Biosensor chip packaging structure, PCB board and microfluidic detection device

Abstract

A biosensor chip packaging structure (100), a PCB board (201) and a microfluidic detection device. The biosensor chip packaging structure comprises: a sensor chip (1), an integrated circuit chip (2) and a substrate (3). The sensor chip (1) is used to contact with external substances and convert the measured parameters into measurement signals; the integrated circuit chip (2) is used to process the measurement signals; the sensor chip (1) and the integrated circuit chip (2) are respectively and independently arranged on the substrate (3), and the sensor chip (1) and the integrated circuit chip (2) are electrically connected through the substrate (3). In the biosensor chip packaging structure, the scrapping of the sensor chip does not affect the integrated circuit chip, thereby reducing the scrapping rate and the process difficulty; the sensor chip can be detected or maintained separately, thereby improving the maintenance economy.

Description

Biosensor chip packaging structure, PCB board and microfluidic detection device Technical Field

[0001] The present invention relates to semiconductor chip packaging technology, and in particular to a biosensor chip packaging structure, a PCB board and a microfluidic detection device. Background Art

[0002] Packaging is the process of assembling integrated circuits into final chip products. Simply put, it involves placing the bare IC die produced in the wafer fab onto a supporting substrate and then securing it in a package to form a complete unit. Current chip packaging has evolved from the initial COB packaging to the more common plastic packaging methods, significantly improving production efficiency and enabling increasingly higher levels of integration in sensor chips.

[0003] Biosensor chips typically integrate a MEMS sensor chip with an ASIC (Application Specific Integrated Circuit) chip. However, in actual production, this packaging method can easily lead to the entire chip being scrapped due to defects in a single component, thus affecting the overall chip production yield. Due to the high cost of ASIC chips, any scrapping of these chips increases costs.

[0004] Therefore, there is an urgent need to provide a packaging structure that can improve product yield.

[0005] Summary of the Invention

[0006] The present invention provides a biosensor chip packaging structure, a PCB board and a microfluidic detection device, in the hope of improving the chip production yield.

[0007] A first aspect of the present invention provides a biosensor chip packaging structure, which includes: at least one sensor chip that converts a measured parameter into a measurement signal; at least one integrated circuit chip that processes the measurement signal; and a substrate for carrying the sensor chip and the integrated circuit chip; wherein the sensor chip and the integrated circuit chip are independently arranged on the substrate.

[0008] In a further embodiment of the present application, the biosensor chip packaging structure further includes: the biosensor chip packaging structure further includes: a conductive structure for electrical connection; the sensor chip and the integrated circuit chip are electrically connected via the conductive structure.

[0009] In a further embodiment of the present application, the conductive structure includes bonding wires; wherein the sensor chip and the integrated circuit chip are directly electrically connected via the bonding wires, and the measurement signal does not pass through the substrate; or the sensor chip and the integrated circuit chip are electrically connected to the substrate respectively via bonding wires, and the measurement signal is indirectly transmitted through the substrate.

[0010] In an optional solution of the present application, the sensor chip and the integrated circuit chip are directly electrically connected via bonding wires; the conductive structure further includes a transfer block connected to the substrate, and the transfer block is arranged between the sensor chip and the integrated circuit chip.

[0011] In an optional solution of the present application, one end of the bonding wire is connected to the adapter block, and the other end is connected to the sensor chip or the integrated circuit chip.

[0012] In another optional scheme of the present application, the conductive structure includes a silicon through-via (TSV) penetrating the sensor chip; the sensor chip is electrically connected to the substrate, and the measurement signal is transmitted from the upper surface of the sensor chip to the substrate through the TSV; the integrated circuit chip is flip-chip arranged and electrically connected to the substrate; the measurement signal is transmitted from the sensor chip to the integrated circuit chip through the substrate.

[0013] In a further embodiment of the present application, the biosensor chip packaging structure further includes: a plastic package, which covers the substrate to encapsulate the biosensor chip packaging structure; the plastic package is provided with an opening, which allows the sensor chip to be at least partially exposed from the plastic package, so that the sensor chip is in direct contact with external substances.

[0014] In a further solution of the present application, the plastic package body is configured to be transparent in at least a portion of its area.

[0015] In a further embodiment of the present application, the biosensor chip packaging structure further includes: a first connection layer and a second connection layer, wherein the first connection layer is arranged on the upper surface of the substrate, and is used to connect the sensor chip and the integrated circuit chip to the substrate; the second connection layer is arranged on the lower surface of the substrate, and is used to connect the biosensor chip packaging structure to an external substrate and electrically connect it.

[0016] In a further embodiment of the present application, the first connection layer includes at least one of adhesive, solder balls, and pads; and the second connection layer is any one of solder balls and pads.

[0017] In a further embodiment of the present application, when the conductive structure includes a through silicon via, the first connection layer uses a solder ball.

[0018] In a second aspect of the present application, a PCB board is further provided, comprising: a PCB substrate; and the biosensor chip packaging structure according to any one of claims 1 to 10, wherein the biosensor chip packaging structure is connected to the PCB substrate and is electrically connected.

[0019] The third aspect of the present application further provides a microfluidic detection device, a fluid component; such as the above-mentioned biosensor chip packaging structure, the fluid component and the biosensor chip packaging structure are assembled to form a reaction chamber.

[0020] Finally, the present application also provides a method for manufacturing a biosensor chip packaging structure, the manufacturing method comprising: providing a substrate; forming at least one independent sensor chip and at least one integrated circuit chip at different positions on the substrate; and setting a conductive structure to connect the sensor chip and the integrated circuit chip.

[0021] In an optional solution of the present application, providing a conductive structure to connect the sensor chip and the integrated circuit chip includes: providing a bonding wire to connect the sensor chip and the integrated circuit chip.

[0022] In an optional solution of the present application, providing a conductive structure to connect the sensor chip and the integrated circuit chip includes: providing bonding wires and a substrate to electrically connect the sensor chip and the integrated circuit chip respectively.

[0023] In a further solution of the present application, a through-silicon via is provided in the sensor chip to transmit the measurement signal from the upper surface of the sensor chip to the lower surface, and the sensor chip and the substrate are electrically connected through the solder balls; the integrated circuit chip is flip-chip provided, and the integrated circuit chip and the substrate are electrically connected through the solder balls.

[0024] In a further solution of the present application, connecting the sensor chip and the integrated circuit chip through bonding wires further includes: setting at least one adapter block on the substrate; processing a connection area on the adapter block; connecting one end of the bonding wire to the adapter block through the connection area, and connecting the other end to the sensor chip or the integrated circuit chip.

[0025] In a further embodiment of the present application, the manufacturing method further includes: placing the substrate into a mold cavity of a plastic encapsulation mold, coating a protective layer at a position of the plastic encapsulation mold corresponding to the sensing area of ​​the sensor chip; using the plastic encapsulation mold to press down on the sensing area to seal the sensing area; injecting a fluid plastic encapsulation body into the mold cavity; using a curing process to form the plastic encapsulation body, and then removing the substrate from the mold cavity to expose at least part of the sensing area. Beneficial effects:

[0026] In summary, the present invention provides a biosensor chip packaging structure, which includes a sensor chip, an integrated circuit chip, and a substrate. By independently disposing the sensor chip and the integrated circuit chip on the substrate and establishing an electrical connection between the sensor chip and the integrated circuit chip, the prior art method of integrating the sensor chip and the integrated circuit chip is abandoned, and the sensor chip and the integrated circuit chip are treated as independent chips, thereby achieving the following technical effects:

[0027] 1. The scrapping of sensor chips during the production process does not affect the integrated circuit chip, thereby improving the overall production yield of the biosensor chip packaging structure, reducing the scrap rate and saving costs;

[0028] 2. The sensor chip and integrated circuit chip are independent chips, which can reduce the difficulty of the process;

[0029] 3. During use, since the sensor chip and integrated circuit chip are not integrated, they can be tested or maintained separately, improving maintenance economy. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0031] FIG1 is a cross-sectional view showing a biosensor chip packaging structure from a microscopic perspective according to an embodiment of the present invention;

[0032] FIG2 is a top view of the biosensor chip packaging structure illustrated in FIG1 according to an embodiment of the present invention;

[0033] FIG3 is a schematic structural diagram of a biosensor chip packaging structure provided in Example 2 of the present invention;

[0034] FIG4 is a schematic structural diagram of a sensor chip packaging structure provided by a third embodiment of the present invention;

[0035] FIG5 is a schematic structural diagram of a biosensor chip packaging structure provided in a fourth embodiment of the present invention;

[0036] FIG6 is a schematic structural diagram of a biosensor chip packaging structure provided in Example 5 of the present invention;

[0037] FIG7 is a top view of the biosensor chip packaging structure illustrated in FIG3 corresponding to Example 6 of the present invention;

[0038] FIG8 is a schematic structural diagram of a PCB board provided in an embodiment of the present invention;

[0039] 9 is a first flow chart of a method for manufacturing a biosensor chip packaging structure according to an embodiment of the present invention;

[0040] FIG10 is a second flow chart of the method for manufacturing the biosensor chip packaging structure provided by an embodiment of the present invention.

[0041] Figures 100 to 500 show a biosensor chip packaging structure; 1. sensor chip; 2. integrated circuit chip; 3. substrate; 4. conductive structure; 5. plastic package; 6. first connection layer; 7. second connection layer; 41. bonding wire; 42. through-silicon via (TSV); 43. adapter block; 51. opening; 11. body; 12. sensing area; 200. PCB board; 201. PCB substrate. DETAILED DESCRIPTION

[0042] In order to make the above and other features and advantages of the present invention more clear, the present invention is further described below with reference to the accompanying drawings. It should be understood that the specific embodiments given herein are for the purpose of explaining to those skilled in the art and are only exemplary and not restrictive.

[0043] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0045] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0046] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0047] In response to the problems existing in the prior art, the present invention proposes a general inventive concept to solve the technical problem that the packaging method currently used for biosensor chips is prone to lead to a low production yield of the entire chip due to poor MEMS sensor production process, thereby raising production costs.

[0048]

Overall Inventive Concept

[0049] First, please refer to Figures 1 and 2. Figure 1 is a cross-sectional view of a biosensor chip package structure 100 from a microscopic perspective according to an embodiment of the present invention. Figure 2 is a top view of the biosensor chip package structure 100 shown in Figure 1 according to an embodiment of the present invention.

[0050] The biosensor chip packaging structure 100 includes: a sensor chip 1, an integrated circuit chip 2 and a substrate 3; the whole is a rectangular block structure, and can also be configured into a special-shaped structure according to its appearance design requirements.

[0051] The sensor chip 1 may include a MEMS chip. The sensor chip 1 can contact the outside world and convert external physical and chemical signals into measurement signals. The measurement signals can be electrical signals or other signals, and can be adaptively changed according to the type of sensor chip required by the biosensor; such as electrical sensors, photoelectric sensors, etc. The integrated circuit chip 2 may include an ASIC chip. The integrated circuit chip 2 further processes and transmits the measurement signals generated by the sensor chip 1 to the next level circuit, and realizes relevant biological information detection by visualizing the measurement signals.

[0052] In an embodiment of the present invention, the substrate 3 is used to encapsulate the IC bare chip (in the embodiment of the present invention, the IC bare chip refers to the sensor chip 1 and the integrated circuit chip 2). The substrate 3 serves as an intermediate product between the sensor chip 1, the integrated circuit chip 2 and the PCB substrate, and is used to carry the sensor chip 1 and the integrated circuit chip 2, and plays the role of protecting, fixing, supporting the sensor chip 1 and the integrated circuit chip 2, and providing a heat dissipation channel. In an embodiment of the present invention, the substrate 3 can be a pure silicon board or a PCB board. For example, the substrate 3 can be arranged with circuit structures, electronic components, etc. to achieve specific biological functions.

[0053] In one general inventive concept of an embodiment of the present invention, a sensor chip 1 and an integrated circuit chip 2 are independently disposed on a substrate 3. Structurally, the sensor chip 1 and the integrated circuit chip 2 can be stacked vertically on the substrate 3 or arranged horizontally. A horizontal arrangement is preferred to reduce processing complexity, wherein the sensor chip 1 and the integrated circuit chip 2 are directly or indirectly electrically connected.

[0054] It can be understood that by independently arranging the sensor chip 1 and the integrated circuit chip 2 on the substrate 3 instead of the integrated design, the sensor chip 1 and the integrated circuit chip 2 can be produced independently without interfering with each other. The sensor chip 1 and the integrated circuit chip 2 are packaged as two independent chips in a typical packaging structure, which solves the problem that the scrapping of the sensor chip 1 affects the integrated circuit chip 2, thereby improving the production yield and saving production costs.

[0055] Based on the above general inventive concept, in terms of the electrical connection between the sensor chip 1 and the integrated circuit chip 2, the biosensor chip package structure 100 further includes: a conductive structure for electrical connection; the conductive structure can be a bonding wire, a terminal, or other means. The sensor chip 1 and the integrated circuit chip 2 are electrically connected via the conductive structure 4 to achieve signal transmission.

[0056] For example, in an optional solution in an embodiment of the present invention, the conductive structure 4 may include a bonding wire 41 as shown in FIG. 1 ; the sensor chip 1 and the integrated circuit chip 2 are both electrically connected to the substrate 3 via the bonding wire 41 .

[0057] In another optional solution in the embodiment of the present invention, other processes may be used instead of the wire bonding process, and it is only necessary to realize signal transmission between the sensor chip 1 and the integrated circuit chip 2. For details, please refer to the following text.

[0058] In the present application, the biosensor chip package structure 100 further includes:

[0059] The plastic package 5 covers the substrate 3 to encapsulate the biosensor chip package structure 100. An opening 51 is provided on any surface of the plastic package 5. The opening 51 allows the sensing area of ​​the sensor chip 1 to be at least partially exposed to the plastic package 5, so that the sensor chip 1 is in direct contact with external substances, allowing the sensor area of ​​the sensor chip 1 to detect information from the external substances.

[0060] Specifically, the sensor chip 1 includes a body 11 and a sensing area 12 , wherein the sensing area 12 is disposed on the upper side of the body 11 , and the opening 51 exposes a portion of the sensing area 12 to contact the outside.

[0061] It can be understood that the surface of the sensing area 12 of the sensor chip 1 is exposed. The sensing area 12 is the area where the biosensor chip is in direct or indirect contact with external substances and can convert measured parameters into measurement signals for identification by the device.

[0062] It is understood that the plastic encapsulation body 5 is a fluid medium before being formed. Transfer molding can be used to squeeze a fluid medium, such as epoxy film molding compound, into a mold cavity. The mold cavity is then embedded in the substrate 3, and the components therein are embedded and then cured to form a solid-state package with a specific structural appearance. The plastic encapsulation body 5 functions to protect the internal components from the external environment; resist external moisture, solvents, and impact; and electrically insulate the chip from the external environment, ensuring that the overall package has good sealing properties and resists thermal shock, mechanical vibration, and heat diffusion.

[0063] Furthermore, the biosensor chip packaging structure 100 also includes: a first connection layer 6, which is arranged on the upper surface of the substrate 3, that is, the side of the substrate 3 facing the sensor chip 1 and the integrated circuit chip 2, and is used to connect the sensor chip 1 and the integrated circuit chip 2 to the substrate 3.

[0064] It can be understood that the first connection layer 6 adheres the sensor chip 1 and the integrated circuit chip 2 to the substrate 3, and plays a role in fixing the chips.

[0065] Furthermore, the first connection layer 6 may be of the same type or of different types; specifically, it may be adapted according to the chip types of the sensor chip 1 and the integrated circuit chip 2 .

[0066] For example, depending on the chip's process requirements, the first connection layer 6 can be an adhesive, such as an epoxy resin adhesive. For chips with high heat dissipation requirements, silver glue can be used to provide better heat dissipation. In some embodiments, solder balls or pads can also be used to better constrain the position of the sensor chip 1 and the integrated circuit chip 2, thereby improving the reliability of the entire biosensor chip package structure 100.

[0067] Furthermore, the biosensor chip package structure 100 further includes: a second connection layer 7, which is provided on a side of the substrate 3 facing away from the sensor chip 1 and the integrated circuit chip 2, and is used to connect the biosensor chip package structure 100 to an external PCB and electrically connect the biosensor chip package structure 100;

[0068] Furthermore, the second connection layer 7 can be either solder balls or solder pads. Specifically, the configuration can be adaptively configured according to the characteristics of the substrate 3 and the material of the PCB board to be connected.

[0069] When the second connection layer 7 uses solder balls, since the connection is a point connection, its contact area is small, and the gap between the solder balls can be filled by the plastic package 5 to provide better support and sealing. When the second connection layer 7 uses solder pads, it can provide a relatively more stable connection strength, so that the substrate 3 is not easy to fall off under the action of external force, thereby improving the reliability of its connection.

[0070] In summary, the overall concept of the embodiments of the present invention is to provide a biosensor chip packaging structure 100, which includes a sensor chip 1, an integrated circuit chip 2 and a substrate 3. By independently arranging the sensor chip 1 and the integrated circuit chip 2 on the substrate 3 and establishing an electrical connection between the sensor chip and the integrated circuit chip, the sensor chip 1 and the integrated circuit chip 2 in the prior art are abandoned, so that the sensor chip 1 and the integrated circuit chip 2 are independent chips. Therefore, the scrapping of the sensor chip 1 during the production process does not affect the integrated circuit chip 2, thereby reducing the scrap rate and indirectly saving costs.

[0071] Given the above general inventive concept, the following is described through specific embodiments:

[0072] [Example 1]

[0073] 1 , in the first embodiment of the present invention, the sensor chip package structure 100 has the following features: the sensor chip package structure 100 is a rectangular block structure as a whole.

[0074] The sensor chip packaging structure 100 includes: a sensor chip 1 , an integrated circuit chip 2 , a substrate 3 , a conductive structure 4 , a plastic package 5 , a first connection layer 6 and a second connection layer 7 .

[0075] In this first embodiment, the conductive structure 4 uses a bonding wire 41;

[0076] The bonding wire 41 may be made of various conductive materials such as gold wire, aluminum wire, copper wire, alloy wire, etc.

[0077] The sensor chip 1 and the integrated circuit chip 2 are arranged horizontally on the substrate 3. The sensor chip 1 and the integrated circuit chip 2 are electrically connected to the substrate 3 through bonding wires 41 respectively. The measurement signal is indirectly transmitted through the substrate 3, that is, the sensor chip 1 reads the measured parameter and converts it into a measurement signal, which is transmitted to the substrate 3 through the bonding wire 41. The measurement signal is further transmitted from the substrate 3 to the integrated circuit chip 2 through the bonding wire 41. The integrated circuit chip 2 receives and processes the measurement signal and then feeds it back to the substrate 3.

[0078] Furthermore, the sensor chip 1 includes a body 11 and a sensing area 12 . The plastic package 5 has an opening 51 reserved therein to expose the sensing area 12 . Other areas of the sensor chip 1 and the integrated circuit chip 2 are covered by the plastic package 5 .

[0079] Furthermore, the first connection layer 6 may optionally use silver glue to provide good heat dissipation, and the substrate 3 may optionally be a silicon board. The integrated circuit chip 2 and the substrate 3 are both adhered to the substrate 3 by silver glue, thereby limiting the position of the sensor chip 1 and the integrated circuit chip 2.

[0080] The second connection layer 7 uses tin solder balls for soldering and electrically connecting with the external substrate.

[0081] As can be understood, the plastic package 5 encapsulates the sensor chip 1, integrated circuit chip 2, and bonding wires 41 on the substrate 3, exposing the sensing area 12 of the sensor chip 1 to achieve the purpose of detecting external substances. The sensor chip 1 obtains the measurement signal of the external substance. The sensor chip 1 and the integrated circuit chip 2 are electrically connected to the substrate via the bonding wires 41. The measurement signal is first output from the sensor chip 1 to the substrate 3, then transmitted through the substrate 3 to the integrated circuit chip 2 for processing. Finally, it is transmitted to the circuit of the substrate 3 via the bonding wires 41. Because the second connection layer 7 is distributed below the substrate 3, it is welded to the external substrate to achieve electrical connection.

[0082] [Example 2]

[0083] Please refer to FIG. 3 , which is a schematic structural diagram of a biosensor chip packaging structure 200 provided in a second embodiment of the present invention.

[0084] The biosensor chip package structure 200 is similar to that of Example 1 in other structural parts. The sensor chip package structure 100 includes a sensor chip 1 , an integrated circuit chip 2 , a substrate 3 , a conductive structure 4 , a plastic package 5 , a first connection layer 6 , and a second connection layer 7 .

[0085] The other features of the second embodiment of the present invention are the same as those of the first embodiment. The conductive structure 4 in the second embodiment still uses the bonding wire 41. The difference is that in the second embodiment, the sensor chip 1 and the integrated circuit chip 2 are directly connected through the bonding wire 41. In this case, the measurement signal does not pass through the substrate 3, and is transmitted to the integrated circuit chip 2 through the bonding wire 41.

[0086] The bonding wire 41 may be made of various conductive materials such as gold wire, aluminum wire, copper wire, alloy wire, etc.

[0087] Specifically, sensor chip 1 and integrated circuit chip 2 are connected via bonding wires 41, and integrated circuit chip 2 is further connected to substrate 3 via bonding wires 41 or other conductive structures. That is, sensor chip 1 reads the measured parameter, converts it into a measurement signal, and transmits it directly to integrated circuit chip 2 via bonding wires 41. Integrated circuit chip 2 receives and processes the measurement signal and then transmits it to substrate 3 for further processing.

[0088] As will be appreciated, in the present invention, the sensor chip 1 and the integrated circuit chip 2 are directly connected via bonding wires 41, i.e., no connection is required through the substrate 3. This direct connection between the sensor chip 1 and the integrated circuit chip 2 shortens the signal transmission distance, avoids the switching process, and reduces signal transmission links, thereby increasing reliability. It also keeps the wiring relatively short, reducing signal loss.

[0089] [Example 3]

[0090] Please refer to FIG. 4 , which is a schematic structural diagram of a sensor chip packaging structure 300 provided in a third embodiment of the present invention.

[0091] The biosensor chip package structure 100 is similar to that of Example 1 in other structural parts. The biosensor chip package structure 100 includes a sensor chip 1 , an integrated circuit chip 2 , a substrate 3 , a conductive structure 4 , a plastic package 5 , a first connection layer 6 , and a second connection layer 7 .

[0092] The other features of the second embodiment of the present invention are the same as those of the first embodiment. The conductive structure 4 includes a through-silicon via 42. The difference from the first embodiment is that the bonding wires are eliminated, and the measurement signal is transmitted from the upper surface of the sensor chip 42 to the substrate through the through-silicon via 42. The sensor chip 1 and the integrated circuit chip 2 are both vertically interconnected.

[0093] Specifically, the through silicon via 42 passes through the upper surface to the lower surface of the body 11 in the sensor chip 1, and the sensing area 12 obtains the measurement signal, and transmits the measurement signal from the upper surface to the lower surface of the body 11 through the through silicon via 42. At the same time, solder balls are used in the first connection layer 6 between the body 11 and the substrate 3 to achieve a stable connection and sealing between the body 11 and the substrate 3.

[0094] The integrated circuit chip 2 is flip-chip mounted, and the first connection layer 6 between the integrated circuit chip 2 and the substrate 3 also uses solder balls.

[0095] Furthermore, the first connection layer 6 between the sensor chip 1 , the integrated circuit chip 2 and the substrate 3 all uses point-filled tin solder balls, which makes the connection more stable while also ensuring good electrical conductivity.

[0096] As can be understood, sensor chip 1 reads the measured parameter and converts it into a measurement signal. This signal is then transmitted from sensing area 12 to substrate 3 via through-silicon vias 42 and solder balls in body 11. The signal is then further transmitted from substrate 3 to integrated circuit chip 2 via solder balls at the bottom of integrated circuit chip 2. Integrated circuit chip 2 receives and processes the signal, which is then fed back to substrate 3 for further processing. Sensor chip 1 utilizes through-silicon via (TSV) technology instead of wire bonding, while integrated circuit chip 2 utilizes a flip-chip design to enhance the connection stability between sensor chip 1 and integrated circuit chip 2. The vertical interconnection between sensor chip 1 and integrated circuit chip 2 reduces interconnect length, signal latency, and capacitance / inductance, enabling low power consumption, high-speed communication, increased bandwidth, and miniaturization of the entire package structure.

[0097] [Example 4]

[0098] Please refer to FIG. 5 , which is a schematic structural diagram of a biosensor chip packaging structure 400 provided in accordance with a fourth embodiment of the present invention.

[0099] The biosensor chip package structure 400 is similar to the second embodiment in other structural parts. The sensor chip package structure 100 includes a sensor chip 1, an integrated circuit chip 2, a substrate 3, a conductive structure 4, a plastic package 5, a first connection layer 6, and a second connection layer 7. The conductive structure 4 includes bonding wires 41, and the sensor chip and the integrated circuit chip are directly electrically connected via the bonding wires 41.

[0100] The difference between the fourth embodiment of the present invention and the second embodiment is that the conductive structure 4 further includes a transfer block 43 connected to the substrate 3 to adapt to the application scenario where the sensor chip 1 and the integrated circuit chip 2 are far apart and cannot be moved closer together, and the bonding wire 41 cannot directly connect the distant sensor chip 1 and the integrated circuit chip 2.

[0101] Specifically, adapter block 43 is disposed between sensor chip 1 and integrated circuit chip 2; a connection region is machined on adapter block 43 to achieve electrical connection between sensor chip 1 and integrated circuit chip 2. For example, a layer of soldering metal is electroplated on the surface of adapter block 43 to form the connection region to achieve electrical connection. The soldering metal can be made of gold, silver, aluminum, or the like. One end of bonding wire 41 is connected to sensor chip 1 or integrated circuit chip 2, and the other end is fixedly connected to the connection region of adapter block 43. Adapter block 43 is provided to provide a mid-way connection. Connection via adapter block 43 shortens the connection distance of bonding wire 41, doubling the connection distance of a single bonding wire 41 and reducing signal loss.

[0102] [Example 5]

[0103] Please refer to FIG. 6 , which is a schematic structural diagram of a biosensor chip packaging structure 500 provided in accordance with a fifth embodiment of the present invention.

[0104] The biosensor chip package structure 500 is similar to any one of the above-mentioned embodiments 1 to 4 in other structural parts. The sensor chip package structure 500 includes a sensor chip 1, an integrated circuit chip 2, a substrate 3, a conductive structure 4, a plastic package 5, a first connection layer 6 and a second connection layer 7.

[0105] In the fifth embodiment of the present invention, the difference is that the second connection layer 7 in the fifth embodiment is a solder pad, and the biosensor chip packaging structure 500 is soldered to the external PCB substrate through a screen printing process to achieve a tight connection between the PCB substrate and the substrate 3.

[0106] It can be understood that the solder pad is the basic component unit of the surface mount assembly. Compared with the solder ball, the solder pad has a larger connection area, a more stable connection, and can reduce the vertical thickness to achieve overall compactness.

[0107] [Example 6]

[0108] Continuing to refer to Figures 3, 5, and 7, the biosensor chip package structure 600 is similar to the other structural components of either the second or fourth embodiment described above, namely, the sensor chip package structure 600 includes a sensor chip 1, an integrated circuit chip 2, a substrate 3, a conductive structure 4, a plastic package 5, a first connection layer 6, and a second connection layer 7. The conductive structure 4 utilizes bonding wires 41. The difference in the sixth embodiment of the present invention is that at least a portion of the plastic package 5 is transparent. Specifically, the transparent region of the plastic package 5 can be formed using a transparent plastic compound.

[0109] In some embodiments, FIG7 shows a top view of a structure in which the plastic package 5 is entirely made of transparent material. The transparent setting of the plastic package 5 allows the interior of the biosensor chip packaging structure 600 to be visible, thereby facilitating defect detection during process production or maintenance identification after use.

[0110] In some embodiments, the plastic package 5 may be partially made of transparent material to make some areas that need to be inspected visible, while other areas may be made of conventional plastic package to reduce the impact of the external environment on important components.

[0111] For example, in the case of the second embodiment (corresponding to FIG3 ) and the fourth embodiment (corresponding to FIG5 ), the plastic package 5 includes at least two layers in at least a vertical direction, wherein the top layer is transparent so that the bonding wires 41 are exposed, and the other layers can be non-transparent conventional plastic packages.

[0112] It is understandable that since the biosensor chip package structure 600 may not be directly capable of power-on testing, if the leads are distorted and short-circuited during the plastic sealing process of the above-mentioned biosensor chip package structure 600, it will not be possible to detect it through electrical testing, resulting in the outflow of defective products. By making at least a portion of the plastic package body 5 transparent, the internal components that need to be inspected are visible, and they can be directly visually inspected or screened for good products in conjunction with image recognition during the production process, thereby improving the production yield of the biosensor chip package structure.

[0113] It is understandable that when the sensor chip 1 and the integrated circuit chip 2 are independently provided, the bonding wires may be distorted and short-circuited when the sensor chip 1 and the integrated circuit chip 2 are injected into the plastic package 5 during the plastic packaging process, resulting in an inability to pass the electrical test. It is difficult to troubleshoot defects and trace problems after a defective product occurs, which can easily lead to the outflow of defective products and reduce the overall reliability of the product. However, by filling the plastic package with a transparent material, the biosensor chip packaging structure does not need to pass the electrical test, and only visual inspection can be used to determine whether the bonding wires are short-circuited. This further improves the product yield of the biosensor chip packaging structure.

[0114]

A PCB board

[0115] Please refer to FIG8 , which is a schematic structural diagram of a PCB board 200 provided in an embodiment of the present invention. The embodiment of the present invention further provides a PCB board 200 , including:

[0116] The PCB substrate 201 and the biosensor chip package structure 100 as described above (or the biosensor chip package structures 200 to 500 in other embodiments), the biosensor chip package structure 100 is connected to the PCB substrate 201 and is electrically connected to the PCB substrate 201 .

[0117] It can be understood that by connecting at least one biosensor chip package structure 100 on a single PCB substrate 201 , the corresponding functions are achieved as a support for electronic components.

[0118]

Microfluidic detection device

[0119] The present invention also provides a microfluidic detection device (not shown), comprising:

[0120] The fluid component and the biosensor chip packaging structure as described in the above embodiments form a reaction chamber at the sensor chip after the fluid component and the biosensor chip packaging structure are assembled.

[0121] Since the sensor chip 1 of the biosensor chip packaging structure on the microfluidic detection device is directly connected to the reaction chamber, it can sense signals faster and more accurately, even if the signal is weak. At the same time, the biosensor chip packaging structure is simplified, which can laterally reduce the overall volume of the microfluidic detection device, making it have the advantages of high sensitivity, strong portability and fast detection.

[0122] At the same time, by independently arranging the sensor chip and the integrated circuit chip in the biosensor chip packaging structure, the overall production yield of the biosensor chip packaging structure can be improved.

[0123] Furthermore, those skilled in the art will understand that if all or some of the submodules involved in the biosensor chip packaging structure, PCB board, and microfluidic detection device provided by the embodiments of the present invention are combined or replaced through fusion, simple changes, or mutual conversion, such as by relocating the components; or by integrating the components into a product; or by designing a detachable design; if the combined components can form a device / device / system with a specific function, then using such a device / device / system to replace the corresponding components of the present invention also falls within the scope of protection of the present invention. [Method for Fabricating a Biosensor Chip Packaging Structure]

[0124] Please refer to FIG9 , which is a first flow chart of a method for manufacturing a biosensor chip packaging structure according to an embodiment of the present invention;

[0125] An embodiment of the present invention further provides a method for manufacturing a biosensor chip packaging structure, comprising:

[0126] Step S1, providing a substrate;

[0127] Step S2, forming at least one independent sensor chip and at least one independent integrated circuit chip at different positions on the substrate;

[0128] Step S3: Setting a conductive structure to connect the sensor chip and the integrated circuit chip.

[0129] The substrate in step S1 is not limited to a PCB board or a silicon board;

[0130] Step S2: Processing at least one sensor chip and at least one integrated circuit chip on different positions of the substrate by bonding or welding, and then setting a conductive structure to achieve signal interconnection between the sensor chip and the integrated circuit chip.

[0131] In an optional manner corresponding to the above step S3, providing a conductive structure to connect the sensor chip and the integrated circuit chip includes: providing a bonding wire to connect the sensor chip and the integrated circuit chip.

[0132] Based on the above solution, connecting the sensor chip and the integrated circuit chip through bonding wires further includes:

[0133] At least one adapter block is provided on the substrate;

[0134] Processing the connection area on the adapter block;

[0135] One end of the bonding wire is connected to the transfer block through the connection area, and the other end is connected to the sensor chip or the integrated circuit chip.

[0136] Among them, the above-mentioned "connection area" can be a layer of welding metal electroplated on the adapter block, such as copper, nickel, titanium, tin, gold, silver, etc. Its purpose is to make the bonding wire tightly welded to the adapter block to prevent the bonding wire from falling off during the processing process, so as to increase the reliability of information exchange between chips.

[0137] In an optional manner corresponding to step S3 above, providing a conductive structure to connect the sensor chip and the integrated circuit chip includes:

[0138] The sensor chip and the integrated circuit chip are respectively provided with bonding wires and electrically connected to the substrate.

[0139] In another optional manner corresponding to the above step S3, providing a conductive structure to connect the sensor chip and the integrated circuit chip includes:

[0140] A through-silicon via is set in the sensor chip to transmit the measurement signal from the upper surface of the sensor chip to the lower surface, and the sensor chip and the substrate are electrically connected through tin solder balls; the integrated circuit chip is set up flip-chip, and the integrated circuit chip and the substrate are electrically connected through tin solder balls.

[0141] Please refer to FIG10 , which is a second flow chart of the method for manufacturing a biosensor chip packaging structure provided by an embodiment of the present invention. Furthermore, the manufacturing method further includes:

[0142] Step S4: placing the substrate into a mold cavity of a plastic encapsulation mold, and coating a protective layer at a position of the plastic encapsulation mold corresponding to the sensing area of ​​the sensor chip;

[0143] Step S5: Using a plastic sealing mold to press down on the sensing area to seal the sensing area;

[0144] Step S6: injecting the fluid plastic package into the mold cavity;

[0145] Step S7: After the plastic package is formed by a curing process, the substrate is separated from the mold cavity to expose at least a portion of the sensing area.

[0146] It is understood that after the sensor chip and integrated circuit chip are mounted and the conductive structure is set, the plastic encapsulation mold is pressed against the surface of the MEMS chip. A protective layer is applied to the plastic encapsulation mold at the position corresponding to the sensing area of ​​the sensor chip. The protective layer can be polytetrafluoroethylene to prevent contamination of the sensing area of ​​the sensor chip. The substrate after completing step S3 is placed in a preset mold cavity. The plastic encapsulation mold is used to apply a certain pressure downward to the sensing area to completely seal the sensing area. Then, pressure is applied to press the plastic encapsulation compound into the cavity. After the plastic encapsulation compound is cured, the plastic encapsulation mold is opened to expose the sensing area, thus completing the plastic encapsulation process.

[0147] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0148] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A biosensor chip packaging structure, It is characterized in that include: At least one sensor chip that converts the measured parameter into a measurement signal; at least one integrated circuit chip for processing the measurement signal; A substrate for carrying the sensor chip and the integrated circuit chip; Wherein, the sensor chip and the integrated circuit chip are independently arranged on the substrate.

2. The biosensor chip packaging structure according to claim 1, It is characterized in that The biosensor chip packaging structure also includes: Conductive structures for electrical connection; The sensor chip and the integrated circuit chip are electrically connected via a conductive structure.

3. The biosensor chip packaging structure according to claim 2, It is characterized in that The conductive structure includes a bonding wire; Wherein, the sensor chip and the integrated circuit chip are directly electrically connected via bonding wires, and the measurement signal does not pass through the substrate; or The sensor chip and the integrated circuit chip are electrically connected to a substrate via bonding wires, respectively, and the measurement signal is indirectly transmitted via the substrate.

4. The biosensor chip packaging structure according to claim 3, It is characterized in that The sensor chip and the integrated circuit chip are directly electrically connected via bonding wires; The conductive structure further comprises a transfer block connected to the substrate, wherein the transfer block is arranged between the sensor chip and the integrated circuit chip; One end of the bonding wire is connected to the adapter block, and the other end is connected to the sensor chip or the integrated circuit chip.

5. The biosensor chip packaging structure according to claim 2, It is characterized in that The conductive structure includes a through silicon via penetrating the sensor chip; The sensor chip is electrically connected to the substrate, and a measurement signal is transmitted from the upper surface of the sensor chip to the substrate through the through silicon via; The integrated circuit chip is flip-chip mounted and electrically connected to the substrate; The measurement signal is transmitted from the sensor chip to the integrated circuit chip through the substrate.

6. The biosensor chip packaging structure according to any one of claims 1 to 5, It is characterized in that The biosensor chip packaging structure also includes: A plastic package body, the plastic package body is covered on the substrate to seal the biosensor chip packaging structure Pack; The plastic package body is provided with an opening, and the opening allows the sensor chip to be at least partially exposed from the plastic package body, so that the sensor chip is in direct contact with external substances.

7. The biosensor chip packaging structure according to claim 6, It is characterized in that The plastic package body is configured to be transparent in at least a partial area.

8. The biosensor chip packaging structure according to any one of claims 2 to 5, It is characterized in that The biosensor chip packaging structure further includes: a first connection layer and a second connection layer, wherein the first connection layer is disposed on the upper surface of the substrate and is used to connect the sensor chip and the integrated circuit chip to the substrate; The second connection layer is arranged on the lower surface of the substrate, and is used to connect the biosensor chip packaging structure to an external substrate and electrically connect it.

9. The biosensor chip packaging structure according to claim 8, It is characterized in that The first connection layer includes at least one of an adhesive, a solder ball, and a solder pad; The second connection layer is any one of a solder ball and a solder pad.

10. The biosensor chip packaging structure according to claim 9, It is characterized in that When the conductive structure includes a through silicon via, the first connection layer uses a solder ball, and the solder ball is a tin solder ball.

11. A PCB board, It is characterized in that include: PCB substrate; The biosensor chip packaging structure according to any one of claims 1 to 10, wherein the biosensor chip packaging structure is connected to the PCB substrate and is electrically connected.

12. A microfluidic detection device, It is characterized in that include: Fluid components; According to the biosensor chip packaging structure according to any one of claims 1 to 10, the fluid component and the biosensor chip packaging structure are assembled to form a reaction chamber.

13. A method for manufacturing a biosensor chip packaging structure, It is characterized in that The preparation method comprises: providing a substrate; forming at least one independent sensor chip and at least one independent integrated circuit chip at different positions on the substrate; A conductive structure is provided to connect the sensor chip and the integrated circuit chip.

14. The method according to claim 13, It is characterized in that The providing of a conductive structure to connect the sensor chip and the integrated circuit chip comprises: A bonding wire is provided to connect the sensor chip and the integrated circuit chip.

15. The method according to claim 13, It is characterized in that The providing of a conductive structure to connect the sensor chip and the integrated circuit chip comprises: The sensor chip and the integrated circuit chip are respectively provided with bonding wires and electrically connected to a substrate.

16. The method according to claim 13, It is characterized in that Providing a conductive structure to connect the sensor chip and the integrated circuit chip comprises: A through-silicon via is provided in the sensor chip to transmit a measurement signal from the upper surface of the sensor chip to the lower surface, and the sensor chip and the substrate are electrically connected through a solder ball; The integrated circuit chip is flipped and arranged, and the integrated circuit chip and the substrate are electrically connected through solder balls.

17. The method according to claim 14, It is characterized in that The step of setting a bonding wire to connect the sensor chip and the integrated circuit chip further comprises: At least one adapter block is arranged on the substrate; Processing a connection area on the adapter block; One end of the bonding wire is connected to the transfer block through the connection area, and the other end is connected to the sensor chip or the integrated circuit chip.

18. The method according to any one of claims 13 to 17, It is characterized in that The production method further comprises: Placing the substrate into a mold cavity of a plastic encapsulation mold, and coating a protective layer at a position of the plastic encapsulation mold corresponding to a sensing area of ​​the sensor chip; Using a plastic sealing mold to press down on the sensing area to seal the sensing area; Injecting a fluid plastic sealing body into the mold cavity; After the plastic package body is formed by a curing process, the substrate is separated from the mold cavity to expose at least a portion of the sensing area.

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