A high voltage SVG test device

Abstract

The present invention relates to the technical field of high-voltage power equipment testing. More specifically, the present invention relates to a high-voltage SVG testing device, comprising: a main control module, which is electrically connected to an SVG module to be tested; a power module, which is used to supply power to the SVG module to be tested; a voltage acquisition module, which is used to acquire the output voltage of the power module, and the voltage acquisition module is electrically connected to the main control module; a current acquisition module, which is used to acquire the output current of the power module, and the current acquisition module is electrically connected to the main control module; a temperature acquisition module, which is used to acquire the internal temperature of the SVG module to be tested, and the temperature acquisition module is electrically connected to the main control module. In order to solve the above problems, the present invention provides a high-voltage SVG testing device, comprising a main control module, a power module, a voltage acquisition module, a current acquisition module and a temperature acquisition module, so as to achieve the effect of improving the test accuracy and efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of high-voltage power equipment testing, and more specifically, to a high-voltage SVG testing device. Background Art

[0002] High-voltage SVG (static var generator) testing is an indispensable part of the power system. With the rapid development and complexity of the power system, the performance detection of high-voltage SVG equipment has become increasingly important. These devices play a key role in improving the stability and efficiency of the power grid, so comprehensive and accurate testing of them is essential. Traditional high-voltage SVG testing methods mainly rely on manual operation and empirical judgment, which have large uncertainties and error risks and cannot meet the requirements of modern power systems for high precision and automation.

[0003] To meet this challenge, the common high-voltage SVG testing methods currently include using a multi-channel data acquisition instrument to measure parameters such as voltage, current and temperature, and using an oscilloscope to observe the modulation waveform and output waveform of the drive circuit. In addition, there are some computer-aided data processing tools for analyzing test results and generating reports. However, these traditional methods usually require complex wiring and debugging processes, which are cumbersome and prone to errors. At the same time, the speed of data acquisition and analysis is slow, making it difficult to achieve real-time monitoring.

[0004] Although the above method can complete basic test tasks to a certain extent, there are still some significant deficiencies. For example, the lack of an integrated test platform leads to poor coordination between various functional modules, affecting the reliability and accuracy of the overall test. Especially in a high-voltage environment, various interference factors will have a greater impact on the test results, and existing test devices often cannot effectively eliminate these interferences, thereby reducing the effectiveness and credibility of the test. This is exactly the main technical problem to be solved by the present invention. Summary of the invention

[0005] The purpose of the present invention is to solve the above problems and provide a high-voltage SVG testing device, including a main control module, a power supply module, a voltage acquisition module, a current acquisition module and a temperature acquisition module, so as to achieve the effect of improving the test accuracy and efficiency.

[0006] In order to achieve these purposes and other advantages according to the present invention, a high voltage SVG testing device is provided, comprising:

[0007] A main control module, which is electrically connected to the SVG module to be tested;

[0008] A power module, which is used to supply power to the SVG module under test;

[0009] A voltage acquisition module, which is used to collect the output voltage of the power module, and the voltage acquisition module is electrically connected to the main control module;

[0010] A current acquisition module, which is used to collect the output current of the power module, and the current acquisition module is electrically connected to the main control module;

[0011] The temperature acquisition module is used to acquire the internal temperature of the SVG module to be tested, and the temperature acquisition module is electrically connected to the main control module.

[0012] Furthermore, in the high-voltage SVG test device, the main control module includes:

[0013] Controller;

[0014] The communication circuit is used to electrically connect the controller to the SVG module to be tested, the voltage acquisition module, the current acquisition module and the temperature acquisition module.

[0015] Furthermore, in the high-voltage SVG test device, the power module includes:

[0016] Power supply body;

[0017] A power supply control circuit, through which the power supply body supplies power to the SVG module to be tested.

[0018] Furthermore, in the high-voltage SVG test device, the power supply control circuit includes:

[0019] An electrostatic protection circuit, which is electrically connected to the power supply body;

[0020] an overvoltage protection circuit, which is electrically connected to the electrostatic protection circuit;

[0021] The overcurrent protection circuit is electrically connected to the overvoltage protection circuits respectively and outputs voltage to the SVG module to be tested.

[0022] Furthermore, the high-voltage SVG testing device further includes:

[0023] The waveform test module is used to collect the modulation wave waveform of the drive circuit of the SVG module to be tested, and the current and voltage waveforms output by the SVG module to be tested. The waveform test module is electrically connected to the main control module.

[0024] Furthermore, the high-voltage SVG testing device further includes:

[0025] A data analysis module is connected to the waveform testing module and the controller respectively.

[0026] Furthermore, the high-voltage SVG testing device further includes:

[0027] A human-computer interaction system is electrically connected to the communication circuit.

[0028] Furthermore, in the high-voltage SVG testing device, the voltage acquisition module is a voltage transformer, which is connected in parallel with the power supply module.

[0029] Furthermore, in the high-voltage SVG testing device, the current acquisition module is a current transformer, which is connected in series with the power module.

[0030] Furthermore, in the high-voltage SVG testing device, the temperature acquisition module is an infrared temperature sensor.

[0031] The beneficial effects of the present invention are:

[0032] The high-voltage SVG test device of the present invention supplies power to the SVG module to be tested through a power module, and then respectively collects the output voltage and output current of the power module through a voltage acquisition module and a current acquisition module, and collects the internal temperature of the SVG module to be tested through a temperature acquisition module. The high-voltage SVG test device has high integration, a friendly human-machine interface, complete functions, convenient installation, simple wiring, and can greatly improve the work efficiency of debuggers. At the same time, it better ensures the personal safety of debuggers and equipment safety.

[0033] Other advantages, objectives and features of the present invention will be embodied in part through the following description, and in part will be understood by those skilled in the art through study and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a structural schematic diagram of the high-voltage SVG testing device described in the present invention. DETAILED DESCRIPTION

[0035] The present invention is further described in detail below in conjunction with embodiments so that those skilled in the art can implement the invention with reference to the description.

[0036] It should be noted that, in the description of the present invention, the terms "lateral", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0037] The inventor of the present application has found that the existing high-voltage SVG testing device has problems such as low testing accuracy and complicated operation. Therefore, the present application mainly adopts the following high-voltage SVG testing device, including a main control module, a power supply module, a voltage acquisition module, a current acquisition module and a temperature acquisition module, so as to achieve the effect of improving the testing accuracy and efficiency. The present application is further described in detail below.

[0038] Example 1

[0039] The high-voltage SVG testing device provided in the embodiment of the present application includes:

[0040] A main control module, which is electrically connected to the SVG module to be tested;

[0041] A power module, which is used to supply power to the SVG module under test;

[0042] A voltage acquisition module, which is used to collect the output voltage of the power module, and the voltage acquisition module is electrically connected to the main control module;

[0043] A current acquisition module, which is used to collect the output current of the power module, and the current acquisition module is electrically connected to the main control module;

[0044] The temperature acquisition module is used to acquire the internal temperature of the SVG module to be tested, and the temperature acquisition module is electrically connected to the main control module.

[0045] Wherein, the main control module includes:

[0046] Controller;

[0047] The communication circuit is used to electrically connect the controller to the SVG module to be tested, the voltage acquisition module, the current acquisition module and the temperature acquisition module.

[0048] Wherein, the power module comprises:

[0049] Power supply body;

[0050] A power supply control circuit, through which the power supply body supplies power to the SVG module to be tested.

[0051] Wherein, the power control circuit comprises:

[0052] An electrostatic protection circuit, which is electrically connected to the power supply body;

[0053] an overvoltage protection circuit, which is electrically connected to the electrostatic protection circuit;

[0054] The overcurrent protection circuit is electrically connected to the overvoltage protection circuits respectively and outputs voltage to the SVG module to be tested.

[0055] Among them, it also includes:

[0056] The waveform test module is used to collect the modulation wave waveform of the drive circuit of the SVG module to be tested, and the current and voltage waveforms output by the SVG module to be tested. The waveform test module is electrically connected to the main control module.

[0057] Among them, it also includes:

[0058] A data analysis module is connected to the waveform testing module and the controller respectively.

[0059] Among them, it also includes:

[0060] A human-computer interaction system is electrically connected to the communication circuit.

[0061] Wherein, the voltage acquisition module is a voltage transformer, which is connected in parallel with the power supply module.

[0062] Wherein, the current acquisition module is a current transformer, which is connected in series with the power supply module.

[0063] Wherein, the temperature acquisition module is an infrared temperature sensor.

[0064] Example 2

[0065] The high-voltage SVG test device provided in the embodiment of the present application includes a main control module, a power supply module, a voltage acquisition module, a current acquisition module and a temperature acquisition module. The coordination relationship between the modules is as follows:

[0066] The main control module includes a controller and a communication circuit. The controller is electrically connected to the SVG module to be tested, the voltage acquisition module, the current acquisition module and the temperature acquisition module through the communication circuit. The controller can use an ARM processor or a DSP processor, and the communication circuit can be an RS-485 bus or a CAN bus. This design enables the main control module to centrally manage and control the working status of each module, thereby improving the integration and reliability of the system.

[0067] The power module is responsible for supplying power to the SVG module under test, and includes a power supply body and a power control circuit. The power supply body can be a switching power supply or a linear power supply, and the specific choice depends on the power requirements and cost budget of the actual application. The power control circuit is responsible for regulating and managing the power output to ensure that the SVG module under test works under safe and stable conditions. For example, the power control circuit can include an electrostatic protection circuit, an overvoltage protection circuit, and an overcurrent protection circuit, which work together to prevent external interference and abnormal conditions from affecting the system.

[0068] The voltage acquisition module is used to collect the output voltage of the power module and is electrically connected to the main control module. This module can select a voltage transformer as the main component and connect it in parallel to the output port of the power module. The voltage transformer has the characteristics of high precision and low loss, and is suitable for voltage measurement in high-voltage environments. In addition, the use of a Hall effect sensor can also be considered, which has a fast response speed and can accurately obtain the voltage value in a short time.

[0069] The current acquisition module is used to collect the output current of the power module and is also electrically connected to the main control module. This module can use a current transformer as the main component and connect it in series in the output line of the power module. The current transformer has good isolation performance and high measurement accuracy, and is suitable for large current applications. In addition, a shunt resistor can be used to indirectly calculate the current value by measuring the voltage difference across the resistor. This method is simple and easy, but attention should be paid to the selection of the resistor to avoid introducing additional errors.

[0070] The temperature acquisition module is used to collect the internal temperature of the SVG module to be tested and is electrically connected to the main control module. Commonly used temperature sensors include infrared temperature sensors and thermocouples. Infrared temperature sensors can measure temperature without contacting the object to be measured, which is particularly suitable for high temperature environments. Thermocouples are more durable and suitable for long-term continuous operation. Both sensors can convert temperature signals into electrical signals that can be recognized by the main control module through appropriate signal conditioning circuits.

[0071] Example 3

[0072] The present embodiment differs from the above embodiment in that a waveform test module and a data analysis module are added. Specifically, the waveform test module is used to collect the modulation wave waveform of the drive circuit of the SVG module to be tested and the current and voltage waveforms output by the SVG module to be tested, and is electrically connected to the main control module. The data analysis module is respectively connected to the waveform test module and the controller, and is used to process and analyze the collected waveform data in real time.

[0073] The waveform test module can use a high-speed oscilloscope as the core component, equipped with multiple channels to collect multiple signals simultaneously. The oscilloscope has a high bandwidth and a high sampling rate, which can capture the details of rapidly changing waveforms and is suitable for measuring high-frequency and pulse signals. In addition to the oscilloscope, you can also consider using a digital storage oscilloscope (DSO), which can not only record waveform data, but also perform preliminary analysis through built-in algorithms to facilitate subsequent data processing.

[0074] The data analysis module is mainly composed of a high-performance processor and a dedicated algorithm, which can perform various processing such as filtering, spectrum analysis, and peak detection on waveform data. The processor can be an embedded microprocessor or FPGA. The former has low power consumption and is easy to program, while the latter has higher computing power and flexibility. Through the processing of the data analysis module, users can more intuitively understand the actual working status of the SVG module to be tested, discover potential problems in time, and take corresponding measures.

[0075] Example 4

[0076] The difference between this embodiment and the above embodiment is that a human-computer interaction system is added. Specifically, the human-computer interaction system is electrically connected to the communication circuit of the main control module to realize the interaction between the user and the test device. The human-computer interaction system can be a touch screen display that integrates a graphical interface and key input functions to facilitate the user to set parameters, display results and diagnose faults.

[0077] The hardware part of the human-computer interaction system can use industrial-grade touch screens, which have the characteristics of strong durability and sensitive response. The screen resolution can be selected according to actual needs. It is generally recommended to be no less than 800x480 pixels to ensure clear display. The software part needs to develop corresponding user interface programs, including menu navigation, data entry, chart drawing and other functions. In addition, voice prompts and alarm functions need to be added to remind users in critical operations or abnormal situations.

[0078] Example 5

[0079] The difference between this embodiment and the above embodiment is that the design is optimized for a specific application scenario. Assume that a wind power station in a remote area needs a portable and easy-to-operate high-voltage SVG test device due to inconvenient transportation and shortage of technicians. To this end, this embodiment adjusts the power module and data transmission method.

[0080] The power module uses a combination of solar panels and energy storage batteries, which not only solves the problem of on-site power supply, but also is environmentally friendly and energy-saving. Solar panels can be installed on the top of the device or other suitable locations, and convert sunlight into electrical energy and store it in batteries through the photovoltaic effect. Energy storage batteries must be high-capacity and long-life types, such as lithium-ion batteries or lead-acid batteries, to ensure continuous power supply.

[0081] The data transmission mode is changed to wireless communication mode, using Wi-Fi or Bluetooth technology to achieve long-distance data transmission. In this way, technicians only need to carry a laptop or smartphone to receive and analyze test results anytime and anywhere, which greatly facilitates on-site operations. The wireless communication module can be built into the main control module and connected to other modules through a standard interface to ensure the stability and security of data transmission.

[0082] Example 6

[0083] The difference between this embodiment and the above embodiment is that redundant design and self-checking function are added to improve the reliability and stability of the test device. Specifically, each key module is equipped with a backup unit. Once the main unit fails, the backup unit will automatically take over the work to ensure that the test process is uninterrupted. In addition, a self-checking system is added to regularly check the status of each module, detect potential problems in advance and issue an alarm.

[0084] Redundancy design is reflected in many key parts such as the main control module, power module, voltage acquisition module, current acquisition module and temperature acquisition module. For example, the controller and communication circuit of the main control module are equipped with dual backup, and any failure will not affect the overall function. The same is true for the power supply body and power control circuit of the power module, which achieve seamless transition through the switching mechanism. The voltage acquisition module and the current acquisition module use dual sensor configurations, which can continue to work normally even if one of them fails. The temperature acquisition module is also equipped with multiple sensors, which are dispersed to cover a larger range.

[0085] The self-check system is an independent subsystem that starts at a fixed time and performs health checks on each module. It can detect whether the power supply is normal, whether the sensor readings are accurate, whether the communication link is smooth, etc. If a problem is found, the self-check system will immediately report it to the main control module and trigger the corresponding early warning mechanism. At the same time, the self-check system will also generate detailed log files for technicians to review and analyze afterwards.

[0086] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the implementation modes. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the embodiments shown and described herein.

Claims

1. A high voltage SVG test device, characterized in that: include: A main control module, which is electrically connected to the SVG module to be tested; A power module, which is used to supply power to the SVG module under test; A voltage acquisition module, which is used to collect the output voltage of the power module, and the voltage acquisition module is electrically connected to the main control module; A current acquisition module, which is used to collect the output current of the power module, and the current acquisition module is electrically connected to the main control module; The temperature acquisition module is used to acquire the internal temperature of the SVG module to be tested, and the temperature acquisition module is electrically connected to the main control module.

2. A high voltage SVG test device as claimed in claim 1, characterized in that: The main control module comprises: Controller; The communication circuit is used to electrically connect the controller to the SVG module to be tested, the voltage acquisition module, the current acquisition module and the temperature acquisition module.

3. A high voltage SVG test device as claimed in claim 2, characterized in that: The power module comprises: Power supply body; A power supply control circuit, through which the power supply body supplies power to the SVG module to be tested.

4. A high voltage SVG test device as claimed in claim 2, characterized in that: The power control circuit comprises: An electrostatic protection circuit, which is electrically connected to the power supply body; an overvoltage protection circuit, which is electrically connected to the electrostatic protection circuit; The overcurrent protection circuit is electrically connected to the overvoltage protection circuits respectively and outputs voltage to the SVG module to be tested.

5. A high voltage SVG testing device as claimed in claim 2, characterized in that: Also includes: The waveform test module is used to collect the modulation wave waveform of the drive circuit of the SVG module to be tested, and the current and voltage waveforms output by the SVG module to be tested. The waveform test module is electrically connected to the main control module.

6. A high voltage SVG testing device as claimed in claim 5, characterized in that: Also includes: A data analysis module is connected to the waveform testing module and the controller respectively.

7. A high voltage SVG testing device as claimed in claim 2, characterized in that: Also includes: A human-computer interaction system is electrically connected to the communication circuit.

8. A high voltage SVG testing device according to any one of claims 1 to 6, characterized in that: The voltage acquisition module is a voltage transformer, which is connected in parallel with the power supply module.

9. A high voltage SVG testing device according to any one of claims 1 to 6, characterized in that: The current acquisition module is a current transformer, which is connected in series with the power supply module.

10. A high voltage SVG testing device according to any one of claims 1 to 6, characterized in that: The temperature acquisition module is an infrared temperature sensor.

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