An anti-displacement patch device for SMT patch machine and its use method

Abstract

The invention relates to the technical field of patch machines, and discloses an anti-displacement patch device for an SMT patch machine and a method for using the device, comprising a base and a conveyor, wherein the top of the base is fixedly connected to the bottom of the conveyor, and the top of the base is fixedly connected to a blocking cylinder, and an electric telescopic rod is started to retract the electric telescopic rod, so that a connecting plate is pulled down, and an air blocking rod is driven to descend, so that negative pressure is generated on the top of the connecting plate, and as the connecting plate continues to move, a convex plate will contact a seesaw plate, so that the seesaw plate rotates, thereby lifting up a fixed plate, driving a spring plate and a suction cup to rise, and as the suction cup continues to rise, the suction cup will contact the bottom of a circuit board, and slightly lift up the circuit board, and at this time, the air blocking rod will also separate from the suction cup, and negative pressure will enter the suction cup, and the suction cup will adsorb the bottom of the circuit board to fix the circuit board, and the circuit board will be fixed by the adsorption force, so that slight deformation of the circuit board is effectively prevented, which affects the position of the patch, thereby reducing the mounting error.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounter equipment, and in particular to an anti-displacement chip mounter device for an SMT chip mounter and a method for using the same. Background Art

[0002] The SMT placement machine is a device used in the electronics manufacturing industry. It is specifically used to accurately place surface mount components (such as resistors, capacitors, integrated circuits, etc.) on circuit boards. It is the most critical and complex equipment in the entire SMT production. The placement machine is the main equipment in the SMT production line.

[0003] Among them, during the operation of the SMT placement machine, the circuit board often needs to be fixed. The common fixing method is to use a clamping block to clamp the circuit board. The extrusion force applied by the clamping block may cause the circuit board to be slightly bent or deformed, which may cause the components to deviate during the placement process and affect the placement accuracy. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides an anti-displacement patch device for an SMT patch machine, comprising a base and a conveyor, wherein the top of the base is fixedly connected to the bottom of the conveyor, and a blocking cylinder is fixedly connected to the top of the base; The adsorption mechanism comprises an air pressure box fixedly connected to the top of the base, a sliding groove is provided on the inner wall of the air pressure box, two electric telescopic rods are fixedly connected to the bottom of the inner wall of the sliding groove, a connecting plate is slidably connected to the inner wall of the sliding groove, the top output ends of the two electric telescopic rods are fixedly connected to the bottom of the connecting plate, twelve air blocking rods are fixedly connected to the top of the connecting plate, a spring plate is slidably connected to the inner wall of the sliding groove, twelve suction cups are fixedly connected to the inner wall of the spring plate, the inner walls of the twelve suction cups are all slidably connected to the outer walls of the air blocking rods, and a downward pressing component is provided on the inner wall of the air pressure box; The lifting mechanism includes a seesaw plate rotatably connected to the inner wall of the sliding groove, a convex plate fixedly connected to the bottom of the connecting plate, a fixed plate fixedly connected to the bottom of the spring plate, and a pushing component is arranged on the outer wall of the air pressure box. The conveyor is started to convey the circuit board to be mounted until the circuit board contacts the blocking cylinder and is blocked by the blocking cylinder. Then the electric telescopic rod is started to retract the electric telescopic rod, pull the connecting plate down, and drive the air blocking rod to descend. At this time, since the air blocking rod is located inside the suction cup, the inside of the sliding groove is in a sealed state. When the connecting plate descends, negative pressure will be generated on the top of the connecting plate. As the connecting plate With the continuous movement of the suction cup, the convex plate will contact the seesaw, push the seesaw to move, and let the seesaw rotate, so that the side of the seesaw close to the convex plate is lowered and the other side is raised, thereby lifting the fixed plate, driving the spring plate and the suction cup to rise, allowing the spring plate to accumulate resilience. As the suction cup continues to rise, the suction cup will contact the bottom of the circuit board and slightly lift the circuit board. At this time, the air barrier rod will also separate from the suction cup, and negative pressure will enter the suction cup, and the suction cup will adsorb the bottom of the circuit board to fix the circuit board. The circuit board is fixed by the adsorption force, which effectively prevents the circuit board from slight deformation and affects the position of the patch, thereby reducing the mounting error.

[0005] Preferably, the pressing assembly includes a placement groove provided on the inner wall of the adsorption mechanism, two fixed sleeves are fixedly connected to the inner wall of the placement groove, and spring return rods 1 are slidably connected to the outer walls of the two fixed sleeves. The top of the spring return rod 1 on the left side extends to the bottom of the seesaw. When the connecting plate descends, the gas at the bottom of the connecting plate will also be squeezed. At this time, the squeezed gas will be blocked by the inclined air blocking plate, so the gas will generate high pressure. When the seesaw is lowered close to the side of the convex plate, the seesaw will squeeze the top of the spring return rod 1 on the left side, causing the spring return rod 1 to descend and accumulate rebound force.

[0006] Preferably, the pressing assembly further comprises two inclined air blocking plates slidably connected to the inner wall of the placement groove, the outer walls of the two spring return rods 1 are fixedly connected with inclined plates, the side walls of the two inclined air blocking plates are fixedly connected with spring return rods 2, and the outer walls of the two spring return rods 2 are slidably connected to the inner wall of the air pressure box; Among them, three jet pipes are fixedly connected to the front and back of the air pressure box, and the outer walls of the six jet pipes are connected with the inner wall of the placement groove, driving the inclined plate to descend, and the spring return rod on the right side is driven to descend through the inclined plate. When the inclined plate descends, the inclined surface of the inclined plate will contact the inclined surface of the inclined air blocking plate, so the inclined plate will squeeze the inclined air blocking plate, allowing the inclined air blocking plate to move away from the fixed sleeve.

[0007] Preferably, the downward pressure component also includes three air suction holes formed on the inner wall of the air pressure box, the inner walls of the three air suction holes are slidably connected with spring air blocking plates, the bottom of the inner wall of the sliding groove is fixedly connected with three fixing frames, the inner walls of the three fixing frames are slidably connected with the outer wall of the spring air blocking plate, driving the spring return rod 2 to move, allowing the spring return rod 2 to accumulate rebound force, and with the movement of the inclined air blocking plate, the obstruction to the high gas will be eliminated, and the gas will enter the placement groove, and finally sprayed toward the top of the circuit board through the jet pipe, exerting a downward impact force on the top of the circuit board, causing the circuit board to move slightly downward, thereby promoting better contact between the circuit board and the contact surface of the suction cup.

[0008] Preferably, the pushing assembly includes two fixed frames fixedly connected to the left and right sides of the air pressure box, and the left and right sides of the air pressure box are both provided with connecting frames, and the side walls of the two connecting frames are both fixedly connected to the side walls of the spring return rod 2, and the side walls of the two connecting frames are both rotatably connected to two connecting rods; The inner walls of the four fixed frames are all slidably connected with sliding plates, and the side walls of the four sliding plates are all rotatably connected with the inner wall of the connecting rod.

[0009] Preferably, the pushing assembly further comprises an air delivery pipe connected to the inner wall of the fixed frame, two connecting frames are fixedly connected to the left and right sides of the air pressure box, sliding frames are fixedly connected to the outer walls of the four sliding plates, and two rotating frames are rotatably connected to the left and right sides of the air pressure box; Among them, the inner walls of the four rotating frames are slidably connected to the side walls of the sliding frame, and the inner walls of the four connecting frames are slidably connected with extrusion plates. When the spring reset rod 2 is away from the fixed sleeve, it will drive the connecting frame to move, thereby driving the connecting rod to move, and the connecting rod will rotate. The connecting rod will pull the sliding plate away from the gas pipe 1, allowing the two sliding plates to approach each other. When the sliding plate moves, gas will be inhaled through the gas pipe 1, allowing the four gas pipes 1 to exert additional attraction on the four corners of the circuit board, thereby enhancing the stability of the circuit board.

[0010] Preferably, the pushing assembly further comprises an air delivery pipe 2 connected through the top of the connecting frame, the bottoms of the four extrusion plates are slidably connected to the inner wall of the rotating frame, the tops of the four extrusion plates are fixedly connected with connecting rods, and the inner walls of the four connecting frames are provided with air inlet holes; Among them, annular grooves are opened on the inner walls of the four gas pipes II, and the inner walls of the four connecting rods are slidably connected with the inner wall of the gas pipe II. When the two sliding plates approach each other, the sliding frame will be driven to move, pulling the rotating frame to rotate, tilting the rotating frame, pulling the extrusion plate down, and the connecting rod will be lowered, so that the connecting rod is separated from the annular groove, and the connecting rod will block the gas pipe II. With the continuous movement of the extrusion plate, the extrusion plate passes over the air inlet hole, allowing gas to enter the connecting frame. When the circuit board patch is completed, the electric telescopic rod is extended again to return the connecting plate to the position, cancel the extrusion of the rocker plate, and release the rebound force of the spring reset rod 1 to return the inclined plate to the position, and the obstruction to the inclined air blocking plate disappears.

[0011] A method for using an anti-displacement patch device for an SMT patch machine includes the following steps: S1: adsorption clamping; S2: Apply impact force; S3: Enhanced stability.

[0012] The present invention has the following beneficial effects: When the mounting plate is lowered, the cam is moved downwards and the mounting plate is moved downwards, and the cam is moved downwards, ...

[0013] (2) When the connecting plate of the present invention descends, it will also squeeze the gas at the bottom of the connecting plate. At this time, the squeezed gas will be blocked by the inclined air blocking plate, so the gas will generate high pressure. When the rocker plate is lowered close to the side of the convex plate, the rocker plate will squeeze the top of the spring return rod 1 on the left side, causing the spring return rod 1 to descend, accumulate rebound force, and drive the inclined plate to descend. The inclined plate drives the spring return rod 1 on the right side to descend. When the inclined plate descends, the inclined surface of the inclined plate will contact the inclined surface of the inclined air blocking plate. Therefore, the inclined plate will squeeze the inclined air blocking plate, causing the inclined air blocking plate to move away from the fixed sleeve, driving the spring return rod 2 to move, allowing the spring return rod 2 to accumulate rebound force. As the inclined air blocking plate moves, the obstruction to the high gas will be eliminated, and the gas will enter the placement groove, and finally be sprayed toward the top of the circuit board through the jet pipe, exerting a downward impact force on the top of the circuit board, causing the circuit board to move slightly downward, thereby promoting better contact between the circuit board and the contact surface of the suction cup.

[0014] (3) In the present invention, when the spring return rod 2 moves away from the fixed sleeve, it will drive the connecting frame to move, thereby driving the connecting rod to move. When the connecting rod rotates, the connecting rod will pull the sliding plate away from the gas pipe 1, allowing the two sliding plates to approach each other. When the sliding plate moves, gas will be sucked in through the gas pipe 1, allowing the four gas pipes 1 to exert additional attraction on the four corners of the circuit board, thereby enhancing the stability of the circuit board and effectively preventing the uneven distribution of the airflow ejected from the air jet pipe, which may cause slight vibration of the circuit board and affect the adsorption of the suction cup.

[0015] (4) When the two sliding plates of the present invention approach each other, the sliding frame will be driven to move, the rotating frame will be pulled to rotate, the rotating frame will be tilted, the extrusion plate will be pulled down, the connecting rod will be lowered, the connecting rod will be separated from the annular groove, and the connecting rod will block the gas pipe 2. As the extrusion plate continues to move, the extrusion plate will pass over the air inlet hole, allowing gas to enter the connecting frame. When the circuit board patch is completed, the electric telescopic rod is extended again to return the connecting plate to its original position, canceling the extrusion of the seesaw plate, and the rebound force of the spring reset rod 1 is released, allowing the inclined plate to return to its original position, and the obstruction to the inclined air blocking plate disappears. The rebound force of the spring reset rod 2 is It will also release, allowing the connecting frame to return to its position, thereby allowing the sliding plate to return to its position, allowing the rotating frame to return to its position, pushing the extrusion plate to rise, allowing the extrusion plate to pass over the air inlet, thereby squeezing the gas in the connecting frame. At this time, the squeezed gas will be blocked by the connecting rod, so the gas pressure will increase until the connecting rod moves to the position of the annular groove, allowing a gap to leak between the annular groove and the connecting rod, and the gas will enter the gas pipe 2 from the gap, and spray toward the bottom of the circuit board through the gas pipe 2. The adsorption force between the suction cup and the circuit board is reduced through gas escape, destroying the original vacuum state, making it easier to separate the suction cup from the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0017] Figure 1 It is a schematic cross-sectional view of the overall structure of the present invention; Figure 2 It is a schematic diagram of the overall structure of the present invention; Figure 3 It is a schematic diagram of the explosion of part of the structure of the adsorption mechanism of the present invention; Figure 4 For the present invention Figure 3 A is an enlarged schematic diagram; Figure 5 For the present invention Figure 3 A magnified schematic diagram of B; Figure 6 It is a cross-sectional schematic diagram of a fixing frame of the present invention; Figure 7 For the present invention Figure 6 A magnified schematic diagram of middle C; Figure 8 It is a schematic diagram of the working process of the present invention.

[0018] In the accompanying drawings, the components represented by the reference numerals are listed as follows: In the figure: 1, base; 11, conveyor; 12, blocking cylinder; 2, adsorption mechanism; 21, air pressure box; 22, sliding groove; 23, electric telescopic rod; 24, connecting plate; 241, air blocking rod; 25, spring plate; 251, suction cup; 3, lifting mechanism; 31, rocker; 32, fixed plate; 33, convex plate; 4, pressing assembly; 41, placement groove; 42, fixed sleeve; 421, spring return rod 1; 43, inclined air blocking plate; 44 , inclined panel; 45, spring return rod 2; 46, jet pipe; 47, air intake hole; 471, fixed frame; 472, spring air blocking plate; 5, pushing assembly; 51, fixed frame; 52, connecting frame; 53, connecting rod; 54, sliding plate; 55, air supply pipe 1; 56, connecting frame; 561, sliding frame; 562, rotating frame; 563, extrusion plate; 564, connecting rod; 565, air intake hole; 57, air supply pipe 2; 571, annular groove. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] For example, see Figure 1 - Figure 3 The present invention is an anti-displacement patch device for an SMT patch machine, comprising a base 1 and a conveyor 11, the top of the base 1 and the bottom of the conveyor 11 are fixedly connected, and a blocking cylinder 12 is fixedly connected to the top of the base 1; The adsorption mechanism 2 includes an air pressure box 21 fixedly connected to the top of the base 1, a sliding groove 22 is provided on the inner wall of the air pressure box 21, two electric telescopic rods 23 are fixedly connected to the bottom of the inner wall of the sliding groove 22, a connecting plate 24 is slidably connected to the inner wall of the sliding groove 22, the top output ends of the two electric telescopic rods 23 are fixedly connected to the bottom of the connecting plate 24, twelve air blocking rods 241 are fixedly connected to the top of the connecting plate 24, a spring plate 25 is slidably connected to the inner wall of the sliding groove 22, twelve suction cups 251 are fixedly connected to the inner wall of the spring plate 25, the inner walls of the twelve suction cups 251 are all slidably connected to the outer walls of the air blocking rods 241, and a pressing component 4 is provided on the inner wall of the air pressure box 21; The lifting mechanism 3 includes a seesaw plate 31 rotatably connected to the inner wall of the sliding groove 22, a convex plate 33 is fixedly connected to the bottom of the connecting plate 24, and a fixed plate 32 is fixedly connected to the bottom of the spring plate 25. A pushing component 5 is arranged on the outer wall of the air pressure box 21. The conveyor 11 is started to convey the circuit board to be mounted until the circuit board contacts the blocking cylinder 12 and is blocked by the blocking cylinder 12. Then the electric telescopic rod 23 is started to retract the electric telescopic rod 23, and the connecting plate 24 is pulled down, driving the air blocking rod 241 to descend. At this time, since the air blocking rod 241 is located inside the suction cup 251, the inside of the sliding groove 22 is in a sealed state. When the connecting plate 24 descends, negative pressure will be generated on the top of the connecting plate 24. As the connecting plate 24 continues to move, the convex plate 33 will contact the seesaw 31, pushing the seesaw 31 to move and allowing the seesaw 31 to rotate, so that the side of the seesaw 31 close to the convex plate 33 is lowered and the other side is raised, thereby lifting the fixed plate 32, driving the spring plate 25 and the suction cup 251 to rise, allowing the spring plate 25 to accumulate resilience. As the suction cup 251 continues to rise, the suction cup 251 will contact the bottom of the circuit board and slightly lift the circuit board. At this time, the air blocking rod 241 will also separate from the suction cup 251, and negative pressure will enter the suction cup 251. The suction cup 251 will adsorb the bottom of the circuit board to fix the circuit board. The circuit board is fixed by the adsorption force, which effectively prevents the circuit board from being slightly deformed and affecting the position of the patch, thereby reducing the mounting error.

[0021] For example 2, please refer to Figure 4 - Figure 8 The present invention is an anti-displacement patch device for an SMT patch machine. On the basis of the first embodiment, the pressing component 4 includes a placement groove 41 opened on the inner wall of the adsorption mechanism 2, and two fixed sleeves 42 are fixedly connected to the inner wall of the placement groove 41. The outer walls of the two fixed sleeves 42 are slidably connected with a spring return rod 421. The top of the spring return rod 421 on the left side extends to the bottom of the seesaw 31. When the connecting plate 24 descends, the gas at the bottom of the connecting plate 24 will be squeezed. At this time, the squeezed gas will be blocked by the inclined air blocking plate 43, so the gas will generate high pressure. When the seesaw 31 is lowered close to the side of the convex plate 33, the seesaw 31 will squeeze the top of the spring return rod 421 on the left side, so that the spring return rod 421 will descend and accumulate resilience.

[0022] The pressing assembly 4 further includes two inclined air blocking plates 43 slidably connected to the inner wall of the placement groove 41, and the outer wall of the two spring return rods 1 421 is fixedly connected with an inclined plate 44, and the side walls of the two inclined air blocking plates 43 are fixedly connected with spring return rods 2 45, and the outer walls of the two spring return rods 2 45 are slidably connected with the inner wall of the air pressure box 21; Among them, three air injection pipes 46 are fixedly connected to the front and back of the air pressure box 21. The outer walls of the six air injection pipes 46 are connected with the inner wall of the placement groove 41, driving the inclined panel 44 to descend, and the spring return rod 421 located on the right side is driven to descend through the inclined panel 44. When the inclined panel 44 descends, the inclined surface of the inclined panel 44 will contact the inclined surface of the inclined air blocking plate 43, so the inclined panel 44 will squeeze the inclined air blocking plate 43, so that the inclined air blocking plate 43 is away from the fixed sleeve 42.

[0023] The pressing component 4 also includes three air suction holes 47 opened on the inner wall of the air pressure box 21, and the inner walls of the three air suction holes 47 are slidably connected with spring air blocking plates 472. The bottom of the inner wall of the sliding groove 22 is fixedly connected with three fixing frames 471, and the inner walls of the three fixing frames 471 are slidably connected with the outer walls of the spring air blocking plates 472, driving the spring return rod 2 45 to move, allowing the spring return rod 2 45 to accumulate resilience. With the movement of the inclined air blocking plate 43, the obstruction to the high gas will be eliminated, and the gas will enter the placement groove 41, and finally sprayed toward the top of the circuit board through the air injection pipe 46, exerting a downward impact force on the top of the circuit board, causing the circuit board to move slightly downward, thereby promoting better contact between the circuit board and the contact surface of the suction cup 251.

[0024] The pushing assembly 5 includes two fixed frames 51 fixedly connected to the left and right sides of the air pressure box 21. The left and right sides of the air pressure box 21 are both provided with connecting frames 52. The side walls of the two connecting frames 52 are both fixedly connected to the side walls of the spring return rod 2 45. The side walls of the two connecting frames 52 are both rotatably connected to two connecting rods 53. The inner walls of the four fixed frames 51 are all slidably connected with sliding plates 54 , and the side walls of the four sliding plates 54 are all rotatably connected to the inner wall of the connecting rod 53 .

[0025] The push assembly 5 also includes an air delivery pipe 55 connected to the inner wall of the fixed frame 51, two connection frames 56 are fixedly connected to the left and right sides of the air pressure box 21, and sliding frames 561 are fixedly connected to the outer walls of the four sliding plates 54. Two rotating frames 562 are rotatably connected to the left and right sides of the air pressure box 21; Among them, the inner walls of the four rotating frames 562 are slidably connected to the side walls of the sliding frame 561, and the inner walls of the four connecting frames 56 are slidably connected with the extrusion plates 563. When the spring return rod 2 45 is away from the fixed sleeve 42, it will drive the connecting frame 52 to move, thereby driving the connecting rod 53 to move, and the connecting rod 53 will rotate. The connecting rod 53 will pull the sliding plate 54 away from the gas pipe 1 55, allowing the two sliding plates 54 to approach each other. When the sliding plate 54 moves, it will inhale gas through the gas pipe 1 55, allowing the four gas pipes 1 55 to exert additional attraction on the four corners of the circuit board, thereby enhancing the stability of the circuit board.

[0026] The pushing assembly 5 also includes an air delivery pipe 57 that is connected to the top of the connecting frame 56. The bottoms of the four extrusion plates 563 are slidably connected to the inner wall of the rotating frame 562. The tops of the four extrusion plates 563 are fixedly connected to connecting rods 564. The inner walls of the four connecting frames 56 are provided with air inlet holes 565. Among them, annular grooves 571 are provided on the inner walls of the four gas pipes 57, and the inner walls of the four connecting rods 564 are slidably connected to the inner wall of the gas pipe 57. When the two sliding plates 54 approach each other, the sliding frame 561 will be driven to move, and the rotating frame 562 will be pulled to rotate, so that the rotating frame 562 is tilted, and the extrusion plate 563 is pulled down, so that the connecting rod 564 is lowered, and the connecting rod 564 is separated from the annular groove 571, so that the connecting rod 564 blocks the gas pipe 57. With the continuous movement of the extrusion plate 563, the extrusion plate 563 passes over the air inlet 565, allowing gas to enter the connecting frame 56. When the circuit board patch is completed, the electric telescopic rod 23 is extended again to return the connecting plate 24 to the position, cancel the extrusion of the rocker 31, and the rebound force of the spring return rod 421 is released to return the inclined plate 44 to the position, and the obstruction to the inclined air blocking plate 43 disappears.

[0027] There is no limitation on the number of the above components, and relevant technicians in the field can freely set them according to actual needs, as long as the above components are installed at the connection positions of the corresponding components.

[0028] The method for using the anti-displacement patch device for an SMT patch machine comprises the following steps: S1: adsorption clamping; S2: Apply impact force; S3: Enhanced stability.

[0029] A specific application of this embodiment is as follows: when the present invention is used, the conveyor 11 is started to convey the circuit board to be mounted, until the circuit board contacts the blocking cylinder 12 and is blocked by the blocking cylinder 12, and then the electric telescopic rod 23 is started to retract the electric telescopic rod 23, and the connecting plate 24 is pulled down, driving the air blocking rod 241 to descend. At this time, since the air blocking rod 241 is located inside the suction cup 251, the inside of the sliding groove 22 is in a sealed state. When the connecting plate 24 descends, negative pressure will be generated on the top of the connecting plate 24. As the connecting plate 24 continues to move, the convex plate 33 will contact the seesaw 31, pushing the seesaw 31 to move, so that The seesaw 31 rotates, so that the side of the seesaw 31 close to the convex plate 33 is lowered and the other side is raised, thereby lifting the fixed plate 32, driving the spring plate 25 and the suction cup 251 to rise, allowing the spring plate 25 to accumulate resilience. As the suction cup 251 continues to rise, the suction cup 251 will contact the bottom of the circuit board and slightly lift the circuit board. At this time, the air blocking rod 241 will also separate from the suction cup 251, and negative pressure will enter the suction cup 251. The suction cup 251 adsorbs the bottom of the circuit board to fix the circuit board. The circuit board is fixed by the adsorption force, which effectively prevents the circuit board from being slightly deformed and affecting the position of the patch, thereby reducing the mounting error. Secondly, when the connecting plate 24 descends, the gas at the bottom of the connecting plate 24 will be squeezed. At this time, the squeezed gas will be blocked by the inclined air blocking plate 43, so the gas will generate high pressure. When the side of the seesaw 31 close to the convex plate 33 is lowered, the seesaw 31 will squeeze the top of the spring return rod 421 on the left side, so that the spring return rod 421 descends, accumulates the rebound force, drives the inclined plate 44 to descend, and drives the spring return rod 421 on the right side to descend through the inclined plate 44. When the inclined plate 44 descends, the inclined surface of the inclined plate 44 will contact the inclined air blocking plate 43. The inclined surface of the air plate 43 is in contact, so the inclined plate 44 will squeeze the inclined air blocking plate 43, so that the inclined air blocking plate 43 is away from the fixed sleeve 42, driving the spring return rod 2 45 to move, so that the spring return rod 2 45 accumulates resilience, and as the inclined air blocking plate 43 moves, the obstruction to the high gas will be eliminated, and the gas will enter the placement groove 41, and finally sprayed toward the top of the circuit board through the air injection pipe 46, exerting a downward impact force on the top of the circuit board, so that the circuit board moves slightly downward, thereby promoting better contact between the circuit board and the contact surface of the suction cup 251; Secondly, when the spring return rod 2 45 is away from the fixed sleeve 42, it will drive the connecting frame 52 to move, thereby driving the connecting rod 53 to move, and the connecting rod 53 will rotate, and the connecting rod 53 will pull the sliding plate 54 away from the gas pipe 1 55, so that the two sliding plates 54 are close to each other. When the sliding plate 54 moves, gas will be sucked in through the gas pipe 1 55, so that the four gas pipes 1 55 exert additional attraction on the four corners of the circuit board, thereby enhancing the stability of the circuit board and effectively preventing the uneven distribution of the airflow ejected by the air jet pipe 46, which may cause slight vibration of the circuit board and affect the adsorption of the suction cup 251; Secondly, when the two sliding plates 54 are close to each other, the sliding frame 561 will be driven to move, and the rotating frame 562 will be pulled to rotate, so that the rotating frame 562 is tilted, and the extrusion plate 563 is pulled down, so that the connecting rod 564 is lowered, so that the connecting rod 564 is separated from the annular groove 571, and the connecting rod 564 blocks the gas pipe 2 57. With the continuous movement of the extrusion plate 563, the extrusion plate 563 passes over the air inlet hole 565, and the gas enters the connecting frame 56. When the circuit board patch is completed, the electric telescopic rod 23 is extended again to return the connecting plate 24 to its original position, cancel the extrusion of the seesaw plate 31, and the rebound force of the spring reset rod 1 421 is released, so that the inclined plate 44 returns to its original position, and the obstruction to the inclined air blocking plate 43 disappears. The spring reset rod 2 45 The rebound force will also be released, so that the connecting frame 52 returns to its original position, thereby returning the sliding plate 54 and the rotating frame 562 to their original position, pushing the extrusion plate 563 up, allowing the extrusion plate 563 to pass over the air inlet hole 565, thereby squeezing the gas in the connecting frame 56. At this time, the squeezed gas will be blocked by the connecting rod 564, so the gas pressure will increase until the connecting rod 564 moves to the position of the annular groove 571, so that a gap leaks out between the annular groove 571 and the connecting rod 564, and the gas will enter the gas pipe 2 57 from the gap, and spray toward the bottom of the circuit board through the gas pipe 2 57. The adsorption force between the suction cup 251 and the circuit board is reduced by the gas escape, destroying the original vacuum state, so that the suction cup 251 is more easily separated from the circuit board. Among them, when the spring return rod 45 returns to its position, the inclined air blocking plate 43 will once again block the gas flow inside the air pressure box 21, and the air blocking rod 241 will enter the suction cup 251 again, so that the interior of the sliding groove 22 is in a sealed state again. At this time, when the connecting plate 24 moves, negative pressure will be generated at the bottom of the connecting plate 24. As the negative pressure increases, the spring air blocking plate 472 will be slightly sucked up. Since the suction hole 47 and the fixing frame 471 are conical in shape, when the fixing frame 471 is sucked up, there will be a gap between the two, thereby sucking in gas from the external environment to complete the replenishment of the gas inside the sliding groove 22.

[0030] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An anti-displacement patch device for an SMT patch machine, comprising a base (1) and a conveyor (11), wherein the top of the base (1) is fixedly connected to the bottom of the conveyor (11), and a blocking cylinder (12) is fixedly connected to the top of the base (1), characterized in that: Also includes: An adsorption mechanism (2), the adsorption mechanism (2) comprising an air pressure box (21) fixedly connected to the top of the base (1), a sliding groove (22) being provided on the inner wall of the air pressure box (21), two electric telescopic rods (23) being fixedly connected to the bottom of the inner wall of the sliding groove (22), a connecting plate (24) being slidably connected to the inner wall of the sliding groove (22), the top output ends of the two electric telescopic rods (23) being fixedly connected to the bottom of the connecting plate (24), twelve air blocking rods (241) being fixedly connected to the top of the connecting plate (24), a spring plate (25) being slidably connected to the inner wall of the sliding groove (22), twelve suction cups (251) being fixedly connected to the inner wall of the spring plate (25), the inner walls of the twelve suction cups (251) being all slidably connected to the outer walls of the air blocking rods (241), and a downward pressing component (4) being provided on the inner wall of the air pressure box (21); A lifting mechanism (3), the lifting mechanism (3) comprising a seesaw plate (31) rotatably connected to the inner wall of the sliding groove (22), a convex plate (33) fixedly connected to the bottom of the connecting plate (24), a fixed plate (32) fixedly connected to the bottom of the spring plate (25), and a pushing assembly (5) provided on the outer wall of the air pressure box (21).

2. The anti-displacement patch device for an SMT patch machine according to claim 1, characterized in that: The pressing assembly (4) comprises a placement groove (41) formed on the inner wall of the adsorption mechanism (2), two fixed sleeves (42) being fixedly connected to the inner wall of the placement groove (41), and spring return rods (421) being slidably connected to the outer walls of the two fixed sleeves (42), and the top of the spring return rod (421) on the left side extends to the bottom of the seesaw (31).

3. The anti-displacement patch device for an SMT patch machine according to claim 2, characterized in that: The pressing assembly (4) further comprises two inclined air blocking plates (43) slidably connected to the inner wall of the placement groove (41); the outer walls of the two spring return rods (421) are fixedly connected to an inclined plate (44); the side walls of the two inclined air blocking plates (43) are fixedly connected to spring return rods (45); the outer walls of the two spring return rods (45) are slidably connected to the inner wall of the air pressure box (21); The front and back sides of the air pressure box (21) are fixedly connected with three air jet pipes (46), and the outer walls of the six air jet pipes (46) are connected to the inner wall of the placement groove (41).

4. The anti-displacement patch device for an SMT patch machine according to claim 3, characterized in that: The pressing assembly (4) further comprises three air suction holes (47) formed on the inner wall of the air pressure box (21), the inner walls of the three air suction holes (47) being slidably connected to spring air blocking plates (472), the inner wall bottom of the sliding groove (22) being fixedly connected to three fixing frames (471), the inner walls of the three fixing frames (471) being slidably connected to the outer walls of the spring air blocking plates (472).

5. The anti-displacement patch device for an SMT patch machine according to claim 4, characterized in that: The pushing assembly (5) comprises two fixed frames (51) fixedly connected to the left and right sides of the air pressure box (21); the left and right sides of the air pressure box (21) are both provided with connecting frames (52); the side walls of the two connecting frames (52) are both fixedly connected to the side walls of the second spring return rod (45); the side walls of the two connecting frames (52) are both rotatably connected to two connecting rods (53); The inner walls of the four fixed frames (51) are all slidably connected to sliding plates (54), and the side walls of the four sliding plates (54) are all rotatably connected to the inner wall of the connecting rod (53).

6. The anti-displacement patch device for an SMT patch machine according to claim 5, characterized in that: The pushing assembly (5) further comprises an air delivery pipe (55) penetrating and connected to the inner wall of the fixed frame (51); the left and right sides of the air pressure box (21) are fixedly connected to two connection frames (56); the outer walls of the four sliding plates (54) are fixedly connected to sliding frames (561); the left and right sides of the air pressure box (21) are rotatably connected to two rotating frames (562); The inner walls of the four rotating frames (562) are all slidably connected to the side walls of the sliding frame (561), and the inner walls of the four connecting frames (56) are all slidably connected to the extrusion plates (563).

7. The anti-displacement patch device for an SMT patch machine according to claim 6, characterized in that: The pushing assembly (5) further comprises a second air delivery pipe (57) which is connected to the top of the connecting frame (56); the bottoms of the four extrusion plates (563) are slidably connected to the inner wall of the rotating frame (562); the tops of the four extrusion plates (563) are fixedly connected to connecting rods (564); and the inner walls of the four connecting frames (56) are provided with air inlet holes (565); The inner walls of the four gas pipes (57) are each provided with an annular groove (571), and the inner walls of the four connecting rods (564) are each slidably connected to the inner wall of the gas pipe (57).

8. A method for using an anti-displacement patch device for an SMT patch machine, using the anti-displacement patch device for an SMT patch machine as claimed in claim 7, characterized in that: The following steps are included: S1: adsorption clamping; S2: Apply impact force; S3: Enhanced stability.

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