A power electronic component package substrate

Abstract

The present invention relates to a power electronic component packaging substrate, comprising a multilayer structure, including a lower connection layer, a first insulating layer, a second insulating layer, an upper connection layer and a device layer, with microchannels constructed between the layers. Each channel is filled with a metal or alloy that remains liquid at room temperature. A piezoelectric drive component generates periodic vibrations, driving the liquid metal to form directional convection in the channel to achieve efficient heat dissipation. The heat generated by the device layer is quickly transferred to the liquid metal through the high thermal conductivity insulating layer, and then dissipated through the heat sink. In addition, a self-detection and self-repair system is also integrated. During the operation of the packaging substrate, the system can monitor the signal transmission status in the microchannel in real time. When the liquid metal is disconnected or deformed due to impact or vibration, causing signal transmission interruption, the self-detection system can immediately start a repair program, adjust the opening and closing state of the connecting hole by controlling the switch component, and restore the signal conduction path.

Description

TECHNICAL FIELD

[0001] The application relates to an electric power electronic device packaging substrate, in particular to an electric power electronic device packaging substrate applied to the technical field of electric power electronic device packaging. BACKGROUND

[0002] As a kind of core technology component, the electric power electronic device packaging substrate plays multiple key roles such as electrical interconnection, thermal management, mechanical support and protection, and realization of three-dimensional integration and miniaturization. Through accurate layout of conductive circuits on the substrate, efficient and accurate electrical signal transmission between the internal components and external circuits is ensured. By utilizing its good thermal conductivity and carefully designed heat dissipation structure, the heat generated during the operation of the electric power electronic device is effectively dissipated, maintaining the stable operation of the device at an appropriate temperature and prolonging the service life. At the same time, the packaging substrate also provides the necessary mechanical strength and protection against external impact and environmental erosion, ensuring the integrity of the device.

[0003] Chinese invention patent CN113923936 specification discloses an electric power electronic module and packaging substrate with enhanced heat dissipation effect through liquid cooling circulation and mechanical rotating mechanism. In this design, the cooling liquid is in full contact with the packaging substrate through a complex heat conduction pipe system to improve the heat dissipation efficiency, and a rotating mechanism is used to drive a fan to increase air flow and strengthen the heat dissipation effect. Although this design improves the heat dissipation performance to some extent, it is high in complexity and difficult to maintain from the economic and practicality point of view, and it does not provide an effective solution to the signal transmission problem inside the electronic components. It cannot effectively deal with the situation of liquid cooling medium flow interruption, signal transmission interruption and other situations caused by physical impact or long-term work of the packaging substrate, thereby affecting the long-term stability and reliability of the electronic components. SUMMARY

[0004] In view of the above existing technology, the technical problem to be solved by the present application is to provide an electric power electronic device packaging substrate integrating efficient heat dissipation and intelligent signal repair, aiming to simplify the structure of the heat dissipation system and reduce the cost. At the same time, by introducing liquid metal as the heat dissipation and signal conduction medium, and combining with piezoelectric driving technology and self-detection and self-repair mechanism, the problems of heat conduction and signal transmission interruption in the heat dissipation process are effectively solved, thereby improving the overall performance and long-term working stability of the electric power electronic device packaging substrate.

[0005] To solve the above problems, the application provides an electric power electronic component packaging substrate, which comprises a lower connecting layer, a first insulating layer fixedly connected to the top end of the lower connecting layer, a second insulating layer fixedly connected to the top end of the first insulating layer, an upper connecting layer fixedly connected to the top end of the second insulating layer, a component layer fixedly connected to the top end of the upper connecting layer, and a sealing layer fixedly connected to the top end of the component layer; a plurality of micro-channels are formed in the upper connecting layer, and the micro-channels penetrate the second insulating layer, the first insulating layer and the lower connecting layer in sequence at the end away from the component layer; a plurality of lower cooling channels are formed between the lower connecting layer and the first insulating layer; a plurality of upper cooling channels are formed between the second insulating layer and the upper connecting layer; a shell is fixedly connected to the outer end of the lower connecting layer, the first insulating layer, the second insulating layer, the upper connecting layer and the component layer; a cooling chamber is formed in the end of the shell close to the first insulating layer and the second insulating layer; a plurality of piezoelectric driving assemblies are fixedly connected in the cooling chamber; the plurality of micro-channels, the lower cooling channels and the upper cooling channels are in communication with the cooling chamber, and the communication parts are filled with liquid metal; the plurality of lower cooling channels are in communication with the plurality of micro-channels distributed along the axis direction of the lower cooling channels through communication holes; a switching assembly is fixedly connected in each of the communication holes; and the liquid metal is a metal or alloy that can keep liquid at room temperature.

[0006] In the above electric power electronic component packaging substrate, the electric power electronic component packaging substrate adopts a multi-layer structure design, and a stable and efficient heat dissipation and signal transmission system is constructed through the lower connecting layer, the first insulating layer, the second insulating layer, the upper connecting layer and the component layer; the micro-channels, the lower cooling channels, the upper cooling channels and the cooling chamber are arranged in the packaging substrate, and the metal or alloy that can keep liquid at room temperature (liquid metal) is filled; the liquid metal is driven to circulate by the piezoelectric driving assemblies, effectively absorbs and rapidly dissipates the heat generated by the component layer, greatly improves the heat dissipation efficiency, and at the same time, the liquid metal realizes high-stable signal transmission between components through the micro-channels due to its excellent electrical conductivity; in particular, the packaging substrate is equipped with the switching assembly, which can flexibly switch the flow path of the liquid metal between the micro-channels and the cooling channels, and gives the substrate a self-repairing function, which can quickly restore the signal path when the signal is interrupted, thereby significantly enhancing the overall performance, reliability and service life of the packaging substrate.

[0007] As a further improvement of the application, the plurality of piezoelectric driving assemblies are uniformly distributed around the lower connecting layer, and the plurality of piezoelectric driving assemblies divide the cooling chamber into a plurality of independent areas; each of the plurality of piezoelectric driving assemblies comprises a driving sheet, and a plurality of tapered holes are formed in the driving sheet.

[0008] As a further improvement of the present application, the small-diameter ends of the plurality of tapered holes are arranged towards the driving pieces, the plurality of tapered tubes are fixedly connected in the plurality of tapered holes, and the small-diameter ends of the plurality of tapered tubes are arranged away from the driving pieces. The plurality of driving pieces are made of piezoelectric material, and the plurality of driving pieces are electrically connected to external devices through wires.

[0009] As a further improvement of the present application, the switch assembly includes deformation pieces arranged in the plurality of communication holes. The bottom ends of the plurality of deformation pieces along the axis of the lower cooling channel are fixedly connected to the same deformation control wire. The plurality of deformation control wires pass through the lower connection layer and are electrically connected to external devices.

[0010] As a further improvement of the present application, the plurality of microchannels on the lower connection layer are fixedly connected to connection columns away from the first insulating layer. The plurality of connection columns are made of high-conductivity material, and the plurality of connection columns are electrically connected to external circuits.

[0011] As a further improvement of the present application, the shell includes a top cover fixedly connected to the outer end of the upper connection layer. The bottom end of the top cover is fixedly connected to a heat-conducting plate. The bottom end of the heat-conducting plate is fixedly connected to the top end of the lower connection layer. The outer ends of the top cover and the heat-conducting plate are fixedly connected to a plurality of cooling fins.

[0012] As a further improvement of the present application, the plurality of microchannels are perpendicular to the top end of the upper connection layer and are uniformly distributed on the upper connection layer. The plurality of lower cooling channels and the plurality of upper cooling channels are respectively arranged between the plurality of microchannels. The plurality of lower cooling channels and the plurality of upper cooling channels respectively pass through the lower connection layer and the first insulating layer, and the second insulating layer and the upper connection layer. The plurality of lower cooling channels and the plurality of upper cooling channels are arranged parallel to the outer end of the lower connection layer. The first insulating layer and the second insulating layer are made of insulating material with high heat-conducting capacity. The plurality of microchannels on the first insulating layer are arranged more densely than the plurality of microchannels on the second insulating layer.

[0013] As a further improvement of the present application, the following steps are included:

[0014] S1, sealing and packaging;

[0015] Filling liquid metal into the microchannels, the lower cooling channels, the upper cooling channels, and the cooling chamber;

[0016] S2, piezoelectric driving convection heat dissipation;

[0017] When working, the piezoelectric driving assembly drives the liquid metal to circulate in the substrate. When the device layer works, the heat generated by the device layer is conducted to the liquid metal. The liquid metal conducts the heat generated by the device layer to the outside during the flow process to dissipate heat.

[0018] S3, signal conduction detection;

[0019] In use, if the substrate is damaged by impact and the like, causing the liquid metal in the microchannel to fail to conduct signals, the substrate performs self-detection to detect the microchannel with interrupted signals;

[0020] S4, self-repair of the signal path;

[0021] By opening the communication hole between the corresponding microchannel and the lower cooling channel through the switch assembly, the liquid metal in the cooling chamber is replenished into the failed microchannel to restore signal transmission.

[0022] In summary, the present application has the following advantages:

[0023] 1. Efficient heat dissipation. By designing microchannels, lower cooling channels, upper cooling channels and cooling chambers inside the packaging substrate and filling metals or alloys that remain liquid at room temperature (liquid metal), the piezoelectric driving assembly is used to drive the liquid metal to circulate in the channels, forming directional convection heat dissipation. The heat generated by the device layer can be quickly transmitted to the liquid metal through the high thermal conductivity of the first insulating layer and the second insulating layer, and then discharged to the environment through the cooling chamber fins, thereby achieving efficient and uniform heat dissipation, improving the working stability and life of power electronic components.

[0024] 2. Integrated signal transmission and heat dissipation functions. The microchannel not only undertakes the task of heat dissipation, but also has the function of signal conduction. The liquid metal can complete signal transmission while transmitting heat due to its good electrical conductivity, realizing the integration of heat dissipation and signal transmission.

[0025] 3. Self-detection and self-repair mechanism. The packaging substrate has a signal conduction detection function. The signal transmission status in the microchannel is monitored in real time by a self-detection circuit or an external detection device, which can quickly identify signal transmission interruptions caused by impact, vibration, etc. When signal interruption is detected, the communication hole is opened through the control switch assembly, and the liquid metal in the cooling chamber is replenished into the failed microchannel to realize self-repair of the signal path, thereby improving the reliability and durability of the packaging substrate.

[0026] 4. Sealing and protection. The liquid metal is filled by vacuum infusion or precise dripping process, and sealed by high-strength sealing glue, welding or mechanical locking, etc. to ensure good air tightness and waterproofness of the packaging substrate, effectively prevent the liquid metal from leaking, and enhance the stability and durability of the packaging structure in complex environments.

[0027] 5. Compact structure and flexibility. The overall packaging substrate is designed compactly and reasonably, and the microchannels, cooling channels and cooling chambers are designed to fully consider the heat dissipation efficiency and signal transmission convenience. At the same time, the piezoelectric driving assembly is used to accurately drive the liquid metal, and the switch assembly is used to realize self-repair of the failure, showing high flexibility and intelligent level. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a perspective view of the present application;

[0029] Figure 2 is a top view of the present application;

[0030] Figure 3 is an A-A sectional view of the present application;

[0031] Figure 4 is a B-B sectional view of the present application;

[0032] Figure 5 is a C-C sectional view of the present application;

[0033] Figure 6 is an enlarged view of D of the present application;

[0034] Figure 7 is an enlarged view of E of the present application;

[0035] Figure 8 is a partial exploded view of the present application Figure 1 ;

[0036] Figure 9 is a partial exploded view of the present application Figure 2 ;

[0037] Figure 10 is a structure view of the piezoelectric driving assembly of the present application;

[0038] Figure 11 is an enlarged view of F of the present application;

[0039] Figure 12 is a front view of the piezoelectric driving assembly of the present application;

[0040] Figure 13 is a G-G sectional view of the present application.

[0041] BRIEF DESCRIPTION OF THE DRAWINGS

[0042] 1, lower connecting layer; 2, first insulating layer; 3, second insulating layer; 4, upper connecting layer; 5, device layer; 6, sealing layer; 7, micro channel; 8, lower cooling channel; 9, upper cooling channel; 10, shell; 11, cooling chamber; 12, piezoelectric driving assembly; 13, liquid metal; 14, communication hole; 15, switch assembly; 16, driving piece; 17, conical hole; 18, conical tube; 19, deformation piece; 20, deformation control line; 21, connecting column; 22, heat sink. DETAILED DESCRIPTION

[0043] The three embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0044] The first embodiment is as follows:

[0045] Figures 1-13 As shown, an electric power electronic component packaging substrate includes a lower connection layer 1, a first insulating layer 2 fixedly connected to the top end of the lower connection layer 1, a second insulating layer 3 fixedly connected to the top end of the first insulating layer 2, an upper connection layer 4 fixedly connected to the top end of the second insulating layer 3, a device layer 5 fixedly connected to the top end of the upper connection layer 4, and a sealing layer 6 fixedly connected to the top end of the device layer 5. A plurality of micro-channels 7 are formed in the upper connection layer 4, and the micro-channels 7 penetrate the second insulating layer 3, the first insulating layer 2, and the lower connection layer 1 in sequence from the end away from the device layer 5. A plurality of lower cooling channels 8 are formed between the lower connection layer 1 and the first insulating layer 2, and a plurality of upper cooling channels 9 are formed between the second insulating layer 3 and the upper connection layer 4. The lower connection layer 1, the first insulating layer 2, the second insulating layer 3, the upper connection layer 4, and the device layer 5 are fixedly connected to the outer end of a shell 10. The shell 10 is provided with a cooling chamber 11 near the end close to the first insulating layer 2 and the second insulating layer 3. A plurality of piezoelectric driving assemblies 12 are fixedly connected in the cooling chamber 11. The plurality of micro-channels 7, the lower cooling channels 8, and the upper cooling channels 9 are in communication with the cooling chamber 11, and the communication parts are filled with liquid metal 13. The plurality of lower cooling channels 8 are in communication with the plurality of micro-channels 7 distributed along the axis direction of the lower cooling channels 8 through communication holes 14. The plurality of communication holes 14 are fixedly connected with switch assemblies 15. The liquid metal 13 is a metal or alloy that can remain in liquid state at room temperature.

[0046] In the above electric power electronic component packaging substrate, the electric power electronic component packaging substrate adopts a multi-layer structure design, and a stable and efficient heat dissipation and signal transmission system is constructed through the lower connection layer 1, the first insulating layer 2, the second insulating layer 3, the upper connection layer 4, and the device layer 5. The micro-channels 7, the lower cooling channels 8, the upper cooling channels 9, and the cooling chamber 11 are arranged inside the packaging substrate, and the metal or alloy liquid metal 13 that remains in liquid state at room temperature is filled. The liquid metal 13 is driven to circulate by the piezoelectric driving assembly 12, effectively absorbs and rapidly dissipates the heat generated by the device layer 5, greatly improves the heat dissipation efficiency, and at the same time, the liquid metal 13 realizes high-stable signal transmission between components by virtue of its excellent electrical conductivity through the micro-channels 7. In particular, the packaging substrate is equipped with the switch assemblies 15, which can flexibly switch the flow path of the liquid metal 13 between the micro-channels 7 and the cooling channels, giving the substrate self-repairing function. When signal interruption occurs, the signal path can be quickly restored, thereby significantly enhancing the overall performance, reliability, and service life of the packaging substrate.

[0047] The lower connection layer 1 is the bottom structure of the packaging substrate, provides stable connection with external circuit boards or other components, and is also part of the heat management and signal conduction path. Its role is to carry the entire packaging substrate and realize heat dissipation and / or signal transmission to internal components through the lower cooling channels 8.

[0048] The first insulation layer 2 has good insulation performance and certain thermal conductivity, and is used to isolate the lower connecting layer 1 and the second insulation layer 3 to prevent short circuit of electric current, while allowing heat to pass through to achieve effective heat conduction from the device layer 5 to the cooling channel.

[0049] The second insulation layer 3 is similar to the first insulation layer 2 and also plays a role in isolation and heat conduction, mainly located below the upper connecting layer 4, combined with the upper cooling channel 9, to ensure that heat can be smoothly transmitted from the upper connecting layer 4 to the cooling system.

[0050] The upper connecting layer 4 serves as a transition between the device layer 5 and the lower structure, and the microchannels 7 opened on it are used to fill the liquid metal 13 to achieve signal transmission and heat dissipation functions, and at the same time, the upper connecting layer 4 also undertakes the task of interconnection with the external circuit.

[0051] The device layer 5 is the area where power electronic components are placed, and through thermal contact with the upper connecting layer 4 and the lower connecting layer 1, the heat generated during operation is transmitted to the liquid metal 13, and through the circulating flow of the liquid metal 13, efficient heat dissipation is achieved.

[0052] The sealing layer 6 is located above the device layer 5 and plays a role in protecting the internal components and liquid metal 13 from the external environment, ensuring the sealing and reliability of the packaging substrate.

[0053] The microchannel 7 fills the channel of the liquid metal 13, not only for conducting heat from the device layer 5, but also for signal transmission function, through the communication with the lower cooling channel 8 and the upper cooling channel 9, to achieve the circulating flow of the liquid metal 13, to achieve efficient heat dissipation and stable signal transmission.

[0054] The lower cooling channel 8 is located between the lower connecting layer 1 and the first insulation layer 2, forming one of the channels for the flow of the liquid metal 13, and through the communication hole 14 with the microchannel 7, the heat is transmitted from the device layer 5 to the cooling chamber 11.

[0055] The upper cooling channel 9 is similar to the lower cooling channel 8, located between the second insulation layer 3 and the upper connecting layer 4, and cooperates with the lower cooling channel 8 to form the heat dissipation path of the liquid metal 13.

[0056] The shell 10 wraps the external structure of the packaging substrate, providing mechanical support and protection, while internally setting up the cooling chamber 11 to achieve control of the flow of the liquid metal 13 and strengthening of the heat dissipation effect.

[0057] The cooling chamber 11 is integrated inside the shell 10 and is used to collect and dissipate heat, and through the piezoelectric driving assembly 12, the liquid metal 13 is driven to circulate, improving the heat dissipation efficiency.

[0058] The piezoelectric driving assembly 12 is installed in the cooling chamber 11, and generates vibration through voltage driving to make the liquid metal 13 form a circulating flow in the micro-channel 7, the lower cooling channel 8 and the upper cooling channel 9, thereby effectively taking away the heat generated by the device layer 5.

[0059] The liquid metal 13 is a metal or alloy that remains liquid at room temperature, and is used to achieve efficient heat management and signal transmission inside the packaging substrate, and has high thermal conductivity and good electrical conductivity.

[0060] The communication hole 14 connects the lower cooling channel 8 and the micro-channel 7, and the flow path of the liquid metal 13 is controlled by the switch assembly 15 to realize the regulation of the heat dissipation and signal transmission functions.

[0061] The switch assembly 15 is installed in the communication hole 14, and is used to open or close the flow of the liquid metal 13 between different channels when needed, to ensure that the signal path can be quickly repaired in case of failure, and to enhance the self-repairing ability of the packaging substrate.

[0062] Through the circulating flow of the liquid metal 13 and the driving of the piezoelectric driving assembly 12, the heat generated by the power electronic components is quickly removed and dissipated, the working temperature of the components is reduced, the system stability is improved, the high efficiency signal transmission between components is realized through the micro-channel 7 by using the high electrical conductivity of the liquid metal 13, and the flow path of the liquid metal 13 between the micro-channel 7 and the cooling channel is flexibly switched by the switch assembly 15, so that when a signal interruption occurs, the signal path can be restored in time, and the reliability and service life of the packaging substrate are improved.

[0063] Second embodiment:

[0064] Figures 1-13 It is shown that a plurality of piezoelectric driving assemblies 12 are uniformly distributed around the lower connecting layer 1, and the plurality of piezoelectric driving assemblies 12 divide the cooling chamber 11 into a plurality of independent areas, the plurality of piezoelectric driving assemblies 12 each include a driving sheet 16, and a plurality of tapered holes 17 are formed in the plurality of driving sheets 16.

[0065] The smaller end of each of the plurality of tapered holes 17 is arranged towards the driving sheet 16, a tapered tube 18 is fixedly connected in each of the plurality of tapered holes 17, and the smaller end of each of the plurality of tapered tubes 18 is arranged away from the driving sheet 16, the plurality of driving sheets 16 are made of piezoelectric material, and the plurality of driving sheets 16 are electrically connected to external equipment through wires.

[0066] The switch assembly 15 includes a deformation sheet 19 located in the plurality of communication holes 14, and the bottom end of each of the plurality of deformation sheets 19 along the axis direction of the lower cooling channel 8 is fixedly connected to the same deformation control wire 20, and the plurality of deformation control wires 20 penetrate through the lower connecting layer 1 and are electrically connected to external equipment.

[0067] A plurality of micro-channels 7 on the lower connecting layer 1 are fixedly connected with connecting columns 21 away from one end of the first insulating layer 2, the plurality of connecting columns 21 are made of high-conductivity material, and the plurality of connecting columns 21 are electrically connected with external circuits.

[0068] The shell 10 comprises a top cover fixedly connected with the outer end of the upper connecting layer 4, the bottom end of the top cover is fixedly connected with a heat-conducting plate, the bottom end of the heat-conducting plate is fixedly connected with the top end of the lower connecting layer 1, and the outer ends of the top cover and the heat-conducting plate are fixedly connected with a plurality of cooling fins 22.

[0069] The plurality of micro-channels 7 are vertically arranged at the top end of the upper connecting layer 4 and uniformly distributed on the upper connecting layer 4, the plurality of lower cooling channels 8 and the plurality of upper cooling channels 9 are respectively arranged between the plurality of micro-channels 7, the plurality of lower cooling channels 8 and the plurality of upper cooling channels 9 respectively penetrate the lower connecting layer 1 and the first insulating layer 2 and the second insulating layer 3 and the upper connecting layer 4, the plurality of lower cooling channels 8 and the plurality of upper cooling channels 9 are arranged in parallel with the outer end of the lower connecting layer 1, the first insulating layer 2 and the second insulating layer 3 are made of insulating material with high heat-conducting capacity, and the plurality of micro-channels 7 on the first insulating layer 2 are arranged more densely than the plurality of micro-channels 7 on the second insulating layer 3.

[0070] The plurality of piezoelectric driving assemblies 12 are uniformly distributed around the lower connecting layer 1 to divide the cooling chamber 11 into a plurality of independent areas, the assemblies excite vibration through respective driving pieces 16, the driving pieces 16 are made of piezoelectric material, can generate high-frequency vibration when powered by external equipment, and the plurality of conical holes 17 and the plurality of conical tubes 18 arranged on the driving pieces are designed to facilitate directional flow of the liquid metal 13 during vibration, thereby forming uniform and efficient convection heat dissipation effect inside the entire packaging substrate, accurately controlling the flow direction and speed of the liquid metal 13, and significantly improving the heat dissipation performance and efficiency.

[0071] The switch assembly 15 comprises a deformation piece 19 and a deformation control line 20, when it is necessary to repair the signal path, the deformation control line 20 is powered by external equipment to make the deformation piece 19 deform, thereby controlling the opening and closing state of the communication hole 14, and further adjusting the flow path of the liquid metal 13 between the micro-channels 7 and the cooling channels, so as to realize self-repair of the signal path and improve the stability and reliability of the packaging substrate.

[0072] The connecting columns 21 are fixed on the plurality of micro-channels 7 away from one end of the first insulating layer 2 on the lower connecting layer 1 and are made of high-conductivity material, thereby ensuring effective electrical connection between the inside of the packaging substrate and the external circuit and being conducive to efficient transmission and transfer of signals.

[0073] The shell 10 is composed of a top cover, a heat-conducting plate and a heat sink 22, the heat-conducting plate transmits the heat of the upper connecting layer 4 and the lower connecting layer 1 to the heat sink 22 through the top cover, the heat sink 22 increases the heat dissipation area and accelerates the heat dissipation to the external environment, which helps to rapidly conduct the heat inside the packaging substrate to the outside, reduces the temperature of the components and improves the working efficiency and service life of the components.

[0074] The layout of the micro-channels 7, the lower cooling channels 8 and the upper cooling channels 9, the micro-channels 7 are uniformly distributed vertically to the upper connecting layer 4, the lower cooling channels 8 and the upper cooling channels 9 are respectively located on both sides of the micro-channels 7 and penetrate through the entire packaging substrate, and maintain parallel with the outer end of the lower connecting layer, the first insulating layer 2 and the second insulating layer 3 are selected from materials with high insulation and heat conduction performance, and the micro-channels 7 on the first insulating layer are more densely arranged, which ensures the uniformity of the heat distribution inside the packaging substrate, and facilitates the connection of the substrate with other circuits, through the efficient flow of the liquid metal 13 between the channels, the signal transmission and high-efficiency heat dissipation are realized, and the compactness and heat dissipation efficiency of the packaging structure are optimized.

[0075] The third embodiment is as follows:

[0076] Figures 1-13 It is shown that the following steps are included;

[0077] S1, sealing and packaging;

[0078] The liquid metal 13 is filled into the micro-channels 7, the lower cooling channels 8, the upper cooling channels 9 and the cooling chamber 11;

[0079] S2, piezoelectric driving convection heat dissipation;

[0080] When working, the piezoelectric driving assembly 12 drives the liquid metal 13 to circulate in the substrate, when the device layer 5 works, the heat generated by the device layer 5 is conducted into the liquid metal 13, and the liquid metal 13 conducts the heat generated by the device layer 5 to the outside during the flow;

[0081] S3, signal conduction detection;

[0082] In the use process, if the liquid metal 13 in the micro-channels 7 cannot conduct signals due to damage such as impact of the substrate, the substrate performs self-detection to detect the micro-channels 7 with interrupted signals;

[0083] S4, signal path self-repairing;

[0084] Through the switch assembly 15, the communication hole 14 between the corresponding micro-channels 7 and the lower cooling channels 8 is opened, so that the liquid metal 13 in the cooling chamber 11 is supplemented into the failed micro-channels 7 to restore the signal transmission.

[0085] The sealing package, all internal channels of the package substrate, including microchannels 7, lower cooling channels 8, upper cooling channels 9 and cooling chambers 11, are subjected to cleaning treatment to ensure that the interior is free of impurities and contaminants.

[0086] The selected metal or alloy liquid metal 13 that remains liquid at room temperature is injected into each internal channel of the package substrate using a vacuum infusion or precision drip process to ensure that the liquid metal 13 can be completely filled and free of air bubbles.

[0087] After the liquid metal 13 is filled, the package substrate is tightly sealed by using high-strength sealing glue, welding or mechanical locking, etc. to ensure that the liquid metal 13 does not leak, while ensuring the airtightness and waterproofness of the package structure.

[0088] Piezoelectric drive convection cooling, when the device layer 5 starts to work and generates heat, the piezoelectric drive assembly 12 is applied with a voltage of a specific frequency and amplitude by an external device, so that the driving piece 16 of the piezoelectric drive assembly 12 generates periodic vibration.

[0089] The tapered hole 17 on the driving piece 16 cooperates with the tapered tube 18 to design so that the fluctuation generated by the vibration is transmitted to the liquid metal 13, and the liquid metal 13 is driven to form directional convection in the microchannels 7, lower cooling channels 8, upper cooling channels 9 and cooling chambers 11.

[0090] The heat generated by the device layer 5 is quickly transmitted to the liquid metal 13 through the high thermal conductivity first insulating layer 2 and second insulating layer 3, and with the circulating flow of the liquid metal 13, the heat is taken to the cooling chamber 11 and discharged to the environment through the cooling fins 22, achieving high-efficiency heat dissipation.

[0091] Signal conduction detection, during the operation of the package substrate, the signal transmission condition in each microchannel 7 is periodically monitored by the internally integrated self-checking circuit or external detection equipment.

[0092] When the substrate is subjected to impact, vibration and other unexpected situations, which may cause the liquid metal 13 in the microchannel 7 to be disconnected or deformed, thereby causing interruption of signal transmission, the self-checking system can quickly identify the affected microchannel 7.

[0093] Signal path self-repair, once the signal-interrupted microchannel 7 is detected, the self-checking system immediately starts the signal path repair program and sends instructions to the corresponding switch assembly 15 through the control circuit.

[0094] After receiving the instructions, the deformation piece 19 is deformed under the drive of the deformation control line 20 below it, opening the communication hole 14, supplementing the liquid metal 13 in the microchannel 7, and removing the signal transmission obstruction caused by the disconnection of the liquid metal 13.

[0095] The liquid metal 13 in the cooling chamber 11 flows into the opened communication hole 14 under the action of the piezoelectric driving assembly 12, and then fills into the fault microchannel 7, re-establishes the signal conduction path, restores normal signal transmission, and after the repair is completed, the communication hole 14 is closed, and the original working state of the packaging substrate is restored.

[0096] By strictly cleaning the microchannel 7, the lower cooling channel 8, the upper cooling channel 9 and the cooling chamber 11 inside the packaging substrate and filling the liquid metal 13 by a vacuum filling or a precise drop filling process, it is ensured that there is no impurity and bubble in the packaging, and the purity of the packaging and the filling effect of the liquid metal 13 are improved.

[0097] The piezoelectric driving assembly 12 is accurately controlled by an external device, the driving sheet 16 generates periodic vibration, and through the design of the conical hole 17 and the conical tube 18, the vibration is effectively converted into directional convection of the liquid metal 13, and efficient thermal management inside the packaging substrate is realized.

[0098] Through the first insulating layer 2 and the second insulating layer 3 with high thermal conductivity, the heat generated by the device layer 5 is quickly transmitted to the liquid metal 13, and with the circulation of the liquid metal 13, the heat is quickly discharged from the cooling chamber 11 through the heat sink 22, thereby ensuring long-term stable operation and efficient heat dissipation of the power electronic components.

[0099] The built-in self-checking circuit or the external detection device monitors the signal transmission condition in the microchannel 7 in real time, and even under adverse conditions such as impact and vibration, the signal transmission interruption caused by the disconnection or deformation of the liquid metal 13 can be quickly identified, and the self-diagnosis ability and fault detection efficiency of the system are improved.

[0100] Once the signal interruption is detected, the self-checking system can immediately trigger the signal path repair program, the deformation sheet 19 of the control switch assembly 15 is deformed under the driving of the deformation control line 20, the communication hole 14 is temporarily opened, the liquid metal 13 is supplemented into the fault microchannel 7, and the signal transmission is restored.

[0101] The whole repair process does not need manual intervention, the liquid metal 13 automatically flows into the fault microchannel 7 under the action of the piezoelectric driving assembly 12, the signal conduction path is re-established, the normal signal transmission is restored, after the repair is completed, the communication hole 14 is automatically closed, the original working state of the packaging substrate is restored, and the self-healing ability and operation reliability of the system are improved.

[0102] In combination with the current actual demand, the protection scope of the above-mentioned embodiments of the application is not limited thereto, various changes made within the knowledge range of those skilled in the art without departing from the concept of the application still fall within the protection scope of the application.

Claims

1. A power electronic component packaging substrate, characterized in that: The invention comprises a lower connection layer (1), wherein the top of the lower connection layer (1) is fixedly connected to a first insulating layer (2), the top of the first insulating layer (2) is fixedly connected to a second insulating layer (3), the top of the second insulating layer (3) is fixedly connected to an upper connection layer (4), the top of the upper connection layer (4) is fixedly connected to a device layer (5), the top of the device layer (5) is fixedly connected to a sealing layer (6), a plurality of microchannels (7) are provided on the upper connection layer (4), the end of the microchannels (7) away from the device layer (5) sequentially passes through the second insulating layer (3), the first insulating layer (2) and the lower connection layer (1), a plurality of lower cooling channels (8) are provided between the lower connection layer (1) and the first insulating layer (2), a plurality of upper cooling channels (9) are provided between the second insulating layer (3) and the upper connection layer (4), and the lower connection layer (1) is provided with a plurality of microchannels (7). The outer ends of the first insulating layer (2), the second insulating layer (3), the upper connecting layer (4) and the device layer (5) are fixedly connected to a shell (10), and a cooling chamber (11) is opened at one end of the shell (10) close to the first insulating layer (2) and the second insulating layer (3). A plurality of piezoelectric drive components (12) are fixedly connected in the cooling chamber (11), and the plurality of microchannels (7), the lower cooling channel (8) and the upper cooling channel (9) are all connected to the cooling chamber (11), and the connected parts are filled with liquid metal (13). The plurality of lower cooling channels (8) are connected to the plurality of microchannels (7) distributed along the axis direction of the lower cooling channel (8) through connecting holes (14), and the plurality of connecting holes (14) are fixedly connected to switch components (15). The liquid metal (13) is a metal or alloy that can remain liquid at room temperature.

2. The power electronic component packaging substrate according to claim 1, characterized in that: The plurality of piezoelectric drive components (12) are evenly distributed around the lower connection layer (1), and the plurality of piezoelectric drive components (12) divide the cooling chamber (11) into a plurality of independent areas. The plurality of piezoelectric drive components (12) each include a drive plate (16), and the plurality of drive plates (16) each have a plurality of conical holes (17).

3. The power electronic component packaging substrate according to claim 2, characterized in that: The ends of the tapered holes (17) with smaller diameters are all arranged in a direction close to the driving plate (16), the tapered tubes (18) are fixedly connected in the tapered holes (17), and the ends of the tapered tubes (18) with smaller diameters are all arranged in a direction away from the driving plate (16), the driving plates (16) are all made of piezoelectric material, and the driving plates (16) are all electrically connected to external equipment through wires.

4. The power electronic component packaging substrate according to claim 1, characterized in that: The switch assembly (15) includes a deformation sheet (19) located in a plurality of connecting holes (14), and the bottom ends of the plurality of deformation sheets (19) along the axis of the lower cooling channel (8) are fixedly connected to the same deformation control wire (20), and the plurality of deformation control wires (20) all pass through the lower connection layer (1) and are electrically connected to external equipment.

5. The power electronic component packaging substrate according to claim 1, characterized in that: The multiple microchannels (7) on the lower connection layer (1) are fixedly connected to a connection column (21) at one end away from the first insulating layer (2), and the multiple connection columns (21) are all made of a high-conductivity material, and the multiple connection columns (21) are all electrically connected to an external circuit.

6. The power electronic component packaging substrate according to claim 1, characterized in that: The shell (10) includes a top cover fixedly connected to the outer end of the upper connection layer (4), a heat conduction plate fixedly connected to the bottom end of the top cover, the bottom end of the heat conduction plate fixedly connected to the top end of the lower connection layer (1), and a plurality of heat sinks (22) fixedly connected to the top cover and the outer end of the heat conduction plate.

7. The power electronic component packaging substrate according to claim 1, characterized in that: The plurality of microchannels (7) are perpendicular to the top of the upper connection layer (4) and are evenly distributed on the upper connection layer (4); the plurality of lower cooling channels (8) and the upper cooling channels (9) are respectively located between the plurality of microchannels (7); the plurality of lower cooling channels (8) and the upper cooling channels (9) respectively penetrate the lower connection layer (1) and the first insulating layer (2) and the second insulating layer (3) and the upper connection layer (4); and the plurality of lower cooling channels (8) and the upper cooling channels (9) are respectively arranged in parallel with the outer end of the lower connection layer (1).

8. The power electronic component packaging substrate according to claim 1, characterized in that: The first insulating layer (2) and the second insulating layer (3) are both made of insulating materials with heat conductivity, and the multiple microchannels (7) on the first insulating layer (2) are arranged more densely than the multiple microchannels (7) on the second insulating layer (3).

9. A power electronic component packaging substrate according to any one of claims 1 to 8, characterized in that: The following steps are included: S1, sealed package; Filling the liquid metal (13) into the microchannel (7), the lower cooling channel (8), the upper cooling channel (9) and the cooling chamber (11); S2, piezoelectric driven convection cooling; During operation, the piezoelectric drive component (12) drives the liquid metal (13) to circulate in the substrate. When the device layer (5) is operating, the heat generated by it is transferred to the liquid metal (13). During the flow process, the liquid metal (13) transfers the heat generated on the device layer (5) to the outside for heat dissipation. S3, signal continuity detection; During use, if the substrate is damaged by impact or the like, resulting in the liquid metal (13) in the microchannel (7) being unable to conduct signals, the substrate performs a self-check to detect the microchannel (7) where the signal is interrupted; S4, signaling pathway self-repair; The connecting hole (14) between the corresponding microchannel (7) and the lower cooling channel (8) is opened by the switch assembly (15), so that the liquid metal (13) in the cooling chamber (11) is replenished into the faulty microchannel (7) to restore signal transmission.

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