Cleaning agent composition, cleaning material, and method for cleaning mold for molding

Abstract

A cleaning agent composition includes a main material of the cleaning agent composition, and an amine compound that does not contain an amino group at a terminal of a molecular chain and contains an amino group at a position other than the terminal of the molecular chain.

Description

Technical Field

[0001] The present invention relates to a cleaning agent composition, a cleaning material and a method for cleaning a molding die. Background Art

[0002] In the field of plastic molding such as injection molding, transfer molding, and compression molding, molding using molds is usually repeated. As the number of moldings increases, molding materials or components derived from the molding materials accumulate inside the mold and become mold fouling. Such mold fouling reduces the demoulding properties of the molded product and may cause poor appearance. In addition, if the fouling accumulates further, it may cause dimensional abnormalities in the molded product.

[0003] Therefore, in order to prevent adverse effects caused by the contaminated mold, the mold needs to be cleaned regularly to remove the contaminants attached to the mold surface.

[0004] As a mold cleaning agent composition that has an excellent cleaning effect on a mold that has been contaminated by repeated molding operations, a mold cleaning agent composition containing at least one of a synthetic rubber and a synthetic resin as a base material, at least one of an alkali metal salt and an alkali metal hydroxide, and an organic solvent or water is known (for example, refer to Patent Documents 1 and 2). After a mold cleaning material containing such a mold cleaning agent composition is arranged in an open mold, the mold is closed, and heating and pressurizing are performed while the mold cleaning material is clamped. In this way, the contaminants formed on the mold surface are integrated with the mold cleaning material, and the mold cleaning material integrated with the contaminants is peeled off from the mold, thereby cleaning the mold surface.

[0005] [Prior art literature]

[0006] [Patent Document]

[0007] Patent Document 1: Japanese Patent Application Publication No. 2011-021156

[0008] Patent Document 2: Japanese Patent Application Publication No. 2011-020416 Summary of the invention

[0009] [Problems to be solved by the invention]

[0010] In addition to the mold cleaning methods described in Patent Documents 1 and 2, there is also a method of using a mold cleaning material formed by molding a mold cleaning composition containing an amine compound to remove contaminants attached to the mold surface to clean the mold. However, although the cleaning composition containing an amine compound has an excellent cleaning effect inside the mold, when the mold is repeatedly cleaned using the cleaning composition, contamination may sometimes occur on the periphery of the mold.

[0011] The present disclosure aims to provide a cleaning composition capable of suppressing contamination of the periphery of a molding die, a cleaning material formed by the cleaning composition, and a method for cleaning a molding die using the cleaning composition.

[0012] [Technical means to solve the problem]

[0013] Means for solving the above-mentioned problems include the following aspects.

[0014] <1> A cleaning agent composition comprising

[0015] Main material of the cleaning composition, and

[0016] An amine compound that does not contain an amino group at the terminal of the molecular chain and contains an amino group at a position other than the terminal of the molecular chain.

[0017] <2> A cleaning agent composition comprising

[0018] Reinforcing material for cleaning agent composition, and

[0019] An amine compound that does not contain an amino group at the terminal of the molecular chain and contains an amino group at a position other than the terminal of the molecular chain.

[0020] <3> A cleaning agent composition comprising an amine compound having no amino group at the terminal of the molecular chain and having an amino group at a position other than the terminal of the molecular chain, and for cleaning a mold for molding a thermosetting resin.

[0021] <4> The cleaning composition according to any one of <1> to <3>, wherein the amine compound includes at least one compound selected from the group consisting of secondary amine compounds and tertiary amine compounds.

[0022] <5> The cleaning composition according to <4>, wherein the amine compound comprises a secondary amine compound,

[0023] The secondary amine compound is at least one selected from the group consisting of methylethanolamine, ethylethanolamine, propylethanolamine, butylethanolamine, dimethylamine, diisopropanolamine and diethanolamine.

[0024] <6> The cleaning composition according to any one of <1> to <3>, wherein the amine compound contains only one hydroxyl group.

[0025] <7> The cleaning composition according to any one of <1> to <6>, wherein the content of the amine compound is less than 20 parts by mass based on 100 parts by mass of the main material.

[0026] <8> A cleaning material formed by molding the cleaning composition according to any one of <1> to <7>.

[0027] <9> A method for cleaning a molding die, comprising:

[0028] A step of placing the cleaning material according to <8> in the opened molding die;

[0029] A step of clamping the cleaning material with the molding die by clamping the molding die, and heating and pressurizing the cleaning material; and

[0030] A step of peeling the cleaning material from the molding die.

[0031] [Effects of the Invention]

[0032] According to the present disclosure, there are provided a cleaning composition capable of suppressing contamination of the periphery of a molding die, a cleaning material formed by the cleaning composition, and a molding die cleaning method for cleaning the molding die using the cleaning composition. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] none DETAILED DESCRIPTION

[0034] Hereinafter, the embodiments for implementing the present disclosure are described in detail. However, the embodiments of the present disclosure are not limited to the following embodiments. In the following embodiments, except for the cases specifically indicated, the components (including component processes, etc.) are not necessary. The same is true for numerical values ​​and their ranges, and the embodiments of the present disclosure are not limited.

[0035] In the present disclosure, the term "process" includes not only a process independent of other processes but also a process that cannot be clearly distinguished from other processes as long as the purpose of the process can be achieved.

[0036] In the present disclosure, a numerical range expressed using "to" includes the numerical values ​​described before and after "to" as a minimum value and a maximum value, respectively.

[0037] In the numerical range recorded in stages in the present disclosure, the upper limit or lower limit recorded in one numerical range can be replaced by the upper limit or lower limit of the numerical range recorded in other stages. In addition, in the numerical range recorded in the present disclosure, the upper limit or lower limit of the numerical range can also be replaced by the value shown in the embodiment.

[0038] In the present disclosure, each component may include a plurality of corresponding substances. When a plurality of substances corresponding to each component are present in the composition, unless otherwise specified, the content rate or content of each component refers to the total content rate or content of the plurality of substances present in the composition.

[0039] [Cleaning agent composition]

[0040] <First embodiment>

[0041] The cleaning composition according to the first embodiment of the present disclosure contains a main material of the cleaning composition and an amine compound (hereinafter also referred to as a "specific amine compound") which does not contain an amino group at the end of the molecular chain and contains an amino group at a position other than the end of the molecular chain.

[0042] Since the cleaning composition of the first embodiment contains a specific amine compound, even when the mold is repeatedly cleaned using the cleaning composition, contamination of the periphery of the mold can be suppressed. The reason for this can be speculated as follows. In addition, the present disclosure is not limited to the following speculation.

[0043] When a cleaning agent composition containing an amine compound having an amino group at the end of a molecular chain (hereinafter also referred to as a "terminal amino group-containing compound") is used for mold cleaning, the terminal amino group-containing compound is easily degraded and altered due to heating of a cleaning material formed by molding the cleaning agent composition. As a result, contaminants are easily accumulated around the periphery of the mold due to repeated mold cleaning using the cleaning agent composition containing the terminal amino group-containing compound.

[0044] On the other hand, in the cleaning composition of the present disclosure, when the cleaning material formed by the cleaning composition is heated, the specific amine compound is less likely to be altered or deteriorated. Therefore, even when the mold is repeatedly cleaned using the cleaning composition, contamination of the mold periphery can be suppressed.

[0045] The cleaning composition is preferably used for cleaning a mold for molding a thermosetting resin.

[0046] (Main material)

[0047] The cleaning agent composition contains a main material. Examples of the main material include rubber materials and resin materials.

[0048] The main material may be used alone or in combination of two or more.

[0049] Examples of the rubber material include butadiene rubbers such as 1,2-polybutadiene, 1,4-polybutadiene, and mixtures thereof; ethylene-α-olefin rubbers such as nitrile rubber and ethylene-propylene rubber; ethylene-α-olefin-polyene rubbers; styrene-butadiene rubber; polyisoprene rubber; butyl rubber; silicone rubber; and fluororubber.

[0050] The rubber material may be used alone or in combination of two or more. For example, a mixture of butadiene rubber and ethylene-α-olefin rubber such as ethylene-propylene rubber may be used.

[0051] Examples of the resin material include polyamide resins such as nylon 6 and nylon 66; polyester resins such as polyethylene terephthalate and polybutylene terephthalate; polycarbonate resins, polyarylate resins, vinyl chloride resins, chlorinated vinyl chloride resins, polyethylene resins, chlorinated polyethylene resins, chlorinated polypropylene resins, polypropylene resins, polystyrene resins, acrylonitrile-styrene resins, vinylidene chloride resins, vinyl acetate resins, polyacrylate resins, polyimide resins, butadiene resins, polyacetal resins, ionomer resins, ethylene-vinyl chloride copolymer resins, ethylene-vinyl acetate resins. Ethylene ester copolymer resin, ethylene-vinyl acetate-vinyl chloride graft polymer resin, polyphenylene resin, polysulfone resin, methacrylic resin, acrylic-fluororesin, acrylic-silicone oligomer, silicone resin, epoxy-containing silicone / acrylic resin, vinyl ester resin, furan resin, phenol resin, melamine resin, guanamine resin, urea resin, polyurethane resin, phthalic acid diacrylate resin, ketone resin, epoxy resin, xylene resin, maleic resin, phenoxy resin, coumarone resin, polyvinyl formal resin, polyvinyl butyral resin, etc.

[0052] The resin materials may be used alone or in combination of two or more.

[0053] As described later, the main material such as rubber material and resin material can also be used in combination with a crosslinking agent, a hardener, etc. Thus, when the cleaning material formed by the cleaning agent composition is heated, the cleaning material becomes a hardened state, and the cleaning material in a hardened state can be taken out from the mold. As a method for hardening the cleaning material, hardening by heating, hardening by cooling of thermoplastic resins, etc., etc. can be cited, and in the hardening by heating, a crosslinking agent, a hardener, etc. are preferably used.

[0054] The content of the main material may be 40% to 95% by mass, 50% to 90% by mass, or 50% to 70% by mass relative to the total amount of the cleaning composition.

[0055] (Specific amine compound)

[0056] The cleaning composition contains an amine compound (specific amine compound) which does not have an amino group at the terminal of the molecular chain and contains an amino group at a position other than the terminal of the molecular chain.

[0057] The specific amine compounds may be used alone or in combination of two or more.

[0058] The specific amine compound preferably includes at least one compound selected from the group consisting of secondary amine compounds and tertiary amine compounds, and more preferably includes a secondary amine compound.

[0059] The specific amine compound (preferably at least one compound selected from the group consisting of secondary amine compounds and tertiary amine compounds) may be a compound containing a hydroxyl group or a compound not containing a hydroxyl group. When the specific amine compound is a compound containing a hydroxyl group, the specific amine compound may contain only one hydroxyl group or may contain two or more hydroxyl groups. From the viewpoint of more preferably suppressing contamination of the periphery of the mold, the specific amine compound preferably contains only one hydroxyl group.

[0060] Examples of specific amine compounds include methylethanolamine, ethylethanolamine, propylethanolamine, butylethanolamine, octyldiethanolamine, triethanolamine, dimethylamine, dimethylcyclohexylamine, dimethylhexylamine, cyclohexylamine, diisobutylamine, di-n-butylamine, diisopropanolamine, and diethanolamine. Among them, methylethanolamine, ethylethanolamine, propylethanolamine, butylethanolamine, dimethylamine, diisopropanolamine, and diethanolamine are preferred from the viewpoint of mold cleaning properties, and methylethanolamine, ethylethanolamine, propylethanolamine, butylethanolamine, and dimethylamine are preferred from the viewpoint of more appropriately suppressing contamination of the periphery of the mold.

[0061] The content of the specific amine compound may be 1% to 20% by mass, 2% to 15% by mass, or 3% to 10% by mass relative to the total amount of the cleaning composition.

[0062] The content of the amine compound may be 30 parts by mass or less relative to 100 parts by mass of the main material. From the viewpoint of suppressing the phenomenon (blooming phenomenon) of the specific amine compound and other components contained in the cleaning composition seeping out to the surface, it is preferably less than 20 parts by mass, more preferably 18 parts by mass or less, and even more preferably 16 parts by mass or less.

[0063] The content of the amine compound may be 1 part by mass or more, 3 parts by mass or more, or 5 parts by mass or more, based on 100 parts by mass of the main material.

[0064] (Crosslinking agent)

[0065] The cleaning agent composition may contain a crosslinking agent, for example, when the main material is a rubber material, a polyethylene resin, etc. The crosslinking agent is not particularly limited as long as it can crosslink the rubber material, and examples thereof include organic peroxides.

[0066] The cross-linking agent may be used alone or in combination of two or more.

[0067] Examples of the organic peroxide include 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(tert-butylperoxy)cyclohexane, tert-butyl peroxymaleate, tert-butyl peroxyoleate, tert-butyl peroxy-3,3,5-trimethylhexanoate, cyclohexanone peroxide, tert-butyl peroxyaryl carbonate, tert-butyl peroxyisopropyl carbonate, 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, 2,2-bis(tert-butylperoxy)octane, tert-butyl peroxyacetate, 2 ,2-bis(tert-butylperoxy)butane, tert-butyl perbenzoate, n-butyl-4,4-bis(tert-butylperoxy)valerate, di-tert-butyl peroxyisophthalate, methyl ethyl ketone peroxide, diisopropylbenzene peroxide, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, α,α'-bis(tert-butylperoxy-m-isopropyl)benzene, tert-butylperoxide isopropylbenzene, diisopropylbenzene hydroperoxide, di-tert-butyl peroxide and 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane-3.

[0068] When the cleaning composition contains a crosslinking agent, the content of the crosslinking agent may be 0.1 to 5% by mass, 0.5 to 4% by mass, or 1 to 3% by mass based on the total amount of the cleaning composition.

[0069] (Hardener)

[0070] The cleaning agent composition may contain a hardener, for example, when the main material is epoxy resin, the hardener may be contained. The hardener is not particularly limited as long as it can harden the epoxy resin, and examples thereof include phenol compounds, amine compounds, imidazole compounds, acid anhydrides, and organic phosphoric acid compounds.

[0071] The hardener may be used alone or in combination of two or more.

[0072] Examples of the phenol compound include monocyclic bifunctional phenols such as hydroquinone, resorcinol, and catechol; polycyclic bifunctional phenols such as bisphenol A, bisphenol F, naphthalene diols, and biphenols; and polyfunctional phenols such as halides and alkyl-substituted products thereof.

[0073] Examples of the amine compound include N,N-benzyldimethylamine, 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol, tetramethylguanidine, triethanolamine, N,N'-dimethylpiperazine, 1,4-diazabicyclo[2.2.2]octane, 1,8-diazabicyclo[5.4.0]-7-undecene, 1,5-diazabicyclo[4.4.0]-5-nonene, hexamethylenetetramine, pyridine, methylpyridine, The invention also includes but is not limited to: anthracene, ...

[0074] Examples of the imidazole compound include imidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 1-benzyl-2-methylimidazole, 2-heptadecylimidazole, 4,5-diphenylimidazole, 2-methylimidazoline, 2-phenylimidazoline, 2-undecylimidazoline, 2-heptadecylimidazole, 2-isopropylimidazole, 2,4-dimethylimidazole, 2-phenyl-4-methylimidazole, 2-ethylimidazoline, 2-phenyl-4-methylimidazoline, benzimidazole, 1-cyanoethylimidazole, and 2,4-diamino-6-[2′-methylimidazolyl-(1′)]ethyl-s-triazine.

[0075] As an acid anhydride, phthalic anhydride, hexahydrophthalic anhydride, pyromellitic dianhydride, and benzophenonetetracarboxylic dianhydride are mentioned, for example.

[0076] Examples of the organic phosphoric acid compound include hexamethylphosphoric acid triamide, tris(dichloropropyl) phosphate, tris(chloropropyl) phosphate, triphenyl phosphite, trimethyl phosphate, phenylphosphonic acid, triphenylphosphine, tri-n-butylphosphine, diphenylphosphine organic phosphorus compounds, and halides thereof.

[0077] When the cleaning composition contains a crosslinking agent, the content of the crosslinking agent may be 0.1 to 5% by mass, 0.5 to 4% by mass, or 1 to 3% by mass based on the total amount of the cleaning composition.

[0078] (Reinforcement Material)

[0079] The cleaning composition may contain a reinforcing material. Examples of the reinforcing material include silica such as amorphous silica, and inorganic fillers such as talc, alumina, calcium carbonate, and aluminum hydroxide.

[0080] The reinforcing material may be used alone or in combination of two or more.

[0081] When the cleaning composition contains a reinforcing material, the content of the reinforcing material may be 10% to 50% by mass, 15% to 40% by mass, or 20% to 30% by mass relative to the total amount of the cleaning composition.

[0082] The content of the reinforcing material may be 20 to 55 parts by mass, 25 to 50 parts by mass, or 30 to 45 parts by mass relative to 100 parts by mass of the main material.

[0083] When the content of the reinforcing material is 55 parts by mass or less, an increase in the viscosity of the cleaning composition can be suppressed, and mold followability tends to be excellent.

[0084] (Release Agent)

[0085] The cleaning composition may contain a release agent. Examples of the release agent include fatty acid-based release agents, silicone oil, and polyethylene.

[0086] The release agents may be used alone or in combination of two or more.

[0087] Examples of the fatty acid-based release agent include aliphatic carboxylic acids, aliphatic carboxylic acid esters, and fatty acid amides, and examples thereof include aliphatic carboxylic acids such as palmitic acid, stearic acid, caproic acid, capric acid, lauric acid, arachic acid, behenic acid, lignoceric acid, cerotic acid, melissic acid, tetratriacontanoic acid, octacosic acid, adipic acid, and azelaic acid; esters of these aliphatic carboxylic acids with alcohols having 30 or less carbon atoms; metal salts of these aliphatic carboxylic acids (e.g., calcium salts and zinc salts); fatty acid amides such as oleamide and stearic acid amide; carnauba wax, montan wax, and the like.

[0088] Examples of the silicone oil include dimethyl silicone oil, methylphenyl silicone oil, and methyl hydrogen silicone oil.

[0089] Among them, from the viewpoint of mold releasability, the mold release agent is preferably octadecanoic acid ester and polyethylene.

[0090] When the cleaning composition contains a release agent, the content of the release agent may be 1 to 15% by mass, 2 to 10% by mass, or 3 to 5% by mass relative to the total amount of the cleaning composition.

[0091] (Other ingredients)

[0092] The cleaning agent composition may contain other components other than the above components, or may not contain other components other than the above components. Examples of other components include cleaning agents, organic solvents, water, softeners such as aroma oil and naphthenic oil, vulcanizing agents such as sulfur, vulcanization accelerators, anti-aging agents, zinc flowers, etc.

[0093] Examples of the cleaning agent include cleaning agents other than the above-mentioned specific amine compounds, such as alkali metal salts, alkali metal hydroxides such as potassium hydroxide, amide group-containing compounds such as propionic acid amide, and primary amine compounds.

[0094] From the viewpoint of suppressing contamination of the periphery of the mold, the content of the primary amine is preferably 1% by mass or less, more preferably 0.5% by mass or less, and still more preferably 0% by mass, based on the total amount of the cleaning composition.

[0095] Examples of the organic solvent include amide solvents, alcohol solvents, ketone solvents, ether solvents, hydrocarbon solvents, halogenated hydrocarbon solvents, phenol solvents, ester solvents, and sulfur solvents (such as dimethyl sulfoxide).

[0096] From the viewpoint of maintaining the cleaning power, there are cases where an organic solvent or water is used in the cleaning composition. However, the cleaning composition of the first embodiment can maintain the cleaning power even without using an organic solvent or water by including a specific amine compound. Furthermore, since no organic solvent or water is used, these will not volatilize, and the cleaning composition of the first embodiment has excellent storage stability.

[0097] The cleaning agent composition can be produced by mechanically kneading the ingredients using a Banbury mixer, a kneader, a roll mixer, an extruder, or the like.

[0098] <Second embodiment>

[0099] The cleaning composition of the second embodiment of the present disclosure comprises a reinforcing material of the cleaning composition, and an amine compound (specific amine compound) that does not contain an amino group at the end of the molecular chain and contains an amino group at a position other than the end of the molecular chain. In the cleaning composition of the second embodiment, the difference from the first embodiment is that the reinforcing material is used as an essential component instead of the main material. Since the cleaning composition of the second embodiment comprises a specific amine compound, even if the mold is repeatedly cleaned using the cleaning composition, contamination of the periphery of the mold can be suppressed.

[0100] The description of the preferred configuration common to the first embodiment will be omitted.

[0101] Examples of the reinforcing material used in the second embodiment include, similarly to the first embodiment, silicon dioxide such as amorphous silica, talc, alumina, calcium carbonate, and inorganic fillers such as aluminum hydroxide.

[0102] The content of the reinforcing material may be 40% to 95% by mass, 50% to 90% by mass, or 50% to 70% by mass, relative to the total amount of the cleaning composition.

[0103] The cleaning composition of the second embodiment may contain other components besides the reinforcing material and the specific amine compound, for example, the materials exemplified as the main material, a cross-linking agent, a curing agent, a release agent, and other components.

[0104] <Third embodiment>

[0105] The cleaning agent composition of the third embodiment of the present disclosure is a composition as follows: it contains an amine compound (specific amine compound) that does not contain an amino group at the end of the molecular chain and contains an amino group at a position other than the end of the molecular chain, and is used to clean a mold for forming a thermosetting resin. In the cleaning agent composition of the third embodiment, the difference from the first and second embodiments is that the main material and the reinforcing material are not essential components; and it is specifically used to clean a mold for forming a thermosetting resin. Since the cleaning agent composition of the third embodiment contains a specific amine compound, even when the cleaning agent composition is used to repeatedly clean the mold, contamination of the periphery of the mold can be suppressed.

[0106] The description of the preferred configurations common to the first embodiment and the second embodiment will be omitted.

[0107] The cleaning composition of the third embodiment may be used without being combined with a main material or a reinforcing material as long as it is used for cleaning a mold for molding a thermosetting resin.

[0108] [Cleaning materials]

[0109] The cleaning material of the present disclosure is a cleaning material obtained by molding any one of the cleaning compositions of the first to third embodiments of the present disclosure.

[0110] The cleaning material disclosed herein is, for example, a component formed by shaping the cleaning agent composition into a powder, ingot, sheet, block, film or strip. The cleaning material disclosed herein may be a material formed by stacking cleaning agent compositions shaped into a film, sheet, etc., or may be a material formed by stacking or attaching a cleaning agent composition shaped into a film, sheet, etc. on or to a component of a film, sheet, etc. having different characteristics. The cleaning material is used, for example, for cleaning a mold. In the case where the cleaning material is a sheet-shaped component, the thickness of the cleaning agent may be 3 mm to 10 mm.

[0111] [Cleaning method for molding dies]

[0112] The cleaning method of the molding die disclosed in the present invention is a method comprising the following steps: a step of disposing the cleaning material disclosed in the present invention in an opened molding die; a step of clamping the cleaning material with the molding die by closing the molding die, and heating and pressurizing the cleaning material; and a step of peeling the cleaning material from the molding die.

[0113] The cleaning method of the forming mold includes the step of placing the cleaning material of the present disclosure in an opened forming mold. For example, the cleaning material formed into a powder, an ingot, a sheet or a strip is placed in the opened forming mold. As an example, the sheet-shaped cleaning material can be placed between the upper mold and the lower mold of the mold, each of which has a concave portion.

[0114] The cleaning method of a forming mold includes a process of clamping a cleaning material by clamping the forming mold by closing the forming mold, and heating and pressurizing. The cleaning material is clamped by the forming mold by closing the forming mold in a state where the cleaning material is arranged in the open forming mold, and heating and pressurizing are performed. By pressurizing, the cleaning material arranged in the forming mold is filled into the cavity including the concave portion formed in the upper mold and the concave portion formed in the lower mold, and is crimped to the mold surface. In addition, by heating, the contaminants attached to the mold are integrated with the cleaning material. At this time, depending on the situation, the burrs formed around the cavity are also integrated with the cleaning material.

[0115] The method for cleaning the forming mold includes a step of peeling the cleaning material from the forming mold. For example, after the heating and pressurizing are performed for a predetermined time, the upper mold and the lower mold are opened, and the cleaning material is peeled from the upper and lower molds. The mold is cleaned in this way.

[0116] The conditions for compression molding and heating the cleaning material by clamping the cleaning material with a mold can be appropriately set according to the composition and type of the cleaning material. For example, when a rubber material or a resin material is used as the main material, it is preferably heated at 160°C to 190°C for 1 minute to 5 minutes.

[0117] The mold to be cleaned in the cleaning method of the molding mold disclosed herein may be, for example, a molding mold of a thermosetting resin. More specifically, the mold to be cleaned may be a molding mold for sealing a semiconductor device that is repeatedly molded using a thermosetting resin.

[0118] Examples of the thermosetting resin include epoxy resins. The mold to be cleaned may be a molding mold for sealing a semiconductor device that is repeatedly molded using a resin composition containing an epoxy resin.

[0119] The resin composition may also contain an epoxy resin, a hardener, and, if necessary, additives such as an inorganic filler and a hardening accelerator.

[0120] In the forming mold cleaned by the cleaning method disclosed herein, pollutants are removed, thereby returning to the mold surface of the initial state. Therefore, when using thermosetting resin to form, it is preferred to apply a release agent on the mold surface in advance. For example, when forming a forming material containing octacosanoic acid wax as a release agent, it is preferred to apply the same octacosanoic acid wax, and in addition, when forming a forming material containing carnaba wax as a release agent, it is preferred to apply the same carnaba wax. And, as a method for applying a release agent on the mold surface, it is preferred to use a person formed in the following manner: prepare an unvulcanized rubber composition containing a release agent, and form it into a sheet. For example, a sheet obtained by allocating the unvulcanized rubber and the release agent recorded in Japanese Patent Laid-Open 2011-020416 Gazette can be cited. Then, by loading the sheet containing the unvulcanized rubber composition containing the release agent into a mold and heating it, the release agent contained is applied to the mold surface. This is considered to be because the release agent in the unvulcanized rubber composition melts during heat vulcanization and seeps out onto the mold surface to form a uniform release agent film on the surface.

[0121] [Example]

[0122] Next, although the embodiment of the present disclosure is specifically described by way of examples, the embodiment of the present disclosure is not limited to these examples.

[0123] First, the components constituting the cleaning composition are prepared.

[0124] 1) EPR (main material): ethylene-propylene-diene rubber, manufactured by Mitsui Chemicals, EPT4045 (ethylene content: 54 mol%, diene content: 8.1 mol%)

[0125] 2) BR (main material): Butadiene rubber, manufactured by JSR Corporation, BR-01 (cis 1,4 bond: 95%)

[0126] 3) Amorphous silica particles (reinforcement material): Brunauer-Emmett-Teller (BET) specific surface area 200 m 2 / g, volume specific gravity 140g / L

[0127] 4) Titanium oxide: average particle size 0.25 μm

[0128] 5) Amide wax: release agent

[0129] 6) Organic peroxide: cross-linking agent

[0130] 7) AEE: 2-(2-aminoethoxy)ethanol, boiling point 222°C, primary amine compound

[0131] 8) NMEOA: methylethanolamine, boiling point 159°C, secondary amine compound

[0132] 9) BEOA: Butylethanolamine, boiling point 198°C, secondary amine compound

[0133] 10) DIPOA: diisopropanolamine, boiling point 249°C, secondary amine compound

[0134] 11) DEOA: diethanolamine, boiling point 269°C, secondary amine compound

[0135] 12)ODEOA: Octyldiethanolamine, boiling point 319°C, tertiary amine compound

[0136] 13) 2-amino-2-methyl-1-propanol, boiling point 165°C, primary amine compound

[0137] [Example 1 to Example 8 and Comparative Example 1 and Comparative Example 2]

[0138] The components constituting the cleaning agent composition were mixed at the ratios shown in Table 1 and kneaded using a kneading roll. Subsequently, the mixture was formed into a sheet (thickness 5 mm) using a nip roll to prepare a target sheet-shaped cleaning material.

[0139] The numerical unit of each component in Table 1 and Table 2 is part by mass, and a blank column in Table 1 and Table 2 means that no component is blended.

[0140] [Table 1]

[0141] Comparative Example 1 Example 1 Example 2 EPR 50 50 50 BR 50 50 50 Amorphous silica particles 40 40 40 Titanium oxide 4 4 4 Amide wax 2 2 2 Organic peroxide 2 2 2 AEE 8 NMEOA 8 BEOA 8 total 156 156 156

[0142] [Table 2]

[0143] Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Comparative Example 2 EPR 50 50 50 50 50 50 50 BR 50 50 50 50 50 50 50 Amorphous silica particles 40 40 40 40 40 40 40 Titanium oxide 4 4 4 4 4 4 4 Amide wax 2 2 2 2 2 2 2 Organic peroxide 2 2 2 2 2 2 2 DIPOA 8 DEOA 8 ODEOA 8 NMEOA 15 20 25 2-Amino-2-methyl-1-propanol 8 total 156 156 156 163 168 173 156

[0144] [Evaluation of contamination around the periphery of the molding die 1]

[0145] Using each cleaning material of Example 1, Example 2 and Comparative Example 1 obtained as described above, the contamination of the periphery of the molding die was evaluated in the following manner. 1.0 g of each cleaning material was clamped between the upper and lower molds at 175°C, heated and hardened for 5 minutes, and then removed from the upper and lower molds. The above operation was repeated 50 times. Then, whether contaminants adhered to the periphery of the upper and lower mold surfaces was evaluated.

[0146] In the above evaluation, in Comparative Example 1 using AEE, gas fouling was significantly generated, whereas in the other Examples 1 and 2, the generation of gas fouling was suppressed.

[0147] [Cleaning evaluation of cleaning materials 1]

[0148] Prepare an iron plate that has been surface-processed by coating an epoxy resin molding material as a sealing resin for semiconductors at high temperature and hardening it at 175°C for 24 hours. Next, each cleaning material of Example 1, Example 2 and Comparative Example 1 obtained as described above is arranged on the iron plate that has been surface-processed, and each cleaning material is heated and pressurized at 175°C for 5 minutes. Then, each cleaning material is peeled off from the iron plate, and the degree of removal of the epoxy resin molding material (i.e., the cleaning effect of the cleaning material) is evaluated. In any of Example 1, Example 2 and Comparative Example 1, the degree of removal of the epoxy resin molding material is excellent, and the cleaning effect of the cleaning material can be confirmed.

[0149] As the epoxy resin molding material, a material containing epoxy resin, a phenol compound as a curing agent, and silica particles as an inorganic filler was used, the equivalent ratio of epoxy group:phenolic hydroxyl group was 1:1, and the content of the inorganic filler was 78% by volume.

[0150] [Evaluation of contamination around the periphery of the molding die 2]

[0151] The cleaning materials of each embodiment and each comparative example obtained as described above were used to carry out the same process as [Evaluation of contamination of the periphery of the molding die 1]. Then, whether contaminants were attached to the periphery of the upper and lower mold surfaces was evaluated according to the following evaluation criteria. The results are shown in Table 3.

[0152] (Evaluation Criteria)

[0153] A: The generation of gas fouling is suppressed.

[0154] B: Although gas fouling was generated, it was within the allowable range.

[0155] C: Gas fouling was obviously generated.

[0156] [Cleaning evaluation of cleaning materials 2]

[0157] The same process as [Cleaning Evaluation of Cleaning Material 1] was performed using the cleaning materials of each embodiment and each comparative example obtained as described above. Then, the degree of removal of the epoxy resin molding material (i.e., the cleaning effect of the cleaning material) was evaluated according to the following evaluation criteria. The results are shown in Table 3.

[0158] (Evaluation Criteria)

[0159] A: When each cleaning material was peeled off from the iron plate, the epoxy resin molding material was sufficiently removed.

[0160] B: When each cleaning material was peeled off from the iron plate, the epoxy resin molding material was not removed and partially remained on the iron plate.

[0161] C: When each cleaning material was peeled off from the iron plate, the epoxy resin molding material was not removed and a large amount of it remained on the iron plate.

[0162] [Blooming properties]

[0163] The cleaning materials of each example and each comparative example obtained as described above were stored at 20° C. for 24 hours and then visually checked. Then, blooming properties were evaluated according to the following evaluation criteria. The results are shown in Table 3.

[0164] (Evaluation Criteria)

[0165] A: No cleaning material seepage.

[0166] B: Cleaning material is leaking.

[0167] [Table 3]

[0168] Comparative Example 1 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Comparative Example 2 Pollution Assessment C A A B B A A A B C Cleaning performance evaluation B A A A A A A A A A Blooming A A A A A A A B B A

[0169] In each example, compared with Comparative Examples 1 and 2, the generation of gas fouling was suppressed.

[0170] In the examples, the cleaning properties were evaluated to be good by using the secondary amine compound.

[0171] In addition, in the examples, it was confirmed that the blooming property was excellent by setting the amount of the amine compound to 15 parts by mass or less based on 100 parts by mass of the total of EPR and BR as the main materials.

[0172] The entire disclosure of PCT / JP2023 / 027450 filed on July 26, 2023 is incorporated into this specification by reference.

[0173] All documents, patent applications, and technical specifications described in this specification are incorporated herein by reference to the same extent as if each individual document, patent application, or technical specification was specifically and individually indicated to be incorporated by reference.

Claims

1. A cleaning agent composition comprising Main material of the cleaning composition, and An amine compound which does not contain an amino group at the terminal of the molecular chain and contains an amino group at a position other than the terminal of the molecular chain.

2. A cleaning agent composition comprising Reinforcing material for cleaning agent composition, and An amine compound which does not contain an amino group at the terminal of the molecular chain and contains an amino group at a position other than the terminal of the molecular chain.

3. A cleaning agent composition comprising an amine compound having no amino group at the end of the molecular chain and having an amino group at a position other than the end of the molecular chain, and for cleaning a mold for molding a thermosetting resin.

4. The cleaning composition according to any one of claims 1 to 3, wherein The amine compound includes at least one compound selected from the group consisting of secondary amine compounds and tertiary amine compounds.

5. The cleaning composition according to claim 4, wherein The amine compound comprises a secondary amine compound, The secondary amine compound is at least one selected from the group consisting of methylethanolamine, ethylethanolamine, propylethanolamine, butylethanolamine, dimethylamine, diisopropanolamine and diethanolamine.

6. The cleaning composition according to any one of claims 1 to 3, wherein The amine compound contains only one hydroxyl group.

7. The cleaning composition according to any one of claims 1 to 6, wherein The content of the amine compound is less than 20 parts by mass based on 100 parts by mass of the main material.

8. A cleaning material formed by shaping the cleaning composition according to any one of claims 1 to 7.

9. A method for cleaning a forming mold, comprising: The step of placing the cleaning material according to claim 8 in the opened molding die; a step of clamping the cleaning material with the molding die by clamping the molding die, and applying heat and pressure; and A step of peeling the cleaning material from the molding die.