Organosilicon modified aromatic amine, high-temperature-resistant epoxy glue and preparation method of high-temperature-resistant epoxy glue

Abstract

The invention discloses organic silicon modified aromatic amine, high-temperature-resistant epoxy glue and a preparation method of the high-temperature-resistant epoxy glue. The organic silicon modified aromatic amine is obtained by reacting polydimethylsiloxane monoglycidyl ether with aromatic amine, the high-temperature-resistant epoxy glue comprises a component A and a component B, wherein the component A is obtained by mixing epoxy resin, an epoxy diluent and silica powder, and the component B is obtained by mixing organic silicon modified aromatic amine and an accelerant. The high-temperature-resistant epoxy glue prepared by taking the organic silicon modified aromatic amine as a curing agent has excellent properties of high toughness, high bonding strength, high heat resistance and convenience in operation.

Description

Technical Field

[0001] The present invention belongs to the technical field of epoxy adhesives, and more specifically, relates to an organosilicon-modified aromatic amine, a high-temperature resistant epoxy adhesive and a preparation method thereof. Background Art

[0002] Epoxy adhesives are widely used, from low temperature to high temperature. In the field of high temperature resistant epoxy adhesives, epoxy adhesives cured by aromatic amines are highly favored due to their good heat resistance, corrosion resistance, mechanical strength, etc.

[0003] However, epoxy adhesives cured by aromatic amines are brittle due to the presence of benzene rings in the molecular chain. Toughening agents are usually added to the system to improve toughness, but the addition of toughening agents will significantly reduce its glass transition temperature, heat resistance and bonding strength.

[0004] In addition, aromatic amines have low reactivity and are generally solid at room temperature, requiring heating to melt. They also have high curing temperatures and long curing times, which causes many inconveniences during use. Summary of the invention

[0005] Based on this, the object of the present invention is to provide a high temperature resistant epoxy adhesive which has high toughness, strong bonding force, strong heat resistance and is easy to operate.

[0006] The specific technical solutions for achieving the above-mentioned invention objectives include the following.

[0007] The first aspect of the present invention provides a silicone-modified aromatic amine, the structural formula of which is shown below:

[0008] n=10~50.

[0009] In a second aspect of the present invention, there is provided an organosilicon-modified aromatic amine obtained by reacting polydimethylsiloxane monoglycidyl ether end-capping with aromatic amine, wherein the molar ratio of the polydimethylsiloxane monoglycidyl ether end-capping to the aromatic amine is 0.95 to 1.05:1;

[0010] Wherein, the structural formula of the aromatic amine is as follows:

[0011]

[0012] The structural formula of the polydimethylsiloxane monoglycidyl ether end-capping is as follows:

[0013] n=10~50.

[0014] The third aspect of the present invention provides a method for preparing an organosilicon-modified aromatic amine, comprising the following steps: adding polydimethylsiloxane monoglycidyl ether as a capping agent dropwise to the melted aromatic amine, and reacting to obtain the organosilicon-modified aromatic amine.

[0015] A fourth aspect of the present invention provides a high temperature resistant epoxy adhesive, comprising component A and component B, wherein component A is obtained by mixing the following components in parts by weight:

[0016] Epoxy resin 100 parts

[0017] Epoxy diluent 5 to 25 parts

[0018] 100 to 250 parts of silicon micropowder;

[0019] The B component is obtained by mixing the following components in parts by weight:

[0020] 100 parts of the above silicone modified aromatic amine

[0021] 1 to 1.5 parts of accelerator.

[0022] A fifth aspect of the present invention provides a method for preparing a high temperature resistant epoxy adhesive, comprising the following steps:

[0023] The epoxy resin, epoxy diluent and silicon powder are stirred and mixed uniformly to obtain component A; the organosilicon-modified aromatic amine and accelerator are mixed uniformly to obtain component B.

[0024] The present invention uses polydimethylsiloxane monoglycidyl ether with a specific silicone chain length to cap a specific type of aromatic amine to prepare an organosilicon-modified aromatic amine, so that an organosilicon chain segment of appropriate length is introduced into the aromatic amine. The organosilicon-modified aromatic amine is used as a curing agent in a high-temperature resistant epoxy adhesive, which can improve the toughness of the high-temperature resistant epoxy adhesive while maintaining a high bonding strength and good high-temperature resistance. The modified aromatic amine introduced with the organosilicon chain segment is liquid at room temperature, which is more convenient in construction. Therefore, the high-temperature resistant epoxy adhesive prepared by using the organosilicon-modified aromatic amine of the present invention as a curing agent has the excellent properties of high toughness, high bonding strength, strong heat resistance, and convenient operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is the infrared spectrum of the organosilicon-modified aromatic amine of Example 1 of the present invention. DETAILED DESCRIPTION

[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0027] Unless otherwise defined, all technical and scientific terms used in the present invention have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the present invention includes any and all combinations of one or more of the related listed items.

[0028] Unless otherwise specified, the experimental methods used in the following examples are all conventional methods, and the materials, reagents, etc. used can be purchased from commercial channels unless otherwise specified.

[0029] In some embodiments of the present invention, a silicone-modified aromatic amine is disclosed, and its structural formula is shown below:

[0030] n=10~50.

[0031] In some embodiments, n=10-26.

[0032] In some embodiments, n=10-18.

[0033] In other embodiments of the present invention, a silicone-modified aromatic amine is disclosed, which is obtained by reacting polydimethylsiloxane monoglycidyl ether end-capping and aromatic amine, wherein the molar ratio of the polydimethylsiloxane monoglycidyl ether end-capping and the aromatic amine is 0.95 to 1.05:1;

[0034] Wherein, the structural formula of the aromatic amine is as follows:

[0035]

[0036] The structural formula of the polydimethylsiloxane monoglycidyl ether end-capping is as follows:

[0037] n=10~50.

[0038] In some embodiments, n=10-26.

[0039] In some embodiments, n=10-18.

[0040] In some of the embodiments, the molar ratio of the polydimethylsiloxane monoglycidyl ether end-capping agent to the aromatic amine is 0.98-1.02:1.

[0041] In some of the embodiments, the molar ratio of the polydimethylsiloxane monoglycidyl ether end-capping agent to the aromatic amine is 0.99-1.01:1.

[0042] In other embodiments of the present invention, a method for preparing the above-mentioned organosilicon-modified aromatic amine is disclosed, comprising the following steps: adding polydimethylsiloxane monoglycidyl ether to the melted aromatic amine for end-capping, and reacting to obtain the organosilicon-modified aromatic amine.

[0043] In some embodiments, the reaction temperature is 150° C. to 170° C., and the reaction time is 1.5 h to 2.5 h.

[0044] In some of the embodiments, the reaction is carried out in the presence of a promoter. In the process of preparing the organosilicon-modified aromatic amine, adding a promoter is beneficial to lowering the reaction temperature.

[0045] In some of the embodiments, the method for preparing the organosilicon-modified aromatic amine comprises the following steps: adding a promoter and polydimethylsiloxane monoglycidyl ether to the melted aromatic amine for end-capping, controlling the temperature at 110°C to 130°C, completing the addition within 1h to 3h, and then reacting at 110°C to 130°C for 1.5h to 2.5h.

[0046] In some embodiments, the promoter is 2,4,6-tris(dimethylaminomethyl)phenol, and the molar ratio of the promoter to the aromatic amine is 0.008-0.012:1.

[0047] In other embodiments of the present invention, a high temperature resistant epoxy adhesive is disclosed, comprising component A and component B, wherein component A is obtained by mixing the following components in parts by weight:

[0048] Epoxy resin 100 parts

[0049] Epoxy diluent 5 to 25 parts

[0050] 100 to 250 parts of silicon powder.

[0051] The B component is obtained by mixing the following components in parts by weight:

[0052] 100 parts of the above silicone modified aromatic amine

[0053] 1 to 1.5 parts of accelerator.

[0054] In some embodiments, the weight ratio of component A to component B is 1:0.5-2.

[0055] In some embodiments, the weight ratio of component A to component B is 1:0.5-1.5.

[0056] In some embodiments, the weight ratio of component A to component B is 1:0.8-1.2.

[0057] In some embodiments, the epoxy diluent is benzyl glycidyl ether.

[0058] In some embodiments, the accelerator is 2,4,6-tris(dimethylaminomethyl)phenol.

[0059] In other embodiments of the present invention, a method for preparing the above-mentioned high temperature resistant epoxy adhesive is disclosed, comprising the following steps: stirring and mixing epoxy resin, epoxy diluent, and silicon micropowder to obtain component A, and mixing silicone-modified aromatic amine and accelerator to obtain component B.

[0060] In the following examples, organosilicon-modified aromatic amines were prepared using aromatic amines and polydimethylsiloxane monoglycidyl ether as reaction raw materials, and the reaction principle is as follows:

[0061]

[0062] Among them, n=10~50.

[0063] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0064] Example 1

[0065] The high temperature resistant epoxy adhesive of this embodiment includes the following preparation materials (by weight) and steps:

[0066] 1. Add 1 mol of aromatic amine (structural formula: ) Raise the temperature to 120℃ and keep it for 2 hours until the aromatic amine melts. Add 0.01mol 2,4,6-tris(dimethylaminomethyl)phenol and 1mol polydimethylsiloxane monoglycidyl ether to cap The temperature was controlled at 120° C., the dropwise addition was completed within 2 hours, and the temperature was kept at 120° C. and the reaction was continued for 2 hours to obtain component B containing silicone-modified aromatic amine and 2,4,6-tris(dimethylaminomethyl)phenol, and the mass ratio of the silicone-modified aromatic amine to 2,4,6-tris(dimethylaminomethyl)phenol was 100:1.3.

[0067] The structural formula of silicone-modified aromatic amine is as follows:

[0068]

[0069] Its infrared spectrum is Figure 1 As shown in the figure, the product also has 1625cm -1 and 1513cm -1 The raw material absorption peak, and 910cm -1 The characteristic peak of epoxy has disappeared, indicating that the epoxy groups have been consumed.

[0070] 2. Weigh 100 parts of epoxy resin (Baling Petrochemical CYD-128), 15 parts of benzyl glycidyl ether (epoxy diluent), and 150 parts of silicon powder, mix well to obtain component A;

[0071] 3. When using, mix component A and component B evenly in a weight ratio of 1:0.6.

[0072] Example 2

[0073] The high temperature resistant epoxy adhesive of this embodiment includes the following preparation materials (by weight) and steps:

[0074] 1. Add 1 mol of aromatic amine (same as in Example 1) to a three-necked flask equipped with a stirrer, a thermometer, a reflux condenser, and a dropping funnel, raise the temperature to 120°C, and keep warm for 2 hours until the aromatic amine melts. Add 0.01 mol of 2,4,6-tris(dimethylaminomethyl)phenol and 1 mol of polydimethylsiloxane monoglycidyl ether to cap the mixture.

[0075] The temperature was controlled at 110° C., the dropwise addition was completed within 3 hours, and the reaction was continued at 120° C. for 2 hours to obtain component B containing organosilicon-modified aromatic amine and 2,4,6-tris(dimethylaminomethyl)phenol;

[0076] The structural formula of the obtained organosilicon-modified aromatic amine is as follows:

[0077]

[0078] 2. Weigh 100 parts of epoxy resin (Baling Petrochemical CYD-128), 15 parts of benzyl glycidyl ether (epoxy diluent), and 150 parts of silicon powder, mix well to obtain component A;

[0079] 3. When using, mix component A and component B evenly in a weight ratio of 1:0.9.

[0080] Example 3

[0081] The high temperature resistant epoxy adhesive of this embodiment includes the following preparation materials (by weight) and steps:

[0082] 1. Add 1 mol of aromatic amine (same as in Example 1) to a three-necked flask equipped with a stirrer, a thermometer, a reflux condenser, and a dropping funnel, raise the temperature to 120°C, and keep warm for 2 hours until the aromatic amine melts. Add 0.01 mol of 2,4,6-tris(dimethylaminomethyl)phenol and 1 mol of polydimethylsiloxane monoglycidyl ether to cap the mixture.

[0083] The temperature was controlled at 115° C., the dropwise addition was completed within 3 hours, and the reaction was continued at 120° C. for 2 hours to obtain component B containing organosilicon-modified aromatic amine and 2,4,6-tris(dimethylaminomethyl)phenol;

[0084] The structural formula of the obtained organosilicon-modified aromatic amine is as follows:

[0085]

[0086] 2. Weigh 100 parts of epoxy resin (Baling Petrochemical CYD-128), 15 parts of benzyl glycidyl ether (epoxy diluent), and 150 parts of silicon powder, mix well to obtain component A;

[0087] 3. When using, mix component A and component B evenly in a weight ratio of 1:1.2.

[0088] Example 4

[0089] The high temperature resistant epoxy adhesive of this embodiment includes the following preparation materials (by weight) and steps:

[0090] 1. Add 1 mol of aromatic amine (same as in Example 1) to a three-necked flask equipped with a stirrer, a thermometer, a reflux condenser, and a dropping funnel, raise the temperature to 120°C, and keep warm for 2 hours until the aromatic amine melts. Add 1 mol of polydimethylsiloxane monoglycidyl ether to cap The temperature was controlled at 115°C, the dropwise addition was completed within 3 hours, and the reaction was carried out at 160°C for 2 hours to obtain an organosilicon-modified aromatic amine; the structural formula is as follows:

[0091]

[0092] 2. Weigh 100 parts of organosilicon-modified aromatic amine and 1.3 parts of 2,4,6-tris(dimethylaminomethyl)phenol, mix them evenly to obtain component B;

[0093] 3. Weigh 100 parts of epoxy resin (Baling Petrochemical CYD-128), 15 parts of benzyl glycidyl ether (epoxy diluent), and 150 parts of silicon powder, mix well to obtain component A;

[0094] 4. When using, mix component A and component B evenly in a weight ratio of 1:1.5.

[0095] Example 5

[0096] The high temperature resistant epoxy adhesive of this embodiment includes the following preparation materials (by weight) and steps:

[0097] 1. Add 1 mol of aromatic amine (same as in Example 1) to a three-necked flask equipped with a stirrer, a thermometer, a reflux condenser, and a dropping funnel, raise the temperature to 120°C, and keep warm for 2 hours until the aromatic amine melts. Add 0.01 mol of 2,4,6-tris(dimethylaminomethyl)phenol and 1 mol of polydimethylsiloxane monoglycidyl ether to cap the mixture.

[0098] The temperature was controlled at 115° C., the dropwise addition was completed within 3 hours, and the reaction was continued at 120° C. for 2 hours to obtain component B containing organosilicon-modified aromatic amine and 2,4,6-tris(dimethylaminomethyl)phenol;

[0099] The structural formula of the obtained organosilicon-modified aromatic amine is as follows:

[0100]

[0101] 2. Weigh 100 parts of epoxy resin (Baling Petrochemical CYD-128), 15 parts of benzyl glycidyl ether (epoxy diluent), and 150 parts of silicon powder, mix well to obtain component A;

[0102] 3. When using, mix component A and component B evenly in a weight ratio of 1:1.8.

[0103] Example 6

[0104] The high temperature resistant epoxy adhesive of this embodiment includes the following preparation materials (by weight) and steps:

[0105] 1. Add 1 mol of aromatic amine (same as in Example 1) to a three-necked flask equipped with a stirrer, a thermometer, a reflux condenser, and a dropping funnel, raise the temperature to 120°C, and keep warm for 2 hours until the aromatic amine melts. Add 0.01 mol of 2,4,6-tris(dimethylaminomethyl)phenol and 1 mol of polydimethylsiloxane monoglycidyl ether to cap the mixture.

[0106] The temperature was controlled at 115° C., the dropwise addition was completed within 3 hours, and the reaction was continued at 120° C. for 2 hours to obtain component B containing organosilicon-modified aromatic amine and 2,4,6-tris(dimethylaminomethyl)phenol;

[0107] The structural formula of the obtained organosilicon-modified aromatic amine is as follows:

[0108]

[0109] 2. Weigh 100 parts of epoxy resin (Baling Petrochemical CYD-128), 15 parts of benzyl glycidyl ether (epoxy diluent), and 150 parts of silicon powder, mix well to obtain component A;

[0110] 3. When using, mix component A and component B evenly in a weight ratio of 1:2.

[0111] Comparative Example 1

[0112] The high temperature resistant epoxy adhesive of this comparative example comprises the following preparation raw materials (by weight) and steps:

[0113] 1. Weigh 100 parts of epoxy resin (Baling Petrochemical CYD-128), 15 parts of benzyl glycidyl ether (epoxy diluent), and 150 parts of silicon powder, mix well to obtain component A;

[0114] 2. Weigh 100 parts of aromatic amine (same as in Example 1) and 1.3 parts of 2,4,6-tris(dimethylaminomethyl)phenol, mix well, and obtain component B;

[0115] 3. When using, mix component A and component B evenly in a weight ratio of 8:1.

[0116] Comparative Example 2

[0117] The high temperature resistant epoxy adhesive of this comparative example comprises the following preparation raw materials (by weight) and steps:

[0118] 1. Weigh 100 parts of epoxy resin (Baling Petrochemical CYD-128), 15 parts of benzyl glycidyl ether (epoxy diluent), 150 parts of silicon powder, and 15 parts of toughening agent MX154 (Japan Zhongyuan), mix well to obtain component A;

[0119] 2. Weigh 100 parts of aromatic amine (same as in Example 1) and 1.3 parts of 2,4,6-tris(dimethylaminomethyl)phenol, mix well, and obtain component B;

[0120] 3. When using, mix component A and component B evenly in a weight ratio of 8:1.

[0121] Comparative Example 3

[0122] The high temperature resistant epoxy adhesive of this comparative example comprises the following preparation raw materials (by weight) and steps:

[0123] 1. Add 1 mol of aromatic amine (same as in Example 1) to a three-necked flask equipped with a stirrer, a thermometer, a reflux condenser, and a dropping funnel, raise the temperature to 120°C, and keep warm for 2 hours until the aromatic amine melts. Add 0.01 mol of 2,4,6-tris(dimethylaminomethyl)phenol and 1 mol of epoxy-terminated tetramethyldisiloxane dropwise, control the temperature at 110°C, complete the addition within 3 hours, keep warm at 120°C and continue the reaction for 2 hours to obtain component B;

[0124] 2. Component A was prepared in the same manner as in Example 2.

[0125] 3. When using, mix component A and component B evenly in a weight ratio of 5:1.

[0126] Comparative Example 4

[0127] The high temperature resistant epoxy adhesive of this comparative example comprises the following preparation raw materials (by weight) and steps:

[0128] 1. Add 1 mol of aromatic amine (same as in Example 1) to a three-necked flask equipped with a stirrer, a thermometer, a reflux condenser, and a dropping funnel, raise the temperature to 120°C, and keep warm for 2 hours until the aromatic amine melts. Add 0.01 mol of 2,4,6-tris(dimethylaminomethyl)phenol and 1 mol of epoxy-terminated octamethyltetrasiloxane dropwise, control the temperature at 110°C, complete the addition within 3 hours, keep warm at 120°C and continue the reaction for 2 hours to obtain component B;

[0129] 2. Component A was prepared in the same manner as in Example 2.

[0130] 3. When using, mix component A and component B evenly in a weight ratio of 5:1.

[0131] Comparative Example 5

[0132] The high temperature resistant epoxy adhesive of this comparative example comprises the following preparation raw materials (by weight) and steps:

[0133] 1. Add 1 mol of p-phenylenediamine into a three-necked flask with a stirrer, thermometer, reflux condenser, and dropping funnel. Heat to 120°C and keep warm for 2 hours until the aromatic amine melts. Add 0.01 mol 2,4,6-tris(dimethylaminomethyl)phenol and 1 mol polydimethylsiloxane monoglycidyl ether to cap the mixture.

[0134] The temperature was controlled at 110°C, the dropwise addition was completed within 3 hours, and the reaction was continued at 120°C for 2 hours to obtain component B;

[0135] 2. Weigh 100 parts of epoxy resin (Baling Petrochemical CYD-128), 15 parts of benzyl glycidyl ether (epoxy diluent), and 150 parts of silicon powder, mix well to obtain component A;

[0136] 3. When using, mix component A and component B evenly in a weight ratio of 1:0.8.

[0137] Comparative Example 6

[0138] The high temperature resistant epoxy adhesive provided in this comparative example, except for the preparation of modified aromatic amine, the modifier polydimethylsiloxane monoglycidyl ether end-capping structure formula used is In addition, when used, component A and component B are uniformly mixed in a weight ratio of 1:0.4, and other preparation methods are the same as those in Example 2.

[0139] Comparative Example 7

[0140] The high temperature resistant epoxy adhesive provided in this comparative example, except for the preparation of modified aromatic amine, the modifier polydimethylsiloxane monoglycidyl ether end-capping structure used is In addition, when used, component A and component B are uniformly mixed in a weight ratio of 1:2.5. Other preparation methods are the same as those in Example 2.

[0141] The following performance tests were performed on the high temperature resistant epoxy adhesives prepared in Examples 1 to 6 and Comparative Examples 1 to 7:

[0142] Glass transition temperature: static thermomechanical analysis (TMA)

[0143] Impact strength: tested according to GB / T 1043.1-2008

[0144] Room temperature shear strength: tested according to GB / T7124-2008

[0145] 80℃ shear strength: tested according to GB / T7124-2008

[0146] The results are shown in Table 1.

[0147] Table 1 Performance results of various high temperature resistant epoxy adhesives

[0148]

[0149] As can be seen from Table 1, the high temperature resistant epoxy adhesive (Examples 1 to 6) prepared by using the organosilicon modified aromatic amine of the present invention as a curing agent has high impact strength, bonding strength and glass transition temperature. In addition, when the high temperature resistant epoxy adhesive of the present invention is used, component A and component B can be directly mixed without heating and curing, and the operation is convenient.

[0150] The high temperature resistant epoxy adhesive (Comparative Example 1) prepared by using unmodified aromatic amine curing agent has very low impact strength and poor toughness. The high temperature resistant epoxy adhesive (Comparative Example 2) prepared by adding conventional toughening agent to the epoxy adhesive system, although the impact strength is improved, the bonding strength and glass transition temperature will significantly decrease, and the high temperature resistance performance is significantly reduced. The organosilicon-modified aromatic amine (Comparative Example 3 and Comparative Example 4) made of terminal epoxy tetramethyl disiloxane and terminal epoxy octamethyl disiloxane modified diaminodiphenylmethane is used as a curing agent. The prepared high temperature resistant epoxy adhesive can improve the toughness of the cured product to a certain extent, but the improvement is still not ideal, and the shear strength is also insufficient. Using polydimethylsiloxane monoglycidyl ether end-capped modified p-phenylenediamine, the epoxy adhesive (Comparative Example 5) prepared by it can not guarantee its good heat resistance and high temperature adhesion while improving toughness. However, when polydimethylsiloxane monoglycidyl ether with a lower n value is used to block modified aromatic amine, the toughness of the epoxy adhesive prepared therefrom (Comparative Example 6) is limitedly improved; when polydimethylsiloxane monoglycidyl ether with a higher n value is used to block modified aromatic amine, the toughness of the epoxy adhesive prepared therefrom (Comparative Example 7) is improved while the bonding strength decreases.

[0151] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0152] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An organosilicon-modified aromatic amine, characterized in that: Its structural formula is as follows: n=10-50, preferably n=10-26, more preferably n=10-18.

2. An organosilicon-modified aromatic amine, characterized in that: It is obtained by reacting polydimethylsiloxane monoglycidyl ether end-capping with aromatic amine, wherein the molar ratio of the polydimethylsiloxane monoglycidyl ether end-capping to the aromatic amine is 0.95-1.05:1; Wherein, the structural formula of the aromatic amine is as follows: The structural formula of the polydimethylsiloxane monoglycidyl ether end-capping is as follows: n=10-50, preferably n=10-26, more preferably n=10-18.

3. The organosilicon-modified aromatic amine according to claim 2, characterized in that: The molar ratio of the polydimethylsiloxane monoglycidyl ether end-capping agent to the aromatic amine is 0.98 to 1.02:1, preferably 0.99 to 1.01:

1.

4. A method for preparing the organosilicon-modified aromatic amine according to claim 2 or 3, characterized in that: The following steps are involved: Polydimethylsiloxane monoglycidyl ether is added dropwise to the melted aromatic amine for end-capping, and the organosilicon-modified aromatic amine is obtained by reaction.

5. The method for preparing organosilicon-modified aromatic amine according to claim 4, characterized in that: The reaction temperature is 150°C to 170°C, and the reaction time is 1.5h to 2.5h; And / or, the reaction is carried out in the presence of a promoter; comprising the following steps: adding a promoter and polydimethylsiloxane monoglycidyl ether to the melted aromatic amine for end-capping, controlling the temperature at 110°C to 130°C, completing the addition within 1h to 3h, and then reacting at 110°C to 130°C for 1.5h to 2.5h.

6. The method for preparing the organosilicon-modified aromatic amine according to claim 5, characterized in that: The accelerator is 2,4,6-tris(dimethylaminomethyl)phenol; And / or, the molar ratio of the promoter to the aromatic amine is 0.008-0.012:

1.

7. A high temperature resistant epoxy adhesive, characterized in that: The invention comprises component A and component B, wherein component A is obtained by mixing the following components in parts by weight: Epoxy resin 100 parts Epoxy diluent 5 to 25 parts 100 to 250 parts of silicon micropowder; The B component is obtained by mixing the following components in parts by weight: 100 parts of the organosilicon-modified aromatic amine according to any one of claims 1 to 3 1 to 1.5 parts of accelerator.

8. The high temperature resistant epoxy adhesive according to claim 7, characterized in that: The weight ratio of component A to component B is 1:0.5-2, preferably 1:0.5-1.5, and more preferably 1:0.8-1.

2.

9. The high temperature resistant epoxy adhesive according to claim 7 or 8, characterized in that: The epoxy diluent is benzyl glycidyl ether; and / or the accelerator is 2,4,6-tris(dimethylaminomethyl)phenol.

10. A method for preparing the high temperature resistant epoxy adhesive according to any one of claims 7 to 9, characterized in that: The following steps are involved: The epoxy resin, epoxy diluent and silicon powder are stirred and mixed uniformly to obtain component A; the organosilicon-modified aromatic amine and accelerator are mixed uniformly to obtain component B.

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