Thermal management loop

Abstract

The invention provides a thermal management loop. The heat management circuit is provided with a battery circuit (first circuit), a refrigeration cycle, and a heat dissipation circuit (second circuit). The heat dissipation circuit includes a flow path (first flow path), a flow path (second flow path), and a flow path (third flow path). The flow path connects a hole (outlet hole) of the condensation part and an upstream HT radiator (upstream radiator). The flow path branches from a flow path connecting the upstream-side HT radiator and the downstream-side HT radiator (downstream-side radiator), and is connected to a hole (inlet hole) of the condensation section. The flow path connects the hole (inlet hole) of the supercooling section and the downstream HT radiator.

Description

Technical Field

[0001] The present disclosure relates to thermal management circuits. Background Art

[0002] Japanese Patent Application Laid-Open No. 2005-186879 discloses a structure for cooling cooling water of an engine using a radiator. Summary of the invention

[0003] In the thermal management circuit of Japanese Patent Application Laid-Open No. 2005-186879, as described above, the coolant for cooling the engine (the device to be cooled) is cooled by the radiator. It is desirable to further improve the cooling efficiency of the device to be cooled using the radiator.

[0004] The present disclosure has been made to solve the above-mentioned problems, and an object of the present disclosure is to provide a thermal management circuit capable of improving the cooling efficiency of a cooling target device using a heat sink.

[0005] In one aspect of the present disclosure, a thermal management circuit is installed in an electrical device, wherein: The thermal management circuit has: A first circuit for circulating a cooling liquid, wherein the cooling liquid exchanges heat with a device to be cooled, that is, a cooling target device; a refrigeration cycle, comprising a cooler and a water-cooled condenser, and for circulating a cooling medium, wherein the cooling medium exchanges heat with a cooling liquid circulating in the first circuit in the cooler; and The second circuit includes a radiator portion and is provided with a cooling liquid flowing therethrough. The cooling liquid exchanges heat with a cooling medium flowing through the refrigeration cycle in a water-cooled condenser.

[0006] The second circuit includes a first flow path, a second flow path, and a third flow path respectively connected to the water-cooled condenser.

[0007] The water-cooled condenser includes a condensing part and a supercooling part.

[0008] The radiator unit includes an upstream radiator and a downstream radiator which are connected in series with each other in the second circuit.

[0009] The first flow path connects the outlet hole of the coolant in the condensation portion to the upstream radiator.

[0010] The second flow path branches off from the flow path connecting the upstream radiator and the downstream radiator, and is connected to an inlet hole of the coolant in the condensation portion.

[0011] The third flow path connects the coolant inlet hole in the supercooling portion and the downstream radiator.

[0012] In a thermal management circuit of one aspect of the present disclosure, as described above, the first flow path connects the outlet hole of the coolant in the condensation section to the upstream radiator, the second flow path branches from the flow path connecting the upstream radiator and the downstream radiator and connects to the inlet hole of the coolant in the condensation section, and the third flow path connects the inlet hole of the coolant in the supercooling section to the downstream radiator. Thus, the coolant flowing out of the upstream radiator can flow directly into the condensation section through the second flow path. As a result, the coolant can flow to the condensation section without passing through the downstream radiator and the supercooling section. Thus, the flow rate (flow momentum, flow rate) of the coolant will not be reduced due to passing through the downstream radiator and the supercooling section, so the flow rate of the coolant flowing into the condensation section from the second flow path can be relatively large. In addition, in the condensation section, the cooling medium changes from gas to liquid, so the condensation heat is dissipated from the cooling medium, and on the other hand, the temperature of the cooling medium hardly changes (decreases). Therefore, the temperature of the cooling medium is maintained at a relatively high value, so even if the coolant with a relatively high temperature passes only through the upstream radiator without passing through the downstream radiator, heat exchange with the cooling medium can be performed. In addition, the flow rate of the coolant passing through the condensation section is large, thereby suppressing the situation where the temperature of the coolant increases due to passing through the condensation section. As a result, it is possible to suppress the situation where the heat exchange amount between the cooling medium and the coolant decreases. In these aspects, the above-mentioned structure of the thermal management circuit is effective for increasing the heat exchange amount in the condensation section.

[0013] In addition, the coolant that has passed through the upstream radiator and the downstream radiator can flow into the supercooling part. As a result, the temperature of the coolant flowing into the supercooling part can be reduced compared to the case where the coolant only passes through the upstream radiator. In addition, the cooling medium in the supercooling part remains in a liquid state, so the temperature of the cooling medium is reduced due to heat dissipation. Therefore, the lower the temperature of the coolant that exchanges heat with the cooling medium, the more the heat exchange amount in the supercooling part can be increased. In this regard, the above-mentioned structure of the thermal management circuit is effective in increasing the heat exchange amount in the supercooling part.

[0014] As a result, the amount of heat exchange between the cooling medium and the coolant in the water-cooled condenser (the amount of heat dissipated by the cooling medium) can be increased, so the cooling efficiency of the cooling target device can be easily improved.

[0015] In the heat management circuit according to the above aspect, preferably, the downstream radiator is disposed upstream of the upstream radiator in a flow direction of outside air flowing into the radiator portion.

[0016] According to such a structure, since the outside air passes through the downstream radiator before passing through the upstream radiator, the temperature of the outside air passing through the downstream radiator can be relatively low. As a result, the heat dissipation of the coolant in the downstream radiator can be increased. Thus, the heat dissipation of the cooling medium in the supercooling section can be increased.

[0017] In the thermal management circuit of the above aspect, preferably, the second circuit includes a fourth flow path connecting the first flow path with the second flow path or the third flow path.

[0018] In addition, the second circuit includes a heater core provided in the fourth flow path and a first valve provided in the first flow path.

[0019] The first valve is configured to be able to adjust a flow rate of the cooling water flowing to the upstream radiator and a flow rate of the cooling water flowing to the heater core.

[0020] According to this configuration, the balance between the amount of heat dissipated by the coolant in the radiator portion and the amount of heat dissipated by the coolant in the heater core (ie, the heating capacity) can be adjusted by the first valve.

[0021] In this case, it is preferable that the second circuit includes a second valve capable of adjusting a flow rate of the cooling water flowing from the upstream radiator to the downstream radiator.

[0022] If configured in this way, the balance between the flow rate of cooling water flowing through the downstream radiator and the flow rate of cooling water flowing into the condensation section through the second flow path can be adjusted. Thus, the balance between the heat dissipation of cooling water in the downstream radiator and the heat dissipation from the cooling medium to the coolant in the condensation section can be adjusted.

[0023] In the above-mentioned heat management circuit in which the second circuit includes the second valve, it is preferred that the second valve is formed integrally with the first valve.

[0024] According to such a configuration, compared with a case where the second valve and the first valve are provided separately, the number of components can be reduced and the configuration of the heat management circuit can be simplified.

[0025] According to the present disclosure, the cooling efficiency of a device to be cooled can be improved using a heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Features, advantages, and technical and industrial significance of exemplary embodiments of the present invention will be described below with reference to the accompanying drawings, in which like reference numerals represent like parts, and in which: Figure 1 is a diagram showing the structure of a thermal management system according to one embodiment; Figure 2 is a diagram showing an electric vehicle equipped with a thermal management system according to an embodiment; Figure 3 is a diagram showing a first flow pattern of a heat dissipation circuit in a heat management circuit according to one embodiment; Figure 4 is a diagram showing a second flow pattern of a heat dissipation circuit in a heat management circuit according to one embodiment; Figure 5is a diagram showing a third flow pattern of a heat dissipation circuit in a heat management circuit according to an embodiment; Figure 6 is a diagram showing a detailed structure of a water-cooled condenser according to one embodiment; Figure 7 is a diagram showing a heat dissipation circuit according to a first modified example of an embodiment; Figure 8 is a diagram showing a heat dissipation circuit according to a second modified example of an embodiment; Fig. 9 is a diagram showing a heat dissipation circuit according to a third modified example of an embodiment; Fig.10 is a diagram showing a heat dissipation circuit according to a fourth modified example of an embodiment; Fig.11 is a diagram showing a heat dissipation circuit according to a fifth modified example of an embodiment; Fig. 12A Yes means Fig.11 A diagram showing a detailed structure of a five-way valve is a diagram showing a case where heat is supplied to a heater core; Fig. 12B Yes means Fig.11 A diagram showing a detailed structure of a five-way valve is a diagram showing a case where heat is supplied to a radiator; Fig. 12C Yes means Fig.11 A diagram showing a detailed structure of a five-way valve is a diagram showing a case where heat is supplied to a radiator; Fig.12D Yes means Fig.11 A diagram showing a detailed structure of a five-way valve in the case where heat is supplied to a heater core and a radiator; and Fig.12E Yes means Fig.11 FIG. 1 is a diagram showing a detailed structure of a five-way valve when heat is supplied to a heater core and a radiator. DETAILED DESCRIPTION

[0027] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In addition, the same reference numerals are given to the same or corresponding parts in the drawings, and their description will not be repeated.

[0028] Figure 1 1 is a diagram showing the overall configuration of a thermal management system 1 including a thermal management system 10 according to the present embodiment. The thermal management system 1 includes a thermal management circuit 10 , an electronic control unit (ECU) 20 , and a human-machine interface (HMI) 30 .

[0029] The thermal management system 1 is installed in, for example, an electric vehicle 2 (see Figure 2 ). In addition, the electric car 2 is an example of the “electrical device” of the present disclosure.

[0030] The thermal management circuit 10 includes a battery circuit 100, a refrigeration cycle 200, a heat dissipation circuit 300, a low temperature circuit 400, and a four-way valve 500. In this specification, the heat medium flowing in the refrigeration cycle 200 is referred to as a "cooling medium", and the heat medium flowing in other circuits (100, 300, 400) is referred to as a "coolant". In addition, the battery circuit 100 and the heat dissipation circuit 300 are examples of the "first circuit" and the "second circuit" of the present disclosure, respectively.

[0031] The battery circuit 100 includes a battery 110 and a water pump 120. A coolant that exchanges heat with the battery 110 flows through the battery circuit 100. The battery 110 stores electric power for driving the electric vehicle 2. The battery 110 is an example of a "cooling target device" in the present disclosure.

[0032] The refrigeration cycle 200 includes a cooler 210 , an evaporator 220 , a compressor 230 , a water-cooled condenser 240 , an expansion valve 250 , and an expansion valve 260 .

[0033] The cooler 210 is connected to the flow paths of the refrigeration cycle 200 and the battery circuit 100 . Thus, the cooling medium flowing through the refrigeration cycle 200 and the cooling liquid flowing through the battery circuit 100 perform heat exchange in the cooler 210 .

[0034] The cooling medium (gas-phase cooling medium or liquid-phase cooling medium) circulating in the refrigeration cycle 200 flows through one or both of the first path of the compressor 230-water-cooled condenser 240-expansion valve 260-evaporator 220-compressor 230 and the second path of the compressor 230-water-cooled condenser 240-expansion valve 250-cooler 210-compressor 230.

[0035] The water-cooled condenser 240 includes a condensing portion 241, a storage tank 242, a supercooling portion 243, and a circulation pipe 244. The condensing portion 241, the storage tank 242, and the supercooling portion 243 are connected in series with each other in the refrigeration cycle 200 (in the circulation path of the cooling medium flowing in the refrigeration cycle 200). The cooling medium of the refrigeration cycle 200 flows in the order of the condensing portion 241, the storage tank 242, and the supercooling portion 243. In addition, the supercooling portion 243 is an example of a "supercooling portion" disclosed in the present invention.

[0036] The condensing unit 241 condenses the high-temperature and high-pressure gas cooling medium pumped from the compressor 230 to change it into a liquid cooling medium, and performs heat exchange between the liquid cooling medium and the coolant circulating in the heat dissipation circuit 300. The storage tank 242 performs gas-liquid separation of the liquid phase cooling medium that has passed through the condensing unit 241. The supercooling unit 243 performs heat exchange between the liquid phase cooling medium that has passed through the storage tank 242 and the coolant circulating in the heat dissipation circuit 300.

[0037] The condensing portion 241 has a hole 241a, a hole 241b, and a hole 241c. The hole 241a is an inlet hole for the coolant of the heat dissipation circuit 300 to flow in. The hole 241b is an outlet hole for the coolant of the heat dissipation circuit 300 to flow out. The hole 241c is an inlet hole for the gaseous cooling medium of the refrigeration cycle 200 pumped from the compressor 230 to flow in.

[0038] The supercooling portion 243 has a hole 243a and a hole 243b. The hole 243a is an inlet hole through which the coolant of the heat radiation circuit 300 flows in. The hole 243b is an outlet hole through which the cooling medium of the refrigeration cycle 200 flows out.

[0039] The flow pipe 244 connects the supercooling portion 243 and the condensing portion 241. The coolant of the heat dissipation circuit 300 flows from the supercooling portion 243 to the condensing portion 241 through the flow pipe 244.

[0040] The low temperature circuit 400 includes an eAxle 410, a water pump 420, and an LT (Low Temperature) radiator 430. Coolant that exchanges heat with the eAxle 410 flows through the low temperature circuit 400. The eAxle 410 includes a PCU (Power Control Unit) and an oil cooler, etc., which are not shown.

[0041] The four-way valve 500 has holes P1 to P4. The hole P1 is an inlet hole for the coolant to flow in after heat exchange with the eAxle 410. The hole P2 is an outlet hole for the coolant to flow out toward the LT radiator 430. The hole P3 is an inlet hole for the coolant in the battery circuit 100 (the coolant that has passed through the cooler 210) to flow in. The hole P4 is an outlet hole for the coolant to flow out toward the battery circuit 100 (the battery 110 side).

[0042] ECU 20 controls the thermal management circuit 10. ECU 20 includes a processor 21, a memory 22, a storage 23, and an interface 24. ECU 20 controls the opening and closing states of each hole of the four-way valve 500. By switching the opening and closing states of each hole of the four-way valve 500, the flow path of the coolant is switched.

[0043] Here, in the conventional thermal management circuit, it is desired to further improve the cooling efficiency of cooling target equipment such as batteries.

[0044] Therefore, in this embodiment, a heat dissipation circuit 300 having the following structure is used. Figure 3 Provide explanation. Figure 3 It shows the first flow mode of the coolant in the heat dissipation circuit 300 .

[0045] The heat dissipation circuit 300 includes a heater core 310 and a radiator 320 (see Figure 1), three-way valve 330, valve 340, check valve 350 and water pump 360. The flow rate (output) of cooling water based on water pump 360, the states of three-way valve 330 and valve 340 are controlled by ECU 20 (refer to Figure 1 ) control. The three-way valve 330 and the valve 340 are examples of a “first valve” and a “second valve”, respectively. In addition, the check valve 350 is an example of a “second valve” of the present disclosure.

[0046] The radiator section 320 includes an upstream HT (High Temperature) radiator 321, a downstream HT radiator 322, and a flow path 325. The upstream HT radiator 321 and the downstream HT radiator 322 are connected in series with each other in the heat dissipation circuit 300. The flow path 325 connects the upstream HT radiator 321 and the downstream HT radiator 322. In addition, the upstream HT radiator 321 is arranged on the upstream side of the downstream HT radiator 322 in the flow direction of the coolant in the heat dissipation circuit 300. In addition, the upstream HT radiator 321 and the downstream HT radiator 322 are examples of the “upstream radiator” and the “downstream radiator” of the present disclosure, respectively.

[0047] The heat dissipation circuit 300 includes a flow path 315, a flow path 370, a flow path 380, and a flow path 390. The flow path 370, the flow path 380, and the flow path 390 respectively connect the radiator portion 320 and the water-cooled condenser 240. In addition, the flow path 370 and the flow path 380 are respectively an example of the "first flow path" and the "second flow path" of the present disclosure. In addition, the flow path 390 and the flow path 315 are respectively an example of the "third flow path" and the "fourth flow path" of the present disclosure.

[0048] Specifically, the flow path 370 connects the hole 241b of the condensing portion 241 to the upstream HT radiator 321. The flow path 380 branches from the flow path 325 connecting the upstream HT radiator 321 to the downstream HT radiator 322 and connects to the hole 241a of the condensing portion 241. The flow path 390 connects the hole 243a of the supercooling portion 243 to the downstream HT radiator 322.

[0049] The flow path 315 connects a portion 370a of the flow path 370 and a portion 390a of the flow path 390. The three-way valve 330 is provided in the portion 370a. The heater core 310 is provided in the flow path 315.

[0050] The three-way valve 330 has holes P11 to P13. Hole P11 is an inlet hole for the coolant from the condensation section 241 to flow in. Hole P12 is an outlet hole for the coolant to flow out to the flow path 315 toward the heater core 310. Hole P13 is an outlet hole for the coolant to flow out toward the upstream HT radiator 321. In addition, holes P11 and P13 are respectively connected to the flow path 370. Hole P12 is connected to the flow path 315. The opening and closing states of the holes P11 to P13 in the three-way valve 330 are controlled by the ECU 20. By switching the opening and closing states of the holes P11 to P13, the flow path of the coolant in the heat dissipation circuit 300 is switched.

[0051] The water pump 360 is provided between the three-way valve 330 and the condensation part 241 on the flow path 370. The valve 340 is provided on the flow path 380. The check valve 350 is provided on the flow path 390. Specifically, the check valve 350 is provided between the downstream side HT radiator 322 and the portion 390a. The check valve 350 restricts the flow of the coolant from the portion 390a to the downstream side HT radiator 322 side.

[0052] Figure 3 This is an example of a case where the holes P11 and P13 are in an open state and the hole P12 is in a closed state. In this case, the coolant in the heat dissipation circuit 300 flows through a first path of the water pump 360-three-way valve 330-upstream HT radiator 321-downstream HT radiator 322-check valve 350-supercooling section 243-circulation pipe 244-condensation section 241-water pump 360 and a second path of the water pump 360-three-way valve 330-upstream HT radiator 321-valve 340-condensation section 241-water pump 360.

[0053] Thus, the coolant flowing in the first path flows into the supercooling section 243 after being cooled by both the upstream HT radiator 321 and the downstream HT radiator 322. As a result, the coolant cooled to a relatively low temperature exchanges heat with the cooling medium of the refrigeration cycle 200 in the supercooling section 243. As a result, the cooling medium can be cooled more effectively in the supercooling section 243. In addition, the temperature of the cooling medium in the supercooling section 243 changes by exchanging heat with the coolant.

[0054] In addition, the coolant flowing in the second path is different from the first path, and does not flow into the condensation section 241 through the downstream HT radiator 322 and the supercooling section 243. As a result, the flow resistance of the coolant can be reduced compared to the first path, so the flow rate (flow momentum, flow rate) of the coolant flowing into the condensation section 241 can be relatively high. Thus, the condensation heat generated by the change of the cooling medium from gas to liquid in the condensation section 241 can suppress the temperature rise of the coolant. As a result, the heat exchange efficiency between the coolant in the condensation section 241 and the cooling medium can be relatively high. In addition, since the flow rate of the coolant flowing into the condensation section 241 can be easily increased, the water pump 360 can be miniaturized.

[0055] Figure 4 Indicates the second circulation mode of the coolant in the heat dissipation circuit 300. At this time, the hole P13 in the three-way valve 330 is in a closed state, and the holes P11 and P12 are in an open state. In this case, the coolant in the heat dissipation circuit 300 circulates in the path of the water pump 360-three-way valve 330-heater core 310-supercooling part 243-circulation pipe 244-condensation part 241-water pump 360. In addition, the check valve 350 is used to restrict the coolant circulating in the heater core 310 from flowing to the downstream side HT radiator 322 side.

[0056] Thus, when the coolant heated by heat exchange in the water-cooled condenser 240 passes through the heater core 310, the heat of the coolant is used for heating. In addition, the cooling water cooled by heat exchange in the heater core 310 flows from the supercooling portion 243 into the water-cooled condenser 240. Thus, heat exchange is performed in the supercooling portion 243 and the condensing portion 241, respectively, so that the heat exchange amount (heat dissipation amount of the cooling medium) can be increased compared to the case where the cooling water flows from the condensing portion 241 into the water-cooled condenser 240.

[0057] Figure 5 3 is a diagram showing a third flow pattern of the coolant in the heat dissipation circuit 300. At this time, the ports P11 to P13 in the three-way valve 330 are in an open state.

[0058] Here, the three-way valve 330 is preferably capable of adjusting the opening of each of the hole P12 and the hole P13. In this case, the ratio of the flow rate of the cooling water flowing from the three-way valve 330 to the upstream HT radiator 321 and the flow rate of the cooling water flowing from the three-way valve 330 to the heater core 310 can be adjusted. Thus, the cooling efficiency of the coolant based on the radiator part 320 and the heating efficiency based on the heater core 310 can be adjusted respectively. In addition, the opening of each of the hole P12 and the hole P13 is adjusted by the ECU 20.

[0059] In addition, the valve 340 is preferably capable of adjusting the flow rate of the cooling water passing through the valve 340. Specifically, the valve 340 may be capable of adjusting the diameter of the flow path (e.g., the opening degree of the opening) through which the cooling water flows. Thus, the flow rate of the coolant flowing from the upstream HT radiator 321 to the valve 340 is adjusted, and thus the flow rate of the cooling water flowing from the upstream HT radiator 321 to the downstream HT radiator 322 can be adjusted. In addition, the flow rate of the cooling water passing through the valve 340 is adjusted by the ECU 20.

[0060] Refer again Figure 2 , the downstream HT radiator 322 is arranged at a position upstream of the upstream HT radiator 321 in the flow direction of the outside air flowing into the radiator portion 320. Specifically, the outside air flows into the vehicle from the grille 2a provided at the front end of the electric vehicle 2. Therefore, the downstream HT radiator 322 is arranged at a position forward of the upstream HT radiator 321 in the front-rear direction of the electric vehicle 2. In addition, when viewed from the front of the electric vehicle 2, the downstream HT radiator 322 may be arranged at a position where at least a portion does not overlap with the upstream HT radiator 321. Thus, it is possible to suppress the outside air warmed by the downstream HT radiator 322 from passing through the upstream HT radiator 321.

[0061] Figure 6 2 is a diagram showing the detailed structure of the water-cooled condenser 240. Figure 6 In FIG. 1 , the flow of the coolant in the heat radiation circuit 300 is indicated by the dotted arrows. In addition, the flow of the cooling medium in the refrigeration cycle 200 is indicated by the solid arrows.

[0062] like Figure 6 As shown, the condensing section 241 and the supercooling section 243 are arranged in a mutually stacked manner. In addition, the water-cooled condenser 240 has a circulation pipe 245 and a circulation pipe 246. The circulation pipe 245 connects the condensing section 241 with the storage tank 242. The cooling medium flowing into the condensing section 241 from the hole 241c flows into the storage tank 242 through the circulation pipe 245. The circulation pipe 246 connects the supercooling section 243 with the storage tank 242. The cooling medium flowing into the storage tank 242 through the circulation pipe 245 flows into the supercooling section 243 through the circulation pipe 246. The cooling medium flowing into the supercooling section 243 through the circulation pipe 246 flows out from the supercooling section 243 through the hole 243b.

[0063] As described above, in the present embodiment, the flow path 370 connects the hole 241b of the condensation section 241 to the upstream HT radiator 321, the flow path 380 branches from the flow path 325 and connects to the hole 241a of the condensation section 241, and the flow path 390 connects the hole 243a of the supercooling section 243 to the downstream HT radiator 322. Thus, the flow rate of the coolant flowing into the condensation section 241 through the flow path 380 can be made relatively large. In addition, the temperature of the coolant flowing into the supercooling section 243 through the flow path 390 can be made relatively low. As a result, the amount of heat exchange (the amount of heat dissipated by the cooling medium) between the coolant in the condensation section 241 and the supercooling section 243 can be increased. As a result, the battery 110 can be efficiently cooled using the cooling medium after heat dissipation.

[0064] Figure 7 The water-cooled condenser 240A shown is different from the structure of the water-cooled condenser 240 in that a flow path 247 is included instead of the flow pipe 244 of the water-cooled condenser 240. The flow path 247 connects the supercooling portion 243 to the flow path 370. Specifically, the flow path 247 connects the flow path between the condensing portion 241 and the water pump 360 to the supercooling portion 243. The coolant of the heat dissipation circuit 300 flows from the supercooling portion 243 to the flow path 370 through the flow path 247. In this structure, the coolant flowing from the three-way valve 330 to the heater core 310 does not pass through the condensing portion 241, but flows into the flow path 370 through the flow path 247.

[0065] exist Figure 8 In the example shown, the three-way valve 330A is arranged in the portion 390a of the flow path 390 instead of the three-way valve 330. In addition, the valve 340A is arranged in the flow path between the portion 370a of the flow path 370 and the upstream HT radiator 321 instead of the valve 340. The three-way valve 330A and the valve 340A have the same structure as the three-way valve 330 and the valve 340, respectively. In this structure, when the valve 340A is set to the closed state and only the hole P13 of the three-way valve 330A is set to the closed state, the coolant circulates in the path of the water pump 360-heater core 310-three-way valve 330A-supercooling part 243-condensing part 241-water pump 360. In addition, when the valve 340A is set to an open state and only the hole P12 of the three-way valve 330A is set to a closed state, the coolant flows in a first path of the water pump 360-valve 340A-upstream HT radiator 321-downstream HT radiator 322-three-way valve 330A-supercooling section 243-circulation pipe 244-condensation section 241-water pump 360 and a second path of the water pump 360-valve 340A-upstream HT radiator 321-condensation section 241-water pump 360. The three-way valve 330A and the valve 340A are examples of the “second valve” and the “first valve” of the present disclosure, respectively.

[0066] exist Fig. 9In the example shown, the heater core 310 is provided in the flow path 315A connecting the portion 370a of the flow path 370 and the portion 380a of the flow path 380, which is different from the above-mentioned embodiment. Fig. 9 In the example shown, a check valve 350A is disposed between the flow path 325 and the portion 380a instead of the check valve 350. The check valve 350A restricts the coolant flowing from the three-way valve 330 to the heater core 310 from flowing toward the flow path 325 side. In this structure, the coolant flowing from the three-way valve 330 to the heater core 310 does not flow through the supercooling portion 243 but flows into the condensing portion 241. In addition, the flow path 315A and the check valve 350A are examples of the "fourth flow path" and the "second valve" of the present disclosure, respectively.

[0067] Fig.10 yes Fig. 9 A modification of the example shown. Fig.10 In the example shown, in the flow path 370, a valve 340A is arranged between the portion 370a and the upstream HT radiator 321. In addition, the three-way valve 330A is arranged at the portion 380a of the flow path 380. When the valve 340A is set to a closed state and only the hole P13 of the three-way valve 330A is set to a closed state, the coolant flows in the path of the water pump 360-heater core 310-three-way valve 330-condensation unit 241-water pump 360. In addition, when the valve 340A is set to an open state and only the hole P12 of the three-way valve 330A is set to a closed state, the coolant flows in the first path of the water pump 360-valve 340A-upstream HT radiator 321-downstream HT radiator 322-supercooling section 243-circulation pipe 244-condensation section 241-water pump 360 and the second path of the water pump 360-valve 340A-upstream HT radiator 321-three-way valve 330A-condensation section 241-water pump 360.

[0068] Fig.11 The difference from the above-mentioned embodiment is that a five-way valve 600 is provided to replace the three-way valve 330 and the valve 340. The five-way valve 600 has a structure in which the three-way valve 330 and the valve 340 are formed integrally. The five-way valve 600 has holes P21 to P25. The hole P21 is an inlet hole for the coolant from the condensation section 241 (water pump 360) to flow in. The hole P22 is an outlet hole for the coolant to flow out to the flow path 315 toward the heater core 310. The hole P23 is an outlet hole for the coolant to flow out to the flow path 370 toward the upstream HT radiator 321. The hole P24 is an inlet hole for the coolant (coolant from the upstream HT radiator 321) flowing in the flow path 380 to flow in. The hole P25 is an outlet hole for the coolant to flow out to the flow path 380 toward the condensation section 241. In addition, the five-way valve 600 has both the function of the "first valve" and the function of the "second valve" disclosed in the present invention.

[0069] FIG. 12A to FIG. 12E is a diagram showing the detailed structure of the five-way valve 600. FIG. 12A to FIG. 12E As shown, the five-way valve 600 includes a main body 610, a valve core 620 and a valve core 630. The main body 610 is connected from hole P21 to P25, and accommodates the valve core 620 and the valve core 630. With the main body 610 as the center, the holes P21, P22, P25, P24, and P23 are arranged clockwise. The valve core 620 and the valve core 630 rotate integrally in the main body 610. As a result, the holes (P21 to P25) blocked by the valve core 620 and the valve core 630 change. As a result, the flow path of the coolant is switched. The rotation angle of the valve core 620 and the valve core 630 can be controlled by the ECU 20 at predetermined angles (for example, 1 degree).

[0070] In addition, the valve core 620 and the valve core 630 each have a fan-shaped shape. The valve core 620 and the valve core 630 are arranged opposite to each other in a state where the front ends of each other overlap. As a result, the internal space of the main body 610 is divided into two spaces by the valve core 620 and the valve core 630. In addition, the central angle θ1 of the valve core 620 is smaller than the central angle θ2 of the valve core 630.

[0071] Fig. 12A 2 is a diagram showing the state of the five-way valve 600 when heat is supplied to the heater core 310. Fig. 12A In the illustrated example, the port P23 is blocked by the valve core 620, and the port P25 is blocked by the valve core 630. The coolant flowing into the five-way valve 600 from the port P21 flows out toward the heater core 310 side from the port P22.

[0072] Fig. 12B and Fig. 12C 2 is a diagram showing the state of the five-way valve 600 when heat is supplied to the radiator. Fig. 12B In the example shown, the hole P22 is blocked by the valve core 630. The coolant flowing into the five-way valve 600 from the hole P21 flows out from the hole P23 to the upstream HT radiator 321. In addition, the coolant flowing into the five-way valve 600 from the hole P24 flows out from the hole P25 to the water-cooled condenser 240 (condensation unit 241).

[0073] exist Fig. 12C In the example shown, the hole P22 is blocked by the valve core 630, and a portion of the hole P24 is blocked by the valve core 620. As a result, the flow rate of the coolant flowing from the hole P24 to the hole P25 is the same as that of the hole P25. Fig. 12B The situation is limited compared to the previous one.

[0074] Fig.12D as well as Fig.12E 2 is a diagram showing the state of the five-way valve 600 when heat is supplied to the heater core 310 and the radiator. Fig.12D In the example shown, the hole P25 is blocked by the valve core 630. The coolant flowing into the five-way valve 600 from the hole P21 flows out of the five-way valve 600 through the hole P23 and the hole P22, respectively.

[0075] exist Fig.12E In the example shown, the hole P25 is blocked by the valve core 630, and a part of the hole P23 is blocked by the valve core 620. As a result, the flow rate of the coolant flowing from the hole P21 to the hole P23 is reduced compared to the flow rate of the coolant flowing from the hole P21 to the hole P23. Fig.12D situation is restricted.

[0076] In the above embodiment, the thermal management circuit 10 is mounted in the electric vehicle 2 , but the present disclosure is not limited thereto. The thermal management circuit 10 may be mounted in electrical equipment other than the electric vehicle (eg, a stationary power storage device).

[0077] In the above embodiment, an example is shown in which the battery 110 is cooled by the coolant that exchanges heat with the cooling medium in the refrigeration cycle 200 and the cooler 210, but the present disclosure is not limited thereto. The coolant that exchanges heat with the cooling medium in the cooler 210 may be used to cool a device other than the battery 110 (e.g., the eAxle 410 and the engine, etc.) instead of the battery 110.

[0078] In the above embodiment, the example in which the heater core 310 is provided in the heat dissipation circuit 300 is shown, but the present disclosure is not limited thereto. The heater core 310 (and the flow path 315 ) may not be provided in the heat dissipation circuit 300 . In this case, the check valve 350 may not be provided in the flow path 390 .

[0079] In the above embodiment, an example in which the valve 340 is provided in the flow path 380 is shown, but the present disclosure is not limited thereto. The valve 340 may not be provided in the flow path 380 .

[0080] In the above embodiment, an example is shown in which the downstream HT radiator 322 is arranged in front of the upstream HT radiator 321 in the front-rear direction of the electric vehicle 2, but the present disclosure is not limited to this. The positional relationship between the downstream HT radiator 322 and the upstream HT radiator 321 is not limited to the example of the above embodiment. For example, the downstream HT radiator 322 and the upstream HT radiator 321 may also be arranged in a row in the left-right direction of the electric vehicle 2. In other words, the downstream HT radiator 322 and the upstream HT radiator 321 may also be arranged in a row in a direction intersecting (orthogonal) with the flow direction of the wind flowing into the radiator portion 320.

[0081] in addition, Figures 7 to 12E The structures of the modified examples of the above-described embodiment may be combined with each other.

[0082] The embodiments disclosed this time should be considered as illustrative in all aspects and not restrictive. The scope of the present disclosure is indicated by the claims rather than the description of the embodiments described above, and is intended to include all modifications within the meaning and scope equivalent to the claims.

Claims

1. A thermal management circuit, mounted on an electrical device, wherein: The thermal management circuit has: A first circuit for circulating a cooling liquid, wherein the cooling liquid exchanges heat with a device to be cooled, that is, a cooling target device; A refrigeration cycle, comprising a cooler and a water-cooled condenser, and for circulating a cooling medium, wherein the cooling medium exchanges heat with the cooling liquid circulating in the first circuit in the cooler; and The second circuit includes a radiator portion and is provided with a cooling liquid for circulation. The cooling liquid exchanges heat with a cooling medium circulating in the refrigeration cycle in the water-cooled condenser. The second circuit includes a first flow path, a second flow path and a third flow path respectively connected to the water-cooled condenser. The water-cooled condenser comprises a condensing part and a supercooling part. The radiator unit includes an upstream radiator and a downstream radiator connected in series with each other in the second circuit. The first flow path connects the outlet hole of the coolant in the condensation unit to the upstream radiator. The second flow path is branched from the flow path connecting the upstream radiator and the downstream radiator, and is connected to the inlet hole of the coolant in the condensation part. The third flow path connects the coolant inlet hole in the supercooling portion and the downstream radiator.

2. The thermal management circuit according to claim 1, wherein: The downstream radiator is disposed upstream of the upstream radiator in a flow direction of outside air flowing into the radiator portion.

3. The thermal management circuit according to claim 1 or 2, wherein: The second circuit comprises: a fourth flow path, connecting the first flow path with the second flow path or the third flow path; a heater core, disposed in the fourth flow path; and a first valve, disposed in the first flow path, The first valve is configured to be able to adjust a flow rate of the cooling water flowing to the upstream radiator and a flow rate of the cooling water flowing to the heater core.

4. The thermal management circuit according to claim 3, wherein: The second circuit includes a second valve capable of adjusting a flow rate of cooling water flowing from the upstream radiator to the downstream radiator.

5. The thermal management circuit according to claim 4, wherein: The second valve is formed integrally with the first valve.

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