Sensor packaging structure and sensing module thereof

Abstract

The invention discloses a sensor packaging structure and a sensing module thereof. The sensing module comprises a substrate and a sensing chip. The substrate comprises an insulating layer, a processor, a plurality of first lines and a plurality of second lines. The processor is embedded in the insulating layer, and a plurality of first contacts and a plurality of second contacts are arranged on the top surface of the insulating layer. The plurality of first circuits are respectively connected to the plurality of first contacts, and a part of each first circuit is exposed out of the first surface of the insulating layer. The plurality of second circuits are respectively connected with the plurality of second contacts, and a part of each second circuit is exposed out of the second surface of the insulating layer. The sensing chip is disposed on the first surface of the insulating layer and is electrically coupled to the plurality of first lines. Therefore, the overall size of the sensor packaging structure can be effectively reduced, and problems possibly derived from an existing circuit board can be avoided.

Description

Technical Field

[0001] The present invention relates to a packaging structure, and in particular to a sensor packaging structure and a sensing module thereof. Background Art

[0002] The existing sensor packaging structure is to install the sensor and the processor side by side on the circuit board, which leads to a larger volume. Furthermore, the circuit board portion located between the sensor and the processor is more susceptible to temperature influence, resulting in warpage and stress concentration.

[0003] Therefore, the inventors believe that the above defects can be improved, and have devoted themselves to research and applied scientific principles, and finally proposed the present invention which has a reasonable design and effectively improves the above defects. Summary of the invention

[0004] The embodiments of the present invention provide a sensor packaging structure and a sensing module thereof, which can effectively improve the defects that may occur in the existing sensor packaging structure.

[0005] The embodiment of the present invention discloses a sensor packaging structure, which includes: a substrate, including: an insulating layer, including a first surface and a second surface located on opposite sides; a processor, buried in the insulating layer, and the top surface of the processor includes a plurality of first contacts and a plurality of second contacts; a plurality of first circuits, respectively connected to the plurality of first contacts; wherein each first circuit is partially exposed on the first surface and defined as a connection pad; a plurality of second circuits, respectively connected to the plurality of second contacts; wherein each second circuit is partially exposed on the second surface and defined as a welding pad; a sensing chip, disposed on the first surface of the insulating layer, and the sensing chip is electrically coupled to the plurality of first circuits; a sealing cover, including: a light-transmitting sheet, having a light-transmitting block and an annular block surrounding the light-transmitting block; a frame, annular and formed on the annular block of the light-transmitting sheet; wherein the sealing cover is fixed to the first surface of the insulating layer with the frame to jointly surround and form a closed space, and the sensing chip is located in the closed space.

[0006] The present invention also discloses a sensor packaging structure, which includes: a substrate, including: an insulating layer, including a first surface and a second surface located on opposite sides; a processor, buried in the insulating layer, and the top surface of the processor includes a plurality of first contacts and a plurality of second contacts; a plurality of first circuits, respectively connected to the plurality of first contacts; wherein each first circuit is partially exposed on the first surface and defined as a connection pad; a plurality of second circuits, respectively connected to the plurality of second contacts; wherein each second circuit is partially exposed on the second surface and defined as a welding pad; a sensor chip, disposed on the first surface of the insulating layer, and the upper surface of the sensor chip has a plurality of contacts; a frame, formed on the insulating layer; The first surface of the layer surrounds the outside of the sensing chip; a plurality of metal pillars are respectively connected to the plurality of connection pads and buried in the frame; a series connection layer includes a plurality of connection lines and a spacing layer arranged on the frame; wherein one end of the plurality of connection lines is respectively connected to the plurality of contacts of the sensing chip, and the other end of the plurality of connection lines is respectively connected to the plurality of metal pillars; a sealing layer includes: a transparent sheet, which is arranged on the series connection layer, and the transparent sheet has a transparent block and an annular block surrounding the transparent block; a sealing body is formed in the frame and covers the annular block of the series connection layer and the transparent sheet, so that the sealing layer, the frame and the substrate are surrounded together to form a closed space, and the sensing chip is located in the closed space.

[0007] The embodiment of the present invention further discloses a sensing module of a sensor packaging structure, which includes: a substrate, including: an insulating layer, including a first surface and a second surface located on opposite sides; a processor, buried in the insulating layer, and the top surface of the processor contains multiple first contacts and multiple second contacts; multiple first circuits, respectively connected to the multiple first contacts; wherein a portion of each first circuit is exposed on the first surface and defined as a connection pad; multiple second circuits, respectively connected to the multiple second contacts; wherein a portion of each second circuit is exposed on the second surface and defined as a welding pad; a sensing chip, arranged on the first surface of the insulating layer, and the sensing chip is electrically coupled to the multiple first circuits.

[0008] In summary, the sensor packaging structure and the sensing module thereof disclosed in the embodiment of the present invention effectively reduce the overall size by arranging the sensing chip and the processor in an upper and lower arrangement, and the sensing module uses the insulating layer in combination with the remade first circuits and the second circuits to replace the existing circuit board, which can effectively avoid the problems that may arise from the existing circuit board.

[0009] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 FIG. 4 is a three-dimensional schematic diagram of a sensor packaging structure according to a first embodiment of the present invention.

[0011] Figure 2 for Figure 1 Schematic diagram of the decomposition.

[0012] Figure 3 for Figure 2 Schematic diagram of local decomposition.

[0013] Figure 4 for Figure 1 Schematic cross-sectional view along section line IV-IV.

[0014] Figure 5 for Figure 1 Schematic cross-sectional view along section line VV.

[0015] Figure 6 FIG. 4 is a three-dimensional schematic diagram of a sensor packaging structure according to a second embodiment of the present invention.

[0016] Figure 7 for Figure 6 Schematic diagram of the decomposition.

[0017] Figure 8 for Figure 7 Schematic diagram of local decomposition.

[0018] Fig. 9 for Figure 6 Schematic cross-sectional view along section line IX-IX.

[0019] Fig.10 for Fig. 9 An enlarged schematic diagram of region X. DETAILED DESCRIPTION

[0020] The following is an explanation of the implementation methods of the "sensor packaging structure and its sensing module" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0021] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or features, these components or features should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one feature from another feature. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0022] Embodiment 1

[0023] See also Figures 1 to 5 , which is the first embodiment of the present invention. This embodiment discloses a sensor packaging structure 100 , which includes a substrate 1 , a sensor chip 2 disposed on the substrate 1 , and a sealing cover 4 fixed to the substrate 1 .

[0024] It should be noted that the substrate 1 and the sensing chip 2 can be combined into a sensing module 10 in this embodiment, and the sensing module 10 can further include components (such as a plurality of metal wires 3) for electrically coupling the substrate 1 and the sensing chip 2. Furthermore, the sensing module 10 is described in this embodiment in conjunction with the sealing cover 4, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the sensing module 10 can also be used alone or in conjunction with other components according to actual needs.

[0025] In this embodiment, the substrate 1 includes an insulating layer 11, a processor 12 embedded in the insulating layer 11, and a plurality of first circuits 13 and a plurality of second circuits 14 electrically coupled to the processor 12. In addition, the processor 12 may be an application specific integrated circuit (ASIC) chip, but the present invention is not limited thereto.

[0026] Specifically, the top surface 12a of the processor 12 includes a plurality of first contacts 121 and a plurality of second contacts 122, the outer surface of the insulating layer 11 includes a first surface 11a and a second surface 11b located on opposite sides, a plurality of first circuits 13 are respectively connected to the plurality of first contacts 121, and each first circuit 13 includes a first fan-out section 131 connected to the corresponding first contact 121 and a connection pad 132 connected to the first fan-out section 131 and exposed on the first surface 11a. Furthermore, a plurality of second circuits 14 are respectively connected to the plurality of second contacts 122, and each second circuit 14 includes a second fan-out section 141 connected to the corresponding second contact 122, a conductive column 142 connected to the second fan-out section 141, and a soldering pad 143 connected to the conductive column 142 and exposed on the second surface 11b. The first fan-out sections 131 of the plurality of first circuits 13 and the second fan-out sections 141 and the conducting pillars 142 of the plurality of second circuits 14 are all buried in the insulating layer 11 .

[0027] In more detail, the insulating layer 11 in this embodiment includes a package body 111, two protection layers 112 disposed on one side of the package body 111, and a protection strip 113 disposed on the other side of the package body 111. The package body 111 embeds the processor 12 and the conductive pillars 142 of the second circuits 14 therein, and the top surface 12a of the processor 12 is exposed (partially or completely) in the package body 111, and both ends of each conductive pillar 142 are also exposed in the package body 111.

[0028] Specifically, the package body 111 is made of epoxy molding compound (EMC) or silicone molding compound (SMC), which has a coefficient of thermal expansion (CTE) of approximately 7 ppm / ° C., and thus can more effectively protect the processor 12 .

[0029] Furthermore, two protective layers 112 are stacked on top of each other and cover the top surface 12a of the processor 12 and one end of each conductive pillar 142, and the first fan-out sections 131 of the plurality of first circuits 13 and the second fan-out sections 141 of the plurality of second circuits 14 are buried in the two protective layers 112, while the connection pads 132 of the plurality of first circuits 13 and the welding pads 143 of the plurality of second circuits 14 are exposed in the two protective layers 112. In addition, the plurality of welding pads 143 are arranged in two rows, and the protective strip 113 is located between the two rows of welding pads 143.

[0030] In other words, each first circuit 13 extends from the corresponding first contact 121 through the two protection layers 112, and a connection pad 132 is formed on the first surface 11a of the insulating layer 11. Each second circuit 14 extends from the corresponding second contact 122 through the two protection layers 112 and the package body 111, and a welding pad 143 is formed on the second surface 11b of the insulating layer 11.

[0031] The sensing chip 2 is a micro-electromechanical system (MEMS) sensing chip, but the present invention is not limited thereto. The sensing chip 2 is disposed on the first surface 11a of the insulating layer 11 (that is, the sensing chip 2 is disposed on the two protective layers 112 ), and the sensing chip 2 is electrically coupled to the plurality of first circuits 13 .

[0032] In this embodiment, the upper surface 2a of the sensing chip 2 has a plurality of contacts 21, one end of the plurality of metal wires 3 is respectively connected to the plurality of contacts 21 of the sensing chip 2, and the other end of the plurality of metal wires 3 is respectively connected to the connection pads 132 of the plurality of first circuits 13, so that the sensing chip 2 can be electrically coupled to the processor 12 through the plurality of metal wires 3 and the plurality of first circuits 13. Alternatively, the substrate 1 and the sensing chip 2 can also be electrically coupled by other means, thereby omitting the plurality of metal wires 3.

[0033] As described above, the structure of the sensing module 10 in this embodiment adopts a wafer-level molding process to shorten the electrical transmission path between the sensing chip 2 and the processor 12, thereby reducing the generation of inductance and noise. Furthermore, the sensing module 10 can also be configured with two protective layers 112 to enable the processor 12 to separate the plurality of first lines 13 and the plurality of second lines 14, and can effectively absorb or release the thermal stress generated by the difference in thermal expansion coefficients of the sensing chip 2 relative to the plurality of first lines 13 and the plurality of second lines 14.

[0034] In addition, although the insulating layer 11 in this embodiment is described as including a package body 111, two protective layers 112 and a protective strip 113, the present invention is not limited thereto. Alternatively, according to actual needs, the protective strip 113 can be omitted, or the number of the two protective layers 112 can be adjusted, or the insulating layer 11 can be a one-piece structure.

[0035] The sealing cover 4 includes a transparent sheet 41 and a frame 42 formed on the transparent sheet 41. In this embodiment, the transparent sheet 41 is a filter glass, and the frame 42 is made of epoxy molding compound (EMC), but the present invention is not limited thereto.

[0036] In more detail, the light-transmitting sheet 41 has a light-transmitting block 411 and an annular block 412 surrounding the light-transmitting block 411, and the frame 42 is annular and formed on the annular block 412 of the light-transmitting sheet 41. The sealing cover 4 is fixed to (e.g., bonded to) the first surface 11a of the insulating layer 11 with the frame 42 (that is, the frame 42 is not directly formed on the insulating layer 11) to form a closed space E. The sensing chip 2 and the plurality of metal wires 3 are all located in the closed space E, and the light-transmitting block 411 faces the upper surface 2a of the sensing chip 2.

[0037] As described above, the sensor package structure 100 in this embodiment effectively reduces the overall size by arranging the sensor chip 2 and the processor 12 in an up-and-down arrangement, and the sensing module 10 uses an insulating layer 11 with a plurality of remade first circuits 13 and a plurality of second circuits 14 to replace the existing circuit board, which can effectively avoid the problems that may arise from the existing circuit board.

[0038] Embodiment 2

[0039] See also Figures 6 to 10 As shown, it is the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments are not repeated (such as: sensing module 10), and the differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:

[0040] In this embodiment, the sensor package structure 100 includes a substrate 1, a sensor chip 2 disposed on the substrate 1, a ring-shaped frame 5 formed on the substrate 1, a plurality of metal pillars 6 embedded in the frame 5, a series connection layer 7 electrically coupling the sensor chip 2 and the plurality of metal pillars 6, and a sealing layer 8 covering the frame 5 and the series connection layer 7. It should be noted that the substrate 1 and the sensor chip 2 in this embodiment can be combined into a sensor module 10 and its structure is the same as that in the first embodiment, so the technical contents related to the substrate 1 and the sensor chip 2 can refer to the first embodiment above, and will not be repeated in this embodiment.

[0041] The frame 5 is formed on the first surface 11a of the insulating layer 11 and surrounds the outer side of the sensing chip 2. In the present embodiment, the frame 5 is made of a molding compound, such as an epoxy molding compound or a silicone molding compound. And the frame 5 is formed on the two protective layers 112 to form a gapless connection. Among them, the size of the frame 5 can be accurately controlled so that the annular gap G1 between it and the sensing chip 2 can be controlled to be between 20 microns and 50 microns, so as to ensure that the sensing chip 2 has free space and is not easily affected by thermal stress and external forces, thereby facilitating the sensing chip 2 to have accurate and stable sensing accuracy.

[0042] Furthermore, the top edge of the frame 5 is substantially coplanar with the upper surface 2a of the sensing chip 2, and the top edges of the multiple metal pillars 6 embedded in the frame 5 are substantially flush with the top edge of the frame 5, and the bottom edges of the multiple metal pillars 6 are respectively connected to the multiple connection pads 132 of the sensing module 10, thereby being electrically coupled to the processor 12 through the multiple first lines 13.

[0043] The series connection layer 7 includes a plurality of connection lines 71 and a spacer layer 72 disposed on the frame 5. One end of the plurality of connection lines 71 is respectively connected to the plurality of contacts 21 of the sensing chip 2, and the other end of the plurality of connection lines 71 is respectively connected to the plurality of metal pillars 6, so that the sensing chip 2 can be electrically coupled to the processor 12 through the plurality of connection lines 71, the plurality of metal pillars 6 and the plurality of first lines 13, thereby shortening the electrical transmission path between the sensing chip 2 and the processor 12 to reduce the generation of inductance and noise.

[0044] Furthermore, the spacer layer 72 is disposed between the top edge of the frame 5 and the upper surface 2a of the sensing chip 2, but does not touch the sensing area 22 of the sensing chip 2. In other words, the spacer layer 72 extends from the top edge of the frame 5 to the upper surface 2a of the sensing chip 2, so that the annular gap G1 is closed. Thus, the volume of the annular gap G1 can be controlled within a very small range, so that infrared reflow soldering can be performed without forming pores, and the annular gap G1 can also effectively block moisture and fully protect the sensing chip 2.

[0045] It should be noted that the spacer layer 72 in this embodiment is a two-layer structure stacked on top of each other, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the spacer layer 72 may be a single-layer structure according to actual needs. In addition, the sensing module 10 in this embodiment includes not only the substrate 1 and the sensing chip 2, but also further includes components for electrically coupling the substrate 1 and the sensing chip 2 (e.g., multiple metal pillars 6 and multiple connection lines 71).

[0046] The sealing layer 8 includes a transparent sheet 81 disposed on the series connection layer 7 and a sealing body 82 formed on the frame 5. In the present embodiment, the transparent sheet 81 is a filter glass, and the sealing body 82 is made of epoxy molding compound, but the present invention is not limited thereto. The transparent sheet 81 has a transparent block 811 and an annular block 812 surrounding the transparent block 811, and the annular block 812 is disposed on (e.g., bonded to) the series connection layer 7 (e.g., the spacer layer 72 and a part of each connection line 71), and the transparent block 811 faces the sensing area 22 of the sensing chip 2.

[0047] In more detail, a sensing gap G2 between the light-transmitting sheet 81 and the sensing chip 2 is between 20 μm and 50 μm, and the sensing gap G2 and the annular gap G1 are separated from each other by a spacer layer 72. Thus, the architecture adopted by the sensor package structure 100 in this embodiment is conducive to accurately controlling the size of the sensing gap G2, so as to ensure the temperature uniformity of the sensing chip 2 during operation without crosstalk, thereby having accurate and stable sensing accuracy.

[0048] The sealing body 82 covers the series connection layer 7 and the annular block 812 of the light-transmitting sheet 81, so that the sealing layer 8, the frame 5 and the substrate 1 together surround a closed space E, and the sensing chip 2 is located in the closed space E. In other words, the closed space E includes the sensing gap G2 and the annular gap G1, and based on the fact that the sensor package structure 100 in this embodiment uses epoxy molding compound to form the package body 111, the frame 5 and the sealing body 82, the sensor package structure 100 has an excellent sealing effect, can effectively protect the internal components and accurately control the relative positions of the components.

[0049] Technical Effects of Embodiments of the Invention

[0050] In summary, the sensor packaging structure and the sensing module thereof disclosed in the embodiments of the present invention effectively reduce the overall size by arranging the sensing chip and the processor in an up-and-down manner, and the sensing module uses an insulating layer with a plurality of remade first circuits and a plurality of second circuits to replace the existing circuit board, which can effectively avoid the problems that may arise from the existing circuit board.

[0051] Furthermore, the sensing module disclosed in the embodiment of the present invention adopts a wafer-level molding process to shorten the electrical transmission path between the sensing chip and the processor, thereby reducing the generation of inductance and noise. Furthermore, the sensing module in this embodiment can also be configured with two protective layers to enable the processor to separate the multiple first lines and the multiple second lines, and can effectively absorb or release the thermal stress generated by the difference in thermal expansion coefficients of the sensing chip relative to the multiple first lines and the multiple second lines.

[0052] In addition, the sensor packaging structure disclosed in the embodiment of the present invention adopts a structure that is conducive to accurately controlling the size of the annular gap and the size of the sensing gap, so that the volume of the annular gap can be controlled within a very small range, so that it can be infrared reflow soldering without forming air holes, and the annular gap can also effectively block moisture and fully protect the sensing chip. Furthermore, the sensing gap is controlled by size to ensure the temperature uniformity of the sensing chip during operation and free from crosstalk, thereby having accurate and stable sensing accuracy.

[0053] The contents disclosed above are only optional feasible embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the patent scope of the present invention.

Claims

1. A sensor packaging structure, characterized in that: The sensor packaging structure comprises: A substrate comprising: An insulating layer including a first surface and a second surface located on opposite sides; A processor is embedded in the insulating layer, and the top surface of the processor contains a plurality of first contacts and a plurality of second contacts; A plurality of first circuits are respectively connected to a plurality of the first contact points; wherein a portion of each of the first circuits is exposed on the first surface and is defined as a connection pad; and A plurality of second circuits are respectively connected to a plurality of the second contact points; wherein a portion of each second circuit is exposed on the second surface and is defined as a welding pad; a sensing chip disposed on the first surface of the insulating layer, and the sensing chip is electrically coupled to the plurality of first circuits; and A sealing cover, comprising: A light-transmitting sheet having a light-transmitting block and an annular block surrounding the light-transmitting block; and A frame body is annular and formed in the annular block of the light-transmitting sheet; wherein the sealing cover is fixed to the first surface of the insulating layer with the frame body to form a closed space together, and the sensing chip is located in the closed space.

2. The sensor packaging structure according to claim 1, characterized in that: Each of the first lines includes a first fan-out segment connected to the corresponding first contact and a connection pad connected to the first fan-out segment; each of the second lines includes a second fan-out segment connected to the corresponding second contact, a conductive column connected to the second fan-out segment, and a welding pad connected to the conductive column; wherein the first fan-out segments of multiple first lines and the second fan-out segments and the conductive columns of multiple second lines are all buried in the insulating layer.

3. The sensor packaging structure according to claim 2, characterized in that: The insulating layer comprises: a package body, in which the processor is embedded, and the top surface of the processor is exposed in the package body; wherein the conductive pillars of the plurality of second circuits are all embedded in the package body; and Two protective layers are provided to cover the top surface of the processor; wherein the first fan-out segments of the first lines and the second fan-out segments of the second lines are embedded in the two protective layers.

4. The sensor packaging structure according to claim 3, characterized in that: The plurality of welding pads are arranged in two rows, and the insulating layer includes a protection strip which is arranged on the packaging body and located between the two rows of welding pads.

5. A sensor packaging structure, characterized in that: The sensor packaging structure comprises: A substrate comprising: An insulating layer including a first surface and a second surface located on opposite sides; A processor is embedded in the insulating layer, and the top surface of the processor contains a plurality of first contacts and a plurality of second contacts; A plurality of first circuits are respectively connected to a plurality of the first contact points; wherein a portion of each of the first circuits is exposed on the first surface and is defined as a connection pad; and A plurality of second circuits are respectively connected to a plurality of the second contact points; wherein a portion of each second circuit is exposed on the second surface and is defined as a welding pad; a sensing chip disposed on the first surface of the insulating layer, and the upper surface of the sensing chip has a plurality of contacts; and a frame body formed on the first surface of the insulating layer and surrounding the outer side of the sensing chip; A plurality of metal pillars, respectively connected to the plurality of connection pads and embedded in the frame; a series connection layer, comprising a plurality of connection lines and a spacer layer disposed on the frame; wherein one end of the plurality of connection lines is respectively connected to the plurality of contact points of the sensing chip, and the other end of the plurality of connection lines is respectively connected to the plurality of metal pillars; and A sealing layer, comprising: a light-transmitting sheet disposed on the series connection layer, and the light-transmitting sheet has a light-transmitting block and an annular block surrounding the light-transmitting block; and A sealing body is formed on the frame body and covers the annular block of the series connection layer and the light-transmitting sheet, so that the sealing layer, the frame body and the substrate together surround a closed space, and the sensing chip is located in the closed space.

6. The sensor packaging structure according to claim 5, characterized in that: A sensing gap between the light-transmitting sheet and the sensing chip is between 20 micrometers and 50 micrometers, and an annular gap between the frame and the sensing chip is between 20 micrometers and 50 micrometers.

7. The sensor packaging structure according to claim 6, characterized in that: The spacer layer extends to the upper surface of the sensing chip to separate the sensing gap from the annular gap.

8. The sensor packaging structure according to claim 5, characterized in that: Each of the first lines includes a first fan-out segment connected to the corresponding first contact and a connection pad connected to the first fan-out segment; each of the second lines includes a second fan-out segment connected to the corresponding second contact, a conductive column connected to the second fan-out segment, and a welding pad connected to the conductive column; wherein the first fan-out segments of multiple first lines and the second fan-out segments and the conductive columns of multiple second lines are all buried in the insulating layer.

9. The sensor packaging structure according to claim 8, characterized in that: The insulating layer comprises: a package body, in which the processor is embedded, and the top surface of the processor is exposed in the package body; wherein the conductive pillars of the plurality of second circuits are all embedded in the package body; and Two protection layers are provided to cover the top surface of the processor; wherein the first fan-out segments of the first circuits and the second fan-out segments of the second circuits are buried between the two protection layers.

10. The sensor packaging structure according to claim 9, characterized in that: The plurality of welding pads are arranged in two rows, and the insulating layer includes a protection strip which is arranged on the packaging body and located between the two rows of welding pads.

11. The sensor packaging structure according to any one of claims 5 to 10, characterized in that: The frame and the sealing body are epoxy molding compound or silicone molding compound.

12. A sensor module of a sensor packaging structure, characterized in that: The sensing module of the sensor packaging structure includes: A substrate comprising: An insulating layer including a first surface and a second surface located on opposite sides; A processor is embedded in the insulating layer, and the top surface of the processor contains a plurality of first contacts and a plurality of second contacts; A plurality of first circuits are respectively connected to a plurality of the first contact points; wherein a portion of each of the first circuits is exposed on the first surface and is defined as a connection pad; and A plurality of second circuits are respectively connected to a plurality of the second contact points; wherein a portion of each second circuit is exposed on the second surface and is defined as a welding pad; and A sensing chip is disposed on the first surface of the insulating layer, and the sensing chip is electrically coupled to the plurality of first circuits.

13. The sensing module according to claim 12, characterized in that: Each of the first lines includes a first fan-out segment connected to the corresponding first contact and a connection pad connected to the first fan-out segment; each of the second lines includes a second fan-out segment connected to the corresponding second contact, a conductive column connected to the second fan-out segment, and a welding pad connected to the conductive column; wherein the first fan-out segments of multiple first lines and the second fan-out segments and the conductive columns of multiple second lines are all buried in the insulating layer.

14. The sensing module according to claim 13, characterized in that: The insulating layer comprises: a package body, in which the processor is embedded, and the top surface of the processor is exposed in the package body; wherein the conductive pillars of a plurality of the second circuits are all embedded in the package body; and Two protective layers are provided to cover the top surface of the processor; wherein the first fan-out segments of the first lines and the second fan-out segments of the second lines are embedded in the two protective layers.

15. The sensing module according to claim 14, characterized in that: The plurality of welding pads are arranged in two rows, and the insulating layer includes a protection strip which is arranged on the packaging body and located between the two rows of welding pads.

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