Memory module connector, motherboard, and computing device

Abstract

Embodiments of the present application provide a memory module connector and a computing device. The memory module connector comprises: a connector main body having a first side wall and a second side wall, the extension direction of the first side wall and the extension direction of the second side wall intersect, the first side wall is configured to be connected with a mainboard, and the second side wall is provided with a plurality of slots configured to be inserted with a memory module; and the plurality of slots are arranged side by side along the extension direction of the second side wall. Embodiments of the present application can improve the setting density of the memory module and reduce the occupation of the server space.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a memory module connector, a motherboard, and a computing device. Background Technology

[0002] With the rapid development of information technology, memory modules have become one of the core components of server systems. The performance, capacity, and integration level of memory modules directly affect the overall performance of the server system. Generally, a server includes memory modules and a central processing unit (CPU), and the memory modules can interact with the CPU. As CPU size increases with performance improvements, higher requirements are placed on the high density of memory modules. Summary of the Invention

[0003] This application provides a memory module connector, a motherboard, and a computing device, which can increase the density of memory modules and reduce the space occupied by the server.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, embodiments of this application provide a memory module connector, including:

[0006] The connector body has a first sidewall and a second sidewall, the extension direction of the first sidewall intersects the extension direction of the second sidewall, the first sidewall is configured to connect to the motherboard, and the second sidewall has multiple slots configured for inserting memory modules; the multiple slots are arranged side by side along the extension direction of the second sidewall.

[0007] The memory module connector provided in this application embodiment has a first sidewall and a second sidewall, the extension direction of the first sidewall intersecting the extension direction of the second sidewall. Thus, the first sidewall can be connected to the motherboard, and multiple slots are provided on the second sidewall for inserting memory modules. The multiple slots are arranged side by side along the extension direction of the second sidewall. Thus, after the memory module is placed on the motherboard through the memory module connector, the multiple memory modules are arranged along the extension direction of the second sidewall. The memory modules are arranged using the space of the sidewall intersecting with the motherboard. Even if the size of the CPU on the motherboard increases and occupies the horizontal space of the motherboard, the number of memory modules will not be affected. This can improve the setting density of memory modules and reduce the space occupied by the server.

[0008] In one implementation, a first slot among a plurality of slots is connected to a first trace, which is conductive to a first sidewall; a second slot among a plurality of slots is connected to a second trace, which is conductive to the first sidewall; the first slot and the second slot are any two adjacent slots among the plurality of slots.

[0009] There is a first gap between the first slot and the second slot, and there is a second gap between the first trace and the second trace on the first sidewall, the second gap being smaller than the first gap.

[0010] In this embodiment, a first slot among the multiple slots is connected to a first trace, which extends to a first sidewall, thereby enabling the memory module inserted into the first slot to connect to the motherboard via the first trace and the first sidewall. A second slot among the multiple slots is connected to a second trace, which extends to the first sidewall, thereby enabling the memory module inserted into the second slot to connect to the motherboard via the second trace and the first sidewall.

[0011] Furthermore, there is a first gap between the first slot and the second slot, and a second gap between the first trace and the second trace on the first sidewall. This second gap is set to be smaller than the first gap. This reduces the space required for the traces connecting multiple memory modules to the motherboard. In other words, the space on the sidewall intersecting with the motherboard within the server can be fully utilized to arrange memory modules, reducing the space occupied by memory modules on the motherboard. Even with increased CPU size, this ensures the number of memory modules that can be installed on the motherboard, increasing the memory module density and reducing the space occupied by the memory modules in the server.

[0012] Furthermore, the first and second slots are any two adjacent slots among multiple slots. This means the distance between the traces corresponding to any two adjacent slots is less than the distance between the slots themselves. Consequently, the space required for the traces to connect to the motherboard is less than the space required for arranging multiple slots, allowing full utilization of the space on the sidewalls intersecting with the motherboard within the server for memory module placement. This reduces the space occupied by memory modules on the motherboard, ensuring a sufficient number of memory modules can be installed on the motherboard even with increased CPU size, increasing memory module density, and reducing the space occupied by the server.

[0013] In one implementation, either the first trace or the second trace includes:

[0014] The first sub-trace is connected to one side wall of the slot;

[0015] The second sub-trace is connected to the other side wall of the slot; the first and second sub-traces have a third spacing on the first side wall, the third spacing being less than or equal to the opening width of the slot.

[0016] In this embodiment, either the first trace or the second trace is configured to include a first sub-trace and a second sub-trace. The first sub-trace is connected to one side wall of the slot, and the second sub-trace is connected to the other side wall of the slot. This allows the first sub-trace to contact pins on one side of the memory module, and the second sub-trace to contact pins on the other side of the memory module, facilitating connection between the pins on both sides of the memory module and the motherboard. The first and second sub-traces have a third spacing on the first side wall, which is less than or equal to the slot opening width. This reduces the spacing between the two traces connected to the pins on both sides of the memory module, thereby reducing the space required for the traces connected to the memory module to be arranged on the first side wall, and consequently reducing the space required for the traces to be arranged on the motherboard. This reduction in the space occupied by the memory module on the motherboard ensures the number of memory modules that can be installed on the motherboard even with an increased CPU size.

[0017] In one implementation, the second sidewall comprises two sides, which are located opposite each other on both sides of the first sidewall.

[0018] In some examples of embodiments of this application, slots are provided on both second sidewalls of the connector body. This increases the number of memory modules that can be inserted into the connector body, allowing for full utilization of the space on the sidewalls intersecting with the motherboard within the server for memory module placement.

[0019] In one implementation, there is a fourth spacing between the two second sidewalls on the side away from the first sidewall, and a fifth spacing between the two second sidewalls on the side connected to the first sidewall, wherein the fourth spacing is less than or equal to the fifth spacing.

[0020] In some examples of embodiments of this application, a fourth spacing is provided between the sides of the two second sidewalls facing away from the first sidewall, and a fifth spacing is provided between the sides of the two second sidewalls connected to the first sidewall. The fourth spacing is set to be less than or equal to the fifth spacing. Thus, after the memory module is inserted into the slot, the side of the memory module away from the connector body is flush with or has a pyramidal conical structure, making it easy to remove the memory module from the slot.

[0021] In one implementation, the connector body includes:

[0022] The wiring layer has a first gap, and the first and second wirings are laid in the wiring layer;

[0023] An insulating layer has a second notch, and the insulating layer is located on both sides of the wiring layer; the first notch and the second notch form a slot.

[0024] In this embodiment, by creating a first notch in the wiring layer and laying a first and a second wiring in the wiring layer, the arrangement of the first and second wirings is facilitated. Insulating layers are provided on both sides of the wiring layer, and a second notch is created in the insulating layer. The second and first notches together form a slot, facilitating the processing and shaping of the connector body, simplifying the slot placement, and improving the processing efficiency of the connector body.

[0025] In one implementation, the routing layer comprises multiple layers, and each routing layer in the multi-layer routing layer has an insulating layer on both sides.

[0026] By setting up multiple routing layers, the traces on these layers are connected to multiple pins on the memory module. Insulating layers are placed on both sides of each routing layer to prevent interference between the traces and facilitate signal transmission.

[0027] In one implementation, the depth direction of the slot is aligned with the extension direction of the first sidewall.

[0028] In some examples of embodiments of this application, the depth direction of the slot is set to be consistent with the first sidewall, which facilitates the slot setting. Additionally, when installing the memory module, it can be installed by first inserting it at an angle and then pressing it down, which facilitates stable installation of the memory module.

[0029] In one implementation, the slot opening is tilted away from the first sidewall.

[0030] In some examples of embodiments of this application, the opening of the slot is tilted away from the first sidewall. Thus, after the memory module is inserted into the slot, the end of the memory module away from the slot is tilted away from the first sidewall, facilitating the insertion and removal of the memory module.

[0031] Secondly, embodiments of this application provide a motherboard, including:

[0032] substrate;

[0033] The memory module connector provided in any of the foregoing embodiments or implementations is connected to the substrate.

[0034] In some implementations, the motherboard includes:

[0035] substrate;

[0036] Board-end connectors connect to the substrate and have connection terminals;

[0037] As provided in any of the foregoing embodiments or implementations, the first and second traces of the first sidewall of the memory module connector are connected to the connection terminal.

[0038] The motherboard provided in this embodiment connects to the substrate via a board-end connector. The board-end connector has connection terminals that can connect to a first trace and a second trace on the first sidewall. This facilitates the connection and disconnection of the memory module connector from the motherboard, making memory module maintenance easier and reducing maintenance costs.

[0039] In one implementation, the board-end connector is provided with terminal contact springs that contact the first trace and the second trace.

[0040] In some examples of embodiments of this application, terminal contact springs are provided on the board-end connector, and these terminal contact springs contact the first trace and the second trace. This improves the stability of the electrical signal connection between the connector body and the board-end connector, and also improves the stability of the connection between the memory module and the motherboard.

[0041] In one implementation, the board-end connector has a groove on the side facing the connector body, and the terminal contact spring is located in the groove.

[0042] In some examples of embodiments of this application, a groove is provided on the side of the board-end connector facing the connector body, and the terminal contact spring is placed in the groove. In this way, the groove can protect the terminal entering and exiting the spring, and can prevent the terminal contact spring from bending and deforming due to lateral force.

[0043] In one implementation, the first sidewall is disposed in the groove, one of the board end connector and the first sidewall is provided with a guide post, and the other of the board end connector and the first sidewall is provided with a guide groove, with the guide post inserted into the guide groove.

[0044] In this embodiment, one of the board-end connector and the first sidewall is provided with a guide post, and the other of the board-end connector and the first sidewall is provided with a guide groove; thus, when the connector body is installed to the board-end connector, the guide post can be inserted into the guide groove, thereby facilitating the positioning and docking of the connector body and the board-end connector and improving the installation efficiency of the connector body.

[0045] In one implementation, the board-end connector has solder balls on the side facing away from the connector body, and the solder balls are connected to the connection terminals; the solder balls are configured to connect to the motherboard.

[0046] In this embodiment, solder balls are provided on one side of the connector body of the board-end connector, and the solder balls are connected to the connection terminals. This allows the board-end connector to be connected to the motherboard via soldering, improving the stability of the connection between the board-end connector and the motherboard.

[0047] Thirdly, embodiments of this application provide a computing device, including a motherboard, a processor, and a memory module as provided in the foregoing embodiments of this application. The processor is disposed on the motherboard, and the memory module is disposed in a slot of a memory module connector. The projection of the memory module on the motherboard is misaligned with that of the processor.

[0048] In this embodiment, by setting the projection on the motherboard of the memory module to be offset from the processor, the memory module can avoid obstructing the processor, thus facilitating the installation of the memory module and the processor. Attached Figure Description

[0049] Figure 1 This is a schematic diagram of a memory module connector and a motherboard as provided in some embodiments of this application;

[0050] Figure 2 This is a schematic diagram of the internal structure of a memory module connector provided in some embodiments of this application;

[0051] Figure 3 yes Figure 2 A magnified view of a portion of point A in the middle;

[0052] Figure 4 This is a schematic diagram of the structure of the memory module connector and the memory module mating according to some embodiments of this application;

[0053] Figure 5 This is an exploded structural diagram of the memory module connector provided in some embodiments of this application;

[0054] Figure 6 This is a top view of a memory module connector provided in some embodiments of this application;

[0055] Figure 7 This is a schematic diagram of the structure of the memory module connector and the board connector provided in some embodiments of this application.

[0056] Explanation of reference numerals in the attached figures:

[0057] 100 - Motherboard; 200 - CPU; 300 - Memory module; 400 - Memory module connector;

[0058] 210-Bracket; 410-Connector body; 411-First sidewall; 412-Second sidewall; 413-Slot; 414-First trace; 415-Second trace; 416-Trace layer; 417-Insulating layer; 420-Board connector; 421-Connecting terminal; 422-Groove; 423-Solder ball;

[0059] 4111-Guide groove; 4141-First sub-trace; 4142-Second sub-trace; 4161-First notch; 4171-Second notch; 4211-First sub-connecting terminal; 4212-Second sub-connecting terminal; 4213-Terminal contact spring; 4221-Guide post. Detailed Implementation

[0060] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of this application.

[0061] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0062] In the description of this application, it should be understood that the terms "upper," "lower," "horizontal," "bottom," "inner," and "outer" (if any) indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In this application, unless otherwise expressly specified and limited, "upper" or "lower" of the first feature and the second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium.

[0063] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two entities connected are not linked by an intermediate structure, but are simply connected to form a whole. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0064] In this application, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0065] With the rapid development of information technology, memory modules are playing an increasingly important role in computing devices. As one of the core components of computing devices, the performance, capacity, and integration of memory modules directly affect the overall performance of the computing device.

[0066] In some examples, the computing device may include a server.

[0067] In some examples, computing devices may include rack-mount servers, artificial intelligence (AI) servers, or graphics processing unit (GPU) servers. AI servers and GPU servers need to process large amounts of data and have high memory requirements.

[0068] In some examples, computing devices may include high-performance computers. High-performance computing (HPC) computers typically require large amounts of memory to support complex computing tasks.

[0069] In some examples, computing devices may include workstations. Workstations typically require a large amount of memory to run complex design and simulation software.

[0070] In some examples, computing devices may include embedded systems. Embedded systems typically need to achieve efficient and stable computing within a limited space.

[0071] In some examples of the embodiments of this application, for ease of explanation, a computing device is used as a server as a specific example for illustration. In some examples, the server may include a chassis (in some examples, it may also be called a case). A receiving space may be formed within the chassis. The receiving space may be configured to accommodate electronic components. The electronic components accommodated within the receiving space may include a motherboard. The motherboard may be fixedly connected to the chassis. For example, the motherboard may be fixed to the chassis by bolts, screws, or threaded rods. In some examples, a central processing unit (CPU) may be provided on the motherboard. In some examples, to improve the server's processing performance, multiple CPUs may be provided on the motherboard. Multiple CPUs may be arranged side-by-side along the width direction of the motherboard. Furthermore, multiple memory modules may be provided on the motherboard. Memory modules may, for example, include dual in-line memory modules (DIMMs).

[0072] Figure 1 This is a schematic diagram of a memory module connector and motherboard provided in some embodiments of this application.

[0073] Reference Figure 1 As shown in some examples of embodiments of this application, a memory module connector 400 is provided. The memory module connector 400 may include a connector body 410. The connector body 410 has a first sidewall 411 and a second sidewall 412, the extending direction of the first sidewall 411 intersects the extending direction of the second sidewall 412. The first sidewall 411 is configured to connect to the motherboard 100, and the second sidewall 412 is provided with a plurality of slots 413, which are configured for inserting memory modules 300; the plurality of slots 413 are arranged side by side along the extending direction of the second sidewall 412. In this way, by setting the insertion position of the memory module 300 on the second sidewall 412 of the connector body 410, and utilizing the space of the sidewall intersecting with the motherboard 100 to arrange the memory module 300, even if the size of the CPU 200 increases and occupies the lateral space of the motherboard 100, the number of memory modules 300 will not be affected, thereby increasing the setting density of the memory modules 300 and reducing the space occupied by the server.

[0074] As the amount of data processed increases, the demands on the processing performance of the CPU 200 become increasingly higher. To improve the processing performance of the CPU 200, its size increases. This results in the CPU 200 requiring more and more space on the motherboard 100. By employing the memory module connector of this embodiment, the problem of insufficient space within the server to accommodate the corresponding memory module 300 due to the increased CPU size can be effectively solved.

[0075] In some examples, refer to Figure 1 As shown, some embodiments of this application provide a memory module connector 400. The memory module connector 400 may include a connector body 410.

[0076] In some examples, refer to Figure 1 As shown, the connector body 410 may have a first sidewall 411. The first sidewall 411 may be configured to connect to the motherboard 100.

[0077] In some examples, the first sidewall 411 can be directly connected to the motherboard 100. For example, the first sidewall 411 may be provided with pins or pads. The pins or pads are connected to circuit traces on the motherboard 100.

[0078] In some examples, the connector body 410 can be connected to the motherboard 100 by means of screws, bolts or threaded rods.

[0079] In some examples, the connector body 410 can be fastened to the motherboard 100 by means of locking, snapping, etc.

[0080] In some examples, the connector body 410 can be soldered to the motherboard 100.

[0081] It is understood that in some other examples of embodiments of this application, the connector body 410 may also be connected to the motherboard 100 in other ways, as long as the connector body 410 and the motherboard 100 are stably connected.

[0082] In some examples, the connector body 410 may have a second sidewall 412. The extending direction of the second sidewall 412 may intersect the extending direction of the first sidewall 411.

[0083] In some examples, the first sidewall 411 may be a sidewall of the connector body 410 that is parallel or approximately parallel to the motherboard 100. The extension direction of the second sidewall 412 may intersect with the motherboard 100. For example, the motherboard 100 may be disposed on the bottom wall of the server chassis, and the second sidewall 412 may extend from the motherboard 100 toward an opening in the server chassis.

[0084] In some examples, the second sidewall 412 may be at an angle to the first sidewall 411 so that the second sidewall 412 extends relative to the first sidewall 411 toward the opening of the server chassis.

[0085] In some examples, refer to Figure 1 As shown, the second sidewall 412 can be perpendicular to the first sidewall 411.

[0086] In some examples, refer to Figure 1 As shown, the second sidewall 412 may have multiple slots 413 arranged side by side. The slots 413 may be configured to accommodate memory modules 300.

[0087] In some examples, the inner wall of slot 413 may be provided with spring contacts that interact with the pins of memory module 300. When memory module 300 is inserted into slot 413, the spring contacts in slot 413 can contact the pins of memory module 300.

[0088] In some examples, refer to Figure 1 As shown, multiple slots 413 can extend along the direction of the second sidewall 412 (e.g., Figure 1 (as shown by the y-axis) arranged side by side. The extension direction of the first sidewall 411 can be along... Figure 1 Arranged in the direction shown by the x-axis.

[0089] The memory module connector 400 provided in this embodiment has a first sidewall 411 and a second sidewall 412 whose extending directions intersect. The first sidewall 411 can be connected to the motherboard 100, and the extending direction of the second sidewall 412 intersects with the motherboard 100. Multiple slots 413 arranged side-by-side are provided on the second sidewall 412 along its extending direction. Thus, by utilizing the space intersecting with the motherboard 100 to arrange the memory modules 300, even if the CPU size on the motherboard increases, occupying more horizontal space on the motherboard 100, the number of memory modules 300 can still be increased, improving the density of the memory modules 300 and reducing the space occupied on the server.

[0090] In some examples, refer to Figure 1 As shown, the width of multiple slots 413 arranged side by side (e.g.) Figure 1 The distance shown in h) is greater than the width of the memory module 300 (e.g. Figure 1 (The distance shown in L1). Thus, by arranging multiple memory modules 300 side by side on the second sidewall 412, the space required for the memory modules 300 to be arranged on the motherboard 100 can be reduced.

[0091] Figure 2 This is a schematic diagram of the internal structure of a memory module connector provided in some embodiments of this application.

[0092] In some examples, refer to Figure 2 As shown, the second sidewall 412 can be inclined relative to the first sidewall 411. An angle of less than 90° is formed between the second sidewall 412 and the first sidewall 411. Thus, after the memory module 300 is inserted into the slot 413, in a direction perpendicular to the motherboard 100 (e.g., ... Figure 1 (As shown by the y-axis), multiple memory modules 300 are misaligned on the side away from the connector body, which facilitates the insertion and removal of memory modules 300.

[0093] In some examples, refer to Figure 2 As shown, the first slot among the plurality of slots 413 is connected to a first trace 414. The first trace 414 can be connected to a spring contact on the inner wall of the first slot.

[0094] In some examples, the first slot can be any one of multiple slots 413.

[0095] In some examples, the first trace 414 can be formed within the connector body by deposition or etching. The arrangement of the first trace 414 within the connector body 410 can be the same as or similar to the arrangement of traces within a printed circuit board, which will not be described in detail in the embodiments of this application.

[0096] In some examples, the first trace 414 can be connected to the first sidewall 411. That is, the first trace 414 can connect the spring piece on the inner wall of the first slot to the first sidewall 411.

[0097] In some examples, the first sidewall 411 may be provided with an array of solder balls (not shown in the figure). The first trace 414 may be connected to the first solder ball in the solder ball array, thereby enabling the first solder ball to conduct to the first slot.

[0098] In some examples, the first sidewall 411 may be provided with a pin array (not shown in the figure). The first trace 414 may be connected to the first pin in the pin array, thereby enabling the first pin to conduct to the first slot.

[0099] In some examples, refer to Figure 2 As shown, the second slot among the multiple slots 413 is connected to a second trace 415. The second trace 415 can be connected to a spring clip on the inner wall of the second slot.

[0100] In some examples, the second slot can be any one of the multiple slots 413 other than the first slot.

[0101] In some examples, the second trace 415 can be connected to the first sidewall 411. That is, the second trace 415 can connect the spring clip on the inner wall of the second slot to the first sidewall 411.

[0102] In some examples, the second trace 415 may be configured in the same, similar, or identical manner as the first trace 414. For details, please refer to the detailed description of the first trace 414 in the foregoing embodiments of this application; further details will not be repeated in the embodiments of this application.

[0103] Figure 3 yes Figure 2 A magnified view of a portion of point A in the middle.

[0104] In some examples, refer to Figure 2 and Figure 3 As shown, there can be a first gap L3 between the first slot and the second slot. It should be noted that the first gap L3 can be the distance between the center of the first slot and the center of the second slot.

[0105] In some examples, refer to Figure 2 and Figure 3 As shown, the first trace 414 and the second trace 415 have a second spacing L4 on the first sidewall 411.

[0106] In some examples, the second spacing L4 is smaller than the first spacing L3. Thus, setting the spacing between the first and second slots on the second sidewall 412 to the first spacing L3 ensures sufficient insertion and removal space between adjacent memory modules 300. Setting the second spacing L4 on the first sidewall 411 to be smaller than the first spacing L3 reduces the distance between the traces of adjacent memory modules 300 on the first sidewall 411, thereby reducing the distance between the connection between adjacent memory modules 300 and the motherboard 100, and consequently reducing the space occupied by the memory modules 300 on the motherboard 100.

[0107] In this embodiment, a first gap exists between the first slot and the second slot, and a second gap exists between the first trace 414 and the second trace 415 on the first sidewall 411. The second gap is set to be smaller than the first gap. This reduces the space required for the wiring arrangement connecting multiple memory modules 300 to the motherboard 100. Specifically, the space intersecting with the motherboard 100 within the server can be fully utilized to arrange the memory modules 300, reducing the space occupied by the memory modules on the motherboard 100. Even with an increased CPU 200 size, the number of memory modules on the motherboard 100 can be ensured, increasing the density of the memory modules 300 and reducing the space occupied on the server.

[0108] In some examples, refer to Figure 2 and Figure 3 As shown, the first slot and the second slot can be any two adjacent slots 413 from a plurality of slots 413.

[0109] In some examples, refer to Figure 2 As shown, eight slots 413 can be arranged along the second sidewall 412. The first slot can be the slot 413 closest to the first sidewall 411 among the eight slots 413. The second slot can be the slot 413 adjacent to the first slot.

[0110] It can be understood that the first slot can be any one of the eight slots 413. The second slot can be a slot 413 adjacent to the first slot.

[0111] In other words, in some embodiments of this application, the first distance L3 can be the minimum distance between two slots 413. In some examples of embodiments of this application, the second distance L4 is set to be less than the minimum distance between two slots 413, so that the space occupied by the wiring to connect to the motherboard 100 is less than the space occupied by the arrangement of multiple slots 413.

[0112] In some examples of embodiments of this application, the first slot and the second slot are any two adjacent slots 413 among a plurality of slots 413. Thus, the distance between the traces corresponding to any two adjacent slots 413 is less than the distance between the slots 413. Consequently, the space occupied by the traces connecting to the motherboard 100 is less than the space occupied by the arrangement of the plurality of slots 413, allowing full utilization of the space intersecting with the motherboard 100 within the server for arranging the memory modules 300. This reduces the space occupied by the memory modules on the motherboard 100, ensuring the number of memory modules that can be installed on the motherboard 100 even with an increased CPU 200 size.

[0113] In some examples, refer to Figure 3 As shown, either the first trace 414 or the second trace 415 may include a first sub-trace 4141. The first sub-trace 4141 may be connected to the sidewall of one side of the slot 413.

[0114] In some examples, as described in the foregoing embodiments of this application, the inner wall of slot 413 may be provided with spring contacts. It is understood that pins may be provided on both sides of the memory module 300. Therefore, spring contacts may be provided on both inner walls of slot 413. The first sub-trace 4141 may be connected to the spring contact on one of the side walls.

[0115] In some examples, refer to Figure 3 As shown, either the first trace 414 or the second trace 415 may include a second sub-trace 4142. The second sub-trace 4142 may be connected to the other side wall of the slot 413. That is, the second sub-trace 4142 may be connected to the spring clip on the other side wall of the slot 413.

[0116] In some examples, the first sub-trace 4141 and the second sub-trace 4142 have a third spacing L5 on the first sidewall 411. The third spacing L5 may be less than or equal to the opening width of the slot 413.

[0117] It is understandable that in some examples, the opening width of slot 413 can be the same as, equal to, or similar to the thickness of memory module 300. That is, the third pitch L5 can be less than or equal to the thickness of memory module 300. In this way, relative to the arrangement of memory module 300 on motherboard 100, the space occupied by motherboard 100 for the connection between the pins of memory module 300 and motherboard 100 can be reduced.

[0118] In this embodiment, either the first trace 414 or the second trace 415 is configured to include a first sub-trace 4141 and a second sub-trace 4142. The first sub-trace 4141 is connected to one side wall of the slot 413, and the second sub-trace 4142 is connected to the other side wall of the slot 413. Thus, the first sub-trace 4141 can contact a pin on one side of the memory module 300, and the second sub-trace 4142 can contact a pin on the other side of the memory module 300, facilitating the connection of the pins on both sides of the memory module 300 to the motherboard 100. The first sub-trace 4141 and the second sub-trace 4142 have a third spacing on the first side wall 411, which is less than or equal to the opening width of the slot 413. This reduces the spacing between the two traces connecting to the pins on both sides of the memory module 300, thereby reducing the space required for the traces connected to the memory module 300 to be arranged on the first sidewall 411, which in turn reduces the space required for the traces to be arranged on the motherboard 100. Reducing the space occupied by the memory modules on the motherboard 100 ensures that the number of memory modules on the motherboard 100 can be maintained even with the increased size of the CPU 200.

[0119] In some examples, refer to Figure 1 and Figure 2 As shown, the second sidewall 412 may include two. The two second sidewalls 412 may be located opposite each other on both sides of the first sidewall 411.

[0120] In other words, in some examples of embodiments of this application, slots 413 can be provided on both second sidewalls 412. In this way, slots 413 can be provided on both sidewalls of a connector body 410, which can increase the number of memory modules 300 connected to the connector body 410.

[0121] In some examples, the motherboard 100 is equipped with 32 memory modules 300. Eight slots 413 can be provided on either of the two second sidewalls 412. That is, 16 memory modules 300 can be inserted into a single connector body 410.

[0122] It is understood that in some examples of the embodiments of this application, the distance between two adjacent slots 413, the distance at which the spring in the slot 413 of the connector body 410 can stably rebound, and the height of the frame are set, and the embodiments of this application do not limit this.

[0123] Additionally, it should be noted that in some embodiments of this application, the number of memory modules 300 can be reduced, for example, to four memory modules 300. The case of eight memory modules 300 in the foregoing embodiments of this application is merely an illustrative example and is not intended to limit the number of memory modules 300 or the applicability of the memory module connector 400.

[0124] In some specific examples, the connector body 410 can be positioned between two CPUs 200. This reduces the space required for the 16 memory modules 300 between the two CPUs 200, ensuring the number of memory modules 300 can be configured even with an increase in the size of the CPUs 200.

[0125] It is understood that in some examples of the embodiments of this application, the number of memory modules 300 is only used as a specific example for illustration, and is not intended to limit the specific number of memory modules 300.

[0126] In some examples of embodiments of this application, slots 413 are provided on both second sidewalls 412 of the connector body 410. This increases the number of memory modules 300 that can be inserted into the connector body 410, and makes full use of the space on the side of the server that intersects with the motherboard 100 to arrange the memory modules 300.

[0127] In some examples, refer to Figure 1 and Figure 2 As shown, there may be a fourth spacing L6 between the two second sidewalls 412 on the side facing away from the first sidewall 411.

[0128] In some examples, refer to Figure 1 and Figure 2 As shown, there is a fifth spacing L7 between the two second sidewalls 412 and the side where they intersect with the first sidewall 411.

[0129] In some examples, refer to Figure 1 As shown, the fourth pitch L6 can be equal to the fifth pitch L7. That is to say, the cross-section of the connector body 410 can be rectangular.

[0130] In some examples, to facilitate the insertion and removal of the memory module 300, the depth of the slot 413 on the second sidewall 412 can be along... Figure 2 The direction indicated by the positive y-axis gradually increases. That is to say, the depth of a slot 413 farther away from the first sidewall 411 can be greater than the depth of a slot 413 closer to the first sidewall 411.

[0131] In some examples, for ease of illustration, the first slot and the second slot are used as examples. The first slot can be located on the side of the second slot near the first sidewall 411. The first slot and the second slot can be any two adjacent slots 413 from a plurality of slots 413. The depth of the second slot can be greater than the depth of the first slot. Thus, after the memory module 300 is inserted into the slot 413, an inclined slope is formed on the side of the memory module 300 arranged on the second sidewall 412 away from the connector body 410. This facilitates the insertion and removal of the memory module 300.

[0132] In some examples, refer to Figure 2 As shown, the fourth spacing L6 can be smaller than the fifth spacing L7. That is to say, the cross-section of the connector body 410 can be trapezoidal or conical.

[0133] In some examples of embodiments of this application, the fourth spacing L6 is set to be smaller than the fifth spacing L7. Thus, after the memory module 300 is inserted into the slot 413, the side of the multiple side-by-side memory modules 300 away from the second sidewall 412 forms an inclined slope, which facilitates the insertion and removal of the memory modules 300.

[0134] In some examples of embodiments of this application, a fourth spacing is provided between the sides of the two second sidewalls 412 facing away from the first sidewall 411, and a fifth spacing is provided between the sides of the two second sidewalls 412 connected to the first sidewall 411. The fourth spacing is set to be less than or equal to the fifth spacing. Thus, after the memory module 300 is inserted into the slot 413, the side of the memory module 300 facing away from the connector body 410 is flush with or has a pyramidal conical structure, making it easy to remove the memory module 300 from the slot 413.

[0135] In some examples, refer to Figure 2 As shown, the depth direction of the slot 413 can be consistent with the extension direction of the first sidewall 411. That is, the depth direction of the slot 413 can be parallel or approximately parallel to the first sidewall 411.

[0136] In some examples, when installing the memory module 300 into the connector body 410, it can be installed by first inserting it at an angle and then pressing it down.

[0137] In some examples, the second sidewall 412 may be provided with a latch. When the memory module 300 is pressed down, the latch can engage with the side of the memory module 300 facing away from the first sidewall 411, thereby securing the memory module 300.

[0138] In some examples of embodiments of this application, the depth direction of the slot 413 is set to be consistent with the first sidewall 411, which facilitates the setting of the slot 413. In addition, when installing the memory module 300, it can be installed by first inserting it at an angle and then pressing it down, which facilitates the stable installation of the memory module 300.

[0139] Figure 4 This is a schematic diagram of the structure of the memory module connector and the memory module in some embodiments of this application.

[0140] In some examples, refer to Figure 4As shown, the opening of the slot 413 can be tilted away from the first sidewall 411. That is, along the depth direction of the slot 413, the distance between the bottom wall of the slot 413 and the first sidewall 411 can be less than the distance between the opening of the slot 413 and the first sidewall 411.

[0141] In some examples, refer to Figure 4 As shown, after the memory module 300 is inserted into the slot 413, the memory module 300 can be tilted away from the first sidewall 411. When it is necessary to remove the memory module 300 from the slot 413, the operator can easily insert or remove the memory module 300 through the opening in the server chassis.

[0142] In some examples of embodiments of this application, the opening of the slot 413 is tilted toward a direction away from the first sidewall 411. Thus, after the memory module 300 is inserted into the slot 413, the end of the memory module 300 away from the slot 413 is tilted toward a direction away from the first sidewall 411, which facilitates the insertion and removal of the memory module 300.

[0143] Figure 5 This is an exploded structural diagram of a memory module connector provided in some embodiments of this application.

[0144] In some examples, refer to Figure 5 As shown, the connector body 410 may include a wiring layer 416. Wiring can be routed in the wiring layer 416. For example, a first wiring 414 and a second wiring 415 may be routed in the wiring layer 416.

[0145] In some examples, the traces on the trace layer 416 can be laid out using deposition or etching methods. Of course, other routing methods can also be used for the traces on the trace layer 416, and this application embodiment does not limit this.

[0146] In some examples, refer to Figure 5 As shown, the wiring may have a first notch 4161. A spring contact that connects to the pins of the memory module 300 may be provided in the first notch 4161.

[0147] In some examples, refer to Figure 5 As shown, the connector body 410 may include an insulating layer 417. The insulating layer 417 may be located on both sides of the wiring layer 416. That is, an insulating layer 417 is provided on one side of the wiring layer 416, and an insulating layer 417 is also provided on the other side of the wiring layer 416.

[0148] In some examples, the insulating layer 417 may have a second notch 4171. The second notch 4171 may be aligned with the first notch 4161. The first notch 4161 and the second notch 4171 together form a slot 413.

[0149] In some examples of embodiments of this application, the connector body 410 may be formed by stacking and fastening insulating layer 417, wiring layer 416, and insulating layer 417 together.

[0150] In some examples, the wiring layer 416 can be fabricated by stamping.

[0151] In some examples, the insulating layer 417 can be manufactured by stamping.

[0152] In some examples, the insulating layer 417, the wiring layer 416, and the insulating layer 417 can be stacked and snapped together to form the connector body 410.

[0153] In some examples, the stacking and fastening method of insulating layer 417, wiring layer 416, and insulating layer 417 may be the same as, similar to, or similar to the stacking and fastening method of memory module connector 400 in related technologies. This application embodiment will not elaborate on this.

[0154] In this embodiment, a first notch 4161 is opened in the wiring layer 416, and a first trace 414 and a second trace 415 are arranged in the wiring layer 416, which facilitates the arrangement of the first trace 414 and the second trace 415. An insulating layer 417 is provided on both sides of the wiring layer 416, and a second notch 4171 is opened in the insulating layer 417. The second notch 4171 and the first notch 4161 form a slot 413, which facilitates the processing and forming of the connector body 410, facilitates the setting of the slot 413, and improves the processing efficiency of the connector body 410.

[0155] Figure 6 This is a top view of a memory module connector provided in some embodiments of this application. It should be noted that the memory module connector 400 has multiple layers. Figure 6 The dashed line in the middle represents the omitted part, that is to say... Figure 7 Not all layers of memory module 400 are shown in the text.

[0156] Generally, the memory module 300 typically has multiple pins, which are arranged along the length of the memory module 300. Therefore, refer to... Figure 6 As shown, in some examples of embodiments of this application, the wiring layer 416 may include multiple layers. Each wiring layer 416 in the multi-layer wiring layer 416 has an insulating layer 417 on both sides.

[0157] In some examples, the number of routing layers 416 can be set according to the number of pins of memory module 300.

[0158] In some examples, the memory module 300 is described as having 288 pins. Since the memory module 300 has pins on both sides, the number of pins on one side of the memory module 300 is 144.

[0159] In some examples, the number of routing layers 416 can be 144.

[0160] In some examples, the springs securing the memory module 300 within slot 413 are typically metal springs. For ease of setup, these springs securing the memory module 300 can be configured as routing layers 416. Therefore, in some examples, the number of routing layers 416 can be 147.

[0161] In some examples, an insulating layer 417 can be placed between two adjacent routing layers 416. With 146 gaps between 147 routing layers 416, 146 insulating layers 417 can be placed. Additionally, an insulating layer 417 can be placed outside the two outermost routing layers 416. The number of insulating layers 417 can be 148.

[0162] In some examples, 148 insulating layers 417 and 147 wiring layers 416 can be formed by stamping. Then, they are arranged and assembled in the manner of one insulating layer 417, one wiring layer 416, and one insulating layer 417 to form the connector body 410.

[0163] By setting up multiple routing layers 416, the traces on the multiple routing layers 416 are connected to multiple pins on the memory module 300. Each routing layer 416 has an insulating layer 417 on both sides, which can prevent mutual interference between the traces of each routing layer 416 and facilitate signal transmission.

[0164] Figure 7 This is a schematic diagram of the structure of the memory module connector and the board connector provided in some embodiments of this application.

[0165] In some examples, as described in the foregoing embodiments of this application, the first sidewall 411 of the connector body 410 can be directly connected to the motherboard 100. For example, the first sidewall 411 can be connected to the motherboard 100 by soldering.

[0166] In some examples, the first sidewall 411 can be fixedly connected to the mainboard 100 by bolts, screws, threaded rods, etc.

[0167] Of course, in some examples, the first sidewall 411 can be snapped together with the motherboard 100.

[0168] In some examples, to facilitate maintenance of the memory module, the connector body 410 and the memory module 300 are easily detached from the motherboard 100. (See reference...) Figure 7 As shown, the memory module connector 400 can be connected to the motherboard 100 via the board-end connector 420. The board-end connector 420 can be configured to connect to the motherboard 100.

[0169] In some instances, the board-end connector 420 can be soldered to the motherboard 100.

[0170] In some examples, the board-end connector 420 can be connected to the motherboard 100 via bolts, screws, or threaded rods.

[0171] In some examples, the board-end connector 420 can be snapped into the motherboard 100.

[0172] In some examples, refer to Figure 7 As shown, the board-end connector 420 may have connection terminals 421. Connection terminals 421 may be configured to connect to a first trace 414 and a second trace 415 of the first sidewall 411. For example, there may be multiple connection terminals 421, with the first trace 414 connected to the first connection terminal 421 and the second trace 415 connected to the second connection terminal 421.

[0173] In some examples, refer to Figure 7 As shown, there can be 16 slots 413, and therefore 16 rows of connection terminals 421, with each row of connection terminals 421 corresponding to one slot 413. As described in detail in the foregoing embodiments of this application, each row of connection terminals 421 can have 144 connection terminals 421.

[0174] In some examples, refer to Figure 7 As shown, the connection terminal 421 may include a first sub-connection terminal 4211. The first sub-connection terminal 4211 may be connected to the first sub-trace 4141.

[0175] In some examples, refer to Figure 7 As shown, the connection terminal 421 may include a second sub-connection terminal 4212. The second sub-connection terminal 4212 may be connected to the second sub-trace 4142.

[0176] In this embodiment, a board-end connector 420 is provided to connect to the motherboard 100. The board-end connector 420 has a connection terminal 421, which can be connected to the first trace 414 and the second trace 415 of the first sidewall 411. This facilitates the connection and disconnection of the memory module connector 400 from the motherboard 100, facilitates the maintenance of the memory module, and reduces the maintenance cost of the memory module.

[0177] In some examples, refer to Figure 7 As shown, the board-end connector 420 may be provided with terminal contact springs 4213. The terminal contact springs 4213 may be configured to contact the first trace 414 and the second trace 415 of the first sidewall 411.

[0178] In some examples, the terminal contact spring 4213 may be located on the side of the board-end connector 420 facing the connector body 410. When the connector body 410 is mounted on the board-end connector 420, the terminal contact spring 4213 may connect to the first trace 414 and the second trace 415 on the first sidewall 411. This enables the connection between the memory module 300 and the motherboard 100.

[0179] In some examples of embodiments of this application, by providing a terminal contact spring 4213 in the board-end connector 420, the terminal contact spring 4213 is configured to contact the first trace 414 and the second trace 415 of the first sidewall 411. In this way, the stability of the electrical signal connection between the connector body 410 and the board-end connector 420 can be improved, and the stability of the connection between the memory module and the motherboard 100 can be improved.

[0180] In some examples, the board-end connector 420 may have a recess 422 on the side facing the connector body 410. The connector body 410 can be installed in the recess 422 to achieve connection with the motherboard 100.

[0181] In some examples, the terminal contact spring 4213 may be located within the groove 422. In this way, the terminal contact spring 4213 can be protected by the sidewall of the groove 422.

[0182] In some examples of embodiments of this application, a groove 422 is provided on the side of the board connector 420 facing the connector body 410, and the terminal contact spring 4213 is disposed in the groove 422. In this way, the groove 422 can protect the terminal inlet and outlet spring, and can prevent the terminal contact spring 4213 from bending and deforming due to lateral force.

[0183] In some examples, continue to refer to Figure 7 As shown, when the connector body 410 is installed on the board-end connector 420, the first sidewall 411 can be located in the groove 422.

[0184] In some examples, one of the board-end connector 420 and the first sidewall 411 may be provided with a guide post 4221.

[0185] In some examples, the guide post 4221 may be disposed on the first sidewall 411. The guide post 4221 may be fixedly connected to the first sidewall 411. For example, the guide post 4221 may be welded to the first sidewall 411 after the multilayer wiring layer 416 and the insulating layer 417 are snapped together to form the connector body 410.

[0186] In some examples, the guide post 4221 may be located on the board-end connector 420. For example, the guide post 4221 may be located on the bottom wall of the recess 422.

[0187] In some examples, the other of the board-end connector 420 and the first sidewall 411 may be provided with a guide groove 4111. The guide post 4221 may be inserted into the guide groove 4111.

[0188] In some examples, when the guide post 4221 is located on the first sidewall 411, the guide groove 4111 may be formed on the bottom wall of the groove 422.

[0189] In some examples, where the guide post 4221 is located on the board end connector 420, the guide groove 4111 may be formed on the first sidewall 411.

[0190] In this embodiment, one of the board-end connector 420 and the first sidewall 411 is provided with a guide post 4221, and the other of the board-end connector 420 and the first sidewall 411 is provided with a guide groove 4111. Thus, when the connector body 410 is installed onto the board-end connector 420, the guide post 4221 can be inserted into the guide groove 4111, thereby facilitating the positioning and docking of the connector body and the board-end connector 420 and improving the installation efficiency of the connector body 410.

[0191] In some examples, the connector body 410 and the board-end connector 420 can be fixedly connected by screws, bolts or threaded rods.

[0192] In some examples, the connector body 410 and the board-end connector 420 can be engaged by a latch, thereby ensuring a stable connection between the connector body 410 and the board-end connector 420. For example, a latch can be provided on the board-end connector 420, which locks the connector body 410 after it has been installed on the board-end connector 420.

[0193] In some examples, refer to Figure 7 As shown, the board-end connector 420 may have solder balls 423 on the side facing away from the connector body 410. The solder balls can be connected to the connection terminals 421. The solder balls 423 can be configured to connect to the motherboard 100.

[0194] In some examples, the first sub-connection terminal 4211 can be connected to a solder ball 423. The second sub-connection terminal 4212 can be connected to a solder ball 423.

[0195] In this embodiment, solder balls 423 are provided on one side of the connector body 410 of the board-end connector 420, and the solder balls 423 are connected to the connection terminal 421. In this way, the board-end connector 420 can be connected to the motherboard 100 by soldering, which can improve the stability of the connection between the board-end connector 420 and the motherboard 100.

[0196] In some examples of embodiments of this application, the motherboard 100 may include a substrate. The substrate may be a printed circuit board (PCB). A CPU 200 may be disposed on the substrate.

[0197] The motherboard 100 may include the memory module connector 400 provided in the foregoing embodiments of this application, and the memory module connector 400 is connected to the substrate.

[0198] It is understood that in some examples of the embodiments of this application, the connection method between the memory module connector 400 and the substrate can be referred to the detailed description of the foregoing embodiments of this application, and will not be repeated in the embodiments of this application.

[0199] In addition, the motherboard 100 provided in some examples of the embodiments of this application has the same or corresponding technical features as the foregoing embodiments of this application, and therefore has the same or corresponding technical effects as the foregoing embodiments of this application. The embodiments of this application will not repeat these details.

[0200] In some examples, embodiments of this application also provide a computing device. The computing device may include the motherboard 100 provided in the foregoing embodiments of this application.

[0201] In some examples, the computing device may include a processor and a memory module 300.

[0202] In some examples, the processor and memory module 300 can be mounted on the motherboard 100. The memory module 300 can be mounted on the motherboard 100 via the memory module connector 400 described in detail in the foregoing embodiments of this application. The projection of the memory module 300 on the motherboard 100 can be offset from the processor. In this way, the memory module 300 will not obstruct the processor, facilitating the installation of the processor and the placement of the memory module 300.

[0203] The embodiments described above are merely specific embodiments of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made based on the technical solution of this application should be included within the scope of protection of this application.

Claims

1. A memory module connector, characterized in that, include: The connector body has a first sidewall and two second sidewalls. The extending directions of the first sidewall and the two second sidewalls intersect each other. The two second sidewalls are located opposite each other on both sides of the first sidewall, and the two second sidewalls are inclined towards the first sidewall. The first sidewall is configured to connect to the motherboard, and the dimensions of the two second sidewalls gradually decrease along the extending direction of the first sidewall in the direction away from the motherboard. The second sidewall has a plurality of slots configured for inserting memory modules. The plurality of slots are arranged side by side along the extending direction of the second sidewall. The memory module has multiple pins arranged along its length. The connector body includes multiple wiring layers and an insulating layer. The multiple wiring layers are stacked along the length of the memory module, and the insulating layer is disposed between adjacent wiring layers. The number of wiring layers is the same as the number of pins in the memory module. Each wiring layer has a first notch, and the insulating layer has a second notch. The first notch and the second notch form the slot. The first notch is used to connect with the pins of the memory module, and the length of the memory module intersects the extension direction of the first sidewall. A first slot among the plurality of slots is connected to a first trace, which is arranged in the trace layer and extends to the first notch and the first sidewall; a second slot among the plurality of slots is connected to a second trace, which is arranged in the trace layer and extends to the first notch and the first sidewall; the first slot and the second slot are any two adjacent slots among the plurality of slots; there is a first gap between the first slot and the second slot, and a second gap between the first trace and the second trace on the first sidewall, the second gap being smaller than the first gap, so that the motherboard space occupied by the traces corresponding to the plurality of slots connecting to the motherboard is smaller than the space occupied by the arrangement of the plurality of slots; the depth direction of the slot is consistent with the extension direction of the first sidewall or inclined relative to the extension direction of the first sidewall.

2. The memory module connector according to claim 1, characterized in that, Either the first trace or the second trace includes: The first sub-trace is connected to one side wall of the slot; The second sub-trace is connected to the other side wall of the slot; the first sub-trace and the second sub-trace have a third spacing on the first side wall, the third spacing being less than or equal to the opening width of the slot.

3. The memory module connector according to claim 1, characterized in that, There is a fourth spacing between the two second sidewalls on the side away from the first sidewall, and a fifth spacing between the two second sidewalls on the side connected to the first sidewall, wherein the fourth spacing is less than or equal to the fifth spacing.

4. The memory module connector according to any one of claims 1-3, characterized in that, The opening of the slot is tilted away from the first sidewall.

5. A motherboard, characterized in that, include: substrate; A board-end connector is connected to the substrate, and the board-end connector has connection terminals; The memory module connector according to any one of claims 1-4, wherein the first trace and the second trace of the first sidewall of the memory module connector are connected to the connection terminal.

6. The motherboard according to claim 5, characterized in that, The board-end connector is provided with terminal contact springs, which are in contact with the first trace and the second trace; And / or, The board-end connector has a groove on one side facing the connector body, the terminal contact spring is located in the groove, the first sidewall is located in the groove, one of the board-end connector and the first sidewall is provided with a guide post, the other of the board-end connector and the first sidewall is provided with a guide groove, and the guide post is inserted into the guide groove.

7. A computing device, characterized in that, The system includes the motherboard, processor, and memory module as described in claim 5 or 6, wherein the processor is disposed on the motherboard, the memory module is disposed in a slot of a memory module connector, and the projection of the memory module on the motherboard is offset from that of the processor.

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