Storage system

Abstract

The invention provides a storage system, and relates to the technical field of memory expansion cards, and the storage system is characterized in that each memory expansion board card in a plurality of memory expansion board cards is connected with a corresponding type of memory unit in a plurality of types of memory units; the memory expansion chip board card is provided with a memory expansion chip, the memory expansion board card is provided with a connector, and the memory expansion chip board card and the memory expansion board card are connected through the connector, so that the reuse rate of the memory expansion chip board card can be improved, and the memory upgrading cost can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of memory expansion cards, and in particular to a storage system. Background Art

[0002] CXL (Compute Express Link) technology is a new type of high-speed interconnect technology designed to provide higher data throughput and lower latency to meet the needs of modern computing and storage systems. With the growing demand for computing, traditional PCI Express (PCIe) technology can no longer meet the needs of data centers and high-performance computing for faster and more efficient interconnect technologies. In order to solve the problems of memory walls and IO walls, Intel launched CXL technology based on the PCIe protocol in 2019, which quickly became the industry-recognized advanced device interconnection standard. Through CXL, the CPU can access a larger memory pool on the connected device with low latency and high bandwidth, thereby expanding memory capacity and improving the performance of AI / ML applications. DDR4 is a high-speed, high-capacity dynamic random access memory (DRAM) widely used in computers and other electronic systems. DDR5 technology is the latest generation of double data rate synchronous dynamic random access memory (SDRAM), with higher speed, larger capacity and lower power consumption. Compared with the previous generation DDR4, DDR5 brings many major improvements and innovative features, making it more suitable for high-performance computing and big data processing needs.

[0003] Since the CXL protocol can achieve cache consistency between two chips, memory expansion can be achieved through the CXL expansion chip. Since the CXL expansion chip is compatible with different DDR rates, the existing memory expansion cards based on the CXL protocol generally support two memory stick forms: DDR5 memory and DDR4 memory. However, there are many differences between DDR5 memory and DDR4 memory, and these two types of memory cannot be perfectly compatible on the same chip. With the elimination of DDR4 memory and the popularization of DDR5 memory, these shortcomings will cause users to need to frequently replace expansion cards, increasing the cost of expansion cards and waste of resources. Summary of the invention

[0004] In view of this, an embodiment of the present application provides a storage system to overcome the above problems or at least partially solve the above problems.

[0005] A first aspect of an embodiment of the present application provides a storage system, the storage system comprising: a plurality of memory expansion boards, a memory expansion chip board, and a plurality of types of memory units; Each memory expansion board of the plurality of memory expansion boards is connected to a corresponding type of memory unit of the plurality of types of memory units; The memory expansion chip board is configured with a memory expansion chip, and the memory expansion board is configured with a connector, and the memory expansion chip board and the memory expansion board are connected via the connector.

[0006] Optionally, the memory expansion board is configured with a first pin, and the memory expansion chip board is configured with multiple types of second pins; The multiple types of second pins correspond to the multiple types of memory units.

[0007] Optionally, the voltage conversion module is connected to the server mainboard via a first golden finger to obtain power provided by the server mainboard; The voltage conversion module is connected to the memory unit on the memory expansion board and the memory expansion chip board on the memory expansion board; The voltage conversion module is used to determine the voltage requirement required by the memory expansion chip board and the voltage requirement required by the memory unit on the memory expansion board; The voltage conversion module is used to perform a first voltage conversion on the power provided by the server mainboard according to the voltage requirement of the memory expansion chip board, so that the memory expansion chip board obtains the first power that meets the voltage requirement of the memory expansion chip board; The voltage conversion module is used to perform a second voltage conversion on the power provided by the server mainboard according to the voltage requirement of the memory unit on the memory expansion board, so that the memory unit on the memory expansion board obtains the second power that meets the voltage requirement of the memory unit on the memory expansion board; The memory expansion chip board obtains the first power supply after the first voltage conversion by the voltage conversion module through the connector.

[0008] Optionally, the memory expansion board is connected to multiple expansion chip boards via multiple connectors; The memory expansion board is also provided with a clock signal buffer, and the clock signal buffer is connected to a plurality of expansion chip boards on the memory expansion board.

[0009] Optionally, the plurality of memory expansion boards include a first memory expansion board and a second memory expansion board, and the plurality of types of memory units are divided into memory units of a first target type and memory units of a second target type; The first memory expansion board is connected to a memory unit of the first target type; The second memory expansion board is connected to the memory unit of the second target type; When the memory unit of the first target type needs to be used, the memory extension chip board is detachably connected to the first memory extension board through the connector on the first memory extension board; When a memory unit of the second target type needs to be used, the memory expansion chip board is removed from the first memory expansion board, and the memory expansion chip board is detachably connected to the second memory expansion board through a connector on the second memory expansion board.

[0010] Optionally, the memory expansion board is provided with a memory slot; the memory unit at least comprises a memory bar; The memory bar is indirectly connected to the memory expansion board through the memory slot.

[0011] Optionally, the memory unit includes at least memory particles; The memory particles are connected to the memory expansion board by means of front and back surface patch welding.

[0012] Optionally, the memory unit further includes a verification particle; The verification particle is connected to the memory expansion board by means of front and back surface patch welding.

[0013] Optionally, the memory expansion board is further configured with a baseboard slot, the memory expansion chip board comprises a first surface and a second surface, the first surface is perpendicular to the second surface, and the area of ​​the first surface is greater than the area of ​​the second surface; wherein: The memory extension chip is connected to the memory extension chip board on the first surface through the connector; The second surface of the memory expansion chip board is also provided with a second gold finger, and the memory expansion chip board is connected to the baseboard slot of the memory expansion board through the second gold finger.

[0014] Optionally, the memory expansion chip board further includes a third surface, and the third surface is parallel to the first surface; A heat sink is also disposed on the third surface of the memory expansion chip board.

[0015] Beneficial effects of this application: An embodiment of the present application provides a storage system, which includes: multiple memory expansion boards, a memory expansion chip board, and multiple types of memory units; each of the multiple memory expansion boards is connected to a corresponding type of memory unit among the multiple types of memory units; the memory expansion chip board is configured with a memory expansion chip, the memory expansion board is configured with a connector, and the memory expansion chip board and the memory expansion board are connected through the connector.

[0016] Through the technical solution of the present application, the memory expansion chip is decoupled from the memory expansion board by means of a memory expansion chip board, and the same memory expansion chip can be reused on expansion boards of various memory types. In addition, the use of a connector improves the convenience of disassembly and installation of the memory expansion chip board, avoids the cost waste of the entire expansion card being scrapped after the memory upgrade, and greatly reduces the total memory cost consumption and the cost of memory upgrades. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application.

[0018] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the description of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] Figure 1 It is a structural schematic diagram of a memory expansion board in a storage system provided by an embodiment of the present application; Figure 2 It is a structural schematic diagram of a memory expansion board including a voltage conversion module provided by the present application; Figure 3 It is a structural schematic diagram of a memory expansion board including multiple memory expansion chip boards provided by an embodiment of the present application; Figure 4 It is a structural schematic diagram of a memory expansion board including a memory slot provided in an embodiment of the present application; Figure 5 It is a structural schematic diagram of a memory expansion board including memory chips provided in an embodiment of the present application; Figure 6 This is a schematic diagram of placing another memory expansion chip board provided by an embodiment of the present application; Figure 7It is a schematic diagram of the structure of a side surface of a memory expansion board including a heat sink provided in one embodiment of the present application. DETAILED DESCRIPTION

[0020] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] DDR4 is a high-speed, high-capacity dynamic random access memory (DRAM) widely used in computers and other electronic systems. DDR4 uses capacitors and transistors to store and read and write data. The charging of the capacitor represents "1" and the discharging of the capacitor represents "0". Transistors are used as switches to control the charging and discharging process of the capacitor. Each storage unit (cell) of DDR4 is located on the crossed word line (Word Line) and bit line (Bit Line). By selectively turning on the transistor on the word line, connecting the bit line and the capacitor, data can be read and written. Compared with the previous DDR3, DDR4 has improved data pre-fetching capabilities and can process data faster. DDR4 chips support higher memory frequencies and lower power consumption, usually working under 1.2V power supply, which is more energy-efficient than DDR3.

[0023] DDR5 technology is the latest generation of double data rate synchronous dynamic random access memory (SDRAM), with higher speed, larger capacity and lower power consumption. Compared with the previous generation DDR4, DDR5 brings many major improvements and innovative features, making it more suitable for high-performance computing and big data processing needs. The starting frequency of DDR5 is 4800MT / s, and it can reach up to 8400MT / s, and may even exceed 10000MT / s under overclocking. This is a significant improvement over the standard speed range of DDR4 (2133MT / s to 3200MT / s). DDR5 can perform data transmission on both the rising and falling edges of each clock. This bidirectional data transmission architecture greatly improves efficiency and bandwidth. The voltage is reduced from 1.2V of DDR4 to 1.1V of DDR5, which effectively reduces operating power consumption and improves energy efficiency. DDR5 memory sticks are divided into two independent sub-channels, each with its own independent data path. This design allows data to be accessed concurrently, improving transmission speed and reducing access latency.

[0024] There are currently several types of memory expansion boards.

[0025] The first method: Use different memory expansion chips and corresponding different firmware (FW) to achieve support for DDR5 memory and DDR4 memory. This method requires the production of two expansion cards, one using the DDR4 memory slot and the other using the DDR5 memory slot.

[0026] The second method: Use a memory expansion chip to bring out all the signals required for the DDR5 and DDR4 protocols, and use different FWs to support different memory sticks. However, this generally requires making two expansion cards and welding different memory slots to install different memory sticks.

[0027] The above two forms have the following disadvantages: The first one: Disadvantages of different memory expansion chips: Different expansion chips mean that expansion cards for expanding DDR4 memory are completely incompatible with DDR5 memory. As DDR4 memory is gradually being phased out, DDR4 expansion cards can no longer be reused, further increasing costs and reducing the cost-effectiveness of expansion cards, making them unsuitable for continued development on subsequent machines.

[0028] The second type: Disadvantages of one chip and two expansion cards: Since ordinary expansion card chips are soldered on the motherboard, DDR4 expansion cards still cannot be reused on DDR5 memory, which wastes the chip's compatibility and fails to fully utilize the advantages of chip reuse memory. As DDR4 memory is gradually eliminated, the ability of DDR4 expansion cards to reduce costs will gradually disappear.

[0029] Based on the shortcomings of the above two forms, an embodiment of the present application provides a storage system, the storage system comprising: a plurality of memory expansion boards, a memory expansion chip board, and a plurality of types of memory units; Each memory expansion board of the plurality of memory expansion boards is connected to a corresponding type of memory unit of the plurality of types of memory units; The memory expansion chip board is configured with a memory expansion chip, and the memory expansion board is configured with a connector, and the memory expansion chip board and the memory expansion board are connected via the connector.

[0030] Specifically, Figure 1 1 is a schematic diagram of a memory expansion board in a storage system provided in an embodiment of the present application. In one embodiment, the present application provides a storage system, which includes multiple memory expansion boards, memory expansion chip boards, and multiple types of memory units, wherein, for example, Figure 1As shown in the figure, a memory expansion board refers to a memory expansion board designed for a type of memory unit. On this memory expansion board, the memory unit of this type can be expanded. Each memory expansion board is specially optimized to adapt to a specific type of memory unit to ensure the best performance and compatibility. For example: DDR4 memory, DDR5 memory or other memory.

[0031] Therefore, in order to meet the expansion of various types of memory units, the storage system needs to include various types of memory expansion boards. In addition, the storage system also includes a memory expansion chip board. The memory expansion chip board is based on CXL technology. CXL technology can expand memory capacity, improve memory scalability and bandwidth, and reduce latency. Therefore, the memory expansion chip board is compatible with various types of memory units.

[0032] At the same time, the storage system also includes various types of memory units to ensure the storage capacity, data transmission and other requirements of the storage system.

[0033] Among them, the multiple memory expansion boards are respectively suitable for multiple types of memory units, and the memory units are connected to the corresponding memory expansion boards, and the connection method can be a specific memory slot or welding.

[0034] The memory expansion chip board is equipped with a memory expansion chip. The memory expansion chip adopts a board design that can be reused on different memory expansion boards through the memory expansion chip board. Specifically, the memory expansion chip is responsible for managing and controlling the memory expansion boards connected to the storage system and the memory units on these boards. The memory expansion chip acts as the brain of the entire memory expansion board and can process all memory-related data processing tasks contained in each memory unit on the memory expansion board connected to the memory expansion chip board, including data transmission, memory allocation, cache consistency, and error correction.

[0035] The memory expansion board has a connector, which is used when a target type of memory unit among multiple types of memory units needs to be used. The connector can connect the memory expansion chip board to the memory expansion board where the target type of memory unit is located through a detachable connection. The connector can be a board-to-board connector, which is designed to achieve fast and reliable connection between boards.

[0036] The memory expansion board can be connected to the server mainboard to expand the memory unit.

[0037] In this way, by setting the memory expansion chip on a separate board (memory expansion chip board), the modular design of decoupling the memory expansion chip from the memory expansion board allows the memory expansion chip connected to a memory expansion board to be disassembled and connected to other memory expansion boards, thereby realizing the reuse of the memory expansion chip. In particular, when a specific type (i.e., target type) of memory unit is required, the user can detachably connect the memory expansion chip board to the memory expansion board where the required specific type of memory unit is located through a connector. This design allows users to flexibly configure the storage system according to specific needs without replacing the entire memory expansion board. At the same time, the memory expansion board can also be connected to other memory expansion chip boards.

[0038] Through the above embodiments, the design of the storage system allows the user to use a detachably connected memory expansion chip board to easily add, remove or replace the original memory expansion board according to application requirements, thereby achieving instant expansion of storage capacity and performance, improving the material utilization of the memory expansion chip, and reducing the overall contract of the memory expansion board.

[0039] Moreover, this flexibility is particularly important in a rapidly changing technology environment, as it allows the system to adapt to new memory technologies without a comprehensive hardware replacement. Through the modular design of the memory expansion chip board, users can use different types of memory with only one memory expansion chip board, making the use of the memory expansion board more convenient.

[0040] In addition, the reusability of memory expansion chip boards also reduces long-term operating costs. Each memory expansion board is optimized for its specific memory unit, and the storage system can provide the best performance memory expansion chip for each memory type of memory unit. The centralized management of memory expansion chips further ensures the efficiency of data transmission and the speed of memory access. When the storage system needs to be maintained or upgraded, users can easily remove and replace specific memory expansion chip boards without affecting the operation of other parts or making major changes to the entire storage system architecture. This ensures the long-term compatibility and sustainable development of the system.

[0041] Optionally, the memory expansion board is configured with a first pin, and the memory expansion chip board is configured with multiple types of second pins; The multiple types of second pins correspond to the multiple types of memory units.

[0042] Specifically, in one embodiment, in order to ensure that the same memory expansion chip board can provide and receive required signals to different types of memory units, corresponding pins need to be brought out on the memory expansion board and the memory expansion chip of the memory expansion chip board.

[0043] Among them, each memory expansion board has the required first pins brought out according to the type of memory unit adapted on the memory expansion board. Since the memory expansion chip board needs to be compatible with different types of memory units, the memory expansion chip board needs to bring out multiple types of second pins correspondingly according to the multiple types of compatible memory units.

[0044] Therefore, after the memory expansion chip board is detachably connected to the memory expansion board where the target type of memory unit is located, the signal required by the target type of memory unit can be brought out to the corresponding first pin of the target type of memory unit on the memory expansion board through the second pin corresponding to the target type of memory unit, so that the first pin and the second pin are electrically connected.

[0045] In this way, the memory expansion chip of the memory expansion chip board can lead out the signals required by the memory unit of the target type through the second pin of the target type and the first pin on the memory expansion board, where the signals include data signals, address signals, EEC check signals, etc. These signals can be reused and can be specifically led out and connected according to the memory expansion chip design.

[0046] Through the above embodiments, specific pins are designed for each type of memory unit, and the storage system can easily adapt to different memory technologies without replacing the entire board. This modular design concept greatly improves the flexibility and scalability of the system. The multiple types of second pins on the memory expansion chip board can ensure that different types of memory units receive the correct signals, including data signals, address signals, and check signals. This helps to improve the reliability of data transmission and the stability of the system. By standardizing the connection between the memory expansion chip board and the memory expansion board, the storage system design becomes simpler. Designers can easily add or replace memory expansion boards to adapt to different application requirements or technology upgrades. When the memory unit or expansion chip needs maintenance or upgrade, the relevant board can be quickly and easily removed and replaced without affecting other parts of the storage system. This reduces maintenance costs and reduces system downtime. This design allows the system to be compatible with multiple types of memory units, including current and future technologies. The storage system can easily adapt to new memory standards without a comprehensive hardware replacement. By accurately providing the required signals to each memory unit, the storage system can avoid unnecessary energy waste.

[0047] Optionally, the voltage conversion module is connected to the server mainboard via a first golden finger to obtain power provided by the server mainboard; The voltage conversion module is connected to the memory unit on the memory expansion board and the memory expansion chip board on the memory expansion board; The voltage conversion module is used to determine the voltage requirement required by the memory expansion chip board and the voltage requirement required by the memory unit on the memory expansion board; The voltage conversion module is used to perform a first voltage conversion on the power provided by the server mainboard according to the voltage requirement of the memory expansion chip board, so that the memory expansion chip board obtains the first power that meets the voltage requirement of the memory expansion chip board; The voltage conversion module is used to perform a second voltage conversion on the power provided by the server mainboard according to the voltage requirement of the memory unit on the memory expansion board, so that the memory unit on the memory expansion board obtains the second power that meets the voltage requirement of the memory unit on the memory expansion board; The memory expansion chip board obtains the first power supply after the first voltage conversion by the voltage conversion module through the connector.

[0048] Specifically, Figure 2 is a schematic diagram of the structure of a memory expansion board including a voltage conversion module provided by the present application. In one embodiment, Figure 2 As shown, considering that the power supply voltages required by various electronic components on the memory expansion board may be different, for example, DDR5 memory needs to be powered by 12V, 3.3V voltages, and DDR4 memory needs to be powered by 2.5V, 0.6V, and 1.2V voltages.

[0049] Therefore, in this embodiment, a voltage conversion module is provided, which is located on the memory expansion board and is connected to the power supply provided by the server mainboard through the first gold finger. The core function of the voltage conversion module is to identify and provide the specific voltage required by the memory expansion chip board and the memory unit.

[0050] Specifically, before the voltage conversion, the voltage conversion module can determine the voltage requirement required by the memory extension chip board and the voltage requirement required by the memory unit on the memory extension board.

[0051] Furthermore, during the voltage conversion process, the voltage conversion module first performs a first voltage conversion on the power provided by the server mainboard according to the voltage requirement of the memory expansion chip board. In this way, the memory expansion chip board in the memory expansion chip board can obtain a first power supply that meets the working voltage requirement. The memory expansion chip board obtains the first power supply after the first voltage conversion by the voltage conversion module through the connector.

[0052] Next, the voltage conversion module performs a second voltage conversion on the power provided by the server mainboard according to the voltage requirement of the memory unit connected to the memory expansion board, thereby ensuring that the memory unit can obtain the second power supply that meets the working voltage requirement of the memory unit.

[0053] Through the above embodiments, by providing accurate power supply voltage, the voltage conversion module ensures that the memory expansion chip and the memory unit can operate stably at the required voltage requirements, avoiding the risk of performance degradation or damage caused by voltage mismatch. In addition, this design enables the memory expansion board to adapt to memory units and expansion chips with different voltage requirements, thereby improving the compatibility and flexibility of the storage system. The voltage conversion module usually adopts efficient conversion technology, such as a switching regulator, which can reduce energy loss and improve power efficiency compared to traditional linear regulators. The design of the voltage conversion module can also support hot-swap function, allowing the memory expansion board to be replaced or upgraded without restarting the system, thereby increasing the maintenance convenience of the system. Through the voltage conversion module, overvoltage protection and undervoltage protection can be provided for the system to avoid damage to the circuit caused by abnormal voltage. The voltage conversion module integrated on the memory expansion board provides a flexible, efficient and safe power supply solution for the storage system, meets the specific requirements of different electronic components for power supply voltage, and ensures the stable operation and performance of the entire storage system.

[0054] Optionally, the memory expansion board is connected to multiple expansion chip boards via multiple connectors; The memory expansion board is also provided with a clock signal buffer, and the clock signal buffer is connected to a plurality of expansion chip boards on the memory expansion board.

[0055] Specifically, Figure 3 1 is a schematic diagram of a memory expansion card including multiple memory expansion chip cards provided by an embodiment of the present application. Figure 3 As shown in the figure, a memory expansion board can be connected to multiple memory expansion chip boards at the same time to manage multiple memory units on a memory expansion board. Since the standard PCIe gold finger only provides a set of 100M clock signals, it cannot meet the scenario of multiple memory expansion chips.

[0056] Therefore, it is necessary to integrate a clock signal buffer (i.e., clock signal buffer) on the memory expansion board so that when multiple memory expansion chip boards are connected, multiple sets of clock signals can be provided to these memory expansion chips to ensure that each memory expansion chip can obtain a set of stable clock signals. Clock signals are essential for synchronous circuit operation, especially in high-speed data processing and communication. By providing each expansion chip with a set of independent clock signals, data can be transmitted synchronously between chips to avoid data errors or processing delays caused by clock deviation.

[0057] The memory expansion board is equipped with a clock signal buffer, which is an electronic device used to receive, amplify and redistribute clock signals. When multiple expansion chip boards are connected, the clock signal buffer ensures that each chip can obtain a synchronized clock signal from a single clock source.

[0058] Through the above embodiments, when multiple expansion chip boards are connected, the memory expansion board can be provided with a clock signal buffer. The use of the clock signal buffer ensures that each chip can obtain a stable and synchronized clock signal even in a multi-chip environment. This is essential for maintaining the accuracy of data transmission and the reliability of the system. Due to the design of the clock signal buffer and the connector, system maintenance and upgrades become more flexible. If a certain memory expansion chip needs to be replaced or upgraded, it can be easily done without affecting the operation of other memory expansion chips or the entire storage system.

[0059] Optionally, the plurality of memory expansion boards include a first memory expansion board and a second memory expansion board, and the plurality of types of memory units are divided into memory units of a first target type and memory units of a second target type; The first memory expansion board is connected to a memory unit of the first target type; The second memory expansion board is connected to the memory unit of the second target type; When the memory unit of the first target type needs to be used, the memory extension chip board is detachably connected to the first memory extension board through the connector on the first memory extension board; When a memory unit of the second target type needs to be used, the memory expansion chip board is removed from the first memory expansion board, and the memory expansion chip board is detachably connected to the second memory expansion board through a connector on the second memory expansion board.

[0060] Specifically, in one embodiment, the storage system supports different types of memory units by using different types of memory expansion boards. In this design, there are two types of memory expansion boards: a first memory expansion board and a second memory expansion board, which are respectively used to connect to memory units of two different target types. The first memory expansion board is connected to the memory unit of the first target type, and the second memory expansion board is connected to the memory unit of the second target type.

[0061] For example, the memory unit of the first target type is DDR4 memory, and the memory unit of the second target type is DDR5 memory. Therefore, the first memory expansion board can be connected to DDR4 memory, and the second memory expansion board can be connected to DDR5 memory. Conversely, the memory unit of the first target type can also be DDR5 memory, and the memory unit of the second target type can also be DDR4 memory. When the memory unit of the first target type needs to be used, the memory expansion chip board can be detachably connected to the first memory expansion board through the connector on the first memory expansion board, so as to realize the management of the memory unit of the first target type in the memory expansion chip. Similarly, when it is necessary to use the memory expansion chip that is already connected to the first memory expansion board to manage the memory unit of the second target type, the memory expansion chip board that is already connected to the first memory expansion board can be removed from the first memory expansion board, and the removed memory expansion chip board can be detachably connected to the second memory expansion board connected to the memory unit of the second target type through the connector on the second memory expansion board, so as to realize the management of the memory unit of the second target type by the memory expansion chip. During the whole process, only the memory expansion chip board needs to be replaced, without replacing the entire memory expansion board.

[0062] Through the above embodiments, the memory requirements can be quickly adjusted and optimized according to the current usage requirements of the memory unit without replacing the entire memory expansion board. In this way, the storage system can quickly adapt to different memory requirements by simply removing and reconnecting the memory expansion chip board to switch different types of memory units. Users can upgrade or expand memory as needed without having to invest a lot of cost to replace the entire memory expansion board, thereby improving the economy of the memory expansion board. Since the connection between the memory expansion chip board and the memory expansion board is detachable, maintenance and troubleshooting become easier.

[0063] Optionally, the memory expansion board is provided with a memory slot; the memory unit at least comprises a memory bar; The memory bar is indirectly connected to the memory expansion board through the memory slot.

[0064] Specifically, Figure 41 is a schematic diagram of a memory expansion board including a memory slot provided by an embodiment of the present application. Figure 4 As shown, the memory unit and the memory expansion board can be indirectly connected. In this implementation, the memory unit is in the form of a memory stick. Therefore, it is necessary to configure a corresponding memory slot on the memory expansion board so that the memory stick is indirectly connected to the memory expansion board through the memory slot.

[0065] Through the above-mentioned embodiment, by adopting this memory stick, the memory unit can be easily disassembled and replaced in case of failure or upgrade, thereby improving the convenience of user use.

[0066] Specifically, Figure 5 is a schematic diagram of the structure of a memory expansion board including memory particles provided by an embodiment of the present application. In one embodiment, as Figure 5 As shown, the memory unit and the memory expansion board can be directly connected. In this implementation, the memory unit is in the form of memory particles. The memory particles do not need to be configured with corresponding memory slots on the memory expansion board. The memory particles can be directly fixed on the memory expansion board by welding the front and back patches, so that the memory particles are directly connected to the memory expansion board through the memory slots. Since the type of the memory unit and the memory expansion board are bound to each other, the memory unit can be directly welded on the memory expansion board by the method of memory particles. Through the above embodiment, by adopting this method of memory particles, while improving the space utilization of the memory expansion board, the line signal instructions can also be optimized, and a heat sink can also be installed to adapt to large memory particles with higher power consumption to improve storage performance.

[0067] Optionally, the memory unit further includes a verification particle; The verification particle is connected to the memory expansion board by means of front and back surface patch welding.

[0068] Specifically, in one embodiment, since memory particles occupy less area than memory bars and no memory slots are required, the remaining space of the memory expansion board can also be used to configure verification particles, which are used to provide a verification mechanism for the data in the memory particles.

[0069] Optionally, the memory expansion board is further configured with a baseboard slot, the memory expansion chip board comprises a first surface and a second surface, the first surface is perpendicular to the second surface, and the area of ​​the first surface is greater than the area of ​​the second surface; wherein: The memory extension chip is connected to the memory extension chip board on the first surface through the connector; The second surface of the memory expansion chip board is also provided with a second gold finger, and the memory expansion chip board is connected to the baseboard slot of the memory expansion board through the second gold finger.

[0070] Specifically, Figure 6 FIG. 1 is a schematic diagram of placing another memory expansion chip board provided in an embodiment of the present application. Figure 6 As shown, in one embodiment, in order to further utilize the space of the memory expansion board and take into account different structural requirements, the position and connection method of the memory expansion chip board can be adjusted on the memory expansion board, a plurality of substrate slots are set on the memory expansion board, and the memory expansion chip board is also configured with a second gold finger. At the same time, the memory expansion chip board includes a first surface and a second surface, the first surface is perpendicular to the second surface, and the area of ​​the first surface is larger than the area of ​​the second surface. On the first surface of the memory expansion chip board, the memory expansion chip is connected to the memory expansion chip board through a connector, and on the second surface, a second gold finger can be set, and the second gold finger is used to connect the memory expansion chip to the memory expansion chip board. The memory expansion chip board is connected to the memory expansion board, so that the memory expansion chip board changes from being connected to the memory expansion board on the first side to being connected to the memory expansion board on the second side. In this case, since the area of ​​the second side is smaller than the area of ​​the second side, the second gold finger on the second side can be used to connect the memory expansion chip board to the baseboard slot of the memory expansion board, so that the memory expansion chip board can be placed vertically on the memory expansion board, thereby reducing the contact area between a single memory expansion chip board and the memory expansion board, and a larger number of memory expansion chip boards can be placed on the memory expansion board, or more memory units can be placed using the saved space.

[0071] Among them, the second gold finger is the second gold finger on the memory expansion chip board, which is a set of conductive contacts. They are not only responsible for transmitting power and signals, but also ensure the electrical connection and physical fixation between the memory expansion chip board and the memory expansion board. The baseboard slot is the baseboard slot on the memory expansion board, which is equivalent to a receiver and is designed with a specific size and shape to adapt to the second gold finger of the memory expansion chip board. This slot allows the memory expansion chip board to be inserted vertically, thereby saving space and improving the compactness inside the server.

[0072] Through the above-mentioned embodiments, the vertically arranged memory expansion chip board helps to save space on the memory expansion board, so that more memory expansion boards can be installed in a limited rack space, thereby improving the memory expansion capability of the server. The use of the second gold finger in conjunction with the baseboard slot provides a stable and reliable electrical connection, ensuring efficient transmission of data and power between the memory expansion chip board and the memory expansion board. The vertically placed memory expansion chip board helps to improve heat dissipation because this layout can provide more space for other components, such as a radiator, and this modular design concept makes maintenance and upgrading easier. If the memory expansion chip board needs to be replaced or upgraded, it only needs to be removed from the baseboard slot and replaced, without the need for complicated operations on the entire system.

[0073] Optionally, the memory expansion chip board further includes a third surface, and the third surface is parallel to the first surface; A heat sink is also disposed on the third surface of the memory expansion chip board.

[0074] Specifically, Figure 7 FIG. 1 is a schematic diagram of a side structure of a memory expansion board including a heat sink provided by an embodiment of the present application. Figure 7 As shown, the memory expansion chip board also includes a third side, which is the back side of the first side of the memory expansion chip board. Therefore, in the scenario where the second side of the memory expansion chip board is placed vertically on the memory expansion board, it is considered that a special heat sink is designed on the memory expansion board for heat dissipation. This heat sink is connected to the memory expansion chip board on the third side in a board-to-board manner through a lateral connection. In other words, the heat sink is not installed vertically on the memory expansion board, but is connected in parallel to the third side of the memory expansion chip board, thereby utilizing the condition that the memory expansion chip board is placed vertically, optimizing the spatial layout of the memory expansion board, and improving the heat dissipation efficiency.

[0075] Through the above embodiments, efficient heat dissipation and space optimization are achieved, which is particularly suitable for server and data center environments with strict requirements on space and heat dissipation, thereby improving the heat dissipation efficiency of the memory expansion chip board and ensuring the stable operation of the system.

[0076] Based on the same inventive concept, another embodiment of the present application provides a memory expansion chip board, on which a memory expansion chip is configured, the memory expansion chip board is connected to the memory expansion board via a connector on the memory expansion board, and the memory expansion chip board is provided with multiple types of second pins, and the multiple types of second pins are used to lead out signals required by multiple types of memory units; When it is necessary to use a target type of memory unit among the multiple types of memory units, a second pin among the multiple types of second pins corresponding to the target type of memory unit is connected to a first pin on the memory expansion board corresponding to the target type of memory unit, so that after the memory expansion chip board is detachably connected to the memory expansion board where the target type of memory unit is located, the signal required by the target type of memory unit is brought out through the second pin corresponding to the target type of memory unit.

[0077] The key point of the memory expansion chip board is that it can be modularly separated from the memory slot, so that it can be directly replaced on other memory expansion boards, avoiding the cost waste of scrapping the expansion card as a whole after the memory upgrade, greatly reducing the total memory cost consumption, and the modular separation design can also be applied to the future compatible design of DDR5 memory and DDR6 memory.

[0078] As for the memory expansion chip board, since it is basically similar to the above-mentioned embodiment of the storage system, the description is relatively simple, and the relevant parts can be referred to the partial description of the embodiment of the storage system.

[0079] Optionally, in the storage system, in order to improve the flexibility, maintainability and performance of the system, the following expansion and improvement solutions may be considered.

[0080] Each type of memory unit can be designed into a modular structure, allowing dynamic replacement and upgrade according to actual needs. Standardized interfaces (e.g., DDR4, DDR5, LPDDR, etc.) are used to allow compatibility of different types of memory modules, which can be easily replaced and upgraded.

[0081] Add a more advanced management chip to the memory expansion chip board, equipped with an intelligent algorithm to monitor the usage and performance of each memory unit. The management system can dynamically adjust memory resource allocation by collecting and analyzing usage data, so as to allocate more resources to critical tasks during peak loads.

[0082] The management system integrates real-time monitoring functions to detect the temperature, power consumption, status, etc. of the memory so that it can respond promptly when a failure occurs.

[0083] Combining memory expansion boards with emerging storage technologies such as flash memory and SSDs, a multi-level storage architecture is built between memory and persistent storage. This not only improves performance, but also enables automatic data migration and tiered storage, optimizing storage strategies based on data usage and access frequency.

[0084] For connectors, a multi-port solution is designed so that one expansion card can connect to multiple types of memory units at the same time, improving expansion capabilities and flexibility. For example, by implementing high-speed interfaces such as PCIe, data transmission and expansion can be faster.

[0085] A hardware encryption module is integrated on the memory expansion chip board to encrypt and protect the data stored in the memory, thereby enhancing data security.

[0086] For important data, a RAID-like mechanism is used to distribute the data across multiple memory units to enhance data reliability and recoverability.

[0087] With real-time data mirroring, if a memory unit fails, the system can quickly switch to another backup unit.

[0088] Through visual information display, users can quickly identify problems and take measures. In addition, the storage system supports remote monitoring and management. Operation and maintenance personnel can remotely manage, monitor performance, and update firmware through network connections. Automated fault handling and resource allocation can be achieved, allowing the system to self-adjust when the load changes.

[0089] Through the above embodiments, the flexibility, maintainability and performance of the system can be improved on the basis of the original storage system. These improvements not only improve the optimal use of system resources, but also enhance security and user experience, laying the foundation for possible future technology updates. This comprehensive solution will make the storage system more competitive in the market and adapt to the ever-changing technical requirements and business scenarios.

[0090] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0091] Those skilled in the art will appreciate that the embodiments of the present application can be provided as methods, devices, or computer program products. Therefore, the present application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0092] The embodiments of the present application are described with reference to the flowcharts and / or block diagrams of the methods, terminal devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0093] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0094] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process, thereby providing instructions for executing on the computer or other programmable terminal device to implement the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0095] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present application.

[0096] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0097] The above is a detailed introduction to a storage system provided by the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A storage system, characterized in that: The storage system includes: a plurality of memory expansion boards, a memory expansion chip board and a plurality of types of memory units; Each memory expansion board of the plurality of memory expansion boards is connected to a corresponding type of memory unit of the plurality of types of memory units; The memory expansion chip board is configured with a memory expansion chip, and the memory expansion board is configured with a connector, and the memory expansion chip board and the memory expansion board are connected via the connector.

2. The storage system according to claim 1, characterized in that: The memory expansion board is configured with a first pin, and the memory expansion chip board is configured with multiple types of second pins; The multiple types of second pins correspond to the multiple types of memory units.

3. The storage system according to claim 1, characterized in that: The memory expansion board is provided with a voltage conversion module, wherein: The voltage conversion module is connected to the server mainboard via a first golden finger to obtain power provided by the server mainboard; The voltage conversion module is connected to the memory unit on the memory expansion board and the memory expansion chip board on the memory expansion board; The voltage conversion module is used to determine the voltage requirement required by the memory expansion chip board and the voltage requirement required by the memory unit on the memory expansion board; The voltage conversion module is used to perform a first voltage conversion on the power provided by the server mainboard according to the voltage requirement of the memory expansion chip board, so that the memory expansion chip board obtains the first power that meets the voltage requirement of the memory expansion chip board; The voltage conversion module is used to perform a second voltage conversion on the power provided by the server mainboard according to the voltage requirement of the memory unit on the memory expansion board, so that the memory unit on the memory expansion board obtains the second power that meets the voltage requirement of the memory unit on the memory expansion board; The memory expansion chip board obtains the first power supply after the first voltage conversion by the voltage conversion module through the connector.

4. The storage system according to claim 1, characterized in that: The memory expansion board is connected to multiple expansion chip boards via multiple connectors; The memory expansion board is also provided with a clock signal buffer, and the clock signal buffer is connected to a plurality of expansion chip boards on the memory expansion board.

5. The storage system according to claim 1, characterized in that: The plurality of memory expansion boards include a first memory expansion board and a second memory expansion board, and the plurality of types of memory cells are divided into a first target type of memory cell and a second target type of memory cell; The first memory expansion board is connected to a memory unit of the first target type; The second memory expansion board is connected to the memory unit of the second target type; When the memory unit of the first target type needs to be used, the memory extension chip board is detachably connected to the first memory extension board through the connector on the first memory extension board; When a memory unit of the second target type needs to be used, the memory expansion chip board is removed from the first memory expansion board, and the memory expansion chip board is detachably connected to the second memory expansion board through a connector on the second memory expansion board.

6. The storage system according to claim 1, characterized in that: The memory expansion board is provided with a memory slot; the memory unit at least comprises a memory bar; The memory bar is indirectly connected to the memory expansion board through the memory slot.

7. The storage system according to claim 1, characterized in that: The memory unit at least includes memory particles; The memory particles are connected to the memory expansion board by means of front and back surface patch welding.

8. The storage system according to claim 6 or 7, characterized in that: The memory unit also includes a check particle; The verification particle is connected to the memory expansion board by means of front and back surface patch welding.

9. The storage system according to claim 1, characterized in that: The memory expansion board is also configured with a base plate slot, and the memory expansion chip board includes a first surface and a second surface, the first surface is perpendicular to the second surface, and the area of ​​the first surface is larger than the area of ​​the second surface; wherein: The memory extension chip is connected to the memory extension chip board on the first surface through the connector; The second surface of the memory expansion chip board is also provided with a second gold finger, and the memory expansion chip board is connected to the baseboard slot of the memory expansion board through the second gold finger.

10. The storage system according to claim 9, characterized in that: The memory expansion chip board also includes a third surface, and the third surface is parallel to the first surface; A heat sink is also disposed on the third surface of the memory expansion chip board.

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