Electronic paper module display device and production method

Abstract

The invention discloses an electronic paper module display device and method. The electronic paper module display device comprises a TFT layer, an electronic paper module and a waterproof protective film layer, the electronic paper module and the TFT layer are electrically communicated with an internal circuit through elargol; the waterproof protection film layer covers the surface of the electronic paper, the edge of the TFT and the IC through spraying or film coating, and the waterproof effect of the PS film is achieved. Comprising the following steps: A10, dispensing silver colloid on circuit connection points on a TFT layer; a20, the electronic paper is attached to the TFT layer; step A30, defoaming is carried out; and step A40, spraying or coating a waterproof material. According to the method, related materials of the process can be reduced, the process flow is saved, the process time is shortened, the production efficiency is greatly improved, and the more efficient production requirement of the electronic paper display module can be met.

Description

Technical Field

[0001] The present application belongs to the field of display device manufacturing, and specifically relates to an electronic paper module display device and a production method. Background Art

[0002] "Electronic paper module", also known as electronic ink screen, has excellent characteristics such as ultra-low power consumption, continuous display without power consumption, eye protection, etc., and has the same display effect and visual experience as paper. Multiple mixed electronic particles are placed in the same ink capsule, and under the action of electric current, multiple ink capsules are arranged and combined to form "electronic ink". Under the influence of positive and negative charges, these tiny ink capsules operate like liquids to form various characters and patterns. The core features are low power consumption and visual health. It can be said to be a new type of "small and beautiful" display technology.

[0003] In the field of electronic paper modules, a variety of special bonding processes are required during the manufacturing process of electronic paper modules, and the technical difficulty is also very high.

[0004] The water content of the electronic ink film (FPL), the core material of the electronic paper module line, needs to be kept stable. Changes in the water content will directly affect the display effect of the electronic paper module. Therefore, during the production process of the electronic paper module, a material is needed to seal the electronic ink film to prevent water vapor from entering or escaping from the electronic ink microcapsules.

[0005] At present, in the manufacturing process of electronic paper module display module, epoxy resin type heat curing glue, referred to as EC glue (Edge Coating), is used. EC glue is coated on the four sides of the PS film of FPL to prevent water vapor from penetrating into FPL from all sides. In the existing technology, silver glue and EC waterproof glue are currently single-component epoxy systems, which need to be heated to 80℃ / 1 hour to solidify. Silicone glue will not solidify until it is placed in the air for 20 minutes. Because the current process has a baking time in the middle, it greatly reduces the efficiency of the production line operation, and also causes pauses in the middle of the production line operation, which is not smooth.

[0006] In order to improve production efficiency, the applicant proposed a method that does not use PS film material in the patent application number "2024112533458" and the patent application name "Electronic paper display module and production method", which also achieves the purpose of reducing FPL water loss, while reducing process time, greatly improving operating efficiency, and meeting the needs of more efficient display module production.

[0007] Nano waterproof technology: In recent years, scientists have discovered and studied the phenomenon of achieving waterproof function by forming super hydrophobic and dense layer surfaces in nature, the most typical example being the surface of various plant leaves represented by lotus leaves. Nano waterproof technology uses this principle to spray or coat waterproof materials on the surface of materials to form hydrophobic and dense layers to achieve waterproof effects.

[0008] Electronic nano waterproof coating is to form a highly adherent film on the surface of components such as PCB circuit boards to prevent water vapor, salt spray, acid and alkali corrosion, so as to protect the circuit board. Nano waterproof coating is a colorless, transparent, non-toxic, harmless, non-flammable liquid product that is moisture-proof, anti-humidity and anti-corrosion. The protective film formed by using nano waterproof coating is also called nano moisture-proof protective film. It is widely used in various electronic related components, such as: electronic digital products, smart home electronic products, smart wearable electronic equipment PCBA boards, precision motors, bearings, precision instruments, etc.

[0009] 1. The nano waterproof coating enables it to have a good bonding ability with various substrate PCB circuit boards, and complies with EU testing standards and chemical safety inspection standards.

[0010] 2. A nano-scale coating with an ultra-high hydrophobic layer and a dense layer is formed on the surface of the PCB circuit board, with a thickness of 0.1-3μm, so that it forms a lotus leaf effect, preventing the components on the PCB circuit board of electronic products from being affected by water and moisture and being corroded by acids, alkalis and salts, thereby extending the service life of electronic products.

[0011] 3. Through the construction method of spraying or coating, the nano liquid is evenly covered to each tiny gap of the electronic components to achieve relatively complete coverage and wrapping, thereby achieving a waterproof effect.

[0012] 4. It is quite different from the commonly used three-proof paint. In comparison, the three-proof paint is less likely to dissipate heat from PCB and components, has poor conductivity, and is relatively thick. The nano waterproof coating is invisible to the naked eye and is called a raincoat with mesh. It has good heat dissipation performance and the necessary conductivity is not affected. Most of the three-proof paints require that some related connectors must be processed when applying, otherwise it is likely to affect the normal operation of the connector after coating.

[0013] Whether to use nano waterproof coating in the production process of electronic paper module display module, how to change the structure of the original electronic paper module, and what process to use to implement the nano waterproof coating are technical problems to be solved by this application.

[0014] Glossary:

[0015] EPD is the abbreviation of "electronic paper display" in English, and its Chinese meaning is electronic paper module mother chip display. The electronic paper module mother chip in this application means the electronic paper module mother chip display.

[0016] TFT is the abbreviation of "Thin Film Transistor" in English, which means thin film field effect transistor in Chinese. Each pixel on the TFT display is driven by the thin film transistor integrated behind it.

[0017] PET is the abbreviation of "Polyethylene terephthalate" in English, which means polyester resin film layer in Chinese.

[0018] IC is the abbreviation of “Integrated Circuit” in English, which means chip in Chinese.

[0019] FPC is the abbreviation of "Flexible Printed Circuit" in English, which means flexible circuit board in Chinese.

[0020] PS is the abbreviation of "Polystyrene" in English, which means polystyrene film in Chinese.

[0021] FPL is the abbreviation of "Front Plane Lamination" in English, which means front plane laminated display module in Chinese.

[0022] ITO is the abbreviation of "Indium Tin Oxide" in English, and its Chinese meaning is indium tin oxide. In this application, the electronic paper module ITO refers to the conductive film layer material of the transparent conductive film shielding glass mainly being ITO (indium tin oxide semiconductor) film. Summary of the invention

[0023] The technical problem to be solved by the present invention is to avoid the problem in the prior art that different positions use curing glues with different process flows, which leads to the inability to share the process execution time of each link and causes low production efficiency of the display device. A glue that can use the same curing method at multiple positions is proposed, which can reduce the process time, greatly improve the operating efficiency, and meet the needs of more efficient display module production.

[0024] The technical solution of the present application to solve the above technical problems is an electronic paper display module, including: a TFT layer, electronic paper, and a waterproof protective film layer; the electronic paper module and the TFT layer are electrically connected to the internal circuit through silver glue; the waterproof protective film layer covers the surface and periphery of the electronic paper module by spraying or plating.

[0025] The electronic paper module includes: an FPL component.

[0026] The above-mentioned FPL component includes an OCA layer A, a PET layer, an ITO layer, an E-Ink layer, and an OCA layer B which are arranged in sequence; the waterproof protective film layer covers the OCA layer A or covers the PET after removing the OCA; and the OCA layer B is attached to the TFT layer.

[0027] The silver glue hole passes through the OCA layer B and the E-Ink layer to communicate with the ITO layer; the silver glue hole is used to inject silver glue.

[0028] The electronic paper module display device also includes a driver chip IC and a flexible circuit board FPC connector, the driver chip IC is bound to the TFT layer; the driver chip IC is protected by a waterproof protective film layer; the FPC connector is used to connect an external circuit, and the FPC connector is bound to the TFT layer.

[0029] The technical solution of the present application to solve the above technical problems can also be a method for producing an electronic paper module display module, including step A10: adding silver glue to the circuit connection points on the TFT layer; step A20: bonding the electronic paper module to the TFT layer; step A30: spraying waterproof material.

[0030] Step A20 includes step A21: IC binding; step A22 "FPC binding"

[0031] Step A30: defoaming.

[0032] In step A40, the spray-coated or film-coated waterproof material is a nano waterproof material, and the waterproof material is a transparent material.

[0033] The above-mentioned electronic paper module display module production method includes any one or more of the following features: Feature TA10: In step A30, the above-mentioned spraying process includes: any one of air spraying, electrostatic spraying, electrophoretic spraying, and coating processes, and coating includes any one of electroplating and electroplating; Feature TA20: In step A40, the spraying or coating can omit the PS film to reduce the product thickness; Feature TA30: In step A40, the spraying or coating waterproof material can omit the IC and TFT terminal area silicone to save materials and reduce the work flow; TA04: In step T40, the material is a nano waterproof material, and the curing method of the material includes any one of UV curing molding, room temperature curing molding, and heating curing molding.

[0034] One of the beneficial effects of the technical solution in the present application is that the electronic paper module is electrically connected to the TFT layer through silver glue, and the waterproof protective film layer covers the surface and periphery of the electronic paper module by spraying or plating, and the electronic paper module is sealed and fixed on the TFT layer, which can achieve complete sealing of the electronic paper module and ensure the display effect of the electronic paper module display module.

[0035] One of the beneficial effects of the technical solution in the present application is that the electronic paper module is electrically connected to the TFT layer through silver glue, and the waterproof protective film layer covers the surface and periphery of the electronic paper module by spraying or coating. There is no need to use two separate glues on the surface and periphery of the module, which saves the types of process materials and simplifies the difficulty of material management; and the waterproof material is sprayed or coated, which is more efficient and improves production efficiency.

[0036] One of the beneficial effects of the technical solution in the present application is that the FPL components are assembled as a whole, which is more efficient.

[0037] One of the beneficial effects of the technical solution in the present application is that the PS membrane material can be omitted by spraying or coating the waterproof material, thereby reducing the product thickness and material cost.

[0038] One of the beneficial effects of the technical solution in the present application is that the driver chip IC is bound to the above-mentioned TFT layer; the driver chip IC is protected by a waterproof protective film layer; all three locations are covered with a waterproof protective film layer by spraying or coating, which can further improve efficiency, enhance the sharing of process materials, and save process time.

[0039] One of the beneficial effects of the technical solution in the present application is that a process that requires multiple materials and multiple processes in the prior art can be completed by a single spraying or coating, thereby saving process materials and process time.

[0040] One of the beneficial effects of the technical solution in the present application is that spraying or coating the waterproof protective film layer on the IC can effectively reduce the product thickness and reduce the product material cost.

[0041] One of the beneficial effects of the technical solution in the present application is that the spray-coated waterproof material is a nano waterproof material, and the above-mentioned waterproof material is a transparent material, which ensures that the electronic paper module displays normally.

[0042] One of the beneficial effects of the technical solution in the present application is that the above-mentioned spraying process includes: any one of air spraying, electrostatic spraying, electrophoretic spraying, coating, and electroplating processes; a variety of spraying methods are applicable, which enhances the adaptability of the process and reduces costs.

[0043] One of the beneficial effects of the technical solution in the present application is that the above-mentioned spray-coated or coated waterproof material can achieve both waterproofness and a certain hardness, and has the effect of PS.

[0044] One of the beneficial effects of the technical solution in the present application is that the curing method of the above-mentioned spray or coating waterproof material includes and not only includes: UV curing molding, room temperature curing molding, heating curing molding, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 is a cross-sectional schematic diagram of an electronic paper module display device;

[0046] Figure 2 is a schematic cross-sectional view of the FPL assembly;

[0047] Figure 3 is a cross-sectional schematic diagram of an electronic paper module display device;

[0048] Figure 4 It is a schematic diagram of a production method of an electronic paper module display device;

[0049] Figure 5 It is a schematic diagram of the production steps of an electronic paper module display device;

[0050] Figure 6 It is a schematic diagram of the production steps of an electronic paper module display device;

[0051] Figure 7 It is a schematic diagram of the production steps of an electronic paper module display device;

[0052] Figure 8 It is a schematic diagram of the production steps of an electronic paper module display device;

[0053] Fig. 9 It is a schematic diagram of the production steps of an electronic paper module display device;

[0054] Fig.10 It is a cross-sectional schematic diagram of an electronic paper module display device in the prior art. DETAILED DESCRIPTION

[0055] The embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0056] It should be noted that the following is a description of the preferred embodiments of the present application, which does not constitute any limitation to the present application. The description of the preferred embodiments of the present application is only an explanation of the general principles of the present application. The embodiments described in this application are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0057] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", and technical features numbered with Arabic numerals 1, 2, 3, etc., and numbers such as "A" and "B", are only used for descriptive purposes and are only for the convenience of explanation, and do not represent a sequential relationship in time or space; they cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and numbered with Arabic numerals 1, 2, 3, etc. may explicitly or implicitly include one or more of the features. In the description of the present application, “several” means two or more than two, unless otherwise clearly and specifically defined.

[0058] like Figure 1 to Figure 2 ,as well as Fig.10 An embodiment of an electronic paper display device includes: a TFT layer, an electronic paper module, and a waterproof protective film layer; the electronic paper module and the TFT layer are electrically connected to the internal circuit through silver glue; the waterproof protective film layer covers the surface and periphery of the electronic paper module by spraying or coating.

[0059] In some embodiments, the electronic paper module includes: a waterproof coating, i.e., a waterproof protective film layer, a TFT layer, a TFT glass substrate, an IC layer, and an FPC layer. The TFT glass substrate is used to carry the TFT layer components; the IC layer is used to set the driver chip IC; and the FPC layer is used to set the flexible circuit board.

[0060] like Figure 1 to Figure 2 In an embodiment of an electronic paper display device, the electronic paper module includes: an FPL component. The FPL component includes an OCA layer A, a PET layer, an ITO layer, an E-Ink layer, and an OCA layer B arranged in sequence; the waterproof protective film layer is attached to the OCA layer A; and the OCA layer B is attached to the TFT layer.

[0061] like Figure 1 to Figure 2 In an embodiment of an electronic paper display device, the silver glue hole passes through the OCA layer B and the E-Ink layer and is connected to the ITO layer; the silver glue hole is used to inject silver glue.

[0062] like Figures 1 to 3In one embodiment of an electronic paper display device, a driver chip IC and a flexible circuit board FPC connector are further included, wherein the driver chip IC is bound to the above-mentioned TFT layer; the driver chip IC is protected by a waterproof protective film layer; the FPC connector is used to connect an external circuit, and the FPC connector is bound to the above-mentioned TFT layer. Driver chip IC and flexible circuit board FPC connector, the driver chip IC is bound to the above-mentioned TFT layer; the driver chip IC is protected by a waterproof protective film layer; the FPC connector is used to connect an external circuit, and the FPC connector is bound to the above-mentioned TFT layer. The IC binding process refers to a process of connecting and fixing a chip (Integrated Circuit, IC) to a circuit board. The IC binding process can ensure the stable connection of the chip on the circuit board for normal operation.

[0063] like Figure 3 The waterproof protective film layer spraying or coating on the IC can completely replace the PS film, ensuring that the electronic paper module and IC are sealed intact and enhancing the reliability of the process.

[0064] like Figure 4 An embodiment of a method for producing an electronic paper module display module includes: step A10: applying silver glue on the circuit connection points on the TFT layer; step A20: laminating the electronic paper module to the TFT layer; step A30: defoaming; step A40: spraying waterproof material.

[0065] like Figures 5 to 8 , an embodiment of an electronic paper module display module production method includes, as Figure 5 Step A10: Apply silver glue to the circuit connection points on the TFT layer; Figure 6 Step A20: Laminating the electronic paper module to the TFT layer; Figure 7 Step A20 includes step A21: binding IC; step A22: binding FPC; Figure 8 Step A40: spray waterproof material.

[0066] like Fig. 9 In an embodiment of a method for producing an electronic paper module display module, the method includes: in step A30, the spray-coated waterproof material is a nano waterproof material, and the waterproof material is a transparent material.

[0067] In some embodiments of the electronic paper module display module production method, in step A40, the above-mentioned spraying or coating process includes: air spraying, i.e. spray gun plus compressed air, electrostatic spraying, electrophoretic spraying, coating process. Coating includes any one of electroplating and sputtering.

[0068] In some embodiments of the electronic paper module display module production method, in step A30, the spray waterproof material is sprayed in a negative pressure space.

[0069] In some embodiments of the electronic paper module display module production method, in step A40, the spray waterproof material is sprayed in a high temperature environment, and the high temperature is higher than 80 degrees and lower than 120 degrees.

[0070] like Fig.10 In an electronic paper module display device in the prior art, the electronic paper module and the TFT layer are electrically connected to the internal circuit through UV silver glue; the waterproof protective film layer is attached to the electronic paper module; the waterproof protective film layer and the UV edge sealing glue are enclosed to seal and fix the electronic paper module on the TFT layer. The waterproof protective film layer and the UV edge sealing glue are set separately, and UV silica gel is set on the IC. The above glues can be cured by UV irradiation, but after all, they are glues of different materials and need to be applied separately, which makes the process more complicated.

[0071] In this application, in order to improve the production efficiency of the production line, reduce the types of production materials, and improve the efficiency of glue coating, a spraying method is adopted, and one glue and one process can complete the work of the original three glues and multiple processes, further improving the production efficiency. Compared with the original process, it saves more time.

[0072] As shown in the accompanying drawings, the above are only embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the invention specification and the accompanying drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An electronic paper display module, It is characterized in that Including: TFT layer, electronic paper, waterproof protective film layer; The electronic paper and the TFT layer are electrically connected to the internal circuit through silver glue; The waterproof protective film layer is covered on the surface of the electronic paper, the edge of the TFT and the IC by spraying or coating.

2. The electronic paper display module according to claim 1, characterized in that: The electronic paper module includes: an FPL component.

3. The electronic paper module display module according to claim 2, characterized in that: The FPL component includes an OCA layer A, a PET layer, an ITO layer, an E-Ink layer, and an OCA layer B arranged in sequence; The waterproof protective film layer is covered on the OCA layer A, or the OCA layer A is removed and directly sprayed or coated on the PET layer; The OCA layer B is attached to the TFT layer.

4. The electronic paper module display module according to claim 3, characterized in that: The silver glue hole passes through the OCA layer B and the E-Ink layer to communicate with the ITO layer; the silver glue hole is used to inject silver glue.

5. The electronic paper display module according to claim 1, characterized in that: It also includes a driver chip IC and a flexible circuit board FPC connector, the driver chip IC is bound to the TFT layer; the driver chip IC and the FPC binding area are protected by a waterproof protective film layer; The FPC connector is used to connect an external circuit, and the FPC connector is bound to the TFT layer.

6. A method for producing an electronic paper module display module, characterized in that: include A10: Apply silver glue to the circuit connection points on the TFT layer; A20: Laminating the electronic paper to the TFT layer; A30: Defoaming; A40: Spraying or coating waterproof material The method for producing an electronic paper display module according to claim 6 is characterized in that step A20 is followed by Step A21: Bind IC Step A22: Bind FPC.

7. The method for producing an electronic paper display module according to claim 6, characterized in that: In step A40, the sprayed or coated waterproof material is a nano waterproof material, and the waterproof material is a transparent material.

8. The method for producing an electronic paper display module according to claim 6, characterized in that: Includes any one or more of the following features: Feature TA10: In step A40, the spraying or coating process includes: any one of air spraying, electrostatic spraying, electrophoretic spraying, and coating process; coating includes any one of electroplating and sputtering; Feature TA20: In step A40, the spraying or coating can omit the PS film to reduce the product thickness; Feature TA30: In step A40, the spraying or coating of waterproof material; Feature TA40: In step A40, the waterproof material is a nano waterproof material, and the curing method of the material includes any one of UV curing molding, room temperature curing molding, and heating curing molding.

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