Liquid epoxy resin mixture as well as preparation method and application thereof

Abstract

The invention discloses a liquid epoxy resin composition as well as a preparation method and application of the liquid epoxy resin composition. The coating comprises the following raw materials: 70%-92% of an inorganic silicon filler, 0.5%-10% of aliphatic epoxy resin, 0.5%-15% of epoxy resin containing aromatic rings, 1-15% of an anhydride curing agent, 0.1-2% of a bonding accelerator, 0.1-1% of a curing accelerator, 0.1-5% of a flexibilizer and 0.1-5% of a warping control aid. The liquid epoxy composition provided by the invention not only has higher glass transition temperature and modulus through the warping control assistant, but also can control the warping deformation of the composition, is especially suitable for packaging protection of a 12-inch wafer, and reduces the generation of stress in the wafer packaging process through warping control.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor electronic packaging materials, and in particular relates to a liquid epoxy resin mixture and a preparation method and application thereof. Background Art

[0002] In recent years, with the continuous development of integrated circuits, electronic packaging has new requirements for low cost, high performance and high integration, and the size tends to be smaller, lighter and thinner. As a type of advanced packaging technology, wafer-level packaging is more in line with the needs and trends of consumer electronics development. Traditional packaging structural materials generally use epoxy molding compounds, but they cannot meet the harsh conditions such as the shortened spacing between metal leads in electronic products and the thinning thickness of packaging devices caused by miniaturization. Wafer-level packaging is a process in which most of the process in packaging is to operate the wafer, and then cut it into a single chip. Plastic sealing is a key step, and liquid epoxy resin mixture is often used for compression molding (Compression Molding), and the entire wafer is plastic sealed and monolithic at the same time, thereby greatly improving its production efficiency and reducing production costs. It is mainly prepared by low-viscosity liquid epoxy resin, spherical silicon powder, epoxy curing agent and accelerator, silicon powder surface treatment agent and other functional additives through appropriate processes.

[0003] However, the wafers that have been plastic-sealed in wafer-level packaging are prone to warping and deformation, which in turn affects the yield of grinding, cutting, assembly and other subsequent processes. The warping of wafers is mainly caused by factors such as the curing shrinkage of the epoxy resin composition, the uneven shrinkage of the 12-inch wafer size material, the orientation effect of the material caused by the shear stress during the wafer molding process, and the difference in thermal expansion coefficient between the material and the wafer. Excessive warping will affect the use of the packaged chip, and the warping height of the packaged chip is generally required to be between 2cm and 3cm for convenient use. Packaged products with a warping height of more than 3cm will be treated as defective products in industrial production, which indirectly increases the packaging cost; therefore, how to provide a low-warping liquid epoxy resin composition to achieve low-cost packaging of electronic products is a technical problem that urgently needs to be solved.

[0004] Prior art patent CN115703918A suppresses warping by improving the flexibility of the resin system and reducing the thermal expansion coefficient of the epoxy resin composition. Patent CN116462936A uses a dibenzo octahedral anhydride curing agent to make the thermal expansion coefficient of the cured product of the epoxy resin composition adjustable, which can effectively reduce the warping of the molded part after resin encapsulation. Patent CN116694275A introduces small-particle silica particles to reduce the increase in the length of the liquid epoxy molding compound in a certain direction at a unit temperature in the molding stage, which can effectively reduce the thermal expansion coefficient of the liquid epoxy molding compound in the molding stage, thereby reducing the warping during the wafer packaging process. It can be seen that most of the prior art controls warping by controlling the thermal expansion coefficient of the epoxy resin composition, but this method cannot take into account the high fluidity of the epoxy resin composition. Summary of the invention

[0005] In order to solve the problems raised in the above background technology, the purpose of the present invention is to provide a liquid epoxy resin composition with high fluidity and low warpage, which not only has high fluidity and low thermal expansion coefficient, but also has the characteristics of low warpage deformation.

[0006] Another object of the present invention is to provide a preparation method and application of the liquid epoxy resin composition with high fluidity and low warpage.

[0007] In order to achieve the above object, the technical solution adopted by the present invention is:

[0008] In one aspect, the present invention provides a liquid epoxy resin composition, wherein the raw material composition thereof comprises, by mass percentage:

[0009] Inorganic silicon filler 70%-92%, aliphatic epoxy resin 0.5%-10%, aromatic ring epoxy resin 0.5%-15%, anhydride curing agent 1-15%, adhesion promoter 0.1-2%, curing promoter 0.1-1%, toughening agent 0.1-5% and warpage control agent 0.1-5%;

[0010] The aromatic ring-containing epoxy resin is an epoxy resin containing an aromatic ring in the molecular chain;

[0011] The inorganic silicon filler is an inorganic silicon filler modified by a silane coupling agent containing an olefin chain with carbon atoms of C5-C20.

[0012] Furthermore, the raw material composition is as follows, by mass percentage:

[0013] 80%-92% of inorganic silicon filler, 1%-5% of aliphatic epoxy resin, 1%-10% of aromatic ring epoxy resin, 1-10% of acid anhydride curing agent, 0.1-2% of adhesion promoter, 0.1-1% of curing promoter, 1-5% of toughening agent and 0.5-5% of warpage control agent.

[0014] Preferably, the inorganic silicon filler is an inorganic silicon filler modified by a silane coupling agent containing an olefin chain with carbon atoms of C5-C15;

[0015] More preferably, the inorganic silicon filler is an inorganic silicon filler modified by a silane coupling agent containing an olefin chain with carbon atoms of C10-C15; for example, silica modified by a silane coupling agent containing an olefin chain with carbon atoms of C10-C15.

[0016] Furthermore, the modified inorganic silicon filler is spherical in shape, and has an average particle size of 1 μm to 50 μm, preferably 10-30 μm.

[0017] Furthermore, the aliphatic epoxy resin is an aliphatic epoxy resin having no cyclic structure other than epoxy groups;

[0018] Preferably, the aliphatic epoxy resin includes at least one of vinyl glycidyl ether, allyl glycidyl ether, alkylene glycol diglycidyl ether, poly(alkylene glycol) diglycidyl ether, alkenylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol glycidyl ether, dipentaerythritol glycidyl ether and the like.

[0019] Furthermore, the aliphatic epoxy resin is one or more of poly(alkylene glycol) diglycidyl ether, alkenylene glycol diglycidyl ether, and trimethylolpropane triglycidyl ether.

[0020] Furthermore, the aromatic ring-containing epoxy resin includes one or a combination of at least two of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, biphenyl epoxy resin, naphthalene epoxy resin, bisphenol AD ​​epoxy resin, p-hydroxybenzoic acid, diglycidyl aniline, 1,1,2,2-tetrakis(p-hydroxyphenyl)ethane tetraglycidyl ether epoxy resin, and p-aminophenol triglycidyl epoxy resin.

[0021] Furthermore, the anhydride curing agent is selected from one or a combination of at least two of phthalic anhydride, trimellitic anhydride glyceride, polyazelaic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, glutaric anhydride, dichloromaleic anhydride, ethylene glycol ditrimellitate, and succinic anhydride.

[0022] Preferably, the adhesion promoter is selected from one or a combination of at least two of γ-(2,3-epoxypropoxy)propyltrimethoxysilane, propyl glycidyl ether trimethoxysilane, γ-epoxypropyl ether trimethoxysilane, trimethoxysilane, γ-aminopropyltriethoxysilane, and γ-mercaptopropyltrimethoxysilane;

[0023] Preferably, the curing accelerator is selected from one or a combination of two of imidazole compounds and triphenylphosphine; more preferably, the imidazole compound is selected from one or a combination of at least two of 2-phenyl-4,5-dihydroxymethylimidazole, 2-methylimidazole, 2-phenylimidazole, dimethyl-imidazole isocyanurate, triphenylphosphine, and triphenylphosphine-1,4-benzoquinone adduct;

[0024] Preferably, the toughening agent is selected from one or a combination of at least two of nitrile rubber, polysulfide rubber, polybutadiene, polyether elastomer, silicone resin, silicone rubber, silicone-modified epoxy resin, polyether-modified epoxy resin, and modified polyurethane;

[0025] Preferably, the warpage control agent is one or a combination of at least two of silicone oil, silane coupling agent, silicone rubber, silicone resin, fatty alcohol sulfate, alkyl phosphate, and sulfonate type anionic surfactant, preferably at least one of silicone oil, silane coupling agent, silicone rubber, and silicone resin;

[0026] Preferably, the warpage control agent is one or a combination of at least two of methyl silicone oil, ethyl silicone oil, phenyl silicone oil, methyl hydrogen silicone oil, methyl phenyl silicone oil, methyl chlorophenyl silicone oil, methyl ethoxy silicone oil, methyl trifluoropropyl silicone oil, methyl vinyl silicone oil, methyl hydroxy silicone oil, ethyl hydrogen silicone oil, hydroxy hydrogen silicone oil, single-end modified silicone oil, side chain modified silicone oil, double-end modified silicone oil, and polyorganosiloxane;

[0027] More preferably, the warpage control aid is selected from one or a combination of at least two of methyl silicone oil, single-end modified silicone oil, and double-end modified silicone oil.

[0028] On the other hand, the present invention provides a method for preparing any of the above-mentioned liquid epoxy resin compositions, comprising the following steps: mixing the alicyclic epoxy resin, the aromatic ring-containing epoxy resin, the anhydride curing agent, the curing accelerator, the toughening agent, the warpage control aid and the inorganic silicon filler, and premixing to obtain a mixture; grinding the mixture to a target particle size, and then performing vacuum degassing to obtain a liquid epoxy resin mixture.

[0029] On the other hand, the present invention also provides an application of the aforementioned liquid epoxy resin composition or the liquid epoxy resin composition prepared by the aforementioned preparation method in an integrated circuit 2.5D / 3D advanced packaging WLCSP or CoWoS packaging process.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] The liquid epoxy resin composition provided by the present invention changes the surface tension of the contact interface, eliminates the orientation effect, and inhibits warping by introducing a warpage control agent. At the same time, due to the functional groups on the molecular chain of the warpage control agent, the curing shrinkage internal stress of the epoxy resin composition can be further reduced. Therefore, the liquid epoxy resin composition provided by the present invention not only has high fluidity and low thermal expansion coefficient, but also can control warping by controlling the fluidity difference of the package contact interface. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in combination with specific implementation methods. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0033] Unless otherwise specified, various raw materials, reagents, instruments and equipment used in this application can be purchased from the market or prepared by existing methods.

[0034] The sources of the ingredients are as follows:

[0035] Aliphatic epoxy resin (Anhui Xinyuan);

[0036] Aromatic epoxy resin ("YD8125, YD8170" manufactured by Nippon Steel Corporation, HP4032D manufactured by DIC Corporation);

[0037] Anhydride curing agent (AMH850 from Zhejiang Alpha Chemical);

[0038] accelerator (purchased from Merck Chemicals);

[0039] Modified silica NQ1175D, 25W1, S31055EA (purchased from Jiangsu Lianrui New Materials Co., Ltd.);

[0040] Toughening agent (purchased from Shenzhen Jiadida Chemical Co., Ltd.);

[0041] Adhesion promoters γ-(2,3-epoxypropoxy)propyltrimethoxysilane KH560 and γ-aminopropyltriethoxysilane KH550 were purchased from Hangzhou Jessica Co., Ltd.;

[0042] Warpage control additives (organic silicon compounds KF96, X-22-163, and X-22-173 were purchased from Ziyue Chemical, and sulfonate additive Tamol NN9401 was purchased from BASF).

[0043] The performance testing methods involved in the following embodiments are as follows:

[0044] Warpage evaluation: On a wafer with a thickness of 775μm and a diameter of 300mm, a liquid epoxy resin composition was compression molded at 5MPa and 125°C for 10 minutes using a Yamada compression molding machine to obtain a packaging material with a thickness of 1500μm. The prepared compression molded sample was cured at 150°C for 1 hour to obtain a sample for warpage test. The cured sample was placed on a horizontal laboratory table, a ruler was placed vertically on the laboratory table and close to the sample, and the highest point of the edge warping was taken as the warpage deformation.

[0045] Evaluation of thermal expansion coefficient and glass transition temperature (Tg): The cured product with a size of 3 mm × 3 mm × 4 mm was measured using TMA450 manufactured by TA. The measurement was performed from 10°C to 280°C at a heating rate of 5°C / min. The thermal expansion coefficient (ppm / °C) between 25°C and 60°C is CTE1, the thermal expansion coefficient (ppm / °C) between 170°C and 220°C is CTE2, and the intersection of the two tangents is Tg.

[0046] Example 1

[0047] The proportions of each component of the liquid epoxy resin composition are as follows:

[0048]

[0049]

[0050] The liquid epoxy resin composition of the present invention is prepared by the following method:

[0051] First, epoxy resin, anhydride curing agent, toughening agent, adhesion promoter, and warpage control agent are uniformly mixed at room temperature, the mixture obtained above is fully mixed with inorganic filler at 35° C. and then cooled to room temperature, and finally a curing accelerator is added and mixed uniformly to obtain a liquid epoxy resin composition.

[0052] In this embodiment, the Tg of the liquid epoxy resin composition is 153° C., the thermal expansion coefficient CTE1: 7 ppm / K, CTE2: 31 ppm / K, and the warpage deformation is 2 mm.

[0053] Example 2

[0054] The proportions of each component of the liquid epoxy resin composition are as follows:

[0055] Components Mass percentage / % Aliphatic epoxy resin XY207 2.5 Aromatic epoxy resin YD8170 0.8 Aromatic epoxy resin HP4032D 3.5 Acid anhydride curing agent AMH850 4.5 Adhesion promoter KH560 0.1 Curing accelerator triphenylphosphine 0.5 Silica NQ1175D 87.5 Toughening agent MX154 0.1 Warpage Control Agent X-22-163 0.5

[0056] In this example, the liquid epoxy resin composition is prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0057] In this embodiment, the liquid epoxy resin composition has a Tg of 151°C and a thermal expansion coefficient CTE1:

[0058] 7.3ppm / K, CTE2: 32ppm / K, warpage deformation is 3mm.

[0059] Example 3

[0060] The proportions of each component of the liquid epoxy resin composition are as follows:

[0061] Components Mass percentage / % Aliphatic epoxy resin XY622 0.9 Aliphatic epoxy resin XY632 1 Aromatic epoxy resin YD8125 0.7 Aromatic epoxy resin HP4032D 2.8 Acid anhydride curing agent AMH850 8 Adhesion promoter KH560 0.5 Curing accelerator 1-methylimidazole 0.1 Silica NQ1175D 85 Toughening agent CTBNX13 0.5 Warpage Control Agent X-22-173 0.5

[0062] In this example, the liquid epoxy resin composition is prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0063] In this embodiment, the liquid epoxy resin composition has a Tg of 147°C and a thermal expansion coefficient CTE1:

[0064] 7.7ppm / K, CTE2: 35ppm / K, warpage deformation is 3mm.

[0065] Example 4

[0066] The proportions of each component of the liquid epoxy resin composition are as follows:

[0067] Components Mass percentage / % Aliphatic epoxy resin XY207 1.8 Aliphatic epoxy resin XY632 4 Aromatic epoxy resin YD8170 5 Aromatic epoxy resin HP4032D 8 Acid anhydride curing agent AMH850 10 Adhesion promoter KH560 0.5 Curing accelerator 1-methylimidazole 0.1 Silica NQ1175D 70 Toughening agent CTBNX13 0.5 Warpage control additive KF96 0.1

[0068] In this example, the liquid epoxy resin composition is prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0069] In this embodiment, the Tg of the liquid epoxy resin composition is 163° C., the thermal expansion coefficient CTE1: 25 ppm / K, CTE2: 48 ppm / K, and the warpage deformation is 4 mm.

[0070] Example 5

[0071] The proportions of each component of the liquid epoxy resin composition are as follows:

[0072] Components Mass percentage / % Aliphatic epoxy resin XY207 1.2 Aromatic epoxy resin HP4032D 1.5 Acid anhydride curing agent AMH850 3 Adhesion promoter KH560 0.3 Curing accelerator 1-methylimidazole 0.5 Silica 25W1 90 Toughening agent MX54 2 Warpage Control Agent X-22-163 1.5

[0073] In this example, the liquid epoxy resin composition is prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0074] In this embodiment, the liquid epoxy resin composition has a Tg of 160°C and a thermal expansion coefficient CTE1:

[0075] 6.5ppm / K, CTE2: 29ppm / K, warpage deformation is 3mm.

[0076] Example 6

[0077] The proportions of each component of the liquid epoxy resin composition are as follows:

[0078]

[0079]

[0080] In this example, the liquid epoxy resin composition is prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0081] In this embodiment, the liquid epoxy resin composition has a Tg of 160° C., a thermal expansion coefficient CTE1 of 6 ppm / K, a CTE2 of 33 ppm / K, and a warpage deformation of 2 mm.

[0082] Example 7

[0083] The proportions of each component of the liquid epoxy resin composition are as follows:

[0084] Components Mass percentage / % Aliphatic epoxy resin XY207 0.5 Aromatic epoxy resin YD8170 0.6 Acid anhydride curing agent AMH850 1.8 Adhesion promoter KH560 0.5 Curing accelerator 2-methylimidazole 0.1 Silica NQ1175D 87 Toughening agent CTBNX13 4.5 Warpage control additive KF96 5

[0085] In this example, the liquid epoxy resin composition is prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0086] In this embodiment, the liquid epoxy resin composition has a Tg of 162°C and a thermal expansion coefficient CTE1:

[0087] 6.4ppm / K, CTE2: 31.3ppm / K, warpage deformation is 2.5mm.

[0088] Example 8

[0089] The proportions of each component of the liquid epoxy resin composition are as follows:

[0090]

[0091]

[0092] In this example, the liquid epoxy resin composition is prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0093] In this embodiment, the liquid epoxy resin composition has a Tg of 158°C and a thermal expansion coefficient CTE1:

[0094] 7.3ppm / K, CTE2: 32ppm / K, warpage deformation is 3.5mm.

[0095] Example 9

[0096] The proportions of each component of the liquid epoxy resin composition are as follows:

[0097] Components Mass percentage / % Aliphatic epoxy resin XY622 6.3 Aromatic epoxy resin YD8170 6 Methyltetrahydrophthalic anhydride AMH100 12 Adhesion promoter KH550 0.4 Curing accelerator 1-methylimidazole 0.8 Silica S31055EA 73 Toughening agent CTBNX13 1 Warpage control agent Tamol NN9401 0.5

[0098] In this example, the liquid epoxy resin composition is prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0099] In this embodiment, the Tg of the liquid epoxy resin composition is 165° C., the thermal expansion coefficient CTE1: 25 ppm / K, CTE2: 49 ppm / K, and the warpage deformation is 2.5 mm.

[0100] Example 10

[0101] The proportions of each component of the liquid epoxy resin composition are as follows:

[0102]

[0103]

[0104] In this example, the liquid epoxy resin composition is prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0105] In this embodiment, the Tg of the liquid epoxy resin composition is 163° C., the thermal expansion coefficient CTE1: 24 ppm / K, CTE2: 51 ppm / K, and the warpage deformation is 3.5 mm.

[0106] Comparative Example 1

[0107] The proportions of each component of the liquid epoxy resin composition are as follows:

[0108] Components Mass percentage / % Aliphatic epoxy resin XY622 1.6 Aromatic epoxy resin HP4032D 4.5 Acid anhydride curing agent AMH850 5.5 Adhesion promoter KH560 0.1 Curing accelerator triphenylphosphine 0.2 Silica NQ1175D 88 Toughening agent MX154 0.1

[0109] In this example, the liquid epoxy resin composition is prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0110] In this embodiment, the liquid epoxy resin composition has a Tg of 159°C and a thermal expansion coefficient CTE1:

[0111] 7.5ppm / K, CTE2: 34.3ppm / K, warpage deformation is 8.5mm.

[0112] Comparative Example 2

[0113] The proportions of each component of the liquid epoxy resin composition are as follows:

[0114]

[0115]

[0116] In this example, the liquid epoxy resin composition is prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0117] In this embodiment, the Tg of the liquid epoxy resin composition is 135° C., the thermal expansion coefficient CTE1: 32 ppm / K, CTE2: 65 ppm / K, and the warpage deformation is 9.3 mm.

[0118] Comparative Example 3

[0119] The proportions of each component of the liquid epoxy resin composition are as follows:

[0120] Components Mass percentage / % Aliphatic epoxy resin XY632 5.7 Aromatic epoxy resin YD8170 5.3 Methylhexahydrophthalic anhydride AMH850 12.8 Adhesion promoter KH560 0.3 Curing accelerator 2-methylimidazole 0.5 Silica NQ1175D 70 Toughening agent CTBNX13 0.1 Warpage Control Agent X-22-173 5.3

[0121] In this example, the liquid epoxy resin composition is prepared into an epoxy resin mixture according to the method in Example 1 to obtain a sample.

[0122] In this embodiment, the Tg of the liquid epoxy resin composition is 128° C., the thermal expansion coefficient CTE1: 27 ppm / K, CTE2: 52 ppm / K, and the warpage deformation is 7.5 mm.

[0123] From the warping results of the embodiments and the comparative examples, it can be seen that the embodiments within the scope of the present invention have better performance in terms of warping deformation. Compared with comparative examples 1-3, no warping control agent is introduced and the ratio of the components in the composition is adjusted, which changes the fluidity of the epoxy resin composition and the upper and lower contact interfaces during the molding process, reduces the influence of the orientation effect on the warping, and further reduces the warping.

Claims

1. A liquid epoxy resin composition, characterized in that The raw material composition includes, by mass percentage: Inorganic silicon filler 70%-92%, aliphatic epoxy resin 0.5%-10%, aromatic ring epoxy resin 0.5%-15%, anhydride curing agent 1-15%, adhesion promoter 0.1-2%, curing promoter 0.1-1%, toughening agent 0.1-5% and warpage control agent 0.1-5%; The aromatic ring-containing epoxy resin is an epoxy resin containing an aromatic ring in the molecular chain; The inorganic silicon filler is an inorganic silicon filler modified by a silane coupling agent containing an olefin chain with carbon atoms of C5-C20.

2. The liquid epoxy resin composition according to claim 1, characterized in that The inorganic silicon filler is an inorganic silicon filler modified by a silane coupling agent containing an olefin chain with carbon atoms of C5-C15; Preferably, the inorganic silicon filler is an inorganic silicon filler modified by a silane coupling agent containing an olefin chain with carbon atoms of C10-C15; More preferably, the modified inorganic silicon filler is spherical in shape, and has an average particle size of 1 μm to 50 μm, preferably 10-30 μm.

3. The liquid epoxy resin composition according to claim 1 or 2, characterized in that: The aliphatic epoxy resin is an aliphatic epoxy resin having no cyclic structure other than epoxy groups; Preferably, the aliphatic epoxy resin includes at least one of vinyl glycidyl ether, allyl glycidyl ether, alkylene glycol diglycidyl ether, poly(alkylene glycol) diglycidyl ether, alkenylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol glycidyl ether, and dipentaerythritol glycidyl ether.

4. The liquid epoxy resin composition according to any one of claims 1 to 3, characterized in that The aromatic ring-containing epoxy resin includes one or a combination of at least two of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, biphenyl epoxy resin, naphthalene epoxy resin, bisphenol AD ​​epoxy resin, p-hydroxybenzoic acid, diglycidyl aniline, 1,1,2,2-tetra(p-hydroxyphenyl)ethane tetraglycidyl ether epoxy resin, and p-aminophenol triglycidyl epoxy resin.

5. The liquid epoxy resin composition according to any one of claims 1 to 4, characterized in that The anhydride curing agent is selected from one or a combination of at least two of phthalic anhydride, trimellitic anhydride glyceride, polyazelaic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, glutaric anhydride, dichloromaleic anhydride, ethylene glycol ditrimellitate, and succinic anhydride.

6. The liquid epoxy resin composition according to any one of claims 1 to 5, characterized in that: The adhesion promoter is selected from one or a combination of at least two of γ-(2,3-epoxypropoxy)propyltrimethoxysilane, propyl glycidyl ether trimethoxysilane, γ-epoxypropyl ether trimethoxysilane, trimethoxysilane, γ-aminopropyltriethoxysilane and γ-mercaptopropyltrimethoxysilane.

7. The liquid epoxy resin composition according to any one of claims 1 to 6, characterized in that: The curing accelerator is selected from one or a combination of two of imidazole compounds and triphenylphosphine; preferably selected from one or a combination of at least two of 2-phenyl-4,5-dihydroxymethylimidazole, 2-methylimidazole, 2-phenylimidazole, dimethyl-imidazole isocyanate, triphenylphosphine, and triphenylphosphine-1,4-benzoquinone adduct; Preferably, the toughening agent is selected from one or a combination of at least two of nitrile rubber, polysulfide rubber, polybutadiene, polyether elastomer, silicone resin, silicone rubber, silicone-modified epoxy resin, polyether-modified epoxy resin, and modified polyurethane.

8. The liquid epoxy resin composition according to any one of claims 1 to 7, characterized in that: The warpage control agent is one or a combination of at least two of silicone oil, silane coupling agent, silicone rubber, silicone resin, fatty alcohol sulfate, alkyl phosphate, and sulfonate type anionic surfactant, preferably at least one of silicone oil, silane coupling agent, silicone rubber, and silicone resin; Preferably, the warpage control agent is one or a combination of at least two of methyl silicone oil, ethyl silicone oil, phenyl silicone oil, methyl hydrogen silicone oil, methyl phenyl silicone oil, methyl chlorophenyl silicone oil, methyl ethoxy silicone oil, methyl trifluoropropyl silicone oil, methyl vinyl silicone oil, methyl hydroxy silicone oil, ethyl hydrogen silicone oil, hydroxy hydrogen silicone oil, single-end modified silicone oil, side chain modified silicone oil, double-end modified silicone oil, and polyorganosiloxane; More preferably, the warpage control aid is selected from one or a combination of at least two of methyl silicone oil, single-end modified silicone oil, and double-end modified silicone oil.

9. The method for preparing the liquid epoxy resin composition according to any one of claims 1 to 8, characterized in that: The following steps are involved: The alicyclic epoxy resin, the aromatic ring-containing epoxy resin, the anhydride curing agent, the curing accelerator, the toughening agent, the warpage control aid and the inorganic silicon filler are mixed and pre-mixed to obtain a mixture; the mixture is ground to a target particle size, and then vacuum degassing is performed to obtain the liquid epoxy resin composition.

10. Use of the liquid epoxy resin composition according to any one of claims 1 to 8 or the liquid epoxy resin composition prepared by the preparation method according to claim 9 in integrated circuit 2.5D / 3D advanced packaging WLCSP or CoWoS packaging process.

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