A crimped packaging power module short circuit failure acoustic emission monitoring system and method

Abstract

The present application belongs to the technical field of power semiconductor monitoring, and particularly relates to a crimping packaging power module short-circuit failure acoustic emission monitoring system and method. The monitoring system comprises an acoustic wave sensor array, a module characteristic parameter measurement unit, a multi-channel signal acquisition unit and an upper computer. The acoustic wave sensor array is used to measure the failure transient acoustic signal of the crimping packaging power module. The module characteristic parameter measurement unit is used to measure the failure characteristic parameters. The multi-channel signal acquisition unit is used to transmit all the received data to the upper computer. The upper computer identifies the acoustic signal acoustic print information to determine whether the crimping packaging power module has short-circuit failure. If the short-circuit failure occurs, the failure position is located based on the difference between the failure transient acoustic signal time received by each acoustic wave sensor and the failure characteristic parameter mutation time. The present application has the characteristics of wide application occasions, non-invasive installation and the like, and is helpful to the online monitoring of the crimping packaging power module short-circuit failure and the rapid positioning of the failure point.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of power semiconductor monitoring, and particularly relates to a compression packaging power module short-circuit failure acoustic emission monitoring system and method. BACKGROUND

[0002] The compression packaging power module realizes large current level through the parallel connection of sub-modules, has the advantages of double-sided heat dissipation, high power density, stable short-circuit state after failure, and the like, is a basic and core device of high-voltage and high-power power electronic equipment, and is widely used in high-voltage circuit breakers, flexible direct current converter valves and the like. Taking the high-voltage circuit breaker as an example, the compression packaging power module needs to bear the short-circuit current impact of several times the rated current under harsh working conditions, and under the long-term repeated impact, the sub-modules stressed in the power module are prone to short-circuit failure. Although the compression packaging power module has a stable short-circuit state after failure, and the equipment usually adopts a series redundant module design, after the failure of a power module, the remaining modules can still bear the current impact to ensure the normal operation of the equipment. However, once the number of failed modules exceeds the threshold, the remaining modules will bear an impact exceeding the design margin and will fail rapidly, thereby causing the equipment to fail. Therefore, it is very important to monitor the short-circuit failure of the compression packaging power module.

[0003] At present, in the monitoring of the short-circuit failure of the compression packaging power module, the method is mainly based on the electrical characteristic parameters of the equipment or the power module, which needs to add various invasive monitoring devices such as voltage probes and current sensors in the power electronic equipment, and the use cost is high. When the short-circuit failure is monitored based on the electrical characteristic parameters of the equipment, it is usually only possible to determine whether the short-circuit failure occurs in the equipment, but it is not possible to locate the power module in which the short-circuit failure occurs. When the short-circuit failure is monitored based on the electrical characteristic parameters of the power module, monitoring devices need to be added to each power module, which is more expensive, but it is not possible to further locate the sub-module in which the short-circuit failure occurs. Therefore, the existing methods generally have the problems of high use cost and difficulty in locating the failure point, thereby failing to effectively guide the operation and maintenance of the equipment, and the advantage of the stable short-circuit state of the compression packaging power module after failure cannot be fully utilized.

[0004] In summary, it is of great significance to accurately guide the operation and maintenance of the equipment and fully utilize the advantages of the compression packaging power module to invent a non-invasive and precise short-circuit failure monitoring system for the compression packaging power module. SUMMARY

[0005] Therefore, the application aims to provide a compression packaging power module short-circuit failure acoustic emission monitoring system and method for non-invasive monitoring of the short-circuit failure of the compression packaging power module and precise location of the failure point.

[0006] To achieve the above object, the present application provides the following technical solutions:

[0007] A compression packaging power module short-circuit failure acoustic emission monitoring system, comprising a compression packaging power module 7, further comprising an acoustic sensor array, a module characteristic parameter measurement unit 4, a multi-channel signal acquisition unit 5, and a host computer 6;

[0008] The acoustic sensor array is arranged around the compression packaging power module 7, and the acoustic sensor array is composed of at least three high-resolution acoustic sensors that are not on the same straight line, for measuring the failure transient acoustic signals of the compression packaging power module 7, and the signals measured by each high-resolution acoustic sensor are sent to the multi-channel signal acquisition unit 5;

[0009] The module characteristic parameter measurement unit 4 is used for measuring the short-circuit failure characteristic parameters of the compression packaging power module 7 and sending the measured failure characteristic parameters to the multi-channel signal acquisition unit 5;

[0010] The multi-channel signal acquisition unit 5 transmits all the received data to the host computer 6;

[0011] The host computer 6 is used for judging whether the compression packaging power module 7 appears short-circuit failure according to the received data, and if the short-circuit failure appears, positioning the failure position based on the difference between the time of receiving the failure transient acoustic signals by each high-resolution acoustic sensor and the time of failure characteristic parameter mutation.

[0012] Further, the specific method for judging whether the compression packaging power module 7 appears short-circuit failure is:

[0013] First, record the failure transient acoustic signals measured by the high-resolution acoustic sensors at the moment of short-circuit failure occurrence through short-circuit test, and then judge whether the acoustic signals measured by the high-resolution acoustic sensors in real time match the recorded failure transient acoustic signals in the short-circuit failure monitoring process, if match, it is determined that the compression packaging power module 7 appears short-circuit failure, otherwise, it does not appear short-circuit failure.

[0014] Further, the specific method for positioning the failure position is:

[0015] In the short-circuit test, record the moment t0 of short-circuit failure occurrence, and record the moment of arrival of the transient acoustic signals at each high-resolution acoustic sensor at the moment of short-circuit failure occurrence, which are defined as t1, t2…t n , respectively. Define the distance between the high-resolution acoustic sensor and the to-be-measured sub-module 8 as l1, l2…l n , respectively. Calculate the acoustic wave propagation speeds v1, v2…v n :

[0016]

[0017] And the average value of v1, v2...v n The average value of v1, v2...v

[0018]

[0019] In the short-circuit failure monitoring process, if it is determined that the crimped packaging power module 7 has a short-circuit failure, the failure characteristic parameter mutation time T0 is recorded, and the time when the failure instantaneous acoustic signal reaches the acoustic sensors 1, 2...n is recorded as T1, T2...T n Then, taking each sensor as the center and v(T n -T0) as the radius, a possible acoustic source position spherical surface is drawn, and the intersection points of each spherical surface are taken as the failure positions.

[0020] The application also provides a monitoring method for a crimped packaging power module short-circuit failure acoustic emission monitoring system, comprising the following steps:

[0021] S1: installing an acoustic sensor array around the crimped packaging power module 7, wherein the acoustic sensor array is composed of at least three high-resolution acoustic sensors that are not on the same straight line;

[0022] S2: installing the to-be-tested sub-module 8 in the crimped packaging power module 7, and making the to-be-tested sub-module 8 have different distances from each high-resolution acoustic sensor, and measuring the distances of the to-be-tested sub-module 8 from the n high-resolution acoustic sensors, which are defined as l1, l2...l n ;

[0023] S3: based on the application working condition, carrying out a short-circuit test on the to-be-tested sub-module 8, measuring the short-circuit failure characteristic parameters by using the module characteristic parameter measuring unit 4, continuously prolonging the conduction time in the test until the to-be-tested sub-module 8 has a destructive short-circuit failure, recording the time t0 when the short-circuit failure occurs, and acquiring the failure instantaneous acoustic signal through the acoustic sensor;

[0024] S4: analyzing the failure instantaneous acoustic signal acoustic print characteristics;

[0025] S5: acquiring the time when the failure instantaneous acoustic signal reaches the n high-resolution acoustic sensors, which are defined as t1, t2...t n , and calculating the acoustic wave propagation speeds v1, v2...v n based on the distances and the acoustic signal arrival time difference:

[0026]

[0027] And the average value of v1, v2...v n is taken as the acoustic wave propagation speed v:

[0028]

[0029] S6: record the failure transient acoustic signal acoustic fingerprint feature and the sound wave propagation speed v into the host computer 6;

[0030] S7: start short circuit failure monitoring, the host computer 6 records the failure characteristic parameter mutation time T0, records the failure transient acoustic signal to the sound wave sensor 1, 2…n time T1, T2…T n

[0031] S8: judge whether the acoustic fingerprint matches the recorded information, if matched, go to S9, if not matched, go to S7;

[0032] S9: draw the possible acoustic source position spherical surface with each sensor as the center and v(T n -T0) as the radius;

[0033] S10: take the intersection point of each spherical surface as the failure sub-module position.

[0034] The beneficial effects of the present application are:

[0035] 1) The acoustic emission monitoring system adopts a non-invasive design, only a few high-resolution sound wave sensors are needed to be installed in the equipment as monitoring equipment, which effectively improves the economy and convenience of the monitoring system.

[0036] 2) In the acoustic emission monitoring method, the signal time difference is used to locate the failure transient acoustic signal, which can accurately locate the specific failure sub-module, effectively improving the accuracy of failure point positioning. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 It is a crimping packaging power module short circuit failure acoustic emission monitoring system;

[0038] Figure 2 It is a crimping packaging power module short circuit failure acoustic emission monitoring method flow chart;

[0039] Figure 3 It is a failure sub-module positioning schematic diagram.

[0040] REFERENCE NUMERALS:

[0041] 1-high resolution sound wave sensor 1; 2-high resolution sound wave sensor 2; 3-high resolution sound wave sensor 3; 4-module characteristic parameter measurement unit; 5-multichannel signal acquisition unit; 6-host computer; 7-crimping packaging power module; 8-sub-module to be tested; 9-supporting rod; 10-collector water-cooled radiator; 11-emitter water-cooled radiator; 12-failure sub-module. DETAILED DESCRIPTION

[0042] The scheme of the present application will be further described below in combination with the drawings and examples. ​

[0043] Example

[0044] like Figure 1 As shown, taking 3300V / 600A press-fit package power module as the monitoring object, a press-fit package power module short-circuit failure acoustic emission monitoring system is established, including an acoustic wave sensor array, a module characteristic parameter measurement unit 4, a multi-channel signal acquisition unit 5, and a host computer 6.

[0045] The acoustic wave sensor array consists of three high-resolution acoustic wave sensors 1, 2, and 3 that are not in the same straight line and are installed on the fixture support rod 9;

[0046] The module characteristic parameter measurement unit 4 is used to collect the gate voltage of the press-fit package power module 7;

[0047] The multi-channel signal acquisition unit 5 is used to collect the instantaneous sound signal of failure and the gate voltage, and transmit them to the host computer 6;

[0048] The upper computer 6 is used to analyze the collected sound signal soundprint information, including characteristic information such as the sound signal amplitude and frequency, to determine whether the press-fit package power module 7 has a short circuit failure. If a short circuit failure occurs, the failure position is located based on the difference between the time when each acoustic wave sensor receives the instantaneous sound signal of the failure and the time when the failure characteristic parameter suddenly changes.

[0049] Install the submodule 8 to be tested at a certain position in the press-fit package power module 7. The distance between this position and the acoustic wave sensors 1, 2, and 3 should be different. Measure the distances l1, l2, and l3 between the submodule 8 to be tested and the acoustic wave sensors 1, 2, and 3 respectively.

[0050] Based on the application conditions, a short-circuit test is performed on the sub-module 8 to be tested. The gate voltage is measured using the module characteristic parameter measurement unit 4. During the test, the on-time is continuously extended until a destructive short-circuit failure occurs in the sub-module 8 to be tested. The time t0 at which the short-circuit failure occurs is recorded, and the instantaneous acoustic signal of the failure is obtained using an acoustic wave sensor.

[0051] Analyze the acoustic signal characteristics of the instantaneous failure, including amplitude, frequency and other characteristic information;

[0052] Obtain the times t1, t2, and t3 when the instantaneous acoustic signal of the failure arrives at acoustic wave sensors 1, 2, and 3, and calculate the acoustic wave propagation velocities v1, v2, and v3 based on the distance and the time difference between the arrival of the acoustic signal:

[0053]

[0054] The average value of v1, v2, and v3 is taken as the sound wave propagation speed v:

[0055]

[0056] The failure transient acoustic signal voiceprint feature and the sound wave propagation speed v are input into the host computer 6;

[0057] The short-circuit failure monitoring of the 3300V / 600A crimping packaging power module 7 is carried out, the host computer records the failure characteristic parameter mutation time T0, and records the time T1, T2, T3 when the failure transient acoustic signal reaches the sound wave sensors 1, 2, 3;

[0058] It is judged whether the sound wave voiceprint matches the information that has been input, and it is confirmed that the voiceprint matches the short-circuit failure transient acoustic signal;

[0059] As shown in Figure 3 With the sound wave sensors 1, 2, 3 as the center, v(T1-T0), v(T2-T0), v(T3-T0) as the radius, the possible sound source position sphere is drawn.

[0060] The intersection points of each sphere are analyzed, and the failure point is located as the sub-module 12.

[0061] Finally, it should be pointed out that the above examples are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the purpose and scope of the present application, and they should be covered in the scope of the claims of the present application.

Claims

1. A compression-packaged power module short-circuit failure acoustic emission monitoring system comprising a compression-packaged power module (7), characterized in that, It also includes an acoustic sensor array, a module characteristic parameter measurement unit (4), a multi-channel signal acquisition unit (5), and an upper computer (6). The acoustic sensor array is arranged around the crimped packaging power module (7) and is composed of at least three high-resolution acoustic sensors not on the same straight line, for measuring the failure transient acoustic signals of the crimped packaging power module (7), and the signals measured by each high-resolution acoustic sensor are sent to the multi-channel signal acquisition unit (5). The module characteristic parameter measurement unit (4) is used to measure the short-circuit failure characteristic parameters of the crimped packaging power module (7) and send the measured failure characteristic parameters to the multi-channel signal acquisition unit (5). The multi-channel signal acquisition unit (5) transmits all the received data to the upper computer (6). The upper computer (6) is used to determine whether the crimped packaging power module (7) has a short-circuit failure based on the received data, and if there is a short-circuit failure, the difference between the failure transient acoustic signal time and the failure characteristic parameter mutation time received by each high-resolution acoustic sensor is used to locate the failure position. The specific method for determining whether the crimped packaging power module (7) has a short-circuit failure is: First, record the failure transient acoustic signal measured by the high-resolution acoustic sensor at the moment of short-circuit failure through short-circuit testing, and then determine whether the real-time measured acoustic signal of the high-resolution acoustic sensor matches the recorded failure transient acoustic signal during short-circuit failure monitoring. If they match, it is determined that the crimped packaging power module (7) has a short-circuit failure, otherwise it does not have a short-circuit failure. The specific method for locating the failure position is: In the short-circuit test, the short-circuit failure occurrence time t0 is recorded, and the time when the instantaneous sound signal reaches each high-resolution sound wave sensor at the short-circuit failure occurrence time is recorded, which is defined as t1, t2…t n The distance between the high-resolution sound wave sensor and the sub-module (8) to be tested is defined as l1, l2…l n ; The sound wave propagation speeds v1, v2…v n : ， And the average value of v1, v2...v n is taken as the sound wave propagation speed v: ， In the short-circuit failure monitoring process, if it is determined that the crimped packaging power module (7) appears short-circuit failure, the failure characteristic parameter mutation moment T0 is recorded, and the failure instantaneous sound signal arrival time T1, T2…T of the sound wave sensor 1, 2…n is recorded. n Then, taking each sensor as the center, v(T n -T0) as the radius, draw the possible sound source position spherical surface, and take each spherical surface intersection point as the failure position.

2. A monitoring method for a crimped package power module short circuit failure acoustic emission monitoring system as claimed in claim 1, characterized in that, It includes the following steps: S1: Install an acoustic sensor array around the crimped packaging power module (7), and the acoustic sensor array is composed of at least three high-resolution acoustic sensors not on the same straight line; S2: install the to-be-tested sub-module (8) in the crimped packaging power module (7), and make the to-be-tested sub-module (8) be different distances from each high-resolution acoustic wave sensor, respectively measure the distances of the to-be-tested sub-module (8) from the n high-resolution acoustic wave sensors, and define as l1, l2…ln. n ; S3: Based on the application working condition, carry out short-circuit test on the to-be-tested sub-module (8), measure the short-circuit failure characteristic parameters using the module characteristic parameter measurement unit (4), and continuously extend the conduction time during the test until the to-be-tested sub-module (8) fails due to short-circuit failure. Record the moment t0 of short-circuit failure, and obtain the failure transient acoustic signal through the acoustic sensor; S4: Analyze the failure transient acoustic signal acoustic fingerprint characteristics; S5: Obtain the time of the failure transient acoustic signal to the n high-resolution acoustic wave sensors, respectively defined as t1, t2…t n , based on the distance, acoustic signal arrival time difference to calculate the acoustic wave propagation speed v1, v2…v n : ， And the average value of v1, v2...v n is taken as the sound wave propagation speed v: ， S6: Record the failure transient acoustic signal acoustic fingerprint characteristics and acoustic propagation speed v into the upper computer (6); S7: Start short-circuit failure monitoring, the upper computer (6) records the failure characteristic parameter mutation moment T0, records the failure instantaneous sound signal arrival time of the sound wave sensor 1, 2…n T1, T2…T n ; S8: Determine whether the acoustic fingerprint matches the recorded information, if it matches, go to S9, if it does not match, go to S7; S9: draw a sphere of possible sound source positions with each sensor as the center and v(T n -T0) as the radius; S10: Take each spherical intersection point as the failure sub-module position.

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