Electronic component conveying device and electronic component measuring device

Abstract

The invention provides a conveying device for an electronic component and a measuring device for the electronic component, which can restrain adhesion of abrasion powder when the electronic component is conveyed. A transport body (10), which is provided with a plurality of cavities (11) penetrating from a first main surface (10a) to a second main surface and accommodating electronic components (40), and which transports the electronic components (40) accommodated in the cavities (11) by being driven in parallel with a transport surface (20a) facing the second main surface, is provided with: a sliding part which is in contact with the transport surface (20a) and slides with the transport surface (20a) when the transport body (10) is driven; and a groove part (14) which is separated from the conveying surface (20a) and does not slide with the conveying surface (20a) when the conveying body (10) is driven. And a groove section (14) that communicates with the opening on the second main surface (10b) side of the at least one cavity (11) and that is provided along the drive direction (Y1) of the transport body.

Description

[0001] This application is a divisional application of the application with application number "202111513856.5", application date December 10, 2021, and invention name "Conveying body, conveying device for electronic components, and measuring device for electronic components". Technical Field

[0002] The present invention relates to a transport body for transporting electronic components, an electronic component transport device including the transport body, and an electronic component measuring device including the electronic component transport device. Background Art

[0003] There is known an electronic component conveying device that conveys the electronic component by driving the conveying body in a state where a cavity provided in the conveying body accommodates the electronic component.

[0004] As one of such electronic component conveying devices, Patent Document 1 discloses a conveying device comprising: a conveying table having a conveying surface; and a turntable as a conveying body, which is disposed opposite to the conveying surface. The conveying device is configured such that a cavity is formed so as to penetrate through two main surfaces of the turntable, and when the cavity contains the electronic component, the turntable rotates so as to slide on the conveying surface of the conveying table, thereby conveying the electronic component in the rotation direction.

[0005] Prior Art Literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2007-45597

[0008] However, in the conveying device described in Patent Document 1, when the turntable rotates, the conveying table and the turntable rub against each other to generate fine abrasion powder, which may adhere to the electronic components. If the abrasion powder adheres to the electronic components, for example, measurement errors may occur during electrical property measurement and the components may be judged as defective. Summary of the invention

[0009] Problems to be solved by the invention

[0010] The present invention is designed to solve the above-mentioned problems, and an object of the present invention is to provide a conveying body capable of suppressing adhesion of abrasion powder when conveying electronic components, an electronic component conveying device having such a conveying body, and an electronic component measuring device having such an electronic component conveying device.

[0011] Means for solving problems

[0012] The conveyor of the present invention is provided with a plurality of cavities penetrating from the first main surface to the second main surface and accommodating electronic components, and is driven parallel to the conveying surface facing the second main surface, thereby conveying the electronic components accommodated in the cavities.

[0013] The conveyor is characterized in that it has:

[0014] a sliding portion, which contacts the conveying surface and slides with the conveying surface when the conveying body is driven; and

[0015] The groove is separated from the conveying surface, and does not slide on the conveying surface when the conveying body is driven.

[0016] The through groove portion communicates with at least one opening on the second main surface side of the cavity, and is provided along the driving direction of the transport body.

[0017] The electronic component conveying device of the present invention is characterized by comprising:

[0018] The above-mentioned conveying body;

[0019] a base member having the conveying surface; and

[0020] The driving unit drives the conveying body in parallel with the conveying surface, thereby conveying the electronic component accommodated in the cavity.

[0021] The electronic component measuring device of the present invention is characterized by comprising:

[0022] The above-mentioned electronic component conveying device; and

[0023] The measuring terminal is provided on the conveying surface side of the base member and is in contact with the electronic component to measure the electrical characteristics of the electronic component.

[0024] Effects of the Invention

[0025] According to the conveying body of the present invention, the through groove portion that is separated from the conveying surface and does not slide with the conveying surface when the conveying body is driven is connected to the opening on the second main surface side of at least one cavity and is arranged along the driving direction of the conveying body, so that when the conveying body is driven, the generation of abrasive powder caused by the contact between the conveying body and the conveying surface can be suppressed. Therefore, when the electronic component contained in the cavity is conveyed, the adhesion of abrasive powder to the electronic component can be suppressed.

[0026] According to the electronic component conveying device of the present invention, the conveying body is provided with the above-mentioned passing groove, so when the conveying body is driven, the generation of abrasion powder caused by the contact between the conveying body and the conveying surface can be suppressed. Therefore, when the electronic components contained in the cavity are conveyed, the adhesion of abrasion powder to the electronic components can be suppressed.

[0027] According to the electronic component measuring device of the present invention, when the electronic component is conveyed by the electronic component conveying device, adhesion of abrasion powder to the electronic component can be suppressed as described above, thereby suppressing the occurrence of measurement errors caused by adhesion of abrasion powder and improving the measurement accuracy of the electrical characteristics of the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a plan view schematically showing the structure of the electronic component conveyance device in the first embodiment.

[0029] Figure 2 It is a schematic diagram showing Figure 1 The electronic component conveying device shown is a cross-sectional view of the structure when cut along the II-II line.

[0030] Figure 3 It is a perspective view schematically showing the appearance of a multilayer ceramic capacitor as an example of an electronic component.

[0031] Figure 4 This is a partially enlarged view of the second main surface side of the transport body.

[0032] Figure 5 Yes Figure 4 The transport body shown is a cross-sectional view taken along line VV.

[0033] Figure 6 Yes Figure 4 The transport body shown is a cross-sectional view taken along line VI-VI.

[0034] Figure 7 This is a partially enlarged view of the second main surface side of the transport body in the second embodiment.

[0035] Figure 8 Yes Figure 7 The transport body shown is a cross-sectional view taken along line VIII-VIII.

[0036] Fig. 9 Yes Figure 7 The transport body shown is a cross-sectional view taken along line IX-IX.

[0037] Fig.10 It is a cross-sectional view schematically showing a part of the electronic component measuring device in the third embodiment.

[0038] Fig.11 This is a diagram schematically showing the structure of a conveying device for electronic components whose conveying body is a flat plate.

[0039] Fig.12 This is a diagram schematically showing a configuration of an electronic component conveying device in a case where a conveying body has a cylindrical shape.

[0040] Fig.13 This is a diagram schematically showing a configuration of an electronic component conveying device in a case where a conveyor has a belt-like shape.

[0041] Description of Reference Numerals

[0042] 10, 10C, 10D, 10E, 10X transport body;

[0043] 10a: a first main surface of the conveying body;

[0044] 10b: a second main surface of the conveying body;

[0045] 11 cavity;

[0046] 12 independent suction slot;

[0047] 13 sliding part;

[0048] 14 through the groove;

[0049] 20 base member;

[0050] 20a conveying surface;

[0051] 21 suction trough;

[0052] 22 suction holes;

[0053] 23 Attraction Department;

[0054] 30 driving unit;

[0055] 31 rotation axis;

[0056] 40 electronic components;

[0057] 50 Determination terminal;

[0058] 51 wire;

[0059] 100 Electronic component conveying device;

[0060] 200 Measurement device for electronic components. DETAILED DESCRIPTION

[0061] Embodiments of the present invention are shown below, and features of the present invention are described in detail.

[0062] <First Embodiment>

[0063] Figure 1 It is a plan view schematically showing the structure of the electronic component conveyance device 100 in the first embodiment. Figure 2 It is a schematic diagram showing Figure 1The electronic component conveying device 100 shown is a cross-sectional view of the structure when it is cut along the II-II line.

[0064] The electronic component conveying device 100 includes a conveying body 10, a base member 20, and a driving unit 30. The conveying body 10 is provided with a plurality of cavities 11 penetrating from a first main surface 10a to a second main surface 10b and accommodating electronic components 40, and is driven parallel to a conveying surface 20a of the base member 20 facing the second main surface 10b, thereby conveying the electronic components 40 accommodated in the cavities 11.

[0065] The electronic component 40 to be transported is, for example, Figure 3 A multilayer ceramic capacitor as shown. Figure 3 The illustrated multilayer ceramic capacitor has a rectangular shape as a whole, and has a pair of external electrodes 41a, 41b on the surface. The dimension of the multilayer ceramic capacitor in the length direction L is, for example, greater than 0.1 mm and less than 7 mm, the dimension in the width direction W is, for example, greater than 0.1 mm and less than 5 mm, and the dimension in the thickness direction T is, for example, greater than 0.01 mm and less than 4 mm. However, the electronic component 40 is not limited to a multilayer ceramic capacitor, and may also be a coil or a multilayer substrate, etc.

[0066] In the present embodiment, the conveyance body 10 is a disk-shaped turntable, and the base member 20 is a disk-shaped table. The conveyance body 10 is placed on a conveyance surface 20 a which is one main surface of the base member 20 .

[0067] The conveyor 10 is made of, for example, glass, ceramics such as zirconia, resin, etc. The thickness of the conveyor 10 is, for example, not less than 0.1 mm and not more than 10 mm.

[0068] As described above, the transport body 10 is provided with a plurality of cavities 11 penetrating from the first main surface 10a to the second main surface 10b. One electronic component 40 is accommodated in one cavity 11.

[0069] In this embodiment, a plurality of cavities 11 are provided in the circumferential direction and the radial direction. That is, the plurality of cavities 11 are arranged in a concentric circle shape. Figure 1 In the figure, only the cavities 11 arranged in the circumferential direction are shown, but in fact, they are also arranged in the radial direction. However, the arrangement of the cavities 11 is not limited to the above arrangement, for example, multiple cavities 11 may not be arranged in the radial direction, but only arranged in the circumferential direction.

[0070] In this embodiment, the shape of the cavity 11 when viewed in a direction perpendicular to the first main surface 10a of the conveyor 10 is rectangular. Since the shape of the cavity 11 is rectangular, Figure 1 as well as Figure 2As shown, when the electronic component 40 having a rectangular parallelepiped shape is accommodated in the cavity for transportation, the electronic component 40 can be held at the corner of the cavity 11 for transportation. However, the shape of the cavity 11 when viewed in a direction perpendicular to the first main surface 10a of the transport body 10 is not limited to a rectangle, but may also be a circle. In addition, the cavity 11 may also have a tapered shape in which the size of the hole gradually increases from the second main surface 10b side toward the first main surface 10a side.

[0071] The cavity 11 has a size such that, when the electronic component 40 is accommodated, a gap, for example, a gap of 0.05 mm or more is formed between the electronic component 40 and the side wall constituting the cavity 11 .

[0072] There is no particular limitation on the method of supplying the electronic component 40 to the cavity 11 of the conveyor 10. For example, the electronic component 40 is supplied to the cavity 11 of the conveyor 10 by a vibration feeder.

[0073] like Figure 2 As shown, a rotating shaft 31 is installed in the central part of the conveyor 10. The rotating shaft 31 passes through the base member 20 and is connected to the driving unit 30. The driving unit 30 drives the conveyor 10 parallel to the conveying surface 20a of the base member 20, thereby conveying the electronic components 40 accommodated in the cavity 11, and is, for example, a motor. In this embodiment, the conveyor 10 is driven in a rotation direction centered on the rotating shaft 31 by the driving unit 30. As a result, the conveyor 10 rotates so as to slide on the conveying surface 20a of the base member 20.

[0074] The conveyor 10 may be driven continuously or intermittently. The rotation speed when the conveyor 10 is driven in the rotation direction is, for example, 1 rpm or more and 100 rpm or less.

[0075] On the conveying surface 20a side of the base member 20, a suction groove 21 is provided in an annular shape. In addition, on the back side 20b of the base member 20 opposite to the conveying surface 20a, a suction hole 22 connected to the suction groove 21 is provided. In the present embodiment, the suction holes 22 are provided at two locations opposite to the suction groove 21. The suction holes 22 are connected to the suction part 23. The suction part 23 is used to suck the electronic component 40 accommodated in the cavity 11, and is, for example, a suction pump. In addition, Figure 2 In FIG. 1 , a structure in which two suction portions 23 are provided corresponding to two suction holes 22 is shown, but a structure in which one suction portion 23 is connected to two suction holes 22 may also be used.

[0076] The groove width of the suction groove 21 is, for example, 0.01 mm or more. The depth of the suction groove 21 is, for example, 0.01 mm or more. The suction pressure generated by the suction portion 23 is, for example, -100 kPa or more and less than 0 kPa.

[0077] On the second main surface 10b side of the conveyor 10, an independent suction groove portion 12 is independently provided for each of the plurality of cavities 11. The independent suction groove portion 12 connects the suction portion 23 provided on the base member 20 and the opening on the second main surface 10b side of the cavity 11. That is, the cavity 11 of the conveyor 10 is not opposed to the suction groove 21 of the base member 20, but a part of the independent suction groove portion 12 is opposed to the suction groove 21 of the base member 20. With such a structure, a suction path is formed that connects from the suction portion 23 provided on the base member 20 to the opening on the second main surface 10b side of the cavity 11 via the suction hole 22, the suction groove 21, and the independent suction groove portion 12. Therefore, when suction is performed by the suction portion 23, the electronic component 40 accommodated in the cavity 11 is sucked via the suction hole 22, the suction groove 21, and the independent suction groove portion 12. As a result, the electronic component 40 is held at a position on the independent suction groove portion 12 side in the cavity 11.

[0078] Figure 4 It is a partially enlarged view of the second main surface 10 b side of the transport body 10 . Figure 5 Yes Figure 4 The transport body 10 shown is a cross-sectional view taken along line VV. Figure 6 Yes Figure 4 The transport body 10 is shown in a cross-sectional view when cut along the line VI-VI. Figure 4 as well as Figure 5 In FIG. 1 , the direction of arrow Y1 is the rotation direction of the conveying body 10 , that is, the circumferential direction.

[0079] like Figure 4 As shown, the independent suction groove 12 is arranged to extend in the radial direction. The groove width of the independent suction groove 12 is, for example, 0.01 mm or more and less than the interval between the cavities 11 adjacent in the circumferential direction. In addition, the depth of the independent suction groove 12 is, for example, 0.01 mm or more and less than 0.1 mm shorter than the thickness of the conveying body 10.

[0080] The conveying body 10 includes a sliding portion 13 ( Figure 2 , Figure 6 ), in contact with the conveying surface 20a, and sliding with the conveying surface 20a when the conveying body 10 is driven; and through the groove portion 14 ( Figure 4 , Figure 5 ), separated from the conveying surface 20a, and does not slide with the conveying surface 20a when the conveying body 10 is driven.

[0081] The through groove 14 is connected to the opening on the second main surface 10b side of at least one cavity 11, and is provided along the driving direction of the conveying body 10. In the present embodiment, the conveying body 10 having a disc-like shape is driven in the rotational direction, so the through groove 14 is provided in an annular shape passing through the cavities 11 arranged in the circumferential direction. In addition, in the present embodiment, the through groove 14 is connected to the opening on the second main surface 10b side of all the cavities 11 arranged in the circumferential direction, but it may be provided as follows, that is, a part of the through groove 14 in the annular shape is interrupted and is not connected to a part of the cavities 11 arranged in the circumferential direction.

[0082] The width of the groove 14 is, for example, 0.01 mm or more and equal to or less than the width of the portion of the cavity 11 communicating with the groove 14. The depth of the groove 14 is, for example, 0.01 mm or more and equal to or less than 0.1 mm shorter than the thickness of the conveyor 10.

[0083] Regarding the conveyor 10 in the present embodiment, since the through groove 14 that does not slide with the conveying surface 20a of the base member 20 when the conveyor 10 is driven is connected to the opening on the second main surface 10b side of at least one cavity 11 and is arranged along the driving direction of the conveyor 10, compared with a structure without the through groove 14, when the conveyor 10 is driven, the generation of wear powder caused by the contact between the conveyor 10 and the conveying surface 20a of the base member 20 can be suppressed. As a result, when the electronic component 40 accommodated in the cavity 11 is transported, the adhesion of wear powder to the electronic component 40 can be suppressed. At this time, if the through groove 14 is set in an annular shape as in the present embodiment, the generation of wear powder can be suppressed throughout all the cavities 11 arranged in the circumferential direction, so the effect of suppressing the adhesion of wear powder to the electronic component 40 is strong. On the other hand, when a portion of the annular groove 14 is interrupted and not connected to a portion of the cavities 11 arranged in the circumferential direction, wear powder may be slightly generated in the portion where the groove 14 is interrupted, but this has a suppressive effect to some extent.

[0084] In addition, an independent suction groove portion 12 is independently provided for each of the plurality of cavities 11, and is not directly connected to the groove portion 14 but is connected via the cavity 11, so that the electronic component 40 accommodated in the cavity 11 can be reliably sucked in a stable state by suction performed by the suction portion 23. In addition, by pre-adjusting the position where the opening on the second main surface 10b side of the cavity 11 communicates with the independent suction groove portion 12, the position where the electronic component 40 is sucked and held in the cavity 11 can be controlled.

[0085] <Second Embodiment>

[0086] In the transport body 10 of the first embodiment, the independent suction groove portion 12 that communicates the suction portion 23 provided on the transport surface 20 a side with the opening on the second main surface 10 b side of the cavity 11 is provided for each of the plurality of cavities 11 .

[0087] In contrast, in the transport body 10X of the second embodiment, the independent suction groove 12 is not provided, and the suction portion 23 provided on the transport surface 20 a side and the opening on the second main surface 10 b side of the cavity 11 are communicated with each other by the through groove 14 .

[0088] Figure 7 It is a partial enlarged view of the second main surface 10b side of the transport body 10X in the second embodiment. Figure 8 Yes Figure 7 The transport body 10X shown is a cross-sectional view taken along line VIII-VIII. Fig. 9 Yes Figure 7 The transport body 10X shown is a cross-sectional view taken along line IX-IX.

[0089] In the present embodiment, the groove portion 14 is also provided in an annular shape along the circumferential direction, which is the driving direction of the conveying body 10X. Figure 7 As shown, the cavity 11 of the conveying body 10X is located within the groove width passing through the groove portion 14. Fig. 9 As shown, a portion of the groove portion 14 is opposed to the suction groove 21 of the base member 20 .

[0090] That is, the through groove 14 in the present embodiment has a groove width that allows the suction portion 23 provided on the conveying surface 20a side of the base member 20 to communicate with the opening on the second main surface 10b side of the cavity 11. The groove width of the through groove 14 is, for example, not less than 0.01 mm and not more than the interval between the cavities 11 adjacent in the radial direction. With such a structure, a suction path is formed that connects from the suction portion 23 provided on the base member 20 to the opening on the second main surface 10b side of the cavity 11 via the suction hole 22, the suction groove 21, and the through groove 14 of the conveying body 10. Therefore, if suction is performed by the suction portion 23, the electronic component 40 accommodated in the cavity 11 is sucked via the suction hole 22, the suction groove 21, and the through groove 14 of the conveying body 10.

[0091] The conveyor 10X in the second embodiment is also provided with the passing groove 14 which is separated from the conveying surface 20a of the base member 20 and does not slide on the conveying surface 20a when the conveyor 10 is driven, similarly to the conveyor 10 in the first embodiment, so that the generation of abrasion powder caused by the contact between the conveyor 10X and the conveying surface 20a of the base member 20 can be suppressed. Thus, when the electronic component 40 accommodated in the cavity 11 is conveyed, the adhesion of abrasion powder to the electronic component 40 can be suppressed.

[0092] Furthermore, since it is not necessary to provide the independent suction groove portion 12 for each cavity 11 as in the conveying body 10 in the first embodiment, processing becomes easy when manufacturing the conveying body 10X, and the manufacturing cost can be reduced.

[0093] <Third Embodiment>

[0094] The electronic component conveying device 100 described above can be used as an electronic component measuring device that measures the electrical characteristics of the electronic component 40 .

[0095] Fig.10 1 is a cross-sectional view schematically showing a part of the electronic component measuring device 200 in the third embodiment. The electronic component measuring device 200 in the third embodiment includes the electronic component conveying device 100 and the measuring terminal 50 in the first embodiment. However, the electronic component conveying device 100X in the second embodiment may be provided instead of the electronic component conveying device 100 in the first embodiment.

[0096] The measuring terminal 50 is arranged on the conveying surface 20a side of the base member 20, contacts the electronic component 40, and measures the electrical characteristics of the electronic component 40. The measuring terminal 50 includes, for example, a conductor such as iron or copper. Surface treatment containing a conductive material may also be applied to the surface of the measuring terminal 50. The shape of the contact surface of the measuring terminal 50 in contact with the electronic component 40 can be set to any shape such as a circle or a quadrilateral. The size of the contact surface of the measuring terminal 50 is, for example, greater than 0.01 mm. The so-called size of the contact surface of the measuring terminal 50 refers to the diameter of the circle when the shape of the contact surface is a circle, and refers to the size of one side of the quadrilateral when the shape of the contact surface is a quadrilateral. In addition, when multiple measuring terminals 50 are configured, the size of the contact surface of the measuring terminal 50 needs to be set to a size that does not interfere with the adjacent measuring terminal 50.

[0097] exist Fig.10 In the example shown, a pair of measuring terminals 50 are provided corresponding to a pair of external electrodes 41a, 41b of the electronic component 40. That is, one of the pair of measuring terminals 50 contacts one of the pair of external electrodes 41a, 41b of the electronic component 40, and the other measuring terminal contacts the other external electrode. The measuring terminal 50 provided on the conveying surface 20a side of the base member 20 is provided inside the hole 52 for measuring terminals provided on the base member 20, and the lead wire 51 connected to the measuring terminal 50 is led out to the back surface 20b side opposite to the conveying surface 20a through the inside of the hole 52 for measuring terminals. When the conveyor 10 is driven to rotate, the measuring terminal 50 contacts the electronic component 40 accommodated in the cavity 11, thereby measuring the electrical characteristics of the electronic component 40.

[0098] According to the electronic component measuring device 200 of the present embodiment, when the electronic component 40 is conveyed by the electronic component conveying device 10, the generation of abrasion powder caused by the contact between the conveying body 10 and the conveying surface 20a of the base member 20 can be suppressed, and thus the adhesion of abrasion powder to the electronic component 40 can be suppressed. Therefore, when the measuring terminal 50 contacts the electronic component 40 to measure the electrical characteristics, the generation of measurement errors caused by the adhesion of abrasion powder can be suppressed, and the measurement accuracy of the electrical characteristics of the electronic component 40 can be improved.

[0099] (Example)

[0100] The electrical characteristics of a multilayer ceramic capacitor, which is one of the electronic components 40, were measured using a conventional measuring device for electronic components in which the conveyor 10 is not provided with the through groove 14, and a measuring device 200 for electronic components in this embodiment in which the conveyor 10 is provided with the through groove 14. Here, multiple multilayer ceramic capacitors were used as objects, and the insulation resistance (IR), the dielectric loss tangent (DF) indicating the degree of power loss in the multilayer ceramic capacitor, and the capacitance (C) were measured, and the ratio that could not be measured, that is, the unmeasured rate, was investigated. The measurement results are shown in Table 1.

[0101] [Table 1]

[0102]

[0103] In Table 1, the yield rate represents the ratio excluding the unmeasured rate of IR, the unmeasured rate of DF, and the unmeasured rate of C. As shown in Table 1, when the conventional electronic component measuring device is used, the unmeasured rate of IR, the unmeasured rate of DF, and the unmeasured rate of C are all higher than when the electronic component measuring device in the present embodiment is used, and the yield rate is 48.9%. On the other hand, when the electronic component measuring device 200 in the present embodiment is used, the yield rate is as high as 99.92%.

[0104] That is, according to the electronic component measuring device 200 in this embodiment, as described above, adhesion of abrasion powder is suppressed when the conveyor 10 conveys the electronic component 40, thereby suppressing the occurrence of measurement errors of the electrical characteristics of the electronic component 40 and improving the measurement accuracy of the electrical characteristics.

[0105] In addition, in the conventional electronic component measuring device, if the conveyor is driven until the amount of abrasion powder generated decreases, the adhesion of abrasion powder can be suppressed when the electronic component 40 is conveyed. However, in this case, the conveyor needs to be driven continuously until the amount of abrasion powder generated decreases in a state where the cavity does not contain the electronic component 40, which makes the process complicated.

[0106] On the other hand, according to the conveyance body 10 and the electronic component conveyance device 100 in the present embodiment, even if it is used immediately, the generation of abrasion powder and the adhesion of abrasion powder to the electronic component 40 can be suppressed.

[0107] The present invention is not limited to the above-described embodiment, and various applications and modifications are possible within the scope of the present invention.

[0108] In the above-mentioned embodiment, the conveying body 10, 10X is described as having a disc-like shape, but the shape of the conveying body 10, 10X is not limited to the disc-like shape. Fig.11 As shown, the shape of the conveyor 10C may be a flat plate. When the shape of the conveyor 10C is a flat plate, the conveyor 10C is driven in a direction parallel to the flat plate. The driving speed in this case is, for example, 1 m / s or more and 10 m / s or less.

[0109] In addition, if Fig.12 As shown, the shape of the conveying body 10D may also be a cylindrical shape. Fig.12 The outer peripheral surface of the transport body 10D shown is provided with a plurality of cavities 11. In this case, the transport body 10D is driven to rotate in the circumferential direction.

[0110] In addition, if Fig.13 As shown, the shape of the conveying body 10E may also be a belt-like shape. Fig.13 The transport body 10E shown has the shape of an endless rotating belt, but may also have the shape of a belt with ends.

[0111] The above-mentioned electronic component conveying device 100 can be applied to a characteristic screening device for screening the characteristics of the electronic component 40, an appearance inspection device for inspecting the appearance of the electronic component 40, a processing device for forming external electrodes, leads, etc. of the electronic component 40, a packaging device for packaging the electronic component 40 by winding tape, etc., an assembly and installation device for assembling and installing the electronic component 40, etc., in addition to the electronic component measuring device.

Claims

1. A conveying device for electronic components, characterized in that: have: A conveyor body, provided with a plurality of cavities penetrating from a first main surface to a second main surface and accommodating electronic components, is driven parallel to a conveying surface opposite to the second main surface, thereby conveying the electronic components accommodated in the cavities, the conveyor body comprising: a sliding portion in contact with the conveying surface and sliding with the conveying surface when the conveyor body is driven; and a through groove portion, separated from the conveying surface, not sliding with the conveying surface when the conveying body is driven, the through groove portion being connected to an opening on the second main surface side of at least one of the cavities, and being arranged along the driving direction of the conveying body; as well as a base member having the conveying surface, A suction groove is provided on the conveying surface, The cavity is not opposite to the suction groove, A portion of the through groove portion is opposed to the suction groove, and the through groove portion has a groove width that allows the suction portion provided on the conveying surface side to communicate with the opening on the second main surface side of the cavity through the suction groove. The conveying body has a disc shape, The through groove is arranged in a circular ring shape along the circumferential direction of the conveying body. The cavity of the conveying body is located within the groove width of the through groove portion along the radial direction.

2. The electronic component conveying device according to claim 1, characterized in that: The invention further includes a driving unit configured to drive the conveyance body in parallel with the conveyance surface to convey the electronic component accommodated in the cavity.

3. The electronic component conveying device according to claim 1, characterized in that: The suction portion suctions the electronic component accommodated in the cavity.

4. A measuring device for electronic components, characterized in that: have: The electronic component conveying device according to any one of claims 1 to 3; and The measuring terminal is provided on the conveying surface side of the base member and is in contact with the electronic component to measure the electrical characteristics of the electronic component.

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