Positioning and fixing device for semiconductor device processing

Abstract

The invention relates to the technical field of semiconductor devices, in particular to a positioning and fixing device for semiconductor device processing, which comprises an operation box, a rotating cylinder and a fixing mechanism. Small-area contact positioning is carried out on the wafer through the three positioning arc plates, then large-area clamping and fixing are carried out on the wafer through all the fixing arc plates, accurate centering and positioning of the wafer are achieved through local contact, the position of the wafer can be adjusted more finely, and the positioning accuracy of the wafer is improved. The wafer clamping method has the advantages that the clamping force can be uniformly distributed to the circumferential edge of the wafer by the aid of large-area contact clamping, the problem of overlarge local stress due to deviation of the initial position of the wafer in clamping and fixing procedures can be solved by the aid of local contact positioning, and accordingly the wafer clamping and fixing effects can be effectively improved by the aid of the wafer clamping method and the wafer clamping and fixing device. And finally, adsorption and fixation are carried out through the adsorption unit, so that the accuracy degree of wafer position adjustment and the stability in the wafer processing process are improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor devices, in particular to a positioning and fixing device for processing semiconductor devices. Background Art

[0002] Semiconductor wafers are the basic materials for manufacturing semiconductor devices. They are usually made of high-purity single crystal silicon and are widely used in computers, mobile phones, automotive electronics, medical equipment, aviation and other fields. The steps of grinding and polishing (or flattening) of wafers in the manufacturing process are very important. They can remove surface damage, improve flatness, reduce thickness differences and improve electrical performance. Before this processing, the semiconductor wafer needs to be positioned and fixed so that the center of the wafer is in the specified position and is firmly limited to ensure processing accuracy and prevent wafer damage during processing.

[0003] At present, before processing, the circumferential edge of the wafer is mainly clamped by a clamp to complete the positioning process and the fixing and locking process of the wafer. With respect to the above positioning and fixing process, the following problems exist: after the wafer is placed, it is fixed and clamped by direct contact clamping, and the positioning of the wafer is also completed while fixing and clamping. In this process, since the initial placement position of the wafer is uncertain, if the initial placement position of a local area of ​​the wafer is close to the clamping member, direct clamping may cause the clamping member to contact and apply pressure to the local area of ​​the wafer in advance, which may easily lead to excessive clamping in the local area of ​​the wafer, resulting in damage or deformation of the wafer. Secondly, in the above process, direct clamping is performed when the initial placement position of the wafer is uncertain, and the overall clamping accuracy of the wafer is low, making it difficult to control the stability of the wafer during the clamping process. Summary of the invention

[0004] Based on this, it is necessary to provide a positioning and fixing device for semiconductor device processing, aiming to solve the above-mentioned problems of the prior art.

[0005] The present application provides a positioning and fixing device for semiconductor device processing, comprising: a work box, the upper end of which is open, a sealing door for sealing the opening of the work box is arranged at the upper end of the work box, a rotating cylinder with a vertical axis is rotated and penetrated through the bottom wall of the inner cavity of the work box, a circular plate located in the work box is fixedly sleeved on the rotating cylinder, and a fixing mechanism is jointly arranged on the rotating cylinder and the circular plate.

[0006] The fixing mechanism includes a positioning arc plate, and three groups of circumferentially evenly distributed positioning components are arranged above the circular plate. The positioning components include a positioning arc plate and two fixed arc plates located on both sides of the positioning arc plate. The inner arc surfaces of the positioning arc plate and the fixed arc plate are both facing the axis of the rotating cylinder. A driving unit is commonly arranged on the circular plate and the rotating cylinder, and a supporting plate is commonly fixed on the lower end surfaces of the two fixed arc plates in the same positioning component.

[0007] The fixing mechanism also includes an adsorption unit for adsorbing and fixing the wafer, and the adsorption unit includes an adsorption table. The upper end surface of the rotating cylinder is fixedly provided with an adsorption table with a cavity inside. The adsorption table is connected to the inner cavity of the rotating cylinder, and an air pump is fixedly provided on the bottom wall of the inner cavity of the working box.

[0008] According to a favorable embodiment, the positioning arc plate is L-shaped, and the inner corner area of ​​the positioning arc plate faces the circular plate, the lower end surface of the positioning arc plate is flush with the upper end surface of the supporting plate, and the vertical section height of the positioning arc plate and the height of the fixed arc plate are the same as the thickness of the wafer.

[0009] According to a favorable embodiment, the fixing mechanism also includes a T-shaped frame, and the circular plate is fixedly provided with a T-shaped frame corresponding to the positioning assembly one by one, and the upper end surface of the circular plate is slidably provided with a sliding frame corresponding to the T-shaped frame one by one, and the sliding frame slides along the corresponding T-shaped frame to the rotating cylinder, and the supporting plate is fixedly provided on the corresponding sliding frame, and a supplementary block is provided to slide up and down between the two fixed arc plates in the same positioning assembly.

[0010] According to a favorable embodiment, the driving unit includes an L-shaped frame, an L-shaped frame is slidably arranged on the T-shaped frame, and the horizontal section of the L-shaped frame passes through the corresponding T-shaped frame and has the same sliding direction as the corresponding sliding frame, the positioning arc plate is fixedly arranged on the end surface of the L-shaped frame facing the rotating cylinder, a triangular plate is sleeved on the rotating cylinder and slides up and down and is located between the circular plate and the bottom of the working box, the triangular plate and the vertical sections of the three L-shaped frames are hingedly arranged with hinge bars, the lower end surface of the triangular plate is rotatably arranged with a fixed circular plate, the rotating cylinder passes through the fixed circular plate, and an electric push rod is commonly arranged between the fixed circular plate and the bottom of the working box.

[0011] According to a favorable embodiment, the horizontal section of the T-shaped frame faces the rotating cylinder, and the driving unit further comprises a gear, a gear is rotatably provided on the upper end surface of the horizontal section of the T-shaped frame via a rotating shaft, two racks are slidably provided on the upper end surface of the horizontal section of the T-shaped frame along its horizontal direction, and the racks are symmetrical about the axis of the rotating shaft, one of the racks on the same T-shaped frame is fixedly connected to two adjacent fixed arc plates via a connecting frame, a driving bar is fixedly provided on the other rack, a pushing bar for pushing the driving bar is fixedly provided on the horizontal section of the L-shaped frame, and a spring is commonly provided between the rack and the vertical section of the T-shaped frame.

[0012] According to a preferred embodiment, the driving unit further comprises a U-shaped frame, the lower end surface of the horizontal section of the T-shaped frame is fixedly provided with a U-shaped frame, the U-shaped frame is located between the T-shaped frame and an adjacent sliding frame, a horizontal plate is fixedly provided on the U-shaped frame, and the lower end surface of the supplementary block is fixedly provided with an inverted right-angled trapezoidal matching block, the inclined surface of the matching block is inclined upward from the direction corresponding to the T-shaped frame to the rotating cylinder.

[0013] According to an advantageous embodiment, the height of the matching block is the same as that of the fixed arc plate, and the upper end surface of the horizontal plate is flush with the lower end of the supplementary block.

[0014] According to a favorable embodiment, the adsorption unit also includes a rotary jet diverter, and the lower end surface of the fixed circular plate is fixedly provided with a rotary jet diverter mounted on the rotating cylinder, the rotary jet diverter is connected to the inner cavity of the rotating cylinder, the rotary jet diverter is connected to the air pump through pipeline 1, and a accommodating cavity is opened in the support plate, and the support plate and the adsorption table are connected through pipeline 2, and pipeline 2 connects the accommodating cavity and the inner cavity of the adsorption table, and multiple adsorption holes are opened through the upper end surface of the support plate and the upper end surface of the adsorption table.

[0015] According to a favorable embodiment, a locking unit for locking all fixed arc plates is provided on the circular plate, and the locking unit includes a locking groove, and a locking groove is provided at one end of the lower end surfaces of the two fixed arc plates corresponding to the same supporting plate, which are away from each other. When two adjacent fixed arc plates are closed, the corresponding two locking grooves jointly form a locking position, and three circumferentially evenly distributed fixed cylinders are fixedly provided on the upper end surface of the circular plate, and a sliding rod that slides up and down is provided on the fixed cylinder, and a locking block that cooperates with the locking position is fixedly provided on the upper end surface of the sliding rod.

[0016] According to a favorable embodiment, a sealing plate is fixedly provided on the lower end surface of the sliding rod, and the sealing plate divides the fixed cylinder into two upper and lower chambers. The upper chamber of the fixed cylinder is connected to the inner cavity of the adsorption platform through a three-way pipe, and the lower chamber of the fixed cylinder is connected to the outside.

[0017] In summary, the present invention includes at least one of the following beneficial effects: First, in the present invention, the wafer is first contact-positioned in a small area by three positioning arc plates, and then the wafer is clamped and fixed in a large area (primary fixation) by all the fixed arc plates. The wafer is first accurately aligned and positioned by local contact, which enables more fine adjustment of the wafer position and reduces the risk of wafer damage or deformation caused by excessive clamping. The subsequent large-area contact clamping helps to evenly distribute the clamping force to the circumferential edge of the wafer. Secondly, after local contact positioning, the problem of excessive local stress caused by the deviation of the initial position of the wafer during the clamping and fixing process is reduced. Finally, the wafer is adsorbed and fixed by the adsorption unit (secondary fixation). In summary, the accuracy of wafer position adjustment and the stability of the wafer processing process are improved.

[0018] Second, in the present invention, the wafer is accurately positioned by initial local area contact and then fixed by large area contact, thereby increasing the stability and uniformity of clamping and preventing the wafer from moving or deviating during processing and affecting the processing process.

[0019] 3. The support plate provided in the present invention supports the wafer at the initial stage of wafer placement. After positioning is completed, the air pump works through pipeline 1 and pipeline 2 so that the adsorption holes on the adsorption platform and the support plate have an adsorption effect on the lower end of the wafer, and the wafer is fixed and limited in the up and down directions, thereby improving stability in subsequent processing.

[0020] Fourth, in the present invention, the triangular locking of all the fixed arc plates is achieved by the upward movement of the three locking blocks, so that in the subsequent processing process, all the fixed arc plates always lock the wafer, reducing the impact of rotation on the wafer position during the processing and improving the stability during the processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0022] Figure 1 A schematic structural diagram of a positioning and fixing device for semiconductor device processing provided according to an embodiment of the present invention is shown.

[0023] Figure 2 A partial cross-sectional structural schematic diagram of a working box, a circular plate and a driving unit provided according to an embodiment of the present invention is shown.

[0024] Figure 3 A partial cross-sectional front view of a working box, a circular plate and a rotating drum provided according to an embodiment of the present invention is shown.

[0025] Figure 4 A partial cross-sectional stereoscopic schematic diagram of a circular plate, a triangular plate and a fixed arc plate provided according to an embodiment of the present invention is shown.

[0026] Figure 5 A schematic diagram of the three-dimensional structure among the triangular plate, the supporting plate and the adsorption platform provided according to an embodiment of the present invention is shown.

[0027] Figure 6 A schematic diagram of an L-shaped frame, a T-shaped frame and a U-shaped frame provided according to an embodiment of the present invention is shown.

[0028] Figure 7 A partial exploded cross-sectional schematic diagram of the fixed arc plate, the positioning arc plate and the locking block after being locked according to an embodiment of the present invention is shown.

[0029] Figure 8 The embodiment of the present invention provides Figure 7 Enlarged view of point A in the middle.

[0030] The above drawings include the following reference numerals: 1, work box; 2, rotating cylinder; 20, circular plate; 3, fixing mechanism; 30, positioning arc plate; 31, fixed arc plate; 32, T-shaped frame; 320, sliding frame; 321, supplementary block; 33, driving unit; 330, L-shaped frame; 331, triangular plate; 332, hinged bar; 333, fixed circular plate; 334, electric push rod; 335, gear; 336, rack; 337, driving bar; 338 , push bar; 339, spring; 340, U-shaped frame; 341, horizontal plate; 342, matching block; 35, supporting plate; 36, adsorption unit; 360, adsorption table; 361, air pump; 362, rotary spray diverter; 363, pipeline one; 364, pipeline two; 365, adsorption hole; 37, locking unit; 370, locking groove; 371, fixing cylinder; 372, sliding rod; 373, locking block; 374, sealing plate; 375, pipeline three. DETAILED DESCRIPTION

[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0032] like Figure 1 , Figure 2 and Figure 3 As shown, a positioning and fixing device for semiconductor device processing includes: a work box 1, the upper end of the work box 1 is open, the upper end of the work box 1 is provided with a sealing door for sealing the opening of the work box 1, a rotating cylinder 2 with a vertical axis rotates and penetrates the bottom wall of the inner cavity of the work box 1 (the rotating cylinder 2 is connected to an external motor), a circular plate 20 located in the work box 1 is fixedly sleeved on the rotating cylinder 2, and a fixing mechanism 3 is commonly provided on the rotating cylinder 2 and the circular plate 20.

[0033] like Figure 2 , Figure 3 and Figure 4As shown, the fixing mechanism 3 includes a positioning arc plate 30, and three groups of circumferentially evenly distributed positioning components are arranged above the circular plate 20. The positioning components include a positioning arc plate 30 and two fixed arc plates 31 located on both sides of the positioning arc plate 30. The inner arc surfaces of the positioning arc plate 30 and the fixed arc plates 31 are both facing the axis of the rotating cylinder 2. A driving unit 33 is commonly arranged on the circular plate 20 and the rotating cylinder 2. The driving unit 33 works to make the three positioning arc plates 30 approach each other and perform centering operations on the wafer. All the fixed arc plates 31 then clamp the wafer and form a full-circle circular ring to form a first-level fixation. The lower end surfaces of the two fixed arc plates 31 in the same positioning component are commonly fixed with a supporting plate 35.

[0034] like Figure 2 , Figure 3 and Figure 4 As shown, the fixing mechanism 3 also includes an adsorption unit 36 ​​for adsorbing and fixing the wafer, and the adsorption unit 36 ​​includes an adsorption table 360. The upper end surface of the rotating cylinder 2 is fixedly provided with an adsorption table 360 ​​with a cavity inside. The adsorption table 360 ​​is connected to the inner cavity of the rotating cylinder 2, and an air pump 361 is fixedly provided on the bottom wall of the inner cavity of the working box 1. When the air pump 361 works, the adsorption table 360 ​​adsorbs the wafer after centering, forming a second-level fixation.

[0035] It should be noted that before performing any processing on the wafer (such as polishing the upper end surface of the wafer), the wafer is first placed on the support plate 35, the sealing door is closed, and the wafer is centered and clamped by the positioning and fixing device in this article, and then the wafer is processed by the existing processing equipment (not shown in the figure) located in the working box 1.

[0036] The specific implementation process of positioning and fixing the wafer in the above process is as follows: first, the wafer is placed on the support plate 35, and the three support plates 35 jointly provide preliminary support for the wafer, and then the driving unit 33 works to make the three positioning arc plates 30 approach the rotating cylinder 2 synchronously, and finally the three positioning arc plates 30 perform preliminary positioning on the wafer, so that the axis of the wafer is collinear with the axis of the rotating cylinder 2, and the positioning step is completed. Then, as the driving unit 33 continues to operate, the positioning arc plate 30 is moved away from the wafer, and the fixed arc plate 31 is close to the wafer. Finally, all the fixed arc plates 31 are pressed against the wafer and form a circular fixed frame, completing the first level of fixation of the wafer, and exposing the upper end surface of the wafer (this surface is the processing surface) to facilitate subsequent processing, and then the air pump 361 works to make the adsorption platform 360 adsorb the wafer to complete the second level of fixation of the wafer, and thus the positioning and fixing action of the wafer is completed, so that subsequent processing operations can be carried out.

[0037] like Figure 1 , Figure 4 and Figure 6As shown, the positioning arc plate 30 is L-shaped, and the inner corner area of ​​the positioning arc plate 30 faces the circular plate 20. The lower end surface of the positioning arc plate 30 is flush with the upper end surface of the supporting plate 35. The vertical section height of the positioning arc plate 30 and the height of the fixed arc plate 31 are the same as the thickness of the wafer.

[0038] As the three positioning arc plates 30 move closer to the rotating cylinder 2, the inner arc surface of the vertical section of the positioning arc plate 30 gradually contacts and presses against the wafer, and the three positioning arc plates 30 cooperate with each other to center the wafer. Finally, the horizontal section of the positioning arc plate 30 moves to the top of the wafer and cooperates with the supporting plate 35 to limit the up and down directions of the wafer to ensure stability and accuracy during the centering process. After completing the centering operation, the positioning arc plate 30 moves away from the wafer, and the horizontal section of the positioning arc plate 30 is detached from the wafer, and the inner arc surface of the subsequent fixed arc plate 31 presses against the wafer to fix and lock it, thereby avoiding interference between the horizontal section of the positioning arc plate 30 during subsequent processing.

[0039] like Figure 2 , Figure 4 and Figure 5 As shown, the fixing mechanism 3 also includes a T-shaped frame 32, and the circular plate 20 is fixedly provided with a T-shaped frame 32 corresponding to the positioning assembly one by one, and the upper end surface of the circular plate 20 is slidably provided with a sliding frame 320 corresponding to the T-shaped frame 32 one by one, and the sliding frame 320 slides along the corresponding T-shaped frame 32 to the rotating cylinder 2, and the supporting plate 35 is fixedly provided on the corresponding sliding frame 320. A supplementary block 321 is provided between two fixed arc plates 31 in the same positioning assembly to slide up and down. When all the fixed arc plates 31 clamp the fixed wafer together, the supplementary block 321 moves up and forms a circular fixed frame surrounding the wafer together with the fixed arc plates 31, see Figure 7 .

[0040] like Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the driving unit 33 includes an L-shaped frame 330, an L-shaped frame 330 is slidably arranged on the T-shaped frame 32, and the horizontal section of the L-shaped frame 330 passes through the corresponding T-shaped frame 32 and has the same sliding direction as the corresponding sliding frame 320, the positioning arc plate 30 is fixedly arranged on the end surface of the L-shaped frame 330 facing the rotating cylinder 2, a triangular plate 331 is sleeved on the rotating cylinder 2 and slides up and down and is located between the circular plate 20 and the bottom of the working box 1, a hinge bar 332 is hingedly arranged between the triangular plate 331 and the vertical sections of the three L-shaped frames 330, a fixed circular plate 333 is rotatably arranged on the lower end surface of the triangular plate 331, the rotating cylinder 2 passes through the fixed circular plate 333, and an electric push rod 334 is commonly arranged between the fixed circular plate 333 and the bottom of the working box 1.

[0041] In the initial state, the fixed arc plate 31 in the same positioning assembly is located between the positioning arc plate 30 and the corresponding T-shaped frame 32, and the positioning arc plate 30 is not positioned and moved at this time. After the wafer is placed on the three supporting plates 35, the electric push rod 334 works to make the fixed circular plate 333 and the triangular plate 331 move downward synchronously, and the triangular plate 331 pulls the L-shaped frame 330 through the hinge bar 332 thereon, so that the L-shaped frame 330 drives the positioning arc plate 30 thereon to approach the wafer, and finally the three positioning arc plates 30 are pressed against the wafer, so that the axis of the wafer is colinear with the axis of the rotating cylinder 2, and at this time the horizontal section of the positioning arc plate 30 is pressed above the wafer, so that the wafer remains horizontal, and the initial positioning process of the wafer is completed.

[0042] like Figure 2 and Figure 5 As shown, the horizontal section of the T-shaped frame 32 faces the rotating cylinder 2, and the driving unit 33 also includes a gear 335. The upper end surface of the horizontal section of the T-shaped frame 32 is rotatably provided with a gear 335 through a rotating shaft. The upper end surface of the horizontal section of the T-shaped frame 32 is slidably provided with two racks 336 along its horizontal direction, and the racks 336 are symmetrical about the axis of the rotating shaft. One of the racks 336 on the same T-shaped frame 32 is fixedly connected to two adjacent fixed arc plates 31 through a connecting frame, and a driving bar 337 is fixedly provided on the other rack 336. A pushing bar 338 for pushing the driving bar 337 is fixedly provided on the horizontal section of the L-shaped frame 330, and a spring 339 is commonly provided between the rack 336 and the vertical section of the T-shaped frame 32.

[0043] During operation, after the initial positioning process of the wafer is completed, the electric push rod 334 works to make the fixed circular plate 333 and the triangular plate 331 move upward synchronously, so that the L-shaped frame 330 drives the positioning arc plate 30 away from the wafer. As the L-shaped frame 330 continues to move, the positioning arc plate 30 moves out of the area above the corresponding supporting plate 35. Then, the L-shaped frame 330 drives the push bar 338 to move and makes the push bar 338 contact the driving bar 337, so that the driving bar 337 drives the corresponding rack 336 to approach the vertical section of the T-shaped frame 32. The meshing between the wheels 335 causes the corresponding other rack 336 to move in the vertical section direction away from the T-shaped frame 32, so that the connecting frame drives the corresponding fixed arc plate 31 and the supporting plate 35 to approach the wafer, and finally the inner arc surface of the fixed arc plate 31 presses against the circumferential surface of the wafer, completing the first level of fixing the wafer. During the above process, the spring 339 is deformed. After the subsequent processing operation is completed, the electric push rod 334 works to reset the triangle plate 331. The elastic force generated by the deformation of the spring 339 resets the fixed arc plate 31 away from the wafer, and then the wafer is taken out.

[0044] like Figure 2 and Figure 6As shown, the driving unit 33 also includes a U-shaped frame 340, and the U-shaped frame 340 is fixedly provided on the lower end surface of the horizontal section of the T-shaped frame 32, and the U-shaped frame 340 is located between the T-shaped frame 32 and the adjacent sliding frame 320. A horizontal plate 341 is fixedly provided on the U-shaped frame 340, and an inverted right-angled trapezoidal matching block 342 is fixedly provided on the lower end surface of the supplementary block 321, and the inclined surface of the matching block 342 is inclined upward from the direction corresponding to the T-shaped frame 32 to the rotating cylinder 2.

[0045] like Figure 6 As shown, the height of the matching block 342 is the same as that of the fixed arc plate 31 , and the upper end surface of the horizontal plate 341 is flush with the lower end of the supplementary block 321 .

[0046] In the process of the connecting frame driving the fixed arc plate 31 and the supporting plate 35 to approach the wafer, as the fixed arc plate 31 continues to move, the fixed arc plate 31 drives the supplementary block 321 and the matching block 342 to move and makes the matching block 342 contact the horizontal plate 341. As the matching block 342 continues to move, the horizontal plate 341 squeezes the inclined surface of the matching block 342, so that the matching block 342 drives the supplementary block 321 thereon to move upward, and finally the lower end face of the matching block 342 is in close contact with the upper end face of the horizontal plate 341. At this time, the upper end of the supplementary block 321 is flush with the upper end of the fixed arc plate 31, so that all the supplementary blocks 321 and all the fixed arc plates 31 together form a circular fixed frame.

[0047] After completing the processing operation, the fixed arc plate 31 is reset away from the wafer, and the fixed arc plate 31 drives the supplementary block 321 and the matching block 342 to move synchronously. When the supplementary block 321 and the matching block 342 move out of the top of the horizontal plate 341, the supplementary block 321 and the matching block 342 move down and reset under the action of their own gravity to avoid hindering the subsequent reset process of the positioning arc plate 30.

[0048] like Figure 2 , Figure 3 and Figure 5 As shown, the adsorption unit 36 ​​also includes a rotary jet diverter 362 (the prior art), the lower end surface of the fixed circular plate 333 is fixedly provided with a rotary jet diverter 362 sleeved on the rotating cylinder 2, the rotary jet diverter 362 is connected to the inner cavity of the rotating cylinder 2, the rotary jet diverter 362 is connected to the air pump 361 through a pipe 1 363, a accommodating cavity is opened in the support plate 35, the support plate 35 and the adsorption platform 360 are connected through a pipe 2 364, the pipe 2 364 connects the accommodating cavity and the inner cavity of the adsorption platform 360, and a plurality of adsorption holes 365 are opened through the upper end surface of the support plate 35 and the upper end surface of the adsorption platform 360.

[0049] During operation, after completing the first level of fixation of the wafer, the air pump 361 works through the pipe 1 363 and the pipe 2 364 so that the adsorption holes 365 on the adsorption platform 360 and the supporting plate 35 have an adsorption effect on the lower end of the wafer, providing the wafer with limited fixation in the up and down directions, completing the second level of fixation of the wafer, and improving the stability in the subsequent processing process.

[0050] Secondly, it should be noted that during the subsequent processing operations, the rotating cylinder 2 needs to drive the circular plate 20 and the wafer to rotate a full circle. The rotary spray diverter 362 is set to enable the air pump 361 to operate continuously to ensure that the wafer is firmly adsorbed during the processing.

[0051] like Figure 2 , Figure 4 , Figure 7 and Figure 8 As shown, the circular plate 20 is provided with a locking unit 37 for locking all the fixed arc plates 31, and the locking unit 37 includes a locking groove 370. The locking groove 370 is provided at one end of the lower end surfaces of the two fixed arc plates 31 corresponding to the same supporting plate 35, which are away from each other. When the two adjacent fixed arc plates 31 are closed, the corresponding two locking grooves 370 jointly form a locking position, and three circumferentially evenly distributed fixed cylinders 371 are fixedly provided on the upper end surface of the circular plate 20, and a sliding rod 372 that slides up and down is provided on the fixed cylinder 371, and a locking block 373 that cooperates with the locking position is fixedly provided on the upper end surface of the sliding rod 372.

[0052] like Figure 5 , Figure 7 and Figure 8 As shown, a sealing plate 374 is fixedly provided on the lower end surface of the sliding rod 372, and the sealing plate 374 divides the fixed cylinder 371 into two upper and lower chambers. The upper chamber of the fixed cylinder 371 is connected to the inner cavity of the adsorption platform 360 through a pipe three 375, and the lower chamber of the fixed cylinder 371 is connected to the outside.

[0053] When the fixed arc plate 31 is pressed against the wafer, the locking grooves 370 of two adjacent fixed arc plates 31 on different supporting plates 35 cooperate with each other to form a locking position, and at this time the locking position is located directly above the corresponding locking block 373 .

[0054] During the adsorption operation of the wafer, as the air pump 361 works, the sealing plate 374 drives the sliding rod 372 to move upward through the pipe three 375, and the sliding rod 372 drives the locking block 373 thereon to be locked in the corresponding locking position, thereby locking the two corresponding fixed arc plates 31 above. The upward movement of the three locking blocks 373 realizes the triangular locking of all the fixed arc plates 31, so that in the subsequent rotation processing, the fixed arc plates 31 always lock the wafer, thereby improving the stability of the processing process. After completing the processing operation, the air pump 361 works to inflate, so that the air pressure in the upper chamber of the adsorption table 360, the support plate 35 and the fixed cylinder 371 is restored, and the locking block 373 is reset to release the lock on the two upper fixed arc plates 31.

[0055] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0056] In addition, the terms "first", "second", "number one", "number two" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "number one", "number two" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0057] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connect", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, all equivalent changes made according to the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A positioning and fixing device for semiconductor device processing, characterized in that: include: A work box (1), wherein the upper end of the work box (1) is open, and a sealing door for sealing the opening of the work box (1) is arranged at the upper end of the work box (1); a rotating cylinder (2) with a vertical axis is rotatably penetrated on the bottom wall of the inner cavity of the work box (1); a circular plate (20) located in the work box (1) is fixedly sleeved on the rotating cylinder (2); and a fixing mechanism (3) is jointly arranged on the rotating cylinder (2) and the circular plate (20); The fixing mechanism (3) comprises a positioning arc plate (30). Three groups of positioning components evenly distributed in the circumferential direction are arranged above the circular plate (20). The positioning components comprise a positioning arc plate (30) and two fixed arc plates (31) located on both sides of the positioning arc plate (30). The inner arc surfaces of the positioning arc plate (30) and the fixed arc plates (31) are both facing the axis of the rotating cylinder (2). The circular plate (20) and the rotating cylinder (2) are jointly provided with a driving unit (33). The driving unit (33) works so that the three positioning arc plates (30) are close to each other and perform centering operation on the wafer. All the fixed arc plates (31) then clamp the wafer and form a full-circle circular ring to form a first-level fixation. The lower end surfaces of the two fixed arc plates (31) in the same positioning component are jointly fixed with a supporting plate (35); The fixing mechanism (3) also includes an adsorption unit (36) for adsorbing and fixing the wafer, and the adsorption unit (36) includes an adsorption platform (360). The upper end surface of the rotating cylinder (2) is fixedly provided with an adsorption platform (360) with a cavity inside, and the adsorption platform (360) is connected to the inner cavity of the rotating cylinder (2). An air pump (361) is fixedly provided on the bottom wall of the inner cavity of the working box (1). When the air pump (361) works, the adsorption platform (360) adsorbs the wafer after centering, thereby forming a second-level fixation.

2. A positioning and fixing device for semiconductor device processing according to claim 1, characterized in that: The positioning arc plate (30) is L-shaped, and the inner corner area of ​​the positioning arc plate (30) faces the circular plate (20). The lower end surface of the positioning arc plate (30) is flush with the upper end surface of the supporting plate (35). The height of the vertical section of the positioning arc plate (30) and the height of the fixed arc plate (31) are the same as the thickness of the wafer.

3. A positioning and fixing device for semiconductor device processing according to claim 1, characterized in that: The fixing mechanism (3) further comprises a T-shaped frame (32), the circular plate (20) being fixedly provided with a T-shaped frame (32) corresponding to the positioning assembly one by one, the upper end surface of the circular plate (20) being slidably provided with a sliding frame (320) corresponding to the T-shaped frame (32), the sliding frame (320) sliding along the corresponding T-shaped frame (32) to the rotating cylinder (2), the supporting plate (35) being fixedly provided on the corresponding sliding frame (320), a supplementary block (321) being slidably provided between two fixed arc plates (31) in the same positioning assembly, and when all the fixed arc plates (31) are clamping and fixing the wafer, all the supplementary blocks (321) are moved upwards and together with all the fixed arc plates (31) form a circular fixed frame surrounding the wafer.

4. A positioning and fixing device for semiconductor device processing according to claim 3, characterized in that: The driving unit (33) comprises an L-shaped frame (330), an L-shaped frame (330) is slidably arranged on the T-shaped frame (32), and the horizontal section of the L-shaped frame (330) penetrates the corresponding T-shaped frame (32) and has the same sliding direction as the corresponding sliding frame (320), a positioning arc plate (30) is fixedly arranged on the end surface of the L-shaped frame (330) facing the rotating cylinder (2), a triangular plate (331) is sleeved on the rotating cylinder (2) and is slidable up and down and is located between the circular plate (20) and the bottom of the working box (1), a hinge bar (332) is hingedly arranged between the triangular plate (331) and the vertical sections of the three L-shaped frames (330), a fixed circular plate (333) is rotatably arranged on the lower end surface of the triangular plate (331), the rotating cylinder (2) penetrates the fixed circular plate (333), and an electric push rod (334) is commonly arranged between the fixed circular plate (333) and the bottom of the working box (1).

5. A positioning and fixing device for semiconductor device processing according to claim 4, characterized in that: The horizontal section of the T-shaped frame (32) faces the rotating cylinder (2), and the driving unit (33) further comprises a gear (335). The upper end surface of the horizontal section of the T-shaped frame (32) is provided with a gear (335) rotatably via a rotating shaft. The upper end surface of the horizontal section of the T-shaped frame (32) is provided with two racks (336) slidably arranged along its horizontal direction, and the racks (336) are symmetrical about the axis of the rotating shaft. One of the racks (336) on the same T-shaped frame (32) is fixedly connected to two adjacent fixed arc plates (31) via a connecting frame, and a driving bar (337) is fixedly arranged on the other rack (336). A pushing bar (338) for pushing the driving bar (337) is fixedly arranged on the horizontal section of the L-shaped frame (330), and a spring (339) is commonly arranged between the rack (336) and the vertical section of the T-shaped frame (32).

6. A positioning and fixing device for semiconductor device processing according to claim 3, characterized in that: The driving unit (33) further comprises a U-shaped frame (340), the U-shaped frame (340) being fixedly arranged on the lower end surface of the horizontal section of the T-shaped frame (32), the U-shaped frame (340) being located between the T-shaped frame (32) and the adjacent sliding frame (320), a horizontal plate (341) being fixedly arranged on the U-shaped frame (340), and an inverted right-angled trapezoidal matching block (342) being fixedly arranged on the lower end surface of the supplementary block (321), the inclined surface of the matching block (342) being inclined upward from the direction corresponding to the T-shaped frame (32) to the rotating cylinder (2).

7. A positioning and fixing device for semiconductor device processing according to claim 6, characterized in that: The height of the matching block (342) is the same as that of the fixed arc plate (31), and the upper end surface of the horizontal plate (341) is flush with the lower end of the supplementary block (321).

8. A positioning and fixing device for semiconductor device processing according to claim 4, characterized in that: The adsorption unit (36) further comprises a rotary jet diverter (362). The lower end surface of the fixed circular plate (333) is fixedly provided with a rotary jet diverter (362) sleeved on the rotating cylinder (2). The rotary jet diverter (362) is communicated with the inner cavity of the rotating cylinder (2). The rotary jet diverter (362) is connected to the air pump (361) via a first pipe (363). A receiving cavity is provided in the support plate (35). The support plate (35) is connected to the adsorption platform (360) via a second pipe (364). The second pipe (364) connects the receiving cavity and the inner cavity of the adsorption platform (360). A plurality of adsorption holes (365) are provided through the upper end surface of the support plate (35) and the upper end surface of the adsorption platform (360).

9. A positioning and fixing device for semiconductor device processing according to claim 1, characterized in that: The circular plate (20) is provided with a locking unit (37) for locking all the fixed arc plates (31), the locking unit (37) comprising a locking groove (370), and a locking groove (370) is provided at one end of the lower end surface of the two fixed arc plates (31) corresponding to the same supporting plate (35) and away from each other. When two adjacent fixed arc plates (31) are closed, the corresponding two locking grooves (370) jointly form a locking position, and three circumferentially uniformly distributed fixed cylinders (371) are fixedly provided on the upper end surface of the circular plate (20), and a sliding rod (372) that slides up and down is provided on the fixed cylinder (371), and a locking block (373) that cooperates with the locking position is fixedly provided on the upper end surface of the sliding rod (372).

10. A positioning and fixing device for semiconductor device processing according to claim 9, characterized in that: A sealing plate (374) is fixedly provided on the lower end surface of the sliding rod (372), and the sealing plate (374) divides the fixed cylinder (371) into two upper and lower chambers. The upper chamber of the fixed cylinder (371) is connected to the inner cavity of the adsorption platform (360) through a pipe three (375), and the lower chamber of the fixed cylinder (371) is connected to the outside.

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