A mold pattern processing device and processing technology

Abstract

The present invention relates to the technical field of mold processing, and discloses a mold pattern processing device and a processing technology. The device includes a lifting plate that is slidably arranged and driven to slide by a servo cylinder. The lifting plate includes a placement table for placing the mold. It also includes a shielding plate that is fixedly arranged above the lifting plate. An opening for the mold to pass through is provided on the shielding plate. Two sets of clamping mechanisms are installed on the shielding plate, and the two sets of clamping mechanisms are arranged symmetrically left and right; the clamping mechanism includes a pressing plate that is elastically and obliquely slidably arranged relative to the shielding plate. The present invention cleverly utilizes the process of the lifting plate rising to move the mold to the processing station while driving the two pressing plates to elastically slide so that the mold is clamped and fixed by the two pressing plates. The fixing of the mold and the movement of the mold to the processing station are carried out simultaneously, so that there is no need to perform a separate fixing operation after the mold is moved to the processing station, reducing the additional fixing operation and thus reducing the operation process.

Description

Technical Field

[0001] The present invention relates to the technical field of mold processing, and particularly relates to a mold pattern processing device and a processing technology. Background Art

[0002] Molds are widely used in blanking, die forging, cold heading, extrusion, powder metallurgy part pressing, pressure casting, and the forming processing of compression molding or injection molding of products such as engineering plastics, rubber, and ceramics. For example, in an injection mold, the heated and melted material is injected into the mold cavity under high pressure, and after cooling and solidifying, a formed product is obtained. For a formed product with patterns on the surface, a corresponding pattern shape needs to be processed in the mold cavity through a processing device.

[0003] For example, in a Chinese invention patent with the application number CN202111526364.X, the publication (announcement) number CN114131405B, and the name "A Mold Pattern Processing Device and Method", the mold body is transported to the processing positioning hole through a support rod, and then the two clamping plates are driven to approach by a pressing push rod, so as to tightly press both sides of the mold body to lock the processing position of the mold body. The driven gear ring is rotated by a rotating driving member, and then the drilling angle of the tool head is adjusted in cooperation with three lifting push rods. Then, the driving motor is driven by a feeding push rod to complete the feeding, thereby completing the processing of the pattern. This invention can perform a flow-type transmission on the mold body, and can quickly switch between the upper and lower workstations to process the workpiece. At the same time, the processing angle of the tool head is adjusted to meet the processing of patterns in various directions inside the mold. The entire processing process has a fast switch and effectively improves the processing efficiency of the mold pattern, with strong practicability.

[0004] Although the mold pattern processing device and method of the above invention patent can improve the processing efficiency to a certain extent, the inventor found in the actual processing process that the prior art and the above patent both have the same drawback: Since the mold needs to be fixed by a fixing mechanism during pattern processing, in the prior art, the mold is mostly fixed by manually operating the fixing mechanism to clamp and fix the mold, or the mold is fixed by an electric method as in the above patent. However, whether it is manual fixing or electric fixing, it is necessary to additionally perform a separate clamping and fixing operation on the mold after the mold moves to the processing station, which undoubtedly increases the operation process and reduces the processing speed. Summary of the Invention

[0005] The purpose of the present invention is to provide a mold pattern processing device and a processing technology to solve the above deficiencies in the prior art.

[0006] To achieve the above object, the present invention provides the following technical solution: A mold pattern processing device, including a lifting plate slidably arranged and driven to slide by a servo cylinder, the lifting plate includes a placement table for placing the mold, and further includes a shielding plate fixedly arranged above the lifting plate, an opening for the mold to pass through is provided on the shielding plate, and two sets of clamping mechanisms are installed on the shielding plate, and the two sets of clamping mechanisms are arranged symmetrically left and right;

[0007] The clamping mechanism includes a pressing plate elastically and obliquely slidably arranged relative to the shielding plate, and the bottom of the pressing plate is in sliding abutting cooperation with the lifting plate;

[0008] During the process of the servo cylinder driving the lifting plate to slide upward, the lifting plate drives the mold to insert upward between the two pressing plates while pushing the two pressing plates to elastically slide towards the mold, so that the mold is clamped and fixed by the two pressing plates while moving to the processing station.

[0009] For the above-mentioned mold pattern processing device, the pressing plate includes an inclined plate and a clamping plate integrally arranged, the inclined plate inclines outward from top to bottom, two sets of fixing plates corresponding to the two pressing plates are fixedly installed on the shielding plate, the number of each set of fixing plates is two, the inclined plate is slidably arranged between the corresponding two fixing plates, an extension plate is fixedly installed on each fixing plate, and a compression spring is installed between the inclined plate and each extension plate, and the inclined plate is inserted into the opening for pressing and fixing the mold.

[0010] For the above-mentioned mold pattern processing device, baffles are fixedly installed on the mutually remote sides of the two inclined plates. When the two pressing plates clamp and fix the mold, gaps are generated between the mutually remote side surfaces of the two inclined plates and the shielding plate. After the debris generated during the processing of the mold pattern splashes into the gaps, it falls into the baffles for collection.

[0011] For the above-mentioned mold pattern processing device, the baffle includes a receiving plate, a containing plate, and a bottom plate. The receiving plate and the containing plate are integrally arranged, the receiving plate is located above the containing plate, the top opening of the receiving plate extends outward and is open, the containing plate is used for receiving debris, and the bottom plate is elastically rotatably arranged at the bottom of the containing plate through an elastic mechanism so as to block the bottom of the containing plate.

[0012] For the above-mentioned mold pattern processing device, the clamping mechanism further includes a compaction plate fixedly connected to the shielding plate through a connecting plate. The side surface of the compaction plate is in sliding fit with the outer side surface of the inclined plate. The compaction plate is inserted into the interior of the containing plate in a matching manner. In the initial state, the bottom of the compaction plate is located above the containing plate. During the process of the lifting plate pushing the two pressing plates to elastically slide towards the mold, the bottom of the compaction plate gradually inserts into the containing plate to compact the loose debris in the containing plate.

[0013] For the above-mentioned mold pattern processing device, after the mold finishes pattern processing and is removed, the lifting plate is continuously driven to slide upward by the servo cylinder to drive the two pressing plates to elastically slide continuously, thereby driving the bottom of the compaction plate to continuously insert into the receiving plate to extrude the compacted debris and push the bottom plate to elastically rotate until the compacted debris is discharged from the receiving plate.

[0014] For the above-mentioned mold pattern processing device, the thickness of the compaction plate gradually decreases from low to high to increase the distance between the compaction plate and the receiving plate, thereby increasing the volume of the receiving plate to facilitate the debris generated during pattern processing to fall into the receiving plate.

[0015] For the above-mentioned mold pattern processing device, a movable plate is rotatably arranged on each of the left and right sides of the opening. The two clamping plates are located between the two movable plates. In the initial state, the sides of the two clamping plates facing away from each other are in one-to-one correspondence and abut against the ends of the two movable plates close to each other.

[0016] For the above-mentioned mold pattern processing device, the two movable plates correspond to the two receiving plates one by one. When the mold processes the pattern, the receiving plate does not contact the movable plate. During the process of the bottom of the compaction plate pushing the compacted debris out of the receiving plate, the two receiving plates push the corresponding two movable plates to rotate upward so that the debris falling on the movable plates slides into the two receiving plates for collection.

[0017] A mold pattern processing process, based on the above-mentioned mold pattern processing device, includes the following steps:

[0018] S1: Loading: First, adjust the lifting plate to the initial position through the servo cylinder, place the mold on the placement table and abut against the abutting plate;

[0019] S2: Moving to the processing station: Start the servo cylinder to drive the lifting plate to drive the mold to move upward, so that while the mold extends upward from the opening, the lifting plate slides and abuts against the bottoms of the two pressing plates to push the two pressing plates to elastically slide towards the mold until the two pressing plates clamp and fix the mold. At this time, the mold moves to the processing station and is automatically fixed;

[0020] S3: Debris collection: Start the tool assembly to process the pattern of the mold. A large amount of debris is generated during the processing. When the mold is fixed, gaps are generated between the sides of the two inclined plates facing away from each other and the baffle plate. The debris falls into the receiving plates of the two enclosing baffle plates through the two gaps for collection;

[0021] S4; Debris compaction: During the process of the lifting plate pushing the two pressing plates to elastically slide towards the mold, the bottom of the compaction plate gradually inserts into the receiving plate to compact the loose debris in the receiving plate;

[0022] S5: Chip discharge: After the mold finishes the pattern processing and the mold is removed, the lifting plate is driven by the servo cylinder to continuously slide upward, driving the two pressing plates to elastically slide, and then driving the bottom of the compaction plate to continuously insert into the receiving plate to extrude the compacted chips, pushing the bottom plate to elastically rotate until the compacted chips are discharged from the receiving plate.

[0023] Beneficial effects:

[0024] In the above technical solution, a mold pattern processing device and a processing technology provided by the present invention, through the creative design of the clamping mechanism, establish a connection between the clamping mechanism and the lifting plate. Skillfully, during the process of the lifting plate rising, while moving the mold to the processing station, it can also drive the two pressing plates to elastically slide so that the mold is clamped and fixed by the two pressing plates. The fixing of the mold and the movement of the mold to the processing station are carried out simultaneously, so there is no need to perform a separate fixing operation after the mold is moved to the processing station, reducing the extra fixing operation, thus reducing the operation process and effectively solving the deficiencies in the prior art;

[0025] In the present invention, through the structural improvement of the clamping mechanism, it can not only produce a fixing effect on the mold, but also produce a function of collecting chips;

[0026] Furthermore, in the clamping mechanism of the present invention, through the setting of the compaction plate, when the lifting plate drives the pressing plate to slide upward to clamp and fix the mold, it will drive the surrounding baffle to move upward synchronously, while the compaction plate remains stationary. At this time, the bottom of the compaction plate continuously inserts into the receiving plate to compact the loose chips in the receiving plate, thereby effectively reducing the volume of the chips and increasing the collection amount of the receiving plate. It can be seen that the present invention utilizes the structural design of the clamping mechanism to cleverly synchronously compact the chips during the process of fixing the mold, producing an unexpected technical effect of increasing the chip collection amount of the receiving plate. Description of the drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0028] Figure 1 It is a front view structural schematic diagram of the mold pattern processing device provided by the embodiment of the present invention;

[0029] Figure 2 It is a structural schematic diagram when the tool assembly is removed provided by the embodiment of the present invention;

[0030] Figure 3 Provided by the embodiment of the present invention Figure 2Schematic diagram of the enlarged structure of part A therein;

[0031] Figure 4 Schematic diagram of the structure of the clamping mechanism provided by the embodiment of the present invention from the first perspective;

[0032] Figure 5 Provided by the embodiment of the present invention Figure 4 Schematic diagram of the enlarged structure of part B therein;

[0033] Figure 6 Schematic diagram of the structure of the clamping mechanism provided by the embodiment of the present invention from the second perspective;

[0034] Figure 7 Schematic diagram of the structure of the clamping mechanism provided by the embodiment of the present invention from the third perspective;

[0035] Figure 8 Schematic diagram of the disassembled structure of the clamping mechanism provided by the embodiment of the present invention;

[0036] Figure 9 Schematic diagram of the sectional structure between the clamping mechanism, the shielding plate and the movable plate provided by the embodiment of the present invention;

[0037] Figure 10 Schematic diagram of the sectional structure when the mold is placed on the placement table in the initial state provided by the embodiment of the present invention;

[0038] Figure 11 Schematic diagram of the sectional structure when the lifting plate abuts against the pressing plate provided by the embodiment of the present invention;

[0039] Figure 12 Schematic diagram of the sectional structure when the mold is clamped and fixed by two pressing plates provided by the embodiment of the present invention;

[0040] Figure 13 Schematic diagram of the sectional structure when the movable plate is pushed upward by the receiving plate provided by the embodiment of the present invention.

[0041] Description of reference numerals:

[0042] 1. Base; 2. Bracket; 3. Tool assembly; 4. Servo cylinder; 5. Lifting plate; 501. Placement table; 502. Contact plate; 6. Shielding plate; 601. Opening; 602. Movable plate; 7. Vertical rod; 8. Pressing plate; 801. Inclined plate; 8011. Inclined groove; 802. Clamping plate; 9. Enclosure; 901. Receiving plate; 902. Accommodating plate; 903. Bottom plate; 10. Compression spring; 11. Fixed plate; 1101. Inclined guiding plate; 12. Extension plate; 13. Ball; 14. Rotating rod; 15. Linking plate; 16. Limiting block; 17. Arc rod; 18. Return spring; 19. Compacting plate; 1901. Connecting plate; 20. Rotating shaft; 21. Mold. Detailed implementation mode

[0043] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further introduced in detail below with reference to the accompanying drawings.

[0044] First embodiment:

[0045] As Figures 1-13 shown, a mold pattern processing device provided by an embodiment of the present invention includes a lifting plate 5 that is slidably arranged and driven to slide by a servo cylinder 4. The lifting plate 5 includes a placement table 501 for placing a mold 21. It also includes a shielding plate 6 that is fixedly arranged and located above the lifting plate 5. An opening 601 through which the mold 21 can pass is provided on the shielding plate 6. Two sets of clamping mechanisms are installed on the shielding plate 6, and the two sets of clamping mechanisms are arranged symmetrically left and right;

[0046] The clamping mechanism includes a pressing plate 8 that is elastically and obliquely slidably arranged relative to the shielding plate 6, and the bottom of the pressing plate 8 is in sliding abutment with the lifting plate 5;

[0047] During the process of the servo cylinder 4 driving the lifting plate 5 to slide upward, the lifting plate 5 drives the mold 21 to be inserted upward between the two pressing plates 8 while pushing the two pressing plates 8 to elastically slide toward the mold 21, so that the mold 21 is moved to the processing station and clamped and fixed by the two pressing plates 8 at the same time.

[0048] The mold pattern processing device provided by this embodiment is used for processing patterns on the mold. The words related to directions and positions involved in this embodiment are relative to the accompanying drawings. Specifically, the mold pattern processing device includes a base 1. A plurality of vertical rods 7 are fixedly installed on the base 1. The lifting plate 5 is slidably inserted into the plurality of vertical rods 7. The shielding plate 6 is located on the lifting plate 5 and fixedly connected to the plurality of vertical rods 7. The servo cylinder 4 is fixedly installed on the base 1 and is used to drive the lifting plate 5 to move up and down. The servo cylinder 4 can also be replaced by other driving devices such as an electric cylinder. A bracket 2 is also fixedly installed on the base 1. A tool assembly 3 for processing patterns is arranged on the bracket 2. A jet nozzle (not shown in the figure) is arranged on one side of the tool assembly 3 and is used to blow away the debris generated during pattern processing through gas to prevent it from affecting continuous processing. The tool assembly 3 and the jet nozzle can move up and down, left and right, and back and forth. The structures and moving methods of the tool assembly 3 and the jet nozzle are all prior arts and will not be elaborated here.

[0049] Among them, the power output end of the servo cylinder 4 is fixedly installed at the center of the lifting plate 5. When the lifting plate 5 moves up and down, it drives the placing table 501 to move up and down synchronously. The placing table 501 is used to place the mold 21. A baffle 502 is fixedly installed at the rear side of the top of the placing table 501. When placing the mold 21, the rear side of the mold 21 abuts against the baffle 502, so that when the mold 21 is clamped and fixed by two clamping mechanisms, the centering of the mold 21 can be achieved. The number of clamping mechanisms is two and they are arranged symmetrically left and right. In the initial state, the distance between the two clamping mechanisms is greater than the length of the mold 21 in the left-right direction so that the mold 21 can enter between the two clamping mechanisms. The clamping mechanism includes a pressing plate 8 that elastically slides obliquely relative to the shielding plate 6. The bottom of the pressing plate 8 is in sliding abutment with the lifting plate 5. The clamping of the mold 21 by the two pressing plates 8 realizes the clamping and fixing of the mold 21 by the clamping mechanism. The sliding power of the pressing plate 8 comes from the driving force when the lifting plate 5 moves upward. When the pressing plate 8 elastically slides, it moves obliquely upward, and the inclination direction is towards the mold 21. Therefore, when the lifting plate 5 pushes the two pressing plates 8 to slide obliquely, the distance between the two pressing plates 8 and the mold 21 will be continuously reduced until the two pressing plates 8 clamp and fix the mold 21. The process of the two pressing plates 8 clamping and fixing the mold 21 is also the process of the mold 21 moving upward to the processing station. The shapes and sizes of the molds 21 are the same. Therefore, when the molds 21 are clamped and fixed, the heights they move upward are the same. At this time, the position where the molds 21 are located is the processing station. Therefore, the invention realizes the clamping and fixing of the mold 21 while moving the mold 21 to the processing station.

[0050] Its working principle is as follows: First, adjust the lifting plate 5 to the initial position through the servo cylinder 4, place the mold 21 on the placing table 501 and abut it against the baffle 502. Then start the servo cylinder 4 to drive the lifting plate 5 to drive the mold 21 to move upward, so that while the mold 21 extends upward from the opening 601, the lifting plate 5 slides in abutment with the bottoms of the two pressing plates 8 to push the two pressing plates 8 to elastically slide obliquely upward towards the mold 21 until the two pressing plates 8 clamp and fix the mold 21. At this time, the mold 21 also moves to the processing station. It can be seen that through the creative design of the clamping mechanism, the invention establishes a connection between the clamping mechanism and the lifting plate 5, and cleverly uses the process of the lifting plate 5 rising to move the mold 21 to the processing station while driving the two pressing plates 8 to elastically slide so that the mold 21 is clamped and fixed by the two pressing plates 8. The fixing of the mold 21 and the movement of the mold 21 to the processing station are carried out simultaneously, so that it is not necessary to perform a separate fixing operation after the mold 21 is moved to the processing station, reducing the extra fixing operation, thus reducing the operation process, improving the processing speed of the mold 21, and effectively solving the deficiencies in the prior art.

[0051] In this embodiment, the extrusion plate 8 includes an inclined plate 801 and a clamping plate 802 which are integrally arranged. The inclined plate 801 inclines outward from top to bottom. Two groups of fixed plates 11 corresponding to the two extrusion plates 8 are fixedly installed on the shielding plate 6. The number of each group of fixed plates 11 is two. The inclined plate 801 is slidably arranged between the corresponding two fixed plates 11. An extension plate 12 is fixedly installed on each fixed plate 11. A compression spring 10 is installed between the inclined plate 801 and each extension plate 12. The inclined plate 801 is inserted into the opening 601 to extrude and fix the mold 21. Specifically, one end of the compression spring 10 is fixedly connected to the extension plate 12 and the other end is fixedly connected to the inclined plate 801. Based on the elasticity of the compression spring 10, the elastic sliding of the extrusion plate 8 is realized. The front and rear side faces of the inclined plate 801 are symmetrically provided with inclined grooves 8011. The inclined guide plates 1101 corresponding to the inclined grooves 8011 are fixedly installed on the fixed plates 11. The inclined guide plates 1101 are slidably inserted into the inclined grooves 8011 to realize the inclined sliding of the extrusion plate 8. In the initial state, the top of the inclined groove 8011 abuts against the top of the inclined guide plate 1101 to realize the limit of the extrusion plate 8.

[0052] On one side of the two inclined plates 801 away from each other, a surrounding baffle 9 is fixedly installed. When the two extrusion plates 8 clamp and fix the mold 21, gaps are generated between the side faces of the two inclined plates 801 away from each other and the shielding plate 6. When the mold 21 is processed with patterns, the debris generated splashes into the gaps and then falls into the surrounding baffle 9 for collection. Specifically, a space with a sealed bottom is formed between the surrounding baffle 9 and the inclined plate 801. The top of the surrounding baffle 9 is open. When the two extrusion plates 8 incline and slide, gaps will be generated between them and the shielding plate 6. When the two extrusion plates 8 clamp and fix the mold 21, the gaps correspond to the open top of the surrounding baffle 9. When pattern processing is carried out, the generated debris is randomly scattered because it is blown away by the air jet nozzle. Some debris falls into the gaps and then into the surrounding baffle 9. The surrounding baffle 9 and the extrusion plate 8 are both part of the clamping mechanism. It can be seen that through the structural improvement of the clamping mechanism, not only can the mold 21 be fixed, but also the debris can be collected.

[0053] Among them, the baffle 9 includes a receiving plate 901, a receiving plate 902, and a bottom plate 903. The receiving plate 901 and the receiving plate 902 are integrally provided. The receiving plate 901 is located above the receiving plate 902, and the top opening of the receiving plate 901 extends outward and is open. The receiving plate 902 is used to receive debris. The bottom plate 903 is elastically rotatably provided at the bottom of the receiving plate 902 to block the bottom of the receiving plate 902. Specifically, the bottom of the receiving plate 902 is blocked by the bottom plate 903, and the debris enters the baffle 9 from the top opening of the receiving plate 901 and then enters the receiving plate 902 for collection. Among them, a rotating rod 14 is integrally provided at the center of the bottom plate 903, and the rotating rod 14 is rotatably connected to the receiving plate 902. The elastic mechanism includes a linkage plate 15, a limiting block 16, an arc rod 17, and a return spring 18. The linkage plate 15 is fixedly connected to the end of the rotating rod 14. The limiting block 16 is fixedly installed on the side surface of the receiving plate 902. One end of the arc rod 17 is fixedly connected to the linkage plate 15 and the other end is slidably inserted into the limiting block 16. The return spring 18 is sleeved on the arc rod 17. The center of the arc of the arc rod 17 falls on the central axis of the rotating rod 14. One end of the return spring 18 abuts against the linkage plate 15 and the other end abuts against the limiting block 16. In the initial state, due to the elastic force of the return spring 18, the bottom plate 903 is located at a specific angle. At this time, the bottom plate 903 blocks the bottom opening of the receiving plate 902, and the debris falling into the baffle 9 is supported by the bottom plate 903.

[0054] Each bottom plate 903 is configured with two elastic mechanisms, and the two elastic mechanisms are correspondingly arranged at both ends of the rotating rod 14 to improve the force balance of the bottom plate 903.

[0055] Further, the clamping mechanism further includes a compaction plate 19 fixedly connected to the shielding plate 6 through a connecting plate 1901. The side surface of the compaction plate 19 is slidably attached to the outer side surface of the inclined plate 801. The compaction plate 19 is inserted into the interior of the receiving plate 902 in a mating manner. In the initial state, the bottom of the compaction plate 19 is located above the receiving plate 902 so that debris can enter the receiving plate 902. During the process of the lifting plate 5 pushing the two pressing plates 8 to elastically slide towards the mold 21, the bottom of the compaction plate 19 gradually inserts into the receiving plate 902 to compact the loose debris in the receiving plate 902. Specifically, since the debris falls into the receiving plate 902 in a loose state, it occupies more collection space, and the amount of collected debris will be reduced under the condition of a certain space size. However, in the clamping mechanism of the present invention, by adding the compaction plate 19, when the lifting plate 5 pushes the pressing plate 8 to slide upward to clamp and fix the mold 21, it will drive the surrounding baffle 9 to move upward synchronously, while the compaction plate 19 remains stationary. At this time, the bottom of the compaction plate 19 continuously inserts into the receiving plate 902 to compact the loose debris in the receiving plate 902, thereby effectively reducing the volume of the debris and increasing the collection capacity of the receiving plate 902. It can be seen that the present invention utilizes the structural design of the clamping mechanism to cleverly synchronously compact the debris during the process of fixing the mold 21, producing an unexpected technical effect of increasing the amount of debris collected by the receiving plate 902. Moreover, since the operation of compacting the debris is achieved during the process of fixing the mold 21, the operation of separately compacting the debris is thus omitted.

[0056] Furthermore, after the mold 21 completes the pattern processing and is removed, the servo cylinder 4 is used to drive the lifting plate 5 to continuously slide upward to drive the two pressing plates 8 to continuously elastically slide, thereby driving the bottom of the compaction plate 19 to continuously insert into the receiving plate 902 to squeeze the compacted debris to push the bottom plate 903 to elastically rotate until the compacted debris is discharged from the receiving plate 902. Specifically, as Figure 13 shown, since the removal of the mold 21 enables the two pressing plates 8 to move a longer distance towards the middle, the lifting plate 5 can slide upward a longer distance, and thus the surrounding baffle 9 can move upward a longer distance. The increase in the upward movement distance of the surrounding baffle 9 causes the distance between the bottom of the compaction plate 19 and the bottom plate 903 to continuously decrease until the bottom of the compaction plate 19 abuts against the bottom plate 903. Based on this, the compaction plate 19 can not only compact the debris in the receiving plate 902, but also automatically push the compacted debris in the receiving plate 902 out of the receiving plate 902, playing a role in cleaning the debris in the receiving plate 902.

[0057] In this embodiment, the thickness of the compaction plate 19 gradually decreases from low to high to increase the distance between the compaction plate 19 and the receiving plate 901, thereby increasing the volume of the receiving plate 901 to facilitate the debris generated during the pattern processing to fall into the receiving plate 901.

[0058] In this embodiment, a movable plate 602 is rotatably arranged on each of the left and right sides of the opening 601. Two clamping plates 802 are located between the two movable plates 602. In the initial state, the sides of the two clamping plates 802 facing away from each other are in one-to-one abutment with the ends of the two movable plates 602 close to each other. Part of the debris generated during the processing of the pattern falls into the gap, and part of the debris with greater kinetic energy will cross the gap and fall on the two movable plates 602. Among them, a rotating shaft 20 is rotatably inserted into each of the ends of the two movable plates 602 close to each other, and the rotating shaft 20 is rotatably connected to the shielding plate 6. As Figure 10 shown, in the initial state, the ends of the two movable plates 602 facing away from each other are in abutment with the side surface of the opening 601 so that the two movable plates 602 are limited and cannot continue to rotate downward. At this time, the two movable plates 602 are in a flat state; as Figure 12 shown, when the two pressing plates 8 clamp and fix the mold 21, the two movable plates 602 are still in a flat state and can receive the flying debris.

[0059] Furthermore, the two movable plates 602 correspond to the two receiving plates 901 one by one. When the mold 21 processes the pattern, the receiving plate 901 is not in contact with the movable plate 602. During the process of the bottom of the compaction plate 19 pushing the compacted debris out of the accommodating plate 902, the two receiving plates 901 push the corresponding two movable plates 602 to rotate upward so that the debris falling on the movable plates 602 slides into the two receiving plates 901 for collection. As Figure 13 shown, since the surrounding baffle 9 can move upward a longer distance after the mold 21 is removed, the top of the receiving plate 901 can push the corresponding movable plate 602 to rotate upward to be in an inclined state. At this time, the debris on the movable plate 602 can fall along the top surface of the movable plate 602 into the corresponding receiving plate 901 under the action of gravity and is blocked by the side surface of the compaction plate 19. Then, the servo cylinder 4 drives the lifting plate 5 to slide downward. At this time, the compaction plate 19 continuously slides out of the accommodating plate 902. When the compaction plate 19 returns to its original position, the debris falling into the receiving plate 901 enters the accommodating plate 902 for collection and is blocked by the bottom plate 903. It can be seen that in the present invention, during the process of the bottom of the compaction plate 19 pushing the compacted debris out of the accommodating plate 902, unexpectedly, the two receiving plates 901 push the corresponding two movable plates 602 to rotate upward so that the debris falling on the movable plates 602 slides into the two receiving plates 901 to be collected.

[0060] Among them, at least two balls 13 are rollingly embedded at the bottom of the pressing plate 8, and the balls 13 are in abutment with the top of the 5, thereby reducing the friction between the pressing plate 8 and the lifting plate 5.

[0061] Second Embodiment:

[0062] As Figures 1-13 shown, the present invention provides a mold pattern processing process, including the following steps:

[0063] S1: Loading: First, adjust the lifting plate 5 to the initial position through the servo cylinder 4, place the mold 21 on the placement table 501 and abut it against the abutting plate 502.

[0064] S2: Moving to the processing station: Start the servo cylinder 4 to drive the lifting plate 5 to drive the mold 21 to move upward, so that while the mold 21 extends upward from the opening 601, the bottom of the lifting plate 5 slides against the bottoms of the two pressing plates 8 to push the two pressing plates 8 to elastically slide toward the mold 21 until the two pressing plates 8 clamp and fix the mold 21. At this time, move to the processing station and achieve automatic fixation.

[0065] S3: Chip collection: Start the tool assembly 3 to process the pattern on the mold 21. A large amount of chips are generated during the processing. When the mold 21 is fixed, gaps are generated between the mutually remote sides of the two inclined plates 801 and the baffle 6. The chips fall into the receiving plates 902 of the two enclosing baffles 9 through the two gaps for collection.

[0066] S4; Chip compaction: During the process that the lifting plate 5 pushes the two pressing plates 8 to elastically slide toward the mold 21, the bottom of the compaction plate 19 gradually inserts into the receiving plate 902 to compact the loose chips in the receiving plate 902.

[0067] S5: Chip discharge: After the mold 21 completes the pattern processing and the mold 21 is removed, the servo cylinder 4 is used to drive the lifting plate 5 to continuously slide upward to drive the two pressing plates 8 to continuously elastically slide, thereby driving the bottom of the compaction plate 19 to continuously insert into the receiving plate 902 to squeeze the compacted chips to push the bottom plate 903 to elastically rotate until the compacted chips are discharged from the receiving plate 902.

[0068] Wherein, a movable plate 602 is rotatably arranged on each of the left and right sides of the opening 601. The two clamping plates 802 are located between the two movable plates 602. In the initial state, the mutually remote sides of the two clamping plates 802 abut against the respective close ends of the two movable plates 602 one by one. Some of the chips generated during the pattern processing will fall into the gaps, and some chips with greater kinetic energy will cross the gaps and fall on the two movable plates 602. Wherein, a rotating shaft 20 is rotatably inserted at each of the mutually close ends of the two movable plates 602. The rotating shaft 20 is rotatably connected to the baffle 6. As Figure 10 shown, in the initial state, the mutually remote ends of the two movable plates 602 abut against the side surface of the opening 601 to limit the two movable plates 602 from continuing to rotate downward. At this time, the two movable plates 602 are in a flat state; as Figure 12 shown, when the two pressing plates 8 clamp and fix the mold 21, the two movable plates 602 are still in a flat state and can receive the flying chips.

[0069] The two movable plates 602 correspond to the two receiving plates 901 one by one. When the mold 21 processes the pattern, the receiving plates 901 do not contact the movable plates 602. During the process that the bottom of the compaction plate 19 pushes the compacted debris out of the receiving plate 902, the two receiving plates 901 push the corresponding two movable plates 602 upward to rotate, so that the debris falling on the movable plates 602 slides into the two receiving plates 901 for collection.

[0070] In step S5, since the surrounding baffle 9 can move upward a longer distance after the mold 21 is removed, the top of the receiving plate 901 can push the corresponding movable plate 602 to rotate upward to be inclined. At this time, the debris on the movable plate 602 can fall along the top surface of the movable plate 602 into the corresponding receiving plate 901 under the action of gravity and is blocked by the side surface of the compaction plate 19. Then, the servo cylinder 4 drives the lifting plate 5 to slide downward. At this time, the compaction plate 19 continuously slides out of the receiving plate 902. When the compaction plate 19 is reset, the debris falling in the receiving plate 901 enters the receiving plate 902 for collection and is blocked by the bottom plate 903. It can be seen that during the process that the bottom of the compaction plate 19 pushes the compacted debris out of the receiving plate 902, unexpectedly, the two receiving plates 901 push the corresponding two movable plates 602 upward to rotate, so that the debris falling on the movable plates 602 slides into the two receiving plates 901 to be collected.

[0071] Only some exemplary embodiments of the present invention are described by way of illustration above. Undoubtedly, for those of ordinary skill in the art, the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the protection scope of the claims of the present invention.

Claims

1. A mold pattern processing device, comprising a lifting plate (5) which is slidably arranged and driven to slide by a servo cylinder (4), the lifting plate (5) comprising a placement table (501) for placing a mold (21), characterized in that: It also includes a shielding plate (6) fixedly arranged and located above the lifting plate (5), the shielding plate (6) being provided with an opening (601) for the mold (21) to pass through, and two groups of clamping mechanisms being installed on the shielding plate (6), the two groups of clamping mechanisms being arranged symmetrically on the left and right; The clamping mechanism comprises a pressing plate (8) elastically and obliquely slidably arranged relative to the shielding plate (6), and the bottom of the pressing plate (8) is in sliding abutment with the lifting plate (5); When the servo cylinder (4) drives the lifting plate (5) to slide upward, the lifting plate (5) drives the mold (21) to be inserted upward between the two extrusion plates (8), and pushes the two extrusion plates (8) to slide elastically toward the mold (21), so that the mold (21) moves to the processing station and is clamped and fixed by the two extrusion plates (8); The extrusion plate (8) comprises an integrally arranged inclined plate (801) and a clamping plate (802), the inclined plate (801) being inclined downward and outwardly, two groups of fixed plates (11) corresponding to the two extrusion plates (8) being fixedly mounted on the shielding plate (6), each group of fixed plates (11) having two, the inclined plate (801) being slidably mounted between the two corresponding fixed plates (11), an extension plate (12) being fixedly mounted on each of the fixed plates (11), a compression spring (10) being mounted between the inclined plate (801) and each of the extension plates (12), and the inclined plate (801) being inserted into the opening (601) for extruding the fixed mold (21); The front and rear sides of the inclined plate (801) are symmetrically provided with inclined grooves (8011); an inclined guide plate (1101) corresponding to the inclined groove (8011) is fixedly mounted on the fixed plate (11); the inclined guide plate (1101) is slidably inserted into the inclined groove (8011) to achieve inclined sliding of the extrusion plate (8); in an initial state, the top of the inclined groove (8011) abuts against the top of the inclined guide plate (1101) to achieve position limiting of the extrusion plate (8); A baffle plate (9) is fixedly mounted on the side of the two inclined plates (801) that is away from each other, and when the two extrusion plates (8) clamp the fixed mold (21), a gap is generated between the side of the two inclined plates (801) that is away from each other and the baffle plate (6), and debris generated when processing the pattern of the mold (21) splashes into the gap and then falls into the baffle plate (9) for collection; The enclosure plate (9) comprises a receiving plate (901), a containing plate (902), and a bottom plate (903); the receiving plate (901) and the containing plate (902) are integrally arranged; the receiving plate (901) is located above the containing plate (902); a top opening of the receiving plate (901) extends outward and opens; the containing plate (902) is used to receive debris; and the bottom plate (903) is elastically rotatably arranged at the bottom of the containing plate (902) by an elastic mechanism so that the bottom of the containing plate (902) is blocked.

2. The mold pattern processing device according to claim 1, characterized in that: The clamping mechanism further comprises a compacting plate (19) fixedly connected to the shielding plate (6) via a connecting plate (1901); the side surface of the compacting plate (19) is slidably fitted with the outer side surface of the inclined plate (801); the compacting plate (19) is plugged into the interior of the containing plate (902); in an initial state, the bottom of the compacting plate (19) is located above the containing plate (902); and in the process of the lifting plate (5) pushing the two extrusion plates (8) upwards and elastically sliding toward the mold (21), the bottom of the compacting plate (19) is gradually inserted into the containing plate (902) to compact loose debris in the containing plate (902).

3. The mold pattern processing device according to claim 2, characterized in that: After the mold (21) has completed pattern processing and the mold (21) has been removed, the servo cylinder (4) drives the lifting plate (5) to continuously slide upwards, thereby driving the two extrusion plates (8) to continuously slide elastically, thereby driving the bottom of the compacting plate (19) to continuously insert into the receiving plate (902) to squeeze the compacted debris and push the bottom plate (903) to elastically rotate until the compacted debris is discharged from the receiving plate (902).

4. The mold pattern processing device according to claim 2, characterized in that: The thickness of the compacting plate (19) gradually decreases from low to high to increase the distance between the compacting plate (19) and the receiving plate (901), thereby increasing the volume of the receiving plate (901) so that debris generated during pattern processing can fall into the receiving plate (901).

5. The mold pattern processing device according to claim 2, characterized in that: A movable plate (602) is rotatably provided on the left and right sides of the opening (601), and the two clamping plates (802) are located between the two movable plates (602). In an initial state, the sides of the two clamping plates (802) that are away from each other abut against the ends of the two movable plates (602) that are close to each other in a one-to-one corresponding manner.

6. The mold pattern processing device according to claim 5, characterized in that: The two movable plates (602) correspond to the two receiving plates (901) one by one. When the mold (21) processes the pattern, the receiving plates (901) and the movable plates (602) do not contact each other. When the bottom of the compacting plate (19) pushes the compacted debris to be discharged from the receiving plate (902), the two receiving plates (901) push the corresponding two movable plates (602) upward to rotate so that the debris falling on the movable plates (602) slides into the two receiving plates (901) for collection.

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