Absorption type cooling system and method directly driven by chip waste heat and used for data center

Abstract

The embodiment of the invention provides an absorption type cooling system and method directly driven by chip waste heat for a data center, and the system comprises a server cabinet, a heat exchange device, a first pipeline device and a second pipeline device, and the server cabinet comprises a cabinet body and a cabinet backboard; a plurality of server cooling modules with two-phase liquid cooling plates are arranged in the cabinet body and are used for radiating a high-power chip of the server, the server cooling modules are connected with the heat exchange device through a second pipeline device, and the cabinet back plate is connected with the heat exchange device through a first pipeline device; the cabinet back plate is used as an evaporator to perform heat dissipation and cooling on hot air in the cabinet, and the server cooling module is used to perform heat dissipation and cooling on a server high-power chip; high-temperature heat of a high-power chip of the server is directly used as a high-temperature heat source to drive absorption refrigeration circulation, near-zero-energy-consumption cooling heat dissipation circulation of all servers of the cabinet can be achieved without additionally inputting the high-temperature heat, the condensation and absorption heat dissipation temperature of the system is high, and waste heat recycling is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of absorption refrigeration systems, and in particular to an absorption cooling system and method directly driven by chip waste heat for a data center. Background Art

[0002] With the rapid development of digital technology, especially the rapid progress in the fields of artificial intelligence and cloud computing, data centers, as the core supporting facilities of these technologies, have become increasingly prominent in terms of energy consumption. In the overall energy consumption structure of data centers, the cooling system accounts for a considerable proportion. Traditional computer room precision air conditioning systems account for up to 34% of energy consumption, or even more. These traditional air conditioning systems not only consume a lot of power, but also have problems such as mixing of cold and hot air flows and the inability to achieve efficient fixed-point heat dissipation, resulting in unsatisfactory heat dissipation efficiency. In order to effectively reduce energy waste and improve heat exchange efficiency, liquid cooling technology is gradually becoming a new trend in data center heat dissipation. At present, single-phase cold plate liquid cooling technology is a more common solution, but its energy utilization rate still needs to be improved, and the high-temperature heat dissipated by the chip is not fully utilized. Summary of the invention

[0003] The purpose of the embodiments of the present invention is to provide an absorption cooling system and method for data centers that is directly driven by chip waste heat, which can achieve cooling and heat dissipation of data cabinets without the need for additional high-temperature heat input, thereby significantly improving the overall energy utilization of the system.

[0004] In a first aspect, an embodiment of the present invention provides an absorption cooling system directly driven by chip waste heat for a data center, comprising: a server cabinet, a heat exchange device, a first pipeline device and a second pipeline device, the server cabinet comprising a cabinet body and a cabinet back plate, a plurality of server cooling modules with two-phase liquid cold plates are arranged in the cabinet body, the server cooling modules are connected to the heat exchange device via the second pipeline device, and the cabinet back plate is connected to the heat exchange device via the first pipeline device.

[0005] In the above implementation process, a heat exchange device and a first pipeline device are set up, the cabinet back panel is used to dissipate heat and cool the hot air in the cabinet, and a heat exchange device and a second pipeline device are set up to dissipate heat and cool the server cooling module. At the same time, the heat of the chip in the server cooling module is directly used as a high-temperature heat source to drive the refrigeration cycle. Without the need for additional high-temperature heat input, the cooling and heat dissipation cycle can be achieved, the heat exchange efficiency is high, and the overall energy utilization rate of the system is significantly improved.

[0006] Furthermore, the heat exchange device includes a condenser and an absorber, the cabinet back panel is respectively connected to the condenser and the absorber through the first pipeline device, and the server cooling module is respectively connected to the condenser and the absorber through the second pipeline device.

[0007] In the above implementation process, the server cooling module and the cabinet back plate are cooled by the condenser and the absorber, and the heat exchange cooling is cyclically performed to improve the heat exchange efficiency.

[0008] Further, the first pipeline device includes: a first liquid inlet pipe and a first liquid outlet pipe, the cabinet back plate is connected to the condenser through the first liquid inlet pipe, and the cabinet back plate is connected to the absorber through the first liquid outlet pipe;

[0009] The second pipeline device includes: a liquid distribution pipe, an air collection pipe and a liquid collection pipe. The server cooling module is connected to the absorber through the liquid distribution pipe, the server cooling module is connected to the condenser through the air collection pipe, and the server cooling module is connected to the absorber through the liquid collection pipe.

[0010] In the above implementation process, by setting the first liquid inlet pipe and the first liquid outlet pipe, the condenser and the absorber can perform cyclic heat exchange cooling on the cabinet backplate, and by setting the liquid distribution pipe, the gas collecting pipe and the liquid collecting pipe, the condenser and the absorber can perform cyclic heat exchange cooling on the server cooling module, and the heat exchange process can be accurately controlled.

[0011] Furthermore, a throttling device is provided on the first liquid inlet pipe; and a circulating pump is provided on the liquid dispensing pipe.

[0012] In the above implementation process, a throttling device is provided to reduce the pressure of liquid water entering the cabinet back plate from the condenser, thereby making the liquid water easier to vaporize, and a circulating pump is provided to drive the dilute solution into the server cooling module through the liquid distribution pipe.

[0013] Furthermore, the server cooling module includes: a server, a liquid cooling plate for dissipating heat for chips in the server, a second liquid inlet pipe, a second liquid outlet pipe, and an air outlet pipe, wherein one end of the second liquid inlet pipe is connected to the liquid distribution pipe, the other end of the second liquid inlet pipe is connected to the liquid cooling plate, one end of the second liquid outlet pipe is connected to the liquid cooling plate, the other end of the second liquid outlet pipe is connected to the liquid collecting pipe, one end of the air outlet pipe is connected to the liquid cooling plate, the other end of the air outlet pipe is connected to the air collecting pipe, and a first channel connecting the second liquid inlet pipe, the second liquid outlet pipe and the air outlet pipe is provided inside the liquid cooling plate.

[0014] Furthermore, the server cooling module also includes a connecting piece, which includes a quick connector, the second liquid inlet pipe is connected to the liquid distribution pipe through the quick connector, the second liquid outlet pipe is connected to the liquid collecting pipe through the quick connector, and the air outlet pipe is connected to the air collecting pipe through the quick connector.

[0015] In the above implementation process, the chip in the server acts as a high-temperature heat source, causing the liquid water in the dilute solution entering the liquid cooling plate to vaporize and absorb heat, taking away the high-temperature heat of the chip, thereby achieving cooling and heat dissipation of the chip and making full use of the high-temperature waste heat.

[0016] Furthermore, a second channel connecting the liquid inlet pipe and the liquid outlet pipe is provided in the cabinet back plate, and a fan is also provided on the outer side of the back plate in the server cabinet.

[0017] In the above implementation process, the hot air in the cabinet is driven by the fan to flow through the cabinet backplane for cooling and then discharged into the room. At this time, the liquid water in the cabinet backplane absorbs heat and boils, turning into the first substance (gas-liquid mixture or water vapor), thereby achieving heat dissipation and cooling of the hot air in the cabinet and improving the heat dissipation efficiency.

[0018] Furthermore, the heat exchange device also includes a heat exchanger, and the heat exchanger is connected to the absorber through the second pipeline device.

[0019] In the above implementation process, the heat exchanger is provided to improve the thermal efficiency and accelerate the circulation heat exchange of the absorption refrigeration system.

[0020] Furthermore, it also includes an outdoor heat dissipation device, which includes an outdoor heat dissipation module, a liquid storage tank and a driving device. The outdoor heat dissipation module, the liquid storage tank, the driving device and the heat exchange device are connected in sequence through a cooling pipe.

[0021] In the above implementation process, an outdoor heat dissipation device is provided to cool down the temperature in the condenser and the absorber, which, on the one hand, promotes the condensation process, and on the other hand, avoids affecting the effect of the circulation heat exchange due to excessive temperature.

[0022] In a second aspect, an embodiment of the present invention provides an absorption cooling method directly driven by chip waste heat for a data center, which is applied to the absorption cooling system directly driven by chip waste heat for a data center as described above, and specifically includes:

[0023] Detecting that the server cabinet enters a working state, controlling the heat exchange device to start;

[0024] Cooling and dissipating the server chip based on the heat exchange device, the second pipeline device and the server cooling module;

[0025] Based on the heat exchange device and the first pipe device, the cabinet backplane is used to cool and dissipate the hot air sucked by the fan in the cabinet.

[0026] Further, the heat exchange device, the second pipe device and the server cooling module are used to cool the server chip, and the cabinet backplane is used to cool the hot air sucked by the fan in the cabinet based on the heat exchange device and the first pipe device, including:

[0027] When the circulation pump is turned on, the liquid cooling plate receives the dilute solution of the absorber through the liquid distribution pipe, and the liquid water is vaporized after the dilute solution absorbs the heat of the chip, and outputs the water vapor to the gas collecting pipe and outputs the concentrated solution to the liquid collecting pipe;

[0028] The condenser receives the water vapor from the gas collecting pipe and condenses the water vapor into liquid water. After the liquid water is depressurized by the throttling device, it is input into the cabinet back plate through the first liquid inlet pipe;

[0029] The fan drives the hot air in the server cabinet to flow through the cabinet back plate to cool down and then be discharged into the room, so that the liquid water on the cabinet back plate absorbs heat and boils to become the first substance, and is transported to the absorber through the first liquid outlet pipe;

[0030] The absorber receives the concentrated solution from the liquid collecting pipe and the first substance from the first liquid outlet pipe, and outputs the diluted concentrated solution to the liquid cooling plate through the circulation pump and the liquid distribution pipe; wherein the first substance is a gas-liquid mixture or water vapor.

[0031] Furthermore, it also includes:

[0032] When the driving device is turned on, the working fluid in the liquid storage tank is driven by the driving device to enter the heat exchange device to cool the heat exchange device, and the working fluid after absorbing heat circulates into the outdoor heat dissipation module.

[0033] The outdoor heat dissipation module receives the working medium after absorbing heat and cools it down, and drives the cooled working medium into the liquid storage tank by using a driving device. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 A schematic diagram of the structure of an absorption cooling system directly driven by chip waste heat for a data center provided by the first embodiment of the present invention;

[0036] Figure 2A top view of a server of an absorption cooling system directly driven by chip waste heat for a data center according to a first embodiment of the present invention;

[0037] Figure 3 A top view of another server of the absorption cooling system directly driven by chip waste heat for a data center according to the first embodiment of the present invention;

[0038] Figure 4 A cross-sectional view of a server of an absorption cooling system directly driven by chip waste heat for a data center according to a first embodiment of the present invention;

[0039] Figure 5 A schematic flow chart of a second embodiment of the present invention provides a chip waste heat direct drive absorption cooling method for a data center;

[0040] Among them, 1. server cabinet; 11. server cooling module; 111. liquid cooling plate; 112. chip; 113a. second liquid inlet pipe; 113b. second liquid outlet pipe; 114. air outlet pipe; 115. quick connector; 116. liquid outlet; 117. air outlet; 118. liquid inlet; 12. liquid distribution pipe; 13. gas collecting pipe; 14. liquid collecting pipe; 15. circulation pump; 2. heat exchange device; 21. cabinet back panel; 22. fan; 23. first liquid inlet pipe; 24. first liquid outlet pipe; 25. cooling pipeline; 26. throttling device; 27. condenser; 28. absorber; 29. ​​heat exchanger; 3. outdoor heat dissipation module; 31. liquid storage tank; 32. driving device. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present invention will be described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0042] It should be noted that in the description of the present invention, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance. At the same time, the step numbers in the text are only for the convenience of explaining the embodiments of the present invention and do not serve to limit the order of execution of the steps.

[0043] The method provided in the embodiment of the present invention may be executed by a relevant terminal device, and the following description will be given by taking an absorption cooling system directly driven by chip waste heat in a data center as an example of the execution subject.

[0044] Please see Figures 1 to 4 , Figure 1A schematic structural diagram of an absorption cooling system directly driven by chip waste heat for a data center provided in a first embodiment of the present invention, the system comprising a server cabinet 1, a heat exchange device 2, a first pipeline device and a second pipeline device, the server cabinet 1 comprising a cabinet body and a cabinet back plate 21, a plurality of server cooling modules 11 with liquid cooling plates 111 are arranged in the cabinet body, the server cooling modules 11 are connected to the heat exchange device 2 via the second pipeline device, and the cabinet back plate 21 is connected to the heat exchange device 2 via the first pipeline device.

[0045] As described above, the embodiment of the present application sets a heat exchange device 2 and a first pipeline device, uses the cabinet back panel 21 to dissipate heat and cool the hot air in the cabinet, sets a heat exchange device 2 and a second pipeline device to dissipate heat and cool the server cooling module 11, and directly uses the heat of the server in the server cooling module 11 as a high-temperature heat source to drive the refrigeration cycle. Without the need for additional high-temperature heat input, the cooling and heat dissipation cycle can be achieved, the heat exchange efficiency is high, and the overall energy utilization of the system is significantly improved.

[0046] In some embodiments, the heat exchange device 2 includes a condenser 27 and an absorber 28, the cabinet back panel 21 is respectively connected to the condenser 27 and the absorber 28 through the first pipeline device, and the server cooling module 11 is respectively connected to the condenser 27 and the absorber 28 through the second pipeline device; specifically, the server cooling module 11 and the cabinet back panel 21 are dissipated with heat through the condenser 27 and the absorber 28, and the heat exchange cooling is cyclical to improve the heat exchange efficiency; optionally, the heat exchange device 2 also includes a heat exchanger 29, and the heat exchanger 29 is connected to the absorber 28 through the second pipeline device. By setting the heat exchanger 29, the thermal efficiency is improved, the cyclic heat exchange of the absorption refrigeration system is accelerated, and the system energy efficiency is improved.

[0047] In some embodiments, the first pipeline device includes: a first liquid inlet pipe 23 and a first liquid outlet pipe 24, the cabinet back panel 21 is connected to the condenser 27 through the first liquid inlet pipe 23, and the cabinet back panel 21 is connected to the absorber 28 through the first liquid outlet pipe 24; the second pipeline device includes: a liquid distributor 12, an air collector 13 and a liquid collector 14, the server cooling module 11 is connected to the absorber 28 through the liquid distributor 12, the server cooling module 11 is connected to the condenser 27 through the air collector 13, and the server cooling module 11 is connected to the absorber 28 through the liquid collector 14; specifically, by setting the first liquid inlet pipe 23 and the first liquid outlet pipe 24, the condenser 27 and the absorber 28 can perform cyclic heat exchange cooling on the cabinet back panel 21, and by setting the liquid distributor 12, the air collector 13 and the liquid collector 14, the condenser 27 and the absorber 28 can perform cyclic heat exchange cooling on the server cooling module 11, and the heat exchange process can be accurately controlled.

[0048] In some embodiments, a throttling device 26 is provided on the first liquid inlet pipe 23; a circulating pump 15 is provided on the liquid distribution pipe 12; specifically, by providing the throttling device 26, the pressure of the liquid water entering the cabinet back panel 21 from the condenser 27 is reduced, so that the liquid water is easier to vaporize, and a circulating pump 15 is provided to drive the dilute solution into the server cooling module 11 through the liquid distribution pipe 12.

[0049] In some embodiments, please refer to Figures 2 to 4 The server cooling module 11 includes: a server, a liquid cooling plate 111 for dissipating heat for a chip in the server, a chip 112 arranged in the server, a second liquid inlet pipe 113a, a second liquid outlet pipe 113b, an air outlet pipe 114, one end of the second liquid inlet pipe 113a is connected to the liquid distribution pipe 12, the other end of the second liquid inlet pipe 113a is connected to the liquid cooling plate 111, one end of the second liquid outlet pipe 113b is connected to the liquid cooling plate 111, the other end of the second liquid outlet pipe 113b is connected to the liquid cooling plate 111, one end of the second liquid outlet pipe 113b is connected to the liquid collecting pipe 14, one end of the air outlet pipe 114 is connected to the liquid cooling plate 111, the other end of the air outlet pipe 114 is connected to the air collecting pipe 13, and a first channel connecting the second liquid inlet pipe 113a, the second liquid outlet pipe 113b and the air outlet pipe 114 is provided inside the liquid cooling plate 111;

[0050] In some embodiments, the server cooling module 11 also includes a connecting piece, which includes a quick connector 115. The second liquid inlet pipe 113a is connected to the liquid distribution pipe 12 through the quick connector 115. The second liquid outlet pipe 113b is connected to the liquid collecting pipe 14 through the quick connector 115. The air outlet pipe 114 is connected to the air collecting pipe 13 through the quick connector 115.

[0051] Specifically, the chip 112 in the server is used as a high-temperature heat source to cause the liquid water in the dilute solution entering the liquid cooling plate 111 to vaporize and absorb heat, thereby taking away the heat of the chip 112 and improving energy utilization.

[0052] Optionally, the outlet of the liquid cooling plate 111 may be disposed on the left and right sides or the front and rear sides of the liquid cooling plate 111 , or may be disposed on the upper surface side of the liquid cooling plate 111 .

[0053] Optionally, the server cooling module 11 is provided with one or more liquid cooling plates 111 corresponding to the server chips, wherein the multiple liquid cooling plates 111 may be connected in series or in parallel.

[0054] Please refer to Figure 1 , Figure 2 and Figure 4, the pipelines of the liquid cooling plates 111 are connected in series, and the dilute lithium bromide solution flows through each liquid cooling plate 111 in a series form, and each liquid cooling plate 111 is connected through a second liquid inlet pipe 113a and an outlet pipe 114; illustratively, the pipelines of the two liquid cooling plates 111 are connected in series, and the dilute lithium bromide solution enters the first liquid cooling plate 111 through the second liquid inlet pipe 113a and the dilute lithium bromide solution flows through the first liquid cooling plate 111 to dissipate heat for the chip 112 attached to the first liquid cooling plate 111, and the heat of the chip 112 is taken away by evaporation of water in the dilute lithium bromide solution, and the remaining lithium bromide solution enters through the second liquid inlet pipe 113a The second liquid cooling plate 111 is cooled by the dilute lithium bromide solution, and the dilute lithium bromide solution flows through the internal channel of the second liquid cooling plate 111 to cool the chip 112. The heat of the chip 112 is also taken away by the evaporation of water in the dilute lithium bromide solution, and the concentrated lithium bromide solution is generated and flows into the collecting pipe 14 through the second liquid outlet pipe 113b, and enters the absorber 28 from the collecting pipe 14 through the heat exchanger 29. The water vapor generated by the first liquid cooling plate 111 and the second liquid cooling plate 111 enters the collecting pipe 13 through the outlet pipe 114 connected to the collecting pipe 13, and enters the condenser 27 from the collecting pipe 13, thereby completing the heat dissipation and cooling of the chip 112 of the server.

[0055] Please refer to Figure 1 , Figure 3 and Figure 4 , the pipelines of the liquid cooling plates 111 are connected in parallel, and the dilute lithium bromide solution flows into each liquid cooling plate 111 at the same time, and each liquid cooling plate 111 is respectively connected to the liquid distribution pipe 12, the liquid collecting pipe 14 and the gas collecting pipe 13. Specifically, the liquid cooling plate 111 is connected to the liquid distribution pipe 12 through the second liquid inlet pipe 113a, the liquid cooling plate 111 is connected to the liquid collecting pipe 14 through the second liquid outlet pipe 113b, and the liquid cooling plate 111 is connected to the gas collecting pipe 13 through the gas outlet pipe 114; illustratively, the pipelines of the two liquid cooling plates 111 are connected in parallel, and the dilute lithium bromide solution flows into each liquid cooling plate 111 through the second liquid inlet pipe 113a, the liquid cooling plate 111 is connected to the liquid distribution pipe 12 through the second liquid outlet pipe 113b, and the liquid cooling plate 111 is connected to the gas collecting pipe 13 through the gas outlet pipe 114. 3a enters the two liquid cooling plates 111 and the dilute lithium bromide solution covers the liquid cooling plates 111 to dissipate heat for the chip 112 on the liquid cooling plates 111. The water in the dilute lithium bromide solution evaporates to take away the heat from the chip 112. The generated water vapor enters the gas collecting pipe 13 through the gas outlet pipe 114, and enters the condenser 27 from the gas collecting pipe 13. The generated concentrated lithium bromide solution flows into the liquid collecting pipe 14 through the second liquid outlet pipe 113b, and enters the absorber 28 or the heat exchanger 29 from the liquid collecting pipe 14, thereby completing the heat dissipation and cooling of the chip 112 of the server.

[0056] In some embodiments, a second channel connecting the liquid inlet pipe and the liquid outlet pipe is provided in the cabinet back panel 21, and a fan 22 is also provided in the server cabinet 1, and the fan 22 is arranged toward the cabinet back panel 21; specifically, the hot air in the cabinet is driven by the fan 22 to flow through the cabinet back panel 21 for cooling and then discharged into the room. At this time, the liquid water in the cabinet back panel 21 absorbs heat and boils, turning into a first substance (a gas-liquid mixture or water vapor), and the cabinet back panel 21 is used to cool and dissipate the hot air sucked by the fan in the cabinet, thereby improving the heat dissipation efficiency.

[0057] In some embodiments, the absorption refrigeration system also includes an outdoor heat dissipation device, which includes an outdoor heat dissipation module 3, a liquid storage tank 31 and a driving device. The outdoor heat dissipation module 3, the liquid storage tank 31, the driving device and the heat exchange device 2 are connected in sequence through a cooling pipe 25; specifically, by setting up an outdoor heat dissipation device, the temperature in the condenser 27 and the absorber 28 is lowered, which on the one hand promotes the condensation process, and on the other hand avoids affecting the effect of the circulation heat exchange due to excessive temperature; wherein the driving device can be a water pump, a fluorine pump or a compressor, etc.

[0058] Optionally, the outdoor heat dissipation device is connected to the absorber 28 and the condenser 27, wherein the outdoor heat dissipation device can be connected in parallel with the absorber 28 and the condenser 27, respectively, or can be connected in series with the absorber 28 and the condenser 27. For example, please refer to Figure 1 The outdoor heat dissipation device is connected in series with the absorber 28 and the condenser 27. The outdoor heat dissipation module 3, the liquid storage tank 31, the driving device, the absorber 28 and the condenser 27 are connected in sequence through the cooling pipeline 25. When the driving device is turned on, the working fluid in the liquid storage tank 31 is driven by the driving device and flows into the absorber 28 and the condenser 27 in sequence through the cooling pipeline 25, so as to cool the working fluid in the absorber 28 and the condenser 27. The working fluid that has absorbed heat in the cooling pipeline 25 returns to the outdoor heat dissipation module 3 for cooling and then returns to the liquid storage tank 31, thereby completing the cooling cycle of the intermediate heat exchange device 2. It should be noted that the working fluid in the cooling pipeline 25 in the outdoor heat dissipation device can be a single-phase working fluid or a two-phase working fluid, such as cooling water.

[0059] Exemplarily, the outdoor heat dissipation module 3 may adopt an air cooling unit or a water cooling unit to achieve heat dissipation of the working medium in the cooling pipeline 25. The embodiment of the present application does not limit the specific device type of the outdoor heat dissipation module 3.

[0060] Optionally, the working fluid used in the first pipeline device and the second pipeline device of the absorption refrigeration system of the embodiment of the present application is a working fluid pair with special properties, that is, a binary solution composed of two substances with different boiling points. Exemplarily, the dilute solution of the embodiment of the present application can be a dilute lithium bromide solution, and correspondingly, the concentrated solution is a concentrated lithium bromide solution.

[0061] For details, please refer to Figure 1 , the server is working, the circulation pump 15 is turned on, the dilute lithium bromide solution enters the heat exchanger 29 from the absorber 28, and after the heat exchange is enhanced and heated by the heat exchanger 29, it is pressurized and driven by the circulation pump 15 to flow through the liquid separator 12, and enters the server cooling module 11 through the liquid separator 12. The liquid separator 12 is connected to the second liquid inlet pipe 113a, so that the dilute lithium bromide solution enters the liquid cooling plate 111 through the liquid inlet 118 of the second liquid inlet pipe 113a, and the dilute lithium bromide solution flows through the internal channel of the liquid cooling plate 111 to cool the chip 112, and the heat of the chip 112 is taken away by the evaporation of the water in the dilute lithium bromide solution. At this time, the chip 112 in the server acts as a high-temperature heat source, which promotes the vaporization of liquid water in the dilute lithium bromide solution. The dilute lithium bromide solution absorbs hot water and evaporates to become a concentrated lithium bromide solution and water vapor; wherein, the water vapor is discharged from the gas outlet 118 of the liquid cooling plate 111. After flowing out, the concentrated lithium bromide solution enters the air outlet pipe 114, which is connected to the air collecting pipe 13, and the water vapor enters the condenser 27 in the intermediate heat exchange device 2 through the air collecting pipe 13; the concentrated lithium bromide solution flows into the second liquid outlet pipe 113b from the liquid outlet 116 of the liquid cooling plate 111, and the second liquid outlet pipe 113b is connected to the liquid collecting pipe 14, and the concentrated lithium bromide solution enters the heat exchanger 29 from the liquid collecting pipe 14, and enters the absorber 28 after being cooled by the heat exchanger 29; in addition, in the absorber 28, the concentrated lithium bromide solution absorbs the first substance after heat exchange from the cabinet backplane 21 to become a dilute lithium bromide solution, and after heat exchange with the concentrated lithium bromide solution through the heat exchanger 29, it passes through the liquid separator 12 and enters the server cooling module 11 again to cool the chip 112, thereby completing the heat exchange and cooling cycle on the entire chip 112 side; wherein the first substance is a gas-liquid mixture or water vapor.

[0062] Specifically, when the server is working, the liquid water in the condenser 27 of the intermediate heat exchange device 2 is depressurized by the throttling device 26 and enters the cabinet back panel 21 through the first liquid inlet pipe 23; the fan 22 drives the hot air in the server cabinet 1 to flow through the cabinet back panel 21 for cooling and then discharged into the room. At this time, the liquid water in the cabinet back panel 21 absorbs heat and boils, becoming the first substance, and flows from the cabinet back panel 21 through the first liquid outlet pipe 24 and then enters the absorber 28. In the absorber 28, the first substance is absorbed by the concentrated lithium bromide solution discharged from the server cooling module 11 and becomes a dilute lithium bromide solution. The dilute lithium bromide solution re-enters the server cooling module 11 through the liquid distribution pipe 12 to cool and dissipate heat for the chip 112, forming a complete cycle heat exchange process.

[0063] In addition, the working fluid provided by the outdoor heat dissipation module 3 is stored in the liquid storage tank 31, and after being pressurized by the driving device, it enters the intermediate heat exchange device 2, which reduces the temperature in the condenser 27 to facilitate the condensation of water vapor; on the other hand, it reduces the temperature in the absorber 28 to facilitate the concentrated lithium bromide solution to absorb water vapor, avoiding the absorption effect being poor due to excessive temperature. The working fluid after absorbing heat returns to the liquid storage tank 31 after being cooled by the outdoor heat dissipation module 3.

[0064] It should be noted that the intermediate heat exchange device 2 in the embodiment of the present application may be provided with a heat exchanger 29 to improve thermal efficiency, or may not be provided with a heat exchanger 29, which does not affect the refrigeration cycle of the system in the embodiment of the present application.

[0065] It is understandable that the heat exchanger 29 is provided in the intermediate heat exchange device 2 to improve the thermal efficiency. Specifically, the concentrated lithium bromide solution is more conducive to absorbing water vapor at low temperatures, while the dilute lithium bromide solution is more likely to evaporate at high temperatures. Therefore, the high-temperature concentrated lithium bromide solution in the liquid collecting pipe 14 is heat exchanged with the low-temperature dilute lithium bromide solution at the outlet of the absorber 28. The concentrated lithium bromide solution in the liquid collecting pipe 14 enters the absorber 28 after being cooled in the heat exchanger 29, and the rate of absorbing water vapor is enhanced. At the same time, after the temperature of the dilute lithium bromide solution is increased in the heat exchanger 29, when it enters the server cooling module 11 from the liquid distribution pipe 12, liquid water is more likely to evaporate. After adding the heat exchanger 29, the heat exchange efficiency can be improved, thereby improving the performance of the absorption refrigeration system.

[0066] As described above, the embodiment of the present application directly utilizes the high-temperature heat dissipation of the cabinet server chip 112 as a high-temperature heat source to drive the absorption refrigeration cycle. Without the need for additional high-temperature heat input, it can provide the required cooling capacity for the cabinet backplane 21, innovatively realizing a self-driven, near-zero energy consumption cooling system.

[0067] The embodiment of the present application utilizes a liquid cooling plate 111 to absorb the high-temperature heat of the chip 112 to achieve evaporation and concentration of the dilute solution. Different from the traditional centralized generation, a new design of distributed solution generation is adopted, which has fewer heat exchange links, high heat exchange efficiency, and reduced heat exchange temperature difference. At the same time, the liquid cooling plate 111 adopts a new structure with a dilute solution inlet, a gas phase outlet and a concentrated solution outlet.

[0068] The embodiment of the present application systematically designs a multi-stage heat exchange process, which effectively reduces the heat exchange temperature difference by precisely controlling the heat exchange process, and significantly improves the overall energy utilization rate of the system.

[0069] Compared with existing liquid cooling technology, cooling and heat dissipation can be achieved without additional input of electrical energy or high-temperature thermal energy, which can reduce the PUE value of the data center cooling system to close to 0, showing better energy efficiency performance.

[0070] Please see Figure 5 , Figure 5A schematic flow chart of a chip waste heat direct-driven absorption cooling method for a data center provided in the second embodiment of the present invention. The second embodiment of the present invention provides an absorption cooling method for a data center directly driven by chip waste heat, which is applied to the absorption cooling system for a data center directly driven by chip waste heat as described in the first embodiment of the present invention, and specifically includes:

[0071] 100. Detect that the server cabinet enters a working state, and control the heat exchange device to start.

[0072] 200. Cooling and dissipating heat of a server chip based on the heat exchange device, the second pipeline device and the server cooling module.

[0073] 300. Based on the heat exchange device and the first pipe device, the cabinet back panel is used to cool and dissipate the hot air sucked by the fan in the cabinet.

[0074] In some embodiments, it also includes:

[0075] 400. When the driving device is turned on, the working fluid in the liquid storage tank is driven by the driving device to enter the heat exchange device to cool the heat exchange device, and the working fluid after absorbing heat circulates into the outdoor heat dissipation module.

[0076] 500. The outdoor heat dissipation module receives the working medium after absorbing heat and cools it down, and drives the cooled working medium into the liquid storage tank by using a driving device.

[0077] In some embodiments, the heat exchange device, the second pipe device and the server cooling module are used to cool and dissipate heat from the server chip, and the cabinet backplane is used to cool and dissipate heat from the hot air sucked by the fan in the cabinet based on the heat exchange device and the first pipe device, including:

[0078] When the circulation pump is turned on, the liquid cooling plate receives the dilute solution of the absorber through the liquid distribution pipe, and the liquid water is vaporized after the dilute solution absorbs the heat of the chip, and outputs the water vapor to the gas collecting pipe and outputs the concentrated solution to the liquid collecting pipe;

[0079] The condenser receives the water vapor from the gas collecting pipe and condenses the water vapor into liquid water. After the liquid water is depressurized by the throttling device, it is input into the cabinet back plate through the first liquid inlet pipe;

[0080] The fan drives the hot air in the server cabinet to flow through the cabinet back plate to cool down and then be discharged into the room, so that the liquid water on the cabinet back plate absorbs heat and boils to become the first substance, and is transported to the absorber through the first liquid outlet pipe;

[0081] The absorber receives the concentrated solution from the liquid collecting pipe and the first substance from the first liquid outlet pipe, and outputs the diluted concentrated solution to the liquid cooling plate through the circulation pump and the liquid distribution pipe; wherein the first substance is a gas-liquid mixture or water vapor.

[0082] As described above, the embodiment of the present application applies the absorption refrigeration cycle in the data center. There is no need to provide an additional high-temperature heat source required by the system generator. The chip heat is directly utilized for the evaporation and concentration of the solution using a liquid cooling plate. Compared with other absorption refrigeration technologies, there are fewer heat exchange links and a smaller required temperature difference. Compared with other liquid cooling technologies, the utilization rate of chip heat dissipation is higher.

[0083] The embodiment of the present application utilizes an absorption system driven by chip heat dissipation, which requires very little energy consumption. The system has high heat dissipation efficiency, is independent of the natural environment, and achieves self-driving and near-zero energy consumption heat dissipation.

[0084] The embodiment of the present application utilizes a liquid cooling plate for efficient active heat dissipation, and directly and accurately and efficiently dissipates heat for high-temperature chips. Compared with single-phase liquid cooling, it can take away more heat per unit area, and can realize a higher-power IT architecture. It has modular application potential. For situations where the power and number of server chips are different, it is only necessary to replace the liquid cooling plate and adjust the pipeline. It can be applicable to multiple high-power cabinets, that is, multiple backplane heat exchangers are connected in parallel, and multiple liquid cooling plates are connected in parallel through liquid distribution pipes, liquid collecting pipes and gas collecting pipes to realize multi-cabinet heat dissipation.

[0085] In several embodiments provided by the present invention, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, program segment or a part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0086] In addition, the functional modules in the various embodiments of the present invention may be integrated together to form an independent part, or each module may exist independently, or two or more modules may be integrated to form an independent part.

[0087] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. An absorption cooling system directly driven by chip waste heat for a data center, characterized in that: include: A server cabinet, a heat exchange device, a first pipeline device and a second pipeline device. The server cabinet includes a cabinet body and a cabinet back plate. A plurality of server cooling modules with two-phase liquid cooling plates are arranged in the cabinet body. The server cooling modules are connected to the heat exchange device through the second pipeline device, and the cabinet back plate is connected to the heat exchange device through the first pipeline device.

2. The chip waste heat directly driven absorption cooling system for data centers according to claim 1 is characterized in that: The heat exchange device includes a condenser and an absorber, the cabinet back panel is connected to the condenser and the absorber respectively through the first pipeline device, and the server cooling module is connected to the condenser and the absorber respectively through the second pipeline device.

3. The chip waste heat directly driven absorption cooling system for data centers according to claim 2 is characterized in that: The first pipeline device includes: a first liquid inlet pipe and a first liquid outlet pipe, the cabinet back plate is connected to the condenser through the first liquid inlet pipe, and the cabinet back plate is connected to the absorber through the first liquid outlet pipe; The second pipeline device includes: a liquid distribution pipe, an air collection pipe and a liquid collection pipe. The server cooling module is connected to the absorber through the liquid distribution pipe, the server cooling module is connected to the condenser through the air collection pipe, and the server cooling module is connected to the absorber through the liquid collection pipe.

4. The chip waste heat directly driven absorption cooling system for data centers according to claim 3 is characterized in that: The first liquid inlet pipe is provided with a throttling device; the liquid dispensing pipe is provided with a circulating pump.

5. The chip waste heat directly driven absorption cooling system for data centers according to claim 3 is characterized in that: The server cooling module includes: a server, a liquid cooling plate for dissipating heat for chips in the server, a second liquid inlet pipe, a second liquid outlet pipe, and an air outlet pipe, wherein one end of the second liquid inlet pipe is connected to the liquid distribution pipe, the other end of the second liquid inlet pipe is connected to the liquid cooling plate, one end of the second liquid outlet pipe is connected to the liquid cooling plate, the other end of the second liquid outlet pipe is connected to the liquid collecting pipe, one end of the air outlet pipe is connected to the liquid cooling plate, the other end of the air outlet pipe is connected to the air collecting pipe, and a first channel connecting the second liquid inlet pipe, the second liquid outlet pipe and the air outlet pipe is provided inside the liquid cooling plate.

6. The chip waste heat directly driven absorption cooling system for data centers according to claim 5, characterized in that: The server cooling module also includes a connector, which includes a quick connector. The second liquid inlet pipe is connected to the liquid distribution pipe through the quick connector, the second liquid outlet pipe is connected to the liquid collecting pipe through the quick connector, and the air outlet pipe is connected to the air collecting pipe through the quick connector.

7. The chip waste heat directly driven absorption cooling system for data centers according to claim 3, characterized in that: A fan is also provided on the outer side of the back plate of the server cabinet.

8. The chip waste heat directly driven absorption cooling system for data centers according to claim 2, characterized in that: The heat exchange device further comprises a heat exchanger, and the heat exchanger is connected to the absorber via the second pipeline device.

9. The chip waste heat directly driven absorption cooling system for data centers according to claim 1, characterized in that: It also includes an outdoor heat dissipation device, which includes an outdoor heat dissipation module, a liquid storage tank and a driving device. The outdoor heat dissipation module, the liquid storage tank, the driving device and the heat exchange device are connected in sequence through a cooling pipe.

10. An absorption cooling method directly driven by chip waste heat for a data center, characterized in that: The absorption cooling system directly driven by chip waste heat for a data center according to any one of claims 1 to 9 specifically comprises: Detecting that the server cabinet enters a working state, controlling the heat exchange device to start; Cooling and dissipating the server chip based on the heat exchange device, the second pipeline device and the server cooling module; Based on the heat exchange device and the first pipe device, the cabinet backplane is used to cool and dissipate the hot air sucked by the fan in the cabinet.

11. The chip waste heat direct-driven absorption cooling method for a data center according to claim 10, characterized in that: The method of cooling the server chip based on the heat exchange device, the second pipe device and the server cooling module, and cooling the hot air sucked by the fan in the cabinet by using the cabinet back plate based on the heat exchange device and the first pipe device, includes: When the circulation pump is turned on, the liquid cooling plate receives the dilute solution of the absorber through the liquid distribution pipe, and the liquid water is vaporized after the dilute solution absorbs the heat of the chip, and outputs the water vapor to the gas collecting pipe and outputs the concentrated solution to the liquid collecting pipe; The condenser receives the water vapor from the gas collecting pipe and condenses the water vapor into liquid water. After the liquid water is depressurized by the throttling device, it is input into the cabinet back plate through the first liquid inlet pipe; The fan drives the hot air in the server cabinet to flow through the cabinet back plate to cool down and then be discharged into the room, so that the liquid water in the cabinet back plate absorbs heat and boils to become the first substance, and is transported to the absorber through the first liquid outlet pipe; The absorber receives the concentrated solution from the liquid collecting pipe and the first substance from the first liquid outlet pipe, and outputs the diluted concentrated solution to the liquid cooling plate through the circulation pump and the liquid distribution pipe; wherein the first substance is a gas-liquid mixture or water vapor.

12. The chip waste heat direct-driven absorption cooling method for a data center according to claim 10, characterized in that: Also includes: When the driving device is turned on, the working fluid in the liquid storage tank is driven by the driving device to enter the heat exchange device to cool the heat exchange device, and the working fluid after absorbing heat circulates into the outdoor heat dissipation module; The outdoor heat dissipation module receives the working medium after absorbing heat and cools it down, and drives the cooled working medium into the liquid storage tank by using a driving device.

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