Intelligent plasma etching machine
By designing the flip unit and cleaning unit of the intelligent plasma etching machine, the automatic flip and etching of materials are realized, solving the problem of difficulty in etching and operation troublesomeness of the bottom of the material in the prior art, and improving the etching efficiency and operation simplicity.
Patent Information
- Application Number
- CN202411704242.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2044-11-26
AI Technical Summary
Existing plasma etching machines are difficult to etch the bottom of the material, resulting in frequent face replacement and troublesome operation.
An intelligent plasma etching machine is designed, including a flip unit and a cleaning unit, which realizes automatic flip and etching of materials through a transmission mechanism and a clamping assembly, simplifying the operation process.
Automatic material replacement and plasma etching are realized, etching efficiency is improved, and operation complexity and time are reduced.
Smart Images

Figure CN119767551A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of plasma etching machines, and in particular, relates to an intelligent plasma etching machine. Background Art
[0002] Circuit printing uses photoengraving technology, that is, etching the photographed image base onto a copper or zinc plate, and using this copper or zinc plate for printing. A plasma etcher is a device that etches the image base onto a copper or zinc plate. Plasma etching is the most common form of dry etching. Its principle is that the gas exposed to the electron area forms plasma, and the resulting ionized gas and gas composed of released high-energy electrons form plasma or ions. When the ionized gas atoms are accelerated by an electric field, they release enough force to tightly bond the material or etch the surface with the surface repelling force.
[0003] However, when etching materials, only the exposed surface of the material can be etched. However, some materials need to be etched at the bottom of the material. This results in the need to shut down the etching machine after etching is completed once and change the surface of the placed material, which is very troublesome.
[0004] In view of this, the present invention is proposed. Summary of the invention
[0005] In order to solve the above technical problems, the basic concept of the technical solution adopted by the present invention is:
[0006] An intelligent plasma etching machine, comprising an installation unit, a flip unit, a plasma etching assembly and a cleaning unit, wherein the installation unit comprises an etching machine body, a side wall of the etching machine body is fixedly mounted with an installation shell, an inner cavity of the etching machine body is mounted with a concave placement shell, a sealing door is arranged above the etching machine body, a first connecting pipe and a second connecting pipe are respectively arranged on the etching machine body, the other ends of the first connecting pipe and the second connecting pipe are respectively connected to the installation shell, an air extraction pump and an air intake pump are respectively arranged on the first connecting pipe and the second connecting pipe, and a water outlet is arranged at the bottom of the installation shell;
[0007] The flip unit comprises a first placement plate and a second placement plate, a placement slot is provided above the second placement plate, a round-shaped installation frame is provided above the first placement plate, a rotating rod is fixedly passed through one side wall of the round-shaped installation frame, bearings are provided at both ends of the rotating rod, and the bearings are respectively installed on the opposite side walls of the concave placement housing, and a transmission mechanism is provided above the rotating rod, and the transmission mechanism is used to drive the rotating rod to rotate;
[0008] The cleaning unit includes a filter plate, a water tank is installed above the filter plate, water inlets are provided on the water tank and the mounting shell, a circular rotating cylinder is rotatably installed in the inner cavity of the water tank, the circular rotating cylinder movably passes through the filter plate, a cylindrical sealing shell is fixedly installed in the inner cavity of the water tank, the cylindrical sealing shell and the circular rotating cylinder are fitted with each other, filtering holes are opened on the cylindrical sealing shell and the circular rotating cylinder, and a plurality of spray heads are provided at the bottom of the circular rotating cylinder.
[0009] As a preferred embodiment of the present invention, the concave placement shell is fixedly installed with a circular mounting cylinder at the first connecting pipe, the inner cavity of the circular mounting cylinder is sealed with a piston plate, the end of the piston plate away from the first connecting pipe is fixedly connected with a moving rod, the other end of the moving rod is movably passed through the circular mounting cylinder, and an air outlet is opened at the bottom of the circular mounting cylinder.
[0010] As a preferred embodiment of the present invention, one end of the moving rod away from the piston plate is fixedly connected to a mounting plate, and second sliding mechanisms are respectively provided at both ends of the mounting plate, and the second sliding mechanisms include two second sliding grooves, and the two second sliding grooves are respectively opened on the two opposite side walls of the concave placement shell, and the two second sliding grooves are symmetrical to each other, and the two second sliding grooves are slidably installed with a second slider in the inner cavity, and the opposite side wall of the two second sliders is fixedly connected to the mounting plate, and the inner walls of the two second sliding grooves are fixedly installed with a second return spring, and the other ends of the two second return springs are fixedly connected to the second slider.
[0011] As a preferred embodiment of the present invention, an L-shaped extrusion rod is fixedly installed on the top of the mounting plate, and an L-shaped connecting rod is also fixedly installed on the bottom of one side wall of the mounting plate.
[0012] As a preferred embodiment of the present invention, the transmission mechanism includes a rack, one end of which is fixedly connected to one end of an L-shaped connecting rod, a gear ring is meshingly installed below the rack, and the gear ring is fixedly installed on the rotating rod.
[0013] As a preferred embodiment of the present invention, the bottom of the sealing door is located in the concave inner cavity of the shell, a sliding rail is provided at the bottom of the sealing door, a first return spring is fixedly installed in the inner cavity of the sliding rail, the other end of the first return spring is fixedly connected to the moving end of the sliding rail, a plasma etching assembly is fixedly installed on the sliding rail, and an L-shaped extrusion rod is provided on one side wall of the plasma etching assembly.
[0014] As a preferred embodiment of the present invention, a sealing plate is sealed at the pipe mouth of the second connecting pipe in the inner cavity of the installation shell, and third sliding mechanisms are respectively arranged at both ends of the sealing plate. The third sliding mechanism includes two third sliding grooves, and the two third sliding grooves are respectively opened on the two side walls opposite to each other in the inner cavity of the installation shell. The two third sliding grooves are symmetrical to each other, and third sliding rods are slidably installed in the inner cavities of the two third sliding grooves, and the sealing plate is fixedly connected to the opposite ends of the two third sliding rods, and third return springs are fixedly installed on the inner walls of the two third sliding grooves, and the other ends of the two third return springs are fixedly connected to the third sliding rod.
[0015] As a preferred embodiment of the present invention, a circumferential mounting plate is fixedly mounted on the bottom of the circular rotating cylinder, a rotating rod is fixedly mounted in the middle of the bottom of the circumferential mounting plate, and a limiting plate is fixedly mounted on the rotating rod.
[0016] As a preferred embodiment of the present invention, a fourth slide groove is opened on one side wall of the limiting plate, a fourth slider is slidably installed in the inner cavity of the fourth slide groove, a movable rod is movably installed on the fourth slider, and the other end of the movable rod is movably connected to the sealing plate.
[0017] As a preferred embodiment of the present invention, a plurality of clamping components are arranged equidistantly around the inner cavity of the circular installation frame.
[0018] Compared with the prior art, the present invention has the following beneficial effects:
[0019] In the present invention, when gas enters the inner cavity of the concave placement shell, the piston plate arranged in the inner cavity of the circular mounting cylinder is pushed to drive the moving rod and the mounting plate to move horizontally with the assistance of the second slide groove and the second slide block. When the L-shaped connecting rod moves horizontally, it can drive the rack to move horizontally. When the rack moves horizontally, it can drive the gear ring to rotate with the assistance of the rotating rod. When the rotating rod rotates, it can drive the circular mounting frame to rotate. A clamping assembly is arranged in the circular mounting frame. The clamping assembly can clamp the placed material, so that the clamped material can also be turned over to achieve surface change. At the same time, when the mounting plate moves, it can push the plasma etching assembly through the L-shaped extrusion rod to be located above the turned material with the assistance of the slide rail.
[0020] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In the attached picture:
[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of an intelligent plasma etching machine;
[0023] Figure 2 It is a schematic diagram of the structure of an intelligent plasma etching machine viewed from above;
[0024] Figure 3 It is a schematic diagram of the inner cavity structure of a concave shell of an intelligent plasma etching machine;
[0025] Figure 4 A smart plasma etching machine Figure 3 The enlarged structural diagram at A in the middle;
[0026] Figure 5 A smart plasma etching machine Figure 3 The enlarged structural diagram at B in the middle;
[0027] Figure 6 It is a schematic diagram of the cross-sectional structure of the installation shell of an intelligent plasma etching machine;
[0028] Figure 7 It is a schematic diagram of the structure of the installation shell of an intelligent plasma etching machine when viewed from above;
[0029] Figure 8 It is a schematic diagram of the limit plate structure of an intelligent plasma etching machine;
[0030] Fig. 9 It is a schematic diagram of the cross-sectional structure of a circular rotating cylinder of an intelligent plasma etching machine.
[0031] In the figure:
[0032] 100, mounting unit; 101, etching machine body; 102, mounting housing; 1021, water inlet; 1022, water outlet; 103, sealing door; 1031, slide rail; 1032, first return spring; 104, first connecting pipe; 1041, air pump; 105, second connecting pipe; 1051, air pump; 106, concave placement housing;
[0033] 200, flip unit; 201, first placement plate; 2011, second placement plate; 2012, placement notch; 2013, circular mounting frame; 2014, clamping assembly; 202, circular mounting cylinder; 2021, piston plate; 2022, moving rod; 2023, mounting plate; 2024, L-shaped extrusion rod; 2025, second slide groove; 2026, second slider; 2027, second return spring; 2028, air outlet; 203, L-shaped connecting rod; 2031, rack; 2032, rotating rod; 2033, bearing; 2034, gear ring;
[0034] 300, plasma etching assembly;
[0035] 400, cleaning unit; 401, filter plate; 4011, water tank; 4012, cylindrical sealing shell; 4013, circular rotating cylinder; 4014, spray head; 402, sealing plate; 4021, third slide bar; 4022, third slide slot; 4023, third return spring; 403, circumferential mounting plate; 4031, rotating rod; 4032, limiting plate; 4033, fourth slide slot; 4034, fourth slider; 4035, movable rod. DETAILED DESCRIPTION
[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention.
[0037] Embodiment 1:
[0038] like Figures 1 to 9As shown, an intelligent plasma etching machine comprises an installation unit 100, a flip unit 200, a plasma etching assembly 300 and a cleaning unit 400, wherein the installation unit 100 comprises an etching machine body 101, a mounting shell 102 is fixedly mounted on one side wall of the etching machine body 101, a concave placement shell 106 is mounted in the inner cavity of the etching machine body 101, a sealing door 103 is arranged above the etching machine body 101, a first connecting pipe 104 and a second connecting pipe 105 are respectively arranged on the etching machine body 101, the other ends of the first connecting pipe 104 and the second connecting pipe 105 are respectively connected to the installation shell 102, an air pump 1041 and an air intake pump 1051 are respectively arranged on the first connecting pipe 104 and the second connecting pipe 105, and a water outlet 1022 is arranged at the bottom of the installation shell 102; the flip unit 200 comprises a first placement plate 201 and a second placement plate 2011, a placement notch 2012 is opened above the second placement plate 2011, and a placement notch 2012 is arranged above the first placement plate 201 A circular mounting frame 2013 is provided, and a rotating rod 2032 is fixedly passed through one side wall of the circular mounting frame 2013. Bearings 2033 are respectively provided at both ends of the rotating rod 2032. The bearings 2033 are respectively installed on the two opposite side walls of the concave placement shell 106. A transmission mechanism is provided above the rotating rod 2032, and the transmission mechanism is used to drive the rotating rod 2032 to rotate; the cleaning unit 400 includes a filter plate 401, and a water tank 4011 is installed above the filter plate 401. The water tank 4011 and the mounting shell 10 2 is provided with a water inlet 1021, a circular rotating cylinder 4013 is rotatably installed in the inner cavity of the water tank 4011, the circular rotating cylinder 4013 movably penetrates the filter plate 401, a cylindrical sealing shell 4012 is fixedly installed in the inner cavity of the water tank 4011, the cylindrical sealing shell 4012 and the circular rotating cylinder 4013 are fitted with each other, and filtering holes are opened on the cylindrical sealing shell 4012 and the circular rotating cylinder 4013, and a plurality of spray heads 4014 are arranged at the bottom of the circular rotating cylinder 4013. When the gas enters the inner cavity of the concave placement shell 106, the piston plate 2021 set in the inner cavity of the circular mounting cylinder 202 drives the moving rod 2022 and the mounting plate 2023 to move horizontally with the assistance of the second slide groove 2025 and the second slider 2026. When the L-shaped connecting rod 203 moves horizontally, it will be able to drive the rack 2031 to move horizontally. When the rack 2031 moves horizontally, it will be able to drive the gear ring 2034 to rotate with the assistance of the rotating rod 2032. When the rotating rod 2032 rotates, it will be able to drive the circular mounting frame 2013 to rotate. A clamping assembly 2014 is set in the circular mounting frame 2013. The clamping assembly 2014 can clamp the placed material, so that the clamped material can also be flipped at this time to achieve face changing. At the same time, when the mounting plate 2023 moves, it will be able to push the plasma etching assembly 300 through the L-shaped extrusion rod 2024 to be located above the flipped material with the assistance of the slide rail 1031.
[0039] like Figures 2 to 4 and Figure 6 As shown, in a specific embodiment, the concave placement shell 106 is fixedly installed with a circular installation cylinder 202 at the first connecting pipe 104, and a piston plate 2021 is sealed in the inner cavity of the circular installation cylinder 202. The end of the piston plate 2021 away from the first connecting pipe 104 is fixedly connected to a moving rod 2022, and the other end of the moving rod 2022 is movable through the circular installation cylinder 202, and an air outlet 2028 is provided at the bottom of the circular installation cylinder 202. In this setting, it is ensured that the staff can start the vacuum pump 1041 to extract the air in the concave placement shell 106 through the first connecting pipe 104, so that the inner cavity of the concave placement shell 106 can be in a vacuum state, and at this time, the extracted gas will be able to enter the inner cavity of the installation shell 102.
[0040] like Figures 2 to 4 and Figure 6 As shown, further, one end of the moving rod 2022 away from the piston plate 2021 is fixedly connected to the mounting plate 2023, and second sliding mechanisms are respectively arranged at both ends of the mounting plate 2023. The second sliding mechanisms include two second sliding grooves 2025, and the two second sliding grooves 2025 are respectively opened on the two opposite side walls of the concave placement shell 106. The two second sliding grooves 2025 are symmetrical to each other, and the inner cavities of the two second sliding grooves 2025 are both slidably installed with second sliders 2026, and the opposite side walls of the two second sliders 2026 are fixedly connected to the mounting plate 2023, and the inner walls of the two second sliding grooves 2025 are fixedly installed with second return springs 2027, and the other ends of the two second return springs 2027 are fixedly connected to the second slider 2026. In this configuration, it is ensured that the staff can reset the mounting plate 2023 with the assistance of the second slide groove 2025, the second slider 2026 and the second reset spring 2027 by turning off the air intake pump 1051, thereby allowing the L-shaped squeezing rod 2024 to lose the squeezing force on the plasma etching assembly 300.
[0041] like Figures 2 to 4 and Figure 6 As shown, further, an L-shaped extrusion rod 2024 is fixedly installed on the top of the mounting plate 2023, and an L-shaped connecting rod 203 is also fixedly installed on the bottom of one side wall of the mounting plate 2023. In this configuration, the installation position and components of the L-shaped connecting rod 203 are determined.
[0042] like Figure 3 and Figure 5As shown, further, the transmission mechanism includes a rack 2031, one end of the rack 2031 is fixedly connected to one end of the L-shaped connecting rod 203, a gear ring 2034 is meshed and installed below the rack 2031, and the gear ring 2034 is fixedly installed on the rotating rod 2032. In this configuration, it is ensured that when the mounting plate 2023 moves, it can drive the L-shaped connecting rod 203 to move horizontally, when the L-shaped connecting rod 203 moves horizontally, it can drive the rack 2031 to move horizontally, and when the rack 2031 moves horizontally, it can drive the gear ring 2034 to rotate with the assistance of the rotating rod 2032.
[0043] like Figure 2 As shown, further, the bottom of the sealing door 103 is located in the inner cavity of the concave placement shell 106, and a slide rail 1031 is provided at the bottom of the sealing door 103. A first return spring 1032 is fixedly installed in the inner cavity of the slide rail 1031, and the other end of the first return spring 1032 is fixedly connected to the moving end of the slide rail 1031. A plasma etching assembly 300 is fixedly installed on the slide rail 1031, and an L-shaped extrusion rod 2024 is provided on one side wall of the plasma etching assembly 300. In this setting, it is ensured that when the L-shaped extrusion rod 2024 loses the extrusion force on the plasma etching assembly 300, the plasma etching assembly 300 can be reset with the assistance of the slide rail 1031 and the first return spring 1032, and at the same time, when the mounting plate 2023 is reset, the clamped material can be reset, thereby changing the surface of the material and etching again.
[0044] Embodiment 2:
[0045] The difference between the above embodiment and this embodiment is that: Figures 1 to 3 and Figures 6 to 9As shown, an intelligent plasma etching machine is provided, in which a sealing plate 402 is sealed at the mouth of a second connecting pipe 105 in the inner cavity of an installation shell 102, and a third sliding mechanism is provided at both ends of the sealing plate 402, and the third sliding mechanism includes two third slide grooves 4022, and the two third slide grooves 4022 are respectively opened on the two side walls opposite to each other in the inner cavity of the installation shell 102, and the two third slide grooves 4022 are symmetrical to each other, and the inner cavities of the two third slide grooves 4022 are both slidably installed with third slide bars 4021, and the sealing plate 402 is fixedly connected to the opposite ends of the two third slide bars 4021, and third return springs 4023 are fixedly installed on the inner walls of the two third slide grooves 4022, and the other ends of the two third return springs 4023 are fixedly connected to the third slide bar 4021. A fourth slide groove 4033 is provided on one side wall of the limiting plate 4032, and a fourth slider 4034 is slidably installed in the inner cavity of the fourth slide groove 4033, and a movable rod 4035 is movably installed on the fourth slider 4034, and the other end of the movable rod 4035 is movably connected to the sealing plate 402. In this arrangement, it is ensured that when gas enters the inner cavity of the mounting shell 102, the sealing plate 402 can be pushed by the gas to move horizontally under the placement of the third slide groove 4022 and the third slider 4021, and when the sealing plate 402 moves horizontally, it can drive the movable rod to push the limiting plate 4032 installed on the rotating rod 4031 to rotate slightly with the assistance of the fourth slide groove 4033 and the fourth slider 4034, and when the rotating rod 4031 rotates slightly, it can drive the circumferential mounting plate 403 to rotate, so that the circular rotating cylinder 4013 can be driven to rotate through the circumferential mounting plate 403.
[0046] like Figures 6 to 9 As shown, in a specific embodiment, a circumferential mounting plate 403 is fixedly mounted on the bottom of the circular rotating cylinder 4013, a rotating rod 4031 is fixedly mounted in the middle of the bottom of the circumferential mounting plate 403, and a limiting plate 4032 is fixedly mounted on the rotating rod 4031. In this configuration, the installation positions of the rotating rod 4031 and the limiting plate 4032 are determined.
[0047] like Figure 3 As shown, further, a plurality of equally spaced clamping assemblies 2014 are arranged around the inner cavity of the round-shaped installation frame 2013. In this arrangement, the installation position of the clamping assemblies 2014 is determined.
[0048] The implementation principle of an intelligent plasma etching machine of this embodiment is as follows:
[0049] First, the staff opens the sealed door 103 (opening the sealed door 103 is a prior art). When the sealed door 103 is opened, the staff places the material on the first placement plate 201 arranged above the concave placement shell 106 placed in the inner cavity of the etching machine body 101, and then the staff closes the sealed door 103;
[0050] At the same time, the staff starts the vacuum pump 1041 to extract the air in the concave placement shell 106 through the first connecting pipe 104, so that the inner cavity of the concave placement shell 106 can be in a vacuum state, and the extracted gas can enter the inner cavity of the installation shell 102 at this time. When entering the inner cavity of the installation shell 102, the sealing plate 402 can be pushed by the gas to move horizontally under the placement of the third slide groove 4022 and the third slide rod 4021;
[0051] When the sealing plate 402 moves horizontally, it will be able to drive the movable rod to push the limit plate 4032 installed on the rotating rod 4031 to rotate slightly with the assistance of the fourth slide groove 4033 and the fourth slider 4034. When the rotating rod 4031 rotates slightly, it will be able to drive the circumferential mounting plate 403 to rotate, so that the circular rotating cylinder 4013 can be driven to rotate through the circumferential mounting plate 403, so that the filtering holes opened on the circular rotating cylinder 4013 and the filtering holes opened on the cylindrical sealing shell 4012 can fit together, so that the water in the water tank 4011 can enter the inner cavity of the circular rotating cylinder 4013, and at this time, the water can be sprayed out through the spray head 4014, so that the incoming air can be humidified, so that the dust in the air can be processed;
[0052] At this time, the staff starts the air intake pump 1051 (the air exhaust pump 1041 is in a closed state at this time), so that the air intake pump 1051 can input the gas in the inner cavity of the installation shell 102 into the inner cavity of the concave placement shell 106 through the second connecting pipe 105 (when the gas in the installation shell 102 is extracted, the dust contained in the gas can be filtered again through the filter plate 401, so as to ensure to a certain extent that the gas entering the concave placement shell 106 does not contain dust).
[0053] When the gas enters the inner cavity of the concave placement shell 106, it will be able to push the piston plate 2021 provided in the inner cavity of the circular installation cylinder 202, driving the moving rod 2022 and the installation plate 2023 to move horizontally with the assistance of the second slide groove 2025 and the second slider 2026, until the piston plate 2021 moves to the gas outlet 2028 opened in the circular installation cylinder 202, at which time the gas will be able to enter the inner cavity of the concave placement shell 106;
[0054] When the mounting plate 2023 moves, it can drive the L-shaped connecting rod 203 to move horizontally. When the L-shaped connecting rod 203 moves horizontally, it can drive the rack 2031 to move horizontally. When the rack 2031 moves horizontally, it can drive the gear ring 2034 to rotate with the assistance of the rotating rod 2032. When the rotating rod 2032 rotates, it can drive the circular mounting frame 2013 to rotate. A clamping assembly 2014 is provided in the circular mounting frame 2013. The clamping assembly 2014 can clamp the placed material, so that the clamped material can also be turned over to achieve surface change.
[0055] At the same time, when the mounting plate 2023 moves, the plasma etching assembly 300 can be pushed by the L-shaped extrusion rod 2024 to be located above the flipped material with the assistance of the slide rail 1031 (at this time, the radio frequency generated by the ICP radio frequency power supply is output to the annular coupling coil, and a certain proportion of mixed etching gas is coupled to glow discharge to generate high-density plasma. Under the action of the RF radio frequency of the lower electrode, these plasmas bombard the surface of the circuit board, and the chemical bonds of the semiconductor material in the substrate pattern area are broken, and volatile substances are generated with the etching gas to achieve etching of the material);
[0056] When etching is completed, the staff turns off the air pump 1051 to allow the mounting plate 2023 to be reset with the assistance of the second slide groove 2025, the second slider 2026 and the second reset spring 2027. Therefore, the L-shaped squeezing rod 2024 loses the squeezing force on the plasma etching component 300. At this time, the plasma etching component 300 can be reset with the assistance of the slide rail 1031 and the first reset spring 1032. At the same time, when the mounting plate 2023 is reset, the clamped material can be reset, thereby changing the surface of the material and etching again.
Claims
1. An intelligent plasma etching machine, comprising a mounting unit (100), a flip unit (200), a plasma etching assembly (300) and a cleaning unit (400), characterized in that: The installation unit (100) comprises an etching machine body (101), a mounting shell (102) is fixedly mounted on one side wall of the etching machine body (101), a concave placement shell (106) is mounted in the inner cavity of the etching machine body (101), a sealing door (103) is arranged above the etching machine body (101), a first connecting pipe (104) and a second connecting pipe (105) are respectively arranged on the etching machine body (101), the other ends of the first connecting pipe (104) and the second connecting pipe (105) are respectively connected to the installation shell (102), an air extraction pump (1041) and an air intake pump (1051) are respectively arranged on the first connecting pipe (104) and the second connecting pipe (105), and a water outlet (1022) is arranged at the bottom of the installation shell (102); The flip unit (200) comprises a first placement plate (201) and a second placement plate (2011), a placement notch (2012) is provided above the second placement plate (2011), a circular installation frame (2013) is provided above the first placement plate (201), a rotating rod (2032) is fixedly passed through one side wall of the circular installation frame (2013), bearings (2033) are respectively provided at both ends of the rotating rod (2032), and the bearings (2033) are respectively installed on two opposite side walls of the concave placement shell (106), and a transmission mechanism is provided above the rotating rod (2032), and the transmission mechanism is used to drive the rotating rod (2032) to rotate; The cleaning unit (400) comprises a filter plate (401), a water tank (4011) is installed above the filter plate (401), a water inlet (1021) is provided on the water tank (4011) and the installation shell (102), a circular rotating cylinder (4013) is rotatably installed in the inner cavity of the water tank (4011), the circular rotating cylinder (4013) movably penetrates the filter plate (401), a cylindrical sealing shell (4012) is fixedly installed in the inner cavity of the water tank (4011), the cylindrical sealing shell (4012) and the circular rotating cylinder (4013) are fitted with each other, filtering holes are provided on the cylindrical sealing shell (4012) and the circular rotating cylinder (4013), and a plurality of spray heads (4014) are provided at the bottom of the circular rotating cylinder (4013).
2. An intelligent plasma etching machine according to claim 1, characterized in that: The concave placement shell (106) is fixedly mounted with a circular mounting cylinder (202) at the first connecting pipe (104); the inner cavity of the circular mounting cylinder (202) is sealed with a piston plate (2021); one end of the piston plate (2021) away from the first connecting pipe (104) is fixedly connected with a moving rod (2022); the other end of the moving rod (2022) is movably inserted into the circular mounting cylinder (202); and an air outlet (2028) is provided at the bottom of the circular mounting cylinder (202).
3. An intelligent plasma etching machine according to claim 2, characterized in that: One end of the moving rod (2022) away from the piston plate (2021) is fixedly connected to the mounting plate (2023), and second sliding mechanisms are respectively arranged at both ends of the mounting plate (2023), and the second sliding mechanism includes two second sliding grooves (2025), and the two second sliding grooves (2025) are respectively opened on the two opposite side walls of the concave placement shell (106), and the two second sliding grooves (2025) are symmetrical to each other. The inner cavities of the two second sliding grooves (2025) are both slidably installed with second sliders (2026), and the opposite side walls of the two second sliders (2026) are fixedly connected to the mounting plate (2023), and the inner walls of the two second sliding grooves (2025) are fixedly installed with second return springs (2027), and the other ends of the two second return springs (2027) are fixedly connected to the second sliders (2026).
4. An intelligent plasma etching machine according to claim 3, characterized in that: An L-shaped extrusion rod (2024) is fixedly mounted above the mounting plate (2023), and an L-shaped connecting rod (203) is also fixedly mounted at the bottom of a side wall of the mounting plate (2023).
5. The intelligent plasma etching machine according to claim 1, characterized in that: The transmission mechanism comprises a rack (2031), one end of the rack (2031) is fixedly connected to one end of an L-shaped connecting rod (203), a gear ring (2034) is meshingly mounted below the rack (2031), and the gear ring (2034) is fixedly mounted on the rotating rod (2032).
6. The intelligent plasma etching machine according to claim 1, characterized in that: The bottom of the sealing door (103) is located in the inner cavity of the concave placement shell (106), and a slide rail (1031) is arranged at the bottom of the sealing door (103). A first return spring (1032) is fixedly installed in the inner cavity of the slide rail (1031), and the other end of the first return spring (1032) is fixedly connected to the moving end of the slide rail (1031). A plasma etching assembly (300) is fixedly installed on the slide rail (1031), and an L-shaped extrusion rod (2024) is arranged on one side wall of the plasma etching assembly (300).
7. The intelligent plasma etching machine according to claim 1, characterized in that: The inner cavity of the installation shell (102) is sealed with a sealing plate (402) at the pipe mouth of the second connecting pipe (105), and third sliding mechanisms are respectively arranged at both ends of the sealing plate (402), and the third sliding mechanism includes two third sliding grooves (4022), and the two third sliding grooves (4022) are respectively opened on the two opposite side walls of the inner cavity of the installation shell (102), and the two third sliding grooves (4022) are symmetrical to each other. The inner cavities of the two third sliding grooves (4022) are both slidably installed with third sliding rods (4021), and the opposite ends of the two third sliding rods (4021) are fixedly connected with the sealing plate (402), and the inner walls of the two third sliding grooves (4022) are fixedly installed with third return springs (4023), and the other ends of the two third return springs (4023) are fixedly connected to the third sliding rod (4021).
8. The intelligent plasma etching machine according to claim 1, characterized in that: A circumferential mounting plate (403) is fixedly mounted on the bottom of the circular rotating cylinder (4013), a rotating rod (4031) is fixedly mounted in the middle of the bottom of the circumferential mounting plate (403), and a limiting plate (4032) is fixedly mounted on the rotating rod (4031).
9. An intelligent plasma etching machine according to claim 8, characterized in that: A fourth slide groove (4033) is provided on one side wall of the limiting plate (4032), a fourth slider (4034) is slidably installed in the inner cavity of the fourth slide groove (4033), a movable rod (4035) is movably installed on the fourth slider (4034), and the other end of the movable rod (4035) is movably connected to the sealing plate (402).
10. The intelligent plasma etching machine according to claim 1, characterized in that: A plurality of clamping components (2014) are arranged equidistantly around the inner cavity of the circular installation frame (2013).
Citation Information
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