High-precision punching and shaping die for chip production

Abstract

The invention discloses a high-precision punching and shaping die for chip production, and belongs to the technical field of punching and shaping dies for chip production. The high-precision punching and shaping die comprises a lower die base and an upper die base which are connected in a lifting mode, the lower surface of the upper die base is elastically and telescopically connected with a buffering die, and a punching cutter set is fixedly installed on the lower surface of the buffering die; rollers are further rotationally mounted on the lower surface of the buffering die through a frame body, a conveying frame is fixedly mounted on the lower die base, sliding grooves are symmetrically formed in the lower die base, and positioning and collecting assemblies used for collecting waste materials are elastically and slidably mounted on the inner sides of the sliding grooves. A supporting base is further fixedly mounted on the upper surface of the lower die base, and an adsorption assembly is arranged on the inner side of the supporting base. According to the high-precision punching and shaping die for chip production, chips and pins can be synchronously positioned in the punching process, the punching stability is effectively ensured, the machining precision is ensured, and meanwhile waste can be automatically collected after punching is completed.

Description

Technical Field

[0001] The invention relates to the technical field of chip production punching and cutting dies, in particular to a high-precision punching and shaping die for chip production. Background Art

[0002] A chip is a carrier that uses integrated circuit technology to make electronic components. It is usually composed of one or more semiconductor wafers. During the chip production process, the chip pins need to be punched and shaped to improve the stability of subsequent circuit connections.

[0003] The prior art (application number: 202321234987.4, Chinese patent with application date of 2023-05-19) discloses a chip punching device, including a slide rail base, the upper rear end of the slide rail base is bolted with an L-shaped bracket, and the upper front end of the L-shaped bracket is bolted with an electric punching cylinder, characterized in that the lower part of the output rod of the electric punching cylinder is bolted with an adjustable tool holder, and punching tools are respectively arranged on the left and right sides of the lower part of the adjustable tool holder; chip positioning workbenches are respectively placed on the left and right sides of the upper part of the slide rail base, and compound threaded rods are respectively arranged at the front and rear ends of the chip positioning workbench, which is conducive to supporting and cutting chips of different shapes and sizes by setting the mobile base, cylindrical storage holes, threaded connection holes and compound threaded rods. Although it can realize the support of the chip to realize punching, it can only position the chip body during operation, and cannot synchronously position the pins, resulting in limited punching stability, and cannot automatically and quickly collect the waste generated by punching, and there are certain use defects. Summary of the invention

[0004] The purpose of the present invention is to provide a high-precision punching and shaping mold for chip production, so as to solve the problem raised by the above background technology that the high-precision punching and shaping mold for chip production on the market is not convenient for synchronously limiting the chip and the pins, and it is not convenient to automatically collect and clean the waste after the punching is completed.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-precision punching and shaping mold for chip production, comprising a lower mold base and an upper mold base connected in a lifting manner, and the lower surface of the upper mold base is elastically and telescopically connected with a buffer mold, and a punching knife group is fixedly installed on the lower surface of the buffer mold, and a roller is also rotatably installed on the lower surface of the buffer mold, a conveying frame is fixedly installed on the lower mold base, and a punching seat is fixedly installed on the upper surface of the conveying frame, and a conveyor belt is installed on the conveying frame through a conveying roller, and chips are conveyed on the conveyor belt at the same time, and the lower mold base is symmetrically provided with slide grooves, and a positioning and collecting component for collecting waste is elastically and slidably installed on the inner side of the slide groove, and the position of the chip pins is corrected and fixed during the sliding process of the positioning and collecting component;

[0006] A support seat is also fixedly mounted on the upper surface of the lower die seat, and an adsorption component is arranged on the inner side of the support seat, and the adsorption component realizes adsorption and positioning of the chip during the sliding process of the positioning and collecting component.

[0007] Preferably, a guide column is fixedly installed above the buffer die, and the guide column is telescopically connected to the upper die base, and a buffer spring is fixedly connected between the upper die base and the buffer die.

[0008] Preferably, the positioning and collecting assembly includes a sliding seat slidably installed on the inner side of the slide groove, and a first spring is fixedly connected between the slide seat and the inner wall of the slide groove, and a gas cylinder is fixedly installed on the outer side of the slide seat through a frame, and one end of the gas cylinder is telescopically connected to a telescopic rod, and an end of the telescopic rod located on the inner side of the gas cylinder is fixedly connected to a first sealing plug, and a second spring is connected between the first sealing plug and the inner wall of the gas cylinder, and the end of the telescopic rod located on the outer side of the gas cylinder is fixedly connected to a fixed cylinder, and an inclined pressure plate is elastically connected to the fixed cylinder through a third spring, and the roller contacts and pushes the pressure plate during the downward movement, the elastic force of the third spring is greater than the elastic force of the first spring, and the elastic force of the third spring is less than the elastic force of the second spring, and the roller pushes the pressure plate during the downward movement to drive the slide to slide along the slide.

[0009] Preferably, the slide seat is a hollow structure, and positioning holes are evenly arranged on the upper end of the slide seat, and the positioning holes are connected to the internal space of the slide seat. At the same time, a positioning airbag is embedded in the inner wall of the positioning hole, and the positioning airbag and the pin clearance of the chip are matched.

[0010] Preferably, an air storage bag is connected between the column at the bottom of the pressure plate and the fixed tube, and the air storage bag is connected to the positioning air bag through a pipeline, and when the pressure plate is adjusted downward, part of the gas in the air storage bag is transported to the positioning air bag, and the positioning air bag is inflated to seal and clamp the chip pins.

[0011] Preferably, the air cylinder is respectively connected to an exhaust pipe and an intake pipe, and both the exhaust pipe and the intake pipe are provided with a one-way valve structure, and the other end of the intake pipe is connected to the inner side of the slide seat, and at the same time, when the first sealing plug slides toward the slide seat, the intake pipe draws air from the inside of the slide seat, and a material collection drawer is installed on the inner side of the slide seat, and the material collection drawer is located above the end of the intake pipe.

[0012] Preferably, the adsorption assembly includes an adjusting rod telescopically installed on the outside of the support seat, and a second magnet is fixedly installed on one end of the adjusting rod located on the outside of the support seat, and a first magnetic block is fixedly connected to the pressure plate through a bracket. At the same time, the pressure plate drives the first magnetic block to move downward and close to the second magnet during the downward adjustment process, and the relative poles of the first magnetic block and the second magnet are opposite. At the same time, the second magnet will drive the adjusting rod to perform telescopic adjustment under the action of magnetic attraction.

[0013] Preferably, one end of the adjusting rod located on the inner side of the support seat is fixedly connected to a pull rope, a suction cup is embedded and installed on the inner side of the support seat, and a second sealing plug is sealed on the inner side of the suction cup. At the same time, the second sealing plug and the other end of the pull rope are fixedly connected, and a return spring is fixedly connected between the second sealing plug and the inner wall of the lower end of the suction cup. At the same time, when the adjusting rod is telescopically adjusted, the second sealing plug is pulled up and down by the pull rope.

[0014] Preferably, the upper end of the suction cup is made of silicone material, and the upper end of the suction cup is flush with the upper end surface of the support seat, and the suction cup and the chip are sealed and fitted.

[0015] Compared with the prior art, the invention has the following beneficial effects: the high-precision punching and shaping die for chip production can synchronously position the chip and the pin during the punching process, effectively ensuring the punching stability and processing accuracy, and can automatically collect the waste after the punching is completed. The specific contents are as follows;

[0016] 1. It is equipped with rollers, slides and positioning sockets. As the upper die seat and the buffer die move downward, the rollers will contact the push plate, thereby driving the slide to slide along the slide groove, so that the positioning sockets on the slide can be sleeved on the outside of the pins to achieve the initial positioning of the pins. As the positioning airbag expands, it can be clamped and fixed with the pins. At the same time, the position of the chip can be corrected through the pins, which improves the subsequent punching accuracy;

[0017] 2. A slide seat, an air cylinder and an air suction pipe are provided. When the pressing plate cannot be moved downward, the first sealing plug can be driven by the telescopic rod to slide and adjust on the inner side of the air cylinder, so that the air cylinder can extract the air inside the slide seat through the air suction pipe. At this time, the inner side of the slide seat maintains a negative pressure state, thereby further improving the positioning stability of the chip. When the pins are cut off, the disconnected waste will be sucked into the inner side of the slide seat under the action of negative pressure, and then collected by the collecting drawer, thereby realizing automatic collection of waste;

[0018] 3. A support seat and a suction cup are provided. As the pressure plate is adjusted downward, the first magnetic block connected to the outside thereof will be close to the second magnet, so that the second magnet drives the adjustment rod to extend and retract under the action of magnetic force, so that the adjustment rod can pull the second sealing plug on the inside of the suction cup to be raised and lowered by a pull rope. At this time, the suction cup can automatically adsorb the chip, further improving the subsequent punching accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0020] Figure 2 It is a bottom view structural schematic diagram of the present invention;

[0021] Figure 3 It is a schematic diagram of the cross-sectional structure of the present invention;

[0022] Figure 4 It is a schematic diagram of the conveyor belt installation structure of the present invention;

[0023] Figure 5 For the present invention Figure 4 The enlarged structural diagram at A in the middle;

[0024] Figure 6 This is a schematic diagram of the slide installation structure of the present invention;

[0025] Figure 7 This is a schematic diagram of the gas delivery cylinder installation structure of the present invention;

[0026] Figure 8 This is a schematic diagram of the cross-sectional structure of the support seat of the present invention;

[0027] Fig. 9 It is a schematic diagram of the cross-sectional structure of the slide seat of the present invention.

[0028] In the figure: 1. lower die base; 2. upper die base; 3. buffer die; 4. guide column; 5. buffer spring; 6. punching knife group; 7. roller; 8. conveyor frame; 801, punching seat; 9. conveyor belt; 10. slide groove; 11. slide seat; 12. first spring; 13. air cylinder; 1301, exhaust pipe; 1302, suction pipe; 14. telescopic rod; 15. first sealing plug; 16. second spring; 17. fixing cylinder; 18. pressure plate; 1801, bracket; 1802, first magnetic block; 19. third spring; 20. air storage bag; 21. positioning socket; 22. positioning air bag; 23. collection drawer; 24. support seat; 25. suction cup; 26. adjustment rod; 27. second magnet; 28. second sealing plug; 29. ​​reset spring; 30. pull rope. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Example 1: Please refer to Figure 1-Figure 8As shown, the existing high-precision punching and shaping mold for chip production only performs a single positioning on the chip body during use, which makes it easy for the position to shift during the pin punching process and affects the processing accuracy. In order to solve this technical problem, this embodiment discloses the following technical content: a high-precision punching and shaping mold for chip production, comprising a lower mold base 1 and an upper mold base 2 connected by lifting, and the lower surface of the upper mold base 2 is elastically telescopically connected to a buffer mold 3, and the lower surface of the buffer mold 3 is fixedly installed with a punching knife group 6, and the lower surface of the buffer mold 3 is also rotatably installed with a roller 7 through a frame, and the lower mold base 1 is fixedly installed with a roller 7. There is a conveying frame 8, and a punching seat 801 is fixedly installed on the upper surface of the conveying frame 8, and a conveyor belt 9 is installed on the conveying frame 8 through a conveying roller, and chips are conveyed on the conveyor belt 9. The lower mold base 1 is symmetrically provided with slide grooves 10, and the inner side of the slide grooves 10 is elastically slidably installed with a positioning and collecting component for collecting waste, and the position of the chip pins is corrected and fixed during the sliding process of the positioning and collecting component; a support seat 24 is also fixedly installed on the upper surface of the lower mold base 1, and an adsorption component is arranged on the inner side of the support seat 24, and the adsorption component realizes the adsorption and positioning of the chip during the sliding process of the positioning and collecting component.

[0031] A guide column 4 is fixedly installed above the buffer mold 3, and the guide column 4 is telescopically connected to the upper mold base 2, and a buffer spring 5 is fixedly connected between the upper mold base 2 and the buffer mold 3; the positioning and collecting assembly includes a slide seat 11 slidably installed on the inner side of the slide groove 10, and a first spring 12 is fixedly connected between the slide seat 11 and the inner wall of the slide groove 10, and a gas cylinder 13 is fixedly installed on the outer side of the slide seat 11 through a frame, and one end of the gas cylinder 13 is telescopically connected to a telescopic rod 14, and one end of the telescopic rod 14 located on the inner side of the gas cylinder 13 is fixedly connected to a first sealing plug 15, At the same time, a second spring 16 is connected between the first sealing plug 15 and the inner wall of the gas cylinder 13, and the end of the telescopic rod 14 located on the outside of the gas cylinder 13 is fixedly connected to the fixing cylinder 17, and the fixing cylinder 17 is elastically connected to an inclined pressure plate 18 through a third spring 19, and the roller 7 contacts and pushes the pressure plate 18 during the downward movement, the elastic force of the third spring 19 is greater than the elastic force of the first spring 12, and the elastic force of the third spring 19 is less than the elastic force of the second spring 16, and the roller 7 pushes the pressure plate 18 during the downward movement and drives the slide 11 to slide along the slide 11.

[0032] The slide 11 is a hollow structure, and positioning holes 21 are evenly arranged on the upper end of the slide 11, and the positioning holes 21 are connected to the internal space of the slide 11. At the same time, a positioning airbag 22 is embedded in the inner wall of the positioning hole 21, and the positioning airbag 22 and the pin clearance of the chip are matched.

[0033] An air storage bag 20 is connected between the column at the lower part of the pressure plate 18 and the fixed tube 17, and the air storage bag 20 is connected to the positioning air bag 22 through a pipeline. When the pressure plate 18 is moved downward for adjustment, part of the gas in the air storage bag 20 is transported to the positioning air bag 22, and at the same time, the positioning air bag 22 is inflated to seal and clamp the chip pins.

[0034] The adsorption component includes an adjustment rod 26 telescopically installed on the outside of the support seat 24, and a second magnet 27 is fixedly installed on one end of the adjustment rod 26 located on the outside of the support seat 24, and a first magnetic block 1802 is fixedly connected to the pressure plate 18 through a bracket 1801. At the same time, the pressure plate 18 drives the first magnetic block 1802 to move downward and close to the second magnet 27 during the downward adjustment process, and the relative poles of the first magnetic block 1802 and the second magnet 27 are opposite. At the same time, the second magnet 27 will drive the adjustment rod 26 to be telescopically adjusted under the action of magnetic attraction.

[0035] One end of the adjusting rod 26 located on the inner side of the support seat 24 is fixedly connected with a pull rope 30, a suction cup 25 is embedded and installed on the inner side of the support seat 24, and the inner side of the suction cup 25 is sealed with a second sealing plug 28, and the second sealing plug 28 and the other end of the pull rope 30 are fixedly connected, and a return spring 29 is fixedly connected between the second sealing plug 28 and the inner wall of the lower end of the suction cup 25, and when the adjusting rod 26 is telescopically adjusted, the second sealing plug 28 is pulled up and down by the pull rope 30; the upper end of the suction cup 25 is made of silicone, and the upper end of the suction cup 25 is flush with the upper end surface of the support seat 24, and the suction cup 25 and the chip are sealed and fitted.

[0036] By adopting the above technical scheme, the chip is intermittently conveyed by the conveyor belt 9, so that the chip can be automatically transported to the top of the support seat 24, and the conveyor frame 8 can perform preliminary positioning of the chip during the chip conveying process. When the chip moves to the top of the support seat 24, the upper mold seat 2 is controlled to drive the buffer mold 3 to move downward, so that the roller 7 under the buffer mold 3 first contacts the pressure plate 18. At this time, due to the elastic force difference between the first spring 12, the second spring 16 and the third spring 19, the pressure plate 18 can be forced to drive the slide seat 11 to slide along the slide groove 10, so that the positioning socket 21 on the slide seat 11 is sleeved on the outside of the chip pins, so as to achieve preliminary positioning of the chip pins. When the slide seat 11 cannot move, the roller 7 continues to move downward. At this time, the roller 7 will push the pressure plate 18 and the fixed cylinder 17 to perform telescopic adjustment, so as to squeeze the air storage bag 20 inside the fixed cylinder 17, so that part of the gas in the air storage bag 20 enters the positioning air bag 22, so that the positioning air bag 22 expands and deforms. The inflated positioning airbag 22 can seal and clamp the pin part inside the positioning socket 21, thereby realizing the correction of the chip position, and then continue to move the roller 7 downward, at this time, the fixing cylinder 17 will drive the first sealing plug 15 to slide elastically on the inside of the gas cylinder 13 through the telescopic rod 14, at this time, the gas cylinder 13 can extract the air in the slide seat 11 through the suction pipe 1302, so that the inside of the slide seat 11 maintains a negative pressure state, thereby further improving the fixing effect of the pins, and at the same time, during the downward movement of the pressing plate 18, the bracket 1801 on its outer side will drive the first magnetic block 1802 to gradually approach the second magnet 27, so that the second magnet 27 drives the adjusting rod 26 to telescopically adjust on the support seat 24 under the action of magnetic force, and at the same time, the adjusting rod 26 will drive the second sealing plug 28 to move downward on the inside of the suction cup 25 through the pull rope 30, at this time, the suction cup 25 can synchronously adsorb and fix the chip above the support seat 24, realize automatic correction and positioning of the pins and chips, and ensure the subsequent punching progress.

[0037] Embodiment 2: The technical content disclosed in this embodiment is a further improvement on the above embodiment 1. The existing high-precision punching and shaping mold for chip production is not convenient for automatically collecting waste after punching. In order to further solve this technical problem, this embodiment discloses the following technical content, such as Figure 7 and Fig. 9 As shown; the air cylinder 13 is respectively connected to an exhaust pipe 1301 and an intake pipe 1302, and both the exhaust pipe 1301 and the intake pipe 1302 are provided with a one-way valve structure, and the other end of the intake pipe 1302 is connected to the inner side of the slide 11, and at the same time, when the first sealing plug 15 slides toward the slide 11, the intake pipe 1302 draws air from the inner side of the slide 11, and a material collection drawer 23 is installed on the inner side of the slide 11, and the material collection drawer 23 is located above the end of the intake pipe 1302.

[0038] By adopting the above technical solution, when the buffer mold 3 is controlled to move downward, the punching knife group 6 can cooperate with the punching seat 801 to automatically cut off the excess part of the pin. As the pin is cut, the waste part cut off at this time will move under the negative pressure inside the slide 11 and enter the inner side of the slide 11. At this time, the collection drawer 23 can automatically collect the sucked waste, thereby realizing automatic collection of waste and preventing waste from falling into the working area of ​​the mold and affecting the subsequent punching accuracy.

[0039] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0040] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-precision punching and shaping die for chip production, comprising a lower die base (1) and an upper die base (2) connected in a lifting manner, wherein a buffer die (3) is elastically and telescopically connected to the lower surface of the upper die base (2), and a punching knife group (6) is fixedly installed on the lower surface of the buffer die (3), characterized in that: The lower surface of the buffer mold (3) is also rotatably mounted with a roller (7) through a frame body, a conveying frame (8) is fixedly mounted on the lower mold base (1), and a punching seat (801) is fixedly mounted on the upper surface of the conveying frame (8), and a conveying belt (9) is mounted on the conveying frame (8) through a conveying roller, and chips are conveyed on the conveying belt (9), and a slide groove (10) is symmetrically provided on the lower mold base (1), and a positioning and collecting component for collecting waste is elastically slidably mounted on the inner side of the slide groove (10), and the position of the chip pins is corrected and fixed during the sliding process of the positioning and collecting component; A support seat (24) is also fixedly mounted on the upper surface of the lower die seat (1), and an adsorption component is arranged on the inner side of the support seat (24), and the adsorption component realizes adsorption and positioning of the chip during the sliding process of the positioning and collecting component.

2. The high-precision punching and shaping die for chip production according to claim 1, characterized in that: A guide column (4) is fixedly installed above the buffer die (3), and the guide column (4) and the upper die seat (2) are telescopically connected, and a buffer spring (5) is fixedly connected between the upper die seat (2) and the buffer die (3).

3. The high-precision punching and shaping die for chip production according to claim 1, characterized in that: The positioning and collecting assembly comprises a sliding seat (11) slidably mounted on the inner side of the sliding groove (10), and a first spring (12) is fixedly connected between the sliding seat (11) and the inner wall of the sliding groove (10), and a gas cylinder (13) is fixedly mounted on the outer side of the sliding seat (11) through a frame, and one end of the gas cylinder (13) is telescopically connected to a telescopic rod (14), and one end of the telescopic rod (14) located on the inner side of the gas cylinder (13) is fixedly connected to a first sealing plug (15), and a second spring (16) is connected between the first sealing plug (15) and the inner wall of the gas cylinder (13). The telescopic rod (14) is fixedly connected to a fixed cylinder (17) at one end outside the gas delivery cylinder (13), and the fixed cylinder (17) is elastically connected to an inclined pressure plate (18) via a third spring (19), and the roller (7) contacts and pushes the pressure plate (18) during the downward movement, the elastic force of the third spring (19) is greater than the elastic force of the first spring (12), and the elastic force of the third spring (19) is less than the elastic force of the second spring (16), and the roller (7) pushes the pressure plate (18) during the downward movement to drive the slide seat (11) to slide along the slide seat (11).

4. The high-precision punching and shaping die for chip production according to claim 3, characterized in that: The slide seat (11) is a hollow structure, and the upper end of the slide seat (11) is evenly provided with positioning holes (21), and the positioning holes (21) are communicated with the internal space of the slide seat (11), and a positioning airbag (22) is embedded and installed on the inner wall of the positioning hole (21), and the positioning airbag (22) and the pin clearance of the chip are matched.

5. The high-precision punching and shaping die for chip production according to claim 4, characterized in that: An air storage bag (20) is connected between the column at the lower part of the pressing plate (18) and the fixing tube (17), and the air storage bag (20) is connected to the positioning air bag (22) through a pipeline. When the pressing plate (18) is adjusted downward, part of the gas in the air storage bag (20) is transported to the positioning air bag (22), and the positioning air bag (22) is inflated to seal and clamp the chip pins.

6. The high-precision punching and shaping die for chip production according to claim 3, characterized in that: The air delivery cylinder (13) is respectively connected to an exhaust pipe (1301) and an intake pipe (1302), and both the exhaust pipe (1301) and the intake pipe (1302) are provided with a one-way valve structure, and the other end of the intake pipe (1302) is connected to the inner side of the slide seat (11), and when the first sealing plug (15) slides toward the slide seat (11), the intake pipe (1302) extracts air from the inner side of the slide seat (11), and a material collection drawer (23) is installed on the inner side of the slide seat (11), and the material collection drawer (23) is located above the end of the intake pipe (1302).

7. The high-precision punching and shaping die for chip production according to claim 1, characterized in that: The adsorption component includes an adjustment rod (26) telescopically mounted on the outside of the support seat (24), and a second magnet (27) is fixedly mounted on one end of the adjustment rod (26) located on the outside of the support seat (24), and a first magnetic block (1802) is fixedly connected to the pressure plate (18) through a bracket (1801), and the pressure plate (18) drives the first magnetic block (1802) to move downward and close to the second magnet (27) during the downward adjustment process, and the magnetic poles of the opposite surfaces of the first magnetic block (1802) and the second magnet (27) are opposite, and the second magnet (27) drives the adjustment rod (26) to be telescopically adjusted under the action of magnetic attraction.

8. The high-precision punching and shaping die for chip production according to claim 7, characterized in that: One end of the adjusting rod (26) located on the inner side of the supporting seat (24) is fixedly connected with a pull rope (30), a suction cup (25) is embedded and installed on the inner side of the supporting seat (24), and a second sealing plug (28) is sealedly connected to the inner side of the suction cup (25), and the second sealing plug (28) and the other end of the pull rope (30) are fixedly connected, and a return spring (29) is fixedly connected between the second sealing plug (28) and the inner wall of the lower end of the suction cup (25), and when the adjusting rod (26) is telescopically adjusted, the second sealing plug (28) is pulled up and down by the pull rope (30).

9. The high-precision punching and shaping die for chip production according to claim 8, characterized in that: The upper end of the suction cup (25) is made of silicone material, and the upper end of the suction cup (25) is flush with the upper end surface of the support seat (24), and the suction cup (25) and the chip are sealed and fitted.

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