Wafer loader adopting self-adaptive air tap

Abstract

The invention relates to the technical field of wafer conveying, in particular to a wafer loader adopting a self-adaptive air tap, which can open a silicon wafer transportation box and fill the silicon wafer transportation box with gas when the silicon wafer transportation box is loaded. The wafer loader comprises a bearing table and an inflation mechanism arranged at the bottom of the bearing table. The inflation mechanism comprises a self-adaptive floating air tap and an air tap lifting structure, the air tap lifting structure is arranged at the bottom of the bearing table, the self-adaptive floating air tap is arranged on the air tap lifting structure, and the air tap lifting structure drives the self-adaptive floating air tap to ascend and descend; the self-adaptive floating air tap can be in floating butt joint with an air inlet in the bottom of a silicon wafer transportation box above the bearing table and fill the silicon wafer transportation box with air. The air tap is stable in lifting motion operation, is not influenced by external force, has self-adaptability, ensures that the air tap and the air inlet in the bottom of the silicon wafer transportation box are always well attached, reduces the risk of air leakage, and also avoids tilting of the silicon wafer transportation box caused by overlarge air cylinder force.

Description

Technical Field

[0001] The invention relates to the technical field of wafer transmission, and in particular to a wafer loader using an adaptive air nozzle. Background Art

[0002] The trend of chip manufacturing towards smaller and thinner development makes pollution control more and more important. If there is moisture in the transport box of silicon wafers, which are the raw materials for chip production, it is easy to cause defects such as film cracking on the surface of the silicon wafers. Therefore, before transportation and storage, filling the silicon wafer transport box with nitrogen through the bottom air inlet is an effective way to protect the silicon wafers in the box from internal and external contamination.

[0003] At present, most products use the expansion and contraction of the cylinder to drive the lifting and lowering of the purge air nozzle, so that the purge air nozzle is closely connected with the air inlet at the bottom of the silicon wafer transport box, and nitrogen is delivered to the silicon wafer transport box through the air inlet, thereby reducing the humidity and oxygen concentration in the silicon wafer transport box and protecting the silicon wafer. However, the air nozzle structure uses a cylinder to lift and lower, and the air nozzle is lifted and lowered as a whole. The air nozzle itself does not have floating properties, and is prone to collision with the silicon wafer transport box during the process of being driven and lifted by the cylinder; and the contact position with the bottom of the silicon wafer transport box lacks an adaptive structure, and cannot accurately align with the bottom air inlet of the silicon wafer transport box, resulting in air leakage. Some air nozzles also use a floating structure with a mandrel and a top cover integrated, and the mandrel can rotate in the shell, but the floating amount of this solution is too large and uncontrollable, and the top cover of the docking silicon wafer transport box, the mandrel and the air pipe are connected, which is easily affected by external forces including the air pipe, resulting in unstable contact of the air nozzle and poor consistency of the purge effect. Summary of the invention

[0004] In view of the above problems, the purpose of the present invention is to provide a wafer loader using an adaptive air nozzle to solve the problem that the existing air nozzle lacks floatability, making the air nozzle unable to accurately connect to the silicon wafer transport box, resulting in air leakage, and the core shaft and the top cover float as a whole, making them susceptible to external forces.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] The present invention provides a wafer loader using an adaptive air nozzle, comprising a carrier platform and an air charging mechanism arranged at the bottom of the carrier platform;

[0007] The inflation mechanism includes an adaptive floating air nozzle and an air nozzle lifting structure, wherein the air nozzle lifting structure is arranged at the bottom of the supporting platform, and the adaptive floating air nozzle is arranged on the air nozzle lifting structure. The air nozzle lifting structure drives the adaptive floating air nozzle to rise and fall. The adaptive floating air nozzle can float and dock with the bottom air inlet of the silicon wafer transport box above the supporting platform. The adaptive floating air nozzle is used to fill protective gas into the silicon wafer transport box.

[0008] The adaptive floating air nozzle includes a top cover assembly, an air nozzle base, an air nozzle core shaft and an elastic transmission member, wherein the air nozzle core shaft and the air nozzle base are slidably matched, and an elastic transmission member is provided between the air nozzle core shaft and the air nozzle base, and the upper end of the air nozzle core shaft is floatingly connected to the top cover assembly, and the top cover assembly is used to dock with the bottom air inlet of the silicon wafer transport box.

[0009] The top cover assembly includes a nozzle top cover, a sealing element and a retaining ring, wherein the nozzle top cover is provided with a central through hole, the nozzle top cover is buckled on the upper end of the nozzle core shaft, and is axially limited by the retaining ring, so that the nozzle top cover can float on the nozzle core shaft; the sealing element is arranged between the nozzle top cover and the nozzle core shaft, the nozzle top cover presses the sealing element, and the nozzle top cover can adaptively deflect when docking with the bottom air inlet of the silicon wafer transport box.

[0010] The outer shape of the contact portion between the air nozzle top cover and the sealing element is a spherical structure, and the spherical structure enables the air nozzle top cover to remain in close contact with the sealing element when adaptively deflected, thereby ensuring sealing performance.

[0011] An annular boss is provided on the outer circumference of the upper end of the air nozzle core shaft, an annular sealing groove is provided on the upper surface of the annular boss, and the sealing element is embedded in the annular sealing groove.

[0012] An annular groove is arranged on the inner wall of the lower port of the air nozzle top cover, the retaining ring is embedded in the annular groove, and the inner diameter of the retaining ring is smaller than the outer diameter of the annular boss of the air nozzle core shaft.

[0013] The elastic transmission member is sleeved on the outer side of the air nozzle core shaft, and the lower end thereof abuts against the air nozzle base, and the upper end of the elastic transmission member abuts against the annular boss at the upper end of the air nozzle core shaft.

[0014] The elastic transmission member is a spring.

[0015] The air nozzle core shaft is installed in a mounting hole provided on the air nozzle base through a sliding bearing, and the sliding bearing is axially limited by a shaft retaining ring.

[0016] The air nozzle core shaft is a hollow structure, and an air pipe joint is provided at the lower end of the air nozzle core shaft.

[0017] The advantages and beneficial effects of the present invention are: the adaptive air nozzle core shaft and the base of the present invention are connected by an internal sliding bearing and an external spring fastening connection, so that the structure can perform adaptive lifting and lowering movements and ensure the stability of the structural movement process. When the silicon wafer transport box has a displacement deviation in the vertical direction, the spring plays a role to ensure that the air nozzle and the air inlet at the bottom of the silicon wafer transport box are always in good fit, reducing the risk of air leakage, and also avoiding the silicon wafer transport box from tilting due to excessive cylinder force.

[0018] The matching connection method between the top cover and the core shaft of the present invention realizes the floating structure of a single top cover, and its floating amount is controllable. The floating structure limited to the top cover ensures that the floating amount is not easily affected by external forces. The floating amount ensures that the top cover can be adaptively deflected when docking with the interface of the silicon wafer transport box, thereby ensuring the accuracy of the docking, and the contact method between the spherical surface of the top cover and the sealing ring ensures the sealing during air inlet and outlet. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is an axonometric view of a wafer loader using an adaptive air nozzle according to the present invention;

[0020] Figure 2 It is a schematic diagram of the installation of the adaptive floating air nozzle in the present invention;

[0021] Figure 3 It is a front view of the adaptive floating air nozzle in the present invention;

[0022] Figure 4 is a cross-sectional view of the adaptive floating air nozzle of the present invention;

[0023] Figure 5 A bottom view of the air nozzle top cover of the present invention;

[0024] Figure 6 for Figure 5 AA section view;

[0025] Figure 7 This is one of the schematic diagrams of the working state of the adaptive floating air nozzle in the present invention;

[0026] Figure 8 This is one of the schematic diagrams of the working state of the adaptive floating air nozzle in the present invention;

[0027] Fig. 9 This is a sealing effect diagram of the gas nozzle top cover in the present invention.

[0028] In the figure: 1. silicon wafer transport box, 101. bottom air inlet, 2. adaptive floating air nozzle, 201. air nozzle top cover, 202. spring, 203. air nozzle base, 204. shaft retaining ring, 205. air nozzle core shaft, 206. air pipe joint, 207. sliding bearing, 208. sealing element, 209. retaining ring, 210. annular boss, 3. mounting back plate, 4. bearing platform, 6. air nozzle lifting structure. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] See also Figure 1 to Figure 2As shown, the present invention provides a wafer loader using an adaptive gas nozzle, which enables a silicon wafer transport box to be opened and fills the silicon wafer transport box with gas when loading; the wafer loader using the adaptive gas nozzle comprises a carrier 4 and a gas charging mechanism, the carrier 4 is horizontally mounted on the mounting back plate 3, the carrier 4 is used to mount the silicon wafer transport box 1, and the gas charging mechanism is mounted below the carrier 4. The gas charging mechanism comprises an adaptive floating gas nozzle 2 and a gas nozzle lifting structure 6, wherein the gas nozzle lifting structure 6 is arranged at the bottom of the carrier 4, the adaptive floating gas nozzle 2 is arranged on the gas nozzle lifting structure 6, the gas nozzle lifting structure 6 drives the adaptive floating gas nozzle 2 to rise and fall, the adaptive floating gas nozzle 2 can float and dock with the bottom air inlet of the silicon wafer transport box 1 above the carrier 4, and the adaptive floating gas nozzle 2 is used to fill the silicon wafer transport box 1 with protective gas.

[0031] See also Figures 3 to 9 As shown, in an embodiment of the present invention, the adaptive floating air nozzle 2 includes a top cover assembly, an air nozzle base 203, an air nozzle core shaft 205 and an elastic transmission member, wherein the air nozzle core shaft 205 is slidably matched with the air nozzle base 203, and an elastic transmission member is provided between the air nozzle core shaft 205 and the air nozzle base 203, the elastic transmission member is sleeved on the outside of the air nozzle core shaft 205, and the lower end abuts against the air nozzle base 203, and the upper end of the elastic transmission member abuts against the upper end of the air nozzle core shaft 205; the upper end of the air nozzle core shaft 205 is floatingly connected to the top cover assembly, and the top cover assembly is used to dock with the bottom air inlet of the silicon wafer transport box 1.

[0032] See also Figure 4 As shown, in the embodiment of the present invention, the nozzle core shaft 205 is a hollow structure, and the outer circumference of the upper end of the nozzle core shaft 205 is provided with an annular boss 210, and the lower end of the nozzle core shaft 205 is provided with an air pipe joint 206, and the air pipe joint 206 is used for inputting clean gas. The nozzle core shaft 205 is installed in the mounting hole provided on the nozzle base 203 through two sets of sliding bearings 207, and the sliding bearings 207 are axially limited by the shaft retaining ring 204. The nozzle core shaft 205 cooperates with the sliding bearings 207 to prevent the nozzle core shaft 205 from being pulled by the air pipe and affected by external forces during the lifting process, resulting in the problem of poor consistency of the purge effect.

[0033] In an embodiment of the present invention, the elastic transmission member is a spring 202, which is sleeved on the outside of the air nozzle core shaft 205, and the lower end of the spring 202 abuts against the air nozzle base 203, and the upper end of the spring 202 abuts against the annular boss 210 of the air nozzle core shaft 205. The spring 202 is used to provide a certain pressure when the air nozzle rises.

[0034] See also Figure 4As shown, in the embodiment of the present invention, the top cover assembly includes a nozzle top cover 201, a sealing element 208 and a retaining ring 209, wherein the nozzle top cover 201 is provided with a central through hole, the nozzle top cover 201 is buckled on the upper end of the nozzle core shaft 205, and is axially limited by the retaining ring 209, the annular boss 210 of the nozzle core shaft 205 is accommodated in the nozzle top cover 201, and the nozzle top cover 201 can float within a certain range on the upper end of the nozzle core shaft 205 by the restriction of the retaining ring 209; the sealing element 208 is arranged between the nozzle top cover 201 and the annular boss 210 of the nozzle core shaft 205, and the nozzle top cover 201 presses the sealing element 208. The floating amount of the nozzle top cover 201 enables the nozzle top cover 201 to be adaptively deflected when docking with the bottom air inlet of the silicon wafer transport box 1.

[0035] Further, see Figures 5 to 8 As shown, the shape of the contact portion of the air nozzle top cover 201 and the sealing element 208 is a spherical structure. When the air nozzle top cover 201 is raised and pressurized, the spherical structure can ensure that the air nozzle top cover 201 is still in close contact with the sealing element 208 when it is adaptively deflected, thereby ensuring the sealing performance. A contact ring is provided on the top outer edge of the air nozzle top cover 201, which contacts the bottom of the silicon wafer transport box 1 through the contact ring.

[0036] Furthermore, an annular sealing groove is provided on the upper surface of the annular boss 210, and the sealing element 208 is embedded in the annular sealing groove. Specifically, the sealing element 208 is an O-type sealing ring.

[0037] Specifically, an annular groove is provided on the inner wall of the lower port of the valve top cover 201, and a retaining ring 209 is embedded in the annular groove, and the inner diameter of the retaining ring 209 is smaller than the outer diameter of the annular boss 210 of the valve core shaft 205. The valve top cover 201 sits on the sealing element 208, and the spherical structure at its bottom can always keep in contact with the sealing element 208. The retaining ring 209 is used to limit the movement of the valve top cover 201 on the valve core shaft 205 within a certain range.

[0038] See also Figures 7 to 9As shown, the nozzle top cover 201 has a certain angular floating range in the horizontal direction. When the adaptive floating nozzle 2 rises, the nozzle top cover 201 contacts the bottom air inlet 101 of the silicon wafer transport box 1. At this time, the spring 202 is compressed, and at the same time, a reaction force is given to the nozzle core shaft 205, so that the bottom spherical surface of the nozzle top cover 201 squeezes the sealing element 208, and the sealing element 208 deforms to achieve the effect of gas sealing. When the nozzle top cover 201 contacts the silicon wafer transport box 1, there is an angle deviation. Because the inner side of the nozzle top cover 201 is a spherical surface, it can be automatically reset under the action of pressure and always in close contact with the bottom surface of the silicon wafer transport box 1. When the purge system is purging, clean gas is ejected from the nozzle core shaft 205 and enters the interior through the bottom air inlet 101 of the silicon wafer transport box 1. Since the purge pressure is relatively high, gas will leak, and the nozzle top cover 201 and the bottom air inlet 101 of the silicon wafer transport box 1 are deformed under the action of the spring 202, which can effectively seal the nozzle top cover 201. The spherical structure of the nozzle top cover 201 and the sealing element 208 can effectively prevent gas leakage from the bottom due to being squeezed.

[0039] In this embodiment, the inflation action of the inflation mechanism is realized as follows:

[0040] When the adaptive floating air nozzle 2 is inflated, the air nozzle lifting structure 6 drives the adaptive floating air nozzle 2 to rise as a whole until the air nozzle top cover 201 contacts the bottom air inlet 101 of the silicon wafer transport box 1 and continues to be pressurized. At this time, the position of the air nozzle base 203 is fixed, the air nozzle top cover 201 is pressurized, and the force is transmitted to the air nozzle core shaft 205 through the sealing element 208. The air nozzle core shaft 205 slides downward in the fixed air nozzle base 203 through the sliding bearing 207. The outer spring 202 ensures that the air nozzle core shaft 205 is stably connected to the air nozzle base 203 during the downward movement, and the air nozzle top cover 201 is tightly connected to the silicon wafer transport box 1. At the same time, the air nozzle top cover 201 is pressurized and performs adaptive deflection movement based on the interface position of the silicon wafer transport box 5. The lower side of the spherical structure of the air nozzle top cover 201 is tightly fitted with the sealing element 208 until the adaptive downward movement of the air nozzle core shaft 205 ends, and the air nozzle top cover 201 accurately fits the air inlet interface, and the positions of each structure no longer change. At this time, protective gas enters the air path connected to the tail end of the air nozzle core shaft 205 and is transported to the silicon wafer transport box 1 through the air nozzle top cover 201. At this time, the spherical structure of the air nozzle top cover 201 can ensure close contact with the sealing element 208 to avoid air leakage. Until the gas filling is completed, the air nozzle lifting structure 6 drives the adaptive floating air nozzle 2 to move downward.

[0041] In this embodiment, the adaptive floating air nozzle 2 adopts a structure in which the air nozzle core shaft 205 and the air nozzle base 203 are installed in two layers inside and outside. The air nozzle core shaft 205 and the air nozzle base 203 are connected by an internal sliding bearing and an external spring fastening connection. The air nozzle core shaft 205 can perform adaptive lifting and lowering movements while ensuring the stability of the structural movement process, thereby solving the problem of the air nozzle's lack of floating performance. The air nozzle top cover 201 is in contact with the air nozzle core shaft 205 through a sealing ring, and a retaining ring 209 is provided on the lower side of the air nozzle top cover 201 to connect with the air nozzle core shaft 205, thereby realizing a floating structure of a single top cover; a single top cover floating structure is adopted, and its floating amount is controllable, and the floating structure limited to the air nozzle top cover 201 ensures that the floating amount is not easily affected by external forces, and the floating amount ensures that the air nozzle top cover 201 can be adaptively deflected when docking with the bottom air inlet 101 of the silicon wafer transport box 1, thereby ensuring the accuracy of docking, and the contact method between the spherical surface of the top cover and the sealing ring ensures the sealing during air inlet and outlet, thereby solving the problem that the existing air nozzle cannot accurately connect to the silicon wafer transport box, resulting in air leakage, and the problem that the core shaft and the top cover float as a whole, resulting in susceptibility to external forces. When there is a displacement deviation in the vertical direction of the silicon wafer transport box 1, or when the height of the silicon wafer transport box 1 is inconsistent, the spring 202 comes into play, and the adaptive floating air nozzle 2 performs adaptive lifting and lowering movements to ensure that the adaptive floating air nozzle 2 and the bottom air inlet 101 of the silicon wafer transport box 1 are always in good fit, reducing the risk of air leakage, and also avoiding the silicon wafer transport box from tilting due to excessive cylinder force.

[0042] Although the above embodiments have been described, once those skilled in the art know the basic creative concepts, they can make additional changes and modifications to these embodiments. Therefore, the above are only embodiments of the present invention and do not limit the patent protection scope of the present invention. All equivalent structures or equivalent process changes made using the contents of the present invention specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A wafer loader using an adaptive air nozzle, characterized in that: It comprises a bearing platform (4) and an inflation mechanism arranged at the bottom of the bearing platform (4); The inflation mechanism comprises an adaptive floating gas nozzle (2) and an gas nozzle lifting structure (6), wherein the gas nozzle lifting structure (6) is arranged at the bottom of the support platform (4), the adaptive floating gas nozzle (2) is arranged on the gas nozzle lifting structure (6), the gas nozzle lifting structure (6) drives the adaptive floating gas nozzle (2) to rise and fall, the adaptive floating gas nozzle (2) can float and dock with the bottom air inlet of the silicon wafer transport box (1) above the support platform (4), and the adaptive floating gas nozzle (2) is used to fill the silicon wafer transport box (1) with protective gas.

2. The wafer loader using the adaptive air nozzle according to claim 1, characterized in that: The adaptive floating air nozzle (2) comprises a top cover assembly, an air nozzle base (203), an air nozzle core shaft (205) and an elastic transmission member, wherein the air nozzle core shaft (205) and the air nozzle base (203) are slidably matched, and an elastic transmission member is provided between the air nozzle core shaft (205) and the air nozzle base (203), and the upper end of the air nozzle core shaft (205) is floatingly connected to the top cover assembly, and the top cover assembly is used to dock with the bottom air inlet of the silicon wafer transport box (1).

3. The wafer loader using the adaptive air nozzle according to claim 2, characterized in that: The top cover assembly comprises a nozzle top cover (201), a sealing element (208) and a retaining ring (209), wherein the nozzle top cover (201) is provided with a central through hole, the nozzle top cover (201) is buckled on the upper end of the nozzle core shaft (205), and is axially limited by the retaining ring (209), so that the nozzle top cover (201) can float on the nozzle core shaft (205); the sealing element (208) is arranged between the nozzle top cover (201) and the nozzle core shaft (205), the nozzle top cover (201) presses the sealing element (208), and the nozzle top cover (201) can adaptively deflect when docking with the bottom air inlet of the silicon wafer transport box (1).

4. The wafer loader using the adaptive air nozzle according to claim 3, characterized in that: The outer shape of the contact portion between the air nozzle top cover (201) and the sealing element (208) is a spherical structure, and the spherical structure enables the air nozzle top cover (201) to remain in close contact with the sealing element (208) when adaptively deflecting, thereby ensuring sealing performance.

5. The wafer loader using the adaptive air nozzle according to claim 3, characterized in that: An annular boss (210) is provided on the outer circumference of the upper end of the air nozzle core shaft (205), an annular sealing groove is provided on the upper surface of the annular boss (210), and the sealing element (208) is embedded in the annular sealing groove.

6. The wafer loader using the adaptive air nozzle according to claim 5, characterized in that: An annular groove is provided on the inner wall of the lower port of the air nozzle top cover (201), the retaining ring (209) is embedded in the annular groove, and the inner diameter of the retaining ring (209) is smaller than the outer diameter of the annular boss (210) of the air nozzle core shaft (205).

7. The wafer loader using the adaptive air nozzle according to claim 5, characterized in that: The elastic transmission member is sleeved on the outer side of the air nozzle core shaft (205), and the lower end thereof abuts against the air nozzle base (203), and the upper end of the elastic transmission member abuts against the annular boss (210) at the upper end of the air nozzle core shaft (205).

8. The wafer loader using the adaptive air nozzle according to claim 7, characterized in that: The elastic transmission member is a spring (202).

9. The wafer loader using the adaptive air nozzle according to claim 2, characterized in that: The air nozzle core shaft (205) is installed in a mounting hole provided on the air nozzle base (203) via a sliding bearing (207), and the sliding bearing (207) is axially limited by a shaft retaining ring (204).

10. The wafer loader using the adaptive air nozzle according to claim 2, characterized in that: The air nozzle core shaft (205) is a hollow structure, and an air pipe joint (206) is provided at the lower end of the air nozzle core shaft (205).

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