A chip packaging test device

Abstract

The present invention relates to the field of chip packaging technology, specifically to a chip packaging testing device, comprising a workbench, a clamping mechanism is installed at the upper end of the workbench, an L-shaped frame is fixedly connected to the upper end of the workbench near one side, and a cleaning mechanism is installed at the lower end of the workbench, the cleaning mechanism comprises an air inlet pipe, a collection box is fixedly connected to the outer side of the air inlet pipe, a baffle is fixedly connected to the upper end of the collection box, two groups of symmetrical card slots are opened on the inner wall of the collection box near the upper end, a motor is installed at the upper end of the L-shaped frame, a second electric telescopic rod is installed at the lower end of the L-shaped frame, the output shaft of the motor is fixedly connected to the shell of the second electric telescopic rod, the output shaft of the second electric telescopic rod is fixedly connected to an electric clamping block, and two groups of symmetrical grinding sheets are fixedly connected to the inner side of the electric clamping block, and the two groups of clamping plates clean the debris inside the collection box through the mutual cooperation of the two groups of L-shaped sweeping rods.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging, and in particular to a chip packaging testing device. Background Art

[0002] In order to avoid external scratches and damage to the chip, the chip needs to be protected, that is, the chip needs to be packaged. The chip packaging test is a function and performance test of the packaged chip. During the chip packaging test, after the wafer manufacturing is completed, the probe is brought into contact with the pads on the chip to test the chip's function.

[0003] When testing existing chips, the chips need to be clamped and fixed, and the quality of the chips needs to be tested while clamped. The burrs left over from chip production need to be cleaned. For this reason, we propose a chip packaging test device. Summary of the invention

[0004] In order to make up for the deficiencies of the prior art and solve at least one technical problem raised in the background technology, the present invention proposes a chip packaging testing device.

[0005] The technical solution adopted by the present invention to solve its technical problem is: a chip packaging testing device comprises a workbench, a clamping mechanism is installed at the upper end of the workbench, an L-shaped frame is fixedly connected to the upper end of the workbench near one side, a cleaning mechanism is installed at the lower end of the workbench, the cleaning mechanism comprises an air inlet pipe, a collection box is fixedly connected to the outer side of the air inlet pipe, a baffle is fixedly connected to the upper end of the collection box, two groups of symmetrical card slots are opened on the inner wall of the collection box near the upper end, a motor is installed at the upper end of the L-shaped frame, a second electric telescopic rod is installed at the lower end of the L-shaped frame, the output shaft of the motor is fixedly connected to the shell of the second electric telescopic rod, the output shaft of the second electric telescopic rod is fixedly connected to an electric clamping block, and two groups of symmetrical grinding sheets are fixedly connected to the inner side of the electric clamping block.

[0006] Preferably, the clamping mechanism includes a first fixed block fixedly connected to the workbench, a first electric telescopic rod is installed at the rear end of the first fixed block, an output shaft of the first electric telescopic rod is fixedly connected to a first slider, a lower end of the first slider is slidably connected to a second fixed block, a lower end of the second fixed block is fixedly connected to the workbench, an upper end of the first slider is fixedly connected to a first fixed plate, a front end of the first fixed plate is fixedly connected to a first fixed frame, and a front end of the first fixed frame is fixedly connected to a first clamping plate.

[0007] Preferably, the upper end of the first sliding block is fixedly connected to a first fixed shaft near the middle position, the outer side of the first fixed shaft is rotatably connected to a first fixed sleeve, the outer side of the first fixed sleeve is fixedly connected to a first moving rod, the other end of the first moving rod is fixedly connected to a second fixed sleeve, the inner side of the second fixed sleeve is rotatably connected to a second fixed shaft, the lower end of the second fixed shaft is fixedly connected to a moving plate, and the inner side of the moving plate is rotatably connected to an intake pipe.

[0008] Preferably, the upper end of the movable plate is fixedly connected to a position near one side, the outer side of the third fixed shaft is rotatably connected to the third fixed sleeve, the outer side of the third fixed sleeve is fixedly connected to the second moving rod, the other end of the second moving rod is fixedly connected to a fourth fixed sleeve, the inner side of the fourth fixed sleeve is rotatably connected to the fourth fixed shaft, the lower end of the fourth fixed shaft is fixedly connected to the second sliding block, the upper end of the second sliding block is fixedly connected to the second fixed plate, the rear end of the second fixed plate is fixedly connected to the second fixed bracket, the rear end of the second fixed bracket is fixedly connected to the second clamping plate, the lower end of the second sliding block is slidably connected to the third fixed block, and the lower end of the third fixed block is fixedly connected to the workbench.

[0009] Preferably, a first L-shaped sweeping rod is fixedly connected to the front end of the first fixing plate.

[0010] Preferably, a second L-shaped sweeping rod is fixedly connected to the rear end of the second fixing plate, and the first fixing plate and the second fixing plate are both slidably connected to the inner side of the collecting box.

[0011] Preferably, the cleaning mechanism includes an air pump installed at the lower end of the workbench, the output port of the air pump is fixedly connected to an exhaust pipe, the front end of the exhaust pipe is fixedly connected to the baffle, the input port of the air pump is fixedly connected to an air inlet pipe, the outer side of the air inlet pipe passes through a movable plate, the upper end of the air inlet pipe is fixedly connected to a funnel, and the outer side of the air inlet pipe is fixedly connected to a filter barrel.

[0012] Preferably, the upper end of the filter barrel is rotatably connected to a rotating shaft, the lower end of the rotating shaft is fixedly connected to blades, a spray head is installed on the inner side of the filter barrel, and a drain pipe is fixedly connected to the outer side of the filter barrel.

[0013] Preferably, a filter plate is fixedly connected to the inner side of the filter barrel near the lower end.

[0014] Compared with the prior art, the present invention provides a chip packaging testing device, which has the following beneficial effects: 1. Through the cooperation of the first slider and the second slider, the first clamping plate and the second clamping plate can move at the same time, and clamp the chip package while moving to avoid chip deviation. The first clamping plate and the second clamping plate apply a set pressure to clamp the chip, so as to check the quality of the chip. Through the cooperation of the motor and the electric telescopic rod, the electric clamping block can grind and remove burrs on the chip package through the grinding sheet while rotating, thereby further improving the quality of the package.

[0015] 2. Through the cooperation of the first L-shaped sweeping rod and the second L-shaped sweeping rod, the first clamping plate and the second clamping plate clean the debris inside the collection box, so that the debris can be cleaned and recycled in a centralized manner to avoid the residual impurities affecting the subsequent test results.

[0016] 3. Through the cooperation of the air pump and the air inlet pipe, the debris inside the collection box enters the filter barrel for centralized collection and treatment. Through the cooperation of the blades and the spray head, small particles of debris and dust are filtered, and the clean gas is discharged to the inside of the baffle through the exhaust pipe, which cleans the inside of the collection box more comprehensively and removes the fine particles remaining on the outside of the chip to improve the quality of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of a chip packaging testing device proposed by the present invention; Figure 2 A schematic cross-sectional view of the overall structure of a chip packaging test device proposed by the present invention; Figure 3 This is a schematic diagram of the overall structure of a clamping mechanism of a chip packaging test device proposed by the present invention; Figure 4 This is an enlarged schematic diagram of a partial structure of a clamping mechanism of a chip packaging test device proposed by the present invention; Figure 5 A schematic cross-sectional view of the overall structure of a cleaning mechanism of a chip packaging test device proposed by the present invention; Figure 6 The present invention is a schematic cross-sectional view of a part of the structure of a chip packaging testing device.

[0018] In the figure: 1, workbench; 2, clamping mechanism; 21, first fixed block; 22, first electric telescopic rod; 23, first slider; 24, second fixed block; 25, first fixed plate; 26, first fixed frame; 27, first clamping plate; 28, first fixed shaft; 29, first fixed sleeve; 210, first moving rod; 211, second fixed shaft; 212, second fixed sleeve; 213, moving plate; 214, third fixed sleeve; 215, third fixed shaft; 216, second moving rod; 217, fourth fixed shaft; 218, fourth fixed sleeve; 21 9. Second slider; 220. Second fixed plate; 221. Second fixed frame; 222. Second clamping plate; 223. Third fixed block; 224. First L-shaped sweeping rod; 225. Second L-shaped sweeping rod; 3. Collecting box; 4. Baffle; 5. L-shaped frame; 6. Cleaning mechanism; 61. Air pump; 62. Exhaust pipe; 63. Inlet pipe; 64. Filter barrel; 65. Rotating shaft; 66. Blade; 67. Sprinkler head; 68. Filter plate; 69. Drain pipe; 610. Funnel; 7. Motor; 8. Second electric telescopic rod; 9. Electric clamping block; 10. Grinding disc. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0020] See also Figure 1 - Figure 6 A chip packaging testing device comprises a workbench 1, a clamping mechanism 2 is installed on the upper end of the workbench 1, an L-shaped frame 5 is fixedly connected to the upper end of the workbench 1 near one side, a cleaning mechanism 6 is installed at the lower end of the workbench 1, the cleaning mechanism 6 comprises an air inlet pipe 63, a collecting box 3 is fixedly connected to the outer side of the air inlet pipe 63, a baffle 4 is fixedly connected to the upper end of the collecting box 3, two groups of symmetrical card grooves are opened on the inner wall of the collecting box 3 near the upper end, a motor 7 is installed on the upper end of the L-shaped frame 5, a second electric telescopic rod 8 is installed on the lower end of the L-shaped frame 5, the output shaft of the motor 7 is fixedly connected to the shell of the second electric telescopic rod 8, the output shaft of the second electric telescopic rod 8 is fixedly connected to an electric clamp 9, and two groups of symmetrical grinding sheets 10 are fixedly connected to the inner side of the electric clamp 9.

[0021] In this embodiment, the clamping mechanism 2 includes a first fixed block 21 fixedly connected to the workbench 1, a first electric telescopic rod 22 is installed at the rear end of the first fixed block 21, an output shaft of the first electric telescopic rod 22 is fixedly connected to a first slider 23, a lower end of the first slider 23 is slidably connected to a second fixed block 24, a lower end of the second fixed block 24 is fixedly connected to the workbench 1, an upper end of the first slider 23 is fixedly connected to a first fixed plate 25, a front end of the first fixed plate 25 is fixedly connected to a first fixed frame 26, and a front end of the first fixed frame 26 is fixedly connected to a first clamping plate 27.

[0022] Specifically, the first electric telescopic rod 22 installed at the rear end of the first fixed block 21 is started, and the output shaft of the first electric telescopic rod 22 drives the first slider 23 to slide above the second fixed block 24. When the first slider 23 slides, it drives the first fixed plate 25 to move, and the first fixed plate 25 drives the first fixed frame 26 to move forward, and the first fixed frame 26 drives the first clamping plate 27 to move.

[0023] In this embodiment, the upper end of the first slider 23 is fixedly connected to the first fixed shaft 28 near the middle position, the outer side of the first fixed shaft 28 is rotatably connected to the first fixed sleeve 29, the outer side of the first fixed sleeve 29 is fixedly connected to the first moving rod 210, the other end of the first moving rod 210 is fixedly connected to the second fixed sleeve 212, the inner side of the second fixed sleeve 212 is rotatably connected to the second fixed shaft 211, the lower end of the second fixed shaft 211 is fixedly connected to a moving plate 213, and the inner side of the moving plate 213 is rotatably connected to the intake pipe 63.

[0024] Specifically, the first slider 23 drives the first fixed sleeve 29 to move through the first fixed shaft 28 , the first fixed sleeve 29 drives the second fixed sleeve 212 to move through the first moving rod 210 , and the second fixed sleeve 212 drives the moving plate 213 to rotate through the second fixed shaft 211 .

[0025] In this embodiment, a third fixed shaft 215 is fixedly connected to a position near one side of the upper end of the movable plate 213, a third fixed sleeve 214 is rotatably connected to the outer side of the third fixed shaft 215, a second movable rod 216 is fixedly connected to the outer side of the third fixed sleeve 214, the other end of the second movable rod 216 is fixedly connected to a fourth fixed sleeve 218, an inner side of the fourth fixed sleeve 218 is rotatably connected to a fourth fixed shaft 217, a second fixed shaft 219 is fixedly connected to the lower end of the fourth fixed shaft 217, a second fixed plate 220 is fixedly connected to the upper end of the second slider 219, a second fixed frame 221 is fixedly connected to the rear end of the second fixed plate 220, a second clamping plate 222 is fixedly connected to the rear end of the second fixed frame 221, a third fixed block 223 is slidably connected to the lower end of the second slider 219, and a lower end of the third fixed block 223 is fixedly connected to the workbench 1.

[0026] Specifically, when the movable plate 213 rotates, the third fixed sleeve 214 is driven to move through the third fixed shaft 215, and the third fixed sleeve 214 pulls the fourth fixed shaft 217 through the second movable rod 216. The fourth fixed shaft 217 drives the second slider 219 to move backward at the upper end of the third fixed block 223, so that the second slider 219 drives the second fixed plate 220 to move, and the second fixed plate 220 drives the second fixed frame 221 to move.

[0027] In this embodiment, a first L-shaped sweeping rod 224 is fixedly connected to the front end of the first fixing plate 25 .

[0028] Specifically, the first fixing plate 25 drives the first L-shaped sweeping rod 224 to move forward.

[0029] In this embodiment, a second L-shaped sweeping rod 225 is fixedly connected to the rear end of the second fixing plate 220 , and both the first fixing plate 25 and the second fixing plate 220 are slidably connected to the inner side of the collecting box 3 .

[0030] Specifically, the second fixed plate 220 drives the second L-shaped sweeping rod 225 to move backward, pushing the debris at the bottom of the collection box 3 into the funnel 610, starting the air pump 61, and the air pump 61 sucks the debris inside the collection box 3 into the filter barrel 64 through the air inlet pipe 63.

[0031] In this embodiment, the cleaning mechanism 6 includes an air pump 61 installed at the lower end of the workbench 1, the output port of the air pump 61 is fixedly connected to the exhaust pipe 62, the front end of the exhaust pipe 62 is fixedly connected to the baffle 4, the input port of the air pump 61 is fixedly connected to the air inlet pipe 63, the outer side of the air inlet pipe 63 passes through the movable plate 213, the upper end of the air inlet pipe 63 is fixedly connected to the funnel 610, and the outer side of the air inlet pipe 63 is fixedly connected to the filter barrel 64.

[0032] Specifically, the filtered gas is discharged to the inside of the baffle 4 through the exhaust pipe 62, and the fine particles remaining on the outside of the chip are completely removed, thereby improving the quality of the chip.

[0033] In this embodiment, the upper end of the filter barrel 64 is rotatably connected to a rotating shaft 65, the lower end of the rotating shaft 65 is fixedly connected to a blade 66, a spray head 67 is installed on the inner side of the filter barrel 64, and a drain pipe 69 is fixedly connected to the outer side of the filter barrel 64.

[0034] Specifically, large pieces of debris fall directly onto the filter sheet 68 , and the airflow drives the blades 66 to rotate to disperse the water sprayed from the sprinkler head 67 , and the filtered water is discharged from the drain pipe 69 .

[0035] In this embodiment, a filter sheet 68 is fixedly connected to the inner side of the filter barrel 64 near the lower end.

[0036] Specifically, small debris and dust particles increase in weight when in contact with water and fall onto the filter sheet 68 for centralized collection and processing.

[0037] Working principle: when in use, place the chip on the inner side of the electric clamp 9, start the second electric telescopic rod 8, the output shaft of the second electric telescopic rod 8 drives the electric clamp 9 to move downward, place the chip in the card slot at the upper end of the collection box 3, start the first electric telescopic rod 22 installed at the rear end of the first fixed block 21, the output shaft of the first electric telescopic rod 22 drives the first slider 23 to slide above the second fixed block 24, when the first slider 23 slides, it drives the first fixed plate 25 to move, the first fixed plate 25 drives the first fixed frame 26 to move forward, the first fixed frame 26 drives the first clamping plate 27 to move, the first slider 23 drives the first fixed sleeve 29 to move through the first fixed shaft 28, the first fixed sleeve 29 drives the second The fixing sleeve 212 moves, and the second fixing sleeve 212 drives the moving plate 213 to rotate through the second fixing shaft 211. When the moving plate 213 rotates, the third fixing sleeve 214 is driven to move through the third fixing shaft 215. The third fixing sleeve 214 pulls the fourth fixing shaft 217 through the second moving rod 216. The fourth fixing shaft 217 drives the second slider 219 to move backward at the upper end of the third fixing block 223, so that the second slider 219 drives the second fixing plate 220 to move, the second fixing plate 220 drives the second fixing frame 221 to move, and the second fixing frame 221 drives the second clamping plate 222 to move, so that the first clamping plate 27 and the second clamping plate 222 clamp the chip. When clamping, the chip is quality tested by the set force. If the chip In the case of oxidation scratches on the package, the pressure applied by the first clamping plate 27 and the second clamping plate 222 will squeeze and rupture the chip package. If the quality is qualified, the chip package will be intact. The qualified chip package is clamped by the first clamping plate 27 and the second clamping plate 222, and the output shaft of the second electric telescopic rod 8 drives the electric clamping block 9 to continue to clamp the chip. The motor 7 is started, and the output shaft of the motor 7 drives the second electric telescopic rod 8 to rotate, and the second electric telescopic rod 8 drives the electric clamping block 9 to rotate. The electric clamping block 9 grinds and removes the burrs on the outer side of the chip through the grinding sheet 10. After grinding, the generated debris and the unqualified and squeezed and broken chip package fragments are concentrated in the inside of the collection box 3, and the first electric telescopic rod 22 is started again to make the first fixed The plate 25 and the second fixed plate 220 respectively drive the first L-shaped sweeping rod 224 and the second L-shaped sweeping rod 225 to move in opposite directions, pushing the debris at the bottom of the collection box 3 into the funnel 610, and starting the air pump 61. The air pump 61 sucks the debris inside the collection box 3 into the inside of the filter barrel 64 through the air inlet pipe 63, and the large pieces of debris fall directly on the filter plate 68. The airflow drives the blades 66 to rotate to break up the water sprayed by the sprinkler head 67. The small debris and dust particles increase in weight when they meet water and fall onto the filter plate 68 for centralized collection and treatment. The filtered water is discharged from the drain pipe 69, and the filtered gas is discharged to the inside of the baffle 4 through the exhaust pipe 62, and the fine particles remaining on the outside of the chip are completely removed to improve the quality of the chip.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip packaging testing device, comprising a workbench (1), characterized in that: A clamping mechanism (2) is installed at the upper end of the workbench (1); an L-shaped frame (5) is fixedly connected to the upper end of the workbench (1) near one side; a cleaning mechanism (6) is installed at the lower end of the workbench (1); the cleaning mechanism (6) comprises an air inlet pipe (63); a collection box (3) is fixedly connected to the outer side of the air inlet pipe (63); a baffle (4) is fixedly connected to the upper end of the collection box (3); two groups of symmetrical slots are provided on the inner wall of the collection box (3) near the upper end; a motor (7) is installed at the upper end of the L-shaped frame (5); a second electric telescopic rod (8) is installed at the lower end of the L-shaped frame (5); an output shaft of the motor (7) is fixedly connected to the outer shell of the second electric telescopic rod (8); an electric clamp (9) is fixedly connected to the output shaft of the second electric telescopic rod (8); and two groups of symmetrical grinding sheets (10) are fixedly connected to the inner side of the electric clamp (9).

2. A chip package testing device according to claim 1, characterized in that: The clamping mechanism (2) comprises a first fixed block (21) fixedly connected to the workbench (1); a first electric telescopic rod (22) is mounted at the rear end of the first fixed block (21); an output shaft of the first electric telescopic rod (22) is fixedly connected to a first slider (23); a lower end of the first slider (23) is slidably connected to a second fixed block (24); a lower end of the second fixed block (24) is fixedly connected to the workbench (1); an upper end of the first slider (23) is fixedly connected to a first fixed plate (25); a front end of the first fixed plate (25) is fixedly connected to a first fixed frame (26); and a front end of the first fixed frame (26) is fixedly connected to a first clamping plate (27).

3. A chip package testing device according to claim 2, characterized in that: A first fixed shaft (28) is fixedly connected to the upper end of the first sliding block (23) near the middle, a first fixed sleeve (29) is rotatably connected to the outer side of the first fixed shaft (28), a first moving rod (210) is fixedly connected to the outer side of the first fixed sleeve (29), the other end of the first moving rod (210) is fixedly connected to a second fixed sleeve (212), the inner side of the second fixed sleeve (212) is rotatably connected to a second fixed shaft (211), the lower end of the second fixed shaft (211) is fixedly connected to a moving plate (213), and the inner side of the moving plate (213) is rotatably connected to an intake pipe (63).

4. The chip package testing device according to claim 3, characterized in that: A third fixed shaft (215) is fixedly connected to a position near one side of the upper end of the movable plate (213); a third fixed sleeve (214) is rotatably connected to the outer side of the third fixed shaft (215); a second movable rod (216) is fixedly connected to the outer side of the third fixed sleeve (214); a fourth fixed sleeve (218) is fixedly connected to the other end of the second movable rod (216); a fourth fixed shaft (217) is rotatably connected to the inner side of the fourth fixed sleeve (218); a second slider (219) is fixedly connected to the lower end of the fourth fixed shaft (217); a second fixed plate (220) is fixedly connected to the upper end of the second slider (219); a second fixed frame (221) is fixedly connected to the rear end of the second fixed plate (220); a second clamping plate (222) is fixedly connected to the rear end of the second fixed frame (221); a third fixed block (223) is slidably connected to the lower end of the second slider (219); and the lower end of the third fixed block (223) is fixedly connected to the workbench (1).

5. The chip package testing device according to claim 2, characterized in that: A first L-shaped sweeping rod (224) is fixedly connected to the front end of the first fixing plate (25).

6. The chip package testing device according to claim 4, characterized in that: A second L-shaped sweeping rod (225) is fixedly connected to the rear end of the second fixing plate (220), and the first fixing plate (25) and the second fixing plate (220) are both slidably connected to the inner side of the collection box (3).

7. The chip package testing device according to claim 1, characterized in that: The cleaning mechanism (6) comprises an air pump (61) mounted at the lower end of the workbench (1); the output port of the air pump (61) is fixedly connected to an exhaust pipe (62); the front end of the exhaust pipe (62) is fixedly connected to the baffle (4); the input port of the air pump (61) is fixedly connected to an air inlet pipe (63); the outer side of the air inlet pipe (63) passes through the movable plate (213); the upper end of the air inlet pipe (63) is fixedly connected to a funnel (610); and the outer side of the air inlet pipe (63) is fixedly connected to a filter barrel (64).

8. The chip package testing device according to claim 7, characterized in that: The upper end of the filter barrel (64) is rotatably connected to a rotating shaft (65), the lower end of the rotating shaft (65) is fixedly connected to a blade (66), a spray head (67) is installed on the inner side of the filter barrel (64), and a drainage pipe (69) is fixedly connected to the outer side of the filter barrel (64).

9. The chip package testing device according to claim 8, characterized in that: A filter sheet (68) is fixedly connected to the inner side of the filter barrel (64) near the lower end.

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