Screen assembly and electronic device

Abstract

This application provides a screen assembly and an electronic device, belonging to the field of electronic device technology. The screen assembly includes: a display screen; a buffer layer disposed on one side of the display screen; a heat sink disposed on the side of the buffer layer away from the display screen; and a shielding layer disposed on the side of the heat sink away from the buffer layer. The heat sink has at least one gap corresponding to its edge, the shielding layer covers the gap, and the shielding layer has through holes that are connected to the gap.

Description

Technical Field

[0001] This application belongs to the field of electronic device technology, specifically relating to a screen assembly and an electronic device. Background Technology

[0002] In related technologies, to improve the heat dissipation performance of electronic devices, a heat sink is usually added to the buffer layer (SCF, Super Clear Film) on the back of the display screen. An adhesive is then placed around the heat sink, and the adhesive is bonded to the copper foil to ensure the adhesion between the display screen and the copper foil. However, due to manufacturing processes, there are gaps between the heat sink and the adhesive. Similarly, when using an ultrasonic fingerprint sensor, there are also gaps between the ultrasonic fingerprint sensor and the heat sink. During the high-pressure degassing process of the components, a pressure difference will occur on both sides of the copper foil corresponding to the gap location. This will cause the copper foil and the buffer layer to collapse, and visible marks can be generated on the display screen through light reflection, thus affecting the user experience. Summary of the Invention

[0003] The purpose of this application is to provide a screen assembly and electronic device that can effectively solve the technical problem of visible marks on the display screen.

[0004] In a first aspect, embodiments of this application provide a screen component, including:

[0005] Display screen;

[0006] A buffer layer is placed on one side of the display screen;

[0007] The heat dissipation component is located on the side of the buffer layer away from the display screen;

[0008] The shielding layer is located on the side of the heat sink that is away from the buffer layer.

[0009] The heat sink has at least one gap at its edge, the shielding layer covers the gap, and the shielding layer has through holes that are connected to the gap.

[0010] As one possible implementation, the heat sink has multiple sides in its orthographic projection on the display screen, each side of the heat sink in its orthographic projection on the display screen corresponds to at least one gap, and each gap is connected to at least one through hole.

[0011] As one possible implementation, the length of the side of the heat sink in the orthographic projection on the display screen is positively correlated with the length of the gap.

[0012] As one possible implementation, the length of the side of the heat sink in the orthographic projection on the display screen is positively correlated with the number of through holes.

[0013] As one possible implementation, the screen component further includes:

[0014] The covering component covers at least the side of the heat sink that is away from the buffer layer.

[0015] In one possible implementation, the cover and the buffer layer form a closed receiving cavity, the heat sink is located inside the receiving cavity, and the gap is located on the side of the buffer layer opposite to the heat sink.

[0016] As one possible implementation, the screen component further includes:

[0017] An adhesive is disposed between the buffer layer and the shielding layer, located on the outside of the heat sink, and there is at least one gap between the adhesive and the edge of the heat sink.

[0018] As one possible implementation, the heat sink has clearance holes, and both the outer edge and the inner edge of the heat sink have gaps.

[0019] As one possible implementation, the screen component further includes:

[0020] A fingerprint sensor is attached to the display or buffer layer, and there is at least one gap between the fingerprint sensor and the edge of the heat sink.

[0021] Secondly, embodiments of this application provide an electronic device, including:

[0022] Frame;

[0023] As provided in the first aspect embodiment, the screen assembly is disposed on the frame.

[0024] In this embodiment of the application, the screen assembly includes a display screen, a buffer layer, a heat sink, and a shielding layer. The buffer layer is disposed on one side of the display screen, the heat sink is disposed on the side of the buffer layer away from the display screen, and the shielding layer is disposed on the side of the heat sink away from the buffer layer.

[0025] Due to manufacturing processes, at least one gap is left at the edge of the heat sink. Furthermore, through holes are provided on the shielding layer, which are connected to the gap. During the high-pressure degassing process, the through holes can connect the two sides of the shielding layer, thereby reducing or eliminating the pressure difference between the two sides of the shielding layer. This reduces the possibility of the buffer layer and shielding layer collapsing at the gap, thus reducing the technical problem of visible marks on the screen assembly and improving the appearance of the screen assembly. Attached Figure Description

[0026] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0027] Figure 1 A schematic diagram of a screen assembly provided in one embodiment of this application is shown;

[0028] Figure 2 This illustration shows a schematic diagram of a buffer layer, heat dissipation component, adhesive component, and shielding layer in a screen assembly provided in one embodiment of this application;

[0029] Figure 3 A schematic diagram of a buffer layer, heat sink, adhesive, shielding layer, and fingerprint sensor in a screen assembly provided in one embodiment of this application is shown.

[0030] Figure 4 A schematic diagram of the adhesive and heat dissipation components in a screen assembly provided in one embodiment of this application is shown;

[0031] Figure 5 A schematic diagram of the adhesive and heat dissipation components in a screen assembly provided in one embodiment of this application is shown;

[0032] Figure 6 A schematic diagram of a screen assembly provided in one embodiment of this application is shown;

[0033] Figure 7 A schematic diagram of a shielding layer in a screen assembly provided in one embodiment of this application is shown;

[0034] Figure 8 A schematic diagram of a heat sink and a fingerprint sensor in a screen assembly provided in one embodiment of this application is shown;

[0035] Figure 9 A schematic diagram of an electronic device provided in one embodiment of this application is shown.

[0036] Figures 1 to 9 Figure label:

[0037] 100 Screen assembly, 110 Display, 120 Buffer layer, 130 Heat sink, 132 Clearance hole, 140 Gap, 150 Shielding layer, 152 Through hole, 160 Covering, 162 Receiving cavity, 170 Adhesive, 180 Fingerprint sensor, 200 Electronic device, 210 Frame. Detailed Implementation

[0038] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0039] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0040] In the description of this application, it should be understood that the terms "upper" and "inner", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0041] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0042] The following is combined Figures 1 to 9 This application describes a screen assembly 100 and an electronic device 200 according to embodiments thereof.

[0043] Firstly, such as Figure 1 , Figure 2 and Figure 3 As shown, this application embodiment provides a screen assembly 100, including: a display screen 110; a buffer layer 120 disposed on one side of the display screen 110; a heat sink 130 disposed on the side of the buffer layer 120 away from the display screen 110; and a shielding layer 150 disposed on the side of the heat sink 130 away from the buffer layer 120. The heat sink 130 has at least one gap 140 corresponding to its edge, the shielding layer 150 covers the gap 140, and the shielding layer 150 has a through hole 152 that communicates with the gap 140.

[0044] In this embodiment of the application, the screen assembly 100 includes a display screen 110, a buffer layer 120, a heat sink 130, and a shielding layer 150. The buffer layer 120 is disposed on one side of the display screen 110, and the heat sink 130 is disposed on the side of the buffer layer 120 away from the display screen 110. The shielding layer 150 is disposed on the side of the heat sink 130 away from the buffer layer 120.

[0045] Due to manufacturing processes, at least one gap 140 is left between the edge of the heat sink 130 and other components. Furthermore, a through hole 152 is provided on the shielding layer 150, which is connected to the gap 140. During the high-pressure degassing process, the through hole 152 can connect the two sides of the shielding layer 150, thereby reducing or eliminating the pressure difference between the two sides of the shielding layer 150. This reduces the possibility of the buffer layer 120 and the shielding layer 150 collapsing at the gap 140, thereby reducing the technical problem of visible marks on the screen assembly 100 and improving the appearance of the screen assembly 100.

[0046] This application provides through holes 152 on the shielding layer 150. The through holes 152 can be of any shape, such as circular, elliptical, polygonal, or linear. The through holes 152 connect the two sides of the shielding layer 150. That is, the through holes 152 connect the gap 140 and the side of the shielding layer 150 away from the gap 140. In this way, during the degassing process, there will be no pressure difference between the gap 140 and the side of the shielding layer 150 away from the gap 140. The degassing pressure acts directly on the foam to compress the buffer layer, which can solve the problem of molded marks appearing on the display screen 110 caused by the collapse or warping of the buffer layer.

[0047] like Figure 4 , Figure 5 and Figure 6 As shown, in one possible implementation, the heat sink 130 has multiple sides in its orthographic projection on the display screen. Each side of the heat sink 130 in its orthographic projection on the display screen corresponds to at least one gap 140, and each gap 140 is connected to at least one through hole 152.

[0048] Specifically, the heat sink 130 has multiple sides in its orthographic projection on the display screen. Each side of the heat sink 130 in its orthographic projection on the display screen corresponds to at least one gap 140. That is, each side of the heat sink 130 corresponds to a gap 140, and the number of gaps 140 can be one, two or more, thereby ensuring the installation effect of the heat sink 130.

[0049] Furthermore, each gap 140 is connected to at least one through hole 152, thereby ensuring that each gap 140 can balance the pressure difference, thus solving the problem of molded marks appearing on the display screen 110 caused by the collapse or warping of the buffer layer.

[0050] In this case, at least two sides of the heat sink 130 in the orthographic projection on the display screen can correspond to the same gap 140, or each side of the heat sink 130 in the orthographic projection on the display screen can individually correspond to at least one gap 140.

[0051] Furthermore, the side of the heat sink 130 in its orthographic projection on the display screen can be straight or curved. That is, the orthographic projection of the heat sink 130 on the display screen can be a polygon, a circle, an ellipse, an oval, or other shapes composed of straight lines and curves.

[0052] like Figure 5 and Figure 6 As shown, in one possible implementation, each side of the heat sink 130 in the orthographic projection on the display screen corresponds to at least one through hole 152.

[0053] Specifically, each side of the heat sink 130 in its orthographic projection on the display screen has at least one through hole 152. Correspondingly, each side of the heat sink 130 in its orthographic projection on the display screen has a corresponding gap 140. By combining the gap 140 and the through hole 152, the effect of balancing the pressure difference through the through hole 152 can be ensured while adapting to the installation process of the screen assembly 100.

[0054] like Figure 4 and Figure 5 As shown, in one possible implementation, the heat sink 130 has a clearance hole 132, and both the outer edge and the inner edge of the heat sink 130 have a gap 140.

[0055] Specifically, the heat sink 130 is provided with a clearance hole 132, which is used to avoid other components, such as the fingerprint sensor 180, camera or light sensor, etc. The outer edge and the inner edge of the heat sink 130 have gaps. The shielding layer 150 is provided with a through hole 152 corresponding to the gap of the outer edge of the heat sink 130, and the shielding layer 150 is provided with a through hole 152 corresponding to the gap 140 of the inner edge of the heat sink 130, thereby ensuring the effect of balancing the pressure difference of the gap 140 through the through hole 152.

[0056] The number of clearance holes 132 can be one, two or more.

[0057] Optionally, the number of through holes 152 located on the outer side of the heat sink 130 is greater than the number of through holes 132 located on the inner side of the heat sink 130.

[0058] like Figure 5 As shown, in one possible implementation, the length of the side of the heat sink 130 in the orthographic projection on the display screen 110 is positively correlated with the length of the gap 140.

[0059] Specifically, in the orthographic projection of the heat sink 130 on the display screen 110, the length of the side and the length of the gap 140 are positively correlated. That is, the longer the side of the heat sink 130, the longer the gap 140, and the shorter the side of the heat sink 130, the shorter the gap 140, thus adapting to the installation process of the heat sink 130.

[0060] For example, the length H1 of the orthographic projection of the heat sink 130 on the display screen along the first direction EF is greater than the length H2 along the second direction CD. The first direction EF and the second direction CD are two perpendicular directions. In the orthographic projection of the heat sink 130 on the display screen, the length H3 of the gap 140 corresponding to the side extending along the first direction EF is greater than the length H4 of the gap 140 corresponding to the side extending along the second direction CD.

[0061] Specifically, the length H1 of the orthographic projection of the heat sink 130 on the display screen along the first direction EF is greater than the length H2 along the second direction CD. The first direction EF and the second direction CD are two perpendicular directions, thus adapting to the shape of the display screen. In the orthographic projection of the heat sink 130 on the display screen, the length H3 of the gap 140 corresponding to the side extending along the first direction EF is greater than the length H4 of the gap 140 corresponding to the side extending along the second direction CD, thereby ensuring that each side of the heat sink 130 has sufficient gap 140 to adapt to the installation process of the screen assembly 100.

[0062] like Figure 6 As shown, in one possible implementation, the length of the side of the heat sink 130 in the orthographic projection on the display screen 110 is positively correlated with the number of through holes 152.

[0063] Specifically, the length of the side of the heat sink 130 in the orthographic projection on the display screen 110 is positively correlated with the number of through holes 152. That is, the longer the side of the heat sink 130, the more through holes 152 it corresponds to, and the shorter the side of the heat sink 130, the fewer through holes 152 it corresponds to, thereby ensuring the effect of balancing the pressure difference on both sides of the shielding layer 150.

[0064] For example: Figure 6 As shown, in the orthographic projection of the heat sink 130 on the display screen, the number of through holes 152 corresponding to the side extending along the first direction EF is greater than the number of through holes 152 corresponding to the side extending along the second direction CD.

[0065] Specifically, in the orthographic projection of the heat sink 130 on the display screen, the number of through holes 152 corresponding to the side extending along the first direction EF is greater than the number of through holes 152 corresponding to the side extending along the second direction CD, thereby ensuring that the through holes 152 corresponding to each side can smoothly balance the pressure difference and ensure the effect of reducing visible marks on the screen assembly 100.

[0066] In the orthographic projection of the heat sink 130 on the display screen, each side corresponds to a gap 140. The number of through holes 152 connected to the gaps 140 corresponding to the side extending along the first direction EF is greater than the number of through holes 152 connected to the gaps 140 corresponding to the side extending along the second direction CD.

[0067] For example, the orthographic projection of the heat sink 130 on the display screen can be a quadrilateral. Each side of the orthographic projection of the heat sink 130 on the display screen corresponds to a gap 140 connected to at least one through hole 152. Specifically, the orthographic projection of the heat sink 130 on the display screen is roughly rectangular, with two through holes 152 corresponding to the side extending along the first direction EF, and one through hole 152 corresponding to the side extending along the second direction CD. The heat sink 130 can also be a triangular structure, a pentagonal structure, or a hexagonal structure, etc.

[0068] Among them, such as Figure 6 As shown, in one possible implementation, the length of the gap 140 and the number of through holes 152 are positively correlated, thereby ensuring the effect of balancing the pressure difference on both sides of the shielding layer 150.

[0069] like Figure 2 and Figure 3 As shown, as one possible implementation, it also includes: a covering 160, which covers at least the side of the heat sink 130 away from the buffer layer 120.

[0070] Specifically, the screen assembly 100 also includes a cover 160, which covers at least the side of the heat sink 130 away from the buffer layer 120, thereby reducing the risk of the heat sink 130 being damaged and entering the interior of the electronic device 200 through the through hole 152, thus improving the reliability of the electronic device 200.

[0071] The covering 160 can be flexible or rigid. The covering 160 covers the heat sink 130, thereby improving the integrity of the heat sink 130 and reducing the risk of the heat sink 130 breaking.

[0072] The thickness of the covering 160 ranges from 0.001 mm to 0.03 mm. Specifically, the thickness of the covering 160 can be 0.001 mm, 0.005 mm, 0.01 mm, 0.015 mm, 0.02 mm, 0.025 mm, or 0.03 mm, etc.

[0073] like Figure 2 and Figure 3 As shown, in one possible implementation, the cover 160 and the buffer layer 120 form a closed receiving cavity 162, the heat sink 130 is located in the receiving cavity 162, and the gap 140 is located on the side of the buffer layer 120 opposite to the heat sink 130.

[0074] Specifically, the cover 160 and the buffer layer 120 form a closed receiving cavity 162, and the heat sink 130 is located inside the receiving cavity 162, thereby ensuring that the debris of the heat sink 130 will not spread to the outside of the cover 160, improving the reliability of the electronic device 200, and ensuring that the heat sink 130 and the buffer layer 120 are in close contact, thereby ensuring the heat dissipation effect.

[0075] After the heat sink 130 is installed, the cover 160 can be bonded to the buffer layer 120 to form a closed receiving cavity 162, which covers the heat sink 130, thereby ensuring that the debris detached from the heat sink 130 will not enter the interior of the electronic device 200 through the through hole 152.

[0076] As one possible implementation, the covering 160 is a resin covering; the heat dissipation component 130 is a graphite heat dissipation component.

[0077] Specifically, the covering 160 is a resin covering, which has high reliability and strong sealing performance. The heat sink 130 is a graphite heat sink. Graphite heat sink 130 is usually formed by powder compression molding. When the electronic device 200 is dropped, the heat sink 130 may shed debris. Therefore, covering the heat sink 130 with the covering 160 can reduce the possibility of debris from the heat sink 130 entering the interior of the electronic device 200 through the through hole 152.

[0078] Since graphite is conductive, if debris from the heat sink 130 enters the interior of the electronic device 200 through the through hole 152, it can easily cause short circuits in other components inside the electronic device 200. Therefore, adding the covering 160 can reduce the risk of short circuits in the components inside the electronic device 200 and improve the stability of the electronic device 200.

[0079] The packaging material can be a resin material, such as polyethylene terephthalate (PET), polycarbonate (PC), or polyimide (PI).

[0080] Of course, in other embodiments of this application, the material of the covering 160 may also be metal or plastic.

[0081] The heat sink 130 can be a graphite sheet (PGS, Pyrolytic Graphite Sheet) or a metal sheet, etc.

[0082] like Figure 1 , Figure 2 and Figure 3 As shown, as one possible implementation, it further includes: an adhesive 170 disposed between the buffer layer 120 and the shielding layer 150, the adhesive 170 being located outside the heat sink 130, and having at least one gap 140 between the edge of the adhesive 170 and the edge of the heat sink 130.

[0083] Specifically, the screen assembly 100 also includes an adhesive 170, which is disposed on the side of the buffer layer 120 away from the display screen 110 and is located on the outside of the heat sink 130, that is, the adhesive 170 surrounds the periphery of the heat sink 130. The shielding layer 150 is disposed on the side of the adhesive 170 and the heat sink 130 away from the buffer layer 120. The adhesive 170 is used to bond the buffer layer 120 and the shielding layer 150 together, so that the screen assembly 100 forms a whole.

[0084] The heat sink 130 has at least one gap 140 between its edge and the adhesive 170. The shielding layer 150 has a through hole 152 connected to the gap 140. During the high-pressure degassing process, the through hole 152 can connect the two sides of the shielding layer 150, thereby reducing or eliminating the pressure difference between the two sides of the shielding layer 150. This reduces the possibility of the buffer layer 120 and the shielding layer 150 collapsing at the gap 140, thereby reducing the technical problem of visible marks on the screen assembly 100 and improving the appearance of the screen assembly 100.

[0085] Specifically, the gap 140 may surround the heat sink 130, and the through hole 152 has at least two, with the at least two through holes 152 spaced apart.

[0086] Specifically, the adhesive 170 is a ring-shaped structure that surrounds the entire heat sink 130, thereby causing the gap 140 to surround the heat sink 130. Therefore, at least two through holes 152 are provided, and the at least two through holes 152 are spaced apart, so that the air can be vented and vented more evenly throughout the gap 140, ensuring that the buffer layer and the shielding layer 150 will not collapse throughout the gap 140.

[0087] The heat sink 130 can be made into a circular, polygonal or irregular shape according to the actual situation. The adhesive 170 is arranged around the entire heat sink 130 to ensure the bonding strength of the shielding layer 150 and the buffer layer 120.

[0088] like Figure 3 , Figure 6 and Figure 8 As shown, as one possible implementation, it also includes: a fingerprint sensor 180, attached to the display screen 110 or the buffer layer 120, with at least one gap 140 between the fingerprint sensor 180 and the edge of the heat sink 130.

[0089] Specifically, the screen assembly 100 also includes a fingerprint sensor 180, which is attached to the display screen 110 or the buffer layer 120 to realize the fingerprint recognition function of the screen assembly 100.

[0090] The fingerprint sensor 180 is located inside the heat sink 130, which surrounds the fingerprint sensor 180. There is at least one gap between the edge of the heat sink 130 and the fingerprint sensor 180. The shielding layer 150 is provided with a through hole 152, which is connected to the gap 140. During the high-pressure degassing process, the through hole 152 can connect the two sides of the shielding layer 150, thereby reducing or eliminating the pressure difference between the two sides of the shielding layer 150, reducing the possibility of the buffer layer 120 and the shielding layer 150 collapsing at the gap 140, thereby reducing the technical problem of visible marks on the screen assembly 100 and improving the appearance of the screen assembly 100.

[0091] The fingerprint sensor 180 can be an ultrasonic fingerprint sensor 180, an optical fingerprint sensor, a semiconductor fingerprint sensor 180, a radio frequency fingerprint sensor 180, etc.

[0092] The fingerprint sensor 180 can be attached to the side of the buffer layer 120 away from the display screen 110. Then, through the debubbling process, the pressure is directly applied to the buffer layer 120, making the buffer layer 120 compact. In addition, the through hole 152 can balance the pressure difference between the gap 140 and the shielding layer 150 on the side away from the gap 140.

[0093] like Figure 6 and Figure 8 As shown, in one possible implementation, the gap 140 surrounds the fingerprint sensor 180, and the through hole 152 has at least two, with the at least two through holes 152 spaced apart.

[0094] Specifically, the gap 140 surrounds the entire fingerprint sensor 180. Therefore, at least two through holes 152 are provided, and the at least two through holes 152 are spaced apart, so that the air can be vented and vented more evenly throughout the gap 140, ensuring that the buffer layer and shielding layer 150 will not collapse throughout the gap 140.

[0095] Optionally, a fingerprint sensor 180 is provided on the inner side of the heat sink 130, and an adhesive 170 is provided on the outer side of the heat sink 130. There is at least one gap 140 between the heat sink 130 and the adhesive 170, and at least one gap 140 between the heat sink 130 and the fingerprint sensor 180.

[0096] As one possible implementation method, such as Figure 7 As shown, along the circumference of the heat sink 130, the length L1 of the through hole 152 is greater than or equal to 0.1 mm; as Figure 3 As shown, the width L2 of the gap 140 ranges from 0.1 mm to 1 mm, and the length L3 of the through hole 152 ranges from 0.01 mm to 0.3 mm along the width direction AB of the gap 140.

[0097] Specifically, such as Figure 3 and Figure 7 As shown, along the circumference of the heat sink 130, the length L1 of the through hole 152 is greater than or equal to 0.1 mm; the width L2 of the gap 140 ranges from 0.1 mm to 1 mm; along the width direction AB of the gap 140, the length L3 of the through hole 152 ranges from 0.01 mm to 0.3 mm. With the above dimensional limitations, the size of the through hole 152 will not affect the shielding effect of the shielding layer 150, and can ensure the flow rate and ventilation speed of the through hole 152, so as to ensure the effect of suppressing the collapse of the shielding layer 150 and the buffer layer 120.

[0098] Along the circumference of the heat sink 130, the length of the through hole 152 can be 0.1mm, 0.12mm, 0.15mm, 0.2mm, 0.5mm, 1mm, 2mm, 3mm, 4mm, or 5mm, etc. The width of the gap 140 can be 0.1mm, 0.2mm, 0.3mm, 0.5mm, 0.7mm, 0.9mm, or 1mm, etc. Along the width direction of the gap 140, the length of the through hole 152 can be 0.01mm, 0.02mm, 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, or 0.3mm, etc.

[0099] As one possible implementation, the shielding layer 150 can be copper foil, aluminum foil, or silver foil, etc., so that the display screen 110 can resist interference, improve heat dissipation, and also achieve anti-static effect.

[0100] As one possible implementation, the adhesive 170 may be polyethylene terephthalate, located around the heat sink 130, to enhance the adhesion between the buffer layer 120 and the shielding layer 150.

[0101] As one possible implementation, the buffer layer 120 may be a combination of cushioning foam and embo, etc. The buffer layer 120 can protect the back of the display screen 110 and reflect external light into the display screen 110 to improve contrast.

[0102] like Figure 2 and Figure 3 As shown, in one possible implementation, the orthographic projection of the through hole 152 onto the display screen 110 side and the orthographic projection of the gap 140 onto the display screen 110 side at least partially overlap, completely overlap, or are separated from the orthographic projection of the through hole 152 onto the display screen 110 side and the orthographic projection of the cover 160 onto the display screen 110 side.

[0103] As one possible implementation, the display screen 110 can be an active-matrix organic light-emitting diode (AMOLED) panel, an organic light-emitting diode panel, or a liquid crystal display screen 110, etc.

[0104] Secondly, such as Figure 9 As shown, this application provides an electronic device 200, including: a frame 210; and a screen assembly 100 as provided in the first aspect embodiment, the screen assembly 100 being disposed on the frame 210.

[0105] The electronic device 200 provided in this application includes the screen assembly 100 as provided in the first aspect embodiment, and therefore has all the beneficial effects of the screen assembly 100 as provided in the first aspect embodiment, which will not be described in detail here.

[0106] Electronic device 200 can be a terminal or other devices besides electronic device 200. For example, electronic device 200 can be a mobile phone, tablet computer, laptop computer, handheld computer, music playback device, private network communication terminal equipment (such as walkie-talkie), mobile internet device (MID), augmented reality / virtual reality / mixed reality device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. The embodiments of this application do not specifically limit it.

[0107] In the description of this specification, references to terms such as "an embodiment" or "specific embodiment" indicate that a particular feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0108] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A screen assembly, characterized in that, include: Display screen; A buffer layer is disposed on one side of the display screen; A heat dissipation component is disposed on the side of the buffer layer opposite to the display screen; A shielding layer is disposed on the side of the heat sink that is away from the buffer layer; Wherein, the edge of the heat sink has at least one gap, the shielding layer covers the gap, the shielding layer has through holes, and the through holes are connected to the gap; An adhesive is disposed between the buffer layer and the shielding layer, the adhesive being located on the outside of the heat sink, and at least one gap is present between the adhesive and the edge of the heat sink.

2. The screen assembly according to claim 1, characterized in that, The heat sink has multiple sides in its orthographic projection on the display screen. Each side of the heat sink in its orthographic projection on the display screen corresponds to at least one of the gaps, and each gap is connected to at least one of the through holes.

3. The screen assembly according to claim 2, characterized in that, The length of the side of the heat sink in the orthographic projection on the display screen is positively correlated with the length of the gap.

4. The screen assembly according to claim 2, characterized in that, The length of the side of the heat sink in the orthographic projection on the display screen is positively correlated with the number of through holes.

5. The screen assembly according to claim 1, characterized in that, Also includes: The covering element covers at least the side of the heat sink that is away from the buffer layer.

6. The screen assembly according to claim 5, characterized in that, The covering and the buffer layer form a closed receiving cavity, the heat dissipation component is located inside the receiving cavity, and the gap is located on the side of the buffer layer opposite to the heat dissipation component.

7. The screen assembly according to any one of claims 1 to 6, characterized in that, The heat sink has clearance holes, and the outer edge and the inner edge of the heat sink both have the gaps.

8. The screen assembly according to any one of claims 1 to 6, characterized in that, Also includes: A fingerprint sensor is attached to the display screen or the buffer layer, and at least one gap is provided between the fingerprint sensor and the edge of the heat sink.

9. An electronic device, characterized in that, include: Frame; The screen assembly as described in any one of claims 1 to 8, wherein the screen assembly is disposed on the frame.

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