Full-automatic cleaning machine for semiconductor wafer manufacturing SIC parts

Abstract

The invention provides a semiconductor wafer manufacturing SIC part full-automatic cleaning machine which comprises a product feeding and discharging station, an alkaline solvent soaking product station is arranged on one side of the product feeding and discharging station, and a first pure water overflow station is arranged on the side, away from the product feeding and discharging station, of the alkaline solvent soaking product station. An acid solvent product soaking station is arranged on one side, far away from the alkaline solvent product soaking station, of the first pure water overflowing station, and a second pure water overflowing station is arranged on one side, far away from the first pure water overflowing station, of the acid solvent product soaking station; according to the invention, full-automatic cleaning can be carried out on semiconductor wafer manufacturing SIC parts, non-uniform cleaning of pollutants of the product parts is avoided, collision and damage of the product parts are eradicated, the problem of secondary pollution caused by contact of the cleaned product parts is solved, and relatively large labor cost required by manual cleaning is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a fully automatic cleaning machine for SIC parts in semiconductor wafer manufacturing. Background Art

[0002] SIC parts are large in size, heavy in weight, and high in product value. At present, the market adopts the method of manual cleaning to remove contaminants. The method of manual cleaning to remove product contaminants has various disadvantages in the process of cleaning product parts. However, SIC parts are usually large in size, heavy in weight, and high in product value. At present, the industry generally adopts manual cleaning to remove contaminants on these parts, but this method has a series of serious disadvantages, which greatly restricts the improvement of production efficiency and product quality, and increases production costs and quality risks;

[0003] First, manual cleaning cannot ensure uniform removal of contaminants from product parts. Due to the limitations of manual operation, it is impossible to ensure consistent and adequate cleaning results for every part when faced with the complex structure and large surface area of ​​SIC parts. Differences in operator techniques and factors such as fatigue may cause over-cleaning of some areas, resulting in damage to parts, while other areas may have residual contaminants. This will undoubtedly significantly affect the quality and yield of subsequent wafers for semiconductor wafer manufacturing, which has extremely high requirements for cleanliness, and increase the probability of defective products, thereby pushing up production costs.

[0004] Secondly, manual handling faces huge challenges in the flow between workstations in the cleaning process. The large size and weight of SIC parts make manual handling not only extremely labor-intensive, but also very easy to cause parts to fall, collide, and other accidents due to careless operation during the flow process, resulting in damage to the parts. In addition, manual flow efficiency is low and cannot meet the rapid turnover requirements required by large-scale production, which prolongs the entire production cycle, greatly reduces production efficiency, and puts the company at a disadvantage in market competition;

[0005] Furthermore, it is common for product parts to be damaged by collisions during manual cleaning. During the handling and cleaning operations, it is inevitable that SIC parts will collide with surrounding objects. The hard material is very likely to be scratched, cracked, or damaged during collisions, which not only destroys the appearance integrity of the parts, but is also likely to change its internal structure and performance parameters, reduce the reliability and service life of the parts, and thus have a negative impact on the overall performance and stability of semiconductor wafer manufacturing equipment, resulting in frequent equipment failures and a significant increase in equipment maintenance costs and downtime;

[0006] In addition, product parts that have been manually cleaned are very susceptible to secondary contamination due to contact. Due to the lack of automated, standardized protection and isolation measures, cleaned parts are easily exposed to unclean external environments or other parts during storage and transportation, thereby being contaminated with dust, oil, microorganisms and other pollutants, which makes the previous cleaning work useless and has to be re-cleaned or additionally processed, which undoubtedly causes a huge waste of production time, labor costs and materials. If secondary contamination is not detected and handled in a timely manner, it may also bring pollutants into the subsequent semiconductor wafer manufacturing process, causing more serious quality problems, and even causing the entire batch of products to be scrapped, causing immeasurable economic losses to the company;

[0007] Finally, given the large size and heavy weight of SIC parts, manual cleaning requires a lot of manpower costs. In order to complete the cleaning task, multiple operators are often required to work together, with high labor intensity and long working hours. This not only means high labor wage expenditures, but also includes increases in employee training costs, labor protection investment, and management costs. As labor costs continue to rise, the production costs of enterprises have also risen sharply, compressing the profit margins of enterprises, seriously hindering the investment of enterprises in key areas such as technology research and development and equipment upgrades, and is not conducive to the sustainable development of enterprises and the improvement of market competitiveness. Summary of the invention

[0008] The purpose of the present invention is to provide a fully automatic cleaning machine for SIC parts of semiconductor wafer manufacturing in view of the shortcomings of the prior art, which can fully automatically clean SIC parts of semiconductor wafer manufacturing, avoid uneven cleaning of contaminants in product parts, prevent damage to product parts by collision, solve the problem of secondary contamination caused by contact of product parts after cleaning, and save the large manpower cost required for manual cleaning.

[0009] To achieve the above-mentioned object, the present invention provides the following technical solutions: a fully automatic cleaning machine for SIC parts in semiconductor wafer manufacturing;

[0010] It comprises upper and lower product stations, an alkaline solvent soaking product station is arranged on one side of the upper and lower product stations, a first pure water overflow station is arranged on the side of the alkaline solvent soaking product station away from the upper and lower product stations, an acidic solvent soaking product station is arranged on the side of the first pure water overflow station away from the alkaline solvent soaking product station, a second pure water overflow station is arranged on the side of the acidic solvent soaking product station away from the first pure water overflow station, an automatic shower and washing product station is arranged on the side of the second pure water overflow station away from the acidic solvent soaking product station, and an automatic blow-drying product station is arranged on the side of the automatic shower and washing product station away from the second pure water overflow station;

[0011] The surface of the alkaline solvent soaking product station is provided with a filter assembly, and the filter assembly includes a water storage tank arranged on one side of the alkaline solvent soaking product station, a filter mesh belt arranged inside the water storage tank, and a fan for filtering dust in the exhaust gas through the filter mesh belt, an air inlet duct, a drive motor, an upper rotating roller, and a lower rotating roller;

[0012] A cleaning assembly is arranged inside the water tank, and the cleaning assembly includes a cleaning roller with bristles arranged inside the water tank, and a first gear, a second gear and a first rotating shaft for cleaning the surface of the filter belt through the cleaning roller with bristles.

[0013] As a preferred fully automatic cleaning machine for SIC parts in semiconductor wafer manufacturing of the present invention, a first display screen and an industrial control operation panel are installed on the surface of the upper and lower product stations, a detachable maintenance door upper and a detachable maintenance door lower are arranged on one side of the upper and lower product stations, the detachable maintenance door upper is located above the detachable maintenance door lower, a fully automatic transplanting platform lifting assembly is arranged inside the upper and lower product stations, a transfer vehicle limiting and fixing device is installed on the surface of the fully automatic transplanting platform lifting assembly, and a product transfer vehicle is arranged below the fully automatic transplanting platform lifting assembly.

[0014] As a preferred fully automatic cleaning machine for semiconductor wafer manufacturing SIC parts of the present invention, a second display screen is installed on the surface of the alkaline solvent immersion product station, a third exhaust duct is installed on the upper surface of the alkaline solvent immersion product station, a fourth detachable maintenance door is installed on the front surface of the alkaline solvent immersion product station, a solvent pH value detection instrument is arranged on the surface of the alkaline solvent immersion product station, a first emergency stop button is installed on the surface of the alkaline solvent immersion product station, an automatic lifting door with a transparent window is installed on the surface of the alkaline solvent immersion product station, and the transparent window is installed on the surface of the alkaline solvent immersion product station. The automatic window lifting door is located between the second display screen and the fourth detachable maintenance door, the interior of the alkaline solvent immersion product station is provided with a built-in bubbling device at the bottom of the tank, the interior of the alkaline solvent immersion product station is provided with a built-in liquid inlet and discharge pipelines at the bottom of the tank, the interior of the alkaline solvent immersion product station is provided with a liquid level sensor near the side, the interior of the alkaline solvent immersion product station is provided with a fully automatic lifting device, the interior of the alkaline solvent immersion product station is provided with an overflow tank for containing a cleaning solvent, and the surface of the alkaline solvent immersion product station is installed with a third three-color alarm light with a buzzer.

[0015] As a preferred fully automatic cleaning machine for SIC parts for semiconductor wafer manufacturing of the present invention, a first exhaust pipe is arranged on the upper surface of the automatic shower cleaning product station, a third display screen is installed on the front surface of the automatic shower cleaning product station, a first detachable maintenance door is arranged near the lower position on the front surface of the automatic shower cleaning product station, a cleaning spray system is arranged inside the automatic shower cleaning product station, a second emergency stop button and a first barcode scanner are installed on the front surface of the automatic shower cleaning product station, the first detachable maintenance door is located between the second emergency stop button and the first barcode scanner, and a first three-color alarm light with a buzzer is installed on the surface of the automatic shower cleaning product station.

[0016] As a preferred fully automatic cleaning machine for SIC parts for semiconductor wafer manufacturing of the present invention, a second exhaust duct is arranged on the upper surface of the automatic blow-drying product station, a fourth display screen is installed on the front surface of the automatic blow-drying product station, a second detachable maintenance door is arranged near the lower position on the front surface of the automatic blow-drying product station, an air shower and drying system is arranged inside the automatic blow-drying product station, a third emergency stop button and a second barcode scanner are installed on the front surface of the automatic blow-drying product station, the second detachable maintenance door is located between the third emergency stop button and the second barcode scanner, and a second three-color alarm light with a buzzer is installed on the surface of the automatic blow-drying product station.

[0017] As a preferred fully automatic cleaning machine for SIC parts of semiconductor wafer manufacturing of the present invention, the top of the third exhaust air duct is fixedly connected to an air inlet duct, and a rectangular shell is provided at one end of the air inlet duct away from the third exhaust air duct, and a water tank is fixedly connected to the bottom surface of the rectangular shell, and the air inlet duct is inserted into the surface of the rectangular shell and extends to the interior of the rectangular shell, and a fan is installed in an installation groove opened on one side of the rectangular shell away from the air inlet duct, and four support plates are installed on the bottom surface of the water tank.

[0018] As a preferred embodiment of a fully automatic cleaning machine for SIC parts for semiconductor wafer manufacturing of the present invention, the upper surface of the rectangular shell is fixedly connected with a top cover plate, and an upper rotating roller is installed inside the top cover plate, and two ends of the rotating shaft of the upper rotating roller respectively pass through the top cover plate, and the upper rotating roller and the top cover plate are rotatably connected, and a driving motor is installed on the surface of the top cover plate, and the end of the output shaft of the driving motor is fixedly connected to one end of the upper rotating roller, and a lower rotating roller is arranged inside the water storage tank, and the lower rotating roller is located below the upper rotating roller, and the two ends of the rotating shaft of the lower rotating roller are respectively inserted into a rotating hole one opened in the water storage tank, and the lower rotating roller is rotatably connected to the water storage tank, and the lower rotating roller is located below the upper rotating roller, and the surfaces of the upper rotating roller and the lower rotating roller are provided with filter mesh belts, and the filter mesh belts are located in two first rectangular grooves opened on the upper surface of the water storage tank, and the filter mesh belts are located in the groove opened on the upper surface of the rectangular shell.

[0019] As a preferred embodiment of a fully automatic cleaning machine for SIC parts for semiconductor wafer manufacturing of the present invention, a baffle plate and a filter screen plate are fixedly connected to the interior of the water tank, a guide groove is opened inside the baffle plate, a rectangular box is fixedly connected to the side of the baffle plate away from the filter screen plate, a square groove is opened on the side of the rectangular box away from the baffle plate, a submersible pump is installed inside the water tank, a connecting pipe is installed at the liquid outlet end of the submersible pump, the connecting pipe passes through the filter screen plate and the baffle plate, and is inserted into the interior of the rectangular box, the filter screen plate is located between the submersible pump and the baffle plate, a first threaded rubber plug and a second threaded rubber plug are respectively inserted into two threads opened on the bottom surface of the water tank, the first threaded rubber plug and the second threaded rubber plug are respectively threadedly connected to the water tank, the first threaded rubber plug is located on the side of the baffle plate away from the filter screen plate, the second threaded rubber plug is located between the baffle plate and the filter screen plate, and a liquid inlet hole is opened on the upper surface of the water tank.

[0020] As a preferred fully automatic cleaning machine for SIC parts for semiconductor wafer manufacturing of the present invention, a first rotating shaft is arranged inside the water tank, the first rotating shaft is inserted into two rotating holes opened inside the water tank, the first rotating shaft and the water tank are rotatably connected, the surface of the first rotating shaft is fixedly sleeved with a cleaning roller with bristles and a second gear, the surface of the second gear is meshingly connected with the first gear, and the first gear is fixedly sleeved on the surface of the lower rotating roller shaft.

[0021] As a preferred fully automatic cleaning machine for SIC parts for semiconductor wafer manufacturing of the present invention, a scraper is arranged between the filter mesh belt and the blocking plate, a second rotating shaft is inserted into the rotating hole opened inside the scraper, both ends of the second rotating shaft are fixedly connected to the water tank, the scraper and the second rotating shaft are rotatably connected, a side of the blocking plate close to the filter mesh belt is fixedly connected to a hollow shell, a built-in extrusion plate and a spring are arranged inside the hollow shell, the built-in extrusion plate and the hollow shell are slidably connected, both ends of the spring are fixedly connected to the built-in extrusion plate and the blocking plate respectively, and a side of the built-in extrusion plate away from the spring is in contact with the surface of the scraper.

[0022] The beneficial effects of the present invention are:

[0023] (1) The present invention can fully automatically clean SIC components for semiconductor wafer manufacturing, avoid uneven cleaning of contaminants in product components, prevent damage to product components by collision, solve the problem of secondary contamination caused by contact between product components after cleaning, and save the large manpower cost required for manual cleaning.

[0024] (2) The present invention is provided with a filter assembly, which is beneficial for allowing the gas discharged from the cleaning machine to pass through the filter belt, filtering impurities in the gas through the continuously rotating filter belt, and cleaning impurities adhered to the surface of the filter belt through the sedimentation liquid, thereby ensuring the effect of filtering the gas discharged from the cleaning machine through the filter belt.

[0025] (3) The present invention is provided with a cleaning component, wherein the cleaning roller with bristles and the contact position of the filter belt are immersed in the sedimentation liquid. The rotation of the cleaning roller with bristles can clean the surface of the filter belt, thereby ensuring the cleaning effect of the filter belt surface. In addition, under the action of the spring elastic potential energy, one end of the scraper can be pressed against the filter belt, thereby avoiding the problem of the filter belt becoming loose after being used for a period of time. At the same time, the debris on the surface of the filter belt can be scraped off, thereby further ensuring the cleaning effect of filtering debris on the surface of the filter belt.

[0026] (4) In the present invention, high-pressure gas is introduced into the pipeline, and the high-pressure gas is ejected from the aeration hole a after passing through the flow groove, impacting the surface of the filter belt, thereby enhancing the effect of flushing the surface of the filter belt. High-pressure gas is introduced into the ventilation pipe, and the high-pressure gas enters the arc block and is ejected from the aeration hole b and the through hole, which not only aerates and flushes the filter belt, but also cleans the cleaning roller. The linear drive member drives the cleaning roller to make a linear reciprocating motion along its axis, and rubs the filter belt along the axis of the cleaning roller, thereby greatly enhancing the cleaning effect of the filter belt. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 It is a structural schematic diagram of the upper and lower product stations in the present invention;

[0029] Figure 3 This is a schematic diagram of the structure of the alkaline solvent soaking product station in the present invention;

[0030] Figure 4 This is a schematic diagram of the structure of the automatic shower cleaning product station in the present invention;

[0031] Figure 5 It is a schematic structural diagram of a rectangular housing and a water storage tank in the present invention;

[0032] Figure 6 It is a schematic diagram of the structure of the baffle plate and the water storage tank in the present invention;

[0033] Figure 7 For the present invention Figure 6 The enlarged view of point A in the middle;

[0034] Figure 8 It is a schematic diagram of the structure of the filter belt and the lower rotating roller in the present invention;

[0035] Fig. 9 It is a schematic diagram of the structure of the rectangular box and the blocking plate in the present invention;

[0036] Fig.10 It is a schematic diagram of the structure of the first gear and the second gear in the present invention;

[0037] Fig.11 This is a schematic diagram of the linear drive member and the mounting sleeve structure of the present invention;

[0038] Fig.12 It is a schematic diagram of the arc block structure in the present invention;

[0039] Fig.13 This is a schematic diagram of the structure of the arc block and the aeration hole b in the present invention;

[0040] Fig.14 It is a schematic cross-sectional view of the lower rotating roller in the present invention.

[0041] In the figure:

[0042] 1. Upper and lower product stations; 11. First display screen; 12. Industrial control operation panel; 13. Removable maintenance door upper; 14. Removable maintenance door lower; 15. Fully automatic transplanting platform lifting assembly; 16. Product transfer vehicle; 17. Transfer vehicle limit fixing device; 2. Alkaline solvent immersion product station; 21. Second display screen; 22. Third exhaust pipe; 23. Fourth removable maintenance door; 24. Solvent pH value detection instrument; 25. First emergency stop button; 26. Automatic lifting door with transparent window; 27. Built-in bubbling device at the bottom of the tank; 28. Built-in liquid inlet and discharge pipes at the bottom of the tank; 29. Liquid level sensor; 210, fully automatic lifting device; 211, overflow tank for cleaning solvent; 212, third three-color alarm light with buzzer; 3, first pure water overflow station; 4, acid solvent immersion product station; 5, second pure water overflow station; 6, automatic shower cleaning product station; 61, third display screen; 62, first exhaust pipe; 63, first three-color alarm light with buzzer; 64, second emergency stop button; 65, first detachable maintenance door; 66, cleaning spray system; 67, first barcode scanner; 7, automatic drying product station; 71, fourth display screen; 72, second exhaust pipeline; 73, second three-color alarm light with buzzer; 74, third emergency stop button; 75, second detachable maintenance door; 76, air shower and drying system; 77, second barcode scanner; 8, filter assembly; 81, air inlet duct; 82, water storage tank; 83, rectangular shell; 84, top cover; 85, upper rotating roller; 86, lower rotating roller; 860, through hole; 861, placement slot; 87, fan; 88, filter belt; 89, first rectangular groove; 810, support plate; 811, first threaded rubber plug; 812, submersible pump; 813, connecting pipe; 814, filter plate; 815, second Threaded rubber plug; 816, blocking plate; 817, guide groove; 818, rectangular box; 819, square groove; 820, driving motor; 821, liquid inlet; 9, cleaning assembly; 900, linear drive member; 901, mounting sleeve; 902, pipeline; 91, first gear; 92, second gear; 93, first rotating shaft; 931, flow groove; 932, aeration hole a; 903, arc block; 9031, aeration hole b; 904, connecting rod; 94, cleaning roller with bristles; 95, scraper; 96, second rotating shaft; 97, hollow shell; 98, built-in extrusion plate; 99, spring. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0045] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0046] Embodiment 1

[0047] like Figure 1-Figure 10 As shown, this embodiment provides a fully automatic cleaning machine for SIC parts in semiconductor wafer manufacturing;

[0048] It includes upper and lower product stations 1, an alkaline solvent immersion product station 2 is arranged on one side of the upper and lower product stations 1, a first pure water overflow station 3 is arranged on the side of the alkaline solvent immersion product station 2 away from the upper and lower product stations 1, an acidic solvent immersion product station 4 is arranged on the side of the first pure water overflow station 3 away from the alkaline solvent immersion product station 2, a second pure water overflow station 5 is arranged on the side of the acidic solvent immersion product station 4 away from the first pure water overflow station 3, an automatic flushing and cleaning product station 6 is arranged on the side of the second pure water overflow station 5 away from the acidic solvent immersion product station 4, and an automatic blow-drying product station 7 is arranged on the side of the automatic flushing and cleaning product station 6 away from the second pure water overflow station 5.

[0049] A first display screen 11 and an industrial control operation panel 12 are installed on the surface of the upper and lower product stations 1. A detachable maintenance door 13 and a detachable maintenance door 14 are arranged on one side of the upper and lower product stations 1. The detachable maintenance door 13 is located above the detachable maintenance door 14. A fully automatic transplanting platform lifting assembly 15 is arranged inside the upper and lower product stations 1. A transfer vehicle limit fixing device 17 is installed on the surface of the fully automatic transplanting platform lifting assembly 15. A product transfer vehicle 16 is arranged below the fully automatic transplanting platform lifting assembly 15. The first display screen 11 is used to display the current station status. The industrial control operation panel 12 is used to operate the device and define the mechanical parameters and electrical control parameters of the device. The detachable maintenance door 13 and the detachable maintenance door 14 are convenient for device maintenance. The fully automatic transplanting platform lifting assembly 15 is used for product circulation between stations. The product transfer vehicle 16 transfers the product to the loading and unloading station. The transfer vehicle limit fixing device 17 is used to fix the transfer vehicle pushed into the loading and unloading station.

[0050] A second display screen 21 is installed on the surface of the alkaline solvent soaking product station 2, a third exhaust pipe 22 is installed on the upper surface of the alkaline solvent soaking product station 2, a fourth detachable maintenance door 23 is installed on the front surface of the alkaline solvent soaking product station 2, a solvent pH value detection instrument 24 is arranged on the surface of the alkaline solvent soaking product station 2, a first emergency stop button 25 is installed on the surface of the alkaline solvent soaking product station 2, and an automatic lifting door 26 with a transparent window is installed on the surface of the alkaline solvent soaking product station 2. The automatic lifting door 26 with a transparent window is located at Between the second display screen 21 and the fourth detachable maintenance door 23, the alkaline solvent soaking product station 2 is provided with a built-in bubbling device 27 at the bottom of the tank, the alkaline solvent soaking product station 2 is provided with a built-in liquid inlet and discharge pipeline 28 at the bottom of the tank, the alkaline solvent soaking product station 2 is provided with a liquid level sensor 29 near the side of the alkaline solvent soaking product station 2, the alkaline solvent soaking product station 2 is provided with a full-automatic lifting device 210, the alkaline solvent soaking product station 2 is provided with a cleaning solvent containing overflow tank 211, and the alkaline solvent soaking product station 2 is provided with a liquid level sensor 29 near the side of the alkaline solvent soaking product station 2. The surface is equipped with a third three-color alarm lamp 212 with a buzzer. The internal structures of the first pure water overflow station 3, the acid solvent soaking product station 4 and the alkaline solvent soaking product station 2 are the same, wherein the second display screen 21 is used to display the current station status, the third exhaust pipe 22 is used to connect with the filter component 8 and the cleaning component 9 to purify air pollution, the fourth detachable maintenance door 23 is convenient for the maintenance of the device, the solvent pH value detection instrument 24 is used to monitor the pH value of the solvent in the tank, the first emergency stop button 25 is used to emergency stop the abnormal operation of the device, with The transparent window automatic lifting door 26 is used to observe the operation of the device. The built-in bubbling device 27 at the bottom of the tank is used to bubble the solvent in the tank to promote the immersion effect. The built-in liquid inlet and discharge pipelines 28 at the bottom of the tank are used to transport or discharge liquid into the tank, including: pure water, cleaning solvent, etc. The liquid level sensor 29 is used to monitor the solvent capacity in the tank. The fully automatic lifting device 210 is used to sink the product into and lift out of the solvent in the tank. The cleaning solvent overflow tank 211 is used to hold the cleaning solvent. The third three-color alarm light 212 with a buzzer is used to feedback the current working status of the workstation.

[0051] The upper surface of the automatic shower cleaning product station 6 is provided with a first exhaust pipe 62, the front surface of the automatic shower cleaning product station 6 is installed with a third display screen 61, the front surface of the automatic shower cleaning product station 6 is provided with a first detachable maintenance door 65 near the lower position, the interior of the automatic shower cleaning product station 6 is provided with a cleaning spray system 66, the front surface of the automatic shower cleaning product station 6 is installed with a second emergency stop button 64 and a first barcode scanning gun 67, the first detachable maintenance door 65 is located between the second emergency stop button 64 and the first barcode scanning gun 67, and the surface of the automatic shower cleaning product station 6 is installed with a first belt A buzzer three-color alarm light 63, a third display screen 61 is used to display the current workstation status, the first exhaust pipe 62 is used to connect with the filter component 8 and the cleaning component 9 to purify air pollution, the first three-color alarm light with a buzzer 63 is used to feedback the current workstation working status, the second emergency stop button 64 is used to emergency stop the abnormal operation of the device, the first detachable maintenance door 65 is convenient for device maintenance, the cleaning spray system 66 spray system includes an infusion pipeline and evenly distributed nozzles to automatically spray and clean the product, and the first barcode scanner 67 scans the barcode or QR code on the product work order to connect to the MES system.

[0052] The upper surface of the automatic drying product station 7 is provided with a second exhaust pipe 72, the front surface of the automatic drying product station 7 is installed with a fourth display screen 71, the front surface of the automatic drying product station 7 is provided with a second detachable maintenance door 75 near the lower position, the interior of the automatic drying product station 7 is provided with an air shower drying system 76, the front surface of the automatic drying product station 7 is installed with a third emergency stop button 74 and a second barcode scanning gun 77, the second detachable maintenance door 75 is located between the third emergency stop button 74 and the second barcode scanning gun 77, and the surface of the automatic drying product station 7 is installed with a second third emergency stop button 74 with a buzzer The fourth display screen 71 is used to display the current workstation status, the second exhaust pipe 72 is used to connect with the filter component 8 and the cleaning component 9 to purify air pollution, the second three-color alarm light 73 with a buzzer is used to feedback the current workstation working status, the third emergency stop button 74 is used to emergency stop the abnormal operation of the device, the second detachable maintenance door 75 is convenient for device maintenance, the air shower and drying system 76 includes an air supply pipe and evenly distributed nozzles to automatically air shower and dry the product. The second barcode scanner 77 scans the barcode or QR code on the product work order to connect to the MES system.

[0053] A filter assembly 8 is provided on the surface of the alkaline solvent soaking product station 2, and the filter assembly 8 includes an air inlet duct 81, a water tank 82, a rectangular shell 83, a top cover plate 84, an upper rotating roller 85, a lower rotating roller 86, a fan 87, a filter mesh belt 88, a support plate 810, a first threaded rubber plug 811, a submersible pump 812, a connecting pipe 813, a filter mesh plate 814, a second threaded rubber plug 815, a blocking plate 816, a rectangular box 818 and a driving motor 820. The top of the third exhaust air duct 22 is fixedly connected with the air inlet duct 81, and a rectangular shell 83 is provided at one end of the air inlet duct 81 away from the third exhaust air duct 22. The bottom surface of the rectangular shell 83 is fixedly connected with the water tank 82. The air inlet duct 81 is inserted into the surface of the rectangular shell 83 and extends to the interior of the rectangular shell 83. A fan 87 is installed in an installation groove opened on one side of the rectangular shell 83 away from the air inlet duct 81, and four support plates 810 are installed on the bottom surface of the water tank 82.

[0054] A top cover plate 84 is fixedly connected to the upper surface of the rectangular shell 83, and an upper rotating roller 85 is installed inside the top cover plate 84. Both ends of the rotating shaft of the upper rotating roller 85 respectively penetrate the top cover plate 84, and the upper rotating roller 85 and the top cover plate 84 are rotatably connected. A driving motor 820 is installed on the surface of the top cover plate 84, and the end of the output shaft of the driving motor 820 is fixedly connected to one end of the upper rotating roller 85. A lower rotating roller 86 is provided inside the water tank 82, and the lower rotating roller 86 is located below the upper rotating roller 85. Both ends of the rotating shaft of the lower rotating roller 86 are respectively inserted into a rotating hole 1 opened inside the water tank 82, and the lower rotating roller 86 is rotatably connected to the water tank 82, and the lower rotating roller 86 is located below the upper rotating roller 85. A filter belt 88 is provided on the surfaces of the upper rotating roller 85 and the lower rotating roller 86. The filter belt 88 is located in two first rectangular grooves 89 opened on the upper surface of the water tank 82, and the filter belt 88 is located in the groove opened on the upper surface of the rectangular shell 83.

[0055] The water tank 82 is fixedly connected with a baffle plate 816 and a filter screen plate 814, a guide groove 817 is provided inside the baffle plate 816, a rectangular box 818 is fixedly connected to the side of the baffle plate 816 away from the filter screen plate 814, and a square groove 819 is provided on the side of the rectangular box 818 away from the baffle plate 816. A submersible pump 812 is installed inside the water tank 82, and a connecting pipe 813 is installed at the liquid outlet end of the submersible pump 812. The connecting pipe 813 passes through the filter screen plate 814 and the baffle plate 816, and is inserted into the rectangular box 818. Internally, the filter screen plate 814 is located between the submersible pump 812 and the blocking plate 816, and the first threaded rubber plug 811 and the second threaded rubber plug 815 are respectively inserted into the two threads opened on the bottom surface of the water tank 82. The first threaded rubber plug 811 and the second threaded rubber plug 815 are respectively threadedly connected to the water tank 82. The first threaded rubber plug 811 is located on the side of the blocking plate 816 away from the filter screen plate 814, and the second threaded rubber plug 815 is located between the blocking plate 816 and the filter screen plate 814. A liquid inlet hole 821 is opened on the upper surface of the water tank 82.

[0056] A cleaning assembly 9 is provided inside the water tank 82, and the cleaning assembly 9 includes a first gear 91, a second gear 92, a first rotating shaft 93, a cleaning roller 94 with bristles, a scraper 95, a second rotating shaft 96, a hollow shell 97, a built-in extrusion plate 98 and a spring 99. A first rotating shaft 93 is provided inside the water tank 82, and the first rotating shaft 93 is inserted into two rotating holes opened inside the water tank 82. The first rotating shaft 93 is rotatably connected to the water tank 82, and a cleaning roller 94 with bristles and a second gear 92 are fixedly sleeved on the surface of the first rotating shaft 93. The surface of the second gear 92 is meshingly connected with the first gear 91, and the first gear 91 is fixedly sleeved on the surface of the rotating shaft of the lower rotating roller 86.

[0057] A scraper 95 is arranged between the filter mesh belt 88 and the blocking plate 816, and a second rotating shaft 96 is inserted in the rotating hole opened inside the scraper 95. Both ends of the second rotating shaft 96 are fixedly connected to the water tank 82. The scraper 95 and the second rotating shaft 96 are rotatably connected. A hollow shell 97 is fixedly connected to a side of the blocking plate 816 close to the filter mesh belt 88. A built-in extrusion plate 98 and a spring 99 are arranged inside the hollow shell 97. The built-in extrusion plate 98 and the hollow shell 99 are slidably connected. Both ends of the spring 99 are fixedly connected to the built-in extrusion plate 98 and the blocking plate 816 respectively, and the side of the built-in extrusion plate 98 away from the spring 99 is in contact with the surface of the scraper 95.

[0058] Working steps:

[0059] During use, in the preparation stage, the operator pushes the product transport vehicle 16 to the upper and lower product stations 1, and the transport vehicle limit fixing device 17 automatically fixes the transport vehicle to ensure its stable position, and checks whether the solvent in each station is sufficient, whether the pipeline connections are normal, whether the various components of the equipment are in normal working condition, etc. The initial status information of each station can be viewed through the first display screen 11, the second display screen 21, the third display screen 61 and the fourth display screen 71, and the solvent pH value detection instrument 24 checks whether the pH of the solvent in the alkaline solvent soaking product station 2 and the acidic solvent soaking product station 4 meets the requirements, and the liquid level sensor 29 monitors whether the solvent capacity in each tank is sufficient;

[0060] Loading: The product is lifted from the product transport vehicle 16 by the fully automatic transfer platform lifting assembly 15 and transferred to the alkaline solvent soaking product station 2. The fully automatic lifting device 210 of the alkaline solvent soaking product station 2 descends to immerse the product in the alkaline solvent, and the alkaline solvent soaking cleaning step begins;

[0061] Alkaline solvent immersion cleaning: The built-in bubbling device 27 at the bottom of the tank is started to bubble the alkaline solvent so that the solvent fully contacts the product surface, thereby enhancing the cleaning effect and removing some pollutants on the product surface, such as oil stains, organic impurities, etc.;

[0062] During this process, the solvent pH value detection instrument 24 continuously monitors the pH value of the solvent. If it exceeds the preset range, the alarm signal is automatically triggered. The third three-color alarm light 212 with a buzzer flashes and emits a buzzing sound to remind the operator to adjust or replace the solvent;

[0063] The liquid level sensor 29 monitors the solvent level in real time. When the liquid level is too low, it automatically triggers the built-in liquid inlet and outlet pipelines 28 at the bottom of the tank to replenish the alkaline solvent, ensuring that the product is always immersed in the solvent at the appropriate liquid level;

[0064] Post-treatment of alkaline solvent immersion: After the alkaline solvent immersion is completed, the fully automatic lifting device 210 lifts the product and leaves the alkaline solvent;

[0065] The automatic lifting door 26 with a transparent window is opened, and the fully automatic transplanting platform lifting assembly 15 transfers the product to the first pure water overflow station 3;

[0066] First pure water overflow cleaning: The product is in the first pure water overflow station 3, and pure water flows in from the built-in liquid inlet and discharge pipes 28 at the bottom of the tank to form an overflow state, and the alkaline solvent remaining on the surface of the product is rinsed to remove the alkaline solvent residue to prevent it from affecting the subsequent cleaning steps. After a certain period of overflow cleaning, the fully automatic transplanting platform lifting component 15 transfers the product to the acid solvent immersion product station 4;

[0067] Acid solvent immersion cleaning: Similar to alkaline solvent immersion cleaning, the product is immersed in an acid solvent, and the built-in bubbling device 27 at the bottom of the tank of the acid solvent immersion product station 4 is started to enhance the cleaning effect and remove pollutants such as metal ions that may exist on the surface of the product.

[0068] The solvent pH value detection instrument 24 monitors the pH value of the acidic solvent, and the liquid level sensor 29 monitors the liquid level to ensure that the cleaning process is carried out normally. If there is any abnormality, the corresponding alarm signal is triggered. The third three-color alarm light 212 with a buzzer alarms;

[0069] Acid solvent soaking post-treatment: After the acid solvent soaking is completed, the product is lifted by the fully automatic lifting device 210, and the fully automatic transplanting platform lifting assembly 15 transfers the product to the second pure water overflow station 5;

[0070] Second pure water overflow cleaning: In the second pure water overflow station 5, pure water overflow cleaning is used again to remove the acidic solvent remaining on the surface of the product to prevent the acid residue from corroding the product or affecting subsequent processing;

[0071] After cleaning is completed, the fully automatic transplanting platform lifting assembly 15 transfers the product to the automatic shower cleaning product station 6;

[0072] Automatic shower cleaning: The cleaning spray system 66 of the automatic shower cleaning product station 6 is started, and the infusion pipeline delivers pure water to the uniformly distributed nozzles to perform all-round automatic spray cleaning on the product to further remove the impurity particles and a small amount of solvent residue remaining on the surface of the product;

[0073] The first barcode scanner 67 scans the barcode or QR code on the product work order, connects the product information with the MES system, and records the cleaning process data for easy traceability and quality management;

[0074] Automatic drying: After spray cleaning is completed, the fully automatic transplanting platform lifting component 15 transfers the product to the automatic drying product station 7;

[0075] The air shower drying system 76 of the automatic product drying station 7 is started, and the air supply pipeline delivers clean air to the evenly distributed nozzles to air dry the products and remove moisture from the product surface;

[0076] The second barcode scanner 77 scans the product work order again to confirm the information recording and processing of the product in the drying process;

[0077] Unloading: After the automatic drying is completed, the fully automatic transfer platform lifting assembly 15 lifts the product from the automatic drying product station 7 and transfers it back to the product transfer vehicle 16 of the upper and lower product stations 1.

[0078] The limiting fixing device 17 of the transport vehicle is released, and the operator pushes the product transport vehicle 16 away from the upper and lower product stations 1 to complete the entire cleaning process;

[0079] During the entire workflow, if any abnormal situation occurs, such as equipment failure, solvent leakage, abnormal cleaning parameters, etc., the emergency stop buttons 1st emergency stop button 25, 2nd emergency stop button 64, 3rd emergency stop button 74 of the corresponding workstation can immediately stop the equipment operation, and at the same time, the corresponding three-color alarm light with buzzer 212, the first three-color alarm light with buzzer 63, and the second three-color alarm light with buzzer 73 will send out obvious alarm signals to remind the operator to troubleshoot and handle the fault. The detachable maintenance door of each workstation is 13. Removable maintenance door 14, fourth removable maintenance door 23, first removable maintenance door 65, second removable maintenance door 75 facilitate operators to quickly approach the inside of the equipment for maintenance operations when the equipment fails or needs routine maintenance. The device of the present invention can fully automatically clean SIC components of semiconductor wafer manufacturing, avoid uneven cleaning of product components pollutants, prevent product components from being damaged by collision, solve the problem of secondary pollution caused by contact of product components after cleaning, and save the large manpower cost required for manual cleaning, etc.

[0080] During the operation of the cleaning machine, the gas generated during the cleaning process flows into the air inlet duct 81 along the inside of the third exhaust air duct 22, and a suitable precipitate is added to the inside of the water storage tank 82 along the inside of the liquid inlet hole 821. The precipitate flows along the inside of the guide groove 817 to the side of the blocking plate 816 away from the filter screen plate 814 until the coolant height there reaches the position of the guide groove 817, and the connecting lines of the fan 87, the drive motor 820 and the submersible pump 812 are all connected to the external power supply, so that the fan 87, the drive motor 820 and the submersible pump 812 are in operation. The operation of the fan 87 draws the gas flowing out of the inside of the third exhaust air duct 22 through the air inlet duct 81, and the gas passes through the filter screen belt 88 and flows from the inside of the fan 87 to the outside. The operation of the drive motor 820 drives the upper rotating roller 85 to rotate, and then drives the filter screen belt 88 to rotate. During the rotation of the filter screen belt 88, the gas passes through The filter belt 88 can filter the impurities in the gas, and as the filter belt 88 rotates, the filter belt 88 with impurities adhered thereto comes into contact with the sedimentation liquid in the water tank 82, so that the impurities adhered to the surface of the filter belt 88 are separated from the filter belt 88, and when the submersible pump 812 is running, the sedimentation liquid in the water tank 82 can be sprayed out along the inside of the square groove 819 and sprayed onto the surface of the filter belt 88, and the position where the sedimentation liquid is sprayed from the inside of the square groove 819 to the surface of the filter belt 88 is located above the sedimentation liquid level in the water tank 82, thereby further cleaning the impurities adhered to the surface of the filter belt 88, which is beneficial to make the gas discharged from the cleaning machine pass through the filter belt 88, filter the impurities in the gas through the continuously rotating filter belt 88, and clean the impurities adhered to the surface of the filter belt 88 through the sedimentation liquid, so as to ensure the effect of filtering the gas discharged from the cleaning machine through the filter belt 88;

[0081] The upper rotating roller 85 drives the lower rotating roller 86 to rotate synchronously through the filter mesh belt 88 during the rotation process. The rotation of the lower rotating roller 86 drives the first gear 91 to rotate synchronously, and then drives the second gear 92 to rotate. The rotation of the second gear 92 drives the first rotating shaft 93 to rotate synchronously, and then drives the cleaning roller 94 with bristles to rotate. Since the contact position between the cleaning roller 94 with bristles and the filter mesh belt 88 is immersed in the sedimentation liquid, the rotation of the cleaning roller 94 with bristles can clean the surface of the filter mesh belt 88, ensuring the cleaning effect of the surface of the filter mesh belt 88, and under the action of the elastic potential energy of the spring 99, one end of the scraper 95 can be pressed against the filter mesh belt 88 to avoid the problem of the filter mesh belt 88 becoming loose after being used for a period of time. At the same time, the debris on the surface of the filter mesh belt 88 can be scraped off, thereby ensuring the cleaning effect of filtering debris on the surface of the filter mesh belt 88.

[0082] Since the sedimentation liquid on the side of the filter screen plate 814 away from the filter screen plate 814 is continuously injected into the side of the blocking plate 816 away from the filter screen plate 814 through the operation of the submersible pump 812, as the liquid on the side of the blocking plate 816 increases, the liquid flows along the inside of the guide groove 817 to between the blocking plate 816 and the filter screen plate 814, and part of the sediment is precipitated on the side of the blocking plate 816 away from the filter screen plate 814. The sedimentation liquid between the blocking plate 816 and the filter screen plate 814 passes through the filter screen plate 814 and flows into the side of the filter screen plate 814 away from the blocking plate 816, so as to facilitate the circulation of the liquid. The sedimentation liquid on one side of the filter screen plate 814 is in a moving state, so that the sedimentation liquid may be mixed with some debris and flow into between the filter screen plate 814 and the blocking plate 816. Under the action of the filter screen plate 814, the debris between the blocking plate 816 and the filter screen plate 814 can be filtered again, further ensuring the effect of flushing the surface of the filter screen belt 88 by the sedimentation liquid. By rotating the first threaded rubber plug 811 and the second threaded rubber plug 815, the first threaded rubber plug 811 and the second threaded rubber plug 815 can be respectively screwed out from the inside of the water tank 82, so that the sediment accumulated in the water tank 82 can be discharged, thereby ensuring the use effect of the cleaning machine.

[0083] In order to enhance the effect of flushing the surface of the filter belt 88, as Figure 11-Figure 14 As shown, a linear drive member 900 is provided on one side of the water tank 82, and the output end of the linear drive member 900 is connected (rotatably connected) to the first rotating shaft 93, a mounting sleeve 901 is provided on the outer side of the first rotating shaft 93, a pipeline 902 is provided on the mounting sleeve 901, and a flow groove 931 and a plurality of aeration holes a932 are provided in the first rotating shaft 93;

[0084] The lower rotating roller 86 is provided with a plurality of through holes 860, a placement groove 861 is provided inside the lower rotating roller 86, an arc block 903 is provided inside the placement groove 861, an aeration hole b9031 is provided inside the arc block 903, a connecting rod 904 is installed on the arc block 903, and a vent pipe is provided on the connecting rod 904; the vent pipe and the pipeline 902 are conventional technical means in the art to pass high-pressure gas, which will not be described in detail here;

[0085] High-pressure gas is introduced into the pipeline 902, and the high-pressure gas is ejected from the aeration hole a932 after passing through the flow groove 931, impacting the surface of the filter belt 88, thereby enhancing the effect of flushing the surface of the filter belt 88. High-pressure gas is introduced into the ventilation pipe, and the high-pressure gas enters the arc block 903 and is ejected from the aeration hole b9031 and the through hole 860, which not only aerates and flushes the filter belt 88, but also cleans the cleaning roller 94. The linear drive member 900 drives the cleaning roller 94 to make a linear reciprocating motion along its axis (with a small amplitude), and rubs the surface of the filter belt 88 along the axis of the cleaning roller 94, thereby greatly enhancing the cleaning effect of the filter belt 88.

[0086] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A fully automatic cleaning machine for semiconductor wafer manufacturing SIC parts; Features: The invention comprises an upper and lower product station (1), wherein an alkaline solvent soaking product station (2) is arranged on one side of the upper and lower product stations (1), a first pure water overflow station (3) is arranged on the side of the alkaline solvent soaking product station (2) away from the upper and lower product stations (1), an acidic solvent soaking product station (4) is arranged on the side of the first pure water overflow station (3) away from the alkaline solvent soaking product station (2), a second pure water overflow station (5) is arranged on the side of the acidic solvent soaking product station (4) away from the first pure water overflow station (3), an automatic rinsing and washing product station (6) is arranged on the side of the second pure water overflow station (5) away from the acidic solvent soaking product station (4), and an automatic drying product station (7) is arranged on the side of the automatic rinsing and washing product station (6) away from the second pure water overflow station (5); A filter assembly (8) is provided on the surface of the alkaline solvent soaking product station (2), and the filter assembly (8) comprises a water storage tank (82) provided on one side of the alkaline solvent soaking product station (2), a filter mesh belt (88) provided inside the water storage tank (82), a fan (87) for filtering dust in the exhaust gas through the filter mesh belt (88), an air inlet duct (81), a drive motor (820), an upper rotating roller (85), and a lower rotating roller (86); A cleaning assembly (9) is arranged inside the water tank (82), and the cleaning assembly (9) comprises a cleaning roller (94) with bristles arranged inside the water tank (82), and a first gear (91), a second gear (92) and a first rotating shaft (93) for cleaning the surface of the filter belt (88) by means of the cleaning roller (94) with bristles.

2. The fully automatic cleaning machine for semiconductor wafer manufacturing SIC parts according to claim 1 is characterized in that: A first display screen (11) and an industrial control operation panel (12) are installed on the surface of the upper and lower product stations (1); a detachable upper maintenance door (13) and a detachable lower maintenance door (14) are provided on one side of the upper and lower product stations (1); the detachable upper maintenance door (13) is located above the detachable lower maintenance door (14); a fully automatic transplanting platform lifting assembly (15) is provided inside the upper and lower product stations (1); a transfer vehicle limit fixing device (17) is installed on the surface of the fully automatic transplanting platform lifting assembly (15); and a product transfer vehicle (16) is provided below the fully automatic transplanting platform lifting assembly (15).

3. The fully automatic cleaning machine for semiconductor wafer manufacturing SIC parts according to claim 1 is characterized in that: A second display screen (21) is installed on the surface of the alkaline solvent soaking product station (2), a third exhaust pipe (22) is installed on the upper surface of the alkaline solvent soaking product station (2), a fourth detachable maintenance door (23) is installed on the front surface of the alkaline solvent soaking product station (2), a solvent pH value detection instrument (24) is arranged on the surface of the alkaline solvent soaking product station (2), a first emergency stop button (25) is installed on the surface of the alkaline solvent soaking product station (2), and an automatic lifting door (26) with a transparent window is installed on the surface of the alkaline solvent soaking product station (2), and the automatic lifting door (26) with a transparent window is located between the second display screen (21) and The alkaline solvent soaking product station (2) is provided with a built-in bubbling device (27) at the bottom of the tank between the fourth detachable maintenance door (23), the alkaline solvent soaking product station (2) is provided with a built-in liquid inlet and discharge pipeline (28) at the bottom of the tank, the alkaline solvent soaking product station (2) is provided with a liquid level sensor (29) at a position close to the side of the alkaline solvent soaking product station (2), the alkaline solvent soaking product station (2) is provided with a full-automatic lifting device (210), the alkaline solvent soaking product station (2) is provided with a cleaning solvent overflow tank (211), and the surface of the alkaline solvent soaking product station (2) is installed with a third three-color alarm light (212) with a buzzer.

4. The fully automatic cleaning machine for semiconductor wafer manufacturing SIC parts according to claim 1 is characterized in that: The upper surface of the automatic shower and cleaning product station (6) is provided with a first exhaust pipe (62); the front surface of the automatic shower and cleaning product station (6) is provided with a third display screen (61); the front surface of the automatic shower and cleaning product station (6) is provided with a first detachable maintenance door (65) near the lower position; the interior of the automatic shower and cleaning product station (6) is provided with a cleaning spray system (66); the front surface of the automatic shower and cleaning product station (6) is provided with a second emergency stop button (64) and a first barcode scanner (67); the first detachable maintenance door (65) is located between the second emergency stop button (64) and the first barcode scanner (67); and the surface of the automatic shower and cleaning product station (6) is provided with a first three-color alarm lamp (63) with a buzzer.

5. The fully automatic cleaning machine for semiconductor wafer manufacturing SIC parts according to claim 1 is characterized in that: The upper surface of the automatic drying product station (7) is provided with a second exhaust pipe (72); the front surface of the automatic drying product station (7) is provided with a fourth display screen (71); the front surface of the automatic drying product station (7) is provided with a second detachable maintenance door (75) near the lower position; the interior of the automatic drying product station (7) is provided with an air shower drying system (76); the front surface of the automatic drying product station (7) is provided with a third emergency stop button (74) and a second barcode scanning gun (77); the second detachable maintenance door (75) is located between the third emergency stop button (74) and the second barcode scanning gun (77); and the surface of the automatic drying product station (7) is provided with a second three-color alarm lamp (73) with a buzzer.

6. The fully automatic cleaning machine for semiconductor wafer manufacturing SIC parts according to claim 3 is characterized by: The top end of the third air exhaust pipe (22) is fixedly connected to an air inlet pipe (81); a rectangular shell (83) is provided at one end of the air inlet pipe (81) away from the third air exhaust pipe (22); a water storage tank (82) is fixedly connected to the bottom surface of the rectangular shell (83); the air inlet pipe (81) is inserted into the surface of the rectangular shell (83) and extends to the inside of the rectangular shell (83); a fan (87) is installed in an installation groove provided on one side of the rectangular shell (83) away from the air inlet pipe (81); and four support plates (810) are installed on the bottom surface of the water storage tank (82).

7. The fully automatic cleaning machine for semiconductor wafer manufacturing SIC parts according to claim 6 is characterized in that: The upper surface of the rectangular shell (83) is fixedly connected to a top cover plate (84), an upper rotating roller (85) is installed inside the top cover plate (84), both ends of the rotating shaft of the upper rotating roller (85) respectively penetrate the top cover plate (84), the upper rotating roller (85) and the top cover plate (84) are rotatably connected, a driving motor (820) is installed on the surface of the top cover plate (84), the end of the output shaft of the driving motor (820) is fixedly connected to one end of the upper rotating roller (85), and a lower rotating roller (86) is arranged inside the water storage tank (82), and the lower rotating roller (86) is located Below the upper rotating roller (85), the two ends of the rotating shaft of the lower rotating roller (86) are respectively inserted into a rotating hole opened inside the water storage tank (82), the lower rotating roller (86) and the water storage tank (82) are rotatably connected, the lower rotating roller (86) is located below the upper rotating roller (85), and the surfaces of the upper rotating roller (85) and the lower rotating roller (86) are sleeved with a filter belt (88), the filter belt (88) is located in two first rectangular grooves (89) opened on the upper surface of the water storage tank (82), and the filter belt (88) is located in a groove opened on the upper surface of the rectangular shell (83).

8. The fully automatic cleaning machine for semiconductor wafer manufacturing SIC parts according to claim 1 is characterized in that: The water storage tank (82) is fixedly connected with a blocking plate (816) and a filter screen plate (814) inside, a guide groove (817) is provided inside the blocking plate (816), a rectangular box (818) is fixedly connected to the side of the blocking plate (816) away from the filter screen plate (814), a square groove (819) is provided on the side of the rectangular box (818) away from the blocking plate (816), a submersible pump (812) is installed inside the water storage tank (82), a connecting pipe (813) is installed at the liquid outlet end of the submersible pump (812), the connecting pipe (813) passes through the filter screen plate (814) and the blocking plate (816), and is inserted into the rectangular box (81 8), the filter screen plate (814) is located between the submersible pump (812) and the blocking plate (816), a first threaded rubber plug (811) and a second threaded rubber plug (815) are respectively inserted into two threads opened on the bottom surface of the water storage tank (82), the first threaded rubber plug (811) and the second threaded rubber plug (815) are respectively threadedly connected to the water storage tank (82), the first threaded rubber plug (811) is located on a side of the blocking plate (816) away from the filter screen plate (814), the second threaded rubber plug (815) is located between the blocking plate (816) and the filter screen plate (814), and a liquid inlet hole (821) is opened on the upper surface of the water storage tank (82).

9. The fully automatic cleaning machine for semiconductor wafer manufacturing SIC parts according to claim 1, characterized in that: A first rotating shaft (93) is arranged inside the water tank (82). The first rotating shaft (93) is inserted into two rotating holes opened inside the water tank (82). The first rotating shaft (93) and the water tank (82) are rotatably connected. A cleaning roller (94) with bristles and a second gear (92) are fixedly sleeved on the surface of the first rotating shaft (93). The surface of the second gear (92) is meshingly connected with a first gear (91). The first gear (91) is fixedly sleeved on the surface of the rotating shaft of the lower rotating roller (86).

10. The fully automatic cleaning machine for semiconductor wafer manufacturing SIC parts according to claim 1, characterized in that: A scraper (95) is arranged between the filter mesh belt (88) and the blocking plate (816); a second rotating shaft (96) is inserted into a rotating hole provided inside the scraper (95); two ends of the second rotating shaft (96) are fixedly connected to the water storage tank (82); the scraper (95) and the second rotating shaft (96) are rotatably connected; a side of the blocking plate (816) close to the filter mesh belt (88) is fixedly connected to a hollow shell (97); a built-in extrusion plate (98) and a spring (99) are arranged inside the hollow shell (97); the built-in extrusion plate (98) and the hollow shell (97) are slidably connected; two ends of the spring (99) are fixedly connected to the built-in extrusion plate (98) and the blocking plate (816) respectively; a side of the built-in extrusion plate (98) away from the spring (99) is in contact with the surface of the scraper (95); A linear drive member (900) is provided on one side of the water storage tank (82); an output end of the linear drive member (900) is connected to a first rotating shaft (93); a mounting sleeve (901) is provided on the outside of the first rotating shaft (93); a pipe (902) is provided on the mounting sleeve (901); and a flow groove (931) and a plurality of aeration holes a (932) are provided in the first rotating shaft (93); A plurality of through holes (860) are provided on the lower rotating roller (86), a placement groove (861) is provided inside the lower rotating roller (86), an arc block (903) is provided inside the placement groove (861), an aeration hole b (9031) is provided inside the arc block (903), a connecting rod (904) is installed on the arc block (903), and a ventilation pipe is provided on the connecting rod (904).

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