Composite liquid cooling heat dissipation plate and manufacturing method thereof

Abstract

The invention relates to the technical field of liquid cooling plates, in particular to a composite liquid cooling heat dissipation plate and a manufacturing method thereof.The composite liquid cooling heat dissipation plate comprises a liquid cooling plate box body used for conducting heat dissipation on a chip, a water inlet pipe and a water outlet pipe are connected to the liquid cooling plate box body, and a flow channel is formed in the liquid cooling plate box body and communicates with the water inlet pipe and the water outlet pipe; the water outlet pipe is provided with an adjusting mechanism which changes the flow speed in the flow channel through water temperature, the adjusting mechanism comprises a shell fixedly connected to the water outlet pipe, a valve ball is installed in the water outlet pipe, a flow guide cover communicated with the shell is fixedly connected to the shell, a bimetallic strip is hinged to the support, and a sealing bag is fixedly connected between the bottom face of the bimetallic strip and the flow guide cover. The bimetallic strip is provided with a transmission assembly used for driving the valve ball to rotate. The water flow can be adjusted according to the heating value of the chip, the flowing speed of the cooling liquid can be dynamically adjusted according to the actual temperature change by adjusting the flowing speed, it is ensured that heat generated by the chip is taken away more efficiently, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling plates, and in particular to a composite liquid cooling heat sink and a manufacturing method thereof. Background Art

[0002] As the performance of electronic devices continues to improve, especially the widespread application of high-power chips, the heat dissipation problem is becoming increasingly serious. High temperature environments will affect the performance and life of chips, so effective heat dissipation solutions become particularly important. Among them, the composite liquid-cooled heat sink reduces the operating temperature by maximizing the heat transfer efficiency between the coolant and the chip. When the heat of the chip changes, the regulation of the fluid flow rate is particularly important. Changes in flow rate can affect the efficiency of heat exchange by changing the flow rate of coolant. In order to keep the chip within the optimal operating temperature range, most of the existing flow rate regulation methods use electrical control, but electric control systems usually involve multiple sensors, control modules and cable connections, which makes the system structure complex, increases the difficulty of design and manufacturing, and may also lead to an increase in failure points. Summary of the invention

[0003] In view of the deficiencies of the prior art, the present invention provides a composite liquid-cooled heat sink and a method for manufacturing the same, which has the advantages of reducing complex electrical connections and components, thereby improving system reliability and solving the problem of using electricity to control liquid flow rate.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0005] A composite liquid-cooled heat sink comprises a liquid-cooled plate box for dissipating heat for a chip, the liquid-cooled plate box being respectively connected with a water inlet pipe and a water outlet pipe, and a flow channel arranged in the liquid-cooled plate box and connected with the water inlet pipe and the water outlet pipe, the water outlet pipe being provided with a regulating mechanism for changing the flow velocity in the flow channel by water temperature, the regulating mechanism comprising a shell fixedly connected to the water outlet pipe, a valve ball being installed in the water outlet pipe, a flow guide cover connected to the shell being fixedly connected, a bracket being further fixedly connected to the shell, a bimetallic strip being hinged on the bracket, a sealing bag being fixedly connected between the bottom surface of the bimetallic strip and the flow guide cover, and a transmission component for driving the valve ball to rotate being provided on the bimetallic strip.

[0006] Preferably, the transmission assembly includes a transmission sleeve fixedly connected to the water outlet pipe, a transmission shaft is rotatably mounted in the transmission sleeve, and an end of the transmission shaft extends through a slide groove into the water outlet pipe and is connected to the valve ball.

[0007] Preferably, a connecting shaft is rotatably installed in the transmission sleeve, bevel gears for meshing transmission are mounted on the connecting shaft and the transmission shaft, a spur gear is mounted on the connecting shaft, a slide bar is slidably connected to the transmission sleeve, and a rack for meshing transmission with the spur gear is fixed at the end of the slide bar.

[0008] Preferably, a U-shaped frame is slidably connected to the slide bar, a plurality of connecting bars are hinged between the bimetallic strip and the U-shaped frame, and a stopper that fits the outer wall of the U-shaped frame is fixedly connected to the end of the slide bar.

[0009] Preferably, a notch is provided on the liquid cooling plate box body, and a heat dissipation copper block corresponding to the chip is embedded in the notch.

[0010] Preferably, the flow channel includes flow channel one and flow channel two, the two flow channels one are respectively arranged on both sides of the liquid cooling plate box, and the flow channel two is respectively connected to the two flow channels one.

[0011] Preferably, the diameter of the second flow channel is larger than the diameter of the first flow channel, and the second flow channel is a U-shaped structure.

[0012] Preferably, an aluminum liquid wrapped area is provided between the heat dissipation copper block and flow channel 1 on one side of the water outlet pipe.

[0013] A method for manufacturing a composite liquid cooling heat sink comprises the following steps:

[0014] S1. According to the specific shape of high-power chips, materials with high thermal conductivity are selected to design independent heat dissipation copper blocks;

[0015] S2. According to the structural characteristics of the liquid cooling plate, during the mold design and manufacturing process, a heat dissipation copper block assembly notch matching the chip position is pre-set on the liquid cooling plate;

[0016] S3. Place the prefabricated heat dissipation copper block into the die-casting mold, and use a fixing device to ensure the stability of the heat dissipation copper block to prevent the heat dissipation copper block from falling off and causing damage to the mold. Subsequently, use the die-casting equipment to inject molten metal into the mold under high pressure to form the preliminary structure of the liquid cooling plate. In this process, the heat dissipation copper block and the metal liquid together constitute the complete structure of the liquid cooling plate.

[0017] By means of the above technical solution, the present invention provides a composite liquid cooling heat sink and a manufacturing method thereof, which have at least the following beneficial effects:

[0018] 1. The composite liquid-cooled heat sink and its manufacturing method are provided with an adjustment mechanism. The higher the water temperature, the greater the bending degree of the bimetallic strip. Conversely, the lower the water temperature, the smaller the bending degree of the bimetallic strip. Thus, the water flow rate can be adjusted according to the heat generated by the chip. By adjusting the flow rate, the flow rate of the coolant can be dynamically adjusted according to the actual temperature change, ensuring that the heat generated by the chip is taken away more efficiently and the heat dissipation effect is improved.

[0019] 2. The composite liquid-cooled heat sink and its manufacturing method, the transmission shaft rotates to drive the valve ball to rotate, thereby adjusting the inlet and outlet positions of the valve ball. Dynamic adjustment of the flow rate helps to maintain the stability of the fluid and avoid local overheating or excessive temperature fluctuations.

[0020] 3. The composite liquid cooling heat sink and its manufacturing method can automatically adjust the flow rate according to the change of water temperature to realize intelligent temperature management. The flow rate increases at high temperature to help quickly dissipate heat; the flow rate decreases at low temperature to save energy.

[0021] 4. The composite liquid-cooled heat sink and its manufacturing method not only meet the requirements of sealing performance, but also can perform efficient heat exchange for high heat consumption chip areas. The presence of high thermal conductivity heat sink blocks significantly improves the heat exchange efficiency of the chip heat transferred to the coolant, thereby achieving a more significant cooling effect.

[0022] 5. The composite liquid-cooled heat sink and its manufacturing method use die-casting technology to achieve the combination of copper and aluminum to form a liquid cooling plate. There is no need to assemble additional high thermal conductivity materials separately to meet the heat exchange requirements, thereby eliminating the processing and assembly welding costs of additional structural parts, and effectively reducing the total cost of component processing and assembly welding. At the same time, this technology improves the reliability of the liquid cooling plate, ensuring that it maintains stable working performance under harsh environments such as high pressure and high temperature. In addition, this process significantly improves the production efficiency of the liquid cooling plate and enhances the overall market competitiveness of the company. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application:

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention in the front view direction;

[0025] Figure 2 It is a cross-sectional view of the liquid cooling plate box of the present invention;

[0026] Figure 3 It is a schematic diagram of the internal structure of the present invention;

[0027] Figure 4 It is a structural schematic diagram of the regulating mechanism of the present invention;

[0028] Figure 5 For the present invention Figure 4 A magnified image of point A;

[0029] Figure 6 This is a disassembled diagram of the liquid cooling plate box and the heat dissipation copper block of the present invention.

[0030] Reference numerals:

[0031] 100, liquid cooling plate box; 101, heat dissipation copper block; 102, notch; 103, aluminum liquid wrapped area; 104, water inlet pipe; 105, water outlet pipe; 106, flow channel 1; 107, flow channel 2;

[0032] 200, adjusting mechanism; 201, housing; 202, valve ball; 203, transmission sleeve; 204, transmission shaft; 205, connecting shaft; 206, bevel gear; 207, spur gear; 208, rack; 209, air guide cover; 210, sealing bag; 211, bracket; 212, bimetallic strip; 213, connecting strip; 214, sliding strip; 215, U-shaped frame; 216, stopper. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] In recent years, die-casting technology has been widely used in the manufacturing industry, and its advantages of high production efficiency, low cost and high part precision are particularly significant. However, in the manufacturing process of liquid cooling plates, the die-casting process is limited by a single material. This leads to the limitation of the thermal conductivity of traditional water-cooled plates, and its heat exchange performance has certain limitations. In order to cope with the growing demand for heat dissipation, an innovative solution has emerged: the use of die-casting technology to achieve a copper-aluminum combined liquid cooling plate solution. This method does not require the subsequent assembly of additional high thermal conductivity materials to meet the heat exchange requirements, thereby avoiding additional structural parts processing and assembly welding costs.

[0035] With the continuous progress of modern manufacturing, liquid cooling plates are becoming more and more widely used in electronic products, automobiles, aerospace and other fields. However, the traditional manufacturing process of liquid cooling plates composed of different materials has problems such as low production efficiency, high cost, unstable heat dissipation performance, etc., which cannot meet the strict requirements of modern manufacturing for high efficiency, energy saving and environmental protection.

[0036] Embodiment 1:

[0037] When the heat of the chip increases, the fixed flow rate may not be able to fully remove the heat, causing the chip temperature to rise and affecting the heat dissipation effect. In order to solve the above problems, combined with Figure 1-Figure 6 As shown, a composite liquid cooling heat sink provided by the present invention comprises a liquid cooling plate box 100 for cooling a chip, the liquid cooling plate box 100 is respectively connected with a water inlet pipe 104 and a water outlet pipe 105, and a flow channel arranged in the liquid cooling plate box 100 and connected with the water inlet pipe 104 and the water outlet pipe 105, and the water outlet pipe 105 is provided with a regulating mechanism 200 for changing the flow velocity in the flow channel by water temperature, which can automatically adjust the flow velocity according to the chip temperature, so that the system is more adaptive and adapts to different workloads and environmental conditions;

[0038] A fixed flow rate may cause large fluctuations in system temperature, which is not conducive to maintaining a stable working environment and affects the overall performance of the equipment. In order to solve the above problems, the regulating mechanism 200 includes a shell 201 fixedly connected to the water outlet pipe 105, a valve ball 202 is installed in the water outlet pipe 105, a flow guide cover 209 connected to the shell 201 is fixedly connected, a bracket 211 is also fixedly connected to the shell 201, a bimetallic strip 212 is hingedly connected to the bracket 211, a sealing bag 210 is fixedly connected between the bottom surface of the bimetallic strip 212 and the flow guide cover 209, and a transmission group for driving the valve ball 202 to rotate is provided on the bimetallic strip 212 When the water that absorbs heat passes through the water outlet pipe 105, the heat will also be transferred to the bimetallic strip 212 through the sealing bag 210, and then one side of the bimetallic strip 212 will bend due to the heat. After the bimetallic strip 212 is bent, it will drive the valve ball 202 to rotate through the transmission component. The higher the water temperature, the greater the bending degree of the bimetallic strip 212, and conversely, the lower the water temperature, the smaller the bending degree of the bimetallic strip 212. Therefore, the water flow rate can be adjusted according to the heat generated by the chip. By adjusting the flow rate, the flow rate of the coolant can be dynamically adjusted according to the actual temperature changes, ensuring that the heat generated by the chip is taken away more efficiently and the heat dissipation effect is improved.

[0039] The bimetallic strip 212 is formed by stacking two metals with different expansion coefficients. When the temperature changes, the two metals expand to different degrees, causing the bimetallic strip 212 to bend. The degree of bending is proportional to the temperature change. The higher the water temperature, the greater the bending degree of the bimetallic strip 212; the lower the water temperature, the smaller the bending degree. A notch 102 is opened on the liquid cooling plate box 100, and a heat dissipation copper block 101 corresponding to the chip is embedded in the notch 102.

[0040] According to the embodiments, not only the sealing performance requirements are met, but also efficient heat exchange can be performed for high heat power consumption chip areas. The presence of high thermal conductivity heat sink blocks significantly improves the heat exchange efficiency of the chip heat transferred to the coolant, thereby achieving a more significant cooling effect.

[0041] Embodiment 2:

[0042] The electric control system needs to consume additional electricity to drive the adjustment mechanism, which increases the overall energy consumption, especially in the case of long-term operation. In order to solve the above problems, combined with Figure 4 and Figure 5 As shown, on the basis of embodiment one, the transmission assembly includes a transmission sleeve 203 fixedly connected to the water outlet pipe 105, and a transmission shaft 204 is rotatably installed in the transmission sleeve 203. The end of the transmission shaft 204 extends through the slide groove to the water outlet pipe 105 and is connected to the valve ball 202. The rotation of the transmission shaft 204 can drive the valve ball 202 to rotate, thereby adjusting the inlet and outlet positions of the valve ball 202. Dynamic adjustment of the flow rate helps to maintain the stability of the fluid and avoid local overheating or excessive temperature fluctuations.

[0043] Specifically, a connecting shaft 205 is rotatably installed in the transmission sleeve 203, and a bevel gear 206 for meshing transmission is mounted on the connecting shaft 205 and the transmission shaft 204. A spur gear 207 is mounted on the connecting shaft 205. A slide bar 214 is slidably connected to the transmission sleeve 203, and a rack 208 for meshing transmission with the spur gear 207 is fixedly connected to the end of the slide bar 214. The movement of the rack 208 will drive the connecting shaft 205 to rotate through the spur gear 207. The rotation of the connecting shaft 205 drives the transmission shaft 204 to rotate through the bevel gear 206, and then drives the valve ball 202 to rotate. There is no need to use electrical equipment for adjustment, which can reduce manufacturing costs.

[0044] Furthermore, a U-shaped frame 215 is slidably connected to the slide bar 214, and a plurality of connecting bars 213 are hinged between the bimetallic strip 212 and the U-shaped frame 215. A stopper 216 that fits the outer wall of the U-shaped frame 215 is fixedly connected to the end of the slide bar 214. The bending of the bimetallic strip 212 will drive the U-shaped frame 215 to move upward through the connecting bar 213. The connecting bar 213 moves with the U-shaped frame 215, and vice versa, it will descend with the U-shaped frame 215 to adapt to the temperature changes of the chip to adjust the flow rate of the liquid, thereby adjusting the heat dissipation effect.

[0045] According to the embodiments, the flow rate can be automatically adjusted according to the change of water temperature to realize intelligent temperature management. When the temperature is high, the flow rate increases to help dissipate heat quickly; when the temperature is low, the flow rate decreases to save energy.

[0046] Embodiment three:

[0047] Combination Figure 1-Figure 3 As shown, based on the first embodiment, the flow channel includes a flow channel 106 and a flow channel 107. The two flow channels 106 are respectively arranged on both sides of the liquid cooling plate box 100, and a flow channel 2 107 is provided between the two flow channels 106. The flow channel 2 107 is respectively connected to the two flow channels 1 106, and there is a wider curved portion (flow channel 2 107) in the middle position, forming an obvious bend, which may be used to increase the contact area between the coolant and the hot surface.

[0048] Specifically, the diameter of the second flow channel 107 is greater than the diameter of the first flow channel 106. The second flow channel 107 is a U-shaped structure, and there are multiple curved paths inside the flow channel. These paths form curved sections, which can effectively guide the flow of the coolant.

[0049] Furthermore, an aluminum liquid wrapped area 103 is provided between the heat dissipating copper block 101 and the flow channel 106 on one side of the water outlet pipe 105 to prevent or reduce the occurrence of galvanic corrosion and avoid flow channel corrosion that may cause product leakage.

[0050] Embodiment 4:

[0051] As the performance of electronic devices continues to improve, the power consumption of chips is also gradually increasing. However, due to the limitation of the thermal conductivity of die-cast materials, the heat transfer performance of traditional water cooling plates has certain limitations. In order to solve the above problems, combined with Figure 1 and Figure 3 As shown, based on the third embodiment, a method for manufacturing a composite liquid cooling heat sink comprises the following steps:

[0052] S1. According to the specific shape of the high-power chip, a material with high thermal conductivity is selected to design an independent heat dissipation copper block 101;

[0053] S2. According to the structural characteristics of the liquid cooling plate, during the mold design and manufacturing process, a heat dissipation copper block 101 assembly notch 102 matching the chip position is pre-set on the liquid cooling plate;

[0054] S3. Place the prefabricated heat dissipation copper block 101 into the die-casting mold, and use a fixing device to ensure the stability of the position of the heat dissipation copper block 101 to prevent the heat dissipation copper block 101 from falling off and causing damage to the mold. Subsequently, use the die-casting equipment to inject molten metal into the mold under high pressure to form the preliminary structure of the liquid cooling plate. In this process, the heat dissipation copper block 101 and the metal liquid together constitute the complete structure of the liquid cooling plate.

[0055] When the heat dissipation copper block 101 directly penetrates into the flow channel 106 cavity, the two different metals, aluminum and copper, come into contact with each other. Due to the different electrode potentials of copper and aluminum, a primary battery with aluminum as the negative electrode and copper as the positive electrode will be formed, which will cause the aluminum material to be gradually corroded. By wrapping the aluminum liquid on the surface of the heat dissipation copper block 101, the potential area of ​​the more positive positive electrode copper can be reduced, while the surface area of ​​the negative electrode aluminum can be maximized, thereby greatly preventing the possibility of galvanic corrosion and avoiding the risk of flow channel corrosion leakage caused by the potential difference.

[0056] At the same time, in order to further improve the sealing performance and solve the problem of fixing the heat dissipation copper block 101, a fixing structure similar to a mold undercut is added to the design of the heat dissipation copper block 101, which can make the heat dissipation copper block 101 and the aluminum part tightly combined. The following figure shows the fixing structure of the heat dissipation copper block 101. In this way, it can be avoided that the heat dissipation copper block 101 cannot be fixed firmly or is not fixed firmly, resulting in sealing failure.

[0057] It should be noted that the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0058] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A composite liquid cooling heat sink, comprising a liquid cooling plate box (100) for cooling a chip, the liquid cooling plate box (100) being respectively connected with a water inlet pipe (104) and a water outlet pipe (105), and a flow channel arranged in the liquid cooling plate box (100) and connected with the water inlet pipe (104) and the water outlet pipe (105), characterized in that: The water outlet pipe (105) is provided with a regulating mechanism (200) for changing the flow velocity in the flow channel according to the water temperature; The regulating mechanism (200) comprises a shell (201) fixedly connected to a water outlet pipe (105), a valve ball (202) being installed in the water outlet pipe (105), a flow guide cover (209) being fixedly connected to the shell (201) and being in communication with the shell (201), a bracket (211) being also fixedly connected to the shell (201), a bimetallic strip (212) being hingedly connected to the bracket (211), a sealing bag (210) being fixedly connected between the bottom surface of the bimetallic strip (212) and the flow guide cover (209), and a transmission component for driving the valve ball (202) to rotate being provided on the bimetallic strip (212).

2. The composite liquid cooling heat sink according to claim 1, characterized in that: The transmission assembly comprises a transmission sleeve (203) fixedly connected to the water outlet pipe (105), a transmission shaft (204) rotatably mounted in the transmission sleeve (203), and an end of the transmission shaft (204) extends through a slide groove into the water outlet pipe (105) and is connected to the valve ball (202).

3. The composite liquid cooling heat sink according to claim 2, characterized in that: A connecting shaft (205) is rotatably mounted in the transmission sleeve (203); a bevel gear (206) for meshing transmission is mounted on the connecting shaft (205) and the transmission shaft (204); a spur gear (207) is mounted on the connecting shaft (205); a slide bar (214) is slidably connected to the transmission sleeve (203); and a rack (208) for meshing transmission with the spur gear (207) is fixedly connected to the end of the slide bar (214).

4. The composite liquid cooling heat sink according to claim 3, characterized in that: A U-shaped frame (215) is slidably connected to the slide bar (214), a plurality of connecting bars (213) are hinged between the bimetallic strip (212) and the U-shaped frame (215), and a stopper (216) that fits the outer wall of the U-shaped frame (215) is fixedly connected to the end of the slide bar (214).

5. The composite liquid cooling heat sink according to claim 1, characterized in that: The liquid cooling plate box body (100) is provided with a notch (102), and a heat dissipation copper block (101) corresponding to the chip is embedded in the notch (102).

6. The composite liquid cooling heat sink according to claim 5, characterized in that: The flow channel comprises flow channel one (106) and flow channel two (107), the two flow channels one (106) are respectively arranged on both sides of the liquid cooling plate box (100), and the flow channel two (107) is respectively connected to the two flow channels one (106).

7. The composite liquid cooling heat sink according to claim 6, characterized in that: The diameter of the second flow channel (107) is greater than the diameter of the first flow channel (106), and the second flow channel (107) is a U-shaped structure.

8. The composite liquid cooling heat sink according to claim 6, characterized in that: An aluminum liquid wrapped area (103) is provided between the heat dissipation copper block (101) and the flow channel 1 (106) on one side of the water outlet pipe (105).

9. A method for manufacturing the composite liquid cooling heat sink according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1. According to the specific shape of the high-power chip, a material with high thermal conductivity is selected to design an independent heat dissipation copper block (101); S2. According to the structural characteristics of the liquid cooling plate, during the mold design and manufacturing process, a heat dissipation copper block (101) assembly notch (102) matching the chip position is pre-set on the liquid cooling plate; S3. Place the prefabricated heat dissipation copper block (101) into a die-casting mold, and use a fixing device to ensure the stability of the position of the heat dissipation copper block (101) to prevent the heat dissipation copper block (101) from falling off and causing damage to the mold. Subsequently, use a die-casting device to inject molten metal into the mold under high pressure to form a preliminary structure of the liquid cooling plate. In this process, the heat dissipation copper block (101) and the metal liquid together constitute the complete structure of the liquid cooling plate.

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