

[0038] The present invention adopts laser selective melting forming technology to achieve integrated high-quality forming. Compared with the traditional mechanical processing + welding forming method, the manufacturing process is simple, the production cycle is short, and the product quality reliability is high.

[0039] The present invention enables the twisted waveguide to be quickly formed with high surface quality through differentiated design of process parameters, thereby improving the forming efficiency.

[0040] The present invention adopts chemical polishing + ultrasonic vibration to perform finishing processing on the twisted waveguide, thereby further reducing the surface roughness and reducing the microwave transmission loss.

[0041] The invention adopts chemical plating + ultrasonic vibration to copper plate the twisted waveguide, thereby improving the electromagnetic performance of the inner cavity of the twisted waveguide and reducing microwave transmission loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 A flowchart of a method for forming and surface treating a twisted waveguide according to the present invention;

[0043] Figure 2 It is a schematic diagram of the twisted waveguide structure of the present invention;

[0044] Figure 3 It is a schematic diagram of the supported twist waveguide structure of the present invention;

[0045] Figure 4 Schematic diagram of the structure of a twist waveguide (i.e., a straight waveguide) with a twist angle of 0° according to the present invention;

[0046] Figure 5 The surface treatment experimental results of the straight waveguide of the present invention are shown in Figure 1; (a) chemical polishing result diagram, (b) chemical plating result diagram;

[0047] Figure 6 It is a schematic diagram of the surface treatment device of the twisted waveguide of the present invention.

[0048] Figure numerals: 1-rectangular flange, 2-twisted rectangular cavity, 3-conical structure, 4-support, 5-twisted waveguide, 6-ultrasonic vibration device with heating function, 7-reaction container, 8-hanger. DETAILED DESCRIPTION

[0049] In order to more clearly illustrate the purpose, technical solutions and advantages of the present invention, the following is described by the specific embodiments shown in the accompanying drawings. It should be noted that these embodiments are only used for illustration and should not be regarded as limiting the scope of the present invention. In addition, in the following description, detailed descriptions of known structures and technologies are omitted to avoid unnecessary confusion of the concept of the present invention.

[0050] The present invention provides a forming and surface treatment method for a twist waveguide. The process of the present invention includes utilizing a laser selective melting forming method to achieve high-quality, high-reliability integrated forming of the twist waveguide. The present invention also includes utilizing a chemical polishing + chemical plating method to achieve high-quality surface treatment of the twist waveguide, thereby obtaining a waveguide device with low transmission loss.

[0051] Embodiment 1: Forming and surface treatment method of twist waveguide

[0052] The twisted waveguide formed by laser selective melting in the present invention comprises a rectangular flange, a conical structure, and a twisted rectangular cavity. The rectangular flanges at both ends are directly connected to the middle twisted rectangular cavity. The rectangular flange and the outside of the twisted rectangular cavity are transitioned by a conical structure. The rectangular flange, the conical structure, and the twisted rectangular cavity are integrally formed by additive manufacturing. The surface treatment of the twisted waveguide adopts chemical polishing + ultrasonic vibration, chemical plating + ultrasonic vibration process surface treatment. The steps of the method are as follows:

[0053] A twist waveguide model is established using 3D modeling software and saved as an STL format file, wherein the twist waveguide includes a rectangular flange, a tapered structure, and a twisted rectangular cavity;

[0054] Add support to the twist waveguide model to obtain a twist waveguide model with support;

[0055] Slice the supported twisted waveguide model, set the process parameters of laser selective melting, and obtain the slice file;

[0056] Adding aluminum alloy powder into a material cylinder of a laser selective melting device;

[0057] The slice file is imported into the laser selective melting forming equipment, and the laser selective melting forming of the twist waveguide is completed in an inert gas environment to obtain the twist waveguide with a substrate and a support;

[0058] After separating the twist waveguide from the substrate and the support, a twist waveguide is obtained;

[0059] The inner and outer surfaces of the twist waveguide are finished by chemical polishing + ultrasonic vibration method;

[0060] The twisted waveguide after finishing is chemically plated by a method of chemical plating + ultrasonic vibration to obtain a twisted waveguide with a coating.

[0061] Preferably, the twist angle of the twist waveguide is not limited. For example, a waveguide with a twist angle of 90° is the most typical in engineering practice.

[0062] Preferably, the aluminum alloy powder is AlSi10Mg powder, and the twisted waveguide is integrally formed by additive manufacturing.

[0063] Preferably, the angle of the tapered structure (with respect to the horizontal direction) is greater than 45°, so as to achieve substantially self-supporting forming of the rectangular flange while ensuring good forming quality.

[0064] Preferably, the twist waveguide formed by selective laser melting is formed using process parameters of small spot, medium laser power and high scanning speed, which is beneficial to improving the forming quality of the twist waveguide and reducing the surface roughness.

[0065] Preferably, the specific process parameters used for laser selective melting to form twisted waveguides are: laser power 400W, scanning speed 1250mm / s, scanning spacing 80μm, spot diameter 40μm, powder layer thickness 30μm, and phase angle 67°.

[0066] Preferably, a reciprocating wire-cut electrospark cutting method is used to separate the twisted waveguide from the substrate, the electrospark pulse width is 15 μs, the pulse interval is 40 μs, the waveform is a rectangular pulse, and the electrode wire is a molybdenum wire with a diameter of 0.18 mm.

[0067] Preferably, the linear support thickness is 0.2 mm, the support spacing is 4 mm, and a vise is used to separate the twist waveguide from the support.

[0068] Preferably, after separating the twist waveguide from the support, the inner and outer surfaces of the obtained twist waveguide are finished by chemical polishing + ultrasonic vibration. The chemical polishing liquid is a mixed solution of H2SO4, H3PO4, and HNO3. The temperature of the chemical polishing liquid is 40 to 60°C, the ultrasonic vibration frequency is 30 to 40 kHz, and the polishing time is 4 to 5 minutes.

[0069] Preferably, the twisted waveguide after finishing is subjected to chemical plating by chemical plating + ultrasonic vibration. The chemical plating process specifically includes firstly performing secondary zinc immersion on the twisted waveguide, then chemically plating nickel on the surface, and finally chemically plating copper on the surface. The specific method is:

[0070] Use NaCO3 solution to degrease the twist waveguide at room temperature for 10 to 15 minutes;

[0071] The twist waveguide is deoxidized using HNO3 solution at room temperature for 30 to 60 seconds.

[0072] A zinc immersion treatment is performed at room temperature to remove the oxide layer and replace it with a zinc layer. The zinc immersion solution is a mixed solution of NaOH, ZnO, FeCl3, and KNaC4H4O6. The zinc immersion time is 30 to 60 seconds.

[0073] The twisted waveguide is partially dezincified and dissolved in HNO3 solution at room temperature, and the dezincification time is 60 to 80 seconds;

[0074] A secondary zinc dipping treatment is performed at room temperature to obtain a more uniform zinc layer, wherein the secondary zinc dipping solution is the same as the primary zinc dipping solution, and the secondary zinc dipping time is 30 to 60 seconds;

[0075] The surface of the twisted waveguide after secondary zinc immersion is nickel plated by a method of chemical nickel plating + ultrasonic vibration, wherein the chemical nickel plating solution is a mixed solution of NiSO4·7H2O, NaH2PO2·H2O, C6H8O7·H2O, C3H6O3, and Tu, the temperature of the chemical nickel plating solution is 70-80°C, and the chemical nickel plating time is 40-60min;

[0076] The surface of the chemically nickel-plated twisted waveguide is copper-plated by a method of chemical copper plating + ultrasonic vibration. The chemical copper plating solution is a mixed solution of CuSO4·5H2O, HCHO, NaOH, Na2EDTA, and Tu. The temperature of the chemical copper plating solution is 30-35° C., and the chemical copper plating time is 90-120 minutes.

[0077] Preferably, the twisted waveguide is washed with water before each step in the surface treatment process.

[0078] Embodiment 2: Forming and surface treatment of a twist waveguide with a twist angle of 0° (i.e., forming and surface treatment of a straight waveguide)

[0079] The straight waveguide formed by laser selective melting in the present invention comprises a rectangular flange and a straight rectangular cavity. The rectangular flanges at both ends are directly connected to the middle straight rectangular cavity. The rectangular flange and the straight rectangular cavity are integrally formed by additive manufacturing. The surface treatment of the straight waveguide adopts chemical polishing + ultrasonic vibration, chemical plating + ultrasonic vibration process surface treatment. The steps of the method are as follows:

[0080] A straight waveguide model is established using 3D modeling software and saved as an STL format file, wherein the straight waveguide includes a rectangular flange and a straight rectangular cavity;

[0081] Add support to the straight waveguide model to obtain a straight waveguide model with support;

[0082] Slice the supported straight waveguide model and set the process parameters of laser selective melting to obtain the slice file;

[0083] Adding aluminum alloy powder into a material cylinder of a laser selective melting device;

[0084] The slice file is imported into the laser selective melting forming equipment, and the laser selective melting forming of the straight waveguide is completed in an inert gas environment to obtain a straight waveguide with a substrate and a support;

[0085] After separating the straight waveguide from the substrate and the support, a straight waveguide is obtained;

[0086] Preferably, the twist angle of the straight waveguide is 0°. The structure of the waveguide with a twist angle of 0° (straight waveguide) does not transition with a tapered structure. The straight waveguide formed by selective laser melting has a more flexible placement method.

[0087] Preferably, the aluminum alloy powder is AlSi10Mg powder, and the straight waveguide is integrally formed by additive manufacturing.

[0088] Preferably, the straight waveguide formed by selective laser melting is formed using process parameters of small spot, medium laser power and high scanning speed, which is beneficial to improving the forming quality of the straight waveguide and reducing the surface roughness.

[0089] Preferably, the specific process parameters used for laser selective melting to form a straight waveguide are: laser power 400W, scanning speed 1300mm / s, scanning spacing 80μm, spot diameter 40μm, powder layer thickness 30μm, and phase angle 67°.

[0090] Preferably, a reciprocating wire-cut electrospark cutting method is used to separate the straight waveguide and the substrate, the electrospark pulse width is 15 μs, the pulse interval is 40 μs, the waveform is a rectangular pulse, and the electrode wire is a molybdenum wire with a diameter of 0.18 mm.

[0091] Preferably, the linear support thickness is 0.2 mm, the support spacing is 4 mm, and a vise is used to separate the straight waveguide from the support.

[0092] Preferably, after separating the straight waveguide from the support, the inner and outer surfaces of the obtained straight waveguide are finished by chemical polishing + ultrasonic vibration. The chemical polishing liquid is a mixed solution of H2SO4, H3PO4, and HNO3. The temperature of the chemical polishing liquid is 40-60°C, the ultrasonic vibration frequency is 30-40kHz, and the polishing time is 4-5min.

[0093] Preferably, the straight waveguide after finishing is subjected to chemical plating by chemical plating + ultrasonic vibration. The chemical plating process specifically includes firstly performing secondary zinc immersion on the straight waveguide, then chemically plating nickel on the surface, and finally chemically plating copper on the surface. The specific method is:

[0094] Use NaCO3 solution to degrease the straight waveguide at room temperature for 10 to 15 minutes;

[0095] At room temperature, use HNO3 solution to remove the oxide layer of the straight waveguide for 30 to 60 seconds;

[0096] A zinc immersion treatment is performed at room temperature to remove the oxide layer and replace it with a zinc layer. The zinc immersion solution is a mixed solution of NaOH, ZnO, FeCl3, and KNaC4H4O6. The zinc immersion time is 30 to 60 seconds.

[0097] At room temperature, the straight waveguide is partially dezincified and dissolved in HNO3 solution for 60 to 80 seconds.

[0098] A secondary zinc dipping treatment is performed at room temperature to obtain a more uniform zinc layer, wherein the secondary zinc dipping solution is the same as the primary zinc dipping solution, and the secondary zinc dipping time is 30 to 60 seconds;

[0099] The surface of the straight waveguide after secondary zinc immersion is nickel plated by a method of chemical nickel plating + ultrasonic vibration, wherein the chemical nickel plating solution is a mixed solution of NiSO4·7H2O, NaH2PO2·H2O, C6H8O7·H2O, C3H6O3, and Tu, the temperature of the chemical nickel plating solution is 70-80°C, and the chemical nickel plating time is 40-60min;

[0100] The surface of the chemical nickel-plated straight waveguide is copper-plated by a method of chemical copper plating + ultrasonic vibration. The chemical copper plating solution is a mixed solution of CuSO4·5H2O, HCHO, NaOH, Na2EDTA, and Tu. The temperature of the chemical copper plating solution is 30-35° C., and the chemical copper plating time is 90-120 min.

[0101] Preferably, the straight waveguide is washed with water before each operation in the surface treatment process.

[0102] The present invention has been described in detail above in conjunction with specific embodiments, but these descriptions cannot be understood as limiting the present invention. Those skilled in the art understand that, without departing from the spirit and scope of the present invention, various equivalent substitutions, modifications or improvements can be made to the technical solution of the present invention and its implementation methods, all of which are included in the protection scope of the present invention.

[0103] The contents not described in detail in the specification of the present invention belong to the common knowledge of those skilled in the art.

Claims

1. A method for forming and surface treating a twist waveguide, characterized in that: The following steps are involved: A twist waveguide model is established using a three-dimensional modeling software and saved in an STL format file, wherein the model is connected by rectangular flanges at both ends and a twisted rectangular cavity in the middle, and the rectangular flange and the outside of the twisted rectangular cavity are transitioned by a conical structure; Add support to the twist waveguide model to obtain a twist waveguide model with support; Slice the supported twisted waveguide model, set the process parameters for laser selective melting, and save the slice file; Adding aluminum alloy powder into a material cylinder of a laser selective melting device; The slicing file is used for laser selective melting to obtain a twist waveguide with a substrate and support; After separating the twist waveguide from the substrate, a twist waveguide with support is obtained; After separating the supported twist waveguide from the support, a twist waveguide is obtained; The inner and outer surfaces of the twist waveguide are finished by chemical polishing + ultrasonic vibration method; The inner and outer surfaces of the obtained twist waveguide are chemically plated by a chemical plating + ultrasonic vibration method.

2. The method for forming and surface treating a twist waveguide according to claim 1, characterized in that: The aluminum alloy powder is AlSi10Mg powder with a particle size of 15 μm to 53 μm.

3. The method for forming and surface treating a twist waveguide according to claim 1, characterized in that: The parameters of the support structure in the twist waveguide include: The support shape is linear, the linear support thickness is 0.2mm, and the support spacing is 4mm.

4. The method for forming and surface treating a twisted waveguide according to claim 1, characterized in that: The process parameters used for twisted waveguide formation by selective laser melting include: The scanning interval is 80μm, the spot diameter is 40μm, the powder layer thickness is 30μm, the phase angle is 67°, the laser power is 380~420w, and the scanning speed is 1250~1500mm / s.

5. The method for forming and surface treating a twisted waveguide according to claim 1, characterized in that: The reciprocating wire-feed electrospark wire cutting method is used to separate the twist waveguide and the substrate. The electric spark pulse width is 10-20μs, the pulse interval is 30-60μs, the waveform is a rectangular pulse, and the electrode wire is a molybdenum wire with a diameter of 0.18mm.

6. The method for forming and surface treating a twisted waveguide according to claim 1, characterized in that: The twist waveguide is separated from the supporting structure and removed by a vise.

7. The method for forming and surface treating a twisted waveguide according to claim 1, characterized in that: The chemical polishing liquid is a mixed solution of H2SO4, H3PO4, and HNO3. The temperature of the chemical polishing liquid is 40-60°C, the ultrasonic vibration frequency is 30-40kHz, and the polishing time is 4-5min.

8. The method for forming and surface treating a twisted waveguide according to claim 1, characterized in that: The chemical plating process specifically includes first performing secondary zinc immersion, then chemical nickel plating on the surface, and finally chemical copper plating on the surface. The specific method is: Use NaCO3 solution to degrease the twist waveguide at room temperature for 10 to 15 minutes; The twisted waveguide is deoxidized using HNO3 solution at room temperature for 30 to 60 seconds. The first zinc immersion treatment removes the oxide layer and replaces it with a zinc layer, and then the twisted waveguide that has been zinc-immersed for the first time is partially de-zincified and dissolved in a HNO3 solution, and then a second zinc immersion treatment is performed to obtain a more uniform zinc layer; The surface of the twisted waveguide after secondary zinc immersion is nickel plated by a method of chemical nickel plating + ultrasonic vibration, wherein the chemical nickel plating solution is a mixed solution of NiSO4·7H2O, NaH2PO2·H2O, C6H8O7·H2O, C3H6O3, and Tu, the temperature of the chemical nickel plating solution is 70-80°C, and the chemical nickel plating time is 40-60min; The surface of the chemically nickel-plated twisted waveguide is copper-plated by a method of chemical copper plating + ultrasonic vibration. The chemical copper plating solution is a mixed solution of CuSO4·5H2O, HCHO, NaOH, Na2EDTA, and Tu. The temperature of the chemical copper plating solution is 30-35° C., and the chemical copper plating time is 90-120 minutes.

9. The method for forming and surface treating a twisted waveguide according to claim 1, characterized in that: The secondary zinc immersion process comprises: The zinc immersion solution is a mixed solution of NaOH, ZnO, FeCl3, and KNaC4H4O6, and the solution used in the two zinc immersion operations is the same; The temperature of the first zinc dipping solution is room temperature, and the zinc dipping time is 30 to 60 seconds; The temperature of zinc stripping and dissolution is room temperature, and the zinc stripping time is 60 to 80 seconds; The temperature of the second zinc dipping solution is room temperature, and the zinc dipping time is 30 to 60 seconds.

10. The method for forming and surface treating a twisted waveguide according to claim 1, characterized in that: The twist waveguide was washed with deionized water before each step of the surface treatment process.

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