A semiconductor testing device and a testing method using the same

Abstract

The present invention provides a semiconductor testing device and a testing method using the same, wherein the device comprises a control module connected in sequence, a first data transmission module connected to the control module, and a plurality of test benches connected to the first data transmission module, wherein the first data transmission module comprises a wireless data transmission module, and the first data transmission module is connected to the test bench signal for receiving a control signal from the control module so that each test bench performs a plurality of identical or different first test tasks based on the control signal. This solution replaces the traditional wired connection with a wireless data transmission module, simplifies the layout and installation of the hardware, avoids the space occupation and complexity caused by traditional wiring and circuit board routing, reduces the complexity and cost of system upgrades, improves the test performance, can uniformly control the operation of multiple test benches, provides support for diversified and parallel test requirements, and can perform parallel operations for different types of test requirements.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor testing equipment, and in particular relates to a semiconductor testing equipment and a testing method using the same. Background Art

[0002] With the development of industrial automation, especially in the field of electronic component production and semiconductor testing, higher requirements are placed on the accuracy, efficiency and reliability of test equipment. Traditional semiconductor test equipment usually consists of multiple industrial computers, test benches and various signal transmission lines. This layout has some limitations, especially in the environment of expanding production scale and diversifying test requirements, traditional systems face many problems.

[0003] In traditional test systems, each test bench usually needs to be equipped with an independent industrial computer, and there are also signals that need to be transmitted between multiple test benches. This method not only has complex wiring and occupies more space, but also increases the complexity of the system's physical layout. When a large number of test equipment needs to be configured, the equipment using this layout method is particularly large, which also leads to higher maintenance costs for the system.

[0004] Moreover, since signals in semiconductor testing are very sensitive to line length, traditional transmission methods lack stability and reliability, which often leads to signal attenuation and distortion, and even affects the accuracy of test results. In order to ensure signal quality, high-performance transmission cables and probes are usually required, which not only increases the overall complexity of the system, but also increases costs. Summary of the invention

[0005] In order to overcome the defects of the above-mentioned prior art, the present invention proposes a semiconductor testing device, comprising a control module connected in sequence, a first data transmission module connected to the control module, and a plurality of test benches connected to the first data transmission module;

[0006] The first data transmission module includes a wireless data transmission module, which is signal-connected to the test bench and is used to receive a control signal from the control module so that each test bench performs a number of identical or different first test tasks based on the control signal.

[0007] Specifically, the test bench includes a plurality of second data transmission modules connected to the first data transmission module, and any of the second data transmission modules is sequentially connected to a first data processing module and a first resource module;

[0008] The second data transmission module includes a wireless data transmission module, which is signal-connected to the first data transmission module and is used to receive a control signal transmitted by the first data transmission module, so as to execute the first test task through each of the first data processing modules and each of the first resource modules based on the control signal.

[0009] Preferably, the control module is connected to a plurality of first data transmission modules, and the number of the first data transmission modules connected to the control module is not greater than the number of second data transmission modules in the same test bench connected to the first data transmission modules.

[0010] Preferably, the second data transmission modules in the same test bench can be connected to each other, the first data processing modules in the same test bench can be connected to each other, and the first resource modules in the same test bench can be connected to each other.

[0011] Furthermore, the semiconductor testing device proposed in the present invention further includes a third data transmission module and a second data processing module connected between the control module and the first data transmission module;

[0012] The third data transmission module is connected to the control module and the second data processing module respectively, the second data processing module is connected to the first data transmission module, and the second data processing module is also connected to a second resource module. The third data transmission module is used to receive a control signal from the control module to execute a second test task through the second data processing module and the second resource module based on the control signal.

[0013] Optionally, the third data transmission module includes a wired data transmission module or a wireless data transmission module.

[0014] Preferably, the wireless data transmission module serving as the first data transmission module, the second data transmission module and the third data transmission module includes a wireless data transmission module supporting WiFi5, WiFi 6 and WiFi 7.

[0015] Preferably, the test level of the second test task is not lower than that of the first test task.

[0016] The present invention also proposes a testing method, which is implemented by the semiconductor testing device as described above, and the method comprises:

[0017] In response to a first test task instruction, the control module transmits a control signal to a corresponding test bench through the first data transmission module;

[0018] Enable each of the test benches that receives the control signal to perform a corresponding first test task;

[0019] After the first test task is completed, the control module receives the returned test data and result information through the first data transmission module.

[0020] Further, the semiconductor testing device further includes a third data transmission module connected between the control module and the first data transmission module, and a second data processing module, the second data processing module is connected to the second data transmission module, and the second data processing module is further connected to a second resource module, and the method further includes:

[0021] In response to the second test task instruction, the control module sends a corresponding control signal to the second data processing module through the third data transmission module;

[0022] Processing the control instruction through the second data processing module to send the processed control signal to the second resource module, and / or sending the processed control signal to the corresponding test bench through the first data transmission module;

[0023] Performing a corresponding second test task through the second resource module, and / or each of the test benches that receives the control instruction performs a corresponding first test task;

[0024] After the first test task and / or the second test task is completed, the control module receives the returned test data and result information through the third data transmission module.

[0025] The present invention has at least the following beneficial effects:

[0026] The solution proposed in the present invention can realize the control of multiple test benches at the remote end through the control module and the wireless data transmission mode, reduce the distance from the resource module to the chip to be tested, improve the test performance, and avoid the influence of the transmission quality of the line length sensitive signal or the high-speed signal on the line length due to the long line. The control module can flexibly configure each test bench to execute different test items according to actual needs, and at the same time make the test bench more flexible to expand. It only needs to ensure the coverage of the wireless network without a large amount of wiring or reconfiguration of equipment. When the test demand increases, the test bench can be quickly added. Since all the test benches are managed by a central control module, the system can feedback the status, results and other information of each test bench in real time. Once a fault occurs, the maintenance personnel can quickly locate the problem and make effective repairs.

[0027] Furthermore, the solution proposed in the present invention enables each test bench to not only process control signals from the control module, but also transmit signals to specific test execution parts through a multi-level data transmission architecture, thereby ensuring that each test bench can effectively execute different test tasks and can achieve efficient data communication with the control module. A plurality of first data transmission modules are connected through the control module, and the number of connected first data transmission modules does not exceed the number of second data transmission modules in the same test bench, which helps to maintain signal stability and fluency and prevent data conflicts or delays caused by excessive concentration. The interconnection between modules in the same test bench enhances the collaborative working ability between modules, so that efficient data exchange and sharing can be carried out between modules, thereby completing complex test tasks faster and more accurately, improving overall resource utilization, and avoiding waste of redundant resources.

[0028] In addition, the second data processing module and the second resource module introduced in the present invention provide the device with a second-level testing capability, so that the testing device can not only perform the basic first test, but also perform a higher-level second test, so that the device can flexibly adapt to higher-precision or more complex semiconductor testing requirements. The third data transmission module serves as a bridge connecting the control module, the second data processing module and the first data transmission module, which facilitates the two-way flow of data. The use of a transmission module that supports multiple WiFi wireless communication technologies can support high-speed, high-bandwidth data transmission, can reduce test bottlenecks caused by data transmission delays, and provide more stable communication.

[0029] Thus, the present invention provides a semiconductor testing device and a testing method using the same. The solution proposed by the present invention replaces the traditional wired connection with a wireless data transmission module, simplifies the layout and installation of the hardware, avoids the space occupation and complexity caused by traditional wiring and circuit board routing, reduces the complexity and cost of system upgrades, and improves the test performance. The control module can perform unified operation control on multiple test benches, provide support for diversified and parallel testing requirements, so that parallel operations can be performed for different types of testing requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 A schematic diagram of the module structure of the semiconductor testing equipment provided in Example 1;

[0032] Figure 2A schematic diagram of a module structure of another implementation of the semiconductor testing equipment provided in Example 1;

[0033] Figure 3 A schematic diagram of a method flow chart of the test method provided in Example 2;

[0034] Figure 4 This is a schematic diagram of a method flow chart of another implementation of the testing method provided in Example 2.

[0035] Reference numerals

[0036] 1-control module; 2-first data transmission module; 3-test bench; 4-second data transmission module; 5-first data processing module; 6-first resource module; 7-third data transmission module; 8-second data processing module; 9-second resource module. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Hereinafter, various embodiments of the present invention will be described more fully. The present invention may have various embodiments, and adjustments and changes may be made therein. However, it should be understood that there is no intention to limit the various embodiments of the present invention to the specific embodiments disclosed herein, but the present invention should be understood to cover all adjustments, equivalents and / or alternatives falling within the spirit and scope of the various embodiments of the present invention.

[0039] Hereinafter, the term "include" or "may include" used in various embodiments of the present invention indicates the presence of disclosed functions, operations or elements, and does not limit the addition of one or more functions, operations or elements. In addition, as used in various embodiments of the present invention, the terms "include", "have" and their cognates are intended only to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be understood as first excluding the presence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or the possibility of adding one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0040] In various embodiments of the present invention, the expression "or" or "at least one of A or / and B" includes any combination or all combinations of the words listed at the same time. For example, the expression "A or B" or "at least one of A or / and B" may include A, may include B, or may include both A and B.

[0041] The expressions (such as "first", "second", etc.) used in various embodiments of the present invention may modify the various constituent elements in various embodiments, but may not limit the corresponding constituent elements. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used for the purpose of distinguishing an element from other elements. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, without departing from the scope of various embodiments of the present invention, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.

[0042] It should be noted that in the present invention, unless otherwise clearly specified and defined, the terms such as "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In the present invention, those skilled in the art need to understand that the terms indicating orientation or positional relationship herein are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0044] The terms used in various embodiments of the present invention are only used for the purpose of describing specific embodiments and are not intended to limit various embodiments of the present invention. As used herein, the singular form is intended to also include the plural form, unless the context clearly indicates otherwise. Unless otherwise limited, all terms used here (including technical terms and scientific terms) have the same meaning as the meaning generally understood by those of ordinary skill in the art to which the various embodiments of the present invention belong. The terms (such as the terms defined in the dictionary generally used) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning, unless clearly defined in various embodiments of the present invention.

[0045] Example 1

[0046] This embodiment provides a semiconductor testing device for testing chips and / or wafers. Figure 1 , the semiconductor testing equipment comprises a control module 1 connected in sequence, a first data transmission module 2 connected to the control module 1, and a plurality of test benches 3 connected to the first data transmission module 2;

[0047] The first data transmission module 2 includes a wireless data transmission module, which is signal-connected to the test bench 3 and is used to receive a control signal from the control module 1 so that each test bench 3 can perform a number of identical or different first test tasks through the control signal.

[0048] Specifically, the test bench 3 includes N second data transmission modules 4 signal-connected to the first data transmission module 2, and any second data transmission module 4 is connected in sequence to a first data processing module 5 and a first resource module 6 to execute the first test task through each first resource module 6; the second data transmission module 4 also includes a wireless data transmission module.

[0049] Preferably, the control module 1 is connected to M first data transmission modules 2, M≤N, that is, the number of first data transmission modules 2 connected to the control module 1 is not greater than the number of second data transmission modules 4 in the same test bench 3 connected to the first data transmission modules 2; in this embodiment, the control module 1 includes an industrial computer.

[0050] Preferably, the second data transmission modules 4 in the same test bench 3 can be interconnected, the first data processing modules 5 in the same test bench 3 can be interconnected, and the first resource modules 6 in the same test bench 3 can be interconnected, so that the modules of the same type in the same test bench 3 can flexibly share resources and data, and more efficient parallel processing can be achieved, and the combination of modules and the expansion of functions can be easily achieved, thereby improving the parallelism of the overall test system, reducing the test time, facilitating equipment expansion or reconfiguration, and increasing the flexibility of the test equipment;

[0051] In addition, when a module fails, the interconnection between modules can provide a redundant path to ensure that the system can continue to operate. Other modules can take over or replace the failed module to ensure that the test process is not interrupted. The interconnection and backup of data and tasks ensure that even if some modules fail, there are still other modules to supplement their functions, thereby enhancing the stability and reliability of the test equipment.

[0052] It should be noted that, since the first data transmission module 2 and the second data transmission module 4 are wireless data transmission modules, their performance will be affected by factors such as bandwidth, signal interference and bandwidth limitation. If the number of the second data transmission modules 4 is too large (i.e., M is too large), it may lead to insufficient wireless channel resources, resulting in the first data transmission module 2 being unable to fully utilize the number of second data transmission modules 4 connected to it, being unable to effectively manage all data streams, or causing problems of uneven data distribution;

[0053] If the number of first data transmission modules 2 connected to the control module 1 exceeds the number of second data transmission modules 4 in the same test bench 3 connected to the first data transmission modules 2, a bottleneck may occur in the data transmission link, or some first data transmission modules 2 may fail to effectively connect to the second data transmission modules 4;

[0054] By limiting the number of second data transmission modules 4, it can be ensured that the workload of each data transmission module will not be too heavy, avoiding the situation where some data transmission modules are idle due to uneven resource allocation, or causing some modules to have resource overload, effectively reducing data transmission delays and packet loss, and improving the stability and performance of the overall equipment.

[0055] For further information, see Figure 2 A third data transmission module 7 and a second data processing module 8 are also connected between the control module 1 and the first data transmission module 2, wherein the third data transmission module 7 is connected to the control module 1 and the second data processing module 8 respectively, the second data processing module 8 is connected to the first data transmission module 2, and the second data processing module 8 is also connected to a second resource module 9 to perform a second test task through the second resource module 9; optionally, the third data transmission module 7 includes a wired data transmission module or a wireless data transmission module.

[0056] It should be noted that the control module 1 can also be connected to a plurality of third data transmission modules 7 to synchronously execute a plurality of identical or different second test tasks.

[0057] In this embodiment, the test level of the second test task is not lower than that of the first test task, which may specifically include but is not limited to the complexity of the second test task being not lower than that of the first test task, the test dimension of the second test task being not less than that of the first test task, and the working conditions required by the second test task being not less than those of the first test task. Exemplarily, the second test task may require higher-precision test instruments and technical means, use dedicated test instruments or more complex data acquisition and processing systems, involve more steps, higher resolution, or longer continuous testing, etc., compared with the first test task.

[0058] Preferably, the wireless data transmission module serving as the first data transmission module 2, the second data transmission module 4 or the third data transmission module 7 includes a wireless data transmission module that can support WiFi versions such as WiFi5, WiFi 6 and WiFi 7;

[0059] It should be noted that WiFi5, WiFi 6 and WiFi 7 are different versions of WiFi technology, corresponding to different wireless communication standards;

[0060] Among them, WiFi5 can theoretically reach a maximum of 3.5Gbps, mainly working in the 5GHz frequency band, and also partially supports the 2.4GHz frequency band, using broadband channels and supporting communication with multiple devices at the same time;

[0061] Theoretically, Wi-Fi 6 can reach a maximum of 9.6Gbps, supports 2.4GHz and 5GHz bands, and partially supports 6GHz bands. It introduces OFDMA technology, can send data packets to multiple devices at the same time, and supports MU-MI MO (Multi-User Multiple Input Multiple Output) in both upload and download directions.

[0062] The theoretical maximum speed of Wi F i 7 can reach 30Gbps, supporting 2.4GHz, 5GHz and 6GHz bands. It further improves the modulation method, enhances OFDMA (Orthogonal Frequency Division Multiple Access) and MU-MIMO technology, supports simultaneous access of more devices, and optimizes latency and throughput. It is suitable for applications in high-density environments and supports devices to communicate between multiple frequency bands at the same time.

[0063] Example 2

[0064] This embodiment proposes a testing method, which is implemented by the semiconductor testing equipment proposed in Embodiment 1. Figure 3 , the method comprising:

[0065] S210: In response to the first test task instruction, the control module transmits a control signal to a corresponding test bench through the first data transmission module.

[0066] S211: Enable each test station that receives the control signal to perform a corresponding first test task.

[0067] S212: After the first test task is completed, the control module receives the returned test data and result information through the first data transmission module.

[0068] Specifically, the semiconductor test equipment includes a control module 1 connected in sequence, a first data transmission module 2 connected to the control module 1, and a plurality of test benches 3 connected to the first data transmission module 2;

[0069] The first data transmission module 2 includes a wireless data transmission module. The first data transmission module 2 is signal-connected to the test bench 3 and is used to receive a control signal from the control module 1 in step S210, so that each test bench 3 can perform several identical or different first test tasks through the control signal in step S211. The first data transmission signal is also used to return the test data and result information transmitted by the test bench 3 to the control module 1 in step S212. In this embodiment, the control module 1 includes an industrial computer.

[0070] The test bench 3 includes N second data transmission modules 4 signal-connected to the first data transmission module 2, and any second data transmission module 4 is connected in sequence to a first data processing module 5 and a first resource module 6 to execute the first test task through each first resource module 6; the second data transmission module 4 also includes a wireless data transmission module.

[0071] Preferably, the control module 1 is connected to M first data transmission modules 2 , M≤N, that is, the number of first data transmission modules 2 connected to the control module 1 is not greater than the number of second data transmission modules 4 in the same test bench 3 connected to the first data transmission modules 2 .

[0072] Furthermore, a third data transmission module 7 and a second data processing module 8 are connected between the control module 1 and the first data transmission module 2, wherein the third data transmission module 7 is connected to the control module 1 and the second data processing module 8 respectively, the second data processing module 8 is connected to the first data transmission module 2, and the second data processing module 8 is also connected to a second resource module 9, see Figure 4 , the method correspondingly further comprises:

[0073] S220: In response to the second test task instruction, the control module sends a corresponding control signal to the second data processing module through the third data transmission module.

[0074] Optionally, the third data transmission module includes a wired data transmission module or a wireless data transmission module.

[0075] Preferably, the wireless data transmission module serving as the first data transmission module 2 , the second data transmission module 4 or the third data transmission module 7 includes a wireless data transmission module that can support WiFi versions such as WiFi5, WiFi 6 and WiFi 7.

[0076] S221: Process the control instruction through the second data processing module to send the processed control signal to the second resource module, and / or send the processed control signal to the corresponding test bench through the first data transmission module.

[0077] S222: Perform the corresponding second test task through the second resource module, and / or each test station that receives the control instruction performs the corresponding first test task.

[0078] In this embodiment, the test level of the second test task is not lower than that of the first test task, which may specifically include but is not limited to the complexity of the second test task being not lower than that of the first test task, the test dimension of the second test task being not less than that of the first test task, and the working conditions required by the second test task being not less than those of the first test task. Exemplarily, the second test task may require higher-precision test instruments and technical means, use dedicated test instruments or more complex data acquisition and processing systems, involve more steps, higher resolution, or longer continuous testing, etc., compared with the first test task.

[0079] S223: After the first test task and / or the second test task is completed, the control module receives the returned test data and result information through the third data transmission module.

[0080] In summary, the present invention provides a semiconductor testing device and a testing method using the same. The solution proposed in the present invention replaces the traditional wired connection with a wireless data transmission module, simplifies the layout and installation of the hardware, avoids the space occupation and complexity caused by traditional wiring and circuit board routing, reduces the complexity and cost of system upgrades, and improves test performance. The control module can perform unified operation control on multiple test benches, provide support for diversified and parallel testing requirements, so that parallel operations can be performed for different types of testing requirements.

[0081] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor testing device, characterized in that: It includes a control module connected in sequence, a first data transmission module connected to the control module, and a plurality of test benches connected to the first data transmission module; The first data transmission module includes a wireless data transmission module, which is signal-connected to the test bench and is used to receive a control signal from the control module so that each test bench performs a number of identical or different first test tasks based on the control signal.

2. The semiconductor testing device according to claim 1, characterized in that: The test bench comprises a plurality of second data transmission modules connected to the first data transmission module, and any of the second data transmission modules is sequentially connected to a first data processing module and a first resource module; The second data transmission module includes a wireless data transmission module, which is signal-connected to the first data transmission module and is used to receive a control signal transmitted by the first data transmission module, so as to execute the first test task through each of the first data processing modules and each of the first resource modules based on the control signal.

3. The semiconductor testing device according to claim 2, characterized in that: The control module is connected to a plurality of first data transmission modules, and the number of the first data transmission modules connected to the control module is not greater than the number of second data transmission modules in the same test bench connected to the first data transmission modules.

4. The semiconductor testing device according to claim 1-3, characterized in that: The second data transmission modules in the same test bench can be connected to each other, the first data processing modules in the same test bench can be connected to each other, and the first resource modules in the same test bench can be connected to each other.

5. The semiconductor testing device according to claim 2 or 3, characterized in that: It also includes a third data transmission module and a second data processing module connected between the control module and the first data transmission module; The third data transmission module is connected to the control module and the second data processing module respectively, the second data processing module is connected to the first data transmission module, and the second data processing module is also connected to a second resource module. The third data transmission module is used to receive a control signal from the control module to execute a second test task through the second data processing module and the second resource module based on the control signal.

6. The semiconductor testing device according to claim 5, characterized in that The third data transmission module includes a wired data transmission module or a wireless data transmission module.

7. The semiconductor testing device according to claim 6, characterized in that: The wireless data transmission modules serving as the first data transmission module, the second data transmission module and the third data transmission module include wireless data transmission modules supporting WiFi5, WiFi6 and WiFi 7.

8. The semiconductor testing device according to claim 5, characterized in that The test level of the second test task is not lower than that of the first test task.

9. A testing method, characterized in that: The method is implemented by the semiconductor testing device according to any one of claims 1 to 8, comprising: In response to a first test task instruction, the control module transmits a control signal to a corresponding test bench through the first data transmission module; Enable each of the test benches that receives the control signal to perform a corresponding first test task; After the first test task is completed, the control module receives the returned test data and result information through the first data transmission module.

10. The testing method according to claim 9, characterized in that: The semiconductor testing device further includes a third data transmission module connected between the control module and the first data transmission module, and a second data processing module, the second data processing module is connected to the second data transmission module, and the second data processing module is further connected to a second resource module, and the method further includes: In response to the second test task instruction, the control module sends a corresponding control signal to the second data processing module through the third data transmission module; Processing the control instruction through the second data processing module to send the processed control signal to the second resource module, and / or sending the processed control signal to the corresponding test bench through the first data transmission module; Performing a corresponding second test task through the second resource module, and / or each of the test benches that receives the control instruction performs a corresponding first test task; After the first test task and / or the second test task is completed, the control module receives the returned test data and result information through the third data transmission module.

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