An epoxy resin based on thiophene and its derivatives and a preparation method thereof

Abstract

The present invention belongs to the technical field of epoxy resins, and specifically discloses an epoxy resin based on thiophene and its derivatives and a preparation method thereof. The present invention performs an epoxidation reaction on thiophene or a thiophene derivative and an epoxidizing agent to obtain an epoxy resin based on thiophene and its derivatives. The epoxy resin based on thiophene and its derivatives prepared by the present invention has excellent electrical conductivity and mechanical properties, and can avoid the problem that the existing epoxy resin has poor related properties, resulting in limitations in applications in certain high-end fields.

Description

Technical Field

[0001] The present invention relates to the technical field of epoxy resins, and in particular to an epoxy resin based on thiophene and its derivatives and a preparation method thereof. Background Art

[0002] At present, the common epoxy resin materials on the market are mostly used in the fields of coatings, electronic materials, adhesives, composite materials, etc., but their electrical conductivity and mechanical properties are difficult to meet the requirements in some high-end applications. Thiophene compounds have become a potential choice for improving the performance of epoxy resin materials because of their good conjugated structure and electrical conductivity. However, there are no relevant reports on thiophene epoxy resins, and there is no industrial production process for thiophene epoxy resins in the prior art.

[0003] Therefore, how to provide an epoxy resin based on thiophene and its derivatives and a preparation method thereof to improve the conductive properties and mechanical properties of traditional epoxy resins is a difficult problem to be solved urgently in the art. Summary of the invention

[0004] In view of this, the present invention provides an epoxy resin based on thiophene and its derivatives and a preparation method thereof to solve the problem that the existing epoxy resin has poor electrical conductivity and mechanical properties, which limits its application in certain high-end fields.

[0005] In order to achieve the above object, the present invention adopts the following technical solution:

[0006] A method for preparing an epoxy resin based on thiophene and its derivatives comprises the following steps:

[0007] Thiophene or a thiophene derivative is subjected to an epoxidation reaction with an epoxidizing agent to obtain an epoxy resin based on thiophene and its derivatives.

[0008] Preferably, the molar ratio of thiophene or thiophene derivative to the epoxidizing agent is independently 1:0.5-2.

[0009] Preferably, the thiophene derivative includes one or more of thiophene-2-ol, polythiophene, thiophene-3-carboxylic acid and substituted thiophene.

[0010] Preferably, the epoxidizing agent comprises one or more of hydrogen peroxide, epichlorohydrin and epichlorohydrin ester.

[0011] Preferably, the epoxidation reaction temperature is 50 to 90° C., and the epoxidation reaction time is 2 to 8 hours.

[0012] Preferably, the epoxidation reaction is carried out in the presence of a catalyst;

[0013] The catalyst includes a molybdenum-based catalyst and / or a tungsten-based catalyst.

[0014] Preferably, the mass ratio of the catalyst to the epoxidizing agent is 1-10-1000.

[0015] Another object of the present invention is to provide an epoxy resin based on thiophene and its derivatives prepared by the preparation method.

[0016] It can be seen from the above technical solutions that, compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. Excellent conductivity: The conjugated structure of thiophene and its derivatives gives the epoxy resin material good conductivity, making it suitable for electronic packaging, antistatic coatings and conductive coatings.

[0018] 2. High mechanical strength and thermal stability: The prepared epoxy resin achieves high crosslinking density by rationally selecting thiophene derivatives (such as carboxyl or hydroxyl substituted thiophene), thereby improving the mechanical strength and heat resistance of the material to meet the needs of high-temperature equipment, composite materials and structural materials.

[0019] 3. Good processability and fluidity: The preparation method of the present invention can obtain epoxy resins with different viscosity ranges. In particular, when low molecular weight thiophene derivatives (such as methylthiophene and dimethylthiophene) are selected, the prepared epoxy resin has good fluidity and is suitable for various processing requirements such as coatings and adhesives.

[0020] 4. Chemical stability and corrosion resistance: Thiophene-based epoxy resins exhibit excellent chemical stability in acid, alkali, oxidant and other environments. Especially when substituents such as carboxyl or amino groups are introduced, their corrosion resistance can be further enhanced, making them suitable for chemical equipment and protective coatings.

[0021] 5. Environmentally friendly preparation method: The epoxidizing agent such as hydrogen peroxide used in the present invention has water as the main by-product, which reduces the generation of toxic by-products. Compared with the traditional epichlorohydrin method, it has higher environmental protection and meets the requirements of modern green chemical industry.

[0022] 6. Adaptability to a variety of catalyst systems: The catalysts used in the present invention include molybdenum catalysts, tungsten catalysts, etc., which can efficiently promote the epoxidation reaction under mild conditions, achieve higher selectivity, reduce the generation of by-products, and have mild reaction conditions, which are suitable for stable production on an industrial scale.

[0023] In summary, the epoxy resin based on thiophene and its derivatives of the present invention is not only superior to traditional epoxy resins in performance, but its preparation method also has significant advantages in environmental protection, reaction efficiency, applicability, etc., meeting the diverse needs of high-performance material applications. DETAILED DESCRIPTION

[0024] The present invention provides a method for preparing an epoxy resin based on thiophene and its derivatives, comprising the following steps:

[0025] Thiophene or a thiophene derivative is subjected to an epoxidation reaction with an epoxidizing agent to obtain an epoxy resin based on thiophene and its derivatives.

[0026] In the present invention, the molar ratio of thiophene or thiophene derivative to the epoxidizing agent is independently 1:0.5 to 2, preferably 1:0.8 to 1.5, and more preferably 1:1 to 1.2.

[0027] In the present invention, the thiophene derivatives include one or more of thiophene-2-ol, polythiophene, thiophene-3-carboxylic acid, dimethylthiophene and substituted thiophene.

[0028] In the present invention, the substituted thiophene includes methylthiophene, ethylthiophene, hydroxythiophene, aminothiophene and carboxythiophene.

[0029] In the present invention, low molecular weight thiophene derivatives (70-200 g / mo) and thiophene react with an epoxidizing agent to generally generate liquid thiophene epoxy resins having lower viscosity and better fluidity, and an epoxy value of generally 0.2-0.6 equivalents / 100 g.

[0030] After high molecular weight thiophene derivatives (such as polythiophene, thiophene-3-carboxylic acid, etc.) react with epoxidants, solid thiophene epoxy resins are formed, which have high mechanical strength and thermal stability. The epoxy value is generally 0.3 to 0.5 equivalents / 100 grams.

[0031] In the present invention, the epoxidizing agent includes one or more of hydrogen peroxide, epichlorohydrin and epichlorohydrin ester.

[0032] In the present invention, the byproduct of hydrogen peroxide is water, so it is environmentally friendly and has no toxic byproducts; epichlorohydrin can react quickly with a variety of organic compounds, the reaction conditions are relatively mild and easy to control; epichlorohydrin ester can more selectively carry out epoxidation reaction, can effectively epoxidize certain less active compounds, and has good reaction controllability.

[0033] In the present invention, the epoxidation reaction temperature is 50-90°C, specifically 55°C, 60°C, 65°C, 70°C, 75°C, 80°C, 85°C; the epoxidation reaction time is 2-8h, specifically 3h, 4h, 5h, 6h, 7h.

[0034] In the present invention, the epoxidation reaction is carried out in the presence of a catalyst, which includes a molybdenum-based catalyst and / or a tungsten-based catalyst.

[0035] In the present invention, the molybdenum-based catalyst includes one or more of ammonium molybdate, diacetyl molybdenum dioxide and molybdic acid; the tungsten-based catalyst includes one or more of sodium tungstate, ammonium metatungstate, tungstic acid and calcium tungstate.

[0036] In the present invention, the mass ratio of the catalyst to the epoxidizing agent is 1-10-1000, preferably 1:50-800, more preferably 1:100-500, and further preferably 1:200-300.

[0037] In the present invention, after the epoxidation reaction is completed, a post-treatment step is further included, and the post-treatment step is specifically washing, extracting and drying performed in sequence.

[0038] In the present invention, the epoxy resin based on thiophene and its derivatives is used for conductive coatings, adhesives, aerospace structural materials, electronic packaging materials, printed circuit board conductors, electrical paints, antistatic coatings, automotive parts, etc.

[0039] The present invention also provides an epoxy resin based on thiophene and its derivatives prepared by the preparation method.

[0040] In the present invention, the epoxy value of the epoxy resin based on thiophene and its derivatives is 0.2 to 0.6 equivalents / 100 grams, and specifically can be 0.3 equivalents / 100 grams, 0.4 equivalents / 100 grams, or 0.5 equivalents / 100 grams.

[0041] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] Example 1

[0043] 10g of methylthiophene and 15g of epichlorohydrin were heated to 60°C in the presence of 0.1g of ammonium molybdate for epoxidation reaction for 6 hours. After the reaction was completed, unreacted raw materials and by-products were removed by washing, extraction and drying steps to finally obtain a liquid methylthiophene epoxy resin. The yield was 85% (based on methylthiophene).

[0044] Performance test: The epoxy resin has good electrical conductivity and low viscosity, and is suitable for application in electronic materials.

[0045] Application areas: conductive coatings and adhesives.

[0046] Example 2

[0047] 12g of thiophene-2-ol and 18g of chlorohydrin ester were heated to 70°C in the presence of 0.15g of sodium tungstate for epoxidation reaction for 5 hours. After the reaction was completed, unreacted raw materials and by-products were removed by vacuum drying to finally obtain liquid thiophene-2-ol epoxy resin. The yield was 88% (based on thiophene-2-ol).

[0048] Performance test: This epoxy resin has high mechanical strength and is suitable for use as a structural adhesive.

[0049] Application areas: adhesives and coatings.

[0050] Example 3

[0051] 10g of thiophene-3-carboxylic acid and 20g of chlorohydrin ester were heated to 85°C in the presence of 0.2g of sodium molybdate for 6 hours for epoxidation reaction. After the reaction was completed, unreacted raw materials and by-products were removed by cooling precipitation and drying steps to finally obtain solid thiophene-3-carboxylic acid epoxy resin. The yield was 82% (based on thiophene-3-carboxylic acid).

[0052] Performance test: This epoxy resin has excellent heat resistance and oxidation resistance, and is suitable for use in high-temperature industrial fields.

[0053] Application areas: high temperature equipment protective materials and electronic component protective layers.

[0054] Example 4

[0055] 8 g of dimethylthiophene and 12 g of epichlorohydrin were heated to 60° C. in the presence of 0.05 g of diacetyl molybdenum dioxide for epoxidation reaction for 5 hours. After the reaction was completed, unreacted raw materials and by-products were removed by distillation to finally obtain a liquid dimethylthiophene epoxy resin. The yield was 90% (based on dimethylthiophene).

[0056] Performance test: The epoxy resin exhibits high electrical conductivity and moderate mechanical strength.

[0057] Application areas: conductive paint and electronic device packaging materials.

[0058] Example 5

[0059] 10g of thiophene and 15g of hydrogen peroxide were heated to 70°C in the presence of 0.08g of sodium tungstate for epoxidation reaction for 6 hours. After the reaction was completed, unreacted raw materials and by-products were removed by vacuum distillation to finally obtain liquid thiophene epoxy resin. The yield was 87% (based on thiophene).

[0060] Performance test: This epoxy resin has excellent conductivity and low viscosity, and is suitable for the application of antistatic materials.

[0061] Application areas: antistatic coatings and conductive paints.

[0062] Example 6

[0063] 9g of 4-phenyl-substituted thiophene and 13.5g of chlorohydrin ester were heated to 75°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, unreacted raw materials and by-products were removed by cooling and drying to finally obtain solid 4-substituted thiophene epoxy resin. The yield was 80% (based on 4-substituted thiophene).

[0064] Performance Test: This epoxy resin has high mechanical strength and good chemical resistance.

[0065] Application areas: chemical equipment protective materials.

[0066] Example 7

[0067] 11 g of thiophene-3-carboxylic acid and 16.5 g of epichlorohydrin were heated to 70° C. in the presence of 0.12 g of ammonium molybdate for 6 hours for epoxidation reaction. After the reaction was completed, unreacted raw materials and by-products were removed by extraction and drying to finally obtain solid thiophene-3-carboxylic acid epoxy resin. The yield was 85% (based on thiophene-3-carboxylic acid).

[0068] Performance test: The epoxy resin has good mechanical properties and high conductivity.

[0069] Application areas: composite materials and electronic devices.

[0070] Example 8

[0071] 10 g of aminothiophene and 14 g of hydrogen peroxide were heated to 65° C. in the presence of 0.1 g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, unreacted raw materials and by-products were removed by distillation to finally obtain solid aminothiophene epoxy resin. The yield was 83% (based on aminothiophene).

[0072] Performance test: The epoxy resin has good conductivity and moderate mechanical properties.

[0073] Application areas: electronic components and conductive coatings.

[0074] Example 9

[0075] 12g of thiophene-2-ol and 16g of chlorohydrin ester were heated to 75°C in the presence of 0.1g of ammonium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, unreacted raw materials and by-products were removed by vacuum drying to finally obtain solid thiophene-2-ol epoxy resin. The yield was 89% (based on thiophene-2-ol).

[0076] Performance test: This epoxy resin has high mechanical strength and is suitable for high-performance composite materials.

[0077] Application areas: composite materials and conductive coatings.

[0078] Example 10

[0079] 10g of thiophene and 15g of epichlorohydrin were heated to 60°C in the presence of 0.08g of sodium molybdate for epoxidation reaction for 6 hours. After the reaction was completed, unreacted raw materials and by-products were removed by extraction and distillation to finally obtain liquid thiophene epoxy resin. The yield was 85% (based on thiophene).

[0080] Performance test: The epoxy resin has good electrical conductivity and is suitable for applications with conductive materials.

[0081] Application areas: conductive coatings and antistatic materials.

[0082] Embodiment 11

[0083] 9 g of methylthiophene and 14 g of epichlorohydrin were heated to 55°C in the presence of 0.1 g of ammonium molybdate for epoxidation reaction for 3 hours. After the reaction was completed, unreacted raw materials and by-products were removed by washing, extraction and drying steps to finally obtain a liquid methylthiophene epoxy resin. The yield was 86% (based on methylthiophene).

[0084] Performance test: Good electrical conductivity, suitable for electronic material applications.

[0085] Application areas: conductive coatings and electronic packaging materials.

[0086] Example 12

[0087] 8g of thiophene-3-carboxylic acid and 13g of hydrogen peroxide were heated to 80°C in the presence of 0.08g of sodium tungstate for epoxidation reaction for 4 hours. After the reaction was completed, solid thiophene-3-carboxylic acid epoxy resin was obtained by vacuum drying. The yield was 82% (based on thiophene-3-carboxylic acid).

[0088] Performance test: Excellent heat resistance, suitable for high temperature applications.

[0089] Application areas: high temperature industrial materials.

[0090] Embodiment 13

[0091] 10 g of aminothiophene and 15 g of chlorohydrin ester were heated to 75° C. in the presence of 0.12 g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, solid aminothiophene epoxy resin was obtained by cooling, precipitation and drying. The yield was 80% (based on aminothiophene).

[0092] Performance test: good chemical stability and excellent conductivity.

[0093] Application areas: sensors and conductive materials.

[0094] Embodiment 14

[0095] 11 g of thiophene and 16 g of epichlorohydrin were heated to 65° C. in the presence of 0.1 g of sodium tungstate for epoxidation reaction for 6 hours. After the reaction was completed, by-products were removed by distillation to obtain a liquid thiophene epoxy resin with a yield of 88% (based on thiophene).

[0096] Performance test: good conductivity and excellent fluidity.

[0097] Application areas: antistatic materials and conductive paints.

[0098] Embodiment 15

[0099] 10g of 4-carboxyl-substituted thiophene and 14g of hydrogen peroxide were heated to 75°C in the presence of 0.09g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, solid substituted thiophene epoxy resin was obtained by cooling, precipitation and drying. The yield was 82% (based on 4-substituted thiophene).

[0100] Performance test: high mechanical strength and good chemical stability.

[0101] Application areas: industrial protective materials.

[0102] Example 16

[0103] 9g of thiophene-2-ol and 13g of chlorohydrin ester were heated to 70°C in the presence of 0.08g of sodium tungstate for epoxidation reaction for 4 hours. After the reaction was completed, the by-products were removed by vacuum drying to obtain liquid thiophene-2-ol epoxy resin. The yield was 87% (based on thiophene-2-ol).

[0104] Performance test: excellent mechanical properties, low viscosity.

[0105] Application areas: composite materials and coatings.

[0106] Embodiment 17

[0107] 10 g of dimethylthiophene and 14 g of epichlorohydrin were heated to 60°C in the presence of 0.1 g of ammonium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, the by-products were removed by distillation to obtain a liquid dimethylthiophene epoxy resin. The yield was 85% (based on dimethylthiophene).

[0108] Performance test: high conductivity and good fluidity.

[0109] Application areas: conductive adhesives and electronic packaging materials.

[0110] Embodiment 18

[0111] 11 g of thiophene and 17 g of hydrogen peroxide were heated to 70° C. in the presence of 0.1 g of sodium molybdate for 6 hours for epoxidation reaction. After the reaction was completed, the byproducts were removed by vacuum drying to obtain a liquid thiophene epoxy resin. The yield was 89% (based on thiophene).

[0112] Performance test: good conductivity and low viscosity.

[0113] Application areas: antistatic coatings and conductive paints.

[0114] Embodiment 19

[0115] 9g of 4-chloro-substituted thiophene and 12g of chlorohydrin ester were heated to 75°C in the presence of 0.08g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, solid 4-substituted thiophene epoxy resin was obtained by cooling, precipitation and drying. The yield was 82% (based on 4-substituted thiophene).

[0116] Performance test: Excellent mechanical strength and chemical stability.

[0117] Application areas: industrial protective materials and chemical equipment coatings.

[0118] Embodiment 20

[0119] 10 g of thiophene and 15 g of epichlorohydrin were heated to 60°C in the presence of 0.1 g of sodium molybdate for epoxidation reaction for 6 hours. After the reaction was completed, by-products were removed by extraction and drying to obtain a liquid thiophene epoxy resin. The yield was 85% (based on thiophene).

[0120] Performance test: good fluidity and excellent conductivity.

[0121] Application areas: conductive coatings and electronic device packaging.

[0122] Embodiment 21

[0123] 8g of thiophene-2-ol and 13g of epichlorohydrin were heated to 70°C in the presence of 0.08g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, unreacted raw materials and by-products were removed by cooling and vacuum drying to finally obtain liquid thiophene-2-ol epoxy resin. The yield was 85% (based on thiophene-2-ol).

[0124] Performance test: low viscosity, good electrical conductivity.

[0125] Application areas: composite materials, conductive coatings.

[0126] Embodiment 22

[0127] 9g of 3-ethylthiophene and 14g of chlorohydrin ester (1-chloro-2,3-epoxypropane ester) were heated to 75°C in the presence of 0.1g of ammonium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, unreacted raw materials and by-products were removed by extraction and drying steps to finally obtain liquid 3-ethylthiophene epoxy resin. The yield was 88% (based on 3-ethylthiophene).

[0128] Performance test: excellent mechanical properties and good fluidity.

[0129] Application areas: adhesives, electronic materials.

[0130] Embodiment 23

[0131] 8 g of methylthiophene and 12 g of hydrogen peroxide were heated to 60°C in the presence of 0.05 g of sodium tungstate for epoxidation reaction for 5 hours. After the reaction was completed, the by-products were removed by vacuum distillation to obtain a liquid methylthiophene epoxy resin. The yield was 87% (based on methylthiophene).

[0132] Performance test: good electrical conductivity, low viscosity.

[0133] Application areas: conductive coatings, antistatic materials.

[0134] Embodiment 24

[0135] 10 g of dimethylthiophene and 15 g of epichlorohydrin were heated to 65°C in the presence of 0.1 g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, solid dimethylthiophene epoxy resin was obtained by washing and drying. The yield was 85% (based on dimethylthiophene).

[0136] Performance test: high mechanical strength, suitable for high-strength materials.

[0137] Application areas: industrial equipment, structural materials.

[0138] Embodiment 25

[0139] 11 g of thiophene-3-carboxylic acid and 16 g of hydrogen peroxide were heated to 80° C. in the presence of 0.12 g of sodium molybdate for 6 hours for epoxidation reaction. After the reaction was completed, solid thiophene-3-carboxylic acid epoxy resin was obtained by cooling and drying. The yield was 83% (based on thiophene-3-carboxylic acid).

[0140] Performance test: excellent heat resistance and mechanical properties.

[0141] Application areas: high temperature materials, composite materials.

[0142] Embodiment 26

[0143] 9g of 5-aminothiophene and 13g of epichlorohydrin were heated to 70°C in the presence of 0.09g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, by-products were removed by distillation to obtain solid 5-aminothiophene epoxy resin. The yield was 88% (based on 5-aminothiophene).

[0144] Performance test: Good electrical conductivity, suitable for electronic packaging.

[0145] Application areas: electronic materials, conductive coatings.

[0146] Embodiment 27

[0147] 10g of thiophene-2-ol and 15g of chlorohydrin ester were heated to 75°C in the presence of 0.1g of sodium tungstate for epoxidation reaction for 5 hours. After the reaction was completed, the by-products were removed by extraction and drying to obtain a liquid thiophene-2-ol epoxy resin. The yield was 85% (based on thiophene-2-ol).

[0148] Performance test: low viscosity and good electrical conductivity.

[0149] Application areas: conductive adhesives, composite materials.

[0150] Embodiment 28

[0151] 8g of thiophene and 12g of hydrogen peroxide were heated to 60°C in the presence of 0.08g of ammonium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, liquid thiophene epoxy resin was obtained by cooling, extraction and drying. The yield was 87% (based on thiophene).

[0152] Performance test: excellent fluidity and electrical conductivity.

[0153] Application areas: antistatic coatings, conductive paints.

[0154] Embodiment 29

[0155] 10g of 4-substituted thiophene and 14g of epichlorohydrin were heated to 65°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, the by-products were removed by distillation to obtain a solid 4-substituted thiophene epoxy resin. The yield was 86% (based on 4-substituted thiophene).

[0156] Performance test: Excellent chemical stability, suitable for protective coating.

[0157] Application areas: chemical equipment protective materials.

[0158] Embodiment 30

[0159] 10 g of methylthiophene and 15 g of hydrogen peroxide were heated to 70°C in the presence of 0.1 g of ammonium molybdate for 6 hours for epoxidation reaction. After the reaction was completed, the by-products were removed by vacuum drying to finally obtain a liquid methylthiophene epoxy resin. The yield was 88% (based on methylthiophene).

[0160] Performance test: low viscosity, excellent electrical conductivity.

[0161] Application areas: conductive adhesive, antistatic coating.

[0162] Embodiment 31

[0163] 9g of thiophene-2-ol and 13g of epichlorohydrin were heated to 70°C in the presence of 0.08g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, unreacted raw materials and by-products were removed by cooling, extraction and drying to finally obtain liquid thiophene-2-ol epoxy resin. The yield was 86% (based on thiophene-2-ol).

[0164] Performance test: low viscosity, good fluidity, suitable for conductive coating.

[0165] Application areas: composite materials, conductive adhesives.

[0166] Embodiment 32

[0167] 8g of ethylthiophene and 12g of chlorohydrin ester were heated to 65°C in the presence of 0.08g of sodium tungstate for epoxidation reaction for 4 hours. After the reaction was completed, unreacted raw materials and by-products were removed by cooling and drying steps to finally obtain liquid ethylthiophene epoxy resin. The yield was 88% (based on ethylthiophene).

[0168] Performance test: Good conductivity, suitable for coating and electronic applications.

[0169] Application areas: conductive coatings, electronic materials.

[0170] Embodiment 33

[0171] 10g of dimethylthiophene and 15g of epichlorohydrin were heated to 65°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, the by-products were removed by distillation and vacuum drying to obtain a solid dimethylthiophene epoxy resin. The yield was 87% (based on dimethylthiophene).

[0172] Performance test: Excellent mechanical properties, suitable for applications with high mechanical strength requirements.

[0173] Application areas: structural materials, industrial coatings.

[0174] Embodiment 34

[0175] 9g of thiophene-3-carboxylic acid and 14g of hydrogen peroxide were heated to 75°C in the presence of 0.1g of sodium molybdate for 6 hours for epoxidation reaction. After the reaction was completed, solid thiophene-3-carboxylic acid epoxy resin was obtained by cooling, extraction and drying. The yield was 85% (based on thiophene-3-carboxylic acid).

[0176] Performance test: Excellent heat resistance, suitable for high temperature industrial applications.

[0177] Application areas: high temperature protection materials, composite materials.

[0178] Embodiment 35

[0179] 10 g of aminothiophene and 15 g of epichlorohydrin were heated to 70° C. in the presence of 0.1 g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, the by-products were removed by vacuum distillation and drying to finally obtain a liquid aminothiophene epoxy resin. The yield was 86% (based on aminothiophene).

[0180] Performance test: Good electrical conductivity, suitable for sensors and conductive materials.

[0181] Application areas: sensors, conductive composite materials.

[0182] Embodiment 36

[0183] 11 g of thiophene and 17 g of hydrogen peroxide were heated to 70° C. in the presence of 0.12 g of sodium tungstate for 6 hours for epoxidation reaction. After the reaction was completed, the byproducts were removed by vacuum drying to finally obtain a liquid thiophene epoxy resin with a yield of 89% (based on thiophene).

[0184] Performance test: good conductivity and high fluidity.

[0185] Application areas: conductive paint, antistatic coating.

[0186] Embodiment 37

[0187] 8g of 4-trifluoromethyl-substituted thiophene and 12g of epichlorohydrin were heated to 60°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, by-products were removed by cooling and drying steps to obtain a solid 4-substituted thiophene epoxy resin. The yield was 82% (based on 4-substituted thiophene).

[0188] Performance test: excellent mechanical properties and good corrosion resistance.

[0189] Application areas: chemical equipment protective materials.

[0190] Embodiment 38

[0191] 10 g of methylthiophene and 15 g of hydrogen peroxide were heated to 70° C. in the presence of 0.1 g of ammonium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, liquid methylthiophene epoxy resin was finally obtained by vacuum drying. The yield was 87% (based on methylthiophene).

[0192] Performance test: low viscosity, excellent electrical conductivity.

[0193] Application areas: conductive coatings, electronic devices.

[0194] Embodiment 39

[0195] 9g of thiophene-2-ol and 13g of epichlorohydrin were heated to 65°C in the presence of 0.08g of sodium tungstate for epoxidation reaction for 5 hours. After the reaction was completed, by-products were removed by cooling and drying to obtain liquid thiophene-2-ol epoxy resin. The yield was 86% (based on thiophene-2-ol).

[0196] Performance test: Low viscosity, suitable for coatings and adhesives.

[0197] Application areas: conductive coatings, composite materials.

[0198] Embodiment 40

[0199] 10g of thiophene and 15g of hydrogen peroxide were heated to 60°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 6 hours. After the reaction was completed, by-products were removed by cooling and vacuum distillation to obtain liquid thiophene epoxy resin. The yield was 85% (based on thiophene).

[0200] Performance test: excellent conductivity and low viscosity.

[0201] Application areas: electronic packaging materials, conductive paints.

[0202] Embodiment 41

[0203] 8g of dimethylthiophene and 12g of epichlorohydrin were heated to 60°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, unreacted raw materials and by-products were removed by cooling and drying steps to finally obtain liquid dimethylthiophene epoxy resin. The yield was 88% (based on dimethylthiophene).

[0204] Performance test: low viscosity, excellent electrical conductivity.

[0205] Application areas: electronic materials, conductive coatings.

[0206] Embodiment 42

[0207] 9g of thiophene-3-carboxylic acid and 14g of hydrogen peroxide were heated to 75°C in the presence of 0.1g of sodium molybdate for 6 hours for epoxidation reaction. After the reaction was completed, solid thiophene-3-carboxylic acid epoxy resin was obtained by cooling, extraction and drying. The yield was 85% (based on thiophene-3-carboxylic acid).

[0208] Performance test: Excellent heat resistance, suitable for high temperature applications.

[0209] Application areas: high temperature protection materials, composite materials.

[0210] Embodiment 43

[0211] 10 g of aminothiophene and 15 g of epichlorohydrin were heated to 70° C. in the presence of 0.1 g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, the by-products were removed by vacuum distillation and drying to finally obtain a liquid aminothiophene epoxy resin. The yield was 86% (based on aminothiophene).

[0212] Performance test: Good electrical conductivity, suitable for conductive glue and coating.

[0213] Application areas: electronic packaging materials, conductive composite materials.

[0214] Embodiment 44

[0215] 11 g of thiophene and 17 g of hydrogen peroxide were heated to 70°C in the presence of 0.1 g of sodium tungstate for 6 hours for epoxidation reaction. After the reaction was completed, the by-products were removed by vacuum drying to finally obtain a liquid thiophene epoxy resin with a yield of 89% (based on thiophene).

[0216] Performance test: good conductivity, low viscosity, suitable for coating applications.

[0217] Application areas: conductive paint, antistatic coating.

[0218] Embodiment 45

[0219] 10g of methylthiophene and 15g of chlorohydrin ester were heated to 65°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, by-products were removed by cooling and drying steps to obtain liquid methylthiophene epoxy resin. The yield was 85% (based on methylthiophene).

[0220] Performance test: good fluidity, suitable for conductive adhesives and electronic materials.

[0221] Application areas: conductive coatings, electronic device packaging.

[0222] Embodiment 46

[0223] 9g of thiophene-2-ol and 13g of epichlorohydrin were heated to 70°C in the presence of 0.08g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, by-products were removed by cooling and drying to obtain a liquid thiophene-2-ol epoxy resin. The yield was 86% (based on thiophene-2-ol).

[0224] Performance test: Low viscosity, suitable for coatings and adhesives.

[0225] Application areas: conductive coatings, composite materials.

[0226] Embodiment 47

[0227] 10 g of thiophene and 15 g of hydrogen peroxide were heated to 60° C. in the presence of 0.1 g of sodium molybdate for epoxidation reaction for 6 hours. After the reaction was completed, the by-products were removed by vacuum drying to obtain a liquid thiophene epoxy resin. The yield was 85% (based on thiophene).

[0228] Performance test: Excellent conductivity, suitable for electronic applications.

[0229] Application areas: conductive coatings, antistatic coatings.

[0230] Embodiment 48

[0231] 8 g of ethylthiophene and 12 g of chlorohydrin ester were heated to 65° C. in the presence of 0.1 g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, by-products were removed by cooling and drying to obtain a liquid ethylthiophene epoxy resin. The yield was 88% (based on ethylthiophene).

[0232] Performance test: good fluidity, suitable for conductive and adhesive applications.

[0233] Application areas: conductive adhesives, coating materials.

[0234] Embodiment 49

[0235] 10g of thiophene-3-carboxylic acid and 15g of epichlorohydrin were heated to 75°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 6 hours. After the reaction was completed, solid thiophene-3-carboxylic acid epoxy resin was obtained by cooling, extraction and drying. The yield was 85% (based on thiophene-3-carboxylic acid).

[0236] Performance test: Excellent heat resistance, suitable for industrial applications.

[0237] Application areas: high temperature materials, protective coatings.

[0238] Embodiment 50

[0239] 9 g of dimethylthiophene and 13 g of hydrogen peroxide were heated to 70°C in the presence of 0.1 g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, the by-products were removed by vacuum drying to obtain a liquid dimethylthiophene epoxy resin. The yield was 86% (based on dimethylthiophene).

[0240] Performance test: Excellent conductivity, suitable for electronic material applications.

[0241] Application areas: conductive adhesive, antistatic materials.

[0242] Embodiment 51

[0243] 8g of thiophene-2-ol and 12g of epichlorohydrin were heated to 65°C in the presence of 0.08g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, unreacted raw materials and by-products were removed by cooling and vacuum drying to finally obtain liquid thiophene-2-ol epoxy resin. The yield was 87% (based on thiophene-2-ol).

[0244] Performance test: good fluidity and excellent conductivity.

[0245] Application areas: composite materials, conductive coatings.

[0246] Embodiment 52

[0247] 9g of 3-ethylthiophene and 14g of chlorohydrin ester were heated to 70°C in the presence of 0.1g of ammonium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, unreacted raw materials and by-products were removed by extraction and drying steps to finally obtain liquid 3-ethylthiophene epoxy resin. The yield was 88% (based on 3-ethylthiophene).

[0248] Performance test: low viscosity, good conductivity.

[0249] Application areas: electronic materials, coatings.

[0250] Embodiment 53

[0251] 10g of dimethylthiophene and 15g of epichlorohydrin were heated to 60°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, by-products were removed by cooling and drying to obtain a solid dimethylthiophene epoxy resin. The yield was 85% (based on dimethylthiophene).

[0252] Performance test: Excellent mechanical properties, suitable for industrial equipment.

[0253] Application areas: high-strength structural materials.

[0254] Embodiment 54

[0255] 9g of thiophene-3-carboxylic acid and 14g of hydrogen peroxide were heated to 75°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 6 hours. After the reaction was completed, solid thiophene-3-carboxylic acid epoxy resin was obtained by cooling, extraction and drying. The yield was 84% ​​(based on thiophene-3-carboxylic acid).

[0256] Performance test: Good heat resistance, suitable for high temperature applications.

[0257] Application areas: high temperature protection materials.

[0258] Embodiment 55

[0259] 10 g of aminothiophene and 15 g of epichlorohydrin were heated to 70° C. in the presence of 0.1 g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, the by-products were removed by vacuum drying to finally obtain a liquid aminothiophene epoxy resin. The yield was 85% (based on aminothiophene).

[0260] Performance test: Good conductivity, suitable for sensor material.

[0261] Application areas: electronic devices, sensors.

[0262] Embodiment 56

[0263] 11 g of thiophene and 17 g of hydrogen peroxide were heated to 70°C in the presence of 0.1 g of sodium molybdate for 6 hours for epoxidation reaction. After the reaction was completed, by-products were removed by cooling and drying to finally obtain a liquid thiophene epoxy resin. The yield was 89% (based on thiophene).

[0264] Performance test: good conductivity, low viscosity.

[0265] Application areas: conductive paint, antistatic coating.

[0266] Embodiment 57

[0267] 10g of methylthiophene and 15g of chlorohydrin ester were heated to 65°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, by-products were removed by cooling and drying steps to obtain a liquid methylthiophene epoxy resin. The yield was 86% (based on methylthiophene).

[0268] Performance test: Low viscosity, suitable for electronic applications.

[0269] Application areas: conductive coatings, electronic packaging.

[0270] Embodiment 58

[0271] 9g of thiophene-2-ol and 13g of epichlorohydrin were heated to 70°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, the by-products were removed by cooling and drying to finally obtain a liquid thiophene-2-ol epoxy resin. The yield was 87% (based on thiophene-2-ol).

[0272] Performance test: good fluidity and excellent conductivity.

[0273] Application areas: composite materials, conductive adhesives.

[0274] Embodiment 59

[0275] 10g of thiophene and 15g of hydrogen peroxide were heated to 60°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 6 hours. After the reaction was completed, by-products were removed by cooling and vacuum drying to obtain a liquid thiophene epoxy resin. The yield was 85% (based on thiophene).

[0276] Performance test: Excellent conductivity, suitable for electronic applications.

[0277] Application areas: conductive coatings, antistatic materials.

[0278] Embodiment 60

[0279] 8g of ethylthiophene and 12g of chlorohydrin ester were heated to 65°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, the by-products were removed by cooling and drying to finally obtain a liquid ethylthiophene epoxy resin. The yield was 88% (based on ethylthiophene).

[0280] Performance test: low viscosity, suitable for conductive materials.

[0281] Application areas: conductive adhesives, coating materials.

[0282] Embodiment 61

[0283] 10 g of thiophene-3-carboxylic acid and 15 g of epichlorohydrin were heated to 75°C in the presence of 0.1 g of sodium molybdate for 6 hours for epoxidation reaction. After the reaction was completed, solid thiophene-3-carboxylic acid epoxy resin was obtained by cooling, extraction and drying. The yield was 84% ​​(based on thiophene-3-carboxylic acid).

[0284] Performance test: good heat resistance, suitable for industrial applications.

[0285] Application areas: protective coatings, high temperature materials.

[0286] Embodiment 62

[0287] 9 g of dimethylthiophene and 13 g of hydrogen peroxide were heated to 70°C in the presence of 0.1 g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, the by-products were removed by vacuum drying to obtain a liquid dimethylthiophene epoxy resin. The yield was 86% (based on dimethylthiophene).

[0288] Performance test: Excellent conductivity, suitable for electronic applications.

[0289] Application areas: conductive adhesive, antistatic coating.

[0290] Embodiment 63

[0291] 8g of thiophene-2-ol and 12g of epichlorohydrin were heated to 65°C in the presence of 0.08g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, by-products were removed by cooling and vacuum drying to obtain a liquid thiophene-2-ol epoxy resin. The yield was 87% (based on thiophene-2-ol).

[0292] Performance test: good fluidity, suitable for conductive coating.

[0293] Application areas: composite materials, conductive adhesives.

[0294] Embodiment 64

[0295] 10g of thiophene and 15g of hydrogen peroxide were heated to 60°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 6 hours. After the reaction was completed, by-products were removed by cooling and vacuum drying to obtain a liquid thiophene epoxy resin. The yield was 85% (based on thiophene).

[0296] Performance test: Excellent conductivity, suitable for electronic material applications.

[0297] Application areas: conductive coatings, antistatic materials.

[0298] Embodiment 65

[0299] 10g of 4-substituted thiophene and 15g of epichlorohydrin were heated to 65°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, by-products were removed by cooling and drying steps to finally obtain solid 4-substituted thiophene epoxy resin. The yield was 86% (based on 4-substituted thiophene).

[0300] Performance test: Excellent chemical resistance, suitable for protective coating applications.

[0301] Application areas: chemical equipment protective materials, industrial coatings.

[0302] Embodiment 66

[0303] 8 g of methylthiophene and 12 g of chlorohydrin ester were heated to 60° C. in the presence of 0.1 g of ammonium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, unreacted raw materials and by-products were removed by cooling and drying to obtain a liquid methylthiophene epoxy resin. The yield was 87% (based on methylthiophene).

[0304] Performance test: good conductivity, low viscosity.

[0305] Application areas: conductive coatings, electronic material packaging.

[0306] Embodiment 67

[0307] 9g of thiophene-2-ol and 13g of hydrogen peroxide were heated to 70°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 4 hours. After the reaction was completed, by-products were removed by cooling and vacuum drying to obtain liquid thiophene-2-ol epoxy resin. The yield was 88% (based on thiophene-2-ol).

[0308] Performance test: Excellent fluidity, suitable for conductive applications.

[0309] Application areas: conductive adhesives, composite materials.

[0310] Embodiment 68

[0311] 10g of dimethylthiophene and 15g of epichlorohydrin were heated to 65°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 6 hours. After the reaction was completed, the by-products were removed by cooling and drying to obtain a liquid dimethylthiophene epoxy resin. The yield was 85% (based on dimethylthiophene).

[0312] Performance test: high mechanical strength and excellent conductivity.

[0313] Application areas: high-strength composite materials, electronic coatings.

[0314] Embodiment 69

[0315] 11 g of thiophene and 17 g of hydrogen peroxide were heated to 70° C. in the presence of 0.12 g of sodium molybdate for epoxidation reaction for 6 hours. After the reaction was completed, the by-products were removed by vacuum drying to finally obtain a liquid thiophene epoxy resin with a yield of 89% (based on thiophene).

[0316] Performance test: good conductivity, moderate viscosity.

[0317] Application areas: antistatic materials, conductive paints.

[0318] Embodiment 70

[0319] 8g of 5-aminothiophene and 12g of chlorohydrin ester were heated to 65°C in the presence of 0.1g of sodium molybdate for epoxidation reaction for 5 hours. After the reaction was completed, by-products were removed by cooling, extraction and drying to obtain solid 5-aminothiophene epoxy resin. The yield was 86% (based on 5-aminothiophene).

[0320] Performance test: Good chemical resistance and electrical conductivity.

[0321] Application areas: sensor materials, electronic components.

[0322] Experimental Example 1

[0323] The thiophene epoxy resins synthesized in Examples 1 to 70 were subjected to performance tests after curing, including mechanical properties, thermal stability, chemical resistance, etc. The test results of Examples 1 to 70 are shown in Table 1:

[0324] Methods and standards for performance testing

[0325] To ensure the authority and repeatability of the data, the following are the methods or relevant international standards used for each test:

[0326] Mechanical properties test: ASTM D638 standard (Test method for tensile properties of plastics).

[0327] Specimen preparation: The cured thiophene epoxy resin was made into a standard dumbbell-shaped test specimen, and the size was cut according to ASTM D638 standard.

[0328] Testing instrument: Use an electronic universal testing machine to perform tensile testing at a speed of 2 mm / min.

[0329] Data recording: Record the peak value of tensile strength and calculate the average value.

[0330] Thermal stability test: Thermogravimetric analysis (TGA) was used to determine the thermal decomposition starting temperature (5% weight loss temperature) of the material during the heating process.

[0331] Test method: According to ASTM E1131 standard (“Thermogravimetric analysis method for polymer materials”).

[0332] Test conditions: heating rate is 10℃ / min, test temperature range is from room temperature to 600℃, protective gas is nitrogen.

[0333] Chemical resistance test: According to ASTM D543 standard ("Chemical resistance test method for plastics").

[0334] Test steps:

[0335] The samples were immersed in strong acid (1M HCl), strong base (1M NaOH) and organic solvent (such as toluene).

[0336] Soaking time: 72 hours, test temperature is 25℃.

[0337] Data Records:

[0338] Record the mass change of the sample (mass loss rate <1% is considered excellent).

[0339] Observe the sample for any cracks or discoloration.

[0340] Conductivity test: According to ASTM D257 standard (Test method for volume resistivity and surface resistivity of insulating materials).

[0341] Test equipment: High-precision volume resistivity tester, Keithley 6517B.

[0342] Test conditions:

[0343] Sample preparation: The cured material was made into sheets with a size of 50 mm × 50 mm and a thickness of 2 mm.

[0344] Test environment: 25℃, relative humidity 50%.

[0345] Viscosity test: The dynamic viscosity of uncured epoxy resin is measured according to ASTM D445 ("Determination of Viscosity").

[0346] Test equipment: Rotational viscometer (Brookfield RV).

[0347] Test conditions: 25°C, using a standard rotating measuring head (Spindle 21).

[0348] Specific operation of curing:

[0349] Curing system

[0350] Depending on the choice of curing agent, the following two typical curing operations are used:

[0351] 1. Polyetheramine D230 curing operation:

[0352] Ratio: The mass ratio of epoxy resin to D230 is 100:30.

[0353] Curing process:

[0354] Mix thiophene epoxy resin and D230 evenly, degas and pour into the mold.

[0355] Curing conditions: pre-curing at 80℃ for 2 hours, then heating to 120℃ for post-curing for 4 hours.

[0356] After curing, the samples were cooled to room temperature, demoulded and trimmed.

[0357] 1. Dicyandiamide curing operation:

[0358] Proportion: The mass ratio of epoxy resin to dicyandiamide is 100:5 (0.2% imidazole accelerator is added at the same time).

[0359] Curing process:

[0360] Mix thiophene epoxy resin, dicyandiamide and imidazole accelerator evenly, degas and pour into the mold.

[0361] Curing conditions: 130°C for 2 hours, followed by post-curing at 150°C for 2 hours.

[0362] After curing, the samples were cooled to room temperature, demoulded and trimmed.

[0363] Table 1: Comparison of performance tests of thiophene epoxy resins (after curing) of Examples 1 to 70

[0364]

[0365]

[0366]

[0367]

[0368] It can be seen from Table 1 that when low molecular weight thiophene or its low molecular weight derivatives (such as methylthiophene, ethylthiophene, thiophene-2-ol, etc.) are used, the obtained thiophene epoxy resin is mostly in liquid form, showing low viscosity and good fluidity. When high molecular weight or high functionality thiophene derivatives (such as thiophene-3-carboxylic acid, high molecular weight variants of substituted thiophene, polythiophene, etc.) are used, the obtained epoxy resin is often solid, and the mechanical properties and thermal stability are significantly improved. But in general, the epoxy resin of thiophene and its derivatives prepared by the present invention shows excellent electrical conductivity and mechanical properties, which can meet the application in special high-end fields.

[0369] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0370] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for preparing an epoxy resin based on thiophene and its derivatives, characterized in that: The steps include: Thiophene or a thiophene derivative is subjected to an epoxidation reaction with an epoxidizing agent to obtain an epoxy resin based on thiophene and its derivatives.

2. The method for preparing an epoxy resin based on thiophene and its derivatives according to claim 1, characterized in that: The molar ratio of thiophene or thiophene derivative to the epoxidizing agent is independently 1:0.5-2.

3. The method for preparing an epoxy resin based on thiophene and its derivatives according to claim 2, characterized in that: The thiophene derivatives include one or more of thiophene-2-ol, polythiophene, thiophene-3-carboxylic acid and substituted thiophene.

4. The method for preparing an epoxy resin based on thiophene and its derivatives according to claim 3, characterized in that: The epoxidizing agent includes one or more of hydrogen peroxide, epichlorohydrin and epichlorohydrin ester.

5. The method for preparing an epoxy resin based on thiophene and its derivatives according to any one of claims 1 to 4, characterized in that: The temperature of the epoxidation reaction is 50-90° C., and the time of the epoxidation reaction is 2-8 hours.

6. The method for preparing an epoxy resin based on thiophene and its derivatives according to claim 5, characterized in that: The epoxidation reaction is carried out in the presence of a catalyst; The catalyst includes a molybdenum-based catalyst and / or a tungsten-based catalyst.

7. The method for preparing an epoxy resin based on thiophene and its derivatives according to claim 6, characterized in that: The mass ratio of the catalyst to the epoxidizing agent is 1-10-1000.

8. The epoxy resin based on thiophene and its derivatives prepared by the preparation method according to any one of claims 1 to 7.

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