A low temperature rise relay

Abstract

The present invention discloses a low-temperature-rise relay, which relates to the field of relays. The relay comprises a base, wherein a magnetic circuit assembly and a movable armature assembly are arranged in the base, the movable armature assembly is connected to the magnetic circuit assembly through a compression spring, the base cover is provided with an upper cover, a lead-out plate is provided in the base, a plurality of glue grooves are provided on the side of the base facing away from the upper cover, so that the lead-out pins of the lead-out plate extend out of the base along the glue grooves, a heat sink is connected on the side of the lead-out plate facing away from the lead-out pins, and a sealing groove is provided on the upper cover so that one end of the heat sink facing away from the lead-out plate passes through and is located outside the upper cover. The present application effectively improves the heat dissipation effect of the relay, thereby effectively reducing the temperature rise of the relay, and effectively solves the problem of excessive temperature of traditional relays under high-density packaging and long-term working conditions.

Description

Technical Field

[0001] The present invention relates to the technical field of relays, and more particularly to a low-temperature-rise relay. Background Art

[0002] With the rapid development of the solar photovoltaic industry, higher requirements are placed on relays used in solar photovoltaic inverters, especially on relay loads. According to market needs, the load voltage must reach 1000Vac, the switching current must be at least 100A, and the conduction current must exceed 320A.

[0003] Since photovoltaic installation locations vary from deserts to oceans, and from high latitudes to low latitudes, relays must be able to withstand large currents and be sealed. This requires the relays to have a sufficiently low temperature rise.

[0004] In summary, how to reduce the temperature rise of the relay is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0005] In view of this, an object of the present invention is to provide a low-temperature-rise relay, which effectively reduces the temperature rise of the relay.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] A low-temperature-rise relay comprises a base, wherein a magnetic circuit assembly and a movable armature assembly are disposed within the base, wherein the movable armature assembly is connected to the magnetic circuit assembly via a compression spring, wherein the base is provided with an upper cover, wherein a lead piece is disposed within the base, and wherein a plurality of adhesive grooves are formed on a side of the base facing away from the upper cover, such that lead pins of the lead piece extend outside the base along the adhesive grooves;

[0008] A heat sink is connected to the side of the lead-out piece away from the lead-out pin, and a sealing groove is provided on the upper cover so that the end of the heat sink away from the lead-out piece passes through and is located outside the upper cover.

[0009] Preferably, the lead-out plate is a U-shaped copper busbar, and the lead-out plate includes an inner side and an outer side of the lead-out plate that are parallel to each other. The side of the inner side of the lead-out plate facing away from the lead-out pin and the side of the outer side of the lead-out plate facing away from the lead-out pin are connected by a cross-piece connector, and the heat sink is arranged at the cross-piece connector.

[0010] Preferably, the heat dissipation element includes:

[0011] A connecting piece connected to the crossbar connecting piece;

[0012] A plurality of heat sinks are arranged parallel to each other and are arranged on the crossbar connector along the reverse extension direction of the lead pins.

[0013] Preferably, the shape of the connecting piece matches that of the crossbar connecting member, so that the contact area between the connecting piece and the crossbar connecting member is increased.

[0014] Preferably, a plurality of heat dissipation teeth are provided on a side of each heat dissipation fin facing away from the crossbar connector, and a plurality of adjacent heat dissipation teeth on each heat dissipation fin are connected to each other via a series connection member.

[0015] Preferably, the distance from the heat sink to the static contact on the lead-out plate is smaller than the distance from the lead-out pin to the static contact on the lead-out plate, and the ratio between the two distances is not less than 3.

[0016] Preferably, a first slot is formed through the inner side of the lead-out piece, and the first slot is in the shape of a circular hole.

[0017] Preferably, a second slot is provided through the inner side of the lead-out piece, and the second slot is a waist-shaped hole.

[0018] Preferably, a plurality of through holes are provided on the upper cover, an explosion-proof window is provided in each of the through holes, and a circle of notches is provided on the inner side of the through holes located at the explosion-proof windows.

[0019] Preferably, a circle of notches is provided on the upper cover in the circumferential direction of the heat sink to form an air duct.

[0020] The low-temperature-rise relay provided by the present invention can effectively reduce the temperature rise of the relay. First, the lead-out plate and the heat sink are effectively connected, and the lead-out pins of the lead-out plate extend out of the base, and the heat sink extends out of the upper cover, ensuring that heat can be quickly transferred from the lead-out plate and the heat sink to the external environment, thereby improving the overall heat dissipation efficiency. In addition, the lead-out plate and the heat sink are located at opposite ends, further improving the heat dissipation effect. Secondly, the glue groove design in the base ensures good sealing between the lead-out pin and the base, avoiding performance degradation due to air leakage. In addition, the sealing groove design on the upper cover further enhances the overall sealing and reliability of the relay, preventing external dust and moisture from entering the interior, thereby extending the service life of the relay. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0022] Figure 1 Schematic diagram of the overall structure of the low temperature rise relay in this embodiment;

[0023] Figure 2 Schematic diagram of the explosion of the low temperature rise relay in this embodiment;

[0024] Figure 3 is a top view of the base in this embodiment;

[0025] Figure 4 This is a schematic diagram of the structure of the lead-out plate and the heat sink in this embodiment;

[0026] Figure 5 Schematic diagram of the distances between the static contact and the crossbar and the lead-out pin 103 in this embodiment;

[0027] Figure 6 2 is a cross-sectional view of the upper cover in this embodiment.

[0028] Figures 1-6 , the reference numerals include:

[0029] 1. Lead-out plate; 11. Inner side of lead-out plate; 12. Outer side of lead-out plate; 101. First slot; 102. Second slot; 103. Lead-out pin; 104. Crossbar connector; 3. Heat sink; 31. Connecting plate; 32. Heat sink; 33. Heat dissipation tooth; 4. Base; 41. Glue groove; 5. Magnetic circuit assembly; 6. Moving armature assembly; 7. Upper cover; 71. Sealing groove; 72. Explosion-proof window; 721. Through hole; 8. Compression spring; 9. Static contact. DETAILED DESCRIPTION

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] Unless otherwise defined, the technical or scientific terms used in this application shall have the usual meanings understood by persons of ordinary skill in the field to which the invention belongs. The words "first", "second" and similar terms used in the present invention do not indicate any order, quantity or importance. Words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly. The embodiments of the present application disclose a low-temperature rise relay.

[0032] The core of the present invention is to provide a low temperature rise relay.

[0033] Please refer to Figures 1 to 6 .

[0034] The low-temperature-rise relay provided by the present invention includes a base 4, within which are disposed a magnetic circuit assembly 5 and a movable armature assembly 6. The movable armature assembly 6 is connected to the magnetic circuit assembly via a compression spring 8. The base 4 is covered by an upper cover 7, within which is disposed a lead plate 1. A plurality of adhesive grooves 41 are defined on the side of the base 4 facing away from the upper cover 7, allowing lead pins 103 of the lead plate 1 to extend outside the base 4 along the adhesive grooves 41. A heat sink 3 is connected to the side of the lead plate 1 facing away from the lead pins 103. A sealing groove 71 is defined in the upper cover 7, allowing the end of the heat sink 3 facing away from the lead plate 1 to extend through the upper cover 7 and be positioned outside the upper cover 7.

[0035] Specifically, there are two lead-out plates 1 in the base 4, and the two lead-out plates 1 are arranged side by side on both sides of the base 4. A plurality of glue grooves 41 for installing the lead-out plates 1 are provided on the base 4. The lead-out pins 103 of the lead-out plates 1 are inserted into the glue grooves 41 and extend out of the base 4 to facilitate heat dissipation and heat conduction to the external space. The lead-out plates 1 and the glue grooves 41 can be sealed and fixed by glue, further improving the stability between the lead-out plates 1 and the base 4. A heat sink 3 is provided on the side of the lead-out plate 1 away from the lead-out pins 103. The heat sink 3 can effectively conduct heat from the heat transfer path in the lead-out plate 1. The upper cover 7 is provided with a sealing groove 71 at the installation location of the heat sink 3. The side of the heat sink 3 away from the lead-out plate 1 is provided through the sealing groove 71 so that the heat sink 3 is located outside the upper cover 7, facilitating heat dissipation and heat conduction to the external space. The heat sink 3 and the sealing groove 71 can be sealed and fixed by glue. In this embodiment, by adding a heat sink 3 to the lead-out plate 1, the heat transfer path of the lead-out plate 1 is made more reasonable, and the lead-out plate 1 and the heat sink 3 are located at opposite ends, thereby forming an effective heat convection channel, which accelerates the transfer and dissipation of heat.

[0036] The low-temperature-rise relay mentioned above effectively improves the heat dissipation efficiency of the relay, thereby effectively reducing the temperature rise of the relay, and effectively solves the problem of excessive temperature of traditional relays under high-density packaging and long-term working conditions.

[0037] The low temperature rise relay provided by the present invention is described in more detail below with reference to the accompanying drawings and specific embodiments.

[0038] In a specific embodiment, reference Figure 4The lead-out plate 1 is a U-shaped copper busbar, and the lead-out plate 1 includes an inner side 11 and an outer side 12 of the lead-out plate that are parallel to each other. The side of the inner side 11 of the lead-out plate facing away from the lead-out pin 103 and the side of the outer side 12 of the lead-out plate facing away from the lead-out pin 103 are connected by a cross-piece connector 104, and the heat sink 3 is arranged at the cross-piece connector 104.

[0039] Specifically, the lead-out plate 1 is a U-shaped structure, which is divided into an outer side 12 and an inner side 11 of the lead-out plate according to the position of the lead-out plate 1 within the base 4. The outer side 12 and the inner side 11 of the lead-out plate are connected by a crossbar connector 104, and the connection is bent. According to the resistance value of the U-shaped copper busbar, the temperature rise at the inner side 11 of the lead-out plate is much higher than the temperature rise at the outer side 12 of the lead-out plate. The heat sink 3 is arranged at the crossbar connector 104, which can lead the heat in the heat transfer path from the inner side 11 of the lead-out plate to the outer side 12 of the lead-out plate to be extracted from the heat sink 3, making the heat transfer route more reasonable and further improving the heat dissipation efficiency. Due to the special structure of the U-shaped copper busbar, a large amount of heat will accumulate on the inner side 11 of the lead-out plate when the current passes through. This is because when the current flows inside the conductor, the existence of resistance will generate heat, and the area near the center of the conductor (i.e., the inner side 11 of the lead-out plate) will have a relatively high temperature due to relatively poor heat dissipation conditions. The heat sink 3 is arranged at the crossbar connector 104 , and the heat sink 3 can directly contact the inner side 11 of the lead-out plate, and quickly take away the heat by heat conduction.

[0040] Based on any of the above embodiments, Figure 4 The heat sink 3 includes a connecting piece 31 and a plurality of heat sinks 32 . The connecting piece 31 is connected to the crossbar connector 104 . The plurality of heat sinks 32 are arranged parallel to each other and are arranged on the crossbar connector 104 along the reverse extension direction of the lead-out pin 103 .

[0041] Specifically, the heat sink 3 includes a horizontally arranged connecting piece 31 and two heat sinks 32 vertically arranged at both ends of the connecting piece 31. The connecting piece 31 is mounted on the crossbar connector 104 so that the extension direction of the heat sink 32 is opposite to the extension direction of the lead pin 103. This allows the heat dissipation position of the heat sink 3 and the heat dissipation position of the lead pin 1 to be located at opposite ends, further improving the heat dissipation effect. The connecting piece 31 is arranged horizontally and fits tightly on the crossbar connector 104, ensuring efficient heat conduction from the crossbar connector 104 to the heat sink 3. The two heat sinks 32 are vertically mounted at both ends of the connecting piece 31, and their extension direction is completely opposite to the extension direction of the lead pin 103. This not only maximizes the use of space, but also effectively separates the heat dissipation area from the high-temperature area of ​​the lead pin 1, avoiding direct heat backflow and improving heat dissipation efficiency. The close fit between the connecting piece 31 and the crossbar connector 104 not only facilitates heat conduction, but also enhances the structural stability of the entire heat dissipation assembly. The risk of loosening and damage due to vibration or shock is reduced, improving the reliability and durability of the relay.

[0042] Based on any of the above embodiments, Figure 4 The shape of the connecting piece 31 matches that of the crossbar connecting piece 104 so that the contact area between the connecting piece 31 and the crossbar connecting piece 104 is increased.

[0043] Specifically, to maximize heat transfer efficiency, the shape of the connecting piece 31 matches that of the crosspiece connector 104. This alignment not only ensures close contact between the two but also significantly increases their contact area. By increasing the contact area, the connecting piece 31 can more effectively absorb heat from the crosspiece connector 104 and quickly transfer it to the heat sink 32. This design significantly reduces thermal resistance and improves heat transfer efficiency, thereby ensuring stable operation of the relay in high-temperature environments.

[0044] Optionally, the connecting piece 31 may adopt a profile similar to that of the crossbar connector 104, or may be provided with additional protrusions, grooves or wavy structures on the contact surface to increase the number and density of contact points.

[0045] Based on any of the above embodiments, Figure 3 A plurality of heat dissipation teeth 33 are provided on the side of each heat dissipation fin 32 away from the crossbar connector 104 , and the plurality of adjacent heat dissipation teeth 33 on each heat dissipation fin 32 are connected to each other through a series connection.

[0046] Specifically, each heat sink 32 is provided with a plurality of heat dissipation teeth 33 on the side facing away from the crossbar connector 104. These heat dissipation teeth 33 not only increase the heat dissipation area, but also, through their unique shape and structure, effectively guide air flow, enhancing the heat dissipation effect. The heat dissipation teeth 33 may adopt different shapes, such as wavy, zigzag, or fin-shaped, to adapt to different heat dissipation requirements and air flow conditions. Multiple adjacent heat dissipation teeth 33 on each heat sink 32 are interconnected by series elements. These series elements not only ensure the structural stability between the heat dissipation teeth 33, but also form a continuous heat dissipation channel, allowing heat to be transferred and dissipated more smoothly within the heat sink 32. The series elements may be made of metal wire, thin metal sheets, or other high-thermal conductivity materials to ensure efficient heat transfer. The design of the heat dissipation teeth 33 and series elements greatly increases the heat dissipation area while optimizing the air flow path, allowing heat to be dissipated more quickly and efficiently into the surrounding environment. This design significantly reduces the temperature of the relay, improving its operational stability and service life. The series connection between the heat dissipation teeth 33 not only facilitates heat transfer but also enhances the overall structural stability of the heat sink 32. This design reduces the risk of heat sink deformation or damage due to vibration or impact, thereby improving the reliability and durability of the relay. Furthermore, the heat dissipation teeth 33 can be configured with a special shape and structure to guide air flow, creating an effective convection cooling effect. This further improves heat dissipation efficiency, especially under high power density and long-term operating conditions, providing more reliable heat dissipation for the relay.

[0047] Based on any of the above embodiments, Figure 5 The distance from the heat sink 3 to the static contact 9 on the lead-out plate 1 is smaller than the distance from the lead-out pin 103 to the static contact 9 on the lead-out plate 1, and the ratio between the two distances is not less than 3.

[0048] Specifically, the distance from heat sink 3 to static contact 9 on lead-out plate 1, i.e., the distance from horizontal connector 104 to static contact 9, is set to X1, and the distance from lead pin 103 to static contact 9 on lead-out plate 1 is set to X2, where X1 is much smaller than X2, and the ratio of X2 to X1 is not less than 3. This allows a large amount of heat generated by the contacts to be transferred to heat sink 3 located at horizontal connector 104 for dissipation, thereby effectively reducing the heat at lead pin 103. Heat generated by the contacts can be more quickly conducted out of the relay body through the heat sink, reducing the temperature rise of the relay. Because heat sink 32 of heat sink 3 is located outside the relay body, its heat dissipation effect is more significant, allowing heat generated by the contacts to be conducted out of the relay body more quickly, thereby significantly reducing the overall temperature rise of the relay.

[0049] Based on any of the above embodiments, the inner side 11 of the lead-out plate is provided with a first slot 101 which is a circular hole and a second slot 102 which is a waist-shaped hole.

[0050] Specifically, by providing a first slot 101 and a second slot 102 on the inner side 11 of the lead sheet, and the first slot 101 and the second slot 102 are located on the outer side of the base 4, the resistance difference between the inner side 11 and the outer side 12 of the lead sheet can be effectively balanced, thereby allowing more current to be transmitted through the outer side 12 of the lead sheet, thereby reducing the heat generated at the inner side 11 of the lead sheet, further effectively reducing the temperature rise inside the relay. Through experimental calculation, the calculation results are shown in the following table. Q is the heat generated in 1s, r1 is the resistance of the outer side of the lead sheet, r2 is the resistance of the inner side of the lead sheet, I1 is the current passing through the outer side of the lead sheet, I2 is the current passing through the inner side of the lead sheet, Q1 is the heat generated in 1s on the outer side of the lead sheet, Q2 is the heat generated in 1s on the inner side of the lead sheet, and S is the surface area. According to the experimental data in the table, it can be seen intuitively that by balancing the resistance difference between the inner side 11 of the lead-out plate and the outer side 12 of the lead-out plate, more heat can be dissipated through the outer side 12 of the lead-out plate, while the heat generated on the inner side 11 of the lead-out plate remains unchanged, thereby effectively reducing the temperature rise inside the relay.

[0051] r1 r2 I1 I2 Q1 Q2 Q1 change Q2 transformation A product on the market 0.02 0.0073 85.6 234 146.5 399.7 0 0 Lateral shortening X1 Inner S=72 0.0147 0.0073 103.2 216.8 156.6 343.1 6.8% -14.2% Lateral shortening X2 Inner S=66 0.0147 0.0078 111 209 181.1 340.7 23.6% -14.8% Shorten the outside X3 inside S=60 0.0147 0.0087 121 199 215.2 344.5 46.9% -13.8%

[0052] Based on any of the above embodiments, Figure 5 The upper cover 7 is provided with a plurality of through holes 721 , each of which is provided with an explosion-proof window 72 . The through holes 721 are located on the inner side of the explosion-proof window 72 and a circle of gaps is provided.

[0053] Specifically, there are two through holes 721 on the upper cover 7, and each through hole 721 is provided with an explosion-proof window 72. The explosion-proof window 72 plays the function of keeping the upper cover 7 sealed during normal use. However, when the device in the shell is damaged and high-temperature gas is generated, the explosion-proof window 72 is damaged in time, which can avoid the explosion of the relay and improve the explosion-proof performance of the relay.

[0054] In order to further ensure that the explosion-proof window 72 can be broken in time when the components in the shell are damaged and high-temperature gas is generated, a circle of notches is opened around the through hole 721 in the circumferential direction of the explosion-proof window 72, so that the connection between the explosion-proof window 72 and the through hole 721 becomes thinner, making it easier for the explosion-proof window 72 to fall off and be damaged from the through hole 721, further improving the explosion-proof performance of the relay.

[0055] Based on any of the above embodiments, Figure 5 A circle of notches is provided on the upper cover 7 in the circumferential direction of the heat sink 3 to form an air duct.

[0056] Specifically, to enhance the heat dissipation effect and improve the thermal management performance of the device, a circle of notches is opened on the upper cover 7 in the circumference of the heat sink 3. These notches are interconnected to form a continuous air duct, providing a channel for air flow, thereby facilitating convection with the outside air and further improving heat dissipation efficiency.

[0057] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0058] The above describes in detail the low-temperature-rise relay provided by the present invention. This document uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above examples is intended only to facilitate understanding of the method and core concepts of the present invention. It should be noted that those skilled in the art may make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications fall within the scope of protection of the present invention.

Claims

1. A low temperature rise relay, comprising a base (4), wherein a magnetic circuit assembly (5) and a movable armature assembly (6) are arranged in the base (4), wherein the movable armature assembly (6) is connected to the magnetic circuit assembly via a compression spring (8), and the base (4) is covered with an upper cover (7), characterized in that: A lead-out piece (1) is provided in the base (4), and a plurality of glue grooves (41) are provided on a side of the base (4) facing away from the upper cover (7), so that the lead-out pins (103) of the lead-out piece (1) extend out of the base (4) along the glue grooves (41); The side of the lead-out piece (1) facing away from the lead-out pin (103) is connected to a heat sink (3), and a sealing groove (71) is provided on the upper cover (7) so that the end of the heat sink (3) facing away from the lead-out piece (1) passes through and is located outside the upper cover (7); The lead-out piece (1) is a U-shaped copper busbar, and the lead-out piece (1) comprises a lead-out piece inner side (11) and a lead-out piece outer side (12) that are parallel to each other; The side of the inner side (11) of the lead-out plate facing away from the lead-out pin (103) and the side of the outer side (12) of the lead-out plate facing away from the lead-out pin (103) are connected via a crossbar connector (104), and the heat sink (3) is arranged at the crossbar connector (104); The heat sink (3) includes a connecting piece (31) and a plurality of heat sinks (32), the connecting piece (31) is connected to the crossbar connector (104), the plurality of heat sinks (32) are arranged in parallel with each other, and are arranged on the crossbar connector (104) along the reverse extension direction of the lead-out pin (103), the connecting piece (31) and the crossbar connector (104) are matched in shape to increase the contact area between the connecting piece (31) and the crossbar connector (104), and a plurality of heat dissipation teeth (33) are provided on a side of each heat sink (32) away from the crossbar connector (104), and the upper ends of the plurality of adjacent heat dissipation teeth (33) on each heat sink (32) are connected to each other through a series connection member; The inner side (11) of the lead-out plate is penetrated by a plurality of slots, including a first circular slot (101) and a second waist-shaped slot (102). The first slot and the second slot are located outside the base (4) and are used to balance the resistance difference between the inner side (11) of the lead-out plate and the outer side (12) of the lead-out plate, so that more current can be transmitted through the outer side (12) of the lead-out plate.

2. A low temperature rise relay according to claim 1, characterized in that: The distance from the heat sink (3) to the static contact (9) on the lead-out plate (1) is smaller than the distance from the lead-out pin (103) to the static contact (9) on the lead-out plate (1), and the ratio between the two distances is not less than 3.

3. A low temperature rise relay according to any one of claims 1-2, characterized in that: The upper cover (7) is provided with a plurality of through holes (721), each of which is provided with an explosion-proof window (72), and the through holes (721) are located on the inner side of the explosion-proof window (72) and have a circle of notches.

4. A low temperature rise relay according to any one of claims 1-2, characterized in that: A circle of notches is provided on the upper cover (7) in the circumferential direction of the heat sink (3) to form an air duct.

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