Electrostatic chuck for easy wafer adsorption

Abstract

An electrostatic chuck that facilitates the adsorption of wafers relates to the field of wafer processing. The electrostatic chuck comprises: a substrate, an insulating layer fixed to the surface of the substrate, an electrostatic electrode disposed inside the substrate, a mounting hole provided on the substrate, a liftable ejector pin disposed on the mounting hole, the end of the ejector pin being lower than the surface of the insulating layer, and a coolant circulation channel for the coolant to enter and exit the substrate; a support assembly, the support assembly being disposed on the ejector pin, the support assembly being expanded to be flush with the top surface of the ejector pin during the ascending phase of the ejector pin, and being retracted during the descending phase of the ejector pin; and a plurality of adjustment assemblies that can assist in temperature regulation, the adjustment assemblies being distributed at equal intervals along the coolant circulation channel inside the substrate. The expandable support assembly increases the contact area between the ejector pin and the wafer, reducing the possibility of damage to the wafer when the ejector pin is ejected or retracted. The adjustment assembly can further assist in adjusting the local temperature of the electrostatic chuck.

Description

Technical Field

[0001] The present invention relates to the field of wafer processing, and in particular to an electrostatic chuck for facilitating wafer adsorption. Background Art

[0002] An electrostatic chuck is a device that uses electrostatic force to grab and hold objects. It is often used to handle wafers during semiconductor manufacturing and processing.

[0003] Electrostatic chucks are crucial in semiconductor processing and offer the following advantages:

[0004] (1) Uniform adsorption force;

[0005] (2) Less pollution;

[0006] (3) Can work in vacuum environment.

[0007] The key and difficulty of electrostatic chuck is temperature control.

[0008] Taking dry etching as an example, dry etching requires the wafer to be controlled at a specific temperature between 100°C and -70°C to maintain certain etching characteristics. This mainly relies on the following two methods:

[0009] (1) Increase gas convection between the wafer surface and the electrostatic chuck surface to dissipate heat (the cooling gas usually used in semiconductor processes is helium);

[0010] (2) Heat is dissipated through heat conduction on the surface of the electrostatic chuck.

[0011] In some high-precision processing and testing equipment, the coordinated work of ejector pins and electrostatic chucks can ensure the stability and positioning accuracy of the wafer throughout the entire process, providing a positioning effect through the lifting of the ejector pins.

[0012] Generally speaking, it is inconvenient to fix the top end surface area of the ejector pin. In order to ensure that the surface of the electrostatic chuck has sufficient adsorption area, the diameters of the ejector pin and its mounting hole are relatively small. However, when supporting a wafer, the contact area between the ejector pin and the wafer is too small, which may cause the contact voltage between the wafer and the top surface of the ejector pin to be too high, and may damage the wafer.

[0013] Therefore, to address the above-mentioned problem, an electrostatic chuck is provided that is convenient for adsorbing wafers. Summary of the Invention

[0014] The present invention provides an electrostatic chuck that is convenient for adsorbing wafers in order to solve the problem that a traditional electrostatic chuck is difficult to gently adjust its local temperature during operation, and to solve the problem that the contact area between the ejector pin and the wafer is too small, which causes damage to the wafer.

[0015] The present invention solves the above technical problems through the following technical solutions:

[0016] The present invention provides an electrostatic chuck for facilitating wafer adsorption, comprising a substrate having an insulating layer fixed to its surface, an electrostatic electrode disposed within the substrate, a mounting hole formed in the substrate, a liftable ejector pin disposed in the mounting hole, the end of the ejector pin being lower than the surface of the insulating layer, and a coolant circulation channel for the inlet and outlet of coolant formed in the substrate.

[0017] A supporting assembly is provided on the ejector pin, wherein the supporting assembly is expanded to be flush with the top surface of the ejector pin during the ascending phase of the ejector pin and is retracted during the descending phase of the ejector pin;

[0018] It also includes a plurality of regulating components that can assist in temperature regulation, and the regulating components are distributed at equal intervals along the cooling liquid circulation channel inside the base plate.

[0019] The supporting assembly includes a driving portion and a plurality of expansion portions, wherein the expansion portions are arranged on the top of the ejector pin and are flush with the top surface of the ejector pin;

[0020] The driving part is fixed on the inner wall of the mounting hole, and the driving part is arranged on the surface of the first driving unit that drives the ejector to move up and down;

[0021] The driving part is in transmission connection with the unfolding part, and the driving part drives the unfolding part to unfold or retract. The unfolding parts are distributed on the top of the ejector pin in a ring array.

[0022] In this technical solution, the expansion portion includes a first support plate, which is fixedly connected to the top side wall of the ejector pin. The outer end of the first support plate is rotatably connected to the second support plate, and the other end of the second support plate is rotatably connected to the third support plate. The top surfaces of the first support plate, the second support plate, and the third support plate can be flush with the top surface of the ejector pin.

[0023] The connection between the first support plate and the second support plate and the connection between the second support plate and the third support plate are both provided with a drive limiting part, which supports or contracts the connection between the first support plate, the second support plate and the third support plate, and the drive limiting part is connected to the driving part.

[0024] In the present technical solution, the drive limiting portion includes a connecting shell and a limiting hose. The connection between the first supporting plate and the second supporting plate and the connection between the second supporting plate and the third supporting plate are both fixed with a connecting shell. The connecting shells at the connection between the first supporting plate and the second supporting plate and at the connection between the second supporting plate and the third supporting plate are interconnected and communicated with each other through a plurality of limiting hoses. The drive limiting portions at the connection between the first supporting plate and the second supporting plate and between the second supporting plate and the third supporting plate are independent of each other, that is, they are not connected with each other.

[0025] Coil springs are provided at the connection between the first supporting plate and the second supporting plate, and at the connection between the second supporting plate and the third supporting plate, and the first supporting plate, the second supporting plate and the third supporting plate are placed in a contracted state through the coil springs.

[0026] Furthermore, the driving part includes a bearing shell, the bearing shell is an annular structure, the bearing shell is fixed to the inner wall of the mounting hole through a connecting rod, the bearing shell is sleeved on the first driving unit, and the first driving unit is one of a pneumatic rod or a hydraulic rod;

[0027] A dividing plate with an annular structure is fixed to the inner cavity of the carrying shell, and the dividing plate separates the inner cavity of the carrying shell to form two closed driving cavities, and a first driving member and a second driving member are respectively provided in the two driving cavities, and the first driving member and the second driving member slide in the two driving cavities respectively;

[0028] It also includes at least two moving shafts, one end of each moving shaft is fixed to the moving end of the first driving unit, and the other end of each moving shaft passes through the bottom outer wall of the carrying shell and is transmission-connected to the first driving member and the second driving member;

[0029] The two driving cavities are respectively connected to the corresponding driving limit parts through air guide tubes of sufficient length.

[0030] Specifically, the first driving member is located inside the lower driving chamber, and the first driving member includes a first piston with an annular structure. The first piston is slidably connected to the inner wall of the driving chamber and is in a sliding and sealing connection with the inner wall of the driving chamber. The first piston is provided with sliding through holes whose positions and number correspond to the positions and number of the movable shafts. The movable shafts can pass through the sliding through holes, and the connection between the movable shaft and the bottom of the sliding through holes is a sliding seal.

[0031] A first transmission cavity is formed on the top side walls of the first piston on both sides of the sliding through hole, a first transmission rod is fixed on the bottom side wall of the first transmission cavity, the first transmission cavity and the first transmission column on the bottom side wall of the partition plate can be plugged into each other, and an insertion cavity is formed on the bottom side wall of the first transmission column, and the insertion cavity and the first transmission rod can be plugged into each other;

[0032] The movable shaft passes through a connecting through hole on the surface of the partition plate and is connected to the second driving member, and the bottom of the connecting through hole is covered with a sealing portion.

[0033] In the present technical solution, the sealing part includes two slidingly connected sealing plates, which jointly cover the surface of the connecting through hole, and the two sealing plates are symmetrically distributed, and the two sealing plates are both slidingly connected to the bottom side wall of the partition plate. One end of the first transmission rope is fixed on the outer end face of the two partition plates, and the first transmission rope covers the surface of the plug-in cavity after passing through the guide wheel. The guide wheel is fixed on the side wall of the partition plate where the first transmission rope passes. The sealing plate and the partition plate are slidingly sealed, and a sealing strip is provided at the connection between the two partition plates.

[0034] In this technical solution, the second driving member includes a second piston, which is located inside the driving chamber at a high position. The second driving member includes a second piston with an annular structure, and the second piston is slidably connected to the inner wall of the corresponding driving chamber and is in a sliding and sealing connection with the inner wall of the driving chamber.

[0035] The bottom side wall of the second piston is provided with insertion holes whose positions and number correspond to the positions and number of the movable shafts. Symmetrical limiting parts are provided on both sides of the insertion holes, and the limiting parts can be clamped with the ear plates on the end of the movable shaft.

[0036] In the present technical solution, the limiting portion includes a limiting plate, which is slidably connected to a slide groove on the inner wall of the insertion hole in a horizontal direction, and a second spring is fixed to the limiting plate, and two ends of the second spring are respectively fixed to the limiting plate and the slide groove. One end of the limiting plate can be inserted into the insertion hole, and the other end of the limiting plate is fixed to a second transmission rope, and the other end of the second transmission rope passes through the inner wall of the second transmission cavity and is connected to the inner wall of the opposite side, that is, the second transmission rope passes through the central axis of the second transmission cavity;

[0037] The second transmission column can be inserted into the second transmission cavity, and the second transmission column can be connected to the second transmission rope;

[0038] The connection between the air guide tube and the driving chamber is located at the top of the driving chamber, and the thickness of the first piston is greater than the diameter of the hole at the connection between the air guide tube and the driving chamber.

[0039] In this technical solution, the regulating assembly includes a judgment module for regulating temperature and performing logical judgment, and a regulating shell. The regulating shell is fixed to the inner wall of the coolant circulation channel by a connecting rod. A piston plate is slidably connected to the inner cavity of the regulating shell, and a sliding seal is formed between the piston plate and the inner wall of the regulating shell.

[0040] The top and bottom of the regulating housing are both provided with a plurality of communicating tubes, and the top sidewall and bottom sidewall of the piston plate are provided with driven rods corresponding to the communicating tubes, and the driven rods can pass through the corresponding communicating tubes. A first sealing plug and a second sealing plug are fixed to both ends of the driven rods, respectively. The first sealing plug is fixed to the piston plate, and the first sealing plug can overlap and seal with the inner end of the communicating tube, and the second sealing plug can overlap and seal with the outer end of the communicating tube, and the outer end and the inner end of the communicating tube are respectively located outside and inside the regulating housing;

[0041] A sliding drive member is fixed on the piston plate, which can drive it to slide in the inner cavity of the adjustment shell. A cooling unit and a heating unit are set on the inner side wall of the adjustment shell. The cooling unit and the heating unit are preferably existing cooling and heating devices of appropriate size, such as semiconductor cooling sheets and electric heating wires, and supporting equipment.

[0042] The judgment module includes a temperature sensor and a matching processing chip, and temperature sensors are installed inside and outside the adjustment shell.

[0043] The sliding drive member includes a second drive unit, which is connected to a drive rod. The drive rod passes through the side wall of the adjustment housing and is connected to the piston plate. The connection between the drive rod and the adjustment housing is a sliding sealing connection.

[0044] On the basis of conforming to the common sense in this field, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present invention.

[0045] The positive progress effect of the present invention is:

[0046] The expandable support assembly increases the contact area between the ejector pins and the wafer, reducing the possibility of damage to the wafer when the ejector pins are ejected or retracted.

[0047] Adjustment of the local temperature of the electrostatic chuck can be further assisted by adjusting the assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 It is a schematic structural diagram of the present invention as a whole;

[0049] Figure 2 This is a schematic diagram of the structure of the present invention with a supporting component;

[0050] Figure 3 It is a structural schematic diagram of the supporting assembly of the present invention;

[0051] Figure 4 This is a schematic diagram of the structure of the present invention when the expansion portion is contracted;

[0052] Figure 5 This is a schematic structural diagram of the driving portion of the present invention when the expansion portion is retracted;

[0053] Figure 6 This is a schematic diagram of the single-side structure of the load-bearing shell of the present invention;

[0054] Figure 7 Schematic diagram of the positional relationship among the first driving member, the second driving member and the partition plate of the present invention;

[0055] Figure 8 Schematic diagram of a half-section structure of the first piston of the present invention;

[0056] Figure 9 This is a structural schematic diagram of the supporting assembly when the unfolding portion of the present invention is in a semi-expanded state;

[0057] Figure 10 This is a schematic structural diagram of the expansion portion of the present invention in a semi-expanded state;

[0058] Figure 11 This is a schematic structural diagram of the driving portion of the present invention when the deployment portion is half deployed;

[0059] Figure 12 For the present invention Figure 11 Schematic diagram of the single-side structure of the middle load-bearing shell;

[0060] Figure 13 For the present invention Figure 12 A local enlarged structural diagram of point A;

[0061] Figure 14 This is a schematic structural diagram of the supporting assembly when the deployment portion of the present invention is in a fully deployed state;

[0062] Figure 15 This is a schematic structural diagram of the present invention when the expansion portion is in a fully expanded state;

[0063] Figure 16 This is a schematic structural diagram of the drive limiter of the present invention;

[0064] Figure 17 This is a schematic diagram of the overall structure of the present invention with an adjustment component;

[0065] Figure 18 This is a schematic diagram of the connection structure between the regulating assembly and the coolant circulation channel of the present invention;

[0066] Figure 19 Schematic diagram of the structure of the adjustment component of the present invention.

[0067] The following are the descriptions of the reference numerals:

[0068] In the accompanying drawings: 1. substrate; 11. electrostatic electrode; 12. insulating layer; 13. coolant circulation channel; 2. ejector pin; 21. first drive unit; 3. adjustment assembly; 31. adjustment shell; 32. piston plate; 33. second drive unit; 331. drive rod; 34. driven rod; 35. first sealing plug; 36. second sealing plug; 37. connecting pipe; 4. drive unit; 41. bearing shell; 42. air guide tube; 5. expansion unit; 51. first support plate; 52. second support plate; 53. third support plate ;54. Connecting shell;55. Limiting hose;6. First driving member;61. First piston;62. First transmission chamber;63. First transmission rod;64. Sliding through hole;7. Second driving member;71. Second piston;72. Insertion hole;73. Limiting plate;74. Second transmission rope;75. Second transmission chamber;8. Partition plate;81. Second transmission column;82. First transmission column;83. Plug-in chamber;84. First transmission rope;85. Sealing plate;86. Connecting through hole;9. Moving shaft;91. Ear plate. DETAILED DESCRIPTION

[0069] The present invention is further described below by way of examples, but the present invention is not limited to the specific examples.

[0070] like Figure 1 and Figure 2 As shown, an electrostatic chuck for facilitating wafer adsorption includes a substrate 1, an insulating layer 12 fixed to the surface of the substrate 1, an electrostatic electrode 11 disposed inside the substrate 1, a mounting hole formed on the substrate 1, a liftable ejector pin 2 disposed on the mounting hole, the end of the ejector pin 2 being lower than the surface of the insulating layer, and a coolant circulation channel 13 for the inlet and outlet of coolant formed on the substrate 1;

[0071] A supporting assembly is provided on the ejector pin 2. The supporting assembly is expanded to be flush with the top surface of the ejector pin 2 during the ascending phase of the ejector pin 2 and is retracted during the descending phase of the ejector pin 2.

[0072] It also includes a plurality of regulating components 3 that can assist in temperature regulation. The regulating components 3 are distributed at equal intervals along the cooling liquid circulation channel 13 inside the substrate 1 .

[0073] The contact area between the ejector pins 2 and the wafer is increased by the expandable support assembly, thereby reducing the possibility of damage to the wafer when the ejector pins 2 are ejected or retracted.

[0074] The adjustment component 3 can further assist in adjusting the local temperature of the electrostatic chuck.

[0075] Example 1

[0076] As one of the embodiments of the present technical solution, the supporting assembly includes a driving portion 4 and a plurality of expansion portions 5, wherein the expansion portion 5 is provided on the top of the ejector pin 2, and the expansion portion 5 is flush with the top surface of the ejector pin 2;

[0077] The driving part 4 is fixed on the inner wall of the mounting hole, and the driving part 4 is arranged on the surface of the first driving unit 21 that drives the ejector pin 2 to move up and down;

[0078] The driving portion 4 is in transmission connection with the unfolding portion 5 , and the driving portion 4 drives the unfolding portion 5 to unfold or retract. The unfolding portions 5 are distributed on the top of the ejector pin 2 in a ring array.

[0079] Specifically, as shown in FIG. 4 , the unfolding portion 5 includes a first supporting plate 51, which is fixedly connected to the top side wall of the ejector pin 2. The outer end of the first supporting plate 51 is rotatably connected to the second supporting plate 52, and the other end of the second supporting plate 52 is rotatably connected to the third supporting plate 53. The top surfaces of the first supporting plate 51, the second supporting plate 52, and the third supporting plate 53 can be flush with the top surface of the ejector pin 2.

[0080] The connection between the first supporting plate 51 and the second supporting plate 52 and the connection between the second supporting plate 52 and the third supporting plate 53 are both provided with a driving limiting part, which supports or contracts the connection between the first supporting plate 51, the second supporting plate 52 and the third supporting plate 53, and the driving limiting part is connected to the driving part 4.

[0081] By unfolding the second supporting plate 52 and the third supporting plate 53 , the contact area between the ejector pins 2 and the wafer is increased.

[0082] Specifically, such as Figure 4 and Figure 16 As shown, the driving limiting portion includes a connecting shell 54 and a limiting hose 55. The connecting shell 54 is fixed to the connection between the first supporting plate 51 and the second supporting plate 52 and the connection between the second supporting plate 52 and the third supporting plate 53. The connecting shells 54 at the connection between the first supporting plate 51 and the second supporting plate 52 and the connection between the second supporting plate 52 and the third supporting plate 53 are connected and communicated with each other through a plurality of limiting hoses 55. The driving limiting portions at the connection between the first supporting plate 51 and the second supporting plate 52 and the second supporting plate 52 and the third supporting plate 53 are independent of each other, that is, they are not communicated with each other. The driving portion 4 is used to blow air into the limiting hose 55 to prop up the limiting hose 55 and then straighten it, so that the second supporting plate 52 and the third supporting plate 53 are rotated and unfolded. The limiting hose 55 is made of soft material, but it does not need to have ductility.

[0083] Coil springs are provided at the connection between the first support plate 51 and the second support plate 52, as well as at the connection between the second support plate 52 and the third support plate 53. The coil springs keep the first support plate 51, the second support plate 52 and the third support plate 53 in a contracted state. When the second support plate 52 and the third support plate 53 rotate and unfold, the coil springs deform to generate elastic potential energy, providing a basis for the subsequent contraction of the second support plate 52 and the third support plate 53.

[0084] The driving part 4 includes a bearing shell 41, which is an annular structure and is fixed to the inner wall of the mounting hole through a connecting rod. The bearing shell 41 is sleeved on the first driving unit 21, and the first driving unit 21 is either a pneumatic rod or a hydraulic rod.

[0085] A ring-shaped partition plate 8 is fixed to the inner cavity of the carrier shell 41. The partition plate 8 separates the inner cavity of the carrier shell 41 to form two sealed driving cavities. A first driving member 6 and a second driving member 7 are respectively disposed in the two driving cavities. The first driving member 6 and the second driving member 7 slide in the two driving cavities respectively.

[0086] The movable shaft 9 further includes at least two movable shafts 9, one end of which is fixed to the movable end of the first drive unit 21, and the other end of which passes through the bottom outer wall of the carrying shell 41 and is transmission-connected to the first drive member 6 and the second drive member 7. A first spring is sleeved on the surface of the movable shaft 9, and the two ends of the first spring are respectively fixed to the first piston 61 and the movable shaft 9. The elastic force provided by the first spring is greater than the friction force between the first piston 61 and the inner wall of the carrying shell 41. The first spring is not shown in the figure. The movable shaft 9 moves upward synchronously when the first drive unit 21 rises. During the upward movement of the movable shaft 9, the first piston 61 on the first drive member 6 is driven to move by the first spring. At this time, the first spring does not deform or deforms slightly.

[0087] The two driving chambers are respectively connected to the corresponding driving limit parts through air guide tubes 42 of sufficient length. The corresponding air guide tubes 42 are inflated through the first driving member 6 and the second driving member 7, and the gas enters the corresponding limit hose 55 through the air guide tubes 42.

[0088] The first driving member 6 is located inside the lower driving chamber. The first driving member 6 includes a first piston 61 of an annular structure. The first piston 61 is slidably connected to the inner wall of the driving chamber and is in a sliding and sealed connection with the inner wall of the driving chamber. The first piston 61 is provided with sliding holes 64 whose positions and number correspond to the positions and number of the movable shafts 9. The movable shafts 9 can pass through the sliding holes 64. The connection between the movable shaft 9 and the bottom of the sliding holes 64 is a sliding seal.

[0089] A first transmission cavity 62 is formed on the top side wall of the first piston 61 on both sides of the sliding through hole 64. A first transmission rod 63 is fixed to the bottom side wall of the first transmission cavity 62. The first transmission cavity 62 and the first transmission column 82 on the bottom side wall of the partition plate 8 can be plugged into each other. The bottom side wall of the first transmission column 82 is formed with an insertion cavity 83, and the insertion cavity 83 can be plugged into the first transmission rod 63.

[0090] The movable shaft 9 passes through a connecting through hole 86 on the surface of the partition plate 8 and is connected to the second driving member 7 . The bottom of the connecting through hole 86 is covered with a sealing portion.

[0091] The sealing portion includes two slidingly connected sealing plates 85, which jointly cover the surface of the connecting through hole 86, and the two sealing plates 85 are symmetrically distributed, and the two sealing plates 85 are both slidingly connected to the bottom side wall of the partition plate 8. One end of the first transmission rope 84 is fixed on the outer end face of the two partition plates 8. The first transmission rope 84 covers the surface of the plug-in cavity 83 after passing through the guide wheel, and the guide wheel is fixed on the side wall of the partition plate 8 through which the first transmission rope 84 passes. The sealing plate 85 and the partition plate 8 are slidingly sealed, and a sealing strip is provided at the connection between the two partition plates 8.

[0092] The first driving unit 21 drives the ejector pin 2 to move upward. When the moving end of the first driving unit 21 moves upward, it drives the moving shaft 9 to move upward. The moving shaft 9 drives the first piston 61 to move upward through the first spring. During the upward movement, the first piston 61 presses the gas in the corresponding driving chamber into the limiting hose 55 between the second supporting plate 52 and the third supporting plate 53 through the air guide pipe 42, so that the supporting assembly is in a semi-expanded state. Figure 10 shown.

[0093] When the first piston 61 moves to the partition plate 8, the first transmission rod 63 is inserted into the plug-in cavity 83 on the first transmission column 82. During the process of the first transmission rod 63 being inserted into the plug-in cavity 83, the second transmission rope 74 is pushed to move, thereby pulling the sealing plate 85 to slide, causing the sealing plate 85 to slide to both sides and no longer cover the connecting through hole 86.

[0094] A third spring is fixed on each of the two sealing plates 85 , and both ends of the third spring are fixed on the sealing plate 85 and the partition plate 8 respectively. During the above process, the third spring is deformed, and the third spring is not shown in the figure.

[0095] The second driving member 7 includes a second piston 71, which is located inside the driving chamber at a high position. The second driving member 7 includes a second piston 71 with an annular structure. The second piston 71 is slidably connected to the inner wall of the corresponding driving chamber and is in a sliding and sealing connection with the inner wall of the driving chamber.

[0096] The bottom side wall of the second piston 71 is provided with insertion holes 72 whose positions and number correspond to the positions and number of the movable shaft 9. Symmetrical limiting parts are provided on both sides of the insertion hole 72, which can be engaged with the ear plate 91 on the end of the movable shaft 9.

[0097] The limiting portion includes a limiting plate 73, which is slidably connected to a slide groove on the inner wall of the insertion hole 72 in the horizontal direction, and a second spring is fixed to the limiting plate 73, and the two ends of the second spring are respectively fixed to the limiting plate 73 and the slide groove. One end of the limiting plate 73 can be inserted into the insertion hole 72, and the other end of the limiting plate 73 is fixed to a second transmission rope 74. The other end of the second transmission rope 74 passes through the inner wall of the second transmission cavity 75 and is connected to the inner wall of the opposite side. That is, the second transmission rope 74 passes through the central axis of the second transmission cavity 75. The elastic force provided by the second spring is less than the friction force between the second piston 71 and the inner wall of the bearing shell 41. The second spring is not shown in the figure;

[0098] The second transmission column 81 can be inserted into the second transmission cavity 75, and the second transmission column 81 can be connected to the second transmission rope 74;

[0099] The connection between the air duct 42 and the drive chamber is located at the top of the drive chamber. The thickness of the first piston 61 is greater than the diameter of the hole at the connection between the corresponding air duct 42 and the drive chamber. When the first piston 61 slides to the connection between the corresponding air duct 42 and the drive chamber, the first piston 61 can seal the hole at the connection between the air duct 42 and the drive chamber. At this time, the first piston 61 slides and overlaps with the partition plate 8.

[0100] When the moving shaft 9 drives the first piston 61 to move to the partition plate 8, the moving shaft 9 continues to move upward with the first driving unit 21. The moving shaft 9 compresses the first spring during the process of continuing to move upward, and then passes through the connecting through hole 86 to the inner wall of the insertion hole 72 on the second piston 71. The moving shaft 9 that continues to move upward drives the second piston 71 to move upward. During the process of moving upward, the second piston 71 presses the gas in the corresponding driving chamber into the limiting hose 55 between the first supporting plate 51 and the second supporting plate 52 through the air guide pipe 42, so that the first supporting plate 51, the second supporting plate 52 and the third supporting plate 53 are in a fully expanded state. Figure 15 As shown, during the process of the expansion portion 5 moving from the contracted state to the fully expanded state, the ejector pin 2 continues to move upward, and during the process of moving from the semi-expanded state to the fully expanded state, the first supporting plate 51, the second supporting plate 52 and the third supporting plate 53 do not contact the inside of the mounting hole.

[0101] When the second piston 71 is driven upward during movement, the second transmission chamber 75 on the second piston 71 gradually disengages from the second transmission column 81, and the second transmission column 81 no longer presses the second transmission rope 74. The limit plate 73 connected to the second transmission rope 74 moves toward one side of the ear plate 91 under the action of the second spring, thereby being engaged with the bottom of the ear plate 91. When the ejector pin 2 contracts, the moving shaft 9 drives the second piston 71 to reset through the engagement between the ear plate 91 and the limit plate 73.

[0102] During the process of resetting the second piston 71 to the partition plate 8, the second transmission chamber 75 covers the second transmission column 81, and the second transmission column 81 pushes the second transmission rope 74 to move. The second transmission rope 74 drives the limit plate 73 to move to both sides, so that the limit plate 73 disengages from the ear plate 91, thereby disengaging the moving shaft 9 from the second piston 71. After disengagement, the moving shaft 9 continues to retract to the bottom of the partition plate 8, thereby driving the first piston 61 to reset.

[0103] During the resetting process of the first piston 61 , the first transmission rod 63 gradually disengages from the insertion cavity 83 , thereby no longer restricting the first transmission rope 84 . Under the action of the third spring, the two sealing plates 85 are reset, thereby sealing the connecting through hole 86 again.

[0104] The air is exhausted, so that the supporting assembly is contracted during the downward movement of the ejector pin 2.

[0105] Example 2

[0106] As one of the embodiments of this technical solution, Figure 18 and 19 As shown, the regulating assembly 3 includes a judgment module for regulating temperature and performing logical judgment, and a regulating shell 31. The regulating shell 31 is fixed to the inner wall of the coolant circulation channel 13 by a connecting rod. A piston plate 32 is slidably connected to the inner cavity of the regulating shell 31. A sliding seal is formed between the piston plate 32 and the inner wall of the regulating shell 31.

[0107] The top and bottom of the regulating housing 31 are both provided with a plurality of communicating tubes 37. The top and bottom side walls of the piston plate 32 are provided with driven rods 34 corresponding to the communicating tubes 37. The driven rods 34 can pass through the corresponding communicating tubes 37. A first sealing plug 35 and a second sealing plug 36 are fixed to both ends of the driven rod 34, respectively. The first sealing plug 35 is fixed to the piston plate 32. The first sealing plug 35 can overlap and seal the inner end of the communicating tube 37. The second sealing plug 36 can overlap and seal the outer end of the communicating tube 37. The outer end and the inner end of the communicating tube 37 are respectively located outside and inside the regulating housing 31.

[0108] A sliding drive member is fixed to the piston plate 32 to drive it to slide in the inner cavity of the adjustment shell 31. A cooling unit and a heating unit are provided on the inner side wall of the adjustment shell 31. The cooling unit and the heating unit are preferably existing cooling and heating devices of appropriate size, such as semiconductor cooling sheets and electric heating wires, and supporting equipment.

[0109] The judgment module includes a temperature sensor and a matching processing chip. Temperature sensors are installed inside and outside the adjustment shell 31.

[0110] The temperature sensor is electrically connected to the processing chip. The temperature sensor monitors the internal temperature of the coolant circulation channel 13. When the temperature of the area where the adjustment component 3 is located increases or decreases significantly, the refrigeration unit and the heating unit quickly heat or reduce the temperature of the medium inside the corresponding adjustment shell 31, and then start the sliding drive member to drive the piston plate 32 to move and discharge the medium in the piston plate 32 to achieve the purpose of quickly adjusting the local temperature of the electrostatic suction cup. At the same time, an equal amount of medium inside the coolant circulation channel 13 is extracted into the inner cavity of the adjustment shell 31 to facilitate the next adjustment, and no medium will be added during the adjustment process.

[0111] The sliding drive member includes a second drive unit 33, which is connected to a drive rod 331. The drive rod 331 passes through the side wall of the adjustment housing 31 and is connected to the piston plate 32. The connection between the drive rod 331 and the adjustment housing 31 is a sliding sealed connection.

[0112] The first spring, the second spring, the third spring and the coil spring in the present application can be made of high-temperature spring materials, for example, ceramic springs and springs made of other high-temperature resistant materials can be used.

[0113] High temperature resistant materials may include Inconel X-750 and Inconel 718 in nickel-based alloys, and Ti-6Al-4V in titanium alloys.

[0114] The present invention is not limited to the above-described embodiments. Any changes in shape or structure fall within the scope of protection of the present invention. The scope of protection of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention. Such changes and modifications shall fall within the scope of protection of the present invention.

Claims

1. An electrostatic chuck for facilitating wafer adsorption, comprising a substrate (1), an insulating layer (12) fixed to the surface of the substrate (1), an electrostatic electrode (11) provided inside the substrate (1), a mounting hole provided on the substrate (1), a liftable ejector pin (2) provided on the mounting hole, an end of the ejector pin (2) being lower than the surface of the insulating layer, a coolant circulation channel (13) for the inlet and outlet of coolant provided on the substrate (1), characterized in that: It also includes a supporting assembly, the supporting assembly being arranged on the ejector pin (2), the supporting assembly being expanded to be flush with the top surface of the ejector pin (2) when the ejector pin (2) is in the ascending stage, and the supporting assembly being retracted when the ejector pin (2) is in the descending stage; It also includes a plurality of regulating components (3) for assisting temperature regulation, wherein the regulating components (3) are distributed at equal intervals along the cooling liquid circulation channel (13) inside the substrate (1); The supporting assembly comprises a driving portion (4) and a plurality of expansion portions (5), wherein the expansion portions (5) are arranged on the top of the ejector pin (2), and the expansion portions (5) are flush with the top surface of the ejector pin (2); The driving part (4) is fixed on the inner wall of the mounting hole, and the driving part (4) is arranged on the surface of the first driving unit (21) that drives the ejector pin (2) to move up and down; The driving portion (4) is in transmission connection with the unfolding portion (5), and the driving portion (4) drives the unfolding portion (5) to unfold or retract. The unfolding portions (5) are distributed in a ring array on the top of the ejector pin (2).

2. The electrostatic chuck for facilitating wafer adsorption according to claim 1, wherein: The unfolding portion (5) includes a first supporting plate (51), the first supporting plate (51) is fixedly connected to the top side wall of the ejector pin (2), the outer end of the first supporting plate (51) is rotatably connected to the second supporting plate (52), and the other end of the second supporting plate (52) is rotatably connected to the third supporting plate (53), and the top surfaces of the first supporting plate (51), the second supporting plate (52) and the third supporting plate (53) are flush with the top surface of the ejector pin (2); A driving limit portion is provided at the connection between the first supporting plate (51) and the second supporting plate (52) and the connection between the second supporting plate (52) and the third supporting plate (53). The driving limit portion supports or contracts the connection between the first supporting plate (51), the second supporting plate (52) and the third supporting plate (53), and the driving limit portion is connected to the driving portion (4).

3. The electrostatic chuck for facilitating wafer adsorption according to claim 2, wherein: The driving limiting portion comprises a connecting shell (54) and a limiting hose (55); the connecting portion between the first supporting plate (51) and the second supporting plate (52) and the connecting portion between the second supporting plate (52) and the third supporting plate (53) are both fixed with the connecting shell (54); the connecting portions between the first supporting plate (51) and the second supporting plate (52) and the connecting portions between the second supporting plate (52) and the third supporting plate (53) are connected and communicated with each other via a plurality of limiting hoses (55); Coil springs are provided at the connection between the first supporting plate (51) and the second supporting plate (52), and at the connection between the second supporting plate (52) and the third supporting plate (53).

4. The electrostatic chuck for facilitating wafer adsorption according to claim 2, wherein: The driving part (4) comprises a bearing shell (41), the bearing shell (41) is an annular structure, the bearing shell (41) is fixed to the inner wall of the mounting hole via a connecting rod, and the bearing shell (41) is sleeved on the first driving unit (21); A partition plate (8) of an annular structure is fixed to the inner cavity of the bearing shell (41), and the partition plate (8) separates the inner cavity of the bearing shell (41) to form two closed driving cavities, and a first driving member (6) and a second driving member (7) are respectively provided in the two driving cavities, and the first driving member (6) and the second driving member (7) are respectively slidably connected in the two driving cavities; It also includes at least two moving shafts (9), one end of the moving shaft (9) is fixed to the moving end of the first driving unit (21), and the other end of the moving shaft (9) passes through the bottom outer wall of the bearing shell (41) and is transmission-connected to the first driving member (6) and the second driving member (7), and a first spring is sleeved on the surface of the moving shaft (9), and the two ends of the first spring are respectively fixed to the first piston (61) and the moving shaft (9); The two driving cavities are respectively connected to corresponding driving limit parts through air guide tubes (42) of sufficient length.

5. The electrostatic chuck for facilitating wafer adsorption according to claim 4, wherein: The first driving member (6) is located inside the driving chamber at a lower position. The first driving member (6) includes a first piston (61) of an annular structure. The first piston (61) is slidably connected to the inner wall of the driving chamber and is in a sliding sealing connection with the inner wall of the driving chamber. The first piston (61) is provided with sliding through holes (64) whose positions and number correspond to the positions and number of the moving shafts (9). The moving shafts (9) pass through the sliding through holes (64). The connection between the moving shafts (9) and the bottom of the sliding through holes (64) is a sliding seal. A first transmission cavity (62) is provided on the top side wall of the first piston (61) on both sides of the sliding through hole (64), a first transmission rod (63) is fixed on the bottom side wall of the first transmission cavity (62), the first transmission cavity (62) and the first transmission column (82) on the bottom side wall of the partition plate (8) are plugged into each other, an insertion cavity (83) is provided on the bottom side wall of the first transmission column (82), and the insertion cavity (83) and the first transmission rod (63) are plugged into each other; The movable shaft (9) passes through a connecting through hole (86) on the surface of the partition plate (8) and is connected to the second driving member (7), and the bottom of the connecting through hole (86) is covered with a sealing portion.

6. The electrostatic chuck for facilitating wafer adsorption according to claim 5, wherein: The sealing portion includes two slidingly connected sealing plates (85), the two sealing plates (85) jointly covering the surface of the connecting through hole (86), and the two sealing plates (85) are symmetrically distributed, and the two sealing plates (85) are both slidingly connected to the bottom side wall of the partition plate (8), and one end of the first transmission rope (84) is fixed on the outer end surface of each of the two partition plates (8), and the first transmission rope (84) covers the surface of the plug-in cavity (83) after passing through the guide wheel, and the guide wheel is fixed on the side wall of the partition plate (8) through which the first transmission rope (84) passes.

7. The electrostatic chuck for facilitating wafer adsorption according to claim 5, wherein: The second driving member (7) includes a second piston (71), the second driving member (7) is located inside the driving chamber at a high position, the second driving member (7) includes a second piston (71) with an annular structure, the second piston (71) is slidably connected to the inner wall of the corresponding driving chamber, and is in a sliding sealing connection with the inner wall of the driving chamber; The bottom side wall of the second piston (71) is provided with insertion holes (72) whose positions and number correspond to the positions and number of the movable shafts (9). Symmetrical limiting portions are provided on both sides of the insertion holes (72), and the limiting portions are engaged with the ear plates (91) on the end of the movable shaft (9).

8. The electrostatic chuck for facilitating wafer adsorption according to claim 7, wherein: The limiting portion includes a limiting plate (73), the limiting plate (73) is slidably connected to a slide groove on the inner wall of the insertion hole (72) in a horizontal direction, and a second spring is fixed to the limiting plate (73), one end of the limiting plate (73) is inserted into the insertion hole (72), and the other end of the limiting plate (73) is fixed to a second transmission rope (74), and the other end of the second transmission rope (74) passes through the inner wall of the second transmission cavity (75) and is connected to the inner wall of the opposite side; A second transmission column (81) is inserted into the second transmission cavity (75), and the second transmission column (81) is overlapped with the second transmission rope (74); The connection between the air guide tube (42) and the drive chamber is located at the top of the drive chamber, and the thickness of the first piston (61) is greater than the diameter of the hole at the connection between the air guide tube (42) and the drive chamber.

9. The electrostatic chuck for facilitating wafer adsorption according to claim 1, wherein: The regulating assembly (3) includes a judgment module for regulating temperature and performing logical judgment, and a regulating shell (31), wherein the regulating shell (31) is fixed to the inner wall of the coolant circulation channel (13) via a connecting rod, and a piston plate (32) is slidably connected in the inner cavity of the regulating shell (31), and a sliding seal is formed between the piston plate (32) and the inner wall of the regulating shell (31); A plurality of connecting tubes (37) are provided on the top and bottom of the regulating housing (31), and driven rods (34) corresponding to the connecting tubes (37) are provided on the top side wall and the bottom side wall of the piston plate (32). The driven rods (34) pass through the corresponding connecting tubes (37), and a first sealing plug (35) and a second sealing plug (36) are fixed to both ends of the driven rod (34), respectively. The first sealing plug (35) is fixed to the piston plate (32), and the first sealing plug (35) overlaps and seals the inner end of the connecting tube (37), and the second sealing plug (36) overlaps and seals the outer end of the connecting tube (37); A sliding drive member is fixed on the piston plate (32) to drive it to slide in the inner cavity of the regulating shell (31), and a refrigeration unit and a heating unit are arranged on the inner side wall of the regulating shell (31); The judgment module includes a temperature sensor and a matching processing chip, and temperature sensors are installed inside and outside the regulating shell (31).

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