Underfill adhesive and preparation method thereof

CN119752375AActive Publication Date: 2025-04-04WANHUA CHEM GRP CO LTD
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Patent Information

Application Number
CN202510006200.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-03
Publication Date
2025-04-04
Estimated Expiration
2045-01-03

AI Technical Summary

Technical Problem

In the prior art, the warping problem caused by the difference in thermal and mechanical properties of the material during assembly process has not been effectively solved.

Method used

By modifying the resin, introducing a tough resin segment and a fluorene ring structure, a polyurethane modified fluorene epoxy resin was prepared, combined with bisphenol A type epoxy resin and other components to form a low-stress and high-reliability underfill glue.

Benefits of technology

This bottom filler has the characteristics of high toughness, low stress, low warpage, high temperature resistance, high humidity resistance, and impact resistance. It significantly reduces the warping problem of large-sized chips and improves its performance in high temperature and high humidity environments.

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Abstract

The invention discloses an underfill adhesive and a preparation method thereof. The underfill adhesive comprises the following raw materials in parts by weight: 5-20 parts of epoxy resin, 10-30 parts of modified epoxy resin and 1-10 parts of a diluent. 0.1 to 2 parts of pigment; 0.1 to 2 parts of a coupling agent; 10-30 parts of a curing agent; 0.1 to 5 parts of an accelerant; and 30-60 parts of a filler. The modified epoxy resin is polyurethane modified fluorene ring epoxy resin, and the epoxy resin has both a polyurethane flexible chain segment and a fluorene ring rigid structure, and has both flexibility and temperature resistance. The underfill adhesive disclosed by the invention has the characteristics of high toughness, low stress, low warping, high temperature resistance, high moisture resistance, impact resistance and the like.
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Citation Information

Patent Citations

  • Flux-compatible epoxy-anhydride adhesive compositions for low-gap underfill applications

    WO2021247532A1

  • Yellowing-free shrinkage-free high-toughness low-temperature curing adhesive and preparation method thereof

    CN111057503A

  • Low-modulus fast-curing chip mounting adhesive and preparation method thereof

    CN116239979A

  • Epoxide resin compositions and method

    US4983672A

  • Epoxide resin compositions and method

    US5045363A