Semiconductor chip packaging device and packaging process

Abstract

The invention provides a semiconductor chip packaging device and packaging technology, and belongs to the technical field of semiconductor chip packaging. The semiconductor chip packaging device comprises a supporting frame, an upper die and a lower die are arranged on the supporting frame, a packaging mechanism is arranged on the supporting frame, the packaging mechanism comprises two fixing bases, a reversing valve and a first air pipe, and the two fixing bases are fixedly installed on the opposite sides of the upper die and the lower die respectively. The packaging mechanism is arranged, gas is injected into an upper mold and a lower mold through a first gas pipe at the same time, and two first piston plates move relatively, so that epoxy resin in the upper mold and the lower mold is compacted, packaging of the epoxy resin is more uniform, and the protection effect is better after the epoxy resin is solidified; compared with the prior art, the packaging effect is better, compression is not needed after a large amount of epoxy resin is added, and the cost is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, and more specifically, to a semiconductor chip packaging device and a packaging process. Background Art

[0002] Semiconductor chip packaging refers to the process of encapsulating a manufactured semiconductor chip in a protective case to provide functions such as physical protection, electrical connection, thermal management, mechanical support, etc., and to facilitate connection with other circuits or systems.

[0003] Existing semiconductor chip packaging is usually carried out by wrapping the semiconductor chip with epoxy resin. However, simply wrapping the semiconductor chip can easily result in uneven wrapping of the epoxy resin after it solidifies, and since the unfrozen epoxy resin has a certain fluidity, it is easy to cause a large number of bubbles inside. Summary of the Invention

[0004] To make up for the above deficiencies, the present invention provides a semiconductor chip packaging device and a packaging process that overcome the above technical problems or at least partially solve the above problems.

[0005] The present invention is implemented as follows: The present invention provides a semiconductor chip packaging device, including a support frame, on which an upper mold and a lower mold are provided. A packaging mechanism is provided on the support frame, and the packaging mechanism includes: Fixed seats, there are two fixed seats, and the two fixed seats are respectively fixedly installed on opposite sides of the upper mold and the lower mold. Fixed rods are fixedly installed on opposite sides of the two fixed seats, and a fixed plate is fixedly installed on the side of the fixed rod away from the fixed seat. First piston plates are slidably sleeved in the inner cavities of the upper mold and the lower mold; A reversing valve, which is fixedly installed on the top of the lower fixed plate. An air pump is provided at the bottom of the support frame, and the output end of the air pump is communicated with the input end of the reversing valve. The reversing valve is provided with a first output end and a second output end; A first air pipe, which is installed on the first output end of the reversing valve, and the inner cavities of the upper mold and the lower mold are both communicated with the other end of the first air pipe.

[0006] In a preferred solution, a support wall is integrally formed at the top of the support frame. A hydraulic rod and a glue injector are installed on the top of the support wall. The output end of the hydraulic rod is fixedly connected to the top of the upper fixed plate. The output end of the glue injector is provided with a glue injection pipe, and the inner cavity of the lower mold is communicated with the glue injection pipe. A chip body is provided between the upper mold and the lower mold.

[0007] In a preferred embodiment, a knocking mechanism is provided between the fixed seat and the fixed plate. The knocking mechanism includes a first piston rod fixedly installed at the bottom of the lower first piston plate. The other end of the first piston rod penetrates through the bottom of the fixed seat. A fixed block is fixedly installed on one side of the fixed seat close to the fixed plate. A reciprocating rod is slidably sleeved inside the fixed block. One end of the reciprocating rod close to the first piston rod is fixedly installed with a reciprocating plate.

[0008] In a preferred embodiment, a support plate is fixedly installed on the side wall of the fixed rod. A cylinder is fixedly installed on the top of the support plate. A second air pipe is installed on the second output end. The inner cavity of the cylinder is communicated with the second air pipe. A limit shell is fixedly installed on the top of the cylinder. A second piston plate is slidably sleeved inside the cylinder. A second piston rod is fixedly installed on the top of the second piston plate. The second piston rod is slidably sleeved inside the limit shell.

[0009] In a preferred embodiment, a sliding cylinder is sleeved on the surface of the second piston rod. A cavity is formed inside the sliding cylinder. A clamping groove is formed at the top of the cavity. A clamping plate is fixedly sleeved on the surface of the second piston rod. The cross-sectional shape of the second piston rod is rectangular.

[0010] In a preferred embodiment, a threaded sleeve is fixedly sleeved on the surface of the sliding cylinder. A driving cylinder is threadedly sleeved on the surface of the threaded sleeve. A first rotating plate is rotatably installed at the bottom of the lower fixed seat. A second rotating plate is fixedly installed on the top of the driving cylinder. A rotating shaft is fixedly installed between the first rotating plate and the second rotating plate. A rotating rod is fixedly installed between the two rotating shafts. A driving rod is fixedly installed between the two rotating rods. A connecting rod is rotatably sleeved on the surface of the driving rod. The other end of the connecting rod is rotatably sleeved on the surface of the reciprocating rod.

[0011] In a preferred embodiment, a commutation mechanism is provided on the top of the lower fixed plate. The commutation mechanism includes a first gear rotatably installed on the top of the support plate. A connecting rod is fixedly installed on the top of the commutation valve. The top of the connecting rod is fixedly connected to the bottom of the first gear.

[0012] In a preferred embodiment, a lead screw is rotatably installed at the bottom of the lower fixed seat. A second gear is fixedly installed at the bottom of the lead screw. The first gear and the second gear are meshed. A sliding rod is fixedly installed between the support plate and the fixed seat.

[0013] In a preferred embodiment, a first power plate is sleeved between the sliding rod and the lead screw. The first power plate is in threaded connection with the lead screw. The bottom of the first piston rod is fixedly installed with a second power plate. A third power plate is fixedly sleeved on the surface of the second piston rod. The first power plate is located between the second power plate and the third power plate.

[0014] A packaging process using the semiconductor chip packaging device described above includes the following packaging steps: S1. Place the chip body in the lower mold, and place the pins of the chip body in the placement grooves opened on the lower mold. Start the hydraulic rod and move the upper mold downward so that the upper mold and the lower mold are closed. Start the injection molding machine to inject epoxy resin into the upper mold and the lower mold. Start the air pump so that high-pressure gas enters the upper mold and the lower mold through the reversing valve and the first air pipe, squeeze the two first piston plates, and make the two first piston plates move in opposite directions to compact the epoxy resin. S2. Through the upward movement of the second piston plate, the sliding cylinder drives the threaded sleeve to move upward. Through the threaded connection between the threaded sleeve and the driving cylinder, the driving cylinder rotates, driving the second rotating plate, the rotating shaft, the rotating rod, and the driving rod to rotate. Under the limiting action of the fixed block, the connecting rod drives the reciprocating rod to move reciprocally, so that the reciprocating plate slightly knocks on the first piston rod to eliminate the bubbles inside the epoxy resin. S3. When the first piston plate moves to a preset position, the second power plate squeezes the first power plate, causing the first power plate to move upward. Through the extrusion of the first power plate on the third power plate, the third power plate moves upward synchronously. Through the threaded connection between the first power plate and the lead screw, the lead screw drives the second gear to rotate, so that the first gear drives the reversing valve to rotate, changing the flow direction of the air flow, closing the first air pipe, and opening the second air pipe.

[0015] A semiconductor chip packaging device and a packaging process provided by the present invention have the following beneficial effects: 1. By setting up the packaging mechanism, gas is injected into the upper mold and the lower mold simultaneously through the first air pipe, and the two first piston plates move relatively, so that the epoxy resin inside the upper mold and the lower mold is compacted, making the wrapping of the epoxy resin more uniform. After the epoxy resin solidifies, the protection effect is stronger. Compared with the prior art, the packaging effect is better, and there is no need to add a large amount of epoxy resin and then compress it, saving costs.

[0016] 2. By setting up a knocking mechanism, when the reciprocating rod slides back and forth inside the fixed block, it drives the reciprocating plate to move back and forth, gently knocking the first piston rod. Through the slight knocking force, the air bubbles inside the epoxy resin burst, thus solving the problem that a large number of air bubbles are likely to remain inside the epoxy resin after molding in the prior art, which affects the encapsulation effect.

[0017] 3. By setting up a commutation mechanism, when the first piston plate moves to a preset position, the first air pipe closes and the second air pipe opens. The high-pressure gas output by the air pump drives the second piston plate to operate through the second air pipe. Thus, the high-pressure gas used to drive the first piston plate to move in the initial state can automatically change the driving object after the epoxy resin is compacted, and then starts to drive the second piston plate to complete the air bubble elimination work, with a high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant drawings can also be obtained based on these drawings.

[0019] Figure 1 is a schematic three-dimensional structure diagram of the whole provided by the embodiment of the present invention; Figure 2 is a schematic overall structure diagram of the upper die and the lower die provided by the embodiment of the present invention; Figure 3 is a schematic structure diagram of the reversing valve and the support plate provided by the embodiment of the present invention; Figure 4 is a partial cross-sectional view of the lower die provided by the embodiment of the present invention; Figure 5 is a schematic structure diagram of the first gear and the second gear provided by the embodiment of the present invention; Figure 6 is a schematic structure diagram of the knocking mechanism provided by the embodiment of the present invention; Figure 7 is a partial cross-sectional view of the driving cylinder and the air cylinder provided by the embodiment of the present invention; Figure 8 is an exploded view of the threaded sleeve and the sliding cylinder provided by the embodiment of the present invention.

[0020] In the figure: 1, support frame; 2, upper die; 3, lower die; 401, fixed seat; 402, fixed rod; 403, fixed plate; 404, first piston plate; 405, reversing valve; 406, air pump; 407, first output end; 408, second output end; 409, first air pipe; 410, support wall; 411, hydraulic rod; 412, glue injector; 413, glue injection pipe; 414, chip body; 501, first piston rod; 502, fixed block; 503, reciprocating rod; 504, reciprocating plate; 505, support plate; 506, air cylinder; 507, second air pipe; 508, limiting shell; 509, second piston plate; 510, second piston rod; 511, sliding cylinder; 512, cavity; 513, clamping groove; 514, clamping plate; 515, threaded sleeve; 516, driving cylinder; 517, first rotating plate; 518, second rotating plate; 519, rotating shaft; 520, rotating rod; 521, driving rod; 522, connecting rod; 601, first gear; 602, connecting rod; 603, lead screw; 604, second gear; 605, sliding rod; 606, first power plate; 607, second power plate; 608, third power plate. Detailed implementation manners

[0021] To make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0022] Refer to Figure 1-8, the present invention provides a technical solution: a semiconductor chip packaging device, including a support frame 1, on which an upper mold 2 and a lower mold 3 are provided. Both the upper mold 2 and the lower mold 3 are provided with placement grooves for placing the pins of the chip body 414. A packaging mechanism is provided on the support frame 1. The packaging mechanism includes a fixed seat 401, a reversing valve 405 and a first air pipe 409. There are two fixed seats 401, and the two fixed seats 401 are respectively fixedly installed on the opposite sides of the upper mold 2 and the lower mold 3. The upper mold 2 and the lower mold 3 are respectively fixedly connected to the two fixed seats 401 by bolts, which is convenient for subsequent replacement and maintenance. Fixed rods 402 are fixedly installed on the opposite sides of the two fixed seats 401. On the side of the fixed rod 402 away from the fixed seat 401, a fixed plate 403 is fixedly installed. A first piston plate 404 is slidably sleeved in the inner cavities of both the upper mold 2 and the lower mold 3. The reversing valve 405 is fixedly installed on the top of the lower fixed plate 403 through a mounting seat and bolts. An air pump 406 is provided at the bottom of the support frame 1. The output end of the air pump 406 is communicated with the input end of the reversing valve 405. The reversing valve 405 is provided with a first output end 407 and a second output end 408. The first air pipe 409 is installed on the first output end 407 of the reversing valve 405. The inner cavities of both the upper mold 2 and the lower mold 3 are communicated with the other end of the first air pipe 409, and the communication positions of the upper mold 2 and the lower mold 3 with the first air pipe 409 are both on the side of the first piston plate 404 away from the chip body 414. A support wall 410 is integrally formed at the top of the support frame 1. A hydraulic rod 411 and a glue injector 412 are installed on the top of the support wall 410. The output end of the hydraulic rod 411 is fixedly connected to the top of the upper fixed plate 403. The output end of the glue injector 412 is installed with a glue injection pipe 413. The inner cavity of the lower mold 3 is communicated with the glue injection pipe 413. A chip body 414 is arranged between the upper mold 2 and the lower mold 3. By setting the packaging mechanism, the user places the chip body 414 in the lower mold 3 and aligns the pins of the chip body 414 with the placement grooves on the lower mold 3 one by one. Then the hydraulic rod 411 is started to drive the upper mold 2 to move downward so that the upper mold 2 and the lower mold 3 are engaged with each other. At this time, the glue injector 412 is started to inject the epoxy resin inside the glue injector 412 into the inside of the upper mold 2 and the lower mold 3. When the injection of the epoxy resin reaches the preset amount, the glue injector 412 is closed. At this time, the epoxy resin wraps the chip body 414. The user starts the air pump 406 to inject gas into the inside of both the upper mold 2 and the lower mold 3 through the first air pipe 409 at the same time. The communication position of the first air pipe 409 and the upper mold 2 is on the side of the first piston plate 404 away from the chip body 414. Similarly, the communication position of the first air pipe 409 and the lower mold 3 is on the side of the other first piston plate 404 away from the chip body 414. After the two first piston plates 404 are extruded by the high-pressure gas, they move toward the side close to the chip body 414, that is, the two first piston plates 404 move relatively, so that the epoxy resin inside the upper mold 2 and the lower mold 3 is compacted, making the wrapping of the epoxy resin more uniform.The protective effect achieved after the epoxy resin solidifies is stronger. Compared with the prior art, the encapsulation effect is better, and there is no need to add a large amount of epoxy resin and then compress it, saving costs. Moreover, the injection and compaction of the epoxy resin are both carried out in a closed space, reducing the generation of bubbles; Refer to Figure 1-8 , a knocking mechanism is provided between the fixing seat 401 and the fixing plate 403. The knocking mechanism includes a first piston rod 501. The first piston rod 501 is fixedly installed at the bottom of the lower first piston plate 404. The other end of the first piston rod 501 penetrates through the bottom of the fixing seat 401. A fixing block 502 is fixedly installed on one side of the fixing seat 401 close to the fixing plate 403. A reciprocating rod 503 is slidably sleeved inside the fixing block 502. One end of the reciprocating rod 503 close to the first piston rod 501 is fixedly installed with a reciprocating plate 504. The shape of the reciprocating plate 504 is arc-shaped, and soft pads with different vibration conductivity can be installed according to needs. By setting the knocking mechanism, when the reciprocating rod 503 reciprocates inside the fixing block 502, it drives the reciprocating plate 504 to reciprocate, slightly knocking the first piston rod 501. Through the slight knocking force, the bubbles inside the epoxy resin are ruptured, thus solving the problem that a large number of bubbles are easily left inside the epoxy resin after molding in the prior art, affecting the encapsulation effect; Refer to Figure 1-8, a support plate 505 is fixedly installed on the side wall of the fixed rod 402. A cylinder 506 is fixedly installed on the top of the support plate 505. A second air pipe 507 is installed on the second output end 408. The inner cavity of the cylinder 506 is communicated with the second air pipe 507. A limit shell 508 is fixedly installed on the top of the cylinder 506. A second piston plate 509 is slidably sleeved inside the cylinder 506. A second piston rod 510 is fixedly installed on the top of the second piston plate 509. The second piston rod 510 is slidably sleeved inside the limit shell 508. A sliding cylinder 511 is sleeved on the surface of the second piston rod 510. A cavity 512 is opened inside the sliding cylinder 511. A clamping groove 513 is opened at the top of the cavity 512. A clamping plate 514 is fixedly sleeved on the surface of the second piston rod 510. The cross-sectional shape of the second piston rod 510 is set to be rectangular. A threaded sleeve 515 is fixedly sleeved on the surface of the sliding cylinder 511. A driving cylinder 516 is threadedly sleeved on the surface of the threaded sleeve 515. A first rotating plate 517 is rotatably installed at the bottom of the lower fixed seat 401. A second rotating plate 518 is fixedly installed on the top of the driving cylinder 516. A rotating shaft 519 is fixedly installed between the first rotating plate 517 and the second rotating plate 518. A rotating rod 520 is fixedly installed between the two rotating shafts 519. A driving rod 521 is fixedly installed between the two rotating rods 520. A connecting rod 522 is rotatably sleeved on the surface of the driving rod 521. The other end of the connecting rod 522 is rotatably sleeved on the surface of the reciprocating rod 503. By setting the second piston plate 509, when the second output end 408 of the reversing valve 405 outputs high-pressure gas, the high-pressure gas enters the inside of the cylinder 506 through the connection of the second air pipe 507, squeezes the second piston plate 509, and makes the second piston plate 509 drive the second piston rod 510 to move upward. When the second piston rod 510 moves upward, the top of the second piston rod 510 is inserted into the inside of the clamping groove 513. The second piston rod 510 continues to move upward and drives the sliding cylinder 511 and the threaded sleeve 515 to move upward. Since a threaded groove is opened inside the driving cylinder 516, through the threaded connection between the threaded sleeve 515 and the driving cylinder 516, the driving cylinder 516 rotates, thereby driving the second rotating plate 518 to rotate. The second rotating plate 518 drives the driving rod 521 to rotate through the cooperation of the rotating shaft 519 and the rotating rod 520. Since the driving rod 521 is eccentrically arranged relative to the rotating rod 520, the driving rod 521 revolves around the center of the second rotating plate 518, driving the connecting rod 522 to move. Through the cooperation of the fixed block 502, the reciprocating rod 503 drives the reciprocating plate 504 to move reciprocally; Refer to Figure 1-8, a reversing mechanism is provided at the top of the lower fixing plate 403. The reversing mechanism includes a first gear 601 which is rotatably installed at the top of the support plate 505. A connecting rod 602 is fixedly installed at the top of the reversing valve 405. The connecting rod 602 is installed at the handle of the reversing valve 405 and is used to drive the handle of the reversing valve 405 to rotate. The top of the connecting rod 602 is fixedly connected to the bottom of the first gear 601. By providing the reversing mechanism, when the first piston plate 404 moves to a preset position, the first gear 601 rotates. Through the cooperation of the connecting rod 602, the handle of the reversing valve 405 is driven to rotate, so that the flow direction of the reversing valve 405 is changed, the first output end 407 is closed, and the second output end 408 is opened. Thus, the first air pipe 409 is closed and the second air pipe 507 is opened. The high-pressure gas output by the air pump 406 drives the second piston plate 509 to operate through the second air pipe 507. Therefore, the high-pressure gas used to drive the first piston plate 404 to move in the initial state can automatically change the driving object after the epoxy resin is compacted, and then start to drive the second piston plate 509 to complete the bubble elimination work, with a high degree of automation; Refer to Figure 1-8, a screw rod 603 is rotatably installed at the bottom of the lower fixing seat 401. A second gear 604 is fixedly installed at the bottom of the screw rod 603. The first gear 601 and the second gear 604 are meshed and connected. A slide rod 605 is fixedly installed between the support plate 505 and the fixing seat 401. A first power plate 606 is sleeved between the slide rod 605 and the screw rod 603. The first power plate 606 is threadedly connected to the screw rod 603. The bottom of the first piston rod 501 is fixedly installed with a second power plate 607. A third power plate 608 is fixedly sleeved on the surface of the second piston rod 510. The first power plate 606 is located between the second power plate 607 and the third power plate 608. Specifically, the second power plate 607 is located below the first power plate 606, and the third power plate 608 is located above the first power plate 606. And the first power plate 606, the second power plate 607 and the third power plate 608 partially overlap in the vertical direction. By setting the first power plate 606, the second power plate 607 and the third power plate 608, when the first piston plate 404 moves towards the side close to the chip body 414 to extrude the epoxy resin, it drives the first piston rod 501 and the second power plate 607 to move. Until reaching the preset position, the second power plate 607 squeezes the first power plate 606, causing the first power plate 606 to move upward. At the same time, the first power plate 606 squeezes the third power plate 608, causing the second piston rod 510 to move upward until the top of the second piston rod 510 is stuck into the internal of the card slot 513. Through the threaded connection between the first power plate 606 and the screw rod 603, and the limiting effect of the slide rod 605, the screw rod 603 drives the second gear 604 to rotate. Through the meshed connection between the second gear 604 and the first gear 601, the first gear 601 drives the handle of the reversing valve 405 to rotate through the connecting rod 602, thereby changing the flow direction of the reversing valve 405, so that the first air pipe 409 is closed and the second air pipe 507 is opened. The gas of the first air pump 406 enters the inside of the air cylinder 506 through the second air pipe 507, thereby providing driving force for the second piston plate 509 to move upward. Thus, the compaction of the epoxy resin and the elimination of bubbles are driven by the same power source, and during the processing, the switching of the power source can be automatically completed without manual intervention, improving the degree of automation. When the processing is completed, only need to reverse-start the air pump 406 to generate suction inside the air cylinder 506, and the second piston plate 509 moves downward until it returns to its original position. During this process, the third power plate 608 squeezes the first power plate 606, and the first power plate 606 squeezes the second power plate 607, so that the first air pipe 409 is connected to the air pump 406 again, and suction is generated inside the first air pipe 409, causing the first piston plate 404 to return to its original position; An encapsulation process of a semiconductor chip encapsulation device in use, including the following encapsulation steps: S1. Place the chip body 414 in the lower mold 3, and place the pins of the chip body 414 in the placement grooves opened on the lower mold 3. Start the hydraulic rod 411, move the upper mold 2 downward so that the upper mold 2 and the lower mold 3 are closed. Start the injection molding machine 412 to inject epoxy resin into the upper mold 2 and the lower mold 3. Start the air pump 406 so that high-pressure gas enters the upper mold 2 and the lower mold 3 through the reversing valve 405 and the first air pipe 409, squeeze the two first piston plates 404, and make the two first piston plates 404 move in opposite directions to compact the epoxy resin. S2. Through the upward movement of the second piston plate 509, the sliding cylinder 511 drives the threaded sleeve 515 to move upward. Due to the threaded connection between the threaded sleeve 515 and the driving cylinder 516, the driving cylinder 516 rotates, driving the second rotating plate 518, the rotating shaft 519, the rotating rod 520, and the driving rod 521 to rotate. Under the limiting action of the fixed block 502, the connecting rod 522 drives the reciprocating rod 503 to move reciprocally, so that the reciprocating plate 504 slightly knocks on the first piston rod 501 to eliminate the bubbles inside the epoxy resin. S3. When the first piston plate 404 moves to the preset position, the second power plate 607 squeezes the first power plate 606, making the first power plate 606 move upward. Through the extrusion of the first power plate 606 on the third power plate 608, the third power plate 608 moves upward synchronously. Due to the threaded connection between the first power plate 606 and the lead screw 603, the lead screw 603 drives the second gear 604 to rotate, so that the first gear 601 drives the reversing valve 405 to rotate, changing the flow direction of the air flow, closing the first air pipe 409, and opening the second air pipe 507.

[0023] Specifically, the working process or principle of the semiconductor chip packaging device and packaging process is as follows: When in use, the user places the chip body 414 in the lower mold 3, starts the hydraulic rod 411, drives the upper mold 2 to move downward, so that the upper mold 2 and the lower mold 3 are engaged with each other. At this time, the glue injector 412 is started, and the epoxy resin inside the glue injector 412 is injected into the inside of the upper mold 2 and the lower mold 3. When the injection of the epoxy resin reaches the preset amount, the glue injector 412 is closed. At this time, the epoxy resin wraps the chip body 414. The user starts the air pump 406 and injects gas into the inside of the upper mold 2 and the lower mold 3 simultaneously through the first air pipe 409. The connection between the first air pipe 409 and the upper mold 2 is located on the side of the first piston plate 404 away from the chip body 414. Similarly, the connection between the first air pipe 409 and the lower mold 3 is located on the side of the other first piston plate 404 away from the chip body 414. After the two first piston plates 404 are squeezed by the high-pressure gas, they move toward the side close to the chip body 414, that is, the two first piston plates 404 move relatively, so that the epoxy resin inside the upper mold 2 and the lower mold 3 is squeezed. When reaching the preset position, the second power plate 607 squeezes the first power plate 606, causing the first power plate 606 to move upward. At the same time, the first power plate 606 squeezes the third power plate 608, causing the second piston rod 510 to move upward until the top of the second piston rod 510 is caught in the internal card slot 513. Through the threaded connection between the first power plate 606 and the lead screw 603, and under the limiting action of the slide bar 605, the lead screw 603 drives the second gear 604 to rotate. Through the meshing connection between the second gear 604 and the first gear 601, the first gear 601 drives the handle of the reversing valve 405 to rotate through the connecting rod 602, thereby changing the flow direction of the reversing valve 405, closing the first air pipe 409, and opening the second air pipe 507. The gas of the first air pump 406 enters the inside of the air cylinder 506 through the second air pipe 507, causing the second piston plate 509 to drive the second piston rod 510 to move upward. The top of the second piston rod 510 is inserted into the internal card slot 513. The second piston rod 510 continues to move upward, driving the sliding cylinder 511 and the threaded sleeve 515 to move upward. Since a threaded groove is provided inside the driving cylinder 516, through the threaded connection between the threaded sleeve 515 and the driving cylinder 516, the driving cylinder 516 rotates, thereby driving the second rotating plate 518 to rotate. The second rotating plate 518 drives the driving rod 521 to rotate through the cooperation of the rotating shaft 519 and the rotating rod 520. Since the driving rod 521 is eccentrically arranged relative to the rotating rod 520, the driving rod 521 revolves around the center of the second rotating plate 518, driving the connecting rod 522 to move. Through the cooperation of the fixed block 502, the reciprocating rod 503 drives the reciprocating plate 504 to reciprocate, thereby intermittently knocking the first piston rod 501. When the processing is completed, only need to start the air pump 406 in the reverse direction, so that suction is generated inside the air cylinder 506.The second piston plate 509 moves downward until it returns to its original position. During this process, the third power plate 608 squeezes the first power plate 606, and the first power plate 606 squeezes the second power plate 607, so that the first air pipe 409 is connected to the air pump 406 again, and suction is generated inside the first air pipe 409, causing the first piston plate 404 to return to its original position.

Claims

1. A semiconductor chip packaging device, comprising a support frame (1), wherein an upper mold (2) and a lower mold (3) are arranged on the support frame (1), characterized in that: The support frame (1) is provided with a packaging mechanism, the packaging mechanism comprising: A fixed seat (401), wherein two fixed seats (401) are provided, and the two fixed seats (401) are respectively fixedly mounted on opposite sides of the upper die (2) and the lower die (3); a fixed rod (402) is fixedly mounted on opposite sides of the two fixed seats (401); a fixed plate (403) is fixedly mounted on a side of the fixed rod (402) away from the fixed seat (401); and a first piston plate (404) is slidably sleeved in the inner cavities of the upper die (2) and the lower die (3); a reversing valve (405), the reversing valve (405) being fixedly mounted on the top of the fixing plate (403) at the lower side, an air pump (406) being arranged at the bottom of the support frame (1), an output end of the air pump (406) being connected to an input end of the reversing valve (405), and a first output end (407) and a second output end (408) being arranged on the reversing valve (405); A first air pipe (409), wherein the first air pipe (409) is installed on the first output end (407) of the reversing valve (405), and the inner cavity of the upper mold (2) and the inner cavity of the lower mold (3) are both connected to the other end of the first air pipe (409).

2. The semiconductor chip packaging device according to claim 1, characterized in that: The top of the support frame (1) is integrally formed with a support wall (410), the top of the support wall (410) is equipped with a hydraulic rod (411) and a glue injection machine (412), the output end of the hydraulic rod (411) is fixedly connected to the top of the upper fixed plate (403), the output end of the glue injection machine (412) is equipped with a glue injection tube (413), the inner cavity of the lower mold (3) is connected to the glue injection tube (413), and a chip body (414) is arranged between the upper mold (2) and the lower mold (3).

3. The semiconductor chip packaging device according to claim 2, characterized in that: A knocking mechanism is provided between the fixed seat (401) and the fixed plate (403), and the knocking mechanism comprises a first piston rod (501), the first piston rod (501) is fixedly mounted on the bottom of the first piston plate (404) at the lower side, the other end of the first piston rod (501) passes through the bottom of the fixed seat (401), a fixed block (502) is fixedly mounted on one side of the fixed seat (401) close to the fixed plate (403), a reciprocating rod (503) is provided on an internal sliding sleeve of the fixed block (502), and a reciprocating plate (504) is fixedly mounted on one end of the reciprocating rod (503) close to the first piston rod (501).

4. The semiconductor chip packaging device according to claim 3, characterized in that: A support plate (505) is fixedly mounted on the side wall of the fixed rod (402), an air cylinder (506) is fixedly mounted on the top of the support plate (505), a second air pipe (507) is mounted on the second output end (408), an inner cavity of the air cylinder (506) is connected to the second air pipe (507), a limiting shell (508) is fixedly mounted on the top of the air cylinder (506), a second piston plate (509) is slidably sleeved inside the air cylinder (506), a second piston rod (510) is fixedly mounted on the top of the second piston plate (509), and the second piston rod (510) is slidably sleeved inside the limiting shell (508).

5. The semiconductor chip packaging device according to claim 4, characterized in that: A slide cylinder (511) is sleeved on the surface of the second piston rod (510), a cavity (512) is provided inside the slide cylinder (511), a clamping groove (513) is provided on the top of the cavity (512), a clamping plate (514) is fixedly sleeved on the surface of the second piston rod (510), and the cross-section of the second piston rod (510) is set to be rectangular.

6. The semiconductor chip packaging device according to claim 5, characterized in that: A threaded sleeve (515) is fixedly sleeved on the surface of the slide cylinder (511), and a driving cylinder (516) is threadedly sleeved on the surface of the threaded sleeve (515). A first rotating plate (517) is rotatably mounted on the bottom of the lower fixed seat (401), and a second rotating plate (518) is fixedly mounted on the top of the driving cylinder (516). A rotating shaft (519) is fixedly mounted between the first rotating plate (517) and the second rotating plate (518), a rotating rod (520) is fixedly mounted between the two rotating shafts (519), and a driving rod (521) is fixedly mounted between the two rotating rods (520). A connecting rod (522) is rotatably sleeved on the surface of the driving rod (521), and the other end of the connecting rod (522) is rotatably sleeved on the surface of the reciprocating rod (503).

7. The semiconductor chip packaging device according to claim 6, characterized in that: A reversing mechanism is provided at the top of the fixing plate (403) at the lower side, and the reversing mechanism comprises a first gear (601), the first gear (601) is rotatably mounted on the top of the supporting plate (505), a connecting rod (602) is fixedly mounted on the top of the reversing valve (405), and the top of the connecting rod (602) is fixedly connected to the bottom of the first gear (601).

8. The semiconductor chip packaging device according to claim 7, characterized in that: A screw rod (603) is rotatably mounted at the bottom of the fixing seat (401) at the lower side, a second gear (604) is fixedly mounted at the bottom of the screw rod (603), the first gear (601) and the second gear (604) are meshingly connected, and a sliding rod (605) is fixedly mounted between the support plate (505) and the fixing seat (401).

9. The semiconductor chip packaging device according to claim 8, characterized in that: A first power plate (606) is sleeved between the sliding rod (605) and the screw rod (603), the first power plate (606) and the screw rod (603) are threadedly connected, a second power plate (607) is fixedly installed on the bottom of the first piston rod (501), a third power plate (608) is fixedly sleeved on the surface of the second piston rod (510), and the first power plate (606) is located between the second power plate (607) and the third power plate (608).

10. A packaging process using the semiconductor chip packaging device according to claim 9, characterized in that: The packaging steps include: S1, placing the chip body (414) in the lower mold (3), and placing the pins of the chip body (414) in the placement grooves provided on the lower mold (3), starting the hydraulic rod (411), moving the upper mold (2) downward, so that the upper mold (2) and the lower mold (3) are molded together, starting the glue injection machine (412) to inject epoxy resin into the interior of the upper mold (2) and the lower mold (3), starting the air pump (406), so that high-pressure gas enters the upper mold (2) and the lower mold (3) through the reversing valve (405) and the first air pipe (409), and squeezes the two first piston plates (404), so that the two first piston plates (404) move in opposite directions, and compacts the epoxy resin; S2. The second piston plate (509) moves upward, so that the slide cylinder (511) drives the threaded sleeve (515) to move upward. The threaded connection between the threaded sleeve (515) and the drive cylinder (516) causes the drive cylinder (516) to rotate, driving the second rotating plate (518), the rotating shaft (519), the rotating rod (520) and the driving rod (521) to rotate. Under the limiting action of the fixed block (502), the connecting rod (522) drives the reciprocating rod (503) to reciprocate, so that the reciprocating plate (504) slightly knocks the first piston rod (501) to eliminate bubbles inside the epoxy resin. S3. When the first piston plate (404) moves to the preset position, the second power plate (607) squeezes the first power plate (606), causing the first power plate (606) to move upward. The first power plate (606) squeezes the third power plate (608), causing the third power plate (608) to move upward synchronously. The first power plate (606) and the screw rod (603) are threadedly connected, causing the screw rod (603) to drive the second gear (604) to rotate, thereby causing the first gear (601) to drive the reversing valve (405) to rotate, causing the flow direction of the airflow to change, the first air pipe (409) to be closed, and the second air pipe (507) to be opened.

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