Transfer port lining and reaction chamber device

Abstract

The invention discloses a wafer transfer opening lining and a reaction cavity device. The wafer transfer opening lining comprises a lining body, and an adjusting structure used for adjusting the uniformity of a flow field is arranged on the outer wall of the lining body. The reaction chamber device comprises a reaction chamber body and the wafer transfer opening lining, a reaction chamber is arranged in the reaction chamber body, the wafer transfer opening lining is arranged in the reaction chamber, and an annular air channel is formed between the inner side wall of the reaction chamber and the side wall of the groove of the wafer transfer opening lining. By means of the film conveying opening lining, the uniformity of a flow field can be improved, particulate matter pollution can be reduced, and then the film quality is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, and in particular to a film transfer port bushing and a reaction chamber device. Background Art

[0002] In the reaction chamber of semiconductor thin film equipment, ensuring the uniformity of the flow field is crucial to obtaining high-quality thin films. It is worth noting that the film transfer port and its accessories occupy about 15% to 30% of the effective volume inside the reaction chamber, and their location is close to the process reaction area, which makes them a key component in the reaction chamber. Therefore, the uniformity of the flow field in the film transfer port and its accessories is directly related to the quality of thin film generation and is an important indicator affecting the thin film process.

[0003] The film transfer port structure and accessory devices commonly used at present usually include a bushing with multiple holes to achieve temperature regulation and provide gas purge functions. However, since the position of the purge gas pipeline relative to the bushing is not centered but offset, the generated purge gas curtain fluid also presents an eccentric distribution. Such an arrangement will have an adverse effect on the uniformity of the overall fluid field in the reaction chamber, which may reduce the quality of the film. In addition, considering that the film transfer port is the only channel for the wafer to enter and exit the reaction chamber, the purge effect at this position not only requires flow field uniformity, but is also closely related to reducing particulate contamination. Poor purge may lead to an increase in the number of particles, thereby affecting the purity and performance of the film.

[0004] Therefore, it is necessary to design a new film transfer sleeve to improve the uniformity of the flow field and reduce particle contamination, thereby improving the film quality. Summary of the invention

[0005] The purpose of the present invention is to overcome the defects of the prior art and provide a film transfer port bushing and a reaction chamber device.

[0006] In order to solve the above technical problems, the purpose of the present invention is achieved through the following technical solutions: a transmission port bushing is provided, comprising: a bushing body, and an adjustment structure for adjusting the uniformity of the flow field is provided on the outer wall of the bushing body.

[0007] A further technical solution is as follows: a groove is provided on the outer wall of the bushing body, and the groove surrounds the side wall of the bushing body.

[0008] A further technical solution is as follows: the bushing body comprises a sheet-transmitting opening structure and a tail structure, the tail structure is connected to the sheet-transmitting opening structure, and the groove surrounds the side wall of the sheet-transmitting opening structure.

[0009] A further technical solution is as follows: a plurality of groups of purge holes with unevenly distributed apertures are arranged in the groove.

[0010] A further technical solution is that the apertures of the plurality of groups of purge holes increase in sequence along the extending direction of the groove.

[0011] A further technical solution is as follows: the width of the upper end surface of the groove is smaller than the width of the lower end surface of the groove.

[0012] A further technical solution is that a blocking strip is arranged on the upper end surface of the groove.

[0013] A further technical solution is as follows: one end of the baffle bar abuts against one end of the tail structure and the film transmission opening structure.

[0014] In addition, in order to overcome the defects of the prior art, the present invention also provides a reaction chamber device, characterized in that it includes a reaction chamber body and the above-mentioned film transmission port bushing, wherein a reaction chamber is provided in the reaction chamber body, the film transmission port bushing is placed in the reaction chamber, and an annular airway is formed between the inner side wall of the reaction chamber and the groove side wall of the film transmission port bushing.

[0015] A further technical solution is as follows: an air intake pipeline is provided in the reaction chamber body, and the air intake pipeline is communicated with the annular air passage.

[0016] The beneficial effects of the present invention compared with the prior art are as follows: the present invention adjusts the uniformity of the flow field by arranging an adjustment structure on the bushing body, specifically by arranging a plurality of groups of purge holes with non-uniformly distributed apertures on the groove, or by adopting a groove with an upper end face width smaller than a lower end face width, to adjust the uniformity of the flow field, thereby improving the uniformity of the flow field and reducing particulate pollution, thereby improving the quality of the film.

[0017] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0019] Figure 1 A schematic diagram of a three-dimensional structure of a film transmission port bushing provided in an embodiment of the present invention Figure 1 ;

[0020] Figure 2 A schematic diagram of a three-dimensional structure of a film transmission port bushing provided in an embodiment of the present invention Figure 2 ;

[0021] Figure 3A schematic diagram of the cross-section structure of a film transmission port bushing provided in an embodiment of the present invention;

[0022] Figure 4 A three-dimensional structure diagram of a film transmission port bushing provided by another embodiment of the present invention Figure 1 ;

[0023] Figure 5 A three-dimensional structure diagram of a film transmission port bushing provided by another embodiment of the present invention Figure 2 ;

[0024] Figure 6 A schematic cross-sectional structure diagram of a film transmission port bushing provided in another embodiment of the present invention;

[0025] Figure 7 A schematic diagram of the three-dimensional structure of a reaction chamber device provided in an embodiment of the present invention;

[0026] Figure 8 A schematic diagram of a cross-sectional structure of a reaction chamber device provided in an embodiment of the present invention;

[0027] Fig. 9 A schematic cross-sectional view of a reaction chamber device provided in another embodiment of the present invention;

[0028] Description of the symbols in the figure:

[0029] 10. Bushing body; 11. Transmission plate opening structure; 12. Tail structure; 13. Groove; 14. Purge hole; 15. Baffle bar; 20. Reaction chamber body; 21. Reaction chamber; 22. Annular airway. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0032] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0033] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0034] In the prior art, the flow field uniformity of the wafer transfer port and accessory devices is insufficient. Common designs use an offset gas purge pipeline, which leads to uneven airflow distribution. The eccentric distribution of the airflow has an adverse effect on the overall flow field uniformity. The wafer transfer port is a key channel for wafer entry and exit, and the purge effect is closely related to particle control. If the purge effect is not good, it may cause particle contamination and reduce the purity and performance of the film.

[0035] To this end, an embodiment of the present invention provides a film transfer port bushing to improve flow field uniformity and reduce particle contamination, thereby improving film quality.

[0036] Specifically, the embodiment of the present invention is provided with an adjustment structure for adjusting the uniformity of the flow field on the bushing body 10, wherein the adjustment structure includes two schemes, one of which is a purge hole 14 with a non-uniformly distributed aperture, and the purge hole 14 adopts a non-uniform aperture design, and the aperture gradually increases from the air inlet end to the distal end to balance the air flow distribution and ensure the uniformity of the air curtain. The other is to set the width of the upper end face of the groove 13 to be smaller than the width of the lower end face of the groove 13, wherein the purge hole 14 is provided on the upper end face, and the aperture of the purge hole 14 in this scheme can be kept consistent. In this way, the cross-sectional area of ​​the upper part of the annular airway 22 is smaller than the cross-sectional area of ​​the lower part of the annular airway 22, thereby balancing the air flow distribution.

[0037] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0038] See also Figures 1 to 3 A film transmission port bushing comprises: a bushing body 10, and an adjustment structure for adjusting the uniformity of the flow field is provided on the outer wall of the bushing body 10.

[0039] In one embodiment, see Figure 1 and Figure 3 The outer wall of the bushing body 10 is provided with a groove 13 , and the groove 13 surrounds the side wall of the bushing body 10 .

[0040] In one embodiment, see Figure 1 and Figure 3 The above-mentioned bushing body 10 includes a transmission opening structure 11 and a tail structure 12 . The tail structure 12 is connected to the transmission opening structure 11 , and the groove 13 surrounds the side wall of the transmission opening structure 11 .

[0041] In this embodiment, the sleeve body 10 is the basic part of the entire structure. It is installed at the wafer transfer opening of the reaction chamber to guide and control the flow path of the purge gas. The wafer transfer opening structure 11 is located at one end of the sleeve body 10 and is responsible for docking the wafer transfer device; and the tail structure 12 is connected behind this opening structure to form a complete sleeve appearance. It is worth noting that the tail structure 12 here specifically refers to a design that can adjust its own shape according to the shape changes of adjacent components to ensure the best matching and sealing effect.

[0042] In one embodiment, see Figure 1 and Figure 3 The groove 13 is provided with a plurality of purge holes 14 with unevenly distributed apertures.

[0043] In this embodiment, in order to adjust the uniformity of the flow field, a specific adjustment structure is provided on the outer wall of the bushing body 10. These adjustment structures are specifically embodied as grooves 13 arranged around the side wall of the bushing. The grooves 13 not only play a physical separation role, but also have key purge holes 14 arranged inside them for achieving accurate distribution and outflow of gas.

[0044] In one embodiment, see Figure 1 and Figure 3 , along the extending direction of the groove 13 , the apertures of the plurality of groups of purge holes 14 increase sequentially.

[0045] Specifically, the apertures of the purge holes 14 in a group remain consistent, and the apertures increase sequentially along the extension direction of the groove 13, that is, along the air intake direction, with the group as a unit.

[0046] In this embodiment, a plurality of groups of purge holes 14 are provided in the above-mentioned groove 13. These purge holes 14 are not arranged at equal intervals or equal diameters, but are distributed in a non-uniform manner. Specifically, along the extending direction of the groove 13, that is, the direction of gas flow, the apertures of the purge holes 14 increase successively from the gas inlet end to the far end. This design is to balance the uneven flow caused by the offset airway, thereby improving the overall uniformity and efficiency of the purge air curtain.

[0047] The purge holes 14 in the group maintain a consistent aperture size, but when observed along the extension direction of the groove 13, that is, in the process of moving from the air inlet end to the far end, it can be seen that the aperture of the purge holes 14 between each group gradually increases. This gradual aperture layout helps to improve the difference in gas flow rate, ensuring that sufficient purge force can be obtained even at a position far from the air inlet, and ultimately achieving a more ideal flow field distribution.

[0048] In this embodiment, the purge holes 14 can be arranged in at least five groups. Of course, in other embodiments, the purge holes 14 can be arranged in other numbers.

[0049] In another embodiment, the design of the groove 13 in this embodiment is significantly different from that in the previous embodiment. For details, please refer to Figures 4 to 6 The width of the upper end surface of the groove 13 is smaller than the width of the lower end surface thereof. This unique trapezoidal cross-section design helps to guide the gas flow path and adjust the gas flow rate by changing the cross-sectional area of ​​the airway, thereby achieving a more balanced flow field distribution.

[0050] In this example, see Figures 4 to 6 A blocking bar 15 is provided on the upper end surface of the groove 13 .

[0051] See also Figures 4 to 6 One end of the blocking bar 15 abuts against one end of the tail structure 12 and the film transmission opening structure 11.

[0052] In this embodiment, the blocking bar 15 is designed and installed on the upper end surface of the groove 13, and its main purpose is to ensure that the width of the upper end surface of the groove 13 is smaller than the width of the lower end surface thereof through physical restriction.

[0053] The presence of the baffle 15 is essential for maintaining the specific trapezoidal cross section of the groove 13. By installing the baffle 15 on the upper end surface of the groove 13, it is ensured that the width of the upper end surface of the groove 13 is always smaller than the width of the lower end surface. This design helps to optimize the gas flow path.

[0054] One end of the baffle 15 abuts between the tail structure 12 and one end of the transmission opening structure 11, which makes the baffle 15 a key guide point in the gas flow path. Due to the existence of the baffle 15, the gas is forced to flow along the wall of the groove 13, and the gas in the lower end surface area also flows along the wall of the groove 13 and is concentratedly output from the purge hole 14, achieving more effective gas distribution and utilization.

[0055] The asymmetric width of the groove 13 is constructed by the baffle 15, which enables more precise control of the gas flow path. In this way, a stable purge effect can be maintained even under complex operating conditions, making the pressure and flow rate of the purge gas curtain more uniform, ultimately improving the performance and reliability of the entire system.

[0056] The above-mentioned film transmission port bushing adjusts the uniformity of the flow field by setting an adjustment structure on the bushing body 10. Specifically, a plurality of groups of purge holes 14 with unevenly distributed apertures are set on the groove 13, or a groove 13 with an upper end face width smaller than a lower end face width is used to adjust the uniformity of the flow field, thereby improving the uniformity of the flow field and reducing particulate pollution, thereby improving the quality of the film.

[0057] In one embodiment, see Figures 7 to 9 A reaction chamber device is also provided, including a reaction chamber body 20 and the above-mentioned film transmission port bushing, wherein a reaction chamber 21 is provided in the reaction chamber body 20, the film transmission port bushing is placed in the reaction chamber 21, and an annular airway 22 is formed between the inner side wall of the reaction chamber 21 and the side wall of the groove 13 of the film transmission port bushing.

[0058] The wafer transfer port bushing is placed in the reaction chamber 21, and its function is to protect and guide the wafer or sample transferred into the reaction chamber 21. In addition, an annular air channel 22 is formed between the inner wall of the reaction chamber 21 and the side wall of the groove 13 of the wafer transfer port bushing for the circulation of the purge gas.

[0059] In one embodiment, see Figures 8 to 9 The reaction chamber body 20 is provided with an air inlet pipeline, which is connected to the annular air channel 22. Figure 8 For example, a purge hole 14 with a non-uniformly distributed pore size is used; for Fig. 9 In particular, a groove 13 whose upper end surface width is smaller than that of the lower end surface is combined with a purge hole 14 of a uniform aperture.

[0060] See also Figure 8 and Fig. 9 The purge gas enters the reaction chamber 21 from the air inlet pipe, and is divided into two paths after reaching the reaction chamber 21. One path goes upward into the upper part of the annular air channel 22 formed by the groove 13 and the inner side wall of the reaction chamber 21, and the other path goes rightward into the lower part of the annular air channel 22 formed by the groove 13 and the inner side wall of the reaction chamber 21. Finally, both gases are blown out vertically downward through the purge hole 14 to form a purge air curtain.

[0061] The design intention of the purge hole 14 to increase in diameter in a direction away from the air inlet, that is, along the direction of the groove 13, is to balance the flow resistance and alleviate the problem of the high point of the left flow field caused by the gas preferentially flowing out from the place closer to the air inlet. By setting the purge hole diameter to gradually increase, the uneven flow field caused by the rapid outflow of gas can be alleviated to a certain extent.

[0062] Secondly, another embodiment adopts a groove 13 design in which the width of the upper end surface is smaller than the width of the lower end surface. This design makes it easier for gas to pass through the lower part of the wider annular air channel 22, thereby replenishing more gas to the right side. With the help of the difference between the width of the upper end surface and the width of the lower end surface of the groove 13, more gas can flow to the right side, thereby filling the low point of the flow field that may appear on the right side, and achieving better flow field uniformity.

[0063] In summary, by ingeniously utilizing the purge holes 14 with non-uniformly distributed apertures, the grooves 13 with an upper end surface width smaller than a lower end surface width, and the purge holes 14 with uniform apertures, the flow rate and pressure of the purge air curtain can be finely controlled, ensuring the uniformity and stability of the flow field in the entire working area. This not only improves the working efficiency of the equipment, but also enhances the consistency and reliability of the processing process.

[0064] The above-mentioned reaction chamber device adjusts the uniformity of the flow field by setting a groove 13 and a purge hole 14 on the film transfer port bushing, which helps to optimize the fluid distribution. The aperture of the purge hole 14 gradually increases along the direction of the groove 13, which can effectively reduce the accumulation and pollution of particulate matter. The design of the annular airway 22 and the air inlet pipeline makes the airflow more evenly distributed in the reaction chamber 21, avoiding the unevenness of local airflow. This can reduce the source of pollution and improve the quality and uniformity of the film. In addition, when the upper end face width of the groove 13 is set to be smaller than the lower end face width, the airflow distribution is balanced.

[0065] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A film transmission port bushing, characterized in that: include: The bushing body has an outer wall provided with an adjustment structure for adjusting the uniformity of the flow field.

2. A film transmission sleeve according to claim 1, characterized in that: A groove is provided on the outer wall of the bushing body, and the groove surrounds the side wall of the bushing body.

3. A film transmission port bushing according to claim 2, characterized in that: The bushing body comprises a sheet-transmitting opening structure and a tail structure, wherein the tail structure is connected to the sheet-transmitting opening structure, and the groove surrounds the side wall of the sheet-transmitting opening structure.

4. A film transmission port bushing according to claim 2, characterized in that: A plurality of groups of purge holes with unevenly distributed apertures are arranged in the groove.

5. A film transmission port bushing according to claim 4, characterized in that: Along the extending direction of the groove, the apertures of the plurality of groups of purge holes increase in sequence.

6. The film transmission port bushing according to claim 2, characterized in that: The width of the upper end surface of the groove is smaller than the width of the lower end surface of the groove.

7. The film transmission port bushing according to claim 3, characterized in that: The upper end surface of the groove is provided with a blocking strip.

8. The film transmission port bushing according to claim 7, characterized in that: One end of the blocking bar abuts against the tail structure and one end of the sheet transmission opening structure.

9. A reaction chamber device, characterized in that: It comprises a reaction chamber body and a film transmission port bushing as claimed in any one of claims 1 to 8, wherein a reaction chamber is arranged in the reaction chamber body, the film transmission port bushing is placed in the reaction chamber, and an annular airway is formed between the inner side wall of the reaction chamber and the groove side wall of the film transmission port bushing.

10. A reaction chamber device according to claim 9, characterized in that: An air intake pipeline is arranged in the reaction chamber body, and the air intake pipeline is communicated with the annular air channel.

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