A new process for increasing the adhesiveness of LCP material and LCP material

Abstract

The present invention belongs to the field of camera technology, and in particular, relates to a new process for increasing the adhesion of LCP materials and LCP materials. The new process for increasing the adhesion of LCP materials designs corresponding supporting devices according to the shape, size and installation structure of the FF type module of the camera, and plans a bonding surface for bonding a flexible circuit board of the camera on the supporting device. A pit array is provided on the bonding surface, and the pit array is composed of a plurality of pits. The bottom of the pit is a plane, and a plurality of inner side surfaces are provided in the pit. The supporting device is made of LCP material. The supporting device with this structure and material improves the adhesion performance of the flexible circuit board on the supporting device while ensuring the high temperature resistance, stability and mechanical properties of the supporting device.

Description

Technical Field

[0001] The invention belongs to the technical field of cameras, and in particular relates to a new process for increasing the adhesion of LCP materials and LCP materials. Background Art

[0002] The camera module includes lenses, sensors, infrared filters, flexible circuit boards, connectors and other components. These components are assembled through lens supporting components. The camera module is divided into FF type modules and AF type modules. The FF type module refers to a module with a fixed focal length, and the AF type module refers to a module that can automatically focus.

[0003] The lens support component of the camera module is generally a bracket made of plastic material. For example, the support component made of nylon material can be used to support the AF type module. The nylon material has a good bonding effect and can stably bond the flexible circuit board of the camera to the nylon support component. However, the nylon material has problems with the expansion coefficient, which leads to unstable screw torque. The FF type module is generally screwed to the support component. If the stability of the support component is not good, it directly affects the focusing stability of the module factory. Therefore, it is necessary to provide a processing technology for the support component suitable for the FF type module. Summary of the invention

[0004] The present invention aims to provide a new process for increasing the adhesion of LCP materials and LCP materials, so as to achieve stronger adhesion between the supporting device of the FF type module of the camera and the flexible circuit board of the camera through the new process for increasing the adhesion of LCP materials.

[0005] To achieve the above objectives, the present invention adopts the following technical solutions: A new process for increasing the adhesion of LCP materials is provided. The new process for increasing the adhesion of LCP materials is used to manufacture a supporting device for an FF type module of a camera, comprising: designing a corresponding supporting device according to the shape, size and mounting structure of the FF type module of the camera, and planning a bonding surface for bonding a flexible circuit board of the camera on the supporting device, wherein a pit array is provided on the bonding surface, the pit array consists of a plurality of pits, the bottom of the pit is a plane, and a plurality of inner side surfaces are provided in the pit; and manufacturing the supporting device by using LCP material.

[0006] Preferably, a raised area is provided on the bonding surface, and the pit array is arranged in the raised area.

[0007] Preferably, the pits are square pits, and isolation strips are provided between adjacent pits, and the top surfaces of the isolation strips are flat.

[0008] Preferably, the supporting device includes a circular ring portion on the front side and a square portion on the rear side, the circular ring portion is provided with an internal thread, the bonding surface is arranged on the back side of the square portion, mounting screw holes are provided at the corners of the square portion, and a snap-in position is provided on the side of the square portion.

[0009] Preferably, the method of manufacturing the support device by using the LCP material specifically includes: manufacturing a mold corresponding to the support device, and using the mold to inject and trim the molten LCP material to obtain the support device.

[0010] The present invention also provides an LCP material produced by a new process for increasing the adhesion of the LCP material described in any of the above items, and the LCP material is used as a supporting device for installing an FF type module of a camera.

[0011] Compared with the prior art, the beneficial effects of the present invention are: the new process for increasing the adhesion of LCP materials designs corresponding supporting devices according to the shape, size and installation structure of the FF type module of the camera, and plans a bonding surface for bonding the flexible circuit board of the camera on the supporting device, and a pit array is provided on the bonding surface, the pit array is composed of a plurality of pits, the bottom of the pit is a plane, and a plurality of inner side surfaces are provided in the pit, and the supporting device is made of LCP material. The supporting device with this structure and material improves the adhesion performance of the flexible circuit board on the supporting device while ensuring the high temperature resistance, stability and mechanical properties of the supporting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 A schematic diagram of the three-dimensional structure of a support device manufactured by an embodiment of a new process for increasing the adhesion of LCP materials of the present invention.

[0013] Figure 2 A schematic diagram of the partial structure of a support device manufactured by an embodiment of a new process for increasing the adhesion of LCP materials of the present invention.

[0014] Figure 3 An enlarged view of the pits of the support device made in accordance with an embodiment of the new process for increasing the adhesion of the LCP material of the present invention. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] In one embodiment, in combination Figure 1-3 As shown, a new process for increasing the adhesion of LCP materials is provided, and the new process for increasing the adhesion of LCP materials is used to make Figure 1 The supporting device 1 of the FF type module of the camera shown, the new process includes: designing the corresponding supporting device 1 according to the shape, size and installation structure of the FF type module of the camera, and planning a bonding surface 11 for bonding the flexible circuit board of the camera on the supporting device 1, and a pit array 12 is provided on the bonding surface 11, the pit array 12 is composed of a plurality of pits 121, the bottom of the pit 121 is a plane 1211, and a plurality of inner side surfaces 1212 are provided in the pit 121.

[0017] For example, for a camera on an electronic device, the FF type module of the camera is installed through the support device 1, and then the support device 1 is installed on the support frame of the electronic device. The FF type module is a fixed focus module, and the focal length is not adjustable. In the new process of increasing the adhesion of the LCP material, a pit array 12 is provided on the bonding surface 11. When the flexible circuit board of the camera is bonded to the bonding surface 11 by glue, the glue can enter the multiple pits 121 of the pit array 12, so that the flexible circuit board has a better bonding effect on the support device 1. The bottom of the pit 121 is a plane 1211, and a plurality of inner side surfaces 1212 are provided in the pit 121, which is conducive to increasing the bonding area of ​​the glue and ensuring a better bonding effect.

[0018] The new process for increasing the adhesion of the LCP material also includes: making a supporting device through the LCP material.

[0019] In the new process of increasing the adhesion of LCP materials, since the FF type module is a fixed-focus module with non-adjustable focal length, the requirements for its supporting device 1 are relatively high. Specifically, the supporting device 1 needs to meet the following characteristics: First, since the temperature of the camera's operating environment may increase, for example, for a camera used in an electronic device, the temperature of the electronic device will rise during use, and the temperature of the camera's environment will increase, so the supporting device 1 needs to have good temperature insensitivity, not deform at high temperatures and have good supporting force; secondly, since the focal length of the FF type module is fixed and cannot automatically focus during use, the supporting device 1 is required to have good structural stability and good mechanical properties to prevent the focal length of the FF type module from changing due to deformation of the supporting device 1; in addition, in order to meet some usage environment requirements, the supporting device 1 is also required to have good chemical corrosion resistance.

[0020] Based on the above factors, in the new process of increasing the adhesion of LCP material, LCP material is selected to make the support device 1. LCP material (liquid crystal polymer) is a polymer material with good high temperature tolerance, dimensional stability and mechanical properties, and its characteristics are very suitable for making the support device 1. However, the molecular structure of LCP material is a layered stacking structure, and the bonding force between layers is weak. When subjected to external forces such as shear, the layers are easily peeled off and the adhesion is poor. The flexible circuit board of the camera often needs to be set on the support device 1 by bonding. Therefore, in the new process of increasing the adhesion of LCP material, when designing the support device 1, a pit array 12 is set on the bonding surface 11 of the support device 1. While ensuring the high temperature resistance, stability and mechanical properties of the support device 1, the bonding performance of the flexible circuit board on the support device 1 is improved, and the flexible circuit board will not easily detach from the support device 1.

[0021] Further, in another embodiment, Figure 2 As shown, in the new process for increasing the adhesion of the LCP material, a raised area 13 is provided on the bonding surface 11, and the entire pit array 12 is arranged in the raised area 13. By providing the raised area 13, the flexible circuit board is bonded to the entire raised area 13 and does not contact the plane area on the bonding surface 11 outside the raised area 13, thereby ensuring firm bonding.

[0022] Further, in another embodiment, Figure 2 As shown, in the new process for increasing the adhesion of the LCP material, each pit 121 in the pit array 12 is a square pit, and an isolation strip 1213 is provided between adjacent pits 121, and the top surface of the isolation strip 1213 is a plane. By setting the top surface of the isolation strip 1213 to a plane, it is helpful to increase the adhesion area of ​​the glue.

[0023] Further, in another embodiment, Figure 1 As shown, in the new process of increasing the adhesion of LCP material, the support device 1 includes a circular ring portion 14 on the front side and a square portion 15 on the rear side, the circular ring portion 14 is provided with an internal thread, the bonding surface 11 is arranged on the back of the square portion 15, a mounting screw hole 151 is arranged at the corner of the square portion 15, and a clamping position 152 is arranged on the side of the square portion 15. The FF type module of the camera is screwed into the circular ring portion 14. Since the support device 1 of the LCP material has good temperature resistance, mechanical and corrosion resistance, its internal thread will not be easily deformed, and it is relatively stable to install the FF type module of the camera inside.

[0024] Further, in another embodiment, in the new process of increasing the adhesiveness of the LCP material, the aforementioned method of making the support device by the LCP material specifically includes: making a mold corresponding to the support device 1, using the mold to inject and trim the molten LCP material to obtain the support device 1. The entire structure of the support device 1 and the raised area 13 and the pit array 12 on the bonding surface 11 are formed by the mold, and other auxiliary materials are added to the molten LCP material according to the process requirements. Trimming the support device 1 refers to cutting, deburring, grinding and other processing techniques of the semi-finished product after compression molding.

[0025] In another embodiment, an LCP material produced by a new process for increasing the adhesion of an LCP material is provided. The LCP material and a supporting device 1 produced by the new process for increasing the adhesion of an LCP material are used to install an FF type module of a camera.

[0026] Based on the above embodiments, it can be known that the support device 1 made by the new process of increasing the adhesion of the LCP material, by setting the pit array 12, makes the passing thrust of the adhesion force between the flexible circuit board and the support device 1 be 20kg to 30kg, which is much higher than the adhesion force between the conventional plastic support device and the flexible circuit board (the passing thrust of the adhesion force between the conventional plastic support device and the flexible circuit board is 12kg to 20kg). The new process of increasing the adhesion of the LCP material solves the problem of unstable expansion coefficient caused by the traditional NTB (nylon material) support component.

[0027] It should be noted that, in this article, terms such as "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A new process for increasing the adhesion of LCP materials, characterized in that: The new process for increasing the adhesion of LCP material is used to make a supporting device for the FF type module of the camera, including: designing a corresponding supporting device according to the shape, size and installation structure of the FF type module of the camera, and planning a bonding surface for bonding the flexible circuit board of the camera on the supporting device, wherein a pit array is provided on the bonding surface, the pit array is composed of a plurality of pits, the bottom of the pit is a plane, and a plurality of inner side surfaces are provided in the pit; the supporting device is made of LCP material.

2. The novel process for increasing the adhesion of LCP materials according to claim 1, characterized in that: A convex area is provided on the bonding surface, and the pit array is arranged in the convex area.

3. The novel process for increasing the adhesion of LCP materials according to claim 1, characterized in that: The pits are square pits, and isolation strips are arranged between adjacent pits, and the top surfaces of the isolation strips are flat.

4. The novel process for increasing the adhesion of LCP materials according to claim 1, characterized in that: The supporting device comprises a circular ring portion at the front side and a square portion at the rear side, the circular ring portion is provided with an internal thread, the bonding surface is arranged on the back side of the square portion, mounting screw holes are arranged at the corners of the square portion, and a snap-in position is arranged on the side of the square portion.

5. The novel process for increasing the adhesion of LCP materials according to claim 1, characterized in that: The method of manufacturing the support device by using the LCP material specifically includes: manufacturing a mold corresponding to the support device, and using the mold to inject and trim the molten LCP material to obtain the support device.

6. An LCP material produced by a new process for increasing the adhesion of the LCP material according to any one of claims 1 to 5, the LCP material being used as a supporting device for installing an FF type module of a camera.

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