Wafer overturning device and method and wafer processing equipment

Abstract

The invention provides a wafer turnover device and method and wafer processing equipment. The wafer turnover device comprises a supporting unit, a wafer turnover unit and a control unit, the clamping unit comprises two clamping assemblies, and the two clamping assemblies are arranged on the supporting unit in a spaced mode in the first direction; the moving unit is connected to the clamping unit, and the moving unit drives the two clamping assemblies to move face to face or back to back in the first direction; the overturning unit is connected with the clamping unit, and the overturning unit can drive the clamping unit to drive the wafer to overturn; the detection unit is used for detecting actual clamping information applied to the wafer by the clamping assembly, and the actual clamping information comprises at least one of the actual clamping information and the actual clamping position; and the control unit is used for controlling the moving unit to enable the two clamping assemblies to move towards each other or away from each other according to the actual clamping information and preset target clamping information. According to the wafer turnover device and method and the wafer processing equipment disclosed by the invention, the wafer fragmentation phenomenon can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a wafer flipping device and method, and wafer processing equipment. Background Art

[0002] The processing of semiconductor devices includes many steps, and different steps are often performed on different processing surfaces of the wafer. For example, in some processes, both the front and back sides of the wafer need to be processed. However, most of the current processing equipment can only process one side of the wafer, which cannot meet the process requirements of two-sided processing. Therefore, the wafer can be clamped by a wafer flipping device and flipped 180 degrees to process the front and back sides of the wafer separately.

[0003] However, in the prior art, the wafer flipping device is not easy to make the contact area of ​​the wafer too large, and can only clamp the edge of the wafer. During the wafer flipping process, the wafer is prone to breakage and other problems. Summary of the invention

[0004] In order to solve at least one technical solution in the above-mentioned prior art, the embodiments of the present disclosure provide a wafer flipping device and method, and wafer processing equipment.

[0005] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0006] In a first aspect, an embodiment of the present disclosure provides a wafer flipping device, comprising:

[0007] Support unit;

[0008] A clamping unit, comprising two clamping assemblies for clamping two sides of the edge of the wafer respectively, wherein the two clamping assemblies are arranged on the supporting unit at intervals from each other along a first direction;

[0009] A moving unit connected to the clamping unit, wherein the moving unit is configured to drive the two clamping assemblies to move toward or away from each other along the first direction;

[0010] A flip unit connected to the clamping unit, wherein the flip unit is configured to drive the clamping unit to flip the wafer;

[0011] A detection unit connected to the clamping unit, the detection unit being used to detect actual clamping information applied by the clamping assembly to the wafer;

[0012] The control unit is connected to the detection unit and the moving unit respectively, and is used to control the moving unit to make the two clamping components move toward or away from each other according to the actual clamping information and the preset target clamping information.

[0013] Exemplarily, the control unit is specifically used for:

[0014] Based on the actual clamping information and the target clamping information, obtaining a distance adjustment parameter of the two clamping components;

[0015] Based on the distance adjustment parameter, the moving unit is controlled to move the two clamping assemblies so that the distance between the two clamping assemblies along the first direction is a target distance.

[0016] Exemplarily, the support unit includes: a base and two support components arranged on the base, each of the support components extends along a second direction perpendicular to the first direction, and the two support components are arranged at intervals from each other in the first direction, and one of the clamping components is movably connected to a corresponding one of the support components.

[0017] Exemplarily, the wafer flipping device also includes: a wafer picking and placing unit, the wafer picking and placing unit is connected to the supporting unit, the wafer picking and placing unit includes a wafer holding part and a moving part, the wafer holding part is used to hold the wafer, and the wafer holding part is constructed to be movable under the drive of the moving part to perform the operation of picking and placing the wafer; the control unit is also connected to the wafer picking and placing unit, and the control unit is also used to control the wafer picking and placing unit to perform the wafer picking and placing operation.

[0018] Exemplarily, the wafer handling unit includes a robot, the robot includes a robot arm and an execution end, the moving part includes the robot arm, and the wafer holding part includes the execution end.

[0019] Exemplarily, the wafer holding portion includes a wafer carrying area; wherein, the wafer holding portion also includes a plurality of holding portions distributed around the wafer carrying area, and the plurality of holding portions are used to hold the edge of the wafer; and / or, the wafer holding portion also includes a plurality of adsorption structures arranged on the carrying surface of the wafer carrying area, and the plurality of adsorption structures are used to adsorb and fix the wafer.

[0020] Exemplarily, the clamping assembly includes a clamping end for contacting the wafer; the detection unit includes a pressure sensor, and the pressure sensor is arranged on the clamping end.

[0021] Exemplarily, the wafer flipping device further includes: an alarm unit connected to the control unit, and the control unit is further configured to control the alarm unit to send out an alarm signal when the difference between the actual clamping information and the target clamping information is greater than a threshold value.

[0022] In a second aspect, an embodiment of the present disclosure further provides a wafer flipping method, which is applied to the wafer flipping device as described above, and the method comprises:

[0023] The two clamping assemblies of the clamping unit clamp two sides of the edge of the wafer respectively;

[0024] Detecting actual clamping information applied by the clamping assembly to the wafer through the detection unit;

[0025] According to the actual clamping information and the preset target clamping information, controlling the moving unit to make the two clamping components move toward or away from each other, so that the actual clamping information reaches the target clamping information;

[0026] The flipping unit drives the clamping unit to flip the wafer.

[0027] In a third aspect, an embodiment of the present disclosure further provides a wafer processing device, comprising the wafer flipping device as described above.

[0028] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0029] In the wafer flipping device and method, and wafer processing equipment provided by the embodiments of the present disclosure, a supporting unit, a clamping unit, a moving unit, a flipping unit, a detection unit and a control unit are provided in the wafer flipping device, wherein the clamping unit may include two clamping components, and the two clamping components may be clamped on both sides of the edge of the wafer respectively, and the two clamping components may drive the wafer to flip under the drive of the flipping unit to achieve the purpose of wafer flipping; and the two clamping components are also driven by the moving unit to approach or move away from each other along a first direction to adjust the distance between the two clamping components along the first direction, and the detection unit may detect the actual clamping information applied by the clamping unit to the wafer, and the control unit may control the moving unit to move the two clamping components closer to or away from each other according to the detected actual clamping information and the preset target clamping information.

[0030] In this way, by detecting the actual clamping information of the wafer, the clamping information such as the clamping force and / or clamping position of the wafer can be accurately quantified, so that the position of the clamping component can be adjusted according to the actual clamping information and the target clamping information, and automatic adjustment of the clamping force and / or clamping position of the wafer can be achieved, so as to ensure that the clamping force and / or clamping position of the wafer is more reasonable, and avoid the problem of wafer breakage caused by factors such as improper clamping force and / or improper clamping position. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram showing the structure of a wafer flipping device in some embodiments of the present disclosure;

[0032] FIG. 2A to FIG. 2D A schematic diagram showing a wafer pick-up and placement process of a wafer flipping device in some embodiments of the present disclosure;

[0033] Figure 3 A structural block diagram of a control unit in an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0035] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0037] In addition, in this document, unless otherwise defined, the terms "substantially", "substantially", "approximately" and "about" are used to describe and explain small changes. When used with an event or situation, these terms can cover situations where the event or situation occurs exactly, and can also cover situations where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being arranged along the same plane in the micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0038] like Figure 1 and Figure 3 As shown, the wafer flipping device provided in the embodiment of the present disclosure includes:

[0039] Support unit 100;

[0040] The clamping unit 200 includes two clamping assemblies 210 for clamping two sides of the edge of the wafer respectively, and the two clamping assemblies 210 are arranged on the supporting unit 100 at intervals from each other along the first direction X;

[0041] A moving unit 300 connected to the clamping unit 200, wherein the moving unit 300 is configured to drive the two clamping assemblies 210 to move toward or away from each other along the first direction X;

[0042] A flip unit 400 connected to the clamping unit 200, wherein the flip unit 400 is configured to drive the clamping unit 200 to flip the wafer;

[0043] A detection unit 500 connected to the clamping unit 200, the detection unit 500 is used to detect actual clamping information applied by the clamping assembly 210 to the wafer, wherein the actual clamping information includes at least one of a clamping force and a clamping position;

[0044] The control unit 600 is connected to the detection unit 500 and the moving unit 300 respectively. The control unit 600 is used to control the moving unit 300 to make the two clamping components 210 move toward or away from each other according to the actual clamping information and the preset target clamping information, so as to adjust the distance between the two clamping components 210 along the first direction X.

[0045] In the above scheme, the two clamping components 210 of the clamping unit 200 can be clamped on both sides of the edge of the wafer respectively, and the two clamping components 210 can drive the wafer to flip under the drive of the flipping unit 400 to achieve the purpose of wafer flipping; and, the two clamping components 210 are also driven by the moving unit 300 to approach or move away from each other along the first direction X, so that the distance between the two clamping components 210 along the first direction X can be adjusted, and the detection unit 500 can detect the actual clamping information applied by the clamping unit 200 to the wafer, and the control unit 600 can control the moving unit 300 to move the two clamping components 210 closer to or away from each other according to the detected actual clamping information and the preset target clamping information.

[0046] When the edge of the wafer is clamped, the clamping force and clamping position it is subjected to are related to the distance between the two clamping components 210. By detecting the actual clamping information of the wafer, the actual clamping force, actual clamping position and other actual clamping information of the wafer can be accurately quantified, so that the positions of the two clamping components 210 can be adjusted according to the actual clamping information and the target clamping information, and automatic adjustment of the clamping force and / or clamping position of the wafer can be achieved to ensure that the clamping force and / or clamping position of the wafer is more reasonable, thereby avoiding problems such as wafer breakage due to factors such as improper clamping force or improper clamping position.

[0047] It should be noted that the target clamping information may mean that when the clamping information of the edge of the wafer is clamped when it is flipped, the wafer is not damaged. The target clamping information may be data pre-set in the control unit 600. The target clamping information may be obtained based on multiple tests, or may be set based on experience or industry practice.

[0048] It should also be noted that, when the mobile unit 300 is controlled to make the two clamping components 210 move toward or away from each other based on the actual clamping information and the preset target clamping information, the wafer may have been removed from the clamping component 210, and after adjusting the distance between the two clamping components 210 to the target distance, the wafer is clamped between the two clamping components 210. In this way, damage to the wafer during the movement of the clamping component 210 can be avoided.

[0049] In some exemplary embodiments, the control unit 600 is specifically used to: obtain a distance adjustment parameter of the two clamping components 210 based on the actual clamping information and the target clamping information; and based on the distance adjustment parameter, control the moving unit 300 to move the two clamping components 210 so that the distance between the two clamping components 210 along the first direction X is the target distance.

[0050] In the above scheme, for example, the distance adjustment parameter of the two clamping components 210 can be converted based on the difference between the actual clamping information and the target clamping information pre-stored in the control unit 600, that is, the distance difference between the actual distance of the two clamping components 210 and the target distance, so that the mobile unit 300 works according to the distance adjustment parameter and can adjust the distance between the two clamping components 210 along the first direction X to the target distance.

[0051] It should be noted that when the distance between the two clamping assemblies 210 along the first direction X is the target distance, when the wafer is clamped and flipped by the two clamping assemblies 210, the clamping force and clamping position of the wafer can ensure that the wafer is not broken.

[0052] Furthermore, in some exemplary embodiments, Figure 1 As shown, the support unit 100 includes a base 110 and two support assemblies 120 disposed on the base 110. The base 110 can be used as a support body, and can be fixed on the process equipment or can be configured to be movable. The support assemblies 120 are arranged to extend along a second direction Y perpendicular to the first direction X. For example, Figure 1 As shown, the first direction X may refer to a horizontal direction, and the second direction Y may refer to a vertical direction.

[0053] The two support assemblies 120 are arranged spaced apart from each other in the first direction X, and one clamping assembly 210 is movably connected to a corresponding one of the support assemblies 120. The movably connected here may mean that the clamping assembly 210 can move relative to the corresponding support assembly 120 under the driving of the moving unit 300, and the clamping assembly 210 can flip relative to the corresponding support assembly 120 under the driving of the flipping unit 400.

[0054] In the above scheme, the two support assemblies 120 can only clamp the edge of the wafer 10, which can ensure that the wafer 10 is flipped while only contacting the edge of the wafer 10, thereby preventing contamination of the wafer, and the clamping force can be automatically adjusted with high clamping accuracy.

[0055] In some exemplary embodiments, Figure 1As shown, the wafer flipping device may also include: a wafer picking and placing unit 800, the wafer picking and placing unit 800 is connected to the supporting unit 100, the wafer picking and placing unit 800 includes a wafer holding part 810 and a moving part 820, the wafer holding part 810 is used to hold the wafer, and the wafer holding part 810 is constructed to be movable under the drive of the moving part 820 to perform the operation of picking and placing the wafer 10; the control unit 600 is also connected to the wafer picking and placing unit 800, and the control unit 600 is also used to control the wafer picking and placing unit 800 to perform the operation of picking and placing the wafer 10.

[0056] By adopting the above solution, a wafer placing unit 800 may be integrated on the wafer flipping device to complete the placing of the wafer 10. For example, see FIG. 2A to FIG. 2D As shown, the wafer placement unit 800 can take out the wafer 10 with one side (such as the front side 11) processed from the wafer processing device ( Figure 2A ), and placed in the clamping unit 200 with the processed surface (e.g., the front surface 11) facing downwards ( Figure 2B After the wafer flipping operation is completed, the unprocessed surface (eg, back surface 12) of the wafer 10 faces downward ( Figure 2C As shown), the wafer placement unit 800 can be taken out from the clamping unit 200, so that the unprocessed surface (such as the back side 12) of the wafer 10 faces upward, and the wafer 10 is transferred to the wafer processing device with the unprocessed surface facing upward ( Figure 2D shown).

[0057] In some exemplary embodiments, the wafer pick-and-place unit 800 includes a robot, the robot includes a robot arm and an execution end, the moving part 820 includes the robot arm, and the wafer holding part 810 includes the execution end. The wafer 10 is picked up and placed in the clamping unit 200 by the robot, which is easy to operate, and the wafer pick-and-place position can be precisely controlled.

[0058] In some exemplary embodiments, the wafer holding portion 810 includes a wafer carrying area 811; wherein the wafer holding portion 810 also includes a plurality of holding portions distributed around the wafer carrying area 811, and the plurality of holding portions are used to hold the edge of the wafer 10. For example, the holding portion may include any suitable structure such as a gripper, a clamping groove, etc.

[0059] Furthermore, in some exemplary embodiments, Figure 1 As shown, the wafer holding portion 810 may further include a plurality of adsorption structures 812 arranged on the bearing surface of the wafer bearing area 811, and the plurality of adsorption structures 812 are used to adsorb and fix the wafer 10. For example, the adsorption structure 812 may include a suction cup or a vacuum adsorption hole.

[0060] In addition, in some exemplary embodiments, the clamping assembly 210 may include a clamping end for contacting the wafer 10. For example, the clamping assembly 210 may include a clamping claw, and the clamping end is the part where the clamping claw contacts the wafer 10. The detection unit 500 may use a pressure sensor, and the pressure sensor is provided on the clamping end.

[0061] The pressure sensor includes but is not limited to piezoelectric pressure sensors, resistive pressure sensors, capacitive pressure sensors, etc. Piezoelectric pressure sensors use the piezoelectric effect to generate electric charge when the material is under pressure to measure pressure; the pressure measurement principle of resistive pressure sensors is that when external pressure is applied to the piezoresistor, the shape or structure of the material changes, causing the resistance value to increase or decrease. By measuring the change in resistance, the pressure value applied to the piezoresistor can be deduced; capacitive pressure sensors use changes in capacitance to measure pressure. For example, the pressure in the embodiment of the present disclosure uses a resistive pressure sensor.

[0062] It should be noted that in the above scheme, the detection unit 500 uses a pressure sensor to reflect the actual clamping information of the wafer 10 through pressure detection. In other embodiments, the detection unit 500 may also use a position sensor to reflect the actual clamping information of the wafer 10 through the position sensor.

[0063] In some exemplary embodiments, Figure 3 As shown, the wafer flipping device further includes: an alarm unit 700 connected to the control unit 600, and the control unit 600 is further configured to control the alarm unit 700 to send out an alarm signal when the difference between the actual clamping information and the target clamping information is greater than a threshold value.

[0064] The alarm signal may include a sound signal, a visual signal, a tactile signal, a communication signal, and an odor signal, etc. The alarm method can timely detect improper clamping problems during wafer flipping, thereby improving product yield. Specifically, the threshold value may be obtained based on multiple tests, or may be set based on experience or industry practices.

[0065] In this way, during the actual processing, the actual clamping information is monitored in real time by the detection unit 500. When the difference between the actual clamping information and the target clamping information is greater than a threshold value, it indicates that the clamping information on the wafer 10 fluctuates greatly. At this time, an alarm signal may be triggered to remind personnel to promptly handle the products during the current fluctuation period, and at the same time, feedback is given to the MES system (Manufacturing Execution System) to avoid product Hold during the fluctuation period (product Hold refers to the temporary suspension or isolation of a batch or a specific product). When the clamping assembly 210 is moved by the moving unit 300 and the clamping information adjustment is completed, the adjusted signal of the wafer flipping device is fed back to the MES system, and the product flows normally (product flows normally refer to the production of products according to a predetermined process during the production or quality control process).

[0066] It should be noted that, in some embodiments, the clamping assembly 210 can be translated when driven by the moving unit 300 and can be rotated when driven by the flipping unit 400 , and the specific structures of the moving unit 300 and the flipping unit 400 are not limited.

[0067] In some embodiments, the clamping assembly 210 includes a clamping end for clamping the wafer 10 and a non-clamping end opposite to the clamping end along the first direction X. The moving unit 300 may be connected to the non-clamping end, and the moving unit 300 may include a moving member and a driving member, the moving member is connected to the non-clamping end, and the driving member may drive the moving member to move along the first direction X to drive the clamping assembly 210 to move along the first direction X.

[0068] For example, the moving member may be a telescopic rod, and the driving member may be a cylinder; or, the moving member may be a lead screw, and the driving member may be a driving motor. The specific structures of the moving member and the driving member are not limited.

[0069] In some embodiments, the clamping assembly 210 includes a clamping end for clamping the wafer 10 and a non-clamping end opposite to the clamping end along the first direction X. The flip unit 400 may include a rotating shaft and a driving motor, wherein the rotating shaft is connected to the non-clamping end, and the driving motor may drive the rotating shaft to drive the clamping assembly 210 to rotate.

[0070] The moving unit 300 may be configured to be connected to the rotating shaft so as to rotate synchronously with the clamping assembly 210 under the drive of the flipping unit 400 ; alternatively, the flipping unit 400 may be configured to be connected to the moving member so as to rotate synchronously with the clamping assembly 210 under the drive of the moving unit 300 .

[0071] It should be understood that the specific structures of the moving unit 300 and the flipping unit 400 are not limited.

[0072] In addition, the embodiment of the present disclosure further provides a wafer flipping method, which is applied to the wafer flipping device provided in the embodiment of the present disclosure, and the method includes:

[0073] Step S01, respectively clamping two sides of the edge of the wafer 10 by the two clamping assemblies 210 of the clamping unit 200;

[0074] Step S02: Detecting actual clamping information applied by the clamping assembly 210 to the wafer 10 through the detection unit 500;

[0075] Step S03, according to the actual clamping information and the preset target clamping information, controlling the moving unit 300 to make the two clamping components 210 move toward or away from each other, so that the actual clamping information reaches the target clamping information;

[0076] Step S04 , driving the clamping unit 200 to flip the wafer via the flipping unit 400 .

[0077] In the above scheme, when the edge of the wafer 10 is clamped, the clamping force and the clamping position it is subjected to are related to the distance between the two clamping components 210. By detecting the actual clamping information of the wafer 10, the actual clamping information such as the actual clamping force and the actual clamping position of the wafer 10 can be accurately quantified, so that the positions of the two clamping components 210 can be adjusted according to the actual clamping information and the target clamping information, and automatic adjustment of the clamping force and / or the clamping position of the wafer 10 can be achieved to ensure that the clamping force and / or the clamping position of the wafer 10 is more reasonable, thereby avoiding problems such as wafer 10 breakage due to factors such as improper clamping force or improper clamping position.

[0078] It should be noted that the target clamping information may mean that when the clamping information of the edge of the wafer 10 is clamped when flipping, the wafer 10 is not damaged. The target clamping information may be data pre-set in the control unit 600. The target clamping information may be obtained based on multiple tests, or may be set based on experience or industry practice.

[0079] It should be noted that in the above step S03, when the moving unit 300 is controlled to make the two clamping components 210 move toward or away from each other according to the actual clamping information and the preset target clamping information, the wafer 10 may have been removed from the clamping component 210, and after adjusting the distance between the two clamping components 210 to the target distance, the wafer 10 is clamped between the two clamping components 210. In this way, damage to the wafer 10 during the movement of the clamping component 210 can be avoided.

[0080] In some exemplary embodiments, the above step S03 specifically includes:

[0081] Step S031, acquiring distance adjustment parameters of the two clamping components 210 based on the actual clamping information and the target clamping information;

[0082] Step S032: Based on the distance adjustment parameter, control the moving unit 300 to move the two clamping assemblies 210 so that the distance between the two clamping assemblies 210 along the first direction X is the target distance.

[0083] In the above scheme, the distance adjustment parameter of the two clamping components 210 can be converted based on the difference between the actual clamping information and the target clamping information pre-stored in the control unit 600, that is, the distance difference between the actual distance of the two clamping components 210 and the target distance, so that the mobile unit 300 works according to the distance adjustment parameter and can adjust the distance between the two clamping components 210 along the first direction X to the target distance.

[0084] It should be noted that when the distance between the two clamping assemblies 210 along the first direction X is the target distance, when the wafer 10 is clamped and flipped by the two clamping assemblies 210, the clamping force and clamping position of the wafer 10 can ensure that the wafer 10 is not broken.

[0085] In addition, illustratively, in the above step S01, the wafer 10 can be placed between the two clamping assemblies 210 by the wafer placement unit 800; after the above step S04, the wafer 10 can be taken out from the two clamping assemblies 210 by the wafer placement unit 800.

[0086] Since the principle of solving the problem by the crystal rod flipping method is similar to the principle of solving the problem by the above-mentioned crystal rod flipping device, the embodiment of the crystal rod flipping method provided in the embodiment of the present disclosure can refer to the embodiment of the above-mentioned crystal rod flipping device provided in the embodiment of the present disclosure, and will not be repeated here.

[0087] In addition, the embodiment of the present disclosure further provides a wafer processing device, including the wafer flipping device provided by the embodiment of the present disclosure. For example, the wafer processing device may be a wafer polishing device, etc. It should be understood that the wafer flipping device can be applied to various production or testing equipment in which the wafer needs to be flipped.

[0088] Since the principle of solving the problem by the wafer processing equipment is similar to the principle of solving the problem by the above-mentioned crystal rod flipping device, the embodiment of the wafer processing equipment provided in the embodiment of the present disclosure can refer to the embodiment of the above-mentioned crystal rod flipping device provided in the embodiment of the present disclosure, and will not be repeated here.

[0089] In addition, an embodiment of the present disclosure also provides an electronic device, which includes a memory, a processor, and one or more programs stored in the memory and executable on the processor. When the one or more programs are executed by the processor, the electronic device performs the wafer flipping method as described above.

[0090] In one embodiment, the present disclosure further provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0091] The computer readable storage medium implements the steps in the above-mentioned method embodiments when the computer program stored in its memory is executed by the processor.

[0092] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0093] There are a few points to note:

[0094] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0095] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0096] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0097] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A wafer flipping device, characterized in that: include: Support unit; A clamping unit, comprising two clamping assemblies for clamping two sides of the edge of the wafer respectively, wherein the two clamping assemblies are arranged on the supporting unit at intervals from each other along a first direction; A moving unit connected to the clamping unit, wherein the moving unit is configured to drive the two clamping assemblies to move toward or away from each other along the first direction; A flip unit connected to the clamping unit, wherein the flip unit is configured to drive the clamping unit to flip the wafer; A detection unit connected to the clamping unit, the detection unit is used to detect actual clamping information applied by the clamping assembly to the wafer, wherein the actual clamping information includes at least one of actual clamping information and actual clamping position; The control unit is connected to the detection unit and the moving unit respectively, and is used to control the moving unit to make the two clamping components move toward or away from each other according to the actual clamping information and the preset target clamping information.

2. The wafer flipping device according to claim 1, characterized in that: The control unit is specifically used for: Based on the actual clamping information and the target clamping information, obtaining a distance adjustment parameter of the two clamping components; Based on the distance adjustment parameter, the moving unit is controlled to move the two clamping assemblies so that the distance between the two clamping assemblies along the first direction is a target distance.

3. The wafer flipping device according to claim 1, characterized in that: The support unit includes: a base and two support components arranged on the base, each of the support components is extended along a second direction perpendicular to the first direction, and the two support components are arranged at intervals from each other in the first direction, and one of the clamping components is movably connected to a corresponding one of the support components.

4. The wafer flipping device according to claim 1, characterized in that: The wafer flipping device also includes: a wafer picking and placing unit, which is connected to the supporting unit, and includes a wafer holding part and a moving part, the wafer holding part is used to hold the wafer, and the wafer holding part is constructed to be movable under the drive of the moving part to perform the operation of picking and placing the wafer; the control unit is also connected to the wafer picking and placing unit, and the control unit is also used to control the wafer picking and placing unit to perform the wafer picking and placing operation.

5. The wafer flipping device according to claim 4, characterized in that: The wafer placing unit includes a robot, the robot includes a robot arm and an execution end, the moving part includes the robot arm, and the wafer holding part includes the execution end.

6. The wafer flipping device according to claim 4, characterized in that: The wafer holding portion includes a wafer carrying area; wherein, the wafer holding portion also includes a plurality of holding portions distributed around the wafer carrying area, and the plurality of holding portions are used to hold the edge of the wafer; and / or, the wafer holding portion also includes a plurality of adsorption structures arranged on the carrying surface of the wafer carrying area, and the plurality of adsorption structures are used to adsorb and fix the wafer.

7. The wafer flipping device according to claim 1, characterized in that: The clamping assembly comprises a clamping end for contacting with a wafer; the detection unit comprises a pressure sensor, and the pressure sensor is arranged on the clamping end.

8. The wafer flipping device according to claim 1, characterized in that: The wafer flipping device further includes: an alarm unit connected to the control unit, and the control unit is further configured to control the alarm unit to send out an alarm signal when the difference between the actual clamping information and the target clamping information is greater than a threshold value.

9. A wafer flipping method, characterized in that: Applied to the wafer flipping device according to any one of claims 1 to 8, the method comprises: The two clamping assemblies of the clamping unit clamp two sides of the edge of the wafer respectively; detecting actual clamping information applied by the clamping assembly to the wafer; According to the actual clamping information and the preset target clamping information, controlling the moving unit to make the two clamping components move toward or away from each other, so that the actual clamping information reaches the target clamping information; The flipping unit drives the clamping unit to flip the wafer.

10. A wafer processing equipment, characterized in that: It comprises a wafer flipping device as described in any one of claims 1 to 8.

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