Non-polyvinyl chloride wood-plastic plate with three-dimensional wood grains as well as preparation method and application of non-polyvinyl chloride wood-plastic plate

Abstract

The invention relates to the technical field of floor manufacturing, in particular to a non-polyvinyl chloride wood-plastic board with three-dimensional wood grains and a preparation method and application thereof, the non-polyvinyl chloride wood-plastic board comprises a non-polyvinyl chloride wood-plastic base material layer containing polyolefin resin with the surface energy not higher than 35 dynes / cm, the adhesion bottom is adhered to one side of the non-polyvinyl chloride wood-plastic base material layer, the surface tension of the adhesion bottom is smaller than that of the polyolefin resin, and the two-dimensional pattern layer, the three-dimensional wear-resistant layer and the finish paint layer are further included. The surface energy relationship between the adhesion bottom and the non-polyvinyl chloride wood-plastic base material layer is limited, so that the phenomena of stripping, warping and cracking of the non-polyvinyl chloride wood-plastic plate can be effectively prevented, and the stability and durability of the plate are effectively improved. Meanwhile, according to the prepared non-polyvinyl chloride wood-plastic plate, environment-friendly production and recycling of the wood-plastic plate can be achieved, and the visual sense and the touch sense of the wood-plastic plate are closer to those of three-dimensional wood grains of real wood grains.

Description

Technical Field

[0001] The invention relates to the technical field of floor manufacturing, in particular to a non-polyvinyl chloride wood-plastic board with three-dimensional wood grains and a preparation method and application thereof. Background Art

[0002] As an important part of the building materials industry, the demand for flooring products is growing as people continue to pursue quality of life. From traditional solid wood floors to modern composite floors, and then to today's new three-dimensional floors, the flooring industry has witnessed the continuous evolution and transformation of various types of floors. Looking to the future, with the increase in demand for building decoration and the accelerated advancement of urbanization, the prospects for the flooring industry are becoming increasingly broad.

[0003] Among them, three-dimensional flooring is a uniquely designed flooring that uses visual effects and material combinations to give it a sense of three-dimensionality and depth. This type of flooring usually creates a visual three-dimensional effect through the clever combination of different materials, colors and textures, as well as unique pattern design, giving people a more spacious and rich space experience.

[0004] At present, as people's demand for interior decoration and design continues to increase, the demand for personalized, fashionable and artistic decorative materials is growing. As a decorative material with unique visual effects and artistic sense, three-dimensional flooring is becoming more and more popular among consumers. At the same time, with the rapid development of science and technology, the manufacturing process of three-dimensional flooring will continue to improve, and material selection and design innovation will further enhance the market competitiveness of three-dimensional flooring. It can be foreseen that three-dimensional flooring will continue to attract attention and favor in the market in the future.

[0005] Polyvinyl chloride (PVC) materials are widely used in three-dimensional floors due to their good durability, excellent waterproofness, and easy cleaning and maintenance.

[0006] For example, the patent with authorization announcement number CN112095967B discloses a multi-layer PVC panel with synchronously matched patterns and molded round edges, which includes a UV paint layer, a PVC wear-resistant layer, a PVC patterned film layer, a PVC substrate board and a PVC base material layer. The surface of the panel has a synchronously matched simulated three-dimensional texture, with arc edges and locking structures all around, which realizes mutual locking and splicing between the panels.

[0007] In addition, patent publication number CN114953665A discloses a process for preparing a PVC floor, wherein a PVC substrate layer, a PVC printing layer and a PVC pre-coating film are stacked and subjected to a one-time lamination process to obtain a finished PVC floor.

[0008] However, with the widespread use of PVC-based flooring, its inherent defects gradually emerged: First, although PVC materials have strong stability and durability, they also bring the problem of difficult recycling. At the same time, because special treatment methods are required during the recycling process, the recycled materials may be difficult to reuse, which reduces the resource recovery rate of PVC artificial boards and causes resource waste.

[0009] Secondly, during the production, use and disposal process, PVC artificial boards may release harmful substances such as volatile organic compounds (VOCs). These VOCs pose potential risks to the environment and human health, especially in indoor environments, where they may cause deterioration of air quality and potentially trigger allergic reactions or respiratory diseases.

[0010] In addition, due to the poor heat resistance of PVC materials, long-term exposure to high temperature may cause softening and deformation or even release harmful gases. This limits the application of PVC artificial sheets in certain special environments, such as near stoves or in places exposed to sunlight.

[0011] Finally, the production process of PVC artificial boards may produce a large amount of harmful waste gas and wastewater, which has a negative impact on the environment. Its characteristics that are not conducive to sustainable development have gradually attracted people's attention and promoted the development and application of green environmentally friendly materials.

[0012] Therefore, technicians are looking for alternative materials to solve these problems, including wood-plastic boards made of polyolefin materials (such as polypropylene, polyethylene, etc.) or polyester materials (such as PET, PETG, PBT, etc.) as candidate solutions. These new materials have better environmental protection and durability, and are expected to become the development trend of the flooring industry in the future.

[0013] For example, the patent with publication number CN117511148A provides a NON-PVC plastic floor and its manufacturing process, which uses PET-P, PET-G or PP resin, calcium powder, various lubricants, processing aids, etc. to mix and synthesize, and then use a special extruder to granulate, and then use an extruder to extrude the NONPVC-LVT floor and NONPVC-SPC floor products for secondary extrusion. PET-P, PET-G, or PP resin replaces PVC, which was originally considered toxic, and the manufactured LVT floor and SPC floor have comprehensive physical indicators, performance, service life, etc. that exceed the replaced products.

[0014] In addition, the patent with publication number CN109944411A discloses a PET plastic floor, which includes at least a substrate layer and a printing layer arranged on the substrate layer. The substrate layer is made of PET or a mixture of PET and PE materials or a mixture of PET and PP materials. The printing layer is formed by printing a pattern on the substrate layer by digital printing or by laminating the printing layer on the upper surface of the substrate layer. A protective layer is also arranged on the printing layer. The PET plastic floor does not contain halogens and does not produce dioxins when burned, which helps to reduce air pollution. The invention can use new PET or recycled PET, and then combine it with high molecular thermoplastic materials such as PE and PP to form a substrate layer, and then compound the printing layer and the wear-resistant layer on the substrate layer according to the required characteristics to form an environmentally friendly and recyclable plastic floor, and the PET plastic floor can be recycled to form a renewable resource for recycling.

[0015] However, when the applicant of the present application used polyolefin materials to prepare three-dimensional flooring, it was found that the bonding force between the substrate and the three-dimensional layer on the surface was weak, which easily led to delamination, warping and cracking problems, which have not been observed in traditional PVC substrates. The applicant tried to use the adhesive material used in PVC substrates to enhance the bonding force between the polyolefin substrate and the three-dimensional layer, but the results were not satisfactory.

[0016] Therefore, based on the above defects, non-PVC wood-plastic boards made of polyolefin materials encounter certain obstacles in the production of three-dimensional floors. In order to overcome these problems, a series of targeted optimization and improvement of three-dimensional floors made of polyolefin materials and their preparation processes are required to improve the quality, stability and environmental protection of non-PVC wood-plastic boards. Through innovation and technological progress, more choices will be brought to the flooring industry, driving the entire industry to develop in a more sustainable and environmentally friendly direction. Summary of the invention

[0017] The present invention aims to overcome the defect of the non-PVC wood-plastic board in the prior art that the adhesion between the substrate and the three-dimensional layer is weak, resulting in low stability of the non-PVC wood-plastic board. Therefore, a new type of non-PVC wood-plastic board with three-dimensional wood grain and a preparation method and application thereof are provided to overcome the above-mentioned shortcomings.

[0018] To achieve the above-mentioned purpose, the present invention is implemented by the following technical solutions: In a first aspect, the present invention first provides a non-polyvinyl chloride wood-plastic board having three-dimensional wood grain, comprising: - a non-PVC wood-plastic substrate layer comprising a polyolefin resin having a surface energy not higher than 35 mN / m; - an attachment base on one side of the non-PVC wood plastic substrate layer; wherein, The surface tension of the attachment substrate is less than the surface tension of the polyolefin resin, and the surface tension difference between the two is less than 5 mN / m; - a two-dimensional pattern layer attached to the attachment bottom away from the non-PVC wood plastic substrate layer; wherein, The two-dimensional pattern layer includes a plurality of connected or unconnected two-dimensional wood grain lines obtained by digital printing; - a three-dimensional wear-resistant layer on the two-dimensional pattern layer, the three-dimensional layer comprising a three-dimensional base layer entirely covering the two-dimensional pattern layer and a three-dimensional wear-resistant layer comprising at least a portion or all of a flange or groove corresponding to the two-dimensional wood grain lines or gaps between the two-dimensional wood grain lines in the two-dimensional pattern layer; - A topcoat layer on the surface of the three-dimensional wear-resistant layer, wherein at least a portion of the topcoat layer is lower than the upper surface of the three-dimensional wear-resistant layer.

[0019] The present invention adopts non-PVC wood-plastic board as the substrate layer, combines digital printing technology and three-dimensional layer design, and realizes the environmentally friendly production and reuse of wood-plastic board. This structural design not only reduces the consumption of traditional wood, promotes resource conservation and recycling, but also meets the requirements of modern society for environmental protection and sustainable development, and has good social benefits and market prospects.

[0020] Specifically, the non-PVC wood-plastic board with three-dimensional wood grain in the present application is endowed with a unique three-dimensional wood grain appearance by the wood grain lines obtained by digital printing in the two-dimensional pattern layer and the three-dimensional base layer and flange / groove design of the three-dimensional wear-resistant layer, so that the non-PVC wood-plastic board creates a simulated wood texture and enhances the visual effect and artistic sense of the product.

[0021] In order to enhance the bonding stability between the substrate and the attachment layer, methods such as corona treatment are usually used to increase the surface energy of the substrate, thereby enhancing the bonding strength between it and other layer structures. However, the inventors of the present application have found that after the substrate is treated by means such as corona treatment, its surface energy will indeed be improved within a period of time, but this effect will decrease with the passage of time, so the improvement of adhesion by simply using such technical means can only be maintained for a relatively short period of time. In addition, if the substrate surface energy is excessively improved by means such as corona treatment, it will be found that the bonding stability between the substrate and the attachment base will even decrease. Therefore, it is difficult for existing technologies to achieve long-term and stable improvement in the bonding stability between the substrate and the attachment base.

[0022] For the flooring industry, the design service life of the floor is usually several years or even decades. During the design service life, it is often subjected to external mechanical shocks (such as pedestrians walking, heavy objects falling and piling up, etc.) and environmental climate tests (such as light, heat and cold, wind and rain, bacteria, etc.). Since the three-dimensional floor has a multi-layer structure, the above tests will cause irreversible damage to the three-dimensional floor with a multi-layer structure (such as delamination, cracking, warping, etc.). In addition, these challenges are even more severe for three-dimensional floors suitable for outdoor use. Therefore, some existing methods of improving the bonding stability between the substrate and the attached substrate are often not applicable for a long time.

[0023] Moreover, the non-PVC wood-plastic board with three-dimensional wood grain described in this application, as a new type of floor material, represents a new trend in the development of the floor industry, replacing the traditional PVC wood-plastic board. However, the current industry research on the non-PVC wood-plastic board itself is still limited, and its physical and chemical properties are still unclear. Therefore, the method of how to improve the long-term bonding stability between the polyolefin resin and the attachment substrate is still unclear, and the R&D personnel in the industry need to continue to invest a lot of energy in further research.

[0024] The inventors of the present application found during the experiment that although the surface energy of the substrate is an important parameter to characterize the adhesion ability of the material surface and has an important influence on the stability of the three-dimensional wood-plastic board, the inventors also found that there is a more significant relationship between the surface energy relationship between the two materials and the bonding strength between them.

[0025] Based on this finding, the present application achieves stability and reliability of the board under use and environmental changes by controlling the surface energy difference between the non-PVC wood-plastic substrate layer and the attachment base to be less than 5mN / m in design.

[0026] The reason is that the appropriate surface energy difference range can help balance the surface energy of the two materials, so that the non-PVC wood-plastic substrate layer and the attachment base can be better combined, maintain a relatively stable state, and help prevent the board from deformation and damage under different temperature and humidity environments. The inventors of the present application found in experiments that when the surface energy difference between the PVC wood-plastic substrate layer and the attachment base is within the set range, the two are more firmly combined, effectively preventing peeling, and improving the stability and durability of the board.

[0027] Preferably, the polyolefin resin is any one or more combinations of polyethylene, polypropylene, polyisobutylene, ethylene-vinyl acetate copolymer, ethylene-polypropylene copolymer, ethylene-acrylic acid or acrylate copolymer, and poly-4-methyl-1-pentene.

[0028] Preferably, the adhesion grade between the non-PVC wood-plastic substrate layer and the attachment base is 5B when tested according to the method described in ASTM D3359.

[0029] Preferably, the non-polyvinyl chloride wood-plastic substrate layer further comprises fillers and processing aids.

[0030] Preferably, the filler is wood powder and / or stone powder.

[0031] Preferably, the attachment base is obtained by curing a photocurable resin composition; The photocurable resin composition comprises a main resin connected with a photosensitive group; The main resin also contains hydrogen bond donor groups and hydrogen bond acceptor groups for forming hydrogen bonds.

[0032] The attachment substrate of the present invention is cured by a photocurable resin composition, which comprises a main resin connected with a photosensitive group, a hydrogen bond donor group for forming a hydrogen bond, and a hydrogen bond acceptor group. The photosensitive group is highly sensitive to light and can quickly respond to the irradiation of a light source, so that the photocurable resin has the characteristic of rapid curing, forms a solid attachment substrate, shortens the production cycle, and improves production efficiency and throughput.

[0033] In addition, since the photocurable resin composition contains hydrogen bond donors and acceptor groups, the interaction between the main resin and the substrate layer can be enhanced through hydrogen bond formation. This unique structure forms a stronger chemical bond during the curing process, improves the bonding strength and adhesion between the attachment base and the substrate layer, and ensures the stability and durability of the wood-plastic board structure.

[0034] In addition, the present application utilizes the combination of hydrogen bond donors and acceptor groups to make the attachment substrate formed by the photocurable resin composition have a more uniform and stable surface treatment quality. The formation of hydrogen bonds helps to reduce the surface tension of the material, reduce the unevenness of the surface energy, enhance the consistency and flatness of the surface treatment, and improve the processing stability and quality control ability during the production of the board.

[0035] Finally, the light-curing technology itself is a green and environmentally friendly curing method. It does not require the addition of solvents or other harmful substances, avoids the emission of volatile organic compounds, and meets the requirements of environmental protection and sustainable development. The design achieves green and environmental protection in the production process by curing the attachment base with light-curing resin, and provides a sustainable solution for the material selection and production of wood-plastic panels.

[0036] Preferably, the photocurable resin composition has a dynamic viscosity of 80 seconds to 250 seconds.

[0037] The dynamic viscosity of the photocurable resin composition ranges from 80 seconds to 250 seconds, which can meet the bonding and curing requirements within an appropriate time. The moderate dynamic viscosity enables the resin to have appropriate viscosity and fluidity during the coating and coating process, ensuring that the resin is evenly coated and completely covered, which is conducive to the strong bonding and curing effect between the attachment base and the substrate layer. At the same time, the appropriate dynamic viscosity improves the operability and stability of the production process, making the resin easier to control and operate during the coating and curing process. The resin has moderate viscosity and viscosity, which can effectively adhere to the surface of the substrate without being too fluid or diluted, maintaining the stability and continuity of the production process and improving the efficiency and quality of product production.

[0038] Preferably, the adhesive base has a thickness of 10 g / m 2 -15g / m 2 weight.

[0039] In actual tests, the inventors found that the coating amount of the attachment base has a significant effect on the bonding strength of the substrate and the deformation control of the wood-plastic board. 2 It was found that the bonding strength between the attachment base and the non-PVC wood-plastic substrate layer was low, which may cause delamination and cracking of the three-dimensional floor; and when the coating amount of the attachment base exceeded 15g / m 2 When the attached base is cured, the shrinkage is too large, which may cause the three-dimensional floor to warp.

[0040] Preferably, the main resin contains any one of an amide group, an imide group, an amino group, a carbamate group, a hydroxyl group, and a urea group.

[0041] Preferably, the photocurable resin composition further comprises an auxiliary resin having a photosensitive group and a reactive diluent; At least one of the auxiliary resin and the reactive diluent comprises a hydrogen bond acceptor group.

[0042] The present application can improve the photosensitivity and reaction speed of the photocurable resin composition by adding auxiliary resins containing photosensitive groups and active diluents, especially components containing hydrogen bond acceptor groups. Under light conditions, the photosensitive groups absorb light energy to promote the resin to undergo a photocuring reaction, while the active components containing hydrogen bond acceptor groups accelerate the curing process and promote the photo-initiated polymerization reaction, thereby improving the curing efficiency and shortening the curing time.

[0043] The added auxiliary resin and reactive diluent contain hydrogen bond acceptor groups, which improve the selectivity and controllability of the curing reaction of the photocurable resin composition. The hydrogen bond acceptor groups participate in the hydrogen bond interactions during the curing process, which helps to adjust the curing reaction speed and mechanism, improve the selectivity of the curing reaction, and make the curing process more controllable and stable. By precisely controlling the hydrogen bond interactions, the molecular structure and cross-linking degree of the photocurable resin are adjusted, the hardness, wear resistance and chemical corrosion resistance of the product are improved, and the durability and stability are enhanced.

[0044] In addition, auxiliary resins and reactive diluents containing hydrogen bond acceptor groups can also enhance the adhesion and weather resistance between materials. Hydrogen bond acceptor groups help to form a closer bond with the surrounding matrix material, improve the adhesion between the cured resin and the substrate, and enhance the product's resistance to water, temperature and chemical corrosion, thereby extending the product's service life.

[0045] In summary, the present application introduces auxiliary resins and reactive diluents containing photosensitive groups, at least one of which contains a hydrogen bond acceptor group, which helps to improve the photocuring efficiency, improve the selectivity and controllability of the curing reaction, optimize the physical properties and durability, improve the surface quality and appearance of the product, enhance the adhesion and weather resistance of the material, and bring more advantages and guarantees to the performance and application of the photocurable resin composition.

[0046] Preferably, the amount of the main resin added is 30wt%-40wt% of the total mass of the photocurable resin composition; and the amount of the auxiliary resin added is not higher than 50wt% of the amount of the main resin added; The amount of the active diluent added is not higher than 65wt% of the amount of the main resin added.

[0047] The present application specifically limits the addition amounts of the main resin, auxiliary resin and reactive diluent in the photocurable resin composition to ensure that the final produced wood-plastic board has better anti-cracking and delamination effects.

[0048] Among them, controlling the addition amount of the main resin to between 30wt% and 40wt% of the total mass of the photocurable resin composition can ensure that the photocurable resin composition has sufficient curing main body, maintain chemical stability and curing effect. As a key component of the photocuring reaction, the main resin, properly controlling the addition amount, helps maintain the balance and stability of the curing reaction, ensuring that the product has excellent physical and chemical properties after curing.

[0049] The amount of auxiliary resin added should not exceed 50wt% of the amount of main resin added, so that the formation of network structure and the curing speed can be adjusted in a targeted manner. The right amount of auxiliary resin can support and stabilize the network structure during the curing process, promote the curing reaction, and avoid excessive addition, which will lead to a chaotic network structure and too fast curing speed, thus affecting the curing effect.

[0050] The amount of active diluent added should not exceed 65wt% of the main resin, which helps to control the balance between the curing volume and coating performance. The right amount of active diluent can adjust the curing volume and coating performance, improve the uniformity of coating and curing efficiency, and maintain the surface quality and consistency of the product.

[0051] Therefore, by reasonably setting the addition ratio of the main resin, auxiliary resin and reactive diluent, it is beneficial to optimize the process performance and stability of the photocurable resin composition. Appropriate ratios can maintain the balance and coordination of the composition, improve the controllability and stability of the production process, and ensure that the product quality and performance meet the requirements.

[0052] Preferably, the amount of the auxiliary resin added is not less than 25wt% of the amount of the main resin added.

[0053] In this application, the amount of auxiliary resin added is set to not less than 25wt% of the amount of main resin added, which can enhance the flexibility and toughness of the photocurable resin composition and effectively adjust the balance between the cured volume and the surface hardness. An appropriate amount of auxiliary resin helps to optimize the curing speed and degree of the photocurable resin, avoid too hard or too soft curing system, and maintain the hardness and uniformity of the product surface. In addition, an appropriate amount of auxiliary resin can improve the fluidity and ductility of the resin system during the curing process, so that the cured product has better elasticity and tensile resistance, and improves the wear resistance and impact resistance of the product.

[0054] At the same time, the addition of an appropriate amount of auxiliary resin can also improve the transparency and optical properties of the resin system. The composition of the auxiliary resin can optimize the refractive index and transparency of the cured layer, allowing light to penetrate the resin system more smoothly, improving the transparency and optical effect of the product, and making the wood grain more clearly visible when digital wood grain printing is performed on the surface.

[0055] Preferably, the amount of the active diluent added is not less than 40 wt % of the amount of the main resin added.

[0056] By setting the amount of reactive diluent added to not less than 40wt% of the amount of the main resin added, the viscosity and fluidity of the photocurable resin composition can be effectively adjusted. An appropriate amount of reactive diluent helps to reduce the viscosity of the resin system, making it easier to flow, improve the uniformity of coating and curing efficiency, and at the same time helps to avoid the generation of bubbles or uneven coating, ensuring the surface quality of the product. In addition, an appropriate amount of reactive diluent can also accelerate the curing speed of the resin system, shorten the curing time, improve production efficiency, and at the same time ensure the degree of curing and quality of the product. Finally, the reactive diluent also helps to reduce the surface tension of the photocurable resin composition, reduce the generation of coating marks and defects, make the product surface smoother, improve gloss and transparency, thereby enhancing the surface gloss and transparency of the product.

[0057] Preferably, the photocurable resin composition further comprises a photoinitiator, a filler and an auxiliary agent.

[0058] Preferably, the amount of the photoinitiator added is 3wt%-5wt% of the total mass of the photocurable resin composition; The amount of the filler added is 20wt%-30wt% of the total mass of the photocurable resin composition; The additive amount of the auxiliary agent accounts for 0.5wt%-1wt% of the total mass of the photocurable resin composition.

[0059] Preferably, the photoinitiator is a free radical photoinitiator.

[0060] Preferably, the reactive diluent comprises at least two branched chains containing acrylic acid structures.

[0061] The branched chains containing acrylic acid structures in the active diluent of the present application can enhance the crosslinking property of the active diluent molecular chains. The presence of multiple acrylic acid structure chains can promote the formation of more crosslinking bonds between the active diluent molecules, thereby increasing the connection points of the molecular chains, thereby improving the stability and durability of the molecular chains, and helping to improve the structural strength and anti-aging ability of the active diluent.

[0062] In addition, the polarity of the acrylic acid structural chain helps the compatibility of the active diluent with the resin matrix, facilitates the uniform dispersion of the active diluent in the resin system, enhances the stability and uniformity of the resin system, and improves the quality and performance of the product. At the same time, the softness and plasticity of the acrylic acid structural chain form a closer bond between the active diluent and the main resin, promotes the interaction and chemical reaction between the two, reduces the interfacial tension, improves the interfacial bonding strength, makes it easier for the resin to penetrate and cover the surface of the substrate, enhances the adhesion and adhesion, and ensures the firmness and durability of the cured layer.

[0063] Preferably, the reactive diluent is any one of tripropylene glycol diacrylate (TPGDA), trimethylolpropane triacrylate (TMPTA), and pentaerythritol triacrylate (PETA).

[0064] Preferably, the filler is any one or more of silicon dioxide, calcium carbonate, aluminum oxide, titanium dioxide, magnesium oxide, talc, wollastonite powder, mica powder, precipitated barium sulfate, bentonite, lime calcium powder, and ultrafine aluminum silicate.

[0065] As a preferred embodiment, the attachment base contains a color masking agent for covering the color of the non-polyvinyl chloride wood-plastic base material layer; and the two-dimensional pattern layer is printed on the surface of the attachment base.

[0066] As another preferred embodiment, the surface of the attachment base away from the non-polyvinyl chloride wood-plastic base material layer is also covered with a color-shielding film for covering the color of the non-polyvinyl chloride wood-plastic base material layer; The two-dimensional pattern layer is printed on the surface of the color-shielding film.

[0067] As another preferred embodiment, the surface of the attachment base away from the non-PVC wood-plastic substrate layer is also covered with a layer of color paint containing a color opacifying agent; The two-dimensional pattern layer is printed on the surface of the color paint layer.

[0068] In the present application, by adding a color masking agent to the attachment base or covering a color masking film or paint layer on the surface of the attachment base away from the non-PVC wood-plastic substrate layer, the color of the non-PVC wood-plastic substrate itself can be masked, providing more possibilities for subsequent customized design. At the same time, the clarity and protection of the pattern printed in the two-dimensional pattern layer can be enhanced, thereby helping the pattern to be printed more finely and clearly and prolonging the durability of the pattern.

[0069] In this application, the printing of the two-dimensional pattern layer can realize the customization of the pattern, so that the wood-plastic board has a personalized appearance and meets the needs and design requirements of different customers. Through the coordination of the color masking agent, color masking film, paint layer and the surface printed two-dimensional pattern, the overall effect of matching and coordination between the layers of the product can be achieved. The unified or contrasting combination of color, pattern and texture makes the appearance of the overall wood-plastic board more layered and harmonious, and improves the overall quality and visual effect of the product.

[0070] In a second aspect, the present invention also provides a method for preparing the non-polyvinyl chloride wood-plastic board having three-dimensional wood grain as described above, comprising the following steps: -Provide a non-PVC wood plastic substrate layer; - coating a layer of photocurable resin composition on the surface of the non-polyvinyl chloride wood-plastic substrate layer, and curing it to obtain the attachment base, so that the difference in surface energy between the attachment base and the non-polyvinyl chloride wood-plastic substrate layer is less than 5mN / m; -Printing is performed on the top of the attachment substrate to obtain a two-dimensional pattern layer; - Perform three-dimensional printing on the surface of the two-dimensional pattern layer to obtain a three-dimensional wear-resistant layer; - Coating a topcoat on the surface of the three-dimensional wear-resistant layer and curing the topcoat layer to obtain the topcoat layer.

[0071] Preferably, the dynamic viscosity of the photocurable resin composition is 80 seconds to 250 seconds; The application amount of the photocurable resin composition is 10 g / m 2 -15g / m 2 .

[0072] Preferably, the two-dimensional pattern layer is directly printed on the surface of the attachment base.

[0073] Preferably, the photocurable resin composition further comprises a color masking agent for covering the color of the non-polyvinyl chloride wood-plastic substrate layer.

[0074] Preferably, before printing the two-dimensional pattern layer, the method further comprises the steps of coating a layer of paint on the attached bottom surface and curing the paint to form a paint layer, and the two-dimensional pattern layer is directly printed on the surface of the paint layer.

[0075] Preferably, the paint layer is white.

[0076] Preferably, the paint is cured by light curing; The color paint at least contains a photo-crosslinking resin, a photoinitiator and white pigment powder.

[0077] Preferably, the coverage of the paint is 15 g / m 2 -20g / m 2 .

[0078] Preferably, before printing the two-dimensional pattern layer, a color masking film for covering the color of the non-PVC wood-plastic substrate layer is further provided on the attached bottom surface by heat bonding, and the two-dimensional pattern layer is directly printed on the surface of the color masking film.

[0079] Preferably, the steps of preparing the three-dimensional wear-resistant layer include: - a step of covering at least a portion of the surface of the two-dimensional pattern layer with a resin liquid and curing the resin liquid to form a three-dimensional base layer; - a step of covering at least a portion of the surface of the three-dimensional base layer with at least one layer of resin liquid; - a step of applying embossing liquid to at least a portion of the surface of the resin liquid on the three-dimensional base layer along the wood grain pattern of the two-dimensional pattern layer, so that the embossing liquid and / or at least a portion of the resin liquid mixed with the embossing liquid and / or at least a portion of the resin liquid covered by the embossing liquid forms an embossed layer; - a step of solidifying the resin liquid except for the embossed layer formed in the previous step; - A step of removing the embossed layer, thereby forming a three-dimensional wear-resistant layer on the surface of the three-dimensional base layer.

[0080] Preferably, the amount of the resin liquid used to form the three-dimensional base layer is 30 g / m 2 -50g / m 2 .

[0081] Preferably, the amount of the resin liquid covering the surface of the three-dimensional base layer is greater than or equal to 150 g / m 2 , and at least a portion of the surface of the three-dimensional base layer is covered with at least two layers of resin liquid.

[0082] The applicant found in actual exploration that in order to make the wood grain on the three-dimensional wear-resistant layer on the surface of the board closer to the feel of natural wood, it is necessary to control the coating amount of the resin liquid used to form the three-dimensional wood grain. After testing, it was found that only the total coating amount of the resin liquid used in the three-dimensional base layer and the three-dimensional wood grain layer is greater than 200g / m 2 When the coating is more than 200g / m 2 After the above resin liquid is applied, it will cause the bottom of the wear-resistant layer to be difficult to solidify instantly, resulting in poor bonding between the three-dimensional wear-resistant layer and the two-dimensional pattern layer on the surface of the plate, and easy peeling between the three-dimensional wear-resistant layer and the substrate.

[0083] In order to achieve the smooth curing of a large amount of resin liquid and enhance the bonding strength between the three-dimensional wear-resistant layer and the substrate, it is necessary to increase the curing power used during curing. However, the provision of high power will generate more waste heat during the curing process. The waste heat generated will cause deformation of the plate and yellowing or aging of the resin liquid. Therefore, this method of increasing the curing power is not practical.

[0084] After studying the cured three-dimensional wear-resistant layer, the applicant found that the three-dimensional wear-resistant layer actually contains two functional areas in the longitudinal direction, including: (1) a bonding area for bonding with non-PVC substrates, namely the three-dimensional base layer in this application; (2) a functional area for forming a three-dimensional structure, namely the three-dimensional wear-resistant layer in this application. Among them, the three-dimensional base layer does not require a large amount of resin, while the applicant has calculated that the amount of the three-dimensional wear-resistant layer needs to be 150g / m 2Only when the above is achieved can the feel of natural wood and better wear resistance be achieved.

[0085] Therefore, the present invention applies a first layer of resin liquid on the surface of the two-dimensional pattern layer, and solidifies it to obtain a three-dimensional base layer. Since the amount of resin liquid used to form the three-dimensional base layer is not large, it can be completely solidified under conventional curing power, so that the bonding force between the three-dimensional base layer and the non-PVC wood-plastic substrate layer containing the adhesive base can be effectively improved, and the problem of peeling will not occur during use. Then, the surface of the three-dimensional base layer is coated with resin, and the resin coating amount is guaranteed to be 150g / m 2 The above is used to form a three-dimensional wear-resistant layer, thereby ensuring the three-dimensional sense of the three-dimensional wood grain.

[0086] Preferably, in the process of covering at least a portion of the surface of the three-dimensional base layer with any two adjacent layers of resin liquid, the process also includes a transition treatment step of stopping the application of force to the resin liquid after the three-dimensional base layer is covered by any layer of resin liquid, and covering with the next layer of resin liquid after the transition treatment step is completed.

[0087] As mentioned above, in order to ensure the three-dimensional effect of the three-dimensional wood grain, at least 150g / m 2 Therefore, the focus of this application is shifted to how to form a 150g / m 2 The above resin coating amount.

[0088] At present, the most common way to apply the resin liquid is to use a roller coater for coating. The applicant has tried to apply a one-time coating amount of up to 150g / m2 on the three-dimensional base layer. 2 The above resin liquid, but the applicant found that this one-time coating method requires too much resin liquid to be loaded on a single roller. If a conventional roller is used, the resin liquid will flow downward, thereby failing to complete normal production.

[0089] Therefore, in order to solve the above problems, the present invention adopts a two-roller distribution coating method, so that each roller coats a layer of resin liquid, so that the total amount of resin in the two layers of resin liquid is greater than 150g / m 2 This method not only realizes the coating of a large amount of resin, but also reduces the resin load pressure of each roller.

[0090] In the prior art, in order to achieve multi-roller coating, a roller coater with two rollers in parallel is usually used. The two rollers of the roller coater are usually matched with a positive roller and a reverse roller. When the first roller coats the resin liquid on the surface of the plate and pushes the substrate forward, it will generate a certain force on the plate and the uncured resin liquid layer attached to the surface of the plate along the plate conveying direction. This force combined with the bristle structure on the roller surface will cause a certain deformation on the surface of the resin liquid. Before the first layer of resin liquid is leveled, the second roller has already taken over the plate coated with uncured resin liquid, which will generate a force opposite to the plate conveying direction on the uncured resin liquid. Therefore, this force will also cause the second layer of resin liquid to be deformed in the opposite direction. At the same time, since there is a certain speed difference between the second roller and the first roller, the deformation between the first layer of resin liquid and the second layer of resin liquid cannot be offset. Instead, the deformation of the two layers of resin liquid will be superimposed on each other, further exacerbating the appearance of marks on the resin liquid. After curing, these marks will be fixed, seriously affecting the visual effect of the final product. The production of this kind of mark will cause obvious defects in the appearance of the finished product, especially the finished product with shallow texture. That is, when viewed from a distance, a blockage can be found in the middle of the part coated with resin liquid.

[0091] Therefore, based on the existing roller coating machine, the present application adds a transition treatment step of stopping the application of force to the resin liquid in the process of covering at least a part of the surface of the three-dimensional base layer with any two adjacent layers of resin liquid. In this way, when the plate passes through the first roller, after the first roller finishes applying force to the plate as a whole, before being transported to the second roller, no force will be applied to the entire plate, and then after a long distance, it is conducive to the leveling of the first layer of resin liquid. At this time, the plate is coated from beginning to end by the second roller again. At this time, since the deformation of the second layer of resin liquid is small, it can be quickly leveled before curing, thereby eliminating the influence of the force of the two rollers on the resin liquid and the speed difference on the surface morphology.

[0092] Preferably, in the process of covering at least a portion of the surface of the three-dimensional base layer with any two adjacent layers of resin liquid, the directions of the forces applied to the any two adjacent layers of resin liquid are opposite.

[0093] As can be seen from the above discussion, the roller coater will generate a certain force on the resin liquid when rolling. Since the resin liquid usually contains a high molecular polymer or prepolymer, and its molecular chain segment is relatively long, it will generate a certain elastic deformation and orientation force under the action of external force. Since the overall process time from coating to curing of the resin liquid is relatively short, the molecular chain segment of the high molecular polymer in the resin liquid is often cured before it returns to the initial state, resulting in a large internal stress in the middle of the three-dimensional wood grain layer after curing, which in turn leads to the phenomenon that cracks are easily generated in the middle of the three-dimensional wood grain layer after curing. Therefore, in order to reduce the generation of internal stress in the middle of the three-dimensional wood grain layer, the present application specifically adjusts the force directions of the two rollers on any two adjacent layers of resin liquid in the process of at least a part of the surface of the three-dimensional base layer being covered with any two adjacent layers of resin liquid, so that during the operation of the second roller, the uncured second wear-resistant layer can be provided with a force opposite to its internal internal stress, thereby weakening or offsetting the original internal stress of the three-dimensional wood grain layer, thereby reducing the probability of cracking in the middle of the three-dimensional wood grain layer after curing.

[0094] Preferably, the embossing liquid is applied to the surface of the resin liquid and / or penetrates downward into the interior of the resin liquid.

[0095] In the present application, there are various principles for forming an embossing layer by adding embossing liquid on the surface of resin liquid, including but not limited to ultraviolet covering method, free radical absorption method or volume occupation method.

[0096] Among them: the ultraviolet covering method is suitable for UV-cured resin liquid. Its principle is to cover the surface of the uncured resin liquid with a layer of embossing liquid that can prevent ultraviolet rays from penetrating, so that the resin liquid below the embossing liquid can remain in a liquid and uncured state, so that this part of the uncured resin liquid forms an embossing layer, which is then removed by mechanical cleaning or solution washing in the subsequent processing process, thereby obtaining a three-dimensional wood grain layer with a wood grain-like structure.

[0097] The free radical absorption law is applicable to the resin liquid of the free radical polymerization principle. The principle is to penetrate into the surface of the uncured resin liquid or downward into the interior of the uncured resin liquid, so as to absorb the free radicals used to polymerize the resin liquid to undergo free radical polymerization and solidification, so that the resin liquid in the part containing the embossing liquid can remain in a liquid and uncured state, so that this part of the uncured resin liquid forms an embossing layer, which is then removed by mechanical cleaning or solution washing in the subsequent processing process, thereby obtaining a three-dimensional wood grain layer with an imitation wood grain structure.

[0098] The volume occupancy rule means that when the embossing liquid penetrates downward into the uncured resin liquid, it squeezes out the uncured resin liquid, so that the occupied volume only contains the embossing liquid. The embossing liquid can be polymerizable or non-polymerizable. Finally, the embossing liquid is cleaned and removed through the principle of mechanical or solvent cleaning to obtain a three-dimensional wood grain layer with a simulated wood grain structure.

[0099] Preferably, the embossing liquid at least contains a polymerization inhibitor for preventing polymerization of the photo-crosslinking resin.

[0100] In this preferred embodiment, an inhibitor is added to the embossing liquid, which can quench the free radicals generated by the decomposition of the photoinitiator under light, thereby effectively preventing the polymerization of the resin liquid containing the inhibitor or reducing the curing speed of the resin liquid containing the inhibitor, so that the resin liquid containing the inhibitor can still maintain a liquid or semi-solid state, thereby making the embossing layer easier to remove.

[0101] Preferably, the coverage of the topcoat is 20 g / m 2 -30g / m 2 .

[0102] In a third aspect, the present invention also provides the use of the non-PVC wood-plastic board with three-dimensional wood grain as described above in floor panels, wall panels or ceiling panels.

[0103] Therefore, the present invention has the following beneficial effects: (1) The present invention limits the surface energy relationship between the attachment base and the non-PVC wood-plastic substrate layer, thereby effectively preventing the non-PVC wood-plastic board from peeling, warping and cracking, and effectively improving the stability and durability of the board; (2) The non-PVC wood-plastic board of the present invention has a three-dimensional wood grain that is closer to real wood grain in terms of visual and tactile sense, so as to meet people's demand for a more realistic combination of visual and tactile sense; (3) The present invention adopts non-polyvinyl chloride wood-plastic board as the substrate layer, which can realize the environmentally friendly production and reuse of wood-plastic board, not only reducing the consumption of traditional wood, promoting resource conservation and recycling, but also meeting the requirements of modern society for environmental protection and sustainable development, and having good social benefits and market prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0104] Figure 1 This is a schematic reproduction diagram of step (S.1) to step (S.2) of preparing a non-PVC wood-plastic board with three-dimensional wood grain in Example 1 of the present invention.

[0105] Figure 2This is a graph showing the results of a hundred-grid test of the non-PVC wood-plastic board in Example 1 of the present invention and the attachment base material of Scheme 1.

[0106] Figure 3 This is a graph showing the results of a hundred-grid test of the attachment base material of the non-PVC wood-plastic board in Example 1 of the present invention and the comparative solution 2 (left) and the comparative solution 4 (right).

[0107] Figure 4 This is a graph showing the results of a hundred-grid test of the polyvinyl chloride wood-plastic board in Example 1 of the present invention and the attachment base material of Scheme 1.

[0108] Figure 5 This is a schematic reproduction diagram of step (S.3) to step (S.4) of preparing a non-PVC wood-plastic board with three-dimensional wood grain in Example 1 of the present invention.

[0109] Figure 6 This is a schematic reproduction diagram of step (S.5) to step (S.8) of preparing a non-PVC wood-plastic board having three-dimensional wood grain in Example 1 of the present invention.

[0110] Figure 7 This is a schematic reproduction diagram of step (S.9) to step (S.11) of preparing a non-PVC wood-plastic board having three-dimensional wood grain in Example 1 of the present invention.

[0111] Figure 8 This is a schematic reproduction diagram of step (S.12) to step (S.13) of preparing a non-PVC wood-plastic board with three-dimensional wood grain in Example 1 of the present invention.

[0112] Fig. 9 This is a photo of the non-PVC wood-plastic board produced using the attachment base material in Scheme 1 as raw material after the warping test in Example 1 of the present invention.

[0113] Fig.10 This is a photo of the non-PVC wood-plastic board produced by using the attachment base material in Comparative Scheme 2 as raw material after the warpage test in Example 1 of the present invention.

[0114] Fig.11 This is a photo of the polyvinyl chloride wood-plastic board produced using the attachment base material in Comparative Scheme 5 as raw material after the warping test in Example 1 of the present invention. DETAILED DESCRIPTION

[0115] The present invention is further described below in conjunction with specific embodiments. Those of ordinary skill in the art will be able to implement the present invention based on these descriptions. In addition, the embodiments of the present invention involved in the following description are generally only embodiments of a part of the present invention, rather than all embodiments. Therefore, based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative work should fall within the scope of protection of the present invention.

[0116] The difference between the non-polyvinyl chloride wood-plastic board with three-dimensional wood grain described in the present invention and the existing polyvinyl chloride wood-plastic board with three-dimensional wood grain is that the material of the substrate is changed. Therefore, in the process of preparation using the original method, the bonding force between the non-polyvinyl chloride wood-plastic substrate layer and the three-dimensional layer on the surface is weak, which leads to a series of problems such as delamination, warping and cracking of the non-polyvinyl chloride wood-plastic board after being prepared into a floor. Therefore, the present application is described in detail through a series of embodiments provided below.

[0117] Example 1 In this embodiment, a bonding base material is first provided which can stably bond with a polyolefin resin having a surface energy not higher than 35 dynes / cm. The bonding base material is a photocurable resin composition composed of a main resin, an auxiliary resin, an active diluent, a photoinitiator, a filler and an auxiliary agent.

[0118] Wherein, in the photocurable resin composition: The main resin is preferably a photocurable resin containing a photosensitive group, a hydrogen bond donor group and a hydrogen bond acceptor group. Further, the main resin needs to contain any one of an amide group, an imide group, an amino group, a carbamate group, a hydroxyl group and a urea group. Moreover, the addition amount of the main resin accounts for 30wt%-40wt% of the total mass of the photocurable resin composition.

[0119] The amount of the auxiliary resin added is not less than 25wt% of the amount of the main resin added, and not more than 50wt% of the amount of the main resin added.

[0120] The reactive diluent contains at least two branched chains containing acrylic acid structures. Furthermore, the reactive diluent can be any one of tripropylene glycol diacrylate (TPGDA), trimethylolpropane triacrylate (TMPTA), and pentaerythritol triacrylate (PETA), and the amount of the reactive diluent added is not less than 40wt% of the amount of the main resin added and not more than 65wt% of the amount of the main resin added.

[0121] The photoinitiator may be a free radical photoinitiator, and the added amount thereof accounts for 3wt%-5wt% of the total mass of the photocurable resin composition.

[0122] The filler can be any one or more of silicon dioxide, calcium carbonate, aluminum oxide, titanium dioxide, magnesium oxide, talc, wollastonite powder, mica powder, precipitated barium sulfate, bentonite, lime calcium powder, and ultrafine aluminum silicate, and the added amount of the filler accounts for 20wt%-30wt% of the total mass of the photocurable resin composition.

[0123] The auxiliary agent may be a heat stabilizer, a leveling agent, a defoaming agent, etc., and the added amount thereof accounts for 0.5wt%-1wt% of the total mass of the photocurable resin composition.

[0124] Tables 1 and 2 below show some typical solutions and comparative solutions prepared according to the above-mentioned photocurable resin composition formula.

[0125] Table 1

[0126] Table 2

[0127] The photocurable resin compositions in Schemes 1 to 3 and Comparative Schemes 1 to 4 are coated on the surface of the non-polyvinyl chloride wood-plastic board, and the non-polyvinyl chloride wood-plastic board with three-dimensional wood grain is prepared.

[0128] The specific steps of the non-PVC wood-plastic board with three-dimensional wood grain include: Figure 1 Steps shown: (S.1) placing an SPC non-PVC wood-plastic board with a length, width and thickness of 1260 mm*970 mm*4.85 mm on the surface of a conveying device moving in a fixed direction, wherein the non-PVC wood-plastic board (in this embodiment, the formula of the non-PVC wood-plastic board is as follows: 47.5 wt% of polypropylene (surface tension 31 mN / m), 15 wt% of wood powder, 35 wt% of stone powder, 1 wt% of antioxidant, 1 wt% of lubricant, and 0.5 wt% of anti-ultraviolet agent); (S.2) The non-PVC wood-plastic board first passes through a first roller coater during the conveying process. The coating roller surface of the roller coater is adhered with the photocurable resin composition of Schemes 1 to 3 and Comparative Schemes 1 to 4. During the contact between the non-PVC wood-plastic board and the coating roller, 12 g / m 2 The photocurable resin composition was coated on the surface of the SPC board, and the light was cured at 395 nm and 8 W / cm 2 The UV lamp cures the primer to form an adherent base.

[0129] In addition, in this embodiment, the inventors also provide a comparative scheme 5 in which a traditional polyvinyl chloride wood-plastic substrate layer is compounded with the attachment base material described in scheme 1. Wherein: the formula of the polyvinyl chloride wood-plastic board is as follows: polyvinyl chloride (surface tension 39mN / m) 45wt%, wood powder 15wt%, stone powder 34wt%, antioxidant 2wt%, lubricant 2.5wt%, anti-ultraviolet agent 1.5wt%).

[0130] The adhesion between the non-PVC wood-plastic substrate layer and the attachment base in Schemes 1 to 3 and Comparative Schemes 1 to 4 was tested according to the method described in ASTM D3359, and the adhesion between the PVC wood-plastic substrate layer and the attachment base in Comparative Scheme 5 was tested. The test results are shown in Table 3 below.

[0131] Table 3 Adhesion test results of different types of photocurable resin compositions

[0132] Among them, the test results of the adhesion base material and the polyvinyl chloride wood plastic substrate layer in scheme 1 are as follows Figure 2 As shown (the results of Scheme 2 and Scheme 3 are similar, so they are not shown here). Figure 1 It can be seen from the figure that the adhesive base used in this application has a good adhesion effect with the PP substrate. Figure 3 The left side in the middle shows the test results of the adhesion base material and the PVC wood plastic substrate layer in Comparative Scheme 2. Figure 3 The right side of the middle is the test result of the hundred grids of the attachment base material and the polyvinyl chloride wood plastic substrate layer in comparative solution 4. Figure 3 It can be seen from the results that the bonding force between the attachment base and the PP substrate is greatly reduced after the attachment base is replaced, which is not conducive to the stability and durability of the board. In addition, Figure 4 The figure is a graph of the hundred-grid test results of the composite of the attachment base material in Scheme 1 and the traditional polyvinyl chloride wood-plastic substrate layer in Comparative Scheme 5. It can be seen from the figure that it is difficult to attach the attachment base in the present application to the traditional polyvinyl chloride wood-plastic substrate layer with high strength. This shows that the attachment base used in the present application has good selectivity for polyolefin substrates.

[0133] Taking the attachment base material in Scheme 1 as an example, by attaching different weights of photocurable resin compositions on the surface of the non-polyvinyl chloride wood-plastic board, the effect of the attachment weight of the photocurable resin composition on the adhesion between the non-polyvinyl chloride wood-plastic substrate layer and the attachment base was investigated. The results are shown in Table 4 below.

[0134] Table 4 Adhesion test results of different attachment weights

[0135] like Figure 5 As shown, (S.3) the non-PVC wood-plastic board obtained in step (S.2) is passed through a second roller coater, the coating roller surface of which is adhered with a photocurable white paint (the white paint comprises: 50wt% photocurable epoxy HYS01-1, 30wt% titanium dioxide, 5wt% photoinitiator 184, 0.5wt% photoinitiator TPO, 14.5wt% diluent hydroxyethyl acrylate), and in the process of the SPC board contacting with the coating roller, 18g / m 2 The white paint is applied on the surface of the primer, and the 2 After curing with UV lamp, a white paint layer is obtained.

[0136] (S.4) The non-PVC wood-plastic board obtained in the previous step is conveyed to the first inkjet printer, so that the surface of the color paint layer is sprayed with 6-8g / m 2 The ink is cured to form a two-dimensional pattern layer having a wood grain pattern on the surface of the primer layer.

[0137] Furthermore, if Figure 6 As shown, (S.5) the non-PVC wood-plastic board obtained in the previous step is conveyed to the third roller coating machine, and 45g / m 2 The photocurable resin liquid (the resin liquid contains: 40wt% polyurethane acrylate, 5wt% silicon dioxide, 15wt% hydroxyethyl acrylate, 30wt% aluminum oxide, 5wt% photoinitiator 184, 0.5wt% photoinitiator TPO, 4.5wt% diluent) was sequentially subjected to 395nm and 8W / cm 2 UV lamp and 160w / cm 2 After curing with Hg lamp, a wood grain base layer is formed.

[0138] (S.6) The non-PVC wood-plastic board obtained in the previous step is conveyed to the fourth roller coating machine, so that the coating roller of the fourth roller coating machine is rolled along the conveying direction of the non-PVC wood-plastic board (the direction of rotation of the roller itself is clockwise) to coat 80g / m 2 Resin liquid (the resin liquid contains: 40wt% of polyurethane acrylate, 5wt% of silica, 15wt% of hydroxyethyl acrylate, 30wt% of aluminum oxide, 5wt% of photoinitiator 184, 0.5wt% of photoinitiator TPO, and 4.5wt% of diluent).

[0139] (S.7) After applying the first layer of resin liquid, the non-PVC wood-plastic board is conveyed forward along the surface of the conveying equipment, and it is ensured that the fourth roller coater does not apply any force to the resin liquid before conveying to the next roller coater.

[0140] (S.8) The non-PVC wood-plastic board obtained in the previous step is conveyed to the fifth roller coating machine, so that the coating roller of the fifth roller coating machine continues to roll-coat 75g / m against the conveying direction of the non-PVC wood-plastic board (the roller itself rotates clockwise). 2 of resin liquid.

[0141] Furthermore, if Figure 7 As shown, (S.9) the non-PVC wood-plastic board obtained in the previous step is conveyed to the second inkjet printer so that 6g / m 2 -8g / m 2 The embossing liquid (the embossing liquid contains: 45.5wt% diacrylate monomer PEG600DA, 20.5wt% p-hydroxyanisole HQMME, 10wt% 2-tert-butylhydroquinone MTBHQ, 24wt% diethylene glycol butyl ether) is prepared, and the embossing liquid is allowed to penetrate downward into the resin liquid and mix with the resin liquid to form an embossing layer.

[0142] (S.10) The resin liquid on the surface of the non-PVC wood-plastic board obtained in the previous step, except for the embossed layer, was sequentially subjected to 395nm and 8W / cm 2 UV lamp and 160w / cm 2 Hg lamp irradiation for deep curing.

[0143] (S.11) The non-PVC wood-plastic board obtained in the previous step is conveyed to a cleaning device including a steel brush, so that the embossed layer is brushed out by the steel brush, thereby forming a three-dimensional wood grain layer.

[0144] Furthermore, if Figure 8 As shown, (S.12) the non-PVC wood-plastic board obtained in the previous step is passed through the sixth roller coating machine and 395nm and 8W / cm 2 UV lamp, thus coating the surface of the three-dimensional wood grain layer with 12g / m 2 A first topcoat is applied and cured to obtain a first topcoat layer; (S.13) The non-PVC wood-plastic board obtained in the previous step is passed through the seventh roller coating machine and 395nm and 8W / cm 2 UV lamp, so as to apply 12g / m 2 The second topcoat is applied and cured to obtain a second topcoat layer.

[0145] Product testing: Product qualification rate test: According to the above method, 50 plates in Scheme 1 to Scheme 3 and Comparative Scheme 1 to Comparative Scheme 5 are respectively produced in batches, and the plates are observed for cracking and delamination. Among them, plates with quality problems observable by the naked eye are recorded as unqualified. Then the temperature in the constant temperature drying oven is set to 80℃, and the sample and the aluminum plate are placed in the constant temperature drying oven for 6 hours, and then the sample and the aluminum plate are taken out to check the qualification rate.

[0146] Warp test: Cut the plate into 240mm*240mm specimens, place them on the aluminum plate with the wear-resistant layer facing upwards, and place them at 23±2℃ and 50±5%RH for 24 hours, and measure the average initial warpage of the plate with a caliper; adjust the temperature in the constant temperature drying oven to 80℃, place the specimen together with the aluminum plate in the constant temperature drying oven for 6 hours, then take out the specimen together with the aluminum plate, and place them at 23±2℃ and 50±5%RH for 24 hours, and measure the average heating warpage of the plate with a caliper.

[0147] The test results of the product qualification rate test and the warpage test are shown in Table 5 below.

[0148] Table 5 Performance test results

[0149] Fig. 9 This is a photo of the non-PVC wood-plastic board produced by the above method and using the attachment base material in Scheme 1 as raw material after the warpage test. Fig. 9 It can be seen that after heating at 80℃ for 6h, the board can still remain straight, indicating that it has good anti-warping performance. Fig.10 This is a photo of the non-PVC wood-plastic board produced by the above method and using the attached base material in Comparative Scheme 2 as raw material after the warpage test. Fig. 9 It can be seen that after heating at 80℃ for 6h, the board showed some warping. Fig.11 The following is a photo of the polyvinyl chloride wood-plastic board produced by the above method using the attached base material in Comparative Scheme 5 as the raw material after the warping test. It can be seen from the figure that the sample exhibits strong warping, indicating that compared with polypropylene materials, polyvinyl chloride has a lower Vicat softening point, so it has a large deformation and warping after being heated at 80°C and 6h, indicating that polyolefin wood-plastic boards have significant advantages over polyvinyl chloride wood-plastic boards in terms of heat resistance.

[0150] Example 2-3 The difference between Example 2 and Example 1 is that the formula of the non-polyvinyl chloride wood-plastic board in Example 1 is replaced by replacing polypropylene with polyethylene and poly-4-methyl-1-pentene respectively, and the photocurable resin composition adopts Scheme 1.

[0151] The prepared three-dimensional wood grain non-PVC wood-plastic board was tested in the same way, and the interpretation results are shown in Table 6 below.

[0152] Table 6

[0153] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A non-PVC wood-plastic board with three-dimensional wood grain, characterized in that: include: - a non-PVC wood-plastic substrate layer comprising a polyolefin resin having a surface tension not higher than 35 mN / m; - an attachment base on one side of the non-PVC wood plastic substrate layer; wherein, The surface tension of the attachment substrate is less than the surface tension of the polyolefin resin, and the surface tension difference between the two is less than 5 mN / m; - a two-dimensional pattern layer attached to the attachment bottom away from the non-PVC wood plastic substrate layer; wherein, The two-dimensional pattern layer includes a plurality of connected or unconnected two-dimensional wood grain lines obtained by digital printing; - a three-dimensional wear-resistant layer on the two-dimensional pattern layer, the three-dimensional layer comprising a three-dimensional base layer entirely covering the two-dimensional pattern layer and a three-dimensional wear-resistant layer comprising at least a portion or all of a flange or groove corresponding to the two-dimensional wood grain lines or gaps between the two-dimensional wood grain lines in the two-dimensional pattern layer; - A topcoat layer on the surface of the three-dimensional wear-resistant layer, wherein at least a portion of the topcoat layer is lower than the upper surface of the three-dimensional wear-resistant layer.

2. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 1, characterized in that: The polyolefin resin is any one or more combinations of polyethylene, polypropylene, polyisobutylene, ethylene-vinyl acetate copolymer, ethylene-polypropylene copolymer, ethylene-acrylic acid or acrylate copolymer, and poly-4-methyl-1-pentene.

3. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 1, characterized in that: According to the test method described in ASTM D3359, the adhesion grade between the non-PVC wood-plastic substrate layer and the attachment base is 5B.

4. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 1, 2 or 3, characterized in that: The non-polyvinyl chloride wood-plastic base material layer also contains fillers and processing aids.

5. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 4, characterized in that: The filler is wood powder and / or stone powder.

6. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 1, characterized in that: The attachment base is obtained by curing the photocurable resin composition; The photocurable resin composition comprises a main resin connected with a photosensitive group; The main resin also contains hydrogen bond donor groups and hydrogen bond acceptor groups for forming hydrogen bonds.

7. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 6, characterized in that: The photocurable resin composition has a dynamic viscosity of 80 seconds to 250 seconds.

8. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 6, characterized in that: The adhesive base has a 10g / m 2 -15g / m 2 weight.

9. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 6, characterized in that: The main resin contains any one of an amide group, an imide group, an amino group, a carbamate group, a hydroxyl group, and a urea group.

10. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 6, characterized in that: The photocurable resin composition further comprises an auxiliary resin having a photosensitive group and a reactive diluent; At least one of the auxiliary resin and the reactive diluent comprises a hydrogen bond acceptor group.

11. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 10, characterized in that: The amount of the main resin added accounts for 30wt%-40wt% of the total mass of the photocurable resin composition; and The amount of the auxiliary resin added is not more than 50wt% of the amount of the main resin added; The amount of the active diluent added is not higher than 65wt% of the amount of the main resin added.

12. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 11, characterized in that: The amount of the auxiliary resin added is not less than 25wt% of the amount of the main resin added.

13. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 11, characterized in that: The amount of the active diluent added is not less than 40 wt % of the amount of the main resin added.

14. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 11, characterized in that: The reactive diluent comprises at least two branched chains containing acrylic acid structures.

15. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 14, characterized in that: The active diluent is any one of tripropylene glycol diacrylate, trimethylolpropane triacrylate and pentaerythritol triacrylate.

16. The non-PVC wood-plastic board with three-dimensional wood grain according to any one of claims 6 to 15, characterized in that: The photocurable resin composition also includes a photoinitiator, a filler and an auxiliary agent.

17. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 16, characterized in that: The amount of the photoinitiator added is 3wt%-5wt% of the total mass of the photocurable resin composition; The amount of the filler added is 20wt%-30wt% of the total mass of the photocurable resin composition; The additive is added in an amount of 0.5 wt % to 1 wt % of the total mass of the photocurable resin composition.

18. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 16, characterized in that: The photoinitiator is a free radical photoinitiator.

19. The non-PVC wood-plastic board with three-dimensional wood grain according to claim 16, characterized in that: The filler is any one or more of silicon dioxide, calcium carbonate, aluminum oxide, titanium dioxide, magnesium oxide, talcum powder, wollastonite powder, mica powder, precipitated barium sulfate, bentonite, lime calcium powder, and ultrafine aluminum silicate.

20. The non-PVC wood-plastic board with three-dimensional wood grain according to any one of claims 6 to 15, characterized in that: The attachment base contains a color masking agent for covering the color of the non-polyvinyl chloride wood-plastic substrate layer; The two-dimensional pattern layer is printed on the surface of the attachment base.

21. The non-PVC wood-plastic board with three-dimensional wood grain according to any one of claims 6 to 15, characterized in that: The surface of the attachment base away from the non-PVC wood-plastic base material layer is also covered with a color paint layer containing a color opacifying agent; The two-dimensional pattern layer is printed on the surface of the color paint layer.

22. The non-PVC wood-plastic board with three-dimensional wood grain according to any one of claims 6 to 15, characterized in that: The surface of the attachment base away from the non-polyvinyl chloride wood-plastic base material layer is also covered with a color-shielding film for covering the color of the non-polyvinyl chloride wood-plastic base material layer; The two-dimensional pattern layer is printed on the surface of the color-shielding film.

23. A method for preparing a non-PVC wood-plastic board having three-dimensional wood grain as claimed in any one of claims 1 to 22, characterized in that: The following steps are involved: -Provide a non-PVC wood plastic substrate layer; - coating a layer of photocurable resin composition on the surface of the non-polyvinyl chloride wood-plastic substrate layer, and curing it to obtain the attachment base, so that the difference in surface energy between the attachment base and the non-polyvinyl chloride wood-plastic substrate layer is less than 5mN / m; -Printing is performed on the top of the attachment substrate to obtain a two-dimensional pattern layer; - Perform three-dimensional printing on the surface of the two-dimensional pattern layer to obtain a three-dimensional wear-resistant layer; - Coating a topcoat on the surface of the three-dimensional wear-resistant layer and curing the topcoat layer to obtain the topcoat layer.

24. The method according to claim 23, characterized in that The dynamic viscosity of the photocurable resin composition is 80 seconds to 250 seconds; The application amount of the photocurable resin composition is 10 g / m 2 -15g / m 2 .

25. The method according to claim 23 or 24, characterized in that The two-dimensional pattern layer is directly printed on the surface of the attachment base.

26. The method according to claim 25, characterized in that The photocurable resin composition also contains a color masking agent for covering the color of the non-polyvinyl chloride wood-plastic substrate layer.

27. The method according to claim 23 or 24, characterized in that Before printing the two-dimensional pattern layer, the method also includes the steps of coating a layer of color paint on the attached bottom surface and curing the color paint to form a color paint layer, and the two-dimensional pattern layer is directly printed on the surface of the color paint layer.

28. The method according to claim 23 or 24, characterized in that Before printing the two-dimensional pattern layer, a color masking film for covering the color of the non-polyvinyl chloride wood-plastic substrate layer is also formed on the attached bottom surface by heat bonding, and the two-dimensional pattern layer is directly printed on the surface of the color masking film.

29. Use of the non-polyvinyl chloride wood-plastic board with three-dimensional wood grain as claimed in any one of claims 1 to 22 in floor panels, wall panels or ceiling panels.

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