A wireless bundle BDU structure and heat dissipation simulation method

Abstract

The present invention proposes a wireless bundle BDU structure, including a shell, a component assembly, a busbar assembly, a PCB acquisition circuit board, a conductive assembly and a liquid cooling assembly, wherein the component assembly is arranged in the shell; the busbar assembly is injection-molded in the shell; the PCB acquisition circuit board is arranged in the shell, and is close to the side of the shell opening, and is spaced apart from the component assembly, the conductive assembly is arranged between the component assembly and the busbar assembly and the PCB acquisition circuit board, and the liquid cooling assembly is arranged on the closed side of the shell, and is in contact with the surface of the busbar assembly; the busbar assembly is fixed in the shell through an injection molding process, which enhances the stability and reliability of the structure, and at the same time ensures the insulation between the busbars, and combines the conductive assembly and the PCB acquisition circuit board to integrate the component assembly to realize a wireless bundle layout of high-voltage sampling and low-voltage control, improve space utilization, and take away the heat from the surface of the busbar assembly through the liquid cooling assembly, thereby achieving an efficient heat dissipation effect, thereby improving the reliability and stability of the BDU.

Description

Technical Field

[0001] The present invention relates to the field of BDU technology, and in particular to a wireless bundle BDU structure and a heat dissipation simulation method. Background Art

[0002] BDU, or battery energy distribution unit, is a core component in the high-voltage circuit of electric vehicles. This unit is also called the battery disconnection unit, which is responsible for regulating the power-on, power-off, pre-charging and charging of the high-voltage electrical circuit. The internal structure of BDU is quite complex, including relays, fuses, current collection elements, and external high-voltage copper busbars, signal and drive connectors, etc.; among them, relays can be divided into high-voltage main positive / main negative relays, pre-charging relays and fast-charging relays according to their functions; fuses are connected in series in the circuit to play the role of overcurrent protection. Once the current is too large, the metal components inside will melt, thereby cutting off the circuit.

[0003] Publication number CN210707274U discloses a BDU controller, a BDU, and a vehicle. The BDU controller includes a control circuit and a battery parameter sampling circuit, and the control circuit is connected to the battery parameter sampling circuit; wherein the control circuit is used to respectively connect to the upper and lower power actuators and the battery management unit (BMU) within the BDU.

[0004] In the current BDU controller, the high-voltage sampling and low-voltage control terminals of the relay are connected by wiring harnesses, which will cause trouble for wiring in the distribution box and take up a large amount of internal space, which not only increases the complexity and weight of the system, but may also lead to instability and reliability of signal transmission. In addition, the existing BDU controller has poor heat dissipation effect, which reduces the reliability and stability of the BDU. Summary of the Invention

[0005] In view of this, the present invention proposes a wireless bundle BDU structure and heat dissipation simulation method. Based on reliable wireless bundle electrical connection and efficient heat dissipation design, the safety risks caused by overheating or electrical failure are reduced, which not only improves space utilization, but also improves the reliability and stability of the BDU.

[0006] The technical solution of the present invention is implemented as follows: In the first aspect, the present invention provides a wireless bundle BDU structure, including a shell, a component assembly, a busbar assembly, a PCB acquisition circuit board, a conduction assembly and a liquid cooling assembly, wherein:

[0007] The shell is hollow inside, with one side closed and the other side having an opening;

[0008] The component assembly is arranged in the housing and is used to control the opening and closing of the battery circuit;

[0009] The busbar assembly is injection molded in the housing and is used to connect and conduct the high-voltage devices of the component assembly;

[0010] The PCB acquisition circuit board is arranged in the housing, close to one side of the housing opening, and is spaced apart from the component assembly, and is used to collect and transmit signals from various high-voltage devices of the component assembly;

[0011] The conducting component is arranged between the component assembly and the busbar assembly and the PCB acquisition circuit board, and is used to connect and conduct the various acquisition points on the busbar assembly and the contacts of the high-voltage devices of the component assembly with the PCB acquisition circuit board;

[0012] The liquid cooling component is arranged on the closed side of the shell and abuts against the surface of the busbar component. Heat exchange medium flows in the liquid cooling component for cooling and heat dissipation.

[0013] On the basis of the above technical solution, preferably, the component assembly includes a main positive relay, a pre-charge relay, a main negative relay, a fast charge relay, a main fuse, a pre-charge resistor, a shunt and a branch fuse, wherein,

[0014] The main positive relay, pre-charge relay, main negative relay, fast charge relay, main fuse, pre-charge resistor, shunt and branch fuse are all arranged in the housing;

[0015] The main fuse is arranged near one side edge of the shell, and the main fuse is parallel to the longitudinal horizontal direction of the shell;

[0016] The main positive relay, pre-charging resistor and branch fuse are all located on the side of the main fuse away from the edge of the shell, and the main positive relay is located between the pre-charging resistor and the branch fuse, and the arrangement direction of the main positive relay, pre-charging resistor and branch fuse is perpendicular to the main fuse;

[0017] The pre-charge relay and the fast-charge relay are both located on the side of the main positive relay away from the main fuse, and the pre-charge relay is set corresponding to the position of the main positive relay, and the fast-charge relay is set corresponding to the position of the pre-charge resistor, and the arrangement direction of the pre-charge relay and the fast-charge relay are both perpendicular to the main fuse;

[0018] The main negative relay is located on the side of the pre-charge relay away from the main positive relay, and the main negative relay and the pre-charge relay are arranged correspondingly, and the arrangement direction of the main negative relay is perpendicular to the main fuse;

[0019] The shunt is located on a side of the main negative relay away from the pre-charge relay and is arranged close to the other side edge of the shell.

[0020] On the basis of the above technical solution, preferably, the busbar assembly includes a first busbar, a second busbar, a third busbar, a fourth busbar, a fifth busbar, a sixth busbar, a seventh busbar and an eighth busbar, wherein:

[0021] One end of the first busbar is fixedly connected to the input end of the main fuse, serving as the input end of the main positive circuit, and the other end of the first busbar passes through and extends to the bottom of the housing;

[0022] One end of the second busbar is fixedly connected to the output end of the main fuse, and the other end of the second busbar is fixedly connected to one end of the contact of the main positive relay;

[0023] The third busbar is fixedly connected to the other end of the contact of the main positive relay and one end of the contact of the fast charging relay, and the third busbar has three connection ends;

[0024] The first connection end of the third busbar passes through and extends into the shell and is arranged near the edge. The first connection end of the third busbar serves as the positive output end of the front drive circuit;

[0025] The second connection end of the third busbar passes through and extends into the housing, and is arranged on both sides of the housing with respect to the first connection end of the third busbar. The second connection end of the third busbar serves as the positive output end of the rear drive circuit.

[0026] The third connection end of the third busbar passes through and extends into the housing, and is located on the same side and adjacent to the first connection end of the third busbar. The third connection end of the third busbar is fixedly connected to one end of the branch fuse;

[0027] One end of the fourth busbar is fixedly connected to the other end of the branch fuse, and the other end of the fourth busbar serves as the positive output end of the IPS control loop;

[0028] The fifth busbar is fixedly connected to the other end of the contact of the fast charging relay, and the fifth busbar has a connection end. The connection end of the fifth busbar passes through and extends into the housing, and is arranged adjacent to the first connection end of the third busbar on the same side. The connection end of the fifth busbar serves as the positive output end of the fast charging circuit;

[0029] The sixth busbar is arranged in the shell, one end of the sixth busbar is fixedly connected to the input end of the shunt, and the other end serves as the input end of the main negative circuit;

[0030] One end of the seventh busbar is fixedly connected to the output end of the shunt, and the other end passes through and extends to the bottom of the housing and is fixedly connected to one end of the contact of the main negative relay;

[0031] The eighth busbar is fixedly connected to the other end of the contact of the main negative relay. The eighth busbar has four connection ends. The connection ends of the eighth busbar pass through and extend into the shell. The first connection end and the second connection end of the eighth busbar are on the same side and adjacent to the second connection end of the third busbar. The first connection end of the eighth busbar serves as the negative output end of the IPS control loop, and the second connection end of the eighth busbar serves as the negative output end of the rear drive loop. The third and fourth connection ends of the eighth busbar are on the same side and adjacent to the first connection end of the third busbar. The third connection end of the eighth busbar serves as the negative output end of the fast charging loop, and the fourth connection end of the eighth busbar serves as the negative output end of the front drive loop.

[0032] Based on the above technical solution, preferably, the first busbar, the second busbar, the third busbar, the fifth busbar, the seventh busbar and the eighth busbar are all injection molded on the bottom surface of the shell and are at the same plane height as the bottom surface of the shell.

[0033] On the basis of the above technical solution, preferably, the conductive component includes a plurality of inserts and wire posts, wherein:

[0034] The contact ends of the main positive relay, main negative relay and fast charging relay are all inside the housing, and the coil ends are all on the opening side of the housing; the contact end and coil end of the pre-charging relay are both on the opening side of the housing;

[0035] A plurality of conductor posts are respectively fixed on the second busbar, the third busbar, the fifth busbar, the sixth busbar, the seventh busbar and the eighth busbar, and one end of the plurality of conductor posts passes through and extends into the housing;

[0036] Several plugs are respectively fixed on the contact ends of the main positive relay, the main negative relay and the fast charging relay, the contact end and the coil end of the pre-charging relay, and one end of each wire column extending out of the housing, and the other ends of the several plugs are plugged into the corresponding ports of the PCB acquisition circuit board;

[0037] The two ends of the pre-charge resistor are plugged into corresponding ports of the PCB acquisition circuit board.

[0038] On the basis of the above technical solution, preferably, it also includes an insulating film and a thermal pad, wherein the insulating film is arranged on the bottom surface of the shell and abuts against the surfaces of the first busbar, the second busbar, the third busbar, the fifth busbar, the seventh busbar and the eighth busbar, and the thermal pad is arranged on the side of the insulating film away from the shell, for conducting the heat dissipated by the busbar to the liquid cooling component.

[0039] On the basis of the above technical solution, preferably, the liquid cooling assembly includes an upper cover, a bottom shell, two outward expansion pipes, a plurality of boss portions and a plurality of extension portions, wherein:

[0040] One side of the upper cover is fixedly connected to the thermal pad, and the other side is fixedly connected to the bottom shell;

[0041] A first flow channel and a second flow channel that are not connected to each other are provided in the bottom shell, the liquid inlet side and the liquid outlet side of the first flow channel and the second flow channel are connected, and the first flow channel and the second flow channel are both U-shaped;

[0042] The two outward expansion pipes are fixed on one side of the upper cover close to the thermal pad and are connected to the interior of the bottom shell and are arranged adjacent to each other. The two outward expansion pipes are respectively located at the connecting points of the liquid inlet end side and the liquid outlet end side of the first flow channel and the second flow channel;

[0043] One side of the outward expansion pipe is arranged with an inclined surface with respect to the upper cover, and the inclination direction of the inclined surface is consistent with the flow direction of the fluid, so as to reduce the flow resistance of the flow channel;

[0044] A plurality of boss portions are provided at the connecting portions of the first flow channel and the second flow channel at the liquid inlet end side and the liquid outlet end side, and the positions of the boss portions correspond to the positions of the first busbar and the second busbar;

[0045] Several extension parts are arranged on both sides of the inner walls of the first flow channel and the second flow channel. One side of the extension part is extended obliquely toward the flow channel, and the extension parts on both sides are evenly staggered and arranged corresponding to the positions of the third busbar, the fifth busbar, the seventh busbar and the eighth busbar.

[0046] In a second aspect, the present invention further provides a heat dissipation simulation method for a wireless bundle BDU structure, which is implemented using a wireless bundle BDU structure. The method comprises the following steps:

[0047] S1, modeling the wireless bundle BDU structure in the modeling software;

[0048] S2, obtain the total power, thermal radiation and thermal convection heat dissipation power of all heat-generating devices inside the wireless bundle BDU structure, and calculate the required heat dissipation capacity of the liquid cooling component based on the total power, thermal radiation and thermal convection heat dissipation power of the heat-generating devices;

[0049] S3: Based on the internal structure of the liquid cooling component, a heat dissipation calculation model is constructed, a thermal simulation calculation is performed on the liquid cooling component structure, and the internal structure of the liquid cooling component is adjusted according to the heat dissipation calculation model to obtain the optimal liquid cooling component structure.

[0050] On the basis of the above technical solution, preferably, it is characterized in that: step S2 includes the following steps:

[0051] Obtain the internal resistance of all heating devices inside the wireless bundle BDU structure and calculate the total power of all heating devices. All heating devices inside the wireless bundle BDU structure include the high-voltage devices of the component assembly and the busbars of the busbar assembly. The calculation expression is:

[0052] P1=I 2 R

[0053] Where P1 is the total power of all heating devices inside the wireless bundle BDU structure, I is the current value passing through the BDU, and R is the sum of the internal resistance of the first busbar, second busbar, third busbar, fourth busbar, fifth busbar, sixth busbar, seventh busbar, eighth busbar, main positive relay, pre-charge relay, main negative relay, fast charge relay, main fuse, pre-charge resistor, shunt, and branch fuse;

[0054] Calculate the heat radiation dissipation power of all heat-generating components inside the wireless bundle BDU structure. The expression is:

[0055] Q1=εAσT 4

[0056] Where Q1 is the heat radiation power of all devices inside the wireless bundle BDU structure, ε is the emissivity, A is the heat dissipation area, σ is the Stefan-Boltzmann constant, and T is the temperature difference between the wireless bundle BDU structure and the environment;

[0057] Calculate the heat dissipation power of all heat-generating components inside the wireless bundle BDU structure using the following expression:

[0058] Q2=AhΔT1

[0059] Where Q2 is the heat dissipation power of all devices inside the wireless bundle BDU structure, A is the heat dissipation area, h is the surface heat transfer coefficient, and ΔT1 is the temperature difference between the heating device and the air;

[0060] According to the total power, heat radiation and heat convection heat dissipation power of the heating device, the required heat dissipation of the liquid cooling component 6 is calculated, and the expression is:

[0061] Q3=P1-Q1-Q2

[0062] Where Q3 is the required heat dissipation of the liquid cooling component.

[0063] Based on the above technical solution, preferably, step S3 includes the following steps:

[0064] According to the internal structure of the liquid cooling component, a heat dissipation calculation model is constructed, and the expression is:

[0065]

[0066] Where Q4 is the estimated heat dissipation of the liquid cooling component, q1 is the water inlet flow rate, m is the mass of the heat exchange medium, V1 is the preset volume of the cavity between the upper cover and the bottom shell, r is the radius of the boss and extension; h1 is the height of the boss and extension; n is the total number of bosses and extensions, and ΔT2 is the temperature difference between the two expansion pipes.

[0067] According to the heat dissipation calculation model, the initial size and number of the boss and extension of the liquid cooling assembly that meet the condition of 0.9Q4≥Q3 are obtained, and the initial structure of the liquid cooling assembly is obtained;

[0068] Import the initial wireless bundle BDU structure model into the simulation software, perform initial settings, mesh division, and solve, and output the temperature of the high-voltage components of the component assembly, the temperature difference of the busbar assembly, insulation film, and thermal pad, the flow resistance of the internal flow channel of the liquid cooling assembly, and the simulated temperature cloud map, simulated velocity section cloud map, and simulated pressure section cloud map;

[0069] Based on the required heat dissipation of the liquid cooling component and the radius and number of the boss and extension parts, the temperature difference of the liquid cooling component is calculated and expressed as:

[0070]

[0071] Where DT1 is the temperature difference of the liquid cooling component, L is the heat transfer path, and k is the thermal conductivity;

[0072] Based on the temperature difference of the liquid cooling assembly, the temperature of the high-voltage devices in the component assembly, the temperature difference of the busbar assembly, the insulation film, the thermal pad, the flow resistance of the internal flow channel of the liquid cooling assembly, and the simulated temperature cloud map, simulated velocity section cloud map, and simulated pressure section cloud map, the conditions for satisfying the optimal liquid cooling assembly structure are preset;

[0073] The conditions for meeting this requirement are: the sum of the temperature difference of the liquid cooling assembly, the temperature difference of the busbar assembly, the insulation film, the thermal pad, and the temperature of the heat exchange medium is greater than or equal to the temperature of the high-voltage device of the component assembly, and the uniformity of the temperature of the liquid cooling assembly, the uniformity of the flow velocity of the heat exchange medium, and the uniformity of the pressure distribution of the heat exchange medium are determined based on the flow resistance of the internal flow channel of the liquid cooling assembly and the simulated temperature cloud map, simulated velocity section cloud map, and simulated pressure section cloud map.

[0074] If all conditions are met, the current optimal solution is output to obtain the final liquid cooling component structure;

[0075] If not, a parametric iterative simulation is performed on the radius and number of the boss and extension, and the radius and number parameters of the boss and extension that meet the conditions are output as the optimal solution to obtain the final liquid cooling component structure.

[0076] The wireless bundle BDU structure and heat dissipation simulation method of the present invention have the following advantages over the prior art:

[0077] (1) The busbar assembly is fixed in the shell through the injection molding process, which not only realizes the electrical connection between the high-voltage devices, but also enhances the stability and reliability of the structure. At the same time, it ensures the insulation between the busbars, improves the safety of the BDU, and adopts the high-voltage sampling and low-voltage control of the conductive components and PCB acquisition circuit board integrated components to realize the wireless beam layout and improve the space utilization. The liquid cooling component is in close contact with the surface of the busbar component, and the heat exchange medium effectively absorbs and takes away the heat, achieving an efficient heat dissipation effect. Therefore, the wireless beam BDU structure reduces the safety risks caused by overheating or electrical failure based on the reliable wireless beam electrical connection and efficient heat dissipation design, and improves the reliability and stability of the BDU;

[0078] (2) By directly injecting the busbar onto the bottom surface of the shell, the space occupied inside the shell is reduced, making the entire BDU more compact and facilitating heat dissipation. This allows the heat on the busbar to be more effectively transferred to the environment, lowering the temperature inside the BDU. At the same time, the flat bottom surface design facilitates the installation of subsequent liquid cooling components.

[0079] (3) By expanding the external expansion pipe, the contact area between the coolant and the liquid cooling component is increased, which helps to improve the cooling efficiency. The inlet of the external expansion pipe is designed to be inclined at an angle consistent with the direction of the flow channel, which can reduce the flow resistance of the coolant in the flow channel and enable the coolant to enter the liquid cooling component more smoothly. The contact area between the heat exchange medium inside the water cooling plate and the high temperature zone is increased by setting the boss and extension part, thereby achieving a better cooling effect.

[0080] (4) By calculating the heat dissipation requirements, optimizing the liquid cooling component structure, comprehensively evaluating the heat dissipation performance, and adjusting the radius and number of the bosses, the heat dissipation requirements can be met and the optimal structure can be achieved, thereby ensuring the stability and safety of the BDU structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0082] Figure 1 A perspective view of the internal structure of the housing of the wireless bundle BDU structure of the present invention;

[0083] Figure 2 A three-dimensional diagram of the components and housing structure of the wireless bundle BDU structure of the present invention;

[0084] Figure 3 A top view of the housing of the wireless bundle BDU structure of the present invention;

[0085] Figure 4 A three-dimensional diagram of the component assembly and busbar assembly structure of the wireless bundle BDU structure of the present invention;

[0086] Figure 5 A perspective view of the housing of the wireless bundle BDU structure of the present invention;

[0087] Figure 6 This is an exploded view of the liquid cooling component of the wireless bundle BDU structure of the present invention;

[0088] Figure 7 This is a circuit schematic diagram of the wireless bundle BDU structure of the present invention;

[0089] Figure 8 This is a circuit diagram of the filter module of the wireless bundle BDU structure of the present invention. DETAILED DESCRIPTION

[0090] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0091] First, as Figure 1-7 As shown, the present invention provides a wireless bundle BDU structure, including a shell 1, a component assembly 2, a busbar assembly 3, a PCB acquisition circuit board 4, a conductive assembly 5 and a liquid cooling assembly 6, wherein the shell 1 is hollow inside, with one side closed and the other side having an opening; the component assembly 2 is arranged in the shell 1, and is used to control the opening and closing of the battery circuit; the busbar assembly 3 is injection-molded in the shell 1, and is used to connect and conduct between the high-voltage devices of the component assembly 2; the PCB acquisition circuit board 4 is arranged in the shell 1, and is close to the side of the opening of the shell 1, and is spaced apart from the component assembly 2, and is used to collect and transmit signals of each high-voltage device of the component assembly 2; the conductive assembly 5 is arranged between the component assembly 2 and the busbar assembly 3 and the PCB acquisition circuit board 4, and is used to connect and conduct between each acquisition point on the busbar assembly 3 and the contacts of each high-voltage device of the component assembly 2 and the PCB acquisition circuit board 4; the liquid cooling assembly 6 is arranged on the closed side of the shell 1, and is in contact with the surface of the busbar assembly 3, and a heat exchange medium flows in the liquid cooling assembly 6 for cooling and heat dissipation.

[0092] At present, in the traditional BDU structure, a large number of cables and connectors not only increase the complexity and weight of the system, but may also cause instability and reliability problems in signal transmission. In this embodiment, the busbar component 3 is fixed in the shell 1 through the injection molding process, which not only realizes the electrical connection between the high-voltage devices, but also enhances the stability and reliability of the structure. At the same time, it ensures the insulation between the busbars, improves the safety of the BDU, and adopts the conductive component 5 and the PCB acquisition circuit board 4 to integrate the high-voltage sampling and low-voltage control of the component component 2, realizing a wireless beam layout and saving a lot of space inside the BDU. Moreover, the liquid cooling component 6 is in close contact with the surface of the busbar component 3 through the internal flowing heat exchange medium to effectively absorb and take away heat, thereby achieving an efficient heat dissipation effect. Therefore, the wireless beam BDU structure reduces the safety risks caused by overheating or electrical failure based on reliable wireless beam electrical connection and efficient heat dissipation design, and improves the reliability and stability of the BDU.

[0093] The component assembly 2 in this embodiment includes a main positive relay 21, a pre-charge relay 22, a main negative relay 23, a fast charge relay 24, a main fuse 25, a pre-charge resistor 26, a shunt 27 and a branch fuse 28, wherein the main positive relay 21, the pre-charge relay 22, the main negative relay 23, the fast charge relay 24, the main fuse 25, the pre-charge resistor 26, the shunt 27 and the branch fuse 28 are all arranged in the shell 1; the main fuse 25 is arranged near one side edge of the shell 1, and the main fuse 25 is parallel to the longitudinal horizontal direction of the shell 1; the main positive relay 21, the pre-charge resistor 26 and the branch fuse 28 are all arranged on the side of the main fuse 25 away from the edge of the shell 1, and the main positive relay 21 is located between the pre-charge resistor 26 and the branch fuse 28, and the main positive relay 21, the pre-charge resistor 26 and the branch fuse 28 are arranged The arrangement directions of the charging resistor 26 and the branch fuse 28 are both perpendicular to the main fuse 25; the pre-charging relay 22 and the fast-charging relay 24 are both located on the side of the main positive relay 21 away from the main fuse 25, and the pre-charging relay 22 is arranged corresponding to the position of the main positive relay 21, and the fast-charging relay 24 is arranged corresponding to the position of the pre-charging resistor 7, and the arrangement directions of the pre-charging relay 22 and the fast-charging relay 24 are both perpendicular to the main fuse 25; the main negative relay 23 is located on the side of the pre-charging relay 22 away from the main positive relay 21, and the main negative relay 23 is arranged corresponding to the position of the pre-charging relay 22, and the arrangement direction of the main negative relay 23 is perpendicular to the main fuse 25; the shunt 27 is located on the side of the main negative relay 23 away from the pre-charging relay 22, and is arranged near the other side edge of the shell 1.

[0094] It should be noted that the main positive relay 21 is responsible for connecting and disconnecting the positive pole of the battery pack with the main circuit. The pre-charging relay 22 pre-charges the battery pack through the pre-charging resistor 26 before the battery pack is connected to the main circuit to protect the battery pack and the main circuit from large current shocks. The main negative relay 23 is responsible for connecting and disconnecting the negative pole of the battery pack with the main circuit, and works in conjunction with the main positive relay 21. The fast charging relay 24 is used to control the on and off of the fast charging circuit to realize the fast charging function of the battery pack. The main fuse 25 serves as an overcurrent protection device. When the current exceeds the set value, the main fuse 25 will melt, cut off the circuit, and protect the battery pack and other components from damage; the pre-charging resistor 26 limits the current in the pre-charging stage to prevent the battery pack and the main circuit from being subjected to excessive shocks. The shunt 27 is used to measure the current of the battery pack and is usually used in conjunction with a current sensor to provide accurate current data for use by the monitoring and protection system. The branch fuse 28 provides overcurrent protection for one or some branches of the battery pack to ensure the safe operation of the branch.

[0095] Furthermore, through a reasonable layout design, component assembly 2 achieves effective connection and isolation between components, thereby improving the reliability and stability of the circuit. It also facilitates heat dissipation, maintenance, and connection with external systems, helping to improve the overall performance of the BDU and ensure the safe and efficient operation of the battery system.

[0096] The busbar assembly 3 in this embodiment includes a first busbar 31, a second busbar 32, a third busbar 33, a fourth busbar 34, a fifth busbar 35, a sixth busbar 36, a seventh busbar 37 and an eighth busbar 38, wherein one end of the first busbar 31 is fixedly connected to the input end of the main fuse 25 as the input end of the main positive circuit, and the other end of the first busbar 31 passes through and extends to the bottom of the shell 1; one end of the second busbar 32 is fixedly connected to the output end of the main fuse 25, and the other end of the second busbar 32 is fixedly connected to one end of the contact of the main positive relay 21; the third busbar 33 is fixedly connected to the other end of the contact of the main positive relay 21 and one end of the contact of the fast charging relay 24, respectively, and the third busbar 33 has three connections. End; the first connection end of the third busbar 33 passes through and extends into the shell 1, and is arranged near the edge, the first connection end of the third busbar 33 serves as the positive output end of the front drive circuit; the second connection end of the third busbar 33 passes through and extends into the shell 1, and is arranged on both sides of the shell 1 with the first connection end of the third busbar 33, and is arranged opposite to each other, the second connection end of the third busbar 33 serves as the positive output end of the rear drive circuit; the third connection end of the third busbar 33 passes through and extends into the shell 1, and is located on the same side as the first connection end of the third busbar 33 and is arranged adjacent to the third connection end of the third busbar 33, the third connection end of the third busbar 33 is fixedly connected to one end of the branch fuse 28; one end of the fourth busbar 34 is fixedly connected to the other end of the branch fuse 28, the fourth busbar The other end of 34 serves as the positive output end of the IPS control loop; the fifth busbar 35 is fixedly connected to the other end of the contact of the fast charging relay 24, and the fifth busbar 35 has a connection end, the connection end of the fifth busbar 35 passes through and extends into the shell 1, and is arranged adjacent to the first connection end of the third busbar 33 on the same side, and the connection end of the fifth busbar 35 serves as the positive output end of the fast charging loop; the sixth busbar 36 is arranged in the shell 1, one end of the sixth busbar 36 is fixedly connected to the input end of the shunt 27, and the other end serves as the input end of the main negative loop; one end of the seventh busbar 37 is fixedly connected to the output end of the shunt 27, and the other end passes through and extends to the bottom of the shell 1 and is fixedly connected to one end of the contact of the main negative relay 23; The eighth busbar 38 is fixedly connected to the other end of the contact of the main negative relay 23. The eighth busbar 38 has four connection ends. The connection ends of the eighth busbar 38 pass through and extend into the shell 1. The first connection end and the second connection end of the eighth busbar 38 are on the same side and adjacent to the second connection end of the third busbar 33. The first connection end of the eighth busbar 38 serves as the negative output end of the IPS control loop, and the second connection end of the eighth busbar 38 serves as the negative output end of the rear drive loop. The third connection end and the fourth connection end of the eighth busbar 38 are on the same side and adjacent to the first connection end of the third busbar 33. The third connection end of the eighth busbar 38 serves as the negative output end of the fast charging loop, and the fourth connection end of the eighth busbar 38 serves as the negative output end of the front drive loop.

[0097] It should be noted that the busbars in the busbar assembly 3 effectively connect the main fuse 25, the main positive relay 21, the fast charging relay 24, the branch fuse 28, the shunt 27 and the main negative relay 23 through precise connection points to form a complete electrical circuit. The layout of the busbar assembly 3 fully considers the space limitations inside the shell 1, so that each busbar can not only meet the electrical connection requirements, but also minimize the space occupancy, thereby improving the overall integration and reliability of the BDU. The busbars in the busbar assembly 3 are tightly combined with the shell 1 through injection molding and other processes to form a solid protective layer, which effectively prevents external interference and short-circuit risks. At the same time, the setting of the main fuse 25 and the branch fuse 28 provides dual overcurrent protection for the circuit, further improving the safety of the BDU.

[0098] In this embodiment, the first busbar 31 , the second busbar 32 , the third busbar 33 , the fifth busbar 35 , the seventh busbar 37 and the eighth busbar 38 are all injection-molded on the bottom surface of the housing 1 and are at the same plane height as the bottom surface of the housing 1 .

[0099] It should be noted that by directly injecting the busbar on the bottom surface of the shell 1, the space occupied inside the shell 1 is reduced, the need for additional mounting brackets or fixings is reduced, space is saved, and the entire BDU is more compact. At the same time, the overall stability of the structure is enhanced, ensuring a firm connection between the busbar and the shell 1, and reducing the risk of loosening or damage due to vibration or impact. Placing the busbar on the bottom surface of the shell helps to dissipate heat. The bottom surface is usually more easily in contact with the outside air, so the heat on the busbar can be more effectively transferred to the environment, reducing the temperature inside the BDU. In addition, the flat bottom surface design also facilitates the installation of the liquid cooling component 6.

[0100] The conducting component 5 in this embodiment includes a number of inserts 51 and wire posts 52, wherein the contact ends of the main positive relay 21, the main negative relay 23 and the fast charging relay 24 are all in the shell 1, and the coil ends are all on the opening side of the shell 1; the contact end and the coil end of the pre-charging relay 22 are both on the opening side of the shell 1; the number of wire posts 52 are respectively fixed on the second busbar 32, the third busbar 33, the fifth busbar 35, the sixth busbar 36, the seventh busbar 37 and the eighth busbar 38, and one end of the number of wire posts 52 passes through and extends into the shell 1; the number of inserts 51 are respectively fixed on the contact ends of the main positive relay 21, the main negative relay 23 and the fast charging relay 24 and the contact ends and coil ends of the pre-charging relay 22 and one end of each wire post 52 extending out of the shell 1, and the other ends of the number of inserts 51 are all plugged into the corresponding ports of the PCB acquisition circuit board 4; the two ends of the pre-charging resistor 26 are plugged into the corresponding ports of the PCB acquisition circuit board 4.

[0101] It should be noted that the plug 51 is a metal sheet with conductive function. The provision of the plug 51 and the wire post 52 realizes a reliable electrical connection between the relay contacts, the busbar and the PCB acquisition circuit board 4, and effectively utilizes the space inside the shell, making the entire BDU more compact.

[0102] This embodiment also includes an insulating film 7 and a thermal pad 8, wherein the insulating film 7 is arranged on the bottom surface of the shell 1 and abuts against the surfaces of the first busbar 31, the second busbar 32, the third busbar 33, the fifth busbar 35, the seventh busbar 37 and the eighth busbar 38, and the thermal pad 8 is arranged on the side of the insulating film 7 away from the shell 1, and is used to conduct heat dissipated by the busbar to the liquid cooling component 6.

[0103] It should be noted that the sizes of the insulating film 7 and the thermal pad 8 are the same as the sizes of the bottom of the shell 1. The insulating film 7 and the thermal pad 8 are laid flat in sequence. The insulating film 7 insulates the busbar assembly 3 to prevent short circuit or leakage between the busbar assembly 3 and the shell 1. The function of the thermal pad 8 is to effectively introduce the heat generated by the busbar assembly 3 during the conduction process to the liquid cooling assembly 6, and take away the heat through the heat exchange medium circulation of the liquid cooling assembly 6, thereby maintaining the stable operation of the electrical system.

[0104] The liquid cooling assembly 6 in this embodiment includes an upper cover 61, a bottom shell 62, two outward expansion pipes 63, a plurality of bosses 65 and a plurality of extensions 66, wherein one side of the upper cover 61 is fixedly connected to the thermal pad 8, and the other side is fixedly connected to the bottom shell 62; a first flow channel 600 and a second flow channel 610 that are not connected to each other are provided in the bottom shell 62, and the liquid inlet side and the liquid outlet side of the first flow channel 600 and the second flow channel 610 are both connected, and the shape of the first flow channel 600 and the second flow channel 610 are both U-shaped; the two outward expansion pipes 63 are fixed on the side of the upper cover 61 close to the thermal pad 8, and are connected to the inside of the bottom shell 62 and are arranged adjacent to each other, and the two outward expansion pipes 63 are respectively located in the first flow channel 600 and the second flow channel 610 the connecting part of the liquid inlet end side and the liquid outlet end side; one side of the outward expansion pipe 63 is arranged at an inclined surface with the upper cover 61, and the inclination direction of the inclined surface is consistent with the flow direction of the fluid, which is used to reduce the flow resistance of the flow channel; a number of bosses 65 are respectively arranged at the connecting parts of the liquid inlet end side and the liquid outlet end side of the first flow channel 600 and the second flow channel 610, and the positions of the bosses 65 correspond to the positions of the first busbar 31 and the second busbar 32; a number of extensions 66 are respectively arranged on both sides of the inner wall of the first flow channel 600 and the second flow channel 610, one side of the extension 66 is arranged to extend obliquely toward the inside of the flow channel, and the extensions 66 on both sides are evenly staggered and arranged corresponding to the positions of the third busbar 33, the fifth busbar 35, the seventh busbar 37 and the eighth busbar 38.

[0105] It should be noted that the two outward expansion pipes 63 serve as the water inlet and outlet of the liquid cooling component 61. The outward expansion pipes 63 are enlarged to increase the contact area between the coolant and the liquid cooling component, which helps to improve the cooling efficiency. The inlet of the outward expansion pipe 63 is designed to be inclined at an angle consistent with the direction of the flow channel, which can reduce the flow resistance of the coolant in the flow channel and enable the coolant to enter the liquid cooling component more smoothly. Two unconnected flow channels are provided in the bottom shell 62, which can be used to cool different busbars or areas respectively, thereby improving the targetedness and efficiency of cooling. The first flow channel 600 and the second flow channel 610 are both U-shaped, which is conducive to the uniform distribution and flow of the coolant and improves the heat exchange efficiency. The contact area between the heat exchange medium inside the water cooling plate and the high temperature zone is increased by providing a number of bosses 65, thereby achieving a better cooling effect. The contact area between the heat exchange medium inside the bottom shell 62 and another high temperature zone is increased by providing a number of extensions 66, thereby achieving a better cooling effect. The inclined extension 66 can reduce the backflow of the internal heat exchange medium, thereby enabling the coolant to flow more efficiently and improving the cooling efficiency.

[0106] In a second aspect, the present invention further provides a heat dissipation simulation method for a wireless bundle BDU structure, which is implemented using a wireless bundle BDU structure. The method comprises the following steps:

[0107] S1, modeling the wireless bundle BDU structure in the modeling software;

[0108] It should be noted that when using SolidWorks or AutoCAD to perform three-dimensional modeling of the wireless bundle BDU structure, the modeling process should take into account the internal layout of the BDU, the position and shape of the component assembly 2 and the busbar assembly 3, and the preliminary design of the liquid cooling assembly 6.

[0109] S2, obtaining the total power, thermal radiation and thermal convection heat dissipation power of all heat-generating components within the wireless bundle BDU structure, and calculating the required heat dissipation capacity of the liquid cooling component 6 based on the total power, thermal radiation and thermal convection heat dissipation power of the heat-generating components;

[0110] Specifically, step S2 includes the following steps:

[0111] Obtain the internal resistance of all heating devices inside the wireless bundle BDU structure and calculate the total power of all heating devices. All heating devices inside the wireless bundle BDU structure include the high-voltage devices of component assembly 2 and the busbars of busbar assembly 3. The calculation expression is:

[0112] P1=I 2 R

[0113] Where, P1 is the total power of all heating devices inside the wireless bundle BDU structure, I is the current value passing through the BDU, and R is the sum of the internal resistances of the first busbar 31, the second busbar 32, the third busbar 33, the fourth busbar 34, the fifth busbar 35, the sixth busbar 36, the seventh busbar 37, the eighth busbar 38, the main positive relay 21, the pre-charge relay 22, the main negative relay 23, the fast charge relay 24, the main fuse 25, the pre-charge resistor 26, the shunt 27, and the branch fuse 28;

[0114] Calculate the heat radiation dissipation power of all heat-generating components inside the wireless bundle BDU structure. The expression is:

[0115] Q1=εAσT 4

[0116] Where Q1 is the heat radiation power of all devices inside the wireless bundle BDU structure, ε is the emissivity, A is the heat dissipation area, σ is the Stefan-Boltzmann constant, and T is the temperature difference between the wireless bundle BDU structure and the environment;

[0117] Calculate the heat dissipation power of all heat-generating components inside the wireless bundle BDU structure using the following expression:

[0118] Q2=AhΔT1

[0119] Where Q2 is the heat dissipation power of all devices inside the wireless bundle BDU structure, A is the heat dissipation area, h is the surface heat transfer coefficient, and ΔT1 is the temperature difference between the heating device and the air;

[0120] According to the total power, heat radiation and heat convection heat dissipation power of the heating device, the required heat dissipation of the liquid cooling component 6 is calculated, and the expression is:

[0121] Q3=P1-Q1-Q2

[0122] Wherein, Q3 is the required heat dissipation of the liquid cooling component 6.

[0123] It should be noted that the detailed parameters of the heating device, including the total power, thermal radiation coefficient, and thermal convection coefficient, are collected, and the heat that the component assembly 2 and the busbar assembly 3 can dissipate through thermal radiation and thermal convection is simulated and calculated. The heat that can be dissipated through thermal radiation and thermal convection is subtracted from the total heat output to obtain the heat dissipation that the liquid cooling assembly 6 needs to bear.

[0124] S3, constructing a heat dissipation calculation model according to the internal structure of the liquid cooling component 6, performing thermal simulation calculation on the structure of the liquid cooling component 6, and adjusting the internal structure of the liquid cooling component 6 according to the heat dissipation calculation model to obtain the optimal structure of the liquid cooling component 6.

[0125] Specifically, step S3 includes the following steps:

[0126] According to the internal structure of the liquid cooling component 6, a heat dissipation calculation model is constructed, and the expression is:

[0127]

[0128] Where Q4 is the estimated heat dissipation of the liquid cooling assembly 6, q1 is the water inlet flow rate, m is the mass of the heat exchange medium, V1 is the preset volume of the cavity between the upper cover 61 and the bottom shell 62, r is the radius of the boss portion 65 and the extension portion 66; h1 is the height of the boss portion 65 and the extension portion 66; n is the total number of boss portions 65 and extension portions 66, and ΔT2 is the temperature difference between the two expansion pipes 63;

[0129] According to the heat dissipation calculation model, the initial size and number of the boss portion 65 and the extension portion 66 of the liquid cooling assembly 6 are obtained under the condition of 0.9Q4≥Q3, and the initial structure of the liquid cooling assembly 6 is obtained;

[0130] Import the initial wireless bundle BDU structure model into the simulation software, perform initial settings, mesh division, and solve, and output the temperature of the high-voltage device in component assembly 2, the temperature difference between the busbar assembly 3, the insulation film 7, and the thermal pad 8, the flow resistance of the internal flow channel of the liquid cooling assembly 6, and the simulated temperature cloud map, simulated velocity section cloud map, and simulated pressure section cloud map;

[0131] According to the required heat dissipation of the liquid cooling assembly 6, the radius and number of the boss portion 65 and the extension portion 66, the temperature difference of the liquid cooling assembly 6 is calculated and expressed as:

[0132]

[0133] Where DT1 is the temperature difference of the liquid cooling component 6, L is the heat transfer path, and k is the thermal conductivity;

[0134] Based on the temperature difference of the liquid cooling assembly 6, the temperature of the high-voltage components of the component assembly 2, the temperature difference between the busbar assembly 3, the insulating film 7, and the thermal pad 8, the flow resistance of the internal flow channel of the liquid cooling assembly 6, and the simulated temperature cloud map, simulated velocity section cloud map, and simulated pressure section cloud map, the conditions for satisfying the optimal structure of the liquid cooling assembly 6 are preset;

[0135] The conditions are as follows: the sum of the temperature difference of the liquid cooling assembly 6, the temperature difference of the busbar assembly 3, the insulating film 7, the thermal pad 8, and the temperature of the heat exchange medium is greater than or equal to the temperature of the high-voltage device of the component assembly 2, and the temperature of the liquid cooling assembly 6, the flow resistance of the internal flow channel, the simulated temperature cloud map, the simulated velocity section cloud map, and the simulated pressure section cloud map are used to determine whether the temperature of the liquid cooling assembly 6 is uniform, the flow rate of the heat exchange medium is uniform, and the pressure distribution of the heat exchange medium is uniform;

[0136] If all conditions are met, the current optimal solution is output to obtain the final liquid cooling component 6 structure;

[0137] If not, a parametric iterative simulation is performed on the radius and number of the boss portion 65 and the extension portion 66, and the radius and number parameters of the boss portion 65 and the extension portion 66 that meet the conditions are output as the optimal solution to obtain the final liquid cooling component 6 structure.

[0138] It should be noted that by obtaining the total power, thermal radiation, and convection heat dissipation power of all heat-generating components within the wireless bundle BDU structure, this method can accurately calculate the required heat dissipation Q3 of the liquid-cooled assembly 6. This ensures that the design of the liquid-cooled system is based on accurate thermal load requirements, avoiding excessive or insufficient design. Based on the internal structure of the liquid-cooled assembly 6, a heat dissipation calculation model was constructed to estimate the heat dissipation Q4. Through simulation calculations and adjustments, the initial size and number of the bosses 65 and extensions 66 were determined, thus obtaining the initial structure of the liquid-cooled assembly 6. Through parametric iterative simulation, the radius and number of the bosses 65 and extensions 66 were further optimized to meet the heat dissipation requirements and achieve the optimal structure. This ensures that the liquid-cooled assembly 6 has efficient heat dissipation performance while maintaining structural compactness and reliability.

[0139] After the simulation calculation is completed, the temperature of the high-voltage device in the component assembly 2, the temperature difference of the busbar assembly 3, the insulating film 7, and the thermal pad 8, as well as the flow resistance of the internal flow channel of the liquid-cooling assembly 6, the simulated temperature cloud map, the simulated velocity section cloud map, and the simulated pressure section cloud map are output. This data provides a comprehensive evaluation of the overall heat dissipation performance of the BDU, including key indicators such as temperature distribution, flow velocity distribution, and pressure distribution. By judging the relationship between the temperature difference of the liquid-cooling assembly 6, the temperature difference of other components, and the temperature of the heat exchange medium, as well as the uniformity of the temperature, velocity, and pressure distribution of the internal flow channel of the liquid-cooling assembly 6, the stability and safety of the BDU system are ensured, and system failure or safety hazards caused by overheating or uneven temperature distribution are avoided.

[0140] like Figure 8 As shown, this embodiment also includes a filtering module, and the positive output end of the fast charging circuit and the negative output end of the fast charging circuit are electrically connected to the positive and negative input ends of the filtering module respectively, so as to simultaneously filter out common-mode and differential-mode interference.

[0141] The filtering module in this embodiment includes a relay K3, a first X capacitor, a first Y capacitor, a first magnetic ring, a second X capacitor, a second Y capacitor, a second magnetic ring, discharge resistors R1, R2, R3, R4, capacitors C1, C2, C3, C4, C5, C6, and a relay K2, wherein the positive output end of the fast charging circuit is electrically connected to one end of the contact of the relay K3, the other end of the contact of the relay K3 is electrically connected to one end of the first X capacitor, one end of the first Y capacitor and the first end of the first magnetic ring respectively, the negative output end of the fast charging circuit is electrically connected to the other end of the first X capacitor and the first Y capacitor and the second end of the first magnetic ring respectively, the first magnetic ring is electrically connected to the second end of the first magnetic ring. The third end of the ring is electrically connected to one end of the second X capacitor, one end of the second Y capacitor, and the first end of the second magnetic ring, respectively. The fourth end of the first magnetic ring is electrically connected to the other ends of the second X capacitor and the second Y capacitor, and the second end of the second magnetic ring, respectively. The third end of the second magnetic ring is electrically connected to the discharge resistor R1, one end of the capacitors C1, C2, C3, C4, C5, and C6, and one end of the contact of the relay K2, respectively. The discharge resistors R1, R2, R3, and R4 are electrically connected at both ends. The fourth end of the second magnetic ring is electrically connected to the other end of the discharge resistor R4 and the other ends of the capacitors C1, C2, C3, C4, C5, and C6, respectively.

[0142] It should be noted that the first X capacitor, the first Y capacitor and the first magnetic ring work together to perform preliminary filtering of common-mode and differential-mode interference. The second X capacitor, the second Y capacitor and the second magnetic ring perform further filtering. The third end of the second magnetic ring is also connected to a discharge circuit composed of discharge resistors R1, R2, R3, and R4, and a filtering network composed of capacitors C1 to C6. These components work together to eliminate residual interference signals, thereby effectively suppressing interference signals in the fast charging circuit and providing a strong guarantee for the stable operation of the electrical system.

[0143] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wireless bundle BDU structure, characterized in that: It comprises a housing (1), a component assembly (2), a busbar assembly (3), a PCB collection circuit board (4), a conduction assembly (5) and a liquid cooling assembly (6), wherein: The shell (1) is hollow inside, with one side being closed and the other side being provided with an opening; The component assembly (2) is arranged in the housing (1) and is used to control the opening and closing of the battery circuit; The busbar assembly (3) is injection-molded in the housing (1) and is used to connect and conduct the high-voltage devices of the component assembly (2); The busbar assembly (3) includes a first busbar (31), a second busbar (32), a third busbar (33), a fourth busbar (34), a fifth busbar (35), a sixth busbar (36), a seventh busbar (37) and an eighth busbar (38); The PCB acquisition circuit board (4) is arranged in the housing (1) and close to one side of the opening of the housing (1), and is spaced apart from the component assembly (2), and is used to collect and transmit signals of various high-voltage devices of the component assembly (2); The conducting component (5) is arranged between the component component (2) and the busbar component (3) and the PCB acquisition circuit board (4), and is used to connect and conduct the various acquisition points on the busbar component (3) and the contacts of the various high-voltage devices of the component component (2) with the PCB acquisition circuit board (4); The liquid cooling component (6) is arranged on the closed side of the shell (1) and is in contact with the surface of the busbar component (3). A heat exchange medium flows in the liquid cooling component (6) for cooling and heat dissipation. It also includes an insulating film (7) and a thermal pad (8), wherein the insulating film (7) is arranged on the bottom surface of the shell (1), and the thermal pad (8) is arranged on the side of the insulating film (10) away from the shell (1), and is used to introduce heat dissipated by the busbar to the liquid cooling component (6), and the insulating film (7) is in contact with the surfaces of the first busbar (31), the second busbar (32), the third busbar (33), the fifth busbar (35), the seventh busbar (37) and the eighth busbar (38); The liquid cooling assembly (6) comprises an upper cover (61), a bottom shell (62), two outward expansion pipes (63), a plurality of boss portions (65) and a plurality of extension portions (66), wherein: One side of the upper cover (61) is fixedly connected to the thermal pad (8), and the other side is fixedly connected to the bottom shell (62); A first flow channel (600) and a second flow channel (610) that are not connected to each other are provided in the bottom shell (62); the liquid inlet side and the liquid outlet side of the first flow channel (600) and the second flow channel (610) are both connected, and the first flow channel (600) and the second flow channel (610) are both U-shaped; The two outward expansion pipes (63) are both fixed on one side of the upper cover (61) close to the thermal pad (8), and are connected to the interior of the bottom shell (62). The two outward expansion pipes (63) are respectively located at the connecting points of the liquid inlet end side and the liquid outlet end side of the first flow channel (600) and the second flow channel (610); One side of the outward expansion pipe (63) and the upper cover (61) are arranged in an inclined plane, and the inclination direction of the inclined plane is consistent with the flow direction of the fluid, so as to reduce the flow resistance of the flow channel; A plurality of bosses (65) are respectively arranged at the connecting portions of the liquid inlet end side and the liquid outlet end side of the first flow channel (600) and the second flow channel (610), and the positions of the bosses (65) correspond to the positions of the first busbar (31) and the second busbar (32); A plurality of extension portions (66) are arranged on both sides of the inner wall of the first flow channel (600) and the second flow channel (610), one side of the extension portion (66) is arranged to extend obliquely toward the inside of the flow channel, and the extension portions (66) on both sides are evenly staggered, and the plurality of extension portions (66) are arranged corresponding to the positions of the third busbar (33), the fifth busbar (35), the seventh busbar (37) and the eighth busbar (38).

2. The wireless bundle BDU structure according to claim 1, wherein: The component assembly (2) includes a main positive relay (21), a pre-charge relay (22), a main negative relay (23), a fast charge relay (24), a main fuse (25), a pre-charge resistor (26), a shunt (27) and a branch fuse (28), wherein: The main positive relay (21), the pre-charge relay (22), the main negative relay (23), the fast charge relay (24), the main fuse (25), the pre-charge resistor (26), the shunt (27) and the branch fuse (28) are all arranged in the housing (1); The main fuse (25) is arranged near one side edge of the housing (1), and the main fuse (25) is parallel to the longitudinal horizontal direction of the housing (1); The main positive relay (21), the pre-charging resistor (26) and the branch fuse (28) are all located on a side of the main fuse (25) away from the edge of the housing (1), and the main positive relay (21) is located between the pre-charging resistor (26) and the branch fuse (28), and the arrangement directions of the main positive relay (21), the pre-charging resistor (26) and the branch fuse (28) are all perpendicular to the main fuse (25); The pre-charge relay (22) and the fast charge relay (24) are both located on a side of the main positive relay (21) away from the main fuse (25), and the pre-charge relay (22) is arranged correspondingly to the position of the main positive relay (21), and the fast charge relay (24) is arranged correspondingly to the position of the pre-charge resistor (7), and the arrangement direction of the pre-charge relay (22) and the fast charge relay (24) are both perpendicular to the main fuse (25); The main negative relay (23) is located on a side of the pre-charge relay (22) away from the main positive relay (21), and the main negative relay (23) is arranged corresponding to the position of the pre-charge relay (22), and the arrangement direction of the main negative relay (23) is perpendicular to the main fuse (25); The shunt (27) is located on one side of the main negative relay (23) away from the pre-charge relay (22) and is arranged close to the other side edge of the housing (1).

3. The wireless bundle BDU structure according to claim 2, wherein: One end of the first busbar (31) is fixedly connected to the input end of the main fuse (25) to serve as the input end of the main positive circuit, and the other end of the first busbar (31) passes through and extends to the bottom of the housing (1); One end of the second busbar (32) is fixedly connected to the output end of the main fuse (25), and the other end of the second busbar (32) is fixedly connected to one end of the contact of the main positive relay (21); The third busbar (33) is fixedly connected to the other end of the contact of the main positive relay (21) and one end of the contact of the fast charging relay (24), respectively, and the third busbar (33) has three connection ends; The first connection end of the third busbar (33) passes through and extends into the housing (1) and is arranged close to the edge. The first connection end of the third busbar (33) serves as the positive output end of the pre-drive circuit. The second connection end of the third busbar (33) passes through and extends into the housing (1), and is arranged on both sides of the housing (1) with the first connection end of the third busbar (33), and is arranged opposite to the first connection end of the third busbar (33). The second connection end of the third busbar (33) serves as the positive output end of the rear drive circuit. The third connection end of the third busbar (33) passes through and extends into the housing (1), and is located on the same side as and adjacent to the first connection end of the third busbar (33). The third connection end of the third busbar (33) is fixedly connected to one end of the branch fuse (28); One end of the fourth busbar (34) is fixedly connected to the other end of the branch fuse (28), and the other end of the fourth busbar (34) serves as the positive output end of the IPS control loop; The fifth busbar (35) is fixedly connected to the other end of the contact of the fast charging relay (24), and the fifth busbar (35) has a connection end, the connection end of the fifth busbar (35) passes through and extends into the housing (1), and is arranged adjacent to the first connection end of the third busbar (33) on the same side, and the connection end of the fifth busbar (35) serves as the positive output end of the fast charging circuit; The sixth busbar (36) is arranged in the housing (1), one end of the sixth busbar (36) is fixedly connected to the input end of the shunt (27), and the other end serves as the input end of the main negative circuit; One end of the seventh busbar (37) is fixedly connected to the output end of the shunt (27), and the other end passes through and extends to the bottom of the housing (1) and is fixedly connected to one end of the contact of the main negative relay (23); The eighth busbar (38) is fixedly connected to the other end of the contact of the main negative relay (23), and the eighth busbar (38) has four connection ends. The connection ends of the eighth busbar (38) pass through and extend into the shell (1). The first connection end and the second connection end of the eighth busbar (38) are on the same side and adjacent to the second connection end of the third busbar (33). The first connection end of the eighth busbar (38) serves as the negative output end of the IPS control loop, and the second connection end of the eighth busbar (38) serves as the negative output end of the rear drive loop. The third connection end and the fourth connection end of the eighth busbar (38) are on the same side and adjacent to the first connection end of the third busbar (33). The third connection end of the eighth busbar (38) serves as the negative output end of the fast charging loop, and the fourth connection end of the eighth busbar (38) serves as the negative output end of the front drive loop.

4. The wireless bundle BDU structure according to claim 3, wherein: The first busbar (31), the second busbar (32), the third busbar (33), the fifth busbar (35), the seventh busbar (37) and the eighth busbar (38) are all injection-molded on the bottom surface of the shell (1) and are at the same plane height as the bottom surface of the shell (1).

5. The wireless bundle BDU structure according to claim 3, wherein: The conducting assembly (5) comprises a plurality of inserts (51) and conductor posts (52), wherein: The contact ends of the main positive relay (21), the main negative relay (23) and the fast charging relay (24) are all located in the housing (1), and the coil ends are all located on the opening side of the housing (1); the contact end and the coil end of the pre-charging relay (22) are both located on the opening side of the housing (1); A plurality of conductor posts (52) are respectively fixed on the second busbar (32), the third busbar (33), the fifth busbar (35), the sixth busbar (36), the seventh busbar (37) and the eighth busbar (38), and one end of the plurality of conductor posts (52) passes through and extends into the housing (1); A plurality of inserts (51) are respectively fixed to the contact ends of the main positive relay (21), the main negative relay (23) and the fast charging relay (24), the contact end and the coil end of the pre-charging relay (22), and one end of each wire column (52) extending out of the housing (1), and the other ends of the plurality of inserts (51) are plugged into corresponding ports of the PCB acquisition circuit board (4); The two ends of the pre-charging resistor (26) are plugged into corresponding ports of the PCB acquisition circuit board (4).

6. A heat dissipation simulation method for a wireless bundle BDU structure, implemented using the wireless bundle BDU structure according to any one of claims 1 to 5, characterized in that: The method comprises the following steps: S1, modeling the wireless bundle BDU structure in the modeling software; S2, obtaining the total power, thermal radiation and thermal convection heat dissipation power of all the heating devices inside the wireless bundle BDU structure, and calculating the required heat dissipation of the liquid cooling component (6) based on the total power, thermal radiation and thermal convection heat dissipation power of the heating devices; S3, constructing a heat dissipation calculation model according to the internal structure of the liquid cooling component (6), performing thermal simulation calculation on the structure of the liquid cooling component (6), and adjusting the internal structure of the liquid cooling component (6) according to the heat dissipation calculation model to obtain the optimal structure of the liquid cooling component (6).

7. The heat dissipation simulation method of the wireless bundle BDU structure according to claim 6, characterized in that: Step S2 includes the following steps: Obtain the internal resistance of all heating devices inside the wireless bundle BDU structure and calculate the total power of all heating devices. All heating devices inside the wireless bundle BDU structure include the component assembly (2) each high-voltage device and the busbar assembly (3) each busbar. The calculation expression is: P1=I 2 R Wherein, P1 is the total power of all heating devices inside the wireless bundle BDU structure, I is the current value passing through the BDU, and R is the sum of the internal resistances of the first busbar (31), the second busbar (32), the third busbar (33), the fourth busbar (34), the fifth busbar (35), the sixth busbar (36), the seventh busbar (37), the eighth busbar (38), the main positive relay (21), the pre-charge relay (22), the main negative relay (23), the fast charge relay (24), the main fuse (25), the pre-charge resistor (26), the shunt (27) and the branch fuse (28); Calculate the heat radiation dissipation power of all heat-generating components inside the wireless bundle BDU structure. The expression is: Q1=eAσT 4 Where Q1 is the heat radiation power of all devices inside the wireless bundle BDU structure, ε is the emissivity, A is the heat dissipation area, σ is the Stefan-Boltzmann constant, and T is the temperature difference between the wireless bundle BDU structure and the environment; Calculate the heat dissipation power of all heat-generating components inside the wireless bundle BDU structure using the following expression: Q2=AhΔT1 Where Q2 is the heat dissipation power of all devices inside the wireless bundle BDU structure, A is the heat dissipation area, h is the surface heat transfer coefficient, and ΔT1 is the temperature difference between the heating device and the air; According to the total power, heat radiation and heat convection heat dissipation power of the heating device, the required heat dissipation of the liquid cooling component (6) is calculated as follows: Q3=P1-Q1-Q2 Where Q3 is the required heat dissipation of the liquid cooling component (6).

8. The heat dissipation simulation method of the wireless bundle BDU structure according to claim 7, characterized in that: Step S3 includes the following steps: According to the internal structure of the liquid cooling component (6), a heat dissipation calculation model is constructed, and the expression is: ； Wherein, Q4 is the estimated heat dissipation of the liquid cooling assembly (6), q1 is the water inlet flow rate, m is the mass of the heat exchange medium, V1 is the volume of the cavity between the preset upper cover (61) and the bottom shell (62), r is the radius of the boss portion (65) and the extension portion (66); h1 is the height of the boss portion (65) and the extension portion (66); n is the total number of the boss portion (65) and the extension portion (66), and ΔT2 is the temperature difference between the two expansion pipes (63); According to the heat dissipation calculation model, the initial size and number of the boss portion (65) and the extension portion (66) of the liquid cooling component (6) are obtained under the condition of 0.9Q4≥Q3, and the initial structure of the liquid cooling component (6) is obtained; Import the initial wireless bundle BDU structure model into the simulation software, perform initial settings, mesh division and solution, and output the temperature of the high-voltage device of the component assembly (2), the temperature difference of the busbar assembly (3), the insulation film (7), the thermal pad (8), the internal flow resistance of the liquid cooling assembly (6), and the simulated temperature cloud map, the simulated velocity section cloud map and the simulated pressure section cloud map; According to the required heat dissipation of the liquid cooling component (6) and the radius of the boss portion (65) and the extension portion (66), the temperature difference of the liquid cooling component (6) is calculated and expressed as: ； Where DT1 is the temperature difference of the liquid cooling component (6), L is the heat transfer path, and k is the thermal conductivity; According to the temperature difference of the liquid cooling assembly (6), the temperature of the high-voltage device of the component assembly (2), the temperature difference of the busbar assembly (3), the insulating film (7), the thermal pad (8), the flow resistance of the internal flow channel of the liquid cooling assembly (6), and the simulated temperature cloud map, the simulated velocity section cloud map, and the simulated pressure section cloud map, the conditions for satisfying the optimal structure of the liquid cooling assembly (6) are preset; The conditions are as follows: the sum of the temperature difference of the liquid cooling component (6), the temperature difference of the busbar component (3), the insulating film (7), the thermal pad (8) and the temperature of the heat exchange medium is greater than or equal to the temperature of the high-voltage device of the component assembly (2), and whether the temperature of the liquid cooling component (6) is uniform, whether the flow rate of the heat exchange medium is uniform and whether the pressure distribution of the heat exchange medium is uniform are determined based on the flow resistance of the internal flow channel of the liquid cooling component (6) and the simulated temperature cloud map, the simulated velocity section cloud map and the simulated pressure section cloud map; If all conditions are met, the current optimal solution is output to obtain the final liquid cooling component (6) structure; If the conditions are not met, a parametric iterative simulation is performed on the radius and number of the boss portion (65) and the extension portion (66), and the radius and number parameters of the boss portion (65) and the extension portion (66) that meet the conditions are output as the optimal solution to obtain the final liquid cooling component (6) structure.

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