Lightweight design method for flexible circuit boards in the aerospace field

Abstract

The present invention relates to the technical field of aerospace, and discloses a lightweight design method for flexible circuit boards in the aerospace field, including: planning the corresponding design constraints of the flexible circuit board, formulating the lightweight design index of the flexible circuit board; based on the lightweight design index, analyzing the optimized structural mode corresponding to the flexible circuit board, and evaluating the sensitive gradient between the multidimensional properties of the material and the optimized structural mode; querying the substrate preparation material corresponding to the flexible circuit board and its corresponding alternative substrate preparation material, calculating the sample equivalent mass density corresponding to the circuit board sample, and analyzing the mass distribution topological characteristics corresponding to the circuit board sample; calculating the flexural offset corresponding to the circuit board sample, and evaluating the internal force response performance corresponding to the circuit board sample; generating the lightweight design method corresponding to the flexible circuit board. The main purpose of the present invention is to solve the problem of poor lightweight design effect of flexible circuit boards in the aerospace field.

Description

Technical Field

[0001] The invention relates to a lightweight design method for a flexible circuit board in the aerospace field, belonging to the technical field of the aerospace field. Background Art

[0002] With the rapid development of aerospace technology, more stringent requirements are placed on the performance and weight of various electronic equipment. As an indispensable key component in aerospace equipment, the lightweight design of flexible circuit boards is extremely important. In current aerospace engineering, the design of flexible circuit boards often relies on traditional empirical methods and limited simulation analysis methods.

[0003] Typically, designers will first determine the materials and basic structure of flexible circuit boards based on general aerospace design specifications and experience from previous projects. In terms of material selection, they often refer to existing material databases and select common aerospace-grade circuit board materials, such as specific epoxy resin substrates and copper foils, without considering the potential advantages of new materials or material combinations. They simply pursue lightweighting without considering the performance of the circuit board after lightweighting, which results in the performance of the designed flexible circuit board not meeting the standards, and in turn leads to poor lightweight design effects of flexible circuit boards in the aerospace field. Summary of the invention

[0004] The present invention provides a lightweight design method for a flexible circuit board in the aerospace field, and its main purpose is to solve the problem that the lightweight design effect of the flexible circuit board in the aerospace field is not good.

[0005] To achieve the above object, the present invention provides a lightweight design method for a flexible circuit board in the aerospace field, comprising:

[0006] Obtain a flexible circuit board to be designed, query the aviation environment parameters and application performance requirements of the flexible circuit board in an aerospace application scenario, plan corresponding design constraints of the flexible circuit board based on the aviation environment parameters and the application performance requirements, and formulate lightweight design indicators of the flexible circuit board based on the design constraints;

[0007] Based on the lightweight design index, material index intrinsic parameters and index structural parameters of the flexible circuit board are collected, the material multidimensional properties corresponding to the material index intrinsic parameters are analyzed, based on the index structural parameters, the optimized structural mode corresponding to the flexible circuit board is analyzed, the sensitive gradient between the material multidimensional properties and the optimized structural mode is evaluated, and based on the sensitive gradient, the index priority sequence corresponding to the lightweight design index is determined;

[0008] Query the substrate preparation material corresponding to the flexible circuit board and the corresponding alternative substrate preparation material, combine the substrate preparation material and the alternative substrate preparation material, simulate and construct the flexible circuit board to obtain a circuit board sample, calculate the sample equivalent mass density corresponding to the circuit board sample, and analyze the mass distribution topological characteristics corresponding to the circuit board sample based on the sample equivalent mass density;

[0009] Collecting the beam bending load value of the circuit board sample, calculating the flexural offset corresponding to the circuit board sample based on the beam bending load value, and evaluating the internal force response performance corresponding to the circuit board sample by combining the flexural offset and the beam bending load value;

[0010] In combination with the mass distribution topological characteristics and the internal force response performance, the target lightweight preparation material is screened out from the matrix preparation material and the alternative matrix preparation material, and the lightweight design method corresponding to the flexible circuit board is generated based on the indicator priority sequence and the target lightweight preparation material.

[0011] Optionally, planning corresponding design constraints of the flexible circuit board based on the aviation environment parameters and the application performance requirements includes:

[0012] Performing data classification on the aviation environment parameters to obtain an environment data group;

[0013] Performing performance grading on the application performance requirements to obtain a performance requirement group;

[0014] Extracting correlation influencing factors between the environmental data group and the performance requirement group;

[0015] Extracting key factors from the associated influencing factors to obtain key design factors;

[0016] Based on the key design factors, corresponding design constraints of the flexible circuit board are planned.

[0017] Optionally, formulating lightweight design indicators of the flexible circuit board based on the design constraints includes:

[0018] Performing constraint analysis on the design constraint conditions to obtain constraint analysis information;

[0019] Calculating information entropy corresponding to the constraint resolution information, and filtering out key constraint information in the constraint resolution information based on the information entropy;

[0020] Performing semantic analysis on the key constraint information to obtain constraint information semantics, and calculating semantic association between the constraint information semantics;

[0021] Based on the semantic association, extracting the semantic characters representing the semantics of the constraint information;

[0022] Based on the semantic representation characters, lightweight design indicators of the flexible circuit board are formulated.

[0023] Optionally, based on the lightweight design index, collecting material index intrinsic parameters and index structure parameters of the flexible circuit board includes:

[0024] Querying the lightweight design requirements corresponding to the lightweight design indicators, and collecting material indicator data and indicator structure data of the flexible circuit board based on the lightweight design requirements;

[0025] Performing data cleaning processing on the material index data and the index structure data respectively to obtain target material index data and target index structure data;

[0026] Respectively performing quality optimization processing on the target material index data and the target index structure data to obtain optimized material index data and optimized index structure data;

[0027] Extracting index parameters from the optimized material index data, performing feature extraction on the index main parameters, and obtaining material index intrinsic parameters;

[0028] Extracting the structural features corresponding to each indicator in the optimization indicator structure data to obtain the indicator structure features;

[0029] The indicator structure characteristics are quantified to obtain indicator structure parameters.

[0030] Optionally, the evaluating the sensitivity gradient between the multi-dimensional property of the material and the optimized structural mode includes:

[0031] Quantifying the multidimensional properties of the material to obtain multidimensional property values;

[0032] Screening key structural modes in the optimized structural modes, and extracting performance modal information about the flexible circuit board in the key structural modes;

[0033] Designing a multidimensional attribute modal set of the flexible circuit board based on the multidimensional attribute value and the performance modal information;

[0034] Constructing a circuit board finite element model corresponding to the flexible circuit board, inputting the multivariate attribute modal set into the circuit board finite element model in sequence, and using the circuit board finite element model to analyze the structural response set of the flexible circuit board under different sets in the multivariate attribute modal set;

[0035] Based on the structural response set, calculating the modal change rate of the optimized structural mode under the multi-dimensional properties of the material;

[0036] Based on the modal change rate, the sensitivity gradient between the multi-dimensional material property and the optimized structural mode is evaluated.

[0037] Optionally, the calculating the sample equivalent mass density corresponding to the circuit board sample includes:

[0038] Querying the matrix component density and the sample preparation process corresponding to the circuit board sample, and determining the matrix component volume of the sample matrix in the circuit board sample based on the sample preparation process;

[0039] Combining the matrix component density and the matrix component volume, the sample equivalent mass density corresponding to the circuit board sample can be calculated by the following formula:

[0040]

[0041] Among them, A represents the sample equivalent mass density corresponding to the circuit board sample, represents the density corresponding to the ath component in the matrix component density, It represents the volume corresponding to the ath component in the matrix component volume, a represents the matrix component serial number, and q represents the number of matrix components.

[0042] Optionally, analyzing the mass distribution topological characteristics corresponding to the circuit board sample based on the sample equivalent mass density includes:

[0043] Performing gridding processing on the circuit board sample to obtain a gridded sample;

[0044] Based on the sample equivalent mass density, the gridded sample is assigned a value to obtain a density grid sample;

[0045] Performing interpolation and smoothing processing on the density grid samples to obtain smoothed density grid samples;

[0046] The mass distribution topological structure of the smooth density grid sample is identified, and features are extracted from the mass distribution topological structure to obtain mass distribution topological features corresponding to the circuit board sample.

[0047] Optionally, the calculating the deflection offset corresponding to the circuit board sample based on the beam bending load value includes:

[0048] Measuring the sample cross-sectional width and sample cross-sectional height of the circuit board sample, and measuring the sample beam length corresponding to the circuit board sample;

[0049] Determine the morphological strain value corresponding to the beam bending load value, and calculate the sample elastic modulus corresponding to the circuit board sample by combining the beam bending load value and the morphological strain value;

[0050] Combining the beam bending load value, the sample cross-sectional width, the sample cross-sectional height, the sample elastic modulus and the sample beam length, the deflection offset corresponding to the circuit board sample is calculated by the following formula:

[0051]

[0052] Where F represents the deflection offset corresponding to the circuit board sample, represents the beam bending load value, G represents the sample beam length, E represents the sample elastic modulus, b represents the sample section width, and L represents the sample section height.

[0053] Optionally, the combining the flexure offset and the beam bending load value to evaluate the internal force response performance corresponding to the circuit board sample includes:

[0054] Locating an offset position point of the deflection offset in the circuit board sample, and querying a standard offset corresponding to the offset position point;

[0055] The position contribution of the offset position point in the circuit board sample is evaluated, and the internal force response performance index corresponding to the circuit board sample is calculated by combining the position contribution, the standard offset and the flexure offset through the following formula:

[0056]

[0057] Among them, H represents the internal force response performance index corresponding to the circuit board sample, Indicates the position contribution corresponding to the dth position point in the offset position point, Indicates the deflection offset of the dth position point in the offset position point, represents the standard offset of the dth position point in the offset position points, d represents the sequence number of the offset position point, and r represents the number of offset position points;

[0058] Based on the internal force response performance index, the internal force response performance corresponding to the circuit board sample is evaluated.

[0059] Optionally, evaluating the position contribution of the offset position point in the circuit board sample includes:

[0060] Detecting circuit board components in the circuit board sample, determining core components in the circuit board components, and analyzing device functional attributes corresponding to the core components;

[0061] Calculating a distance parameter between the offset position point and the core device;

[0062] Analyze the location area function corresponding to the offset location point, and calculate the functional contribution corresponding to the offset location point by combining the device functional attributes and the location area function;

[0063] The position contribution of the offset position point in the circuit board sample is evaluated by combining the distance parameter and the functional contribution.

[0064] A lightweight design system for flexible circuit boards in the aerospace field, the system comprising:

[0065] A lightweight design index formulation module is used to obtain a flexible circuit board to be designed, query the aviation environment parameters and application performance requirements of the flexible circuit board in an aerospace application scenario, plan the corresponding design constraints of the flexible circuit board based on the aviation environment parameters and the application performance requirements, and formulate the lightweight design index of the flexible circuit board based on the design constraints;

[0066] An indicator priority sequence determination module is used to collect material indicator intrinsic parameters and indicator structural parameters of the flexible circuit board based on the lightweight design indicator, analyze the material multidimensional properties corresponding to the material indicator intrinsic parameters, analyze the optimized structural mode corresponding to the flexible circuit board based on the indicator structural parameters, evaluate the sensitive gradient between the material multidimensional properties and the optimized structural mode, and determine the indicator priority sequence corresponding to the lightweight design indicator based on the sensitive gradient;

[0067] A mass distribution topological feature analysis module is used to query the substrate preparation material corresponding to the flexible circuit board and the corresponding alternative substrate preparation material, combine the substrate preparation material and the alternative substrate preparation material, simulate and construct the flexible circuit board to obtain a circuit board sample, calculate the sample equivalent mass density corresponding to the circuit board sample, and analyze the mass distribution topological feature corresponding to the circuit board sample based on the sample equivalent mass density;

[0068] An internal force response performance evaluation module is used to collect the beam bending load value of the circuit board sample, calculate the flexural offset corresponding to the circuit board sample based on the beam bending load value, and evaluate the internal force response performance corresponding to the circuit board sample in combination with the flexural offset and the beam bending load value;

[0069] A lightweight design module is used to combine the mass distribution topological characteristics and the internal force response performance, screen out a target lightweight preparation material from the matrix preparation material and the alternative matrix preparation material, and generate a lightweight design method corresponding to the flexible circuit board based on the indicator priority sequence and the target lightweight preparation material.

[0070] Compared with the problems described in the background technology, the present invention plans the corresponding design constraints of the flexible circuit board based on the aviation environment parameters and the application performance requirements, so as to understand the constraints of the flexible circuit board in aerospace applications, and provide a basis for the subsequent lightweight design indicators of the flexible circuit board. The present invention collects the material index intrinsic parameters and index structure parameters of the flexible circuit board based on the lightweight design indicators, so as to comprehensively and accurately grasp the initial state of the flexible circuit board in terms of materials and structure, provide accurate basic data for subsequent optimization, and analyze the multi-dimensional properties of the material corresponding to the intrinsic parameters of the material index. Analyzing the multi-dimensional properties of the material helps to deeply understand the comprehensive performance potential of the material, so as to more specifically select suitable materials in the harsh environment of aerospace and achieve a balance between performance and lightweight. The present invention can obtain a circuit board sample by simulating and constructing the flexible circuit board, which is convenient for subsequent related analysis Processing, calculating the sample equivalent mass density corresponding to the circuit board sample, can intuitively understand the mass distribution of the circuit board sample, and provide an important basis for the subsequent analysis of the mass distribution topological characteristics corresponding to the circuit board sample. The present invention calculates the flexural offset corresponding to the circuit board sample based on the beam bending load value, and can use the flexural offset to understand the deformation degree of the circuit board under actual working conditions in advance, which provides an important basis for the subsequent evaluation of the internal force response performance corresponding to the circuit board sample. The present invention combines the mass distribution topological characteristics and the internal force response performance to select the target lightweight preparation material from the matrix preparation material and the replacement matrix preparation material, and can accurately select the target lightweight preparation material that meets the mass distribution topological requirements and has good internal force response performance, which helps to optimize the product structure of the flexible circuit board, improve the stability and reliability of the flexible circuit board, and reduce material costs and product weight. Therefore, the lightweight design method for flexible circuit boards in the aerospace field proposed in the present invention improves the lightweight design effect of flexible circuit boards in the aerospace field. BRIEF DESCRIPTION OF THE DRAWINGS

[0071] Figure 1 A schematic flow chart of a lightweight design method for a flexible circuit board in the aerospace field provided by an embodiment of the present invention;

[0072] Figure 2 A functional module diagram for implementing the lightweight design system for flexible circuit boards in the aerospace field provided by one embodiment of the present invention.

[0073] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments. DETAILED DESCRIPTION

[0074] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0075] The embodiment of the present application provides a lightweight design method for flexible circuit boards in the aerospace field. The execution subject of the lightweight design method for flexible circuit boards in the aerospace field includes but is not limited to at least one of the electronic devices such as a server and a terminal that can be configured to execute the method provided by the embodiment of the present application. In other words, the lightweight design method for flexible circuit boards in the aerospace field can be executed by software or hardware installed in a terminal device or a server device. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc.

[0076] Embodiment 1:

[0077] Reference Figure 1 FIG. 1 is a flow chart of a lightweight design method for a flexible circuit board in the aerospace field provided by an embodiment of the present invention. In this embodiment, the lightweight design method for a flexible circuit board in the aerospace field includes:

[0078] S1. Obtain the flexible circuit board to be designed, query the aviation environmental parameters and application performance requirements of the flexible circuit board in the aerospace application scenario, plan the corresponding design constraints of the flexible circuit board based on the aviation environmental parameters and the application performance requirements, and formulate the lightweight design indicators of the flexible circuit board based on the design constraints.

[0079] The present invention plans the corresponding design constraints of the flexible circuit board based on the aviation environment parameters and the application performance requirements, thereby understanding the constraints of the flexible circuit board in aerospace applications and providing a basis for the subsequent lightweight design indicators of the flexible circuit board.

[0080] It should be explained that the flexible circuit board is a circuit board made of a flexible substrate with bendable and rollable properties. It is widely used in various parts of aerospace equipment with complex shapes, limited space and weight sensitivity. The aviation environmental parameters cover a variety of physical conditions in the operation of aerospace, such as extreme temperature ranges (from near absolute zero in the space environment to high temperature on the surface of the aircraft during high-speed flight), air pressure changes (from ground pressure to high-altitude low-pressure environment), humidity fluctuations (humidity differences in different flight altitudes and regions), strong vibration frequencies and amplitudes (vibrations generated during takeoff, flight, and landing of aircraft), high acceleration conditions (acceleration during spacecraft launch and maneuvering flight) and complex electromagnetic environments (electromagnetic interference generated by various electronic devices and space radiation), etc. The application performance requirements include electrical performance, such as high-speed and stable signal transmission speed, high anti-interference ability to ensure accurate data transmission, and the design constraints refer to the various limiting factors encountered when designing flexible circuit boards. Further, the aviation environmental parameters and application performance requirements of the flexible circuit boards in aerospace application scenarios can be obtained by querying the equipment technical specification database provided by aerospace equipment manufacturers.

[0081] In detail, the planning of the corresponding design constraints of the flexible circuit board based on the aviation environment parameters and the application performance requirements includes:

[0082] Performing data classification on the aviation environment parameters to obtain an environment data group;

[0083] Performing performance grading on the application performance requirements to obtain a performance requirement group;

[0084] Extracting correlation influencing factors between the environmental data group and the performance requirement group;

[0085] Extracting key factors from the associated influencing factors to obtain key design factors;

[0086] Based on the key design factors, corresponding design constraints of the flexible circuit board are planned.

[0087] It should be explained that the environmental data group is a data set that divides aviation environmental parameters into categories such as temperature, air pressure, humidity, vibration, and electromagnetic; the performance requirement group is a set of requirements that classifies application performance requirements according to electrical, mechanical, thermal and other performance aspects; the associated influencing factors refer to the factors that interact and restrict each other between aviation environmental parameters and application performance requirements. For example, high temperature environment will affect the electrical and mechanical properties of circuit board materials, while high vibration environment will place higher requirements on the mechanical structure strength and connection reliability of circuit boards; the key design factors are factors that play a decisive role in the design of flexible circuit boards extracted from the associated influencing factors. For example, in a high temperature and high vibration environment, the thermal expansion coefficient and elastic modulus of the material become key factors.

[0088] Furthermore, the data classification of the aviation environmental parameters can be achieved through a data clustering algorithm; the performance grading of the application performance requirements can be achieved through an expert evaluation method; based on the environmental data group and the performance requirement group, the correlation data between the two is analyzed, and the correlation influencing factors are extracted from the correlation data, for example, by establishing an environment-performance impact matrix to intuitively find out the interrelated factors; the key factor extraction of the correlation influencing factors can be achieved through a hierarchical analysis method; based on the design key factors, the corresponding design constraints of the flexible circuit board are planned. If the key factors involve space limitations, the maximum size and minimum bending radius of the circuit board are set. For example, when the flexible circuit board needs to be installed in a small space of aerospace equipment, the maximum length, width and thickness of the circuit board are determined according to the shape of the space and the size of the available space. At the same time, the minimum bending radius is set according to the bending requirements of the installation location to ensure that the circuit board can be installed smoothly and work normally.

[0089] The present invention formulates lightweight design indicators for the flexible circuit board based on the design constraints, thereby accurately guiding the material selection and structural optimization of the flexible circuit board, effectively reducing the weight of the flexible circuit board while meeting the stringent requirements of aerospace, improving the overall performance of the equipment, and reducing energy consumption. It should be explained that the lightweight design indicators are the goal of optimizing the weight of the flexible circuit board.

[0090] In detail, the lightweight design index of the flexible circuit board is formulated based on the design constraints, including:

[0091] Performing constraint analysis on the design constraint conditions to obtain constraint analysis information;

[0092] Calculating information entropy corresponding to the constraint resolution information, and filtering out key constraint information in the constraint resolution information based on the information entropy;

[0093] Performing semantic analysis on the key constraint information to obtain constraint information semantics, and calculating semantic association between the constraint information semantics;

[0094] Based on the semantic association, extracting the semantic characters representing the semantics of the constraint information;

[0095] Based on the semantic representation characters, lightweight design indicators of the flexible circuit board are formulated.

[0096] It should be explained that the constraint analysis information is the specific restriction information on size, weight, performance, etc. obtained after a detailed interpretation of the design constraints. The information entropy is a quantitative indicator corresponding to the constraint analysis information that reflects its uncertainty and complexity. The key constraint information is the core restriction part of the constraint analysis information that has a decisive influence on the design of flexible circuit boards. The constraint information semantics is the intrinsic meaning and logical expression of the key constraint information. The semantic association indicates the degree of mutual connection between the semantics of the constraint information. The representation semantic characters are iconic characters in the constraint information semantics that can reflect key semantic features and key points.

[0097] Furthermore, the text parsing algorithm in natural language processing technology can be used to perform constraint parsing on the design constraints to obtain constraint parsing information; the information entropy corresponding to the constraint parsing information can be calculated by the Shannon entropy calculation formula, and the information of the same type in the constraint parsing information can be screened for information corresponding to the maximum value of the information entropy to obtain key constraint information; the key constraint information can be semantically parsed by a semantic analysis method to obtain constraint information semantics, and the semantic association between the constraint information semantics can be calculated by a cosine similarity algorithm; when the semantic association is greater than a preset threshold, the representation semantic characters in the constraint information semantics are extracted, and the preset threshold can be set to 0.8, or it can be set according to the actual application scenario; based on the representation semantic characters, the lightweight design indicators of the flexible circuit board are formulated, such as determining the target material density range according to the semantic characters representing the material density limit, and planning the outer dimensions and number of layers of the circuit board according to the semantic characters representing the structural size constraint.

[0098] S2. Based on the lightweight design index, the material index intrinsic parameters and index structural parameters of the flexible circuit board are collected, the material multidimensional properties corresponding to the material index intrinsic parameters are analyzed, based on the index structural parameters, the optimized structural mode corresponding to the flexible circuit board is analyzed, the sensitive gradient between the material multidimensional property and the optimized structural mode is evaluated, and based on the sensitive gradient, the index priority sequence corresponding to the lightweight design index is determined.

[0099] The present invention collects the material index intrinsic parameters and index structural parameters of the flexible circuit board based on the lightweight design index, so as to comprehensively and accurately grasp the initial state of the flexible circuit board in terms of material and structure, provide accurate basic data for subsequent optimization, and analyze the multi-dimensional properties of the material corresponding to the material index intrinsic parameters. Analyzing the multi-dimensional properties of the material helps to deeply understand the comprehensive performance potential of the material, so as to more specifically select suitable materials under the harsh environment of aerospace and achieve a balance between performance and lightweight. It should be explained that the material index intrinsic parameters include but are not limited to the material density, elastic modulus, Poisson's ratio, thermal conductivity, electrical conductivity, thermal expansion coefficient, dielectric constant and other parameters reflecting the inherent characteristics of the material, and the index structural parameters cover the basic parameters of the structure such as the original thickness, number of layers, line width and spacing, component size and position of the circuit board.

[0100] Specifically, based on the lightweight design index, collecting the material index intrinsic parameters and index structure parameters of the flexible circuit board includes:

[0101] Querying the lightweight design requirements corresponding to the lightweight design indicators, and collecting material indicator data and indicator structure data of the flexible circuit board based on the lightweight design requirements;

[0102] Performing data cleaning processing on the material index data and the index structure data respectively to obtain target material index data and target index structure data;

[0103] Respectively performing quality optimization processing on the target material index data and the target index structure data to obtain optimized material index data and optimized index structure data;

[0104] Extracting index parameters from the optimized material index data, performing feature extraction on the index main parameters, and obtaining material index intrinsic parameters;

[0105] Extracting the structural features corresponding to each indicator in the optimization indicator structure data to obtain the indicator structure features;

[0106] The indicator structure characteristics are quantified to obtain indicator structure parameters.

[0107] It should be explained that the lightweight design requirements are the specific criteria and limiting conditions set for the material and structural characteristics of the flexible circuit board in the aerospace application scenario corresponding to the lightweight design indicators in order to achieve the weight reduction goal. The material index data and the index structure data are respectively related data sets used to characterize the inherent characteristics of the material and the initial structural layout and parameters of the flexible circuit board. The target material index data and the target index structure data are respectively relatively accurate data subsets that conform to the basic logic after the material index data and the index structure data are removed from invalid data such as abnormal values ​​and error values. The optimized material index data and the optimized index structure data are respectively the data results of the target material index data and the target index structure data by further improving the data quality and integrity through operations such as supplementing missing values ​​and smoothing noise. The main index parameters are the key parameter combinations in the optimized material index data that can reflect the main information of the original data to the greatest extent and are independent of each other. The index structure characteristics are the quantitative attribute descriptions corresponding to each indicator in the optimized index structure data, which are extracted by a specific quantitative method and can concisely and accurately describe the characteristics of the structural morphology, layout, connection relationship, etc.

[0108] Furthermore, the lightweight design requirements corresponding to the lightweight design indicators can be queried by keyword retrieval and data screening in a pre-built aerospace lightweight design database. Based on the lightweight design requirements, the material indicator data and indicator structure data of the flexible circuit board can be collected by connecting with the authoritative material supplier database and mining the past successful aerospace circuit board design case library; the material indicator data and the indicator structure data can be cleaned separately by automated cleaning software based on data statistical rules and outlier judgment algorithms to obtain target material indicator data and target indicator structure data; the target material indicator data and target indicator structure data can be cleaned separately by using data interpolation algorithms, noise smoothing filters and other tools. The target material index data and the target index structure data are subjected to quality optimization processing to obtain optimized material index data and optimized index structure data; the index parameters in the optimized material index data can be extracted by a principal component analysis (PCA) algorithm, and the index parameters can be subjected to feature extraction by a feature extraction model based on deep learning (such as a convolutional neural network) to obtain material index intrinsic parameters; the structural features corresponding to each index in the optimized index structure data can be extracted by a morphological analysis method and a geometric feature extraction algorithm to obtain the index structure features; the index structure features can be quantified by using a structural parameter quantification model (such as a parameter calculation model based on finite element theory) to obtain the index structure parameters.

[0109] The present invention can comprehensively and deeply grasp the material characteristics by analyzing the multidimensional properties of the material corresponding to the intrinsic parameters of the material index. Based on the index structural parameters, the optimized structural modes corresponding to the flexible circuit board are analyzed, and the key structural response characteristics such as vibration, stress and strain of the flexible circuit board under actual working conditions can be accurately grasped. The sensitive gradient between the multidimensional properties of the material and the optimized structural modes is evaluated, which helps to clarify the key factors affecting the structural performance of the material properties, so as to adjust the material and structural parameters in a targeted manner in the lightweight design to achieve efficient and reliable lightweight goals.

[0110] It should be explained that the multidimensional properties of the material are the comprehensive characteristics of the intrinsic parameters of the material indicators in multiple dimensions such as mechanical properties, thermal properties, electrical properties, chemical properties and processing properties. The optimized structural mode is the key modal information such as natural frequency, vibration mode, stress distribution, etc. corresponding to the flexible circuit board under specific boundary conditions and working conditions obtained by finite element analysis and other means to reflect its structural dynamic response characteristics. The sensitive gradient represents the quantitative relationship between the rate of change and sensitivity of the structural modal response degree caused by the change of material property parameters between the multidimensional properties of the material and the optimized structural mode. The indicator priority sequence represents the lightweight The design indicators correspond to the order of importance for achieving the lightweight goal of flexible circuit boards. Furthermore, the multi-dimensional properties of the materials corresponding to the intrinsic parameters of the material indicators can be analyzed by predictive models constructed by algorithms such as neural networks and support vector machines. The model is trained and learned based on the existing massive material performance data, and can accurately analyze the properties of the material in multiple dimensions such as mechanics, thermal, electrical, chemical stability and processability; based on the indicator structure parameters, the optimized structural mode corresponding to the flexible circuit board can be analyzed by professional finite element analysis software; based on the level of the sensitive gradient, the indicator priority sequence corresponding to the lightweight design indicator is determined.

[0111] In detail, the evaluating the sensitivity gradient between the multi-dimensional properties of the material and the optimized structural mode includes:

[0112] Quantifying the multidimensional properties of the material to obtain multidimensional property values;

[0113] Screening key structural modes in the optimized structural modes, and extracting performance modal information about the flexible circuit board in the key structural modes;

[0114] Designing a multidimensional attribute modal set of the flexible circuit board based on the multidimensional attribute value and the performance modal information;

[0115] Constructing a circuit board finite element model corresponding to the flexible circuit board, inputting the multivariate attribute modal set into the circuit board finite element model in sequence, and using the circuit board finite element model to analyze the structural response set of the flexible circuit board under different sets in the multivariate attribute modal set;

[0116] Based on the structural response set, calculating the modal change rate of the optimized structural mode under the multi-dimensional properties of the material;

[0117] Based on the modal change rate, the sensitivity gradient between the multi-dimensional material property and the optimized structural mode is evaluated.

[0118] It should be explained that the multidimensional attribute value is the performance value of the multidimensional attribute of the material in different dimensions (such as mechanical, thermal, electrical and other dimensions) that is specifically quantified and presented; the key structural mode is the modal information in the optimized structural mode that has a key influence on the overall structural performance of the flexible circuit board and can reflect its core dynamic characteristics; the performance modal information is the key information in the key structural mode about the flexible circuit board that reflects its structural response characteristics, functional performance and interaction with the external environment under actual working conditions; the multivariate attribute modal set is the multi-dimensional, multi-type and interrelated data of the flexible circuit board that integrates the multidimensional attribute values ​​of the material and the performance modal information related to the key structural modal. The circuit board finite element model is a digital model corresponding to the flexible circuit board, which is constructed based on the finite element analysis method and simulates its various physical behaviors such as mechanics and thermals by discretizing the actual physical structure into finite elements and nodes. The structural response set is a result set of the circuit board finite element model analyzing the flexible circuit board under different sets in the multi-attribute modal set, such as stress distribution, strain, vibration frequency and displacement, which reflects its structural dynamic changes and stress state. The modal change rate is a quantitative representation of the speed of change of the structural modal characteristics (such as natural frequency, vibration mode, etc.) generated by the optimized structural mode under the multi-dimensional properties of the material as the attribute parameters of each dimension of the material change.

[0119] Furthermore, the multidimensional properties of the material can be quantified by using a quantitative algorithm based on physical models and statistical principles. For example, the specific values ​​of the mechanical and thermal properties of the material can be calculated based on the microstructural parameters of the material in combination with classical mechanics and thermodynamics equations. At the same time, the attribute data of different units and magnitudes can be converted into uniform and comparable dimensionless values ​​by using data normalization and standardization methods to obtain multidimensional attribute values. The key structural modes in the optimized structural modes can be screened by a screening method based on sensitivity analysis and principal component analysis (PCA), that is, the modes are ranked according to their sensitivity to the overall performance of the flexible circuit board, and the modes with high sensitivity are selected. At the same time, PCA is used to identify the key structural modes that affect the structural response. The modal feature vector that should contribute a large amount is then extracted and pattern recognized by performing feature extraction and pattern recognition on the dynamic response monitoring data of the flexible circuit board under actual working conditions to extract the performance modal information about the flexible circuit board in the key structural mode; based on the multidimensional attribute value and the performance modal information, the multivariate attribute modal set of the flexible circuit board can be designed by using the Latin hypercube sampling and full factorial experimental design techniques in the experimental design (DOE) method, combined with the analysis of the functional requirements and design constraints of the flexible circuit board, to ensure that the designed set can fully cover all possible material properties and structural modal combinations; the performance modal set can be designed by using professional finite element analysis software (such as ANSYS, ABA QUS, etc.) to construct a circuit board finite element model corresponding to the flexible circuit board, firstly create an accurate three-dimensional solid model according to the geometric shape and material distribution of the flexible circuit board, then reasonably mesh the model, select a suitable unit type and mesh size, and then set the corresponding material parameters according to the physical properties of the material, and input the multi-attribute modal set into the circuit board finite element model in sequence, and then run the finite element solver, set suitable boundary conditions and loading conditions, and use the circuit board finite element model to analyze the structural response set of the flexible circuit board under different sets in the multi-attribute modal set, including key response parameters such as stress, strain, displacement, and vibration frequency; based on The structural response set can calculate the modal change rate of the optimized structural mode under the multi-dimensional properties of the material by adopting mathematical calculation methods such as numerical difference method, least squares method fitting curve slope, etc., that is, analyzing the changes in structural modal parameters (such as natural frequency, vibration mode, etc.) when the material property parameters change slightly, and obtaining modal change rate data; based on the modal change rate, evaluate the sensitivity gradient between the multi-dimensional properties of the material and the optimized structural mode. If the modal change rate is above 80%, it means that the sensitivity gradient is high; if the modal change rate is between 60%-80%, it means that the sensitivity gradient is medium; if the modal change rate is below 60%, it means that the sensitivity gradient is low.

[0120] S3. Query the substrate preparation material corresponding to the flexible circuit board and its corresponding alternative substrate preparation material, combine the substrate preparation material and the alternative substrate preparation material to simulate and construct the flexible circuit board to obtain a circuit board sample, calculate the sample equivalent mass density corresponding to the circuit board sample, and based on the sample equivalent mass density, analyze the mass distribution topological characteristics corresponding to the circuit board sample.

[0121] The present invention can obtain a circuit board sample by simulating and constructing the flexible circuit board, which is convenient for subsequent related analysis and processing. The sample equivalent mass density corresponding to the circuit board sample is calculated, and the mass distribution of the circuit board sample can be intuitively understood, which provides an important basis for the subsequent analysis of the mass distribution topological characteristics of the circuit board sample. It should be explained that the substrate preparation material is the basic material originally designed and adopted for the flexible circuit board and has conventional performance. The alternative substrate preparation material is an alternative material that can replace the substrate preparation material corresponding to the flexible circuit board to meet specific needs. The circuit board sample is a model instance for analysis and research formed by the simulation construction of the flexible circuit board. The sample equivalent mass density is a quantitative indicator corresponding to the circuit board sample that reflects its mass distribution; further, the substrate preparation material corresponding to the flexible circuit board and the corresponding alternative substrate preparation material can be obtained by querying from a professional material science database, detailed product information of an electronic material supplier, and relevant industry technical literature; combined with the substrate preparation material and the alternative substrate preparation material, the flexible circuit board can be simulated and constructed by advanced electronic design automation (EDA) software.

[0122] In detail, the calculating the sample equivalent mass density corresponding to the circuit board sample includes:

[0123] Querying the matrix component density and the sample preparation process corresponding to the circuit board sample, and determining the matrix component volume of the sample matrix in the circuit board sample based on the sample preparation process;

[0124] Combining the matrix component density and the matrix component volume, the sample equivalent mass density corresponding to the circuit board sample can be calculated by the following formula:

[0125]

[0126] Among them, A represents the sample equivalent mass density corresponding to the circuit board sample, represents the density corresponding to the ath component in the matrix component density, It represents the volume corresponding to the ath component in the matrix component volume, a represents the matrix component serial number, and q represents the number of matrix components.

[0127] It should be explained that the matrix component density is a characteristic parameter of the ratio of the mass to volume of the material constituting the matrix part of the circuit board sample; the sample preparation process is a complete set of operation procedures corresponding to the circuit board sample for processing various materials into samples that meet the requirements through specific steps and methods; the matrix component volume is the size of the space occupied by the matrix part material of the circuit board sample in the entire sample structure; further, the query of the matrix component density and sample preparation process corresponding to the circuit board sample can be obtained from the Internet through human-computer interaction; based on the material usage record in the sample preparation process, the matrix component volume of the sample matrix in the circuit board sample is determined.

[0128] The present invention analyzes the mass distribution topological characteristics corresponding to the circuit board sample based on the equivalent mass density of the sample, thereby clearly understanding the distribution of the internal mass of the circuit board and accurately locating areas where stress concentration and weak performance may occur, so as to subsequently screen out target lightweight preparation materials from the matrix preparation material and the alternative matrix preparation material. It should be explained that the mass distribution topological characteristics are the representations of the mass distribution conditions at different internal positions corresponding to the circuit board sample.

[0129] In detail, the analyzing the mass distribution topological characteristics corresponding to the circuit board sample based on the sample equivalent mass density includes:

[0130] Performing gridding processing on the circuit board sample to obtain a gridded sample;

[0131] Based on the sample equivalent mass density, the gridded sample is assigned a value to obtain a density grid sample;

[0132] Performing interpolation and smoothing processing on the density grid samples to obtain smoothed density grid samples;

[0133] The mass distribution topological structure of the smooth density grid sample is identified, and features are extracted from the mass distribution topological structure to obtain mass distribution topological features corresponding to the circuit board sample.

[0134] It should be noted that the grid sample is a manifestation form of the circuit board sample after being divided into multiple grid units for subsequent analysis and processing. The density grid sample is a product obtained by assigning corresponding values to the grid units of the grid sample based on the equivalent mass density of the sample, so that the grid units have mass density attributes. The smoothed density grid sample is a presentation form in which the mass density distribution of the density grid sample is more continuous and smoother after interpolation and smoothing processing. The mass distribution topological structure is a result that can reflect the internal structure of the sample mass distribution, constructed based on the connection relationship and boundary characteristics of the regions with similar mass densities identified by topological analysis of the smoothed density grid sample.

[0135] Furthermore, the circuit board sample can be processed into a grid sample through a grid division algorithm (such as a finite element grid division algorithm, a spatial division algorithm based on octree, etc.); based on the equivalent mass density of the sample, the grid sample can be assigned values through a method of mapping the equivalent mass density value of the sample to the grid units according to certain rules (such as average distribution, weighted distribution, etc.) to obtain a density grid sample; the density grid sample can be interpolated and smoothed through an interpolation algorithm (such as bilinear interpolation, cubic spline interpolation, or Kriging interpolation, etc.) to obtain a smoothed density grid sample; the mass distribution topological structure of the smoothed density grid sample can be identified through a topological analysis software based on graph theory, and the mass distribution topological structure can be feature-extracted through a feature extraction algorithm (such as algorithms for calculating the area, perimeter, connectivity metric, etc. of topological regions) to obtain the mass distribution topological features corresponding to the circuit board sample.

[0136] S4. Collect the beam bending load values of the circuit board sample. Based on the beam bending load values, calculate the corresponding flexural offset of the circuit board sample, and evaluate the internal force response performance corresponding to the circuit board sample according to the flexural offset.

[0137] In the present invention, by calculating the corresponding flexural offset of the circuit board sample based on the beam bending load values, the deformation degree of the circuit board under actual working conditions can be understood in advance through the flexural offset, which provides an important basis for the subsequent evaluation of the internal force response performance corresponding to the circuit board sample. It should be noted that the beam bending load value is a quantitative value of the magnitude of the acting force when the circuit board sample undergoes bending deformation under an external acting force, reflecting the load situation that causes the beam structure to produce a bending effect on the circuit board under specific working conditions. Furthermore, the beam bending load values of the circuit board sample can be collected by conducting a standard mechanical loading experiment on the circuit board sample and using measuring tools such as strain gauges and displacement sensors to obtain the stress load values of the sample under different load conditions.

[0138] In detail, the calculating the deflection displacement corresponding to the circuit board sample based on the beam bending load value includes:

[0139] Measuring the sample cross-sectional width and sample cross-sectional height of the circuit board sample, and measuring the sample beam length corresponding to the circuit board sample;

[0140] Determine the morphological strain value corresponding to the beam bending load value, and calculate the sample elastic modulus corresponding to the circuit board sample by combining the beam bending load value and the morphological strain value;

[0141] Combining the beam bending load value, the sample cross-sectional width, the sample cross-sectional height, the sample elastic modulus and the sample beam length, the deflection offset corresponding to the circuit board sample is calculated by the following formula:

[0142]

[0143] Among them, F represents the deflection offset corresponding to the circuit board sample, q represents the beam bending load value, G represents the sample beam length, E represents the sample elastic modulus, b represents the sample cross-sectional width, and L represents the sample cross-sectional height.

[0144] It should be explained that the sample cross-sectional width and the sample cross-sectional height are two dimensional parameters used to measure the cross-sectional size of the circuit board sample on the cross-section perpendicular to its length direction; the sample beam length is the length dimension of the circuit board sample along the main force direction; the morphological strain value is a quantitative value of the degree of shape change of the circuit board sample due to bending deformation under the beam bending load value; the sample elastic modulus is a material characteristic parameter of the circuit board sample that measures the material's ability to resist elastic deformation.

[0145] Furthermore, the sample cross-sectional width and sample cross-sectional height of the circuit board sample can be measured by an online measuring tool, which is compiled by a programming language; the circuit board sample is simplified into a simply supported beam, and the length of the simply supported beam is measured to obtain the sample beam length; the deformation amount of the circuit board sample under the beam bending load value can be measured by an optical measurement method, and the morphological strain value obtained by calculating the difference between the deformation amounts is calculated, and the ratio between the beam bending load value and the morphological strain value is calculated to obtain the sample elastic modulus corresponding to the circuit board sample.

[0146] The present invention combines the flexural offset and the beam bending load value to evaluate the internal force response performance corresponding to the circuit board sample. The internal force response performance can be used to understand the ability and characteristics of the internal force of the circuit board sample to resist deformation, thereby laying an important basis for the screening of subsequent target lightweight preparation materials. It should be explained that the internal force response performance is the ability and characteristics of the internal force of the circuit board sample to resist deformation.

[0147] In detail, the combining of the deflection offset and the beam bending load value to evaluate the internal force response performance corresponding to the circuit board sample includes:

[0148] Locating an offset position point of the deflection offset in the circuit board sample, and querying a standard offset corresponding to the offset position point;

[0149] The position contribution of the offset position point in the circuit board sample is evaluated, and the internal force response performance index corresponding to the circuit board sample is calculated by combining the position contribution, the standard offset and the flexure offset through the following formula:

[0150]

[0151] Among them, H represents the internal force response performance index corresponding to the circuit board sample, Indicates the position contribution corresponding to the dth position point in the offset position point, Indicates the deflection offset of the dth position point in the offset position point, represents the standard offset of the dth position point in the offset position points, d represents the sequence number of the offset position point, and r represents the number of offset position points;

[0152] Based on the internal force response performance index, the internal force response performance corresponding to the circuit board sample is evaluated.

[0153] It should be explained that the offset position point is the specific position where the flexural offset occurs in the circuit board sample, the standard offset is the offset value that should appear under ideal conditions corresponding to the offset position point, the position contribution is the importance of the offset position point determined based on factors such as the impact on the overall performance of the circuit board, and the internal force response performance index represents a quantitative indicator of the comprehensive performance of the circuit board sample when subjected to internal forces. Furthermore, the offset position point of the flexural offset in the circuit board sample can be located by a laser displacement measuring device, and the standard offset corresponding to the offset position point can be queried through the circuit board standard performance database.

[0154] Further, as an optional embodiment of the present invention, the step of evaluating the position contribution of the offset position point in the circuit board sample includes:

[0155] Detecting circuit board components in the circuit board sample, determining core components in the circuit board components, and analyzing device functional attributes corresponding to the core components;

[0156] Calculating a distance parameter between the offset position point and the core device;

[0157] Analyze the location area function corresponding to the offset location point, and calculate the functional contribution corresponding to the offset location point by combining the device functional attributes and the location area function;

[0158] The position contribution of the offset position point in the circuit board sample is evaluated by combining the distance parameter and the functional contribution.

[0159] It should be explained that the circuit board device is the electronic component in the circuit board sample, the core device is the device in the circuit board device that plays a key role in the overall function of the circuit board, the device functional attributes are the functional characteristics and performance parameters corresponding to the core device, the distance parameter is the spatial interval value between the offset position point and the core device, the position area function is the role of the area where the offset position point is located in the overall function of the circuit board, and the functional contribution indicates the degree of influence of the offset position point on the overall function of the circuit board.

[0160] Furthermore, the circuit board components in the circuit board sample, such as optical lenses, can be detected by machine vision detection equipment; the core components of the circuit board components can be determined based on the signal flow direction of the circuit board components by analyzing the signal flow direction, and the device functional attributes corresponding to the core components can be analyzed by consulting the device technical manual; the distance parameter between the offset position point and the core component can be calculated by a geometric measurement algorithm based on coordinate positioning; the position of the offset position point can be marked by pre-dividing the circuit board area functions to determine the position area function; the correlation between the device functional attributes and the position area function can be calculated, and the correlation can be used as the functional contribution corresponding to the offset position point; the position contribution of the offset position point in the circuit board sample can be evaluated based on the values ​​of the distance parameter and the functional contribution, such as the closer the distance parameter, the more important the offset position point is, and the higher the functional contribution, the more important the function of the offset position point is, and the higher the position contribution corresponding to the offset position point is.

[0161] S5. In combination with the mass distribution topological characteristics and the internal force response performance, a target lightweight preparation material is screened out from the matrix preparation material and the alternative matrix preparation material, and a lightweight design method corresponding to the flexible circuit board is generated based on the indicator priority sequence and the target lightweight preparation material.

[0162] The present invention selects a target lightweight preparation material from the matrix preparation material and the substitute matrix preparation material by combining the mass distribution topological characteristics and the internal force response performance, and can accurately select the target lightweight preparation material that meets the mass distribution topological requirements and has good internal force response performance, which helps to optimize the product structure of the flexible circuit board, improve the stability and reliability of the flexible circuit board, and reduce material costs and product weight. It should be explained that the target lightweight preparation material is an ideal preparation material among the matrix preparation material and the substitute matrix preparation material that can meet the lightweight requirements of specific products and ensure the performance of use. Furthermore, combined with the rationality of the mass distribution topological characteristics and the quality of the internal force response performance, A target lightweight preparation material is screened out from the substrate preparation material and the alternative substrate preparation material; based on the indicator priority sequence and the target lightweight preparation material, a lightweight design method corresponding to the flexible circuit board is generated, and the key goals and key directions of the flexible circuit board in the lightweight design are clarified according to the indicator priority sequence, such as giving priority to reducing the thickness of the plate or selecting low-density materials, etc. Then, with the target lightweight preparation material as the core, the appropriate processing technology and key goals and key directions are determined according to its characteristics, such as using special etching technology to reduce the weight of copper foil, or designing a new hollow structure to reduce the amount of material used, while meeting the circuit function and mechanical performance requirements, thereby generating a flexible circuit board design method that takes into account both lightweight and practicality.

[0163] Compared with the problems described in the background technology, the present invention plans the corresponding design constraints of the flexible circuit board based on the aviation environment parameters and the application performance requirements, so as to understand the constraints of the flexible circuit board in aerospace applications, and provide a basis for the subsequent lightweight design indicators of the flexible circuit board. The present invention collects the material index intrinsic parameters and index structure parameters of the flexible circuit board based on the lightweight design indicators, so as to comprehensively and accurately grasp the initial state of the flexible circuit board in terms of materials and structure, provide accurate basic data for subsequent optimization, and analyze the multi-dimensional properties of the material corresponding to the intrinsic parameters of the material index. Analyzing the multi-dimensional properties of the material helps to deeply understand the comprehensive performance potential of the material, so as to more specifically select suitable materials in the harsh environment of aerospace and achieve a balance between performance and lightweight. The present invention can obtain a circuit board sample by simulating and constructing the flexible circuit board, which is convenient for subsequent related analysis Processing, calculating the sample equivalent mass density corresponding to the circuit board sample, can intuitively understand the mass distribution of the circuit board sample, and provide an important basis for the subsequent analysis of the mass distribution topological characteristics corresponding to the circuit board sample. The present invention calculates the flexural offset corresponding to the circuit board sample based on the beam bending load value, and can use the flexural offset to understand the deformation degree of the circuit board under actual working conditions in advance, which provides an important basis for the subsequent evaluation of the internal force response performance corresponding to the circuit board sample. The present invention combines the mass distribution topological characteristics and the internal force response performance to select the target lightweight preparation material from the matrix preparation material and the replacement matrix preparation material, and can accurately select the target lightweight preparation material that meets the mass distribution topological requirements and has good internal force response performance, which helps to optimize the product structure of the flexible circuit board, improve the stability and reliability of the flexible circuit board, and reduce material costs and product weight. Therefore, the lightweight design method for flexible circuit boards in the aerospace field proposed in the present invention improves the lightweight design effect of flexible circuit boards in the aerospace field.

[0164] Embodiment 2:

[0165] like Figure 2 1 is a functional module diagram of a lightweight design system for flexible circuit boards in the aerospace field, provided by one embodiment of the present invention.

[0166] The lightweight design system 100 for flexible circuit boards in the aerospace field of the present invention can be installed in an electronic device. According to the functions to be implemented, the lightweight design system 100 for flexible circuit boards in the aerospace field can include a lightweight design index formulation module 101, an index priority sequence determination module 102, a mass distribution topological feature analysis module 103, an internal force response performance evaluation module 104 and a lightweight design module 105. The module described in the present invention can also be referred to as a unit, which refers to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, which are stored in the memory of the electronic device.

[0167] In this embodiment, the functions of each module / unit are as follows:

[0168] The lightweight design index formulation module 101 is used to obtain a flexible circuit board to be designed, query the aviation environment parameters and application performance requirements of the flexible circuit board in an aerospace application scenario, plan the corresponding design constraints of the flexible circuit board based on the aviation environment parameters and the application performance requirements, and formulate the lightweight design index of the flexible circuit board based on the design constraints;

[0169] The indicator priority sequence determination module 102 is used to collect material indicator intrinsic parameters and indicator structural parameters of the flexible circuit board based on the lightweight design indicator, analyze the material multidimensional properties corresponding to the material indicator intrinsic parameters, analyze the optimized structural mode corresponding to the flexible circuit board based on the indicator structural parameters, evaluate the sensitive gradient between the material multidimensional properties and the optimized structural mode, and determine the indicator priority sequence corresponding to the lightweight design indicator based on the sensitive gradient;

[0170] The mass distribution topological feature analysis module 103 is used to query the substrate preparation material corresponding to the flexible circuit board and the corresponding alternative substrate preparation material, combine the substrate preparation material and the alternative substrate preparation material to simulate and construct the flexible circuit board to obtain a circuit board sample, calculate the sample equivalent mass density corresponding to the circuit board sample, and analyze the mass distribution topological feature corresponding to the circuit board sample based on the sample equivalent mass density;

[0171] The internal force response performance evaluation module 104 is used to collect the beam bending load value of the circuit board sample, calculate the flexural offset corresponding to the circuit board sample based on the beam bending load value, and evaluate the internal force response performance corresponding to the circuit board sample by combining the flexural offset and the beam bending load value;

[0172] The lightweight design module 105 is used to combine the mass distribution topological characteristics and the internal force response performance, screen out the target lightweight preparation material from the matrix preparation material and the alternative matrix preparation material, and generate a lightweight design method corresponding to the flexible circuit board based on the indicator priority sequence and the target lightweight preparation material.

[0173] In detail, each module described in the lightweight design system 100 for flexible circuit boards in the aerospace field described in the embodiment of the present application is used in the same manner as described above. Figure 1 The technical means described in the lightweight design method for flexible circuit boards in the aerospace field are the same and can produce the same technical effects, so they will not be repeated here.

[0174] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0175] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A lightweight design method for flexible circuit boards in the aerospace field, characterized in that: The method comprises: Obtain a flexible circuit board to be designed, query the aviation environment parameters and application performance requirements of the flexible circuit board in an aerospace application scenario, plan corresponding design constraints of the flexible circuit board based on the aviation environment parameters and the application performance requirements, and formulate lightweight design indicators of the flexible circuit board based on the design constraints; Based on the lightweight design index, material index intrinsic parameters and index structural parameters of the flexible circuit board are collected, the material multidimensional properties corresponding to the material index intrinsic parameters are analyzed, based on the index structural parameters, the optimized structural mode corresponding to the flexible circuit board is analyzed, the sensitive gradient between the material multidimensional properties and the optimized structural mode is evaluated, and based on the sensitive gradient, the index priority sequence corresponding to the lightweight design index is determined; Query the substrate preparation material corresponding to the flexible circuit board and the corresponding alternative substrate preparation material, combine the substrate preparation material and the alternative substrate preparation material, simulate and construct the flexible circuit board to obtain a circuit board sample, calculate the sample equivalent mass density corresponding to the circuit board sample, and analyze the mass distribution topological characteristics corresponding to the circuit board sample based on the sample equivalent mass density; Collecting the beam bending load value of the circuit board sample, the beam bending load value is a quantitative value of the force magnitude of the bending deformation of the circuit board sample when the circuit board sample is subjected to an external force, reflecting the load condition of the circuit board under a specific working condition that causes the beam structure to produce a bending effect; based on the beam bending load value, calculating the flexural offset corresponding to the circuit board sample; combining the flexural offset and the beam bending load value, evaluating the internal force response performance corresponding to the circuit board sample; In combination with the mass distribution topological characteristics and the internal force response performance, the target lightweight preparation material is screened out from the matrix preparation material and the alternative matrix preparation material, and the lightweight design method corresponding to the flexible circuit board is generated based on the indicator priority sequence and the target lightweight preparation material.

2. The lightweight design method for flexible circuit boards in the aerospace field according to claim 1, characterized in that: The planning of the corresponding design constraints of the flexible circuit board based on the aviation environment parameters and the application performance requirements includes: Performing data classification on the aviation environment parameters to obtain an environment data group; Performing performance grading on the application performance requirements to obtain a performance requirement group; Extracting correlation influencing factors between the environmental data group and the performance requirement group; Extracting key factors from the associated influencing factors to obtain key design factors; Based on the key design factors, corresponding design constraints of the flexible circuit board are planned.

3. The lightweight design method for flexible circuit boards in the aerospace field according to claim 1, characterized in that: The step of formulating lightweight design indicators of the flexible circuit board based on the design constraints includes: Performing constraint analysis on the design constraint conditions to obtain constraint analysis information; Calculating information entropy corresponding to the constraint resolution information, and filtering out key constraint information in the constraint resolution information based on the information entropy; Performing semantic analysis on the key constraint information to obtain constraint information semantics, and calculating semantic association between the constraint information semantics; Based on the semantic association, extracting the semantic characters representing the semantics of the constraint information; Based on the semantic representation characters, lightweight design indicators of the flexible circuit board are formulated.

4. The lightweight design method for flexible circuit boards in the aerospace field according to claim 1, characterized in that: The collecting of material index intrinsic parameters and index structure parameters of the flexible circuit board based on the lightweight design index includes: Querying the lightweight design requirements corresponding to the lightweight design indicators, and collecting material indicator data and indicator structure data of the flexible circuit board based on the lightweight design requirements; Performing data cleaning processing on the material index data and the index structure data respectively to obtain target material index data and target index structure data; Respectively performing quality optimization processing on the target material index data and the target index structure data to obtain optimized material index data and optimized index structure data; Extracting index parameters from the optimized material index data, performing feature extraction on the index parameters, and obtaining material index intrinsic parameters; Extracting the structural features corresponding to each indicator in the optimization indicator structure data to obtain the indicator structure features; The indicator structure characteristics are quantified to obtain indicator structure parameters.

5. The lightweight design method for flexible circuit boards in the aerospace field as claimed in claim 1, characterized in that: The step of evaluating the sensitivity gradient between the multi-dimensional material property and the optimized structural mode includes: Quantifying the multidimensional properties of the material to obtain multidimensional property values; Screening key structural modes in the optimized structural modes, and extracting performance modal information about the flexible circuit board in the key structural modes; Designing a multidimensional attribute modal set of the flexible circuit board based on the multidimensional attribute value and the performance modal information; Constructing a circuit board finite element model corresponding to the flexible circuit board, inputting the multivariate attribute modal set into the circuit board finite element model in sequence, and using the circuit board finite element model to analyze the structural response set of the flexible circuit board under different sets in the multivariate attribute modal set; Based on the structural response set, calculating the modal change rate of the optimized structural mode under the multi-dimensional properties of the material; Based on the modal change rate, the sensitivity gradient between the multi-dimensional material property and the optimized structural mode is evaluated.

6. The lightweight design method for flexible circuit boards in the aerospace field as claimed in claim 1, characterized in that: The calculating the sample equivalent mass density corresponding to the circuit board sample includes: Querying the matrix component density and the sample preparation process corresponding to the circuit board sample, and determining the matrix component volume of the sample matrix in the circuit board sample based on the sample preparation process; Combining the matrix component density and the matrix component volume, the sample equivalent mass density corresponding to the circuit board sample can be calculated by the following formula: Among them, A represents the sample equivalent mass density corresponding to the circuit board sample, represents the density corresponding to the ath component in the matrix component density, It represents the volume corresponding to the ath component in the matrix component volume, a represents the matrix component serial number, and q represents the number of matrix components.

7. The lightweight design method for flexible circuit boards in the aerospace field as claimed in claim 1, characterized in that: The analyzing the mass distribution topological characteristics corresponding to the circuit board sample based on the sample equivalent mass density includes: Performing gridding processing on the circuit board sample to obtain a gridded sample; Based on the sample equivalent mass density, the gridded sample is assigned a value to obtain a density grid sample; Performing interpolation and smoothing processing on the density grid samples to obtain smoothed density grid samples; The mass distribution topological structure of the smooth density grid sample is identified, and features are extracted from the mass distribution topological structure to obtain mass distribution topological features corresponding to the circuit board sample.

8. The lightweight design method for flexible circuit boards in the aerospace field as claimed in claim 1, characterized in that: The step of calculating the deflection offset corresponding to the circuit board sample based on the beam bending load value comprises: Measuring the sample cross-sectional width and sample cross-sectional height of the circuit board sample, and measuring the sample beam length corresponding to the circuit board sample; Determine the morphological strain value corresponding to the beam bending load value, and calculate the sample elastic modulus corresponding to the circuit board sample by combining the beam bending load value and the morphological strain value; Combining the beam bending load value, the sample cross-sectional width, the sample cross-sectional height, the sample elastic modulus and the sample beam length, the deflection offset corresponding to the circuit board sample is calculated by the following formula: Where F represents the deflection offset corresponding to the circuit board sample, represents the beam bending load value, G represents the sample beam length, E represents the sample elastic modulus, b represents the sample section width, and L represents the sample section height.

9. The lightweight design method for flexible circuit boards in the aerospace field as claimed in claim 1, characterized in that: The step of evaluating the internal force response performance of the circuit board sample in combination with the deflection offset and the beam bending load value includes: Locating an offset position point of the deflection offset in the circuit board sample, and querying a standard offset corresponding to the offset position point; The position contribution of the offset position point in the circuit board sample is evaluated, and the internal force response performance index corresponding to the circuit board sample is calculated by combining the position contribution, the standard offset and the flexure offset through the following formula: Among them, H represents the internal force response performance index corresponding to the circuit board sample, Indicates the position contribution corresponding to the dth position point in the offset position point, Indicates the deflection offset of the dth position point in the offset position point, represents the standard offset of the dth position point in the offset position points, d represents the sequence number of the offset position point, and r represents the number of offset position points; Based on the internal force response performance index, the internal force response performance corresponding to the circuit board sample is evaluated.

10. The lightweight design method for flexible circuit boards in the aerospace field as claimed in claim 9, characterized in that: The step of evaluating the position contribution of the offset position point in the circuit board sample includes: Detecting circuit board components in the circuit board sample, determining core components in the circuit board components, and analyzing device functional attributes corresponding to the core components; Calculating a distance parameter between the offset position point and the core device; Analyze the location area function corresponding to the offset location point, and calculate the functional contribution corresponding to the offset location point by combining the device functional attributes and the location area function; The position contribution of the offset position point in the circuit board sample is evaluated by combining the distance parameter and the functional contribution.

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