Dual-redundancy pressure core assembly based on heavily doped silicon piezoresistive chip

Abstract

The invention belongs to the field of pressure sensors, and particularly relates to a dual-redundancy pressure core assembly based on a heavily doped silicon piezoresistive chip. A heavily-doped silicon piezoresistive chip is packaged in the same sintering tube seat oil filling cavity, so that mutually-independent dual-redundancy pressure measurement is realized. Meanwhile, components such as a diaphragm, a ceramic pad and a pressing ring are arranged, the ceramic pad comprises a plurality of communicating mounting cavities, the chip is connected with a signal pin penetrating through a tube hole of the sintering tube seat through a wire, and the sintering tube seat is provided with a liquid guide hole and is sealed with oil through a sealing steel ball. The heavily doped silicon piezoresistive chip adopts special bonding and silicon island design, and the sintered tube socket is also formed by special bonding. The assembly avoids the problem of large size caused by a switching structure in the prior art, achieves miniaturization and light weight, and is suitable for harsh scenes; a dual-redundancy measurement function is achieved, and stable operation of a key system is guaranteed; the silicon island design optimizes the performance of the chip, prolongs the service life, reduces the cost, can accurately and stably measure the pressure, and adapts to complex working conditions.

Description

Technical Field

[0001] The invention belongs to the field of pressure sensors, in particular to a dual-redundancy pressure core component based on a heavily doped silicon piezoresistive chip. Background Art

[0002] In today's industrial and technological fields, medium pressure measurement is of vital importance, and dual-channel pressure measurement is more common. For example, a dual-channel pressure-sensitive core shown in Chinese Patent Publication No. CN112729660A is representative in terms of pressure measurement technology. The prior art adopts a dual-chip structure design to achieve dual-channel pressure measurement through a specific mutual switching structure. In practical applications, this design can achieve separate pressure measurement to a certain extent, meeting some basic measurement requirements. However, it also has significant disadvantages.

[0003] First, its overall structure (including the axial direction) is large in size and heavy in weight. This is because a special switching structure is required to realize the dual-channel function, which increases the volume and weight of the component, and is not conducive to application in scenarios with strict requirements on space and weight. Secondly, the design of the switching channel makes the overall structure complex and difficult to operate, requiring a more complex control and switching mechanism, which increases the cost of use and the difficulty of maintenance. Furthermore, this design lacks versatility and universality, and is difficult to adapt to different application scenarios and needs, limiting its application in a wider range of fields. In response to the above problems, against the background of the growing demand for lightweight, miniaturized, and wide-range dual-redundancy pressure measurement, there is an urgent need for a new pressure core assembly to overcome the shortcomings of the existing technology in order to better meet the diverse needs in practical applications. Summary of the invention

[0004] In order to solve the above problems, a dual-redundancy pressure core component based on heavily doped silicon piezoresistive chips is proposed. The heavily doped silicon piezoresistive chips are packaged in the same oil-filled cavity of a sintered tube holder, and a variety of optimized designs are combined to achieve dual-redundancy pressure measurement and performance improvement.

[0005] In order to achieve the above object, the present invention specifically adopts the following technical solutions:

[0006] A dual-redundancy pressure core component based on a heavily doped silicon piezoresistive chip comprises a sintered tube seat and a plurality of heavily doped silicon piezoresistive chips packaged in the sintered tube seat. The heavily doped silicon piezoresistive chips are packaged in an oil-filled cavity of the same sintered tube seat and are respectively used to realize mutually independent dual-redundancy pressure measurements.

[0007] Furthermore, it also includes: a diaphragm, a ceramic pad and a pressure ring, wherein the diaphragm is welded to the sintered tube seat, the ceramic pad is arranged in a groove of the sintered tube seat, and the pressure ring fixes the ceramic pad and the diaphragm.

[0008] Furthermore, the ceramic pad includes at least two mounting cavities for placing the heavily doped silicon piezoresistive chips, and the mounting cavities are interconnected.

[0009] Furthermore, an oil-filled cavity is provided between the mounting cavity and the diaphragm, and the chip in the mounting cavity is connected to a signal pin via a wire.

[0010] Furthermore, the signal pin passes through the tube hole of the sintered tube holder and is connected to an external signal acquisition device.

[0011] Furthermore, a liquid guide hole is provided in the sintered tube seat, and oil is sealed above the liquid guide hole by a sealing steel ball.

[0012] Furthermore, the heavily doped silicon piezoresistive chip is bonded with glass and single crystal silicon having similar thermal expansion coefficients, thereby reducing thermal effects.

[0013] Furthermore, the heavily doped silicon piezoresistive chip is a silicon island design, which has better linearity and overload resistance.

[0014] Furthermore: the sintered tube seat is formed by bonding glass and single crystal silicon with similar thermal expansion coefficients to reduce the influence of heat on the chip output characteristics.

[0015] Compared with the prior art, the present invention has the following beneficial technical effects:

[0016] The present invention packages the heavily doped silicon piezoresistive chip in the oil-filled cavity of the same sintered tube holder, thereby avoiding the increase in the volume of the component due to the switching structure in the prior art, and realizing the miniaturization and lightweight design of the pressure core component, which is more advantageous in application scenarios with strict requirements on space and weight.

[0017] The dual-redundancy measurement function of the present invention realizes independent dual-redundancy pressure measurement, which improves the reliability and accuracy of the measurement. When one measurement channel fails, the other channel can still work normally, ensuring the continuous acquisition of pressure measurement data, providing a strong guarantee for the stable operation of key systems, such as the pressure monitoring link on the industrial automation production line, which can effectively prevent production interruptions or product quality problems caused by pressure measurement failures.

[0018] The silicon island design of the heavily doped silicon piezoresistive chip makes it more linear and more resistant to overload. In practical applications, it can more accurately reflect pressure changes, and the chip is not easily damaged when facing instantaneous pressure overload, which prolongs the service life of the pressure core component and reduces maintenance costs. It can adapt to various complex working conditions during engine operation and ensure the accuracy and stability of pressure measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1is an exploded view of a certain embodiment of the present invention;

[0020] Figure 2 is a cross-sectional view of a certain embodiment of the present invention;

[0021] Figure 3 is a three-dimensional diagram of a ceramic pad and a pin according to an embodiment of the present invention;

[0022] Figure 4 is a top view of a ceramic pad according to an embodiment of the present invention;

[0023] Figure 5 It is a cross-sectional view of a heavily doped silicon piezoresistive chip according to an embodiment of the present invention.

[0024] The numbers in the figure are: 1, sintered tube seat; 101, tube hole; 102, liquid guide hole; 2, ceramic pad; 201, side hole; 3, signal pin; 4, installation cavity (oil-filled cavity); 5, wire hole; 6, heavily doped silicon piezoresistive chip; 601, heavily doped resistor strip; 602, silicon island; 603, single crystal silicon; 604, glass; 7, diaphragm; 8, pressure ring; 9, rubber ring groove; 10, sealing steel ball. DETAILED DESCRIPTION

[0025] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in the following embodiments only illustrate the basic concept of the present invention in a schematic manner, and the following embodiments and features in the embodiments can be combined with each other without conflict.

[0026] Among them, the drawings are only used for illustrative explanations, and they only represent schematic diagrams rather than actual pictures, and should not be understood as limitations on the present invention. In order to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of actual products. For those skilled in the art, the omission of certain well-known structures and their descriptions in the drawings is understandable.

[0027] The present invention provides a dual-redundancy pressure core assembly based on a heavily doped silicon piezoresistive chip, which has a compact structure, high measurement accuracy, and excellent stability and reliability. The specific implementation of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0028] See also Figure 1 and 2The dual-redundancy pressure core assembly of the present invention mainly includes key components such as a sintered tube seat 1, a ceramic pad 2, a signal pin 3, a heavily doped silicon piezoresistive chip 6, a diaphragm 7, and a pressure ring 8. The above components cooperate with each other to achieve accurate measurement and collection of pressure signals.

[0029] The sintered tube seat 1 is the main structure of the entire assembly, and its design is reasonable and durable. On the sintered tube seat 1, there are designed tube holes 101 and liquid guide holes 102. The main function of the tube hole 101 is to allow the signal pin 3 to pass through, so as to transmit the electrical signal output by the heavily doped silicon piezoresistive chip 6 to the external signal acquisition device. The liquid guide hole 102 is used for oil filling and liquid discharge operations to ensure that the oil in the oil filling cavity 4 can be filled and discharged smoothly.

[0030] The sealing steel ball is cleverly arranged above the sintered tube base 1 to achieve sealing of the oil-filled cavity 4. This sealing method ensures that the oil will not leak, thereby ensuring the sealing performance of the component and the measurement accuracy.

[0031] See also Figure 3 and 4 , the ceramic pad 2 is arranged in the groove of the sintered tube seat 1, and its main function is to place the heavily doped silicon piezoresistive chip 6. The ceramic pad 2 has two interconnected mounting cavities 4. The two mounting cavities 4 are respectively used to place two heavily doped silicon piezoresistive chips 6, so that the two chips 6 can realize dual-redundancy pressure measurement in the same sintered tube seat 1. By encapsulating the two heavily doped silicon piezoresistive chips 6 in the oil-filled cavity 4 of the same sintered tube seat 1, the miniaturization and lightweight design of the component is achieved. This design makes the component easier to install and carry, while reducing the cost. At the same time, the mounting cavities 4 are interconnected through the side holes 201. This connection method ensures that the oil in the oil-filled cavity 4 can be evenly distributed, thereby further improving the stability of the measurement.

[0032] The signal pin 3 passes through the tube hole 101 of the sintered tube base 1 and is electrically connected to the heavily doped silicon piezoresistive chip 6 through a wire. The main function of the signal pin 3 is to transmit the electrical signal output by the chip 6 to an external signal acquisition device so as to monitor and collect the pressure signal in real time.

[0033] See also Figure 5 The chip 6 is bonded with glass 604 and single crystal silicon 603 with similar thermal expansion coefficients to reduce the impact of heat on chip performance. This bonding method not only improves the stability of the chip, but also makes the thermal expansion coefficient of the chip close to that of the sintered tube seat 1, thereby further reducing the impact of thermal stress on the chip output characteristics.

[0034] The chip 6 is designed with a silicon island 602, and a heavily doped resistor strip 601 is arranged on the silicon island 602. These resistor strips can convert pressure changes into electrical signals for output, thereby realizing pressure measurement. The structure of the silicon island 602 enables the chip 6 to have better linearity and overload resistance, further improving the accuracy and reliability of the measurement. This enables the component to maintain stable working performance in harsh environments such as high pressure and high temperature.

[0035] The diaphragm 7 is connected to the sintered tube seat 1 by welding, and together with the ceramic pad 2 and the pressure ring 8, it forms an oil-filled chamber 4. The diaphragm 7 can sense the change of external pressure and transmit it to the oil in the oil-filled chamber 4. After being subjected to pressure, the oil will further act on the heavily doped silicon piezoresistive chip 6, thereby realizing the measurement of pressure. The diaphragm 7 can withstand greater pressure without deformation or rupture. At the same time, the material of the diaphragm 7 also has good sealing performance, which can ensure that the oil in the oil-filled chamber 4 will not leak.

[0036] The main function of the pressure ring 8 is to fix the ceramic pad 2 and the diaphragm 7, thereby ensuring the structural stability of the entire assembly. Under the action of the pressure ring 8, the ceramic pad 2 is tightly pressed into the groove of the sintered tube seat 1, and the diaphragm 7 is also firmly welded to the sintered tube seat 1. This fixing method not only improves the reliability of the assembly, but also enables the assembly to maintain stable performance during long-term use.

[0037] In addition, the ceramic pad 2 also has wire holes 5. These wire holes 5 are used to pass wires connected to the chip 6, so as to achieve the transmission of electrical signals. The wires are connected to the signal pins 3 below through the wire holes 5, ensuring the stable transmission of electrical signals. This design not only simplifies the structure of the component, but also improves the transmission efficiency of electrical signals.

[0038] Furthermore, a rubber ring groove 9 is provided in the sintered tube seat 1. The rubber ring groove 9 is used to place a rubber ring to seal the oil filling chamber 4. The provision of the rubber ring groove 9 further ensures the sealing of the oil filling chamber 4 and prevents leakage of oil. This sealing method not only improves the sealing performance of the component, but also ensures the accuracy of the measurement.

[0039] In the specific implementation, firstly, two heavily doped silicon piezoresistive chips 6 need to be placed in the two mounting cavities 4 of the ceramic pad 2, and connected to the signal pin 3 through wires. Then, the ceramic pad 2 is placed in the groove of the sintered tube seat 1 and fixed with a pressure ring 8. Next, the diaphragm 7 is welded to the sintered tube seat 1 to form an oil-filled cavity 4. Finally, oil is filled into the oil-filled cavity 4 through the liquid guide hole 102, and the sealing steel ball 10 is used to seal the oil.

[0040] Through the implementation of the above steps, the dual-redundancy pressure core assembly of the present invention is successfully manufactured. The assembly is not only compact in structure and has high measurement accuracy, but also has excellent stability and reliability. In practical applications, the assembly can be widely used in key parts of industrial automation production lines, such as hydraulic stations, air pressure stations, etc. When the production line is running, the assembly can monitor the pressure changes in key parts in real time and transmit the monitoring results to the control system. When one of the measurement channels fails, the other channel can still work normally, thereby ensuring the continuous acquisition of pressure monitoring data.

[0041] The present invention bonds two heavily doped silicon piezoresistive pressure chips in a sintered tube socket of a dual-redundancy pressure core assembly, thereby effectively realizing a miniaturized and lightweight design of the dual-redundancy pressure core assembly, improving the versatility of the dual-redundancy pressure core assembly, realizing dual-redundancy pressure measurement, and having high dual-redundancy consistency; the silicon island type heavily doped silicon piezoresistive chip has a stronger overload resistance, better temperature drift performance, and a wider applicable temperature range.

[0042] The above are only preferred embodiments of the present invention, and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A dual-redundancy pressure core assembly based on a heavily doped silicon piezoresistive chip, comprising a sintered tube base (1) and a plurality of heavily doped silicon piezoresistive chips (6) packaged in the sintered tube base (1), characterized in that: The heavily doped silicon piezoresistive chips (6) are packaged in the oil-filled cavity of the same sintered tube base (1) and are respectively used to realize independent dual-redundancy pressure measurements.

2. The double-redundant pressure core assembly based on heavily doped silicon piezoresistive chip according to claim 1, characterized in that: include: A diaphragm (7), a ceramic pad (2) and a pressure ring (8), wherein the diaphragm (7) is welded to a sintered tube seat (1), the ceramic pad (2) is arranged in a groove of the sintered tube seat (1), and the pressure ring (8) fixes the ceramic pad (2) and the diaphragm (7).

3. The double-redundant pressure core assembly based on heavily doped silicon piezoresistive chip according to claim 1, characterized in that: The ceramic pad (2) comprises at least two mounting cavities (4) for placing heavily doped silicon piezoresistive chips, and the mounting cavities (4) are interconnected.

4. The double-redundant pressure core assembly based on heavily doped silicon piezoresistive chip according to claim 2, characterized in that: An oil-filled cavity is located between the installation cavity (4) and the diaphragm (7), and the chip in the installation cavity (4) is connected to the signal pin (3) via a wire.

5. The double-redundant pressure core assembly based on heavily doped silicon piezoresistive chip according to claim 1, characterized in that: The signal pin (3) passes through the tube hole (101) of the sintered tube holder and is connected to an external signal collection device.

6. The double-redundant pressure core assembly based on heavily doped silicon piezoresistive chip according to claim 1, characterized in that: A liquid guide hole (102) is arranged in the sintered tube seat, and oil is sealed above the liquid guide hole through a sealing steel ball (10).

7. The double-redundant pressure core assembly based on heavily doped silicon piezoresistive chip according to claim 1, characterized in that: The heavily doped silicon piezoresistive chip (6) is bonded by glass (604) and single crystal silicon (603) having similar thermal expansion coefficients, thereby reducing thermal influence.

8. The double-redundant pressure core assembly based on heavily doped silicon piezoresistive chip according to claim 1, characterized in that: The heavily doped silicon piezoresistive chip (6) comprises a silicon island (602) and has better linearity and overload resistance.

9. The double-redundant pressure core assembly based on heavily doped silicon piezoresistive chip according to claim 1, characterized in that: The sintered tube seat (1) is formed by bonding glass (604) and single crystal silicon (603) with similar thermal expansion coefficients, so as to reduce the influence of heat on chip output characteristics.

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