A new energy vehicle body stamping device with a chip cleaning and discharge structure

Abstract

The present invention discloses a new energy vehicle body stamping device with a chip cleaning and discharge structure, which relates to the field of stamping processing technology, including a base, a die frame, a top die seat, a bottom die seat, a plate and a pressure monitor, wherein the upper surface of the base is connected to the die frame through a guide column, the bottom of the die frame is connected to the top die seat through a hydraulic cylinder, a stamping die set is installed at the bottom of the top die seat, the upper surface of the base is provided with a bottom die seat, a plate is placed on the upper surface of the bottom die seat, a chip discharge chute is provided at the bottom of the base, and a pressure monitor is provided on one side of the stamping die set. The present invention sets a stamping die set and a bottom die seat, and the guide column squeezes the air inside the guide sleeve downward, and the airflow flows closely against the surface of the plate to clean the surface of the plate. After the punch cuts the chips, the chips are pushed to fall quickly into the chip discharge chute, and at the same time, the air flow quickly cools the stamping knife block.

Description

Technical Field

[0001] The present invention relates to the technical field of stamping processing, and in particular to a new energy vehicle body stamping device with a chip cleaning and discharging structure. Background Art

[0002] New energy vehicles refer to motor vehicles that are powered by non-traditional fuels (such as electricity, hydrogen, etc.). With the improvement of environmental awareness and the attention paid to the emission pollution problems of traditional fuel vehicles, new energy vehicles have gradually become an important direction of global transportation development.

[0003] In the manufacturing process of new energy vehicles, it is often necessary to perform stamping processing on the internal connecting components of the vehicle. During the stamping process, more material chips are generated. At the same time, due to the requirements on the quality of the internal components of the vehicle, continuous stamping processing technology is often used to process and manufacture the components. During the continuous processing, material chips are constantly accumulated, affecting the quality of subsequent material processing. Existing stamping devices mostly use a punch ejection method to guide the material chips to fall for collection by gravity. However, the material chips cut by punching and cutting are easy to stick to the punch that is repeatedly stamped and heated, causing the material chips to scatter, affecting the recovery of the staff and reducing the quality of continuous production and processing. Therefore, a new energy vehicle body stamping device with a material chip cleaning and discharge structure is introduced. Summary of the invention

[0004] The object of the present invention is to provide a new energy vehicle body stamping device with a chip cleaning and discharging structure to solve the problems raised in the above-mentioned background technology.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] A new energy vehicle body stamping device with a chip cleaning and discharge structure comprises a base, a die frame, a top die seat, a bottom die seat, a plate and a pressure monitor, wherein the upper surface of the base is connected to the die frame through a guide column, the bottom of the die frame is connected to the top die seat through a hydraulic cylinder, a stamping die set is installed at the bottom of the top die seat, a bottom die seat is symmetrically arranged on the upper surface of the base corresponding to the stamping die set, a plate is placed on the upper surface of the bottom die seat, a chip discharge chute is arranged at the bottom of the base, and a pressure monitor is arranged on one side of the stamping die set;

[0007] The stamping die set includes an upper connecting plate, the upper connecting plate is connected to the bottom of the top die base, a punch assembly is arranged at the bottom of the upper connecting plate, a buffer assembly is arranged horizontally with respect to the punch assembly at the bottom of the upper connecting plate, a positioning pressing plate is connected to the bottom of the buffer assembly, and an air guide hole is opened inside the upper connecting plate;

[0008] The punch assembly comprises a punching knife block, the top of which is connected to the upper connecting plate, an air jet through hole is vertically opened inside the punching knife block, and a strip-shaped notch is horizontally opened on the bottom surface of the punching knife block;

[0009] The buffer assembly includes a guide column, the top of which is connected to the upper connecting plate, the bottom of which is movably connected to a guide sleeve, the other end of which is connected to a spring, and a punched through hole is vertically opened inside the guide column;

[0010] The air injection through hole and the stamping through hole are communicated with each other through an air guide through hole.

[0011] A hydraulic module is arranged between the die frame and the top die base, and the hydraulic module is used to drive the stamping die to perform up and down reciprocating motion, and the hydraulic module is electrically connected to the pressure monitor.

[0012] The cross-sectional area of ​​the notch is smaller than the cross-sectional area of ​​the air injection through hole.

[0013] There are four guide columns, which are arranged symmetrically in a rectangular shape with respect to the bottom of the upper connecting plate. The bottom end of the guide column is clamped with the inner wall of the guide sleeve through an annular piston. The top end of the spring is in contact with the upper connecting plate, and the bottom end of the spring is in contact with the guide sleeve. The interior of the guide sleeve is connected to the stamped through hole. The hydraulic module on the die frame performs stamping processing, and the hydraulic module drives the stamping module at the bottom of the die frame to move up and down and reciprocate. When the stamping module stamps downward, the positioning plate contacts the upper surface of the bottom plate, and the positioning plate presses the upper connecting plate upward, so that the guide column slides along the inner wall of the guide sleeve, and the air on the inner wall of the guide sleeve is squeezed through the annular piston at the bottom of the guide column, and the stamping module is continuously pressed downward so that the bottom of the stamping knife block fits with the upper surface of the plate, blocking the compressed air from being directly ejected from the jet through hole in the stamping knife block, and the strip groove and the surface of the plate form a new exhaust port, and the aperture of the new exhaust port is smaller than the inner diameter of the jet through hole, so that the stamping process of the stamping knife block is slowed down, the internal air is pressed out at a uniform speed, and the plate is stamped at a uniform speed, thereby improving the processing quality of metal plates and reducing the influence of uneven force on the plates.

[0014] The pressure monitor is connected to one side of the upper connecting plate, and the bottom of the pressure monitor passes through the upper connecting plate and is connected to the air guide hole. While the stamping module is stamping the plate, the positioning plate quickly squeezes the bottom plate to position it, and then the stamping knife block descends along with the upper connecting plate, and the stamping knife block passes through the positioning plate and fits with the upper surface of the plate. The air inside the buffer assembly is squeezed outward and sprayed out, and the air flows through the guide sleeve to the air guide hole, and after being transmitted to the air jet hole through the air guide hole, it is sprayed out along the strip slot, and the airflow flows closely to the surface of the plate, and the airflow cleans the surface of the plate, improving the processing quality and neatness.

[0015] The bottom die base includes a die, which is fixedly connected to the upper surface of the base, a clamping rod is connected to the upper surface of the die, a clamping rod is installed on the upper surface of the die, a discharge port is vertically opened at the center of the surface of the die, the discharge port passes through the base, and the discharge port is located vertically above the chip removal chute.

[0016] One end of the clamping rod is movably connected to one side of the plate, and the central axis of the bottom end of the clamping rod is connected to a driving motor, and the driving motor is used to cooperate with the clamping rod to move the position of the plate.

[0017] The punching knife block is pressed down to the inner wall of the discharge port by a hydraulic module, and the cross-sectional size of the punching knife block is consistent with the size of the discharge port.

[0018] The chip removal chute is tilted relative to the bottom of the base, and protective baffles are provided on both sides of the chip removal chute. After the punching knife block punches the plate, the bottom of the punching knife block drives the cut chips to move downward. At this time, the punching knife block extends into the discharge port of the die, blocking the direction of the gas ejection from the bottom of the punching knife block, so that the gas pushes the bottom chips downward to fall and separate. At the same time, the ejected gas accelerates the air flow around the punching knife block and the chips, accelerates the cooling of the cutting edge of the chips, and cools the punching knife block synchronously, avoiding the safety hazard caused by heat accumulation in the metal material. The chips quickly fall into the chip removal chute from the inner wall of the discharge port, and are guided to slide down through the tilted chip removal chute, and the chips are centrally recovered and processed.

[0019] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: the present invention facilitates the rapid discharge of chips by setting a stamping die set and a bottom die seat, the guide sleeve in the stamping die set squeezes along the guide column to buffer and reduce speed, and at the same time the guide column squeezes the air inside the guide sleeve downward, the internal air flows through the strip groove at the bottom of the stamping knife block and is ejected, the air flow flows close to the surface of the plate, cleans the surface of the plate, and improves the processing quality, after the punch cuts off the chips, the stamping knife block extends into the die and air is continuously ejected, pushing the chips to quickly fall into the chip removal chute to avoid blockage and accumulation of chips, and at the same time the air flow quickly cools down the stamping knife block to avoid heat accumulation and extend the service life of the stamping knife block. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0021] Figure 1 It is a schematic diagram of the structure of the present invention;

[0022] Figure 2 It is a schematic diagram of the connection structure between the top die base and the stamping die set of the present invention;

[0023] Figure 3 It is a schematic diagram of the connection structure of the punching die set and the bottom die set of the present invention;

[0024] Figure 4 It is a schematic diagram of the connection structure of the punching die set and the pressure monitor of the present invention;

[0025] Figure 5 It is a schematic diagram of the structure of the punching knife block of the present invention;

[0026] Figure 6 It is a schematic diagram of the structure of the buffer component of the present invention.

[0027] In the figure:

[0028] 1. Base;

[0029] 2. Mould frame;

[0030] 3. Top mold base;

[0031] 4. Stamping die set; 401. Upper connecting plate; 402. Punch assembly; 4021. Stamping knife block; 4022. Air jet through hole; 4023. Strip notch; 403. Buffer assembly; 4031. Guide column; 4032. Guide sleeve; 4033. Spring; 4034. Stamping through hole; 404. Positioning pressure plate; 405. Air guide through hole;

[0032] 5. Bottom die base; 501. Concave die; 502. Clamping rod; 503. Discharge port;

[0033] 6. Panels;

[0034] 7. Chip removal chute;

[0035] 8. Pressure monitor. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] See also Figure 1-Figure 6 , the present invention provides a technical solution:

[0038] A new energy vehicle body stamping device with a chip cleaning and discharge structure comprises a base 1, a die frame 2, a top die seat 3, a bottom die seat 5, a plate 6 and a pressure monitor 8, wherein the upper surface of the base 1 is connected to the die frame 2 via a guide column, the bottom of the die frame 2 is connected to the top die seat 3 via a hydraulic cylinder, a stamping die set 4 is installed at the bottom of the top die seat 3, a bottom die seat 5 is symmetrically arranged on the upper surface of the base 1 corresponding to the stamping die set 4, a plate 6 is placed on the upper surface of the bottom die seat 5, a chip discharge chute 7 is arranged at the bottom of the base 1, and a pressure monitor 8 is arranged on one side of the stamping die set 4;

[0039] The stamping die set 4 includes an upper connecting plate 401, which is connected to the bottom of the top die base 3, a punch assembly 402 is arranged at the bottom of the upper connecting plate 401, a buffer assembly 403 is arranged horizontally with respect to the punch assembly 402 at the bottom of the upper connecting plate 401, a positioning pressing plate 404 is connected to the bottom of the buffer assembly 403, and an air guide hole 405 is opened inside the upper connecting plate 401;

[0040] The punch assembly 402 includes a punching blade block 4021, the top of which is connected to the upper connecting plate 401, an air jet through hole 4022 is vertically opened inside the punching blade block 4021, and a strip-shaped notch 4023 is horizontally opened on the bottom surface of the punching blade block 4021;

[0041] The buffer assembly 403 includes a guide column 4031, the top of the guide column 4031 is connected to the upper connecting plate 401, the bottom of the guide column 4031 is movably connected with a guide sleeve 4032, the other end of the guide column 4031 is connected with a spring 4033, and a punching through hole 4034 is vertically opened inside the guide column 4031;

[0042] The air injection through hole 4022 and the punching through hole 4034 are connected through the air guide through hole 405 .

[0043] A hydraulic module is arranged between the die frame 2 and the top die base 3. The hydraulic module is used to drive the stamping die 4 to reciprocate up and down. The hydraulic module is electrically connected to a pressure monitor. The pressure monitor controls the up and down movement of the hydraulic module.

[0044] The cross-sectional area of ​​the notch 4023 is smaller than the cross-sectional area of ​​the air injection through hole 4022 .

[0045] There are four guide posts 4031, which are arranged symmetrically in a rectangular shape with respect to the bottom of the upper connecting plate 401. The bottom end of the guide post 4031 is clamped with the inner wall of the guide sleeve 4032 through an annular piston. The top end of the spring 4033 contacts the upper connecting plate 401, and the bottom end of the spring 4033 contacts the guide sleeve 4032. The interior of the guide sleeve 4032 is connected with the stamping through hole 4034. The hydraulic module on the mold frame 2 is started to perform stamping processing. The hydraulic module drives the stamping die 4 at the bottom of the mold frame 2 to move up and down reciprocatingly. When the stamping die 4 is stamped downward, the positioning plate 404 contacts the upper surface of the bottom plate 6, and the positioning plate 404 presses the upper connecting plate 401 upward, so that the guide post 4031 slides along the inner wall of the guide sleeve 4032. The annular piston at the bottom of the guide post 4031 squeezes the air on the inner wall of the guide sleeve 4032, and the stamping die 4 is continuously pressed downward so that The bottom of the stamping knife block 4021 fits with the upper surface of the plate 6, blocking the pressurized air from being directly ejected from the jet hole 4022 in the stamping knife block 4021. The strip groove 4023 and the surface of the plate 6 form a new exhaust port. The aperture of the new exhaust port is smaller than the inner diameter of the jet hole 4022. The stamping process of the stamping knife block 4021 is slowed down, and the internal air is pressed out at a uniform speed, and the plate 6 is stamped at a uniform speed, thereby improving the processing quality of the metal plate 6 and reducing the impact of uneven force on the plate 6.

[0046] The pressure monitor 8 is connected to one side of the upper connecting plate 401 , and the bottom of the pressure monitor 8 passes through the upper connecting plate 401 and is connected to the air guide hole 405 .

[0047] In one embodiment, while the stamping die set 4 is stamping the plate 6, the positioning plate 404 quickly squeezes the bottom plate 6 to position it, and then the stamping knife block 4021 descends along with the upper connecting plate, and the stamping knife block 4021 penetrates the positioning plate 404 and fits with the upper surface of the plate 6, and the air inside the buffer component 403 is squeezed and sprayed out, and the air flows into the air guide hole 405 through the guide sleeve 4032, and is transmitted to the air injection hole 4022 through the air guide hole 405, and then sprayed out along the strip notch 4023, and the airflow flows closely to the surface of the plate 6, and the airflow cleans the surface of the plate 6, thereby improving the processing quality and neatness;

[0048] Cooperate with the pressure monitor 8 to monitor the internal air pressure in real time. When the buffer assembly 403 is pressurized and exhausted, the internal air pressure is higher than the normal value, indicating that the gas outlet diameter becomes smaller and there is foreign matter blocking it. Control the hydraulic module to lift the stamping module 4 and use the airflow to flush and clean the surface of the plate 6;

[0049] Assuming that the air in the buffer assembly 403 is uniformly pressed down by the hydraulic module, the pressure change rate of the air directly ejected from the inner wall of the air jet hole 4022 is n, and the pressure change rate of the air ejected from the gap formed between the flat and clean surface of the plate 6 and the strip groove 4023 is m. Since the aperture of the gap is smaller than the aperture of the air jet hole 4022, m is smaller than n, and the real-time measured rate is a;

[0050] When a is less than m, it indicates that there is a blockage at the air outlet or the surface of the plate 6 is convex. The hydraulic module is controlled to lift the stamping module 4 and press down again for measurement. The surface of the plate 6 is cleaned by air flow. If the value returns to normal, it indicates that the cleaning is completed and the stamping process continues. If the value is still less than m, the control lever 502 is rotated to transfer the plate 6 for repair and adjustment, thereby reducing the waste of the plate 6 and facilitating recycling by the staff.

[0051] When a is equal to n, it indicates that there is a misalignment between the punching blade block 4021 and the plate 6, and the relative position of the plate 6 and the punching blade block 4021 needs to be readjusted;

[0052] When a is greater than m and a is less than n, it indicates that there is a depression on the surface of the plate 6, so that the surface of the plate 6 cannot be horizontally fitted with the bottom of the punching knife block 4021, and the plate 6 needs to be removed, repaired and recycled;

[0053] While controlling the hydraulic module to lift the punching module 4, observe the air pressure value of the internal air intake of the buffer component 403 in the pressure monitor 8. When the internal air pressure change rate changes, it indicates that there is internal damage and needs to be repaired.

[0054] The bottom die base 5 includes a die 501, which is fixedly connected to the upper surface of the base 1. The upper surface of the die 501 is connected with a clamping rod 502. The upper surface of the die 501 is installed with a clamping rod 502. A discharge port 503 is vertically opened at the center of the surface of the die 501. The discharge port 503 passes through the base 1 and is located vertically above the chip discharge chute 7.

[0055] One end of the clamping rod 502 is movably connected to one side of the plate 6 , and a driving motor is connected to the central axis of the bottom end of the clamping rod 502 . The driving motor is used to cooperate with the clamping rod 502 to move the position of the plate 6 .

[0056] The punching blade block 4021 is pressed down to the inner wall of the discharge port 503 by the hydraulic module, and the size of the cross section of the punching blade block 4021 is consistent with the size of the discharge port 503 .

[0057] In one embodiment, the chip removal chute 7 is tilted relative to the bottom of the base 1, and protective baffles are provided on both sides of the chip removal chute 7. The horizontal spacing between the protective baffles matches the width of the top discharge port 503. A magnet is provided on the left side of the inner wall of the discharge port 503. After the stamping process of the plate 6 is completed, the waste plate is pressed downward to the inner wall of the discharge port 503 by the stamping knife block 4021, and then the stamping knife block 4021 is lifted, one side of the waste plate is adsorbed by the magnet on the inner wall of the discharge port 503, and the other side of the waste plate falls and conflicts with the surface of the chip removal chute 7 at the bottom, so that the waste plate The bottom of the base 1 is in an inclined state, and then the top of the base 1 is used to punch the plate 6. The punching knife block 4021 repeatedly punches, and the newly punched and falling waste plate cooperates with the airflow blown out through the jet through hole 4022 at the bottom of the punching knife block 4021 to squeeze the first punched waste plate at the bottom and drop it onto the chip removal chute 7. The newly punched and falling waste is repeatedly adsorbed by the magnet, so that the waste plate falls in an orderly manner during the stamping process, reducing the blockage of the waste. At the same time, the airflow blows the dust on the surface of the waste to reduce the adhesion of the dust to the waste plate, which is convenient for the staff to recycle the waste.

[0058] In one embodiment, after the stamping knife block 4021 performs stamping processing on the plate 6, the bottom of the stamping knife block 4021 drives the cut chips to move downward. At this time, the stamping knife block 4021 extends into the discharge port 503 of the die 501, blocking the direction of the gas ejection from the bottom of the stamping knife block 4021, so that the gas pushes the bottom chips downward to fall and separate. At the same time, the ejected gas accelerates the stamping knife block 4021 and the air flow around the chips, accelerates the cooling of the cutting edge of the chips, and synchronously cools the stamping knife block 4021 to avoid safety hazards caused by heat accumulation in the metal material. The chips quickly fall into the chip discharge chute 7 from the inner wall of the discharge port 503, and are guided to slide down through the inclined chip discharge chute 7, so that the chips are centrally recovered and processed.

[0059] Working principle of the present invention:

[0060] First, the plate 6 is placed on the upper surface of the die 501, and the two sides of the plate 6 are clamped and fixed by the clamping rod 502, and the driving motor at the bottom of the clamping rod 502 is started to adjust the horizontal position of the plate 6 on the surface of the die 501;

[0061] After the position of the plate 6 is determined, the hydraulic module on the die frame 2 is started to perform stamping processing. The hydraulic module drives the stamping die 4 at the bottom of the die frame 2 to move up and down. When the stamping die 4 is stamping downward, the positioning plate 404 contacts the upper surface of the plate 6 at the bottom, and the positioning plate 404 presses the upper connecting plate 401 upward, so that the guide column 4031 slides along the inner wall of the guide sleeve 4032. The guide sleeve 4032 is pressed by the annular piston at the bottom of the guide column 4031. The air on the inner wall of 32 is squeezed, and the stamping die set 4 is continuously pressed downward so that the bottom of the stamping knife block 4021 is fitted with the upper surface of the plate 6, and the compressed air is blocked from being directly ejected from the air jet through hole 4022 in the stamping knife block 4021. The strip-shaped notch 4023 and the surface of the plate 6 form a new exhaust port, and the aperture of the new exhaust port is smaller than the inner diameter of the air jet through hole 4022, so that the stamping process of the stamping knife block 4021 is decelerated, and the internal air is pressed out at a uniform speed, and the plate 6 is stamped at a uniform speed;

[0062] While the stamping die 4 is stamping the plate 6, the positioning plate 404 quickly squeezes the plate 6 at the bottom to position it, and then the stamping knife block 4021 descends along with the upper connecting plate, and the stamping knife block 4021 penetrates the positioning plate 404 and fits with the upper surface of the plate 6. The air inside the buffer component 403 is squeezed and sprayed out, and the air flows into the air guide hole 405 through the guide sleeve 4032. After being transmitted to the air injection hole 4022 through the air guide hole 405, it is sprayed out along the strip notch 4023. The airflow flows closely to the surface of the plate 6, and the airflow cleans the surface of the plate 6.

[0063] After the stamping process, the bottom of the stamping knife block 4021 drives the cut chips to move downward. At this time, the stamping knife block 4021 extends into the discharge port 503 of the die 501, blocking the direction of the gas ejection from the bottom of the stamping knife block 4021, so that the gas pushes the chips at the bottom downward to fall and separate. At the same time, the ejected gas accelerates the stamping knife block 4021 and the air flow around the chips, accelerates the cooling of the cutting edge of the chips, and cools the stamping knife block 4021 synchronously to avoid safety hazards caused by heat accumulation in the metal material. The chips quickly fall into the chip discharge chute 7 from the inner wall of the discharge port 503, and are guided to slide down through the inclined chip discharge chute 7. The chips are centrally recovered and processed, and the plate 6 completed by the stamping process is transmitted out of the surface of the die 501 by rotating the clamping rod 502.

[0064] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0065] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A new energy vehicle body stamping device with a chip cleaning and discharge structure, comprising a base (1), a die frame (2), a top die base (3), a bottom die base (5), a plate (6) and a pressure monitor (8), characterized in that: The upper surface of the base (1) is connected to a die frame (2) via a guide column, the bottom of the die frame (2) is connected to a top die seat (3) via a hydraulic cylinder, a punching die set (4) is installed at the bottom of the top die seat (3), a bottom die seat (5) is symmetrically arranged on the upper surface of the base (1) corresponding to the punching die set (4), a plate (6) is placed on the upper surface of the bottom die seat (5), a chip removal chute (7) is arranged at the bottom of the base (1), and a pressure monitor (8) is arranged on one side of the punching die set (4); The punching die set (4) comprises an upper connecting plate (401), the upper connecting plate (401) is connected to the bottom of the top die base (3), a punch assembly (402) is arranged at the bottom of the upper connecting plate (401), a buffer assembly (403) is arranged at the bottom of the upper connecting plate (401) horizontally with respect to the punch assembly (402), a positioning pressing plate (404) is connected to the bottom of the buffer assembly (403), and an air guide hole (405) is opened inside the upper connecting plate (401); The punch assembly (402) comprises a punching knife block (4021), the top of the punching knife block (4021) is connected to the upper connecting plate (401), an air injection through hole (4022) is vertically opened inside the punching knife block (4021), and a strip-shaped notch (4023) is horizontally opened on the bottom surface of the punching knife block (4021); The buffer assembly (403) comprises a guide column (4031), the top of the guide column (4031) is connected to the upper connecting plate (401), the bottom of the guide column (4031) is movably connected with a guide sleeve (4032), the other end of the guide column (4031) is connected with a spring (4033), and a stamped through hole (4034) is vertically opened inside the guide column (4031); The air injection through hole (4022) and the stamping through hole (4034) are connected via the air guide through hole (405).

2. A new energy vehicle body stamping device with a chip cleaning and discharge structure according to claim 1, characterized in that: A hydraulic module is arranged between the die frame (2) and the top die base (3), and the hydraulic module is used to drive the stamping die (4) to perform up and down reciprocating motion. The hydraulic module is electrically connected to a pressure monitor.

3. A new energy vehicle body stamping device with a chip cleaning and discharge structure according to claim 1, characterized in that: Four guide posts (4031) are provided, and the four guide posts (4031) are arranged symmetrically in a rectangular shape with respect to the bottom of the upper connecting plate (401). The bottom end of the guide post (4031) is clamped with the inner wall of the guide sleeve (4032) through an annular piston. The top end of the spring (4033) is in contact with the upper connecting plate (401), and the bottom end of the spring (4033) is in contact with the guide sleeve (4032). The interior of the guide sleeve (4032) is connected with the stamped through hole (4034).

4. A new energy vehicle body stamping device with a chip cleaning and discharge structure according to claim 1, characterized in that: The pressure monitor (8) is connected to one side of the upper connecting plate (401), and the bottom of the pressure monitor (8) passes through the upper connecting plate (401) and is connected to the air guide hole (405).

5. The new energy vehicle body stamping device with a chip cleaning and discharging structure according to claim 1, characterized in that: The bottom die base (5) comprises a die (501), the die (501) is fixedly connected to the upper surface of the base (1), the upper surface of the die (501) is connected to a clamping rod (502), the upper surface of the die (501) is installed with a clamping rod (502), a discharge port (503) is vertically opened at the center of the surface of the die (501), the discharge port (503) passes through the base (1), and the discharge port (503) is located vertically above the chip discharge chute (7).

6. A new energy vehicle body stamping device with a chip cleaning and discharge structure according to claim 5, characterized in that: One end of the clamping rod (502) is movably connected to one side of the plate (6), and the central axis of the bottom end of the clamping rod (502) is connected to a driving motor, and the driving motor is used to cooperate with the clamping rod (502) to move the position of the plate (6).

7. The new energy vehicle body stamping device with a chip cleaning and discharging structure according to claim 5, characterized in that: The punching knife block (4021) is pressed down to the inner wall of the discharge port (503) by a hydraulic module, and the size of the cross section of the punching knife block (4021) is consistent with the size of the discharge port (503).

8. The new energy vehicle body stamping device with a chip cleaning and discharging structure according to claim 1, characterized in that: The chip removal chute (7) is arranged obliquely with respect to the bottom of the base (1), and protective baffles are arranged on both sides of the chip removal chute (7).

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