A device suitable for spin coating of square wafers

Abstract

The invention relates to the technical field of quartz electronic component manufacturing, and in particular to a device suitable for spin coating of square wafers; the device comprises a tray body and a vacuum suction cup, wherein the upper end surface of the tray body is provided with a rectangular groove, and the four bottom corners of the rectangular groove are provided with circular grooves and through holes, and the center of the rectangular groove is provided with a plurality of tray annular grooves from the inside to the outside in sequence, the lower end surface of the tray body is provided with a circular groove, and a tray negative pressure hole is provided in the circular groove, and a suction cup negative pressure hole is provided in the center of the vacuum suction cup, and a plurality of suction cup annular grooves are also provided in sequence from the inside to the outside in sequence in the center of the vacuum suction cup, and a rotating table is provided below the vacuum suction cup, and an installation groove is provided on the outer side of the rotating table, and the square wafer is placed in the groove of the tray body and then placed above the vacuum suction cup as a whole, and connected by vacuum adsorption, so that the design effectively solves the technical problem of uneven distribution of photoresist or insufficient coverage of the square wafer during spin coating in the prior art.

Description

Technical Field

[0001] The invention relates to the technical field of quartz electronic component manufacturing, in particular to a device suitable for spin coating of square wafers. Background Art

[0002] During the process of spin coating on a square wafer, it is difficult to accurately center the wafer, and the distances between each corner and the center are different, resulting in different centrifugal forces. In addition, the corners of the square wafer have no support, which will generate airflow in the cavity during rotation, making it difficult for the photoresist to be evenly distributed on the corners of the wafer.

[0003] However, uneven coating of photoresist will cause the pattern on the wafer to deform after exposure, and if the photoresist does not cover the edge of the wafer, there will be no pattern in the uncovered area of ​​the wafer after exposure, thereby reducing the effective use area of ​​the wafer, affecting the yield, and increasing the difficulty of subsequent processing steps. Summary of the invention

[0004] The purpose of the present invention is to provide a device suitable for spin coating of square wafers, aiming to solve the technical problems in the prior art that uneven coating of photoresist will cause deformation of the pattern on the wafer after exposure, and the failure of photoresist to cover the edge of the wafer will result in no pattern in the uncovered area of ​​the wafer after exposure, thereby reducing the effective use area of ​​the wafer, affecting the yield, and also increasing the difficulty of processing in subsequent processes.

[0005] To achieve the above-mentioned purpose, the present invention adopts a device suitable for spin coating of square wafers, including a tray body and a vacuum suction cup, the upper end surface of the tray body has a rectangular groove, the four bottom corners of the rectangular groove each have a circular groove and a through hole, the center of the rectangular groove is provided with a plurality of tray annular grooves from the inside to the outside, the lower end surface of the tray body has a circular groove, a tray negative pressure hole is provided in the circular groove, and the tray negative pressure hole passes through the upper and lower end surfaces of the tray body, the center of the vacuum suction cup is provided with a suction cup negative pressure hole, the center of the vacuum suction cup is also provided with a plurality of suction cup annular grooves from the inside to the outside, and the suction cup negative pressure hole is located at the innermost layer of the plurality of suction cup annular grooves, a rotating table is provided below the vacuum suction cup, and the suction cup negative pressure hole is connected to the rotating table, the outer side of the rotating table has a mounting groove, and the tray body is provided on the vacuum suction cup.

[0006] Wherein, the tray body is embedded, and the tray body, the vacuum suction cup and the rotating table are all arranged in a ring shape.

[0007] There are multiple negative pressure holes in the tray, and the multiple negative pressure holes in the tray are arranged in a ring shape on the lower end surface of the tray body.

[0008] Wherein, the circular groove and the plurality of tray annular grooves are connected via tray radial grooves respectively.

[0009] Wherein, the suction cup negative pressure hole and the plurality of suction cup annular grooves are connected via suction cup radial grooves respectively.

[0010] Among them, the center of the tray body is located directly above the suction cup negative pressure hole, the multiple tray negative pressure holes are respectively located near the middle suction cup annular groove, and the tray through hole is located at the outermost suction cup annular groove.

[0011] Wherein, the diameters of the plurality of tray annular grooves and the plurality of suction cup annular grooves are arranged to increase in annular shape from the inside to the outside.

[0012] The present invention provides a device suitable for spin coating of square wafers, comprising a tray body and a vacuum suction cup, the upper end surface of the tray body having a rectangular groove, the four bottom corners of the rectangular groove each having a circular groove and a through hole, the center of the rectangular groove being provided with a plurality of tray annular grooves from the inside to the outside, the lower end surface of the tray body having a circular groove, the circular groove being provided with a tray negative pressure hole, the center of the vacuum suction cup being provided with a suction cup negative pressure hole, the center of the vacuum suction cup also being provided with a plurality of suction cup annular grooves from the inside to the outside, a rotating table being provided below the vacuum suction cup, the outer side of the rotating table being provided with an installation groove, the square wafer being compensated into a circular wafer by the tray body, thereby improving the uneven photoresist coating during spin coating of the square wafer, the wafer and the vacuum suction cup being positioned by the grooves on both sides of the tray body, making it easier to position the center of the square wafer, reducing the difficulty of glue spreading and improving the glue spreading efficiency. The eccentricity of each corner of the tray body is consistent when it rotates, which improves the consistency of the square wafer coating effect, increases the process yield, and lays the foundation for subsequent exposure and development. This design proposes a square wafer spin coating device that is easy to operate and improves production efficiency, improves processing effects, and enhances the consistency of process processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 It is a three-dimensional stereogram of a vacuum chuck in a device suitable for spin coating of square wafers according to the present invention.

[0015] Figure 2 It is a three-dimensional stereogram of a tray body in the device suitable for spin coating of square wafers of the present invention.

[0016] Figure 3 It is a schematic diagram of the back side of the tray body in the device suitable for spin coating of square wafers of the present invention.

[0017] Figure 4 It is a three-dimensional stereogram of a square wafer in the apparatus suitable for spin coating of square wafers of the present invention.

[0018] Figure 5 It is a schematic diagram of the assembly of the device for spin coating of square wafers according to the present invention.

[0019] Figure 6 It is a schematic diagram of the disassembly of the device for spin coating of square wafers according to the present invention.

[0020] 1-vacuum suction cup, 2-tray body, 3-square wafer, 4-suction cup negative pressure hole, 5-suction cup annular groove, 6-suction cup radial groove, 7-rotating table, 8-mounting groove, 9-rectangular groove, 10-tray annular groove, 11-circular groove, 12-tray radial groove, 13-through hole, 14-tray negative pressure hole, 15-circular groove. DETAILED DESCRIPTION

[0021] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0022] See also Figures 1 to 6 The present invention provides a device suitable for spin coating of square wafers, comprising a tray body 2 and a vacuum suction cup 1, wherein the upper end surface of the tray body 2 has a rectangular groove 9, and the four bottom corners of the rectangular groove 9 are each provided with a circular groove 11 and a through hole 13, and the center of the rectangular groove 9 is provided with a plurality of tray annular grooves 10 in sequence from the inside to the outside, and the lower end surface of the tray body 2 has a circular groove 15, and a tray negative pressure hole 14 is provided in the circular groove 15, and the tray negative pressure hole 14 passes through the upper and lower end surfaces of the tray body 2, and a suction cup negative pressure hole 4 is provided in the center of the vacuum suction cup 1, and a plurality of suction cup annular grooves 5 are also provided in sequence from the inside to the outside at the center of the vacuum suction cup 1, and the suction cup negative pressure hole 4 is located at the innermost layer of the plurality of suction cup annular grooves 5, and a rotating table 7 is provided below the vacuum suction cup 1, and the suction cup negative pressure hole 4 is connected to the rotating table 7, and the outer side of the rotating table 7 has a mounting groove 8, and the tray body 2 is provided on the vacuum suction cup 1.

[0023] In this embodiment, the square wafer 3 is compensated into a round wafer by the tray body 2, thereby improving the uneven photoresist coating during spin coating of the square wafer 3. The grooves on both sides of the tray body 2 are used to position the wafer and the vacuum chuck 1, making it easier to locate the center of the square wafer 3, reducing the difficulty of glue spreading and improving glue spreading efficiency. The eccentricity of each corner of the tray body 2 is consistent when rotating, which improves the consistency of the glue spreading effect of the square wafer 3, improves the process yield, and lays the foundation for subsequent exposure and development. This design proposes a square wafer 3 spin coating device that is easy to operate and improves production efficiency, improves processing effects, and improves the consistency of process processing.

[0024] In this embodiment, the diameter of the tray negative pressure hole 14 is smaller than the tray annular groove 10, and the diameter of the suction cup negative pressure hole 4 is smaller than the suction cup annular groove 5; the groove depths of the suction cup annular groove 5 and the suction cup radial groove 6 are both smaller than the thickness of the vacuum suction cup 1; the diameter of the circular groove 15 is equal to the outer diameter of the vacuum suction cup 1; the groove depth of the circular groove 15 plus the groove depth of the rectangular groove 9 is smaller than the thickness of the tray body 2; the groove depths of the tray annular groove 10, the circular groove 11 and the tray radial groove 12 are all smaller than the thickness of the tray body 2 minus the sum of the groove depths of the rectangular groove 9 and the circular groove 15; the height of the mounting groove 8 is smaller than the height of the rotating table 7.

[0025] Furthermore, the tray body 2 is embedded, and the tray body 2, the vacuum suction cup 1 and the rotating table 7 are all arranged in a ring shape.

[0026] In this embodiment, the tray body 2 is made of quartz material, and its polishing degree is consistent with the square wafer 3 required for glue coating. The diameter of the tray body 2 is larger than the diameter of the circumscribed circle of the square wafer 3, and its front side includes an embedded part and a platform part.

[0027] Furthermore, there are multiple tray negative pressure holes 14 , and the multiple tray negative pressure holes 14 are arranged in a ring shape on the lower end surface of the tray body 2 .

[0028] Furthermore, the circular groove 11 and the plurality of tray annular grooves 10 are connected via tray radial grooves 12 .

[0029] Furthermore, the suction cup negative pressure hole 4 and the plurality of suction cup annular grooves 5 are connected via suction cup radial grooves 6 .

[0030] Furthermore, the center of the tray body 2 is located directly above the suction cup negative pressure hole 4, the plurality of tray negative pressure holes 14 are respectively located near the suction cup annular groove 5 in the middle, and the tray through hole 13 is located at the outermost suction cup annular groove 5.

[0031] Furthermore, the diameters of the plurality of tray annular grooves 10 and the plurality of suction cup annular grooves 5 are arranged to increase in annular shape from the inside to the outside.

[0032] In this embodiment, the diameters of the multiple tray annular grooves 10 are different, and the diameters of the multiple suction cup annular grooves 5 are also different. At the same time, the diameters of the multiple tray annular grooves 10 and the multiple suction cup annular grooves 5 increase successively from the innermost layer outward.

[0033] In this embodiment, the vacuum suction cup 1 is placed on the glue spreading machine, and then the rotating table 7 is connected to the driving motor of the glue spreading machine through the mounting groove 8, and then the tray body 2 is placed above the vacuum suction cup 1, and then the square chip 3 is placed in the tray body 2, and the square chip 3, the tray and the vacuum suction cup 1 are fixedly connected by vacuum adsorption.

[0034] In this embodiment, the suction force generated by the vacuum adsorption first enters the tray body 2 through the suction cup negative pressure hole 4 to adsorb, and then a part of the adsorption force enters the tray negative pressure hole 14 through the suction cup radial groove 6 and the suction cup annular groove 5 in the middle. At this time, the middle part of the square chip 3 can be adsorbed, and then another part of the adsorption force enters the through hole 13 through the suction cup radial groove 6 and the outermost suction cup annular groove 5. At this time, the edge part of the square chip 3 can be adsorbed, thereby ensuring that the square chip 3 will not loosen.

[0035] What is disclosed above is only a preferred embodiment of the present invention, and it certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. A device suitable for spin coating of square wafers, characterized in that: It includes a tray body and a vacuum suction cup, the upper end surface of the tray body has a rectangular groove, the four bottom corners of the rectangular groove each have a circular groove and a through hole, the center of the rectangular groove is provided with a plurality of tray annular grooves from the inside to the outside, the lower end surface of the tray body has a circular groove, a tray negative pressure hole is provided in the circular groove, and the tray negative pressure hole passes through the upper and lower end surfaces of the tray body, a suction cup negative pressure hole is provided in the center of the vacuum suction cup, and a plurality of suction cup annular grooves are also provided in the center of the vacuum suction cup from the inside to the outside, and the suction cup negative pressure hole is located at the innermost layer of the plurality of suction cup annular grooves, a rotating table is provided below the vacuum suction cup, and the suction cup negative pressure hole is connected to the rotating table, the outer side of the rotating table has a mounting groove, and the tray body is provided on the vacuum suction cup.

2. The device for spin coating of square wafers according to claim 1, characterized in that: The tray body is embedded, and the tray body, the vacuum suction cup and the rotating table are all arranged in a ring shape.

3. The device for spin coating of square wafers as claimed in claim 2, characterized in that: The number of the tray negative pressure holes is multiple, and the multiple tray negative pressure holes are arranged in a ring shape on the lower end surface of the tray body.

4. The device for spin coating square wafers as claimed in claim 3, characterized in that: The circular groove and the plurality of tray annular grooves are connected to each other through tray radial grooves.

5. The device for spin coating of square wafers as claimed in claim 4, characterized in that: The suction cup negative pressure hole and the plurality of suction cup annular grooves are communicated with each other through suction cup radial grooves.

6. The device for spin coating of square wafers as claimed in claim 5, characterized in that: The center of the tray body is located directly above the suction cup negative pressure hole, a plurality of the tray negative pressure holes are respectively located near the middle suction cup annular groove, and the tray through hole is located at the outermost suction cup annular groove.

7. The device for spin coating square wafers as claimed in claim 6, characterized in that: The diameters of the plurality of tray annular grooves and the plurality of suction cup annular grooves are arranged to increase in annular shape from the inside to the outside.

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