Corrosion equipment for wafer processing

Abstract

The invention relates to the technical field of wafer processing corrosion, and discloses wafer processing corrosion equipment which comprises a workbench and a supporting frame, the supporting frame is arranged at the bottom of the workbench and fixedly connected with the bottom of the workbench, a processing barrel is fixedly connected to the top of the workbench, the wafer processing corrosion equipment further comprises a processing device, the processing device is arranged in the processing barrel, and the processing barrel is fixedly connected with the supporting frame. The treatment device is used for carrying out corrosion treatment on a wafer needing to be subjected to corrosion processing, and the treatment device is fixedly connected with the inner wall of the treatment cylinder; the transfer device is arranged above the processing cylinder, the transfer device is used for driving the wafer to move to different processing positions, and the transfer device is fixed on the workbench through a support; the treatment device comprises a corrosion cylinder; and the corrosion cylinder is arranged in the treatment cylinder. According to the corrosion equipment for wafer processing, wafers can be conveniently and automatically driven to be transferred to different processing stations, and use is convenient.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing etching, in particular to an etching device for wafer processing. Background Art

[0002] Silicon carbide is a representative material of the third-generation semiconductors. It has a wide bandgap and high chemical inertness. It has important application value in the field of high-frequency and high-voltage devices. It has gradually been used in photovoltaics, new energy vehicles, smart grids and other fields, with excellent performance. During the processing of silicon carbide wafers, dislocation defects are prone to occur on the surface of silicon carbide. Such defects are not easy to detect. Since the dislocations will be corroded first, the corrosion method is usually used to judge the dislocation area of ​​the silicon carbide wafer.

[0003] However, the currently used etching equipment is not convenient for taking out and cleaning the wafer after etching, and the wafer is not convenient for being fully in contact with the etching solution during the etching process. Summary of the invention

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: an etching device for wafer processing, comprising a workbench and a support frame, wherein the support frame is arranged at the bottom of the workbench and fixedly connected to the bottom of the workbench, and a processing cylinder is fixedly connected to the top of the workbench, and further comprising:

[0005] A processing device, which is arranged inside the processing tube, and is used to perform etching treatment on the wafers that need to be etched, and the processing device is fixedly connected to the inner wall of the processing tube;

[0006] A transfer device, which is arranged above the processing cylinder and is used to drive the wafer to move to different processing positions. The transfer device is fixed on the workbench through a bracket;

[0007] The processing device comprises:

[0008] An etching cylinder, which is arranged inside the processing cylinder and is used to perform etching treatment on the wafer to be processed, and the etching cylinder is filled with an etching solution;

[0009] A cleaning cylinder, the cleaning cylinder is arranged inside the processing cylinder, and the cleaning cylinder is used to clean the wafer after the etching treatment;

[0010] The positioning frame is arranged inside the processing tube, and the bottom of the positioning frame is fixedly connected to the bottom of the inner wall of the processing tube. The positioning frame is used to fix the etching tube and the cleaning tube inside the processing tube, so as to automatically drive the wafer to be transferred to different processing stations, which is convenient to use.

[0011] Preferably, the cleaning cylinder includes a cylinder body, an arc-shaped guide rail is fixedly connected to one side of the inner wall of the cylinder, a side of the arc-shaped guide rail away from the inner wall of the cylinder is fixedly connected to a fixed seat through an electronic slider, a side of the fixed seat away from the arc-shaped guide rail is fixedly connected to a water spray assembly, a stirring assembly is penetrated and rotatably connected to the bottom of the inner wall of the cylinder, the bottom of the stirring assembly is located outside the cylinder body, a driving shaft of a driving motor is fixedly connected to the bottom of the stirring assembly, and the top of the driving motor is fixedly connected to the bottom of the cylinder body through a bracket. By combining the cleaning and rinsing operations, the surface of the chip can be cleaned more thoroughly and the cleaning effect is better.

[0012] Preferably, the side surface of the cylinder is fixedly connected to the side surface of the positioning frame, the stirring assembly is rotatably connected to the cylinder via a sealed bearing, and the interior of the cylinder below the water spray assembly is filled with cleaning water.

[0013] Preferably, the water spray assembly comprises a main water pipe, the side of the main water pipe is connected to an annular water pipe, the inner side wall of the annular water pipe is connected to a water spray nozzle, and the side of the annular water pipe is slidably connected to a supporting slideway via a slider.

[0014] Preferably, the side of the supporting slide away from the annular water pipe is fixed on the inner wall of the cylinder, the side of the main water pipe away from the annular water pipe is fixed on a fixed seat, and the bottom of the main water pipe is connected to an external water injection pump through a connecting pipe, so that the water nozzle can rinse the chips inside the transfer device from different positions and angles, avoiding dead corners during rinsing, and making the rinsing effect more thorough and comprehensive.

[0015] Preferably, the transfer device includes a transfer bracket, the top of the transfer bracket is fixedly connected to an electric rotating table, the rotating part of the electric rotating table is fixedly connected to the rotating bracket, the bottom of the rotating bracket is fixedly connected to a telescopic push rod, and the bottom of the telescopic push rod is fixedly connected to a placement device to facilitate the transfer of the chip.

[0016] Preferably, the bottom of the transfer bracket is fixedly connected to the top of the workbench, and the fixed part of the electric rotating table is fixedly connected to the transfer bracket.

[0017] Preferably, the placing device includes a placing base, a rotating motor is fixedly connected to the bottom of the placing base, a placing bracket is fixedly connected to the driving shaft of the rotating motor, a placing net cylinder is fixedly connected to the bottom of the placing bracket, a placing opening is opened on the side of the placing net cylinder, a plug is arranged inside the placing opening to avoid the situation where the fixed part is inconvenient to contact with the corrosion solution due to the fixed chip, and the corrosion is more comprehensive.

[0018] Preferably, the top of the placement base is fixedly connected to the bottom of the telescopic push rod, and the interior of the placement net cylinder is divided into multiple groups of placement spaces by multiple groups of net plates.

[0019] The present invention provides an etching device for wafer processing, which has the following beneficial effects:

[0020] 1. When using the etching equipment for wafer processing, the wafer is placed inside the transfer device, and the transfer device drives the wafer to move into the etching cylinder, and the etching cylinder etches the wafer inside the transfer device. After the etching process is completed, the transfer device drives the wafer to transfer to the cleaning cylinder, and the cleaning cylinder cleans the etched wafer. It is convenient to automatically drive the wafer to transfer to different processing stations, and it is convenient to use.

[0021] 2. The etching equipment for wafer processing, when the transfer device sends the wafer into the interior of the cleaning cylinder, first the wafer is sent into the cleaning water inside the cylinder for cleaning, and at the same time the driving motor drives the stirring component to rotate, the stirring component drives the cleaning water inside the cylinder to move, and the wafer is cleaned by the movement of the cleaning water. After cleaning is completed, the transfer device drives the wafer to rise inside the cleaning cylinder to a position directly facing the water spray component, and the wafer is rinsed by the water spray component to facilitate rinsing away the residual liquid on the wafer, and by combining the cleaning and rinsing operations, the surface of the wafer is cleaned more thoroughly and the cleaning effect is better.

[0022] 3. When the etching equipment for chip processing is in use, the external water injection pump sends cleaning water into the main water pipe through the connecting pipe. The cleaning water inside the main water pipe enters different annular water pipes respectively and is sprayed out through the water nozzles on the inner sides of the annular water pipes. The water nozzles spray the cleaning water onto the chips inside the transfer device to clean the chips. At the same time, the arc guide rail drives the fixed seat to move through the electronic slider, and the fixed seat drives the water spray assembly to slide along the inner wall of the cylinder, so that the water nozzle can rinse the chips inside the transfer device from different positions and angles, avoiding dead corners during rinsing and making the rinsing effect more thorough and comprehensive.

[0023] 4. When using the etching equipment for wafer processing, the wafer is placed inside the placement device, and then the electric rotating table drives the rotating bracket to rotate, the rotating bracket drives the telescopic push rod to rotate, and the telescopic push rod drives the placement device to rotate, so that the wafer inside can be transferred through the placement device. When transferred to the corresponding processing station, the placement device is driven down by extending the telescopic push rod, and the wafer inside the placement device can be sent to the corresponding processing device, which is convenient for transferring the wafer.

[0024] 5. The etching equipment for chip processing, when the placement device enters the interior of the etching cylinder and is immersed in the etching liquid, the placement bracket is driven to rotate by the rotating motor, the placement bracket drives the placement net cylinder to rotate, the placement net cylinder drives the chip inside it to rotate, when the chip rotates, it will slide inside the placement space under the resistance of the etching liquid and stick to the net plate, and the placement bracket is driven to rotate back and forth by the rotating motor, which can drive the chip to slide back and forth inside the placement space, so that the two sides of the chip are intermittently stuck to different net plates, so that both sides of the chip can be corroded by the etching solution, avoiding the situation that the fixed part is inconvenient to contact with the etching solution due to the fixed chip, and the etching is more comprehensive. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of the etching equipment for wafer processing of the present invention;

[0026] Figure 2 It is a schematic diagram of the structure of the processing device of the present invention;

[0027] Figure 3 This is a schematic diagram of the cleaning cylinder structure of the present invention;

[0028] Figure 4 This is a schematic diagram of the internal structure of the cleaning cylinder of the present invention;

[0029] Figure 5 It is a schematic diagram of the structure of the water spray assembly of the present invention;

[0030] Figure 6 It is a schematic diagram of the structure of the transfer device of the present invention;

[0031] Figure 7 This is a schematic diagram of the structure of the placement device of the present invention;

[0032] Figure 8 This is a schematic diagram of the internal structure of the net cylinder of the present invention.

[0033] In the figure: 1. workbench; 2. support frame; 3. treatment cylinder; 4. treatment device; 41. corrosion cylinder; 42. cleaning cylinder; 421. cylinder body; 422. arc guide rail; 423. fixed seat; 424. water spray assembly; 4241. main water pipe; 4242. annular water pipe; 4243. water spray nozzle; 4244. support slide; 425. stirring assembly; 426. driving motor; 43. positioning frame; 5. transfer device; 51. transfer bracket; 52. electric rotating table; 53. rotating bracket; 54. telescopic push rod; 55. placement device; 551. placement base; 552. rotating motor; 553. placement bracket; 554. placement net cylinder; 555. placement port; 556. plug. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] See also Figure 1-Figure 5 The present invention provides a technical solution to solve the problem that the currently used etching equipment is inconvenient to remove and clean the wafer after etching: an etching equipment for wafer processing, comprising a workbench 1 and a support frame 2, the support frame 2 is arranged at the bottom of the workbench 1 and fixedly connected to the bottom of the workbench 1, and a processing cylinder 3 is fixedly connected to the top of the workbench 1, and also includes:

[0036] The processing device 4 is arranged inside the processing tube 3, and is used to perform etching treatment on the wafers that need to be etched. The processing device 4 is fixedly connected to the inner wall of the processing tube 3;

[0037] A transfer device 5, which is arranged above the processing cylinder 3 and is used to drive the wafer to move to different processing positions. The transfer device 5 is fixed on the workbench 1 through a bracket;

[0038] The processing device 4 comprises:

[0039] An etching cylinder 41 is disposed inside the processing cylinder 3 and is used to perform etching treatment on the wafer to be processed. The etching cylinder 41 is filled with an etching solution.

[0040] A cleaning cylinder 42, which is disposed inside the processing cylinder 3 and is used to clean the wafer after the etching process;

[0041] A positioning frame 43, the positioning frame 43 is arranged inside the treatment tube 3, the bottom of the positioning frame 43 is fixedly connected to the bottom of the inner wall of the treatment tube 3, and the positioning frame 43 is used to fix the corrosion tube 41 and the cleaning tube 42 inside the treatment tube 3;

[0042] When in use, the wafer is placed inside the transfer device 5, and the transfer device 5 drives the wafer to move to the inside of the etching cylinder 41, and the etching cylinder 41 etches the wafer inside the transfer device 5. After the etching process is completed, the transfer device 5 drives the wafer to move to the inside of the cleaning cylinder 42, and the cleaning cylinder 42 cleans the etched wafer, which is convenient for automatically driving the wafer to be transferred to different processing stations, and is convenient to use;

[0043] The cleaning cylinder 42 includes a cylinder body 421, one side of the inner wall of the cylinder body 421 is fixedly connected with an arc guide rail 422, the side of the arc guide rail 422 away from the inner wall of the cylinder body 421 is fixedly connected with a fixing seat 423 through an electronic slider, the side of the fixing seat 423 away from the arc guide rail 422 is fixedly connected with a water spray assembly 424, the bottom of the inner wall of the cylinder body 421 is penetrated and rotatably connected with a stirring assembly 425, the bottom of the stirring assembly 425 is located outside the cylinder body 421, the bottom of the stirring assembly 425 is fixedly connected with a driving shaft of a driving motor 426, the top of the driving motor 426 is fixedly connected to the bottom of the cylinder body 421 through a bracket, the side of the cylinder body 421 is fixedly connected to the side of the positioning frame 43, the stirring assembly 425 and the cylinder body 421 are rotatably connected through a sealed bearing, and the position inside the cylinder body 421 below the water spray assembly 424 is filled with cleaning water;

[0044] When the transfer device 5 delivers the wafer into the cleaning cylinder 42, the wafer is first delivered into the cleaning water in the cylinder 421 for cleaning, and at the same time, the driving motor 426 drives the stirring assembly 425 to rotate, and the stirring assembly 425 drives the cleaning water in the cylinder 421 to move, and the wafer is cleaned by the movement of the cleaning water. After the cleaning is completed, the transfer device 5 drives the wafer to rise in the cleaning cylinder 42 to a position facing the water spray assembly 424, and the wafer is rinsed by the water spray assembly 424, so that the residual liquid on the wafer can be rinsed off. By combining the cleaning and rinsing operations, the surface of the wafer is cleaned more thoroughly and the cleaning effect is better.

[0045] The water spray assembly 424 includes a main water pipe 4241, a side of the main water pipe 4241 is connected to an annular water pipe 4242, an inner wall of the annular water pipe 4242 is connected to a water spray nozzle 4243, a side of the annular water pipe 4242 is slidably connected to a support slide 4244 through a slider, a side of the support slide 4244 away from the annular water pipe 4242 is fixed to the inner wall of the cylinder 421, a side of the main water pipe 4241 away from the annular water pipe 4242 is fixed to a fixing seat 423, and the bottom of the main water pipe 4241 is connected to an external water injection pump through a connecting pipe;

[0046] During use, the external water injection pump delivers cleaning water into the main water pipe 4241 through the connecting pipe. The cleaning water inside the main water pipe 4241 enters into different annular water pipes 4242 respectively, and is sprayed out through the water nozzle 4243 on the inner side of the annular water pipe 4242. The water nozzle 4243 sprays the cleaning water onto the wafer inside the transfer device 5, thereby cleaning the wafer. At the same time, the arc guide rail 422 drives the fixed seat 423 to move through the electronic slider, and the fixed seat 423 drives the water spray assembly 424 to slide along the inner wall of the cylinder 421, so that the water nozzle 4243 can rinse the wafer inside the transfer device 5 from different positions and angles, avoiding dead corners during rinsing and making the rinsing effect more thorough and comprehensive.

[0047] See also Figure 1-Figure 8 The present invention provides a technical solution to solve the problem that the currently used etching equipment is inconvenient to transfer wafers and the wafers are inconvenient to fully contact with the etching solution during the etching process: the transfer device 5 includes a transfer bracket 51, the top of the transfer bracket 51 is fixedly connected to an electric rotating table 52, the rotating part of the electric rotating table 52 is fixedly connected to a rotating bracket 53, the bottom of the rotating bracket 53 is fixedly connected to a telescopic push rod 54, the bottom of the telescopic push rod 54 is fixedly connected to a placing device 55, the bottom of the transfer bracket 51 is fixedly connected to the top of the workbench 1, and the fixed part of the electric rotating table 52 is fixedly connected to the transfer bracket 51;

[0048] When in use, the wafer is placed inside the placement device 55, and then the electric rotating table 52 drives the rotating bracket 53 to rotate, the rotating bracket 53 drives the telescopic push rod 54 to rotate, and the telescopic push rod 54 drives the placement device 55 to rotate, so that the wafer inside can be transferred through the placement device 55. When transferred to the corresponding processing station, the placement device 55 can be lowered by extending the telescopic push rod 54, so that the wafer inside the placement device 55 can be sent to the corresponding processing device, which is convenient for transferring the wafer;

[0049] The placing device 55 comprises a placing base 551, a rotating motor 552 is fixedly connected to the bottom of the placing base 551, a placing bracket 553 is fixedly connected to the driving shaft of the rotating motor 552, a placing net cylinder 554 is fixedly connected to the bottom of the placing bracket 553, a placing opening 555 is provided on the side of the placing net cylinder 554, a plug 556 is provided inside the placing opening 555, the top of the placing base 551 is fixedly connected to the bottom of the telescopic push rod 54, the inside of the placing net cylinder 554 is divided into a plurality of placing spaces by a plurality of net plates, the placing net cylinder 554 is columnar, and the placing net cylinder 554 is fixed on the placing bracket 553 with its axis kept horizontal;

[0050] After the placement device 55 enters the corrosion cylinder 41 and is immersed in the corrosion liquid, the placement bracket 553 is driven to rotate by rotating the motor 552, and the placement bracket 553 drives the placement net cylinder 554 to rotate, and the placement net cylinder 554 drives the chip inside it to rotate. When the chip rotates, it will slide inside the placement space under the resistance of the corrosion liquid and stick to the mesh plate. By rotating the motor 552 to drive the placement bracket 553 to rotate back and forth, the chip can be driven to slide back and forth inside the placement space, so that the two sides of the chip are intermittently stuck to different mesh plates, so that both sides of the chip can be corroded by the corrosion solution, avoiding the situation where the fixed part is inconvenient to contact with the corrosion solution due to the fixed chip, and the corrosion is more comprehensive.

[0051] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. An etching device for wafer processing, comprising a workbench (1) and a support frame (2), wherein the support frame (2) is arranged at the bottom of the workbench (1) and is fixedly connected to the bottom of the workbench (1), and a processing cylinder (3) is fixedly connected to the top of the workbench (1), characterized in that: Also includes: A processing device (4), the processing device (4) is arranged inside the processing tube (3), the processing device (4) is used to perform etching treatment on the wafer that needs to be etched, and the processing device (4) is fixedly connected to the inner wall of the processing tube (3); A transfer device (5), the transfer device (5) being arranged above the processing cylinder (3), the transfer device (5) being used to drive the wafer to move to different processing positions, the transfer device (5) being fixed on the workbench (1) via a bracket; The processing device (4) comprises: An etching cylinder (41), the etching cylinder (41) being arranged inside the processing cylinder (3), the etching cylinder (41) being used to perform etching treatment on a wafer to be processed, the etching cylinder (41) being filled with an etching solution; A cleaning cylinder (42), the cleaning cylinder (42) being arranged inside the processing cylinder (3), the cleaning cylinder (42) being used to clean the wafer after the etching treatment; A positioning frame (43), wherein the positioning frame (43) is arranged inside the treatment tube (3), and the bottom of the positioning frame (43) is fixedly connected to the bottom of the inner wall of the treatment tube (3), and the positioning frame (43) is used to fix the corrosion tube (41) and the cleaning tube (42) inside the treatment tube (3).

2. The etching equipment for wafer processing according to claim 1, characterized in that: The cleaning cylinder (42) comprises a cylinder body (421), one side of the inner wall of the cylinder body (421) is fixedly connected to an arc-shaped guide rail (422), the side of the arc-shaped guide rail (422) away from the inner wall of the cylinder body (421) is fixedly connected to a fixing seat (423) via an electronic slider, the side of the fixing seat (423) away from the arc-shaped guide rail (422) is fixedly connected to a water spraying assembly (424), a stirring assembly (425) penetrates through and is rotatably connected to the bottom of the inner wall of the cylinder body (421), the bottom of the stirring assembly (425) is located outside the cylinder body (421), the bottom of the stirring assembly (425) is fixedly connected to a driving shaft of a driving motor (426), and the top of the driving motor (426) is fixedly connected to the bottom of the cylinder body (421) via a bracket.

3. The etching equipment for wafer processing according to claim 2, characterized in that: The side of the cylinder (421) is fixedly connected to the side of the positioning frame (43), the stirring assembly (425) is rotatably connected to the cylinder (421) via a sealed bearing, and the interior of the cylinder (421) below the water spray assembly (424) is filled with cleaning water.

4. The etching equipment for wafer processing according to claim 2, characterized in that: The water spray assembly (424) comprises a main water pipe (4241), the side of the main water pipe (4241) is connected to an annular water pipe (4242), the inner wall of the annular water pipe (4242) is connected to a water spray nozzle (4243), and the side of the annular water pipe (4242) is slidably connected to a supporting slideway (4244) via a slider.

5. The etching equipment for wafer processing according to claim 4, characterized in that: The side of the supporting slide (4244) away from the annular water pipe (4242) is fixed to the inner wall of the cylinder (421), the side of the main water pipe (4241) away from the annular water pipe (4242) is fixed to the fixing seat (423), and the bottom of the main water pipe (4241) is connected to an external water injection pump through a connecting pipe.

6. The etching equipment for wafer processing according to claim 1, characterized in that: The transfer device (5) comprises a transfer bracket (51), the top of the transfer bracket (51) is fixedly connected to an electric rotating platform (52), the rotating part of the electric rotating platform (52) is fixedly connected to a rotating bracket (53), the bottom of the rotating bracket (53) is fixedly connected to a telescopic push rod (54), and the bottom of the telescopic push rod (54) is fixedly connected to a placement device (55).

7. The etching equipment for wafer processing according to claim 6, characterized in that: The bottom of the transfer bracket (51) is fixedly connected to the top of the workbench (1), and the fixed part of the electric rotating table (52) is fixedly connected to the transfer bracket (51).

8. The etching equipment for wafer processing according to claim 6, characterized in that: The placement device (55) comprises a placement base (551), the bottom of the placement base (551) is fixedly connected to a rotating motor (552), the driving shaft of the rotating motor (552) is fixedly connected to a placement bracket (553), the bottom of the placement bracket (553) is fixedly connected to a placement net cylinder (554), a placement opening (555) is provided on the side of the placement net cylinder (554), and a plug (556) is provided inside the placement opening (555).

9. The etching equipment for wafer processing according to claim 8, characterized in that: The top of the placement base (551) is fixedly connected to the bottom of the telescopic push rod (54), and the interior of the placement net cylinder (554) is divided into multiple groups of placement spaces by multiple groups of net plates.

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